EP2628358A1 - Led driver circuit - Google Patents
Led driver circuitInfo
- Publication number
- EP2628358A1 EP2628358A1 EP11771108.5A EP11771108A EP2628358A1 EP 2628358 A1 EP2628358 A1 EP 2628358A1 EP 11771108 A EP11771108 A EP 11771108A EP 2628358 A1 EP2628358 A1 EP 2628358A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- led
- driver circuit
- circuit
- temperature
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
- H05B45/18—Controlling the intensity of the light using temperature feedback
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/31—Phase-control circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/32—Pulse-control circuits
- H05B45/325—Pulse-width modulation [PWM]
Definitions
- the invention relates to an LED driver circuit - hereinafter "driver” - for power control and supply of an LED.
- LEDs are light-emitting diodes, or light-emitting diodes, and the associated electronic driver circuits or assemblies that illuminate the respective LEDs are called LED drivers.
- the brightness of an LED increases with the power consumption. At constant semiconductor temperature, the increase is approximately proportional. The efficiency decreases with increasing temperature, therefore the luminous efficacy at the power limit decreases depending on the type of cooling. The LED turns off when the temperature of the semiconductor exceeds a maximum of about 150 ° C.
- the performance of luminaires with LEDs can be controlled, for example, via resistance elements or dimmers with phase control. These drivers are always at some distance from the actual LED, d. H. The disadvantage of this is that by removing the driver from the LED, the control of the LED is sluggish.
- LEDs with high light output become so hot during operation that they have to be cooled in order not to fail.
- WO 2007107601 AI proposes to cool the LEDs, to arrange them on ceramic support body, which are integrally connected to ceramic heat-dissipating cooling elements, so-called heat sinks.
- the conductor tracks are applied, so that the carrier body is formed as a circuit board.
- sintered metallization regions are applied as conductor tracks on the surface of the carrier body are.
- the LEDs are soldered onto the tracks. The heat dissipation is thus extremely high and can be variably adjusted by the choice of ceramic.
- the invention has for its object to improve the electrical control and performance of the LED.
- the driver circuit according to the invention is defined by the features of claim 1. Accordingly, the driver circuit for controlling the supply current of the LED is formed as a function of the temperature of the carrier body of the LED.
- the driver circuit for example, have a temperature-dependent resistor, which is heat-conductively connected to the carrier body.
- Driver is always understood below as an electrical driver circuit.
- the brightness of the LED immediately follows the temperature. Falling temperatures on the driver (due to wind, shadow, radiation reduction) usually lead to higher light emission.
- the speed of the control can be increased by using highly heat conductive ceramic as the base of the LED and its driver and slowed down by using low-conductivity ceramics, with the natural (unamplified) brightness variations behave inversely to the thermal conductivity of the ceramic.
- brightness effects in a lamp array can be produced which, for example, make flow effects visible.
- FIG. 3 shows a detail according to FIG. 2,
- Fig. 4 shows another LED lamp
- Figs. 5a, 5b another LED light
- Fig. 14 is a table with the components used in the electronic
- FIGS. 1 to 3 and 6 show a base GU10 luminaire comprising a lower part 1 with a power supply 2, a lampshade 3 and a ceramic mounting substrate 4 which can be glued on.
- the lamp shown in Figure 6 has no lampshade. Otherwise, it is identical to the lamp of Figure 1 formed.
- the mounting substrate 4 is in this example a carrier body or mounting plate for the LED and the driver 17 and consists in this example of gray fructalooleitInBoxem AIN and the lampshade 3 from ruby-colored alumina with chromium oxide doping.
- the mounting substrate 4 is not visible.
- the lamp body or lampshade 3 is closed with a glass pane (not shown) at the upper end of the lampshade 3.
- sintered metallization regions 15 for soldering the LED (s) are arranged on the surface of the ceramic substrate 4. These sintered metallization regions 15 form conductor tracks and thus a circuit board. For reasons of clarity, the diodes on the metallization regions 15 are not shown.
- the drivers 17 are shown only schematically. In the embodiment shown, the drivers 17 are not arranged on the sintered metallization regions 14 or 15, but on the mounting substrate 4. With further miniaturization of the LED (2 * 2 mm are already possible today), the driver can also be mounted directly on the metallization regions 15 become.
- bushings 16 see Figure 3
- connector elements (2, 11) are arranged for the electrical connection wires. These connecting wires are electrically conductively connected to the drivers 17 and the drivers 17 to the metallization regions 15.
- any number of metallization regions 15 may be arranged.
- the mounting substrate 4 has a radial indentation 13 on the circumferential surface facing the metallization region 15 for better fixation.
- the luminaire is modularly formed from three ceramic parts, namely a lower part 1 with a power supply 2, a mounting substrate 4 or mounting plate and a lampshade 3.
- the power supply 2, 11 are, for example, electrical connection wires (not shown in the FIG.) In the lower part 1 and within the lower part 1 to the drivers 17 and from there to the LEDs.
- the mounting substrate 4 consists of a ceramic with preferably a high heat dissipation. On the Mounting substrate 4, the LED are soldered to the conductor tracks.
- the lampshade 3 is also preferably made of a ceramic with cooling fins 5 on its outer surface. The cooling fins 5 extend in the longitudinal direction of the lampshade third
- mounting substrate is the more general term, since the mounting substrate is only a mounting plate.
- the mounting substrate can also not be disc-shaped. Otherwise both terms describe the same item.
- the lower part 1 is formed cylindrically with an inner cavity 7. This saves material.
- the lamp thus consists of a lower part 1, a mounting plate 4 and a lampshade 3, which surrounds the LED. On the mounting substrate 4, the light source is attached.
- the lower part 1 can also be equipped as a plug for the production of plug-in connections with appropriate sockets or with threads for screwing in brackets or, in occupied with terminal poles sockets, in lamp holders.
- the lampshade 3 has on its circumference evenly distributed cooling fins 5, so that the outline of the lampshade 3 looks at its opening like a gear.
- the cooling fins 5 are, in particular in high-power LEDs, an advantage to dissipate the heat generated to the ambient air. Its cross section can take any other possible form such as semicircular or semi-elliptical. For LEDs with low heat losses, the screen can also be smooth. The screen may also have different shapes, such as oval or polygonal.
- the lower part 1 can also be formed in one piece with the mounting substrate 4, as shown in FIG. 2.
- FIG. 6 shows a lamp according to FIG. 1 without lampshade 3.
- This umbrellaless variant is advantageous because heat and / or solar radiation directly (not shielded) influence the driver temperature and the LEDs can be readjusted in a very short time due to this temperature change.
- the same reference numerals in Figures 1, 2 and 6 also show the same article.
- FIG. 4 shows an array of 9 diode carriers 20, which consist of the ceramic heat sinks described in WO 2007/107601 A2 (see the introduction to the description) with sintered metallization regions as conductor tracks.
- diode carriers 20 consist of the ceramic heat sinks described in WO 2007/107601 A2 (see the introduction to the description) with sintered metallization regions as conductor tracks.
- 6 diodes or LEDs 23 are applied (shown only schematically) and electrically connected to each other via the metallization regions (not shown). For cooling, the diode carrier 20 on Finns 27.
- square diode carriers 20 are shown. It can also be used any other form.
- the individual diode carrier 20 are installed or suspended in a metal frame 21, which also at the same time as a power supply for the LEDs 23 is used.
- the array of diode supports 20 is used for surface illumination, but can also be used for point illumination.
- the diode carrier 20 are fixed in different angles in the metal frame 21, that results in a focused light.
- the array can also be just for surface lighting or curved for a point lighting.
- each diode carrier 20 at the same time also the driver of the driving of the LEDs is arranged.
- the sintered metallization regions are in this case formed as conductor tracks on which the LEDs are arranged.
- FIG. 5a, 5b show a ceramic diode support 40 in plan view, Figure 5a and in section, Figure 5b, which consists of a ceramic support body 32 which is integrally provided with heat dissipating ceramic cooling elements 37, here fins, provided.
- a ceramic support body 32 which is integrally provided with heat dissipating ceramic cooling elements 37, here fins, provided.
- sintered metallization regions 41 are applied, so that the diode carrier 40 is a circuit board.
- LEDs 43 are attached, which are soldered onto the metallization 41.
- the diode carriers 40 have plugs and / or sockets as connecting elements with which the diode carriers 40 are connected directly or indirectly to each other.
- FIG. 5 shows a variant with only plugs, which consist of pins 36 here. These pins 36, two for each plug, are located at the periphery of the diode carrier 40 with the plugs 36 on opposite sides of the diode carrier 40.
- a separate connecting element 38 is used here. This connecting element 38 is in the variant shown here a rectangular or square shaped plate with through holes 44. In these holes 44, the pins 36 on the diode support 40, establishing an electrical contact, plugged.
- Each connecting element 38 has four holes 44. Two holes 44 on the connecting element 38 are electrically connected to each other.
- the diode carriers 40 For fixing the diode carriers 40 in a frame, they have at least at one edge a strip 34 without metallization areas 41 and without LEDs 43 and drivers.
- This strip 34 thus forms a ceramic spring for attachment to a frame or a rail. At least two rails then form the frame.
- the strip 34 has at least one recess for attachment to preferably a screw.
- FIG. 7 shows, in section and in an exploded view, a luminaire with the driver circuit according to the invention.
- This lamp is similar to that of Figure 1 and is intended for the version E27.
- the lamp consists of six parts or units, namely a metallic threaded bushing 52, a ceramic lower part 1, an electronic module 51 as a driver for driving the LEDs 43, a ceramic mounting substrate 4, a ceramic lampshade 3 with cooling fins 5 and a glass pane 50.
- the lower part 1 is formed as a hollow cylinder body open on both sides and is the central support body of the lamp. At his the lampshade 3 facing away from the lower part 1 has a radially to the outer wall of the lower part 1 retracted outer thread 54. On this outer thread 54, the threaded bushing 52 is turned up with its inner thread. This threaded bush 52 is designed in accordance with standard E27 and consists of metal.
- the electronic module 51 is inserted, which contains the driver.
- the electrical connection of the electronic module 51 is only indicated for a better overview.
- the electronic module 51 is electrically connected to the LEDs 43 on the mounting substrate 4.
- the mounting substrate 4 has two holes through which the electrical connection is made from the electronic module 51 to the LEDs.
- the ceramic mounting substrate 4 is glued to the lower part 1.
- the mounting substrate 4 is the support body or the mounting plate for the LEDs 43 and is preferably made of gray fructiqueleitInBoxem AIN and the lampshade 3 of ruby-colored aluminum oxide with Chromoxiddot mich.
- the mounting substrate 4 is not visible from the outside.
- the lampshade 3 is closed with a glass plate 50 at the upper end of the lampshade 3.
- the drivers are arranged in the electronic module 51 on three vertically stacked printed circuit boards 51a, 51b, 51c. If space is sufficient, the drivers are preferably placed on the sintered metallization areas or on the bare mounting substrate 4. The drivers are electrically connected to the LED.
- the drivers are arranged in the electronic module 51, which is located in the cavity 7 of the lower part 1 located.
- the electronic module 51 is fixed in the lower part 1 with a thermally conductive electrically insulating potting compound.
- the mounting substrate 4 may not be disc-shaped.
- the mounting substrate 4 has a radial intake 13 for better fixation.
- the mounting substrate 4 consists of a ceramic with preferably a high heat dissipation.
- the LED are soldered to the conductor tracks.
- the lampshade 3 is preferably made of a ceramic with cooling fins 5 on its outer surface.
- the cooling fins 5 extend in the longitudinal direction of the lampshade third
- the lampshade 3 For better attachment of the lampshade 3 on the lower part 1, this has on its inner surface a paragraph 8, with which the lampshade 3 is seated on a corresponding paragraph or indentation 13 on the mounting substrate 4.
- the lower end of the lampshade 3 surrounds the mounting substrate 4 and the upper end 12 of the lower part 1.
- the lower part 1 is cylindrically formed with an inner cavity 7. This material is saved and there is space for the electronic module 51 created.
- the lower part 1 can also be equipped as a plug for the production of plug-in connections with appropriate sockets or with threads for screwing in brackets or, in occupied with terminal poles sockets, in lamp holders.
- the lampshade 3 has on its circumference evenly distributed in the longitudinal direction of the lamp extending cooling fins 5, so that the outline of the lampshade 3 looks at its opening like a gear.
- the cooling fins 5 are, in particular in high-power LEDs, an advantage to dissipate the heat generated to the ambient air.
- Your cross section can be any other take possible shape such as semicircular or semi-elliptical.
- the screen can also be smooth.
- the screen may also have different shapes, such as oval or polygonal.
- the electrical insulation is given and the driver can be connected directly without galvanic isolation. Due to the thermal heat conduction properties of the ceramic in conjunction with a thermally conductive potting compound and spatially compact sandwich construction (see Figure 7), there is a very good overall heat distribution in the base interior or in the interior of the lower part 1.
- the driver's own power dissipation and heat generation Through the LEDs come with little time delay to the electronics, which then regulate the supply current of the LEDs so far linearly that a freely predetermined maximum temperature of the entire system is not exceeded.
- the driver circuit itself, but also the LEDs are protected against overheating. The better the cooling, the brighter the LEDs shine and vice versa. Thermal overload is largely excluded.
- the entire circuit can be manually dimmed with commercial phase dimmers in a wide range.
- FIG 8 shows the complete electronic circuit of the driver, wherein in Figure 14, the components used are listed.
- FIG. 9 shows the electronic circuit of the electronic module 51c (see FIG. 7).
- Figures 12a and 13a show a schematic view of the electronic module 51c from above and below.
- the electronic module 51c is responsible for connection to the 230-volt network and has a bridge rectifier with diodes D2.
- the bridge rectifier is preceded by the two resistors R17 and R21 in order to avoid a short circuit in the case of discharged capacitors.
- Resistors R17 and R21 also serve as overvoltage protection for mains voltages up to 500 volts.
- the bridge rectifier bridge is equipped with smoothing capacitors C1, C2 and C7, which are designed as ceramic capacitors and have a lifetime of up to 500,000 operating hours.
- the capacitors and the coil LI are used to filter in order to short-circuit high interference frequencies.
- the capacitor C9 is an aluminum solid-state capacitor for dimming the generated DC voltage
- FIG. 10 shows the electronic circuit of the electronic module 51b (see FIG. 7).
- FIGS. 12b and 13b show a schematic view of the electronic module 51b from above and below.
- the electronic module 51b is a dimming circuit for phase control dimming.
- the dimming circuit uses voltage dividers, diodes and MOS field-effect transistors.
- the dimming circuit simulates an ohmic load in the range of approx. 10 watts so that the power required for their operation is applied to the dimmers.
- FIG. 11 shows the electronic circuit of the electronic module 51a (see FIG. 7).
- FIGS. 12c and 13c show a schematic view of the electronics module 51a from above and below.
- the electronic module 51a has an HV9961LG integrated circuit for controlling the output side LED current.
- a temperature-dependent resistor (NTC) R19 is arranged, which generates a temperature-dependent control signal for the integrated circuit for temperature-dependent activation of the LED.
- the temperature-dependent dimming is done using the pulse width modulation.
- the integrated circuit HV9961 LG is designed for the military temperature range for temperatures from - 55 ° C to + 125 ° C with a power class of 10 watts to achieve a long service life.
- the integrated circuit Depending on the temperature, the integrated circuit generates a supply voltage for the LED which is reduced compared to the mains voltage, the remaining voltage being dissipated as heat.
- the integrated circuit On the output side, the integrated circuit with a MOS field effect transistor Ql and with a choke coil L2 with an inductance of 3 Millihenry provided. With the control circuit according to FIG. 11, up to 8 LEDs can be operated.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Circuit Arrangement For Electric Light Sources In General (AREA)
- Details Of Measuring Devices (AREA)
- Led Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102010042485 | 2010-10-15 | ||
DE102011008065 | 2011-01-07 | ||
DE102011012672 | 2011-01-07 | ||
DE102011016502 | 2011-04-08 | ||
DE102011016503 | 2011-04-08 | ||
PCT/EP2011/067959 WO2012049283A1 (en) | 2010-10-15 | 2011-10-14 | Led driver circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2628358A1 true EP2628358A1 (en) | 2013-08-21 |
Family
ID=45440482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11771108.5A Withdrawn EP2628358A1 (en) | 2010-10-15 | 2011-10-14 | Led driver circuit |
Country Status (10)
Country | Link |
---|---|
US (1) | US9301362B2 (en) |
EP (1) | EP2628358A1 (en) |
JP (1) | JP2013539920A (en) |
KR (1) | KR20140020833A (en) |
CN (1) | CN103238373B (en) |
BR (1) | BR112013009195A2 (en) |
DE (1) | DE102011114880A1 (en) |
RU (1) | RU2013121972A (en) |
TW (1) | TW201234918A (en) |
WO (1) | WO2012049283A1 (en) |
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US20100213869A1 (en) * | 2009-02-24 | 2010-08-26 | Andrew Locke | Illumination device |
TWI466421B (en) * | 2012-12-05 | 2014-12-21 | Hep Tech Co Ltd | Method of Activation Method of Passive AC and DC Converter and Its Function Correction Circuit |
-
2011
- 2011-10-05 DE DE102011114880A patent/DE102011114880A1/en not_active Withdrawn
- 2011-10-14 US US13/879,055 patent/US9301362B2/en not_active Expired - Fee Related
- 2011-10-14 EP EP11771108.5A patent/EP2628358A1/en not_active Withdrawn
- 2011-10-14 WO PCT/EP2011/067959 patent/WO2012049283A1/en active Application Filing
- 2011-10-14 KR KR1020137012447A patent/KR20140020833A/en not_active Application Discontinuation
- 2011-10-14 TW TW100137278A patent/TW201234918A/en unknown
- 2011-10-14 JP JP2013533228A patent/JP2013539920A/en active Pending
- 2011-10-14 RU RU2013121972/07A patent/RU2013121972A/en not_active Application Discontinuation
- 2011-10-14 CN CN201180060272.5A patent/CN103238373B/en not_active Expired - Fee Related
- 2011-10-14 BR BR112013009195A patent/BR112013009195A2/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201234918A (en) | 2012-08-16 |
JP2013539920A (en) | 2013-10-28 |
KR20140020833A (en) | 2014-02-19 |
US9301362B2 (en) | 2016-03-29 |
DE102011114880A1 (en) | 2012-04-19 |
CN103238373B (en) | 2016-08-17 |
BR112013009195A2 (en) | 2016-07-26 |
CN103238373A (en) | 2013-08-07 |
US20130241425A1 (en) | 2013-09-19 |
WO2012049283A1 (en) | 2012-04-19 |
RU2013121972A (en) | 2014-11-20 |
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