EP2695189A1 - Ceramic printed circuit board comprising an al cooling body - Google Patents
Ceramic printed circuit board comprising an al cooling bodyInfo
- Publication number
- EP2695189A1 EP2695189A1 EP12714276.8A EP12714276A EP2695189A1 EP 2695189 A1 EP2695189 A1 EP 2695189A1 EP 12714276 A EP12714276 A EP 12714276A EP 2695189 A1 EP2695189 A1 EP 2695189A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- soldered
- metallization
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/508—Cooling arrangements characterised by the adaptation for cooling of specific components of electrical circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/86—Ceramics or glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Definitions
- the invention relates to a printed circuit board made of ceramic with an upper side and a lower side, wherein sintered metallization regions are arranged on the upper side and the lower side is designed as a heat sink.
- Such a ceramic circuit board is known from WO 2007/107601 A3.
- the invention has the object to improve a printed circuit board made of ceramic according to the preamble of claim 1 so that.
- the heat dissipation of components on the top of the circuit board is improved
- this object is achieved in that also sintered metallization areas are arranged on the bottom on which a metallic heat sink is soldered. Due to the sintered metallization areas on the underside and the soldering of the metal heat sink, a particularly good heat dissipation is achieved from the top of the printed circuit board to the metallic heat sink.
- solder preferably a refractory brazing alloy having a melting point between 450 and 660 ° C is achieved.
- Metallic heat sinks have a high thermal conductivity.
- the printed circuit board is made of aluminum oxide or aluminum nitride.
- the circuit board is made of aluminum nitride, which has a particularly good thermal conductivity.
- the metallic heat sink is made of aluminum.
- Aluminum has a high thermal conductivity.
- the metallic heat sink consists of a carrier plate with a connection side and an active side, and the heat sink with the connection side is soldered onto the metallization regions of the underside of the circuit board and has cooling elements projecting on the active side. By projecting cooling elements, the surface of the heat sink is increased and can radiate the heat introduced better.
- the protruding cooling elements are a plurality of needles in the nature of a pin cushion.
- the surface is extremely enlarged in a small space.
- the top of the circuit board is concave or convex, whereby when using the circuit board as a lamp, the radiated light can be focused or scattered.
- a method according to the invention for producing a printed circuit board is characterized in that a ceramic substrate pre-metallized on both sides by sintered metallization regions is produced, the metallization areas being gold, silver, silver alloys, active plating with galvanic coatings such as Ni + Au or thick-film aluminum or alternative methods such as Thin-film or plasma spraying is metallized and then the heat sink is soldered with its connection side on the underside of the circuit board, wherein as solder preferably a refractory brazing material with a melting point between 450 and 660 ° C is used.
- soldering with brazing in the temperature range mentioned a necessary solid compound is achieved with good heat transfer performance. There is no clamping, screwing or gluing, as they have defects that are avoided when brazing with brazing.
- the circuit board is used as a lamp or part of a lamp, wherein on the upper side of the printed circuit board LEDs are optionally soldered with associated circuit and / or electrical components.
- the circuit may be covered for protection with an opaque lid.
- the printed circuit board 2 has an upper 2a and a lower side 2b, wherein a soldered metallic heat sink 3 is arranged on the lower side 2b.
- An essential feature of the invention is that both the upper side 2a and the lower side 2b are formed as ceramic circuit boards 2. This is achieved by applying sintered metallization regions on the upper side 2a and lower side 2b. Sintered metallization regions are described in WO 2007107601 A2. On the upper side 2a or on the localized metallization regions, components such as LEDs and / or a circuit can be soldered directly.
- the advantage lies, inter alia, in the fact that the heat generated by the components is conducted directly into the ceramic of the printed circuit board 2 due to the high thermal conductivity.
- the ceramic substrate preferably of AIN, pre-metallized on both sides by sintered metallization regions is metallized with gold, silver, silver alloys, active solder with galvanic coatings such as Ni + Au or with aluminum in thick film technology or alternative methods (thin film, plasma spraying, etc.) (base metallization). Both sides of the substrate can also be covered with different metallization.
- the circuit board made of aluminum nitride, since in this case the thermal conductivity is extremely high.
- a metallic heat sink 3 is soldered in a suitable geometry on the underside 2b of the ceramic circuit board 2 or on its base-metallized side.
- the heat sink 3 is preferably made of aluminum (injection molding, cast part or the like).
- the solder is preferably a refractory brazing material with a melting point between 450 and 660 ° C, the printed circuit board 2 on the base metallization and the braze with the metallic heat sink 3 firmly connects. There is no clamping, screwing or gluing.
- the ceramic circuit board 2 which has both sides sintered Metallmaschines Kunststoffe and thus both sides of a board, or can be used, is on one side to the cooler side, i. towards the metallic heat sink 3, preferably flat.
- the surface On the component side, i. on the top 2a where LEDs 6 are preferably arranged, the surface may also be convex or concave curved. As a result, when the components are LEDs 6, the light is scattered or bundled.
- the braze used to braze the metallic heat sink 3 is preferably a commercially available aluminum brazing alloy (TMP aluminum brazing paste-39), as used to repair aluminum components, solid and good at 570 ° C.
- thermally conductive over 50 W / mK
- thermally conductive over 50 W / mK
- the mounting side ie on the bottom 2b mechanically or chemically well cleaned (free of oxide) aluminum cooler 3 is connected.
- the electrical components such as diodes, LEDs 6, transistors or similar. are then soldered with any other required components such as resistors or drivers with a soft solder in the temperature range at preferably 100-400 ° C in a second step on the top 2a of the pre-metallized ceramic circuit board 2. This creates a good heat transfer, especially for power components.
- connection to the electrical network is preferably carried out by connector strips on the upper side 2a of the ceramic or via bonding wires from the ceramic to the outside.
- LEDs 6 soldered
- single or group lenses can be glued or soldered for protection or light scattering. Even opaque lid can serve to close the circuit.
- the ceramic circuit board according to the invention can be used as a lamp or as part of a lamp.
- FIG. 1 shows a printed circuit board 2 according to the invention with its top 2a and bottom 2b.
- a metallic heat sink 3 is soldered aluminum.
- the ceramic of the printed circuit board 2 is aluminum nitride.
- the printed circuit board 2 is round in this example.
- the sintered metallization areas are not visible in this figure.
- the metallic heat sink 3 is made of aluminum and is formed like a pincushion, i. consists of a support plate 4, which is soldered onto the ceramic circuit board 2.
- a plurality of protruding cylindrical needles 5 are arranged on the carrier plate 4.
- FIG. 2 shows the upper side 2 a of the printed circuit board 2 according to FIG. 1.
- the soldered electrical components are identified by the reference numeral 6.
- the power lines are applied in thick film technology and marked with the reference numeral 7. These power lines 7 and the components 6 are soldered onto the sintered metallization regions. The metallization areas are not visible in the figure.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102011006726 | 2011-04-04 | ||
PCT/EP2012/055746 WO2012136579A1 (en) | 2011-04-04 | 2012-03-30 | Ceramic printed circuit board comprising an al cooling body |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2695189A1 true EP2695189A1 (en) | 2014-02-12 |
Family
ID=45954642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12714276.8A Withdrawn EP2695189A1 (en) | 2011-04-04 | 2012-03-30 | Ceramic printed circuit board comprising an al cooling body |
Country Status (10)
Country | Link |
---|---|
US (1) | US9730309B2 (en) |
EP (1) | EP2695189A1 (en) |
JP (1) | JP2014517497A (en) |
KR (1) | KR20140034781A (en) |
CN (1) | CN103563074B (en) |
BR (1) | BR112013025429A2 (en) |
DE (1) | DE102012205178A1 (en) |
RU (1) | RU2013148615A (en) |
TW (1) | TW201302046A (en) |
WO (1) | WO2012136579A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102401358B (en) * | 2010-09-10 | 2016-08-03 | 欧司朗股份有限公司 | The manufacture method of cooling body, cooling body and there is the illuminator of this cooling body |
CN104486900A (en) * | 2014-11-07 | 2015-04-01 | 广东风华高新科技股份有限公司 | Supporting member for circuit board and manufacturing method for supporting member |
CN105305206B (en) * | 2015-11-03 | 2021-04-20 | 华中科技大学 | Heat sink suitable for jet flow impact cooling system of disk laser |
JP2018046237A (en) * | 2016-09-16 | 2018-03-22 | 株式会社東芝 | Semiconductor device and manufacturing method of the same |
US10415895B2 (en) * | 2016-11-21 | 2019-09-17 | Abl Ip Holding Llc | Heatsink |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6543521B1 (en) * | 1999-10-04 | 2003-04-08 | Matsushita Electric Industrial Co., Ltd. | Cooling element and cooling apparatus using the same |
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2012
- 2012-03-30 JP JP2014503085A patent/JP2014517497A/en active Pending
- 2012-03-30 DE DE102012205178A patent/DE102012205178A1/en not_active Withdrawn
- 2012-03-30 WO PCT/EP2012/055746 patent/WO2012136579A1/en active Application Filing
- 2012-03-30 RU RU2013148615/07A patent/RU2013148615A/en not_active Application Discontinuation
- 2012-03-30 US US14/008,867 patent/US9730309B2/en not_active Expired - Fee Related
- 2012-03-30 EP EP12714276.8A patent/EP2695189A1/en not_active Withdrawn
- 2012-03-30 KR KR1020137029079A patent/KR20140034781A/en not_active Application Discontinuation
- 2012-03-30 CN CN201280017161.0A patent/CN103563074B/en not_active Expired - Fee Related
- 2012-03-30 BR BR112013025429A patent/BR112013025429A2/en not_active IP Right Cessation
- 2012-04-02 TW TW101111615A patent/TW201302046A/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US6543521B1 (en) * | 1999-10-04 | 2003-04-08 | Matsushita Electric Industrial Co., Ltd. | Cooling element and cooling apparatus using the same |
Non-Patent Citations (1)
Title |
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See also references of WO2012136579A1 * |
Also Published As
Publication number | Publication date |
---|---|
TW201302046A (en) | 2013-01-01 |
RU2013148615A (en) | 2015-05-10 |
CN103563074B (en) | 2018-09-14 |
US9730309B2 (en) | 2017-08-08 |
US20140016330A1 (en) | 2014-01-16 |
KR20140034781A (en) | 2014-03-20 |
BR112013025429A2 (en) | 2016-12-27 |
DE102012205178A1 (en) | 2012-10-04 |
CN103563074A (en) | 2014-02-05 |
WO2012136579A1 (en) | 2012-10-11 |
JP2014517497A (en) | 2014-07-17 |
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