EP2571048A3 - Method for producing a structure with a cavity sealed hermetically under a controlled atmosphere - Google Patents

Method for producing a structure with a cavity sealed hermetically under a controlled atmosphere Download PDF

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Publication number
EP2571048A3
EP2571048A3 EP12182855.2A EP12182855A EP2571048A3 EP 2571048 A3 EP2571048 A3 EP 2571048A3 EP 12182855 A EP12182855 A EP 12182855A EP 2571048 A3 EP2571048 A3 EP 2571048A3
Authority
EP
European Patent Office
Prior art keywords
producing
controlled atmosphere
sealed hermetically
cavity sealed
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12182855.2A
Other languages
German (de)
French (fr)
Other versions
EP2571048A2 (en
EP2571048B1 (en
Inventor
Jean-Louis Pornin
Xavier Baillin
Charlotte Gillot
Laurent Vandroux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique et aux Energies Alternatives CEA filed Critical Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Publication of EP2571048A2 publication Critical patent/EP2571048A2/en
Publication of EP2571048A3 publication Critical patent/EP2571048A3/en
Application granted granted Critical
Publication of EP2571048B1 publication Critical patent/EP2571048B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/20—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. moulding inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Micromachines (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Procédé de réalisation d'une structure d'encapsulation (100) comportant les étapes de :
- réalisation d'au moins une portion de matériau (110) apte à libérer au moins un gaz lorsque ledit matériau est chauffé, la portion de matériau communiquant avec l'intérieur d'une cavité (102) fermée hermétiquement de la structure d'encapsulation,
- chauffage de tout ou partie de ladite portion de matériau tel qu'au moins une partie du gaz soit libérée depuis ladite portion de matériau dans la cavité,

et dans lequel ladite portion de matériau apte à libérer au moins un gaz lorsque ledit matériau est chauffé comporte des éléments piégés dans ladite portion de matériau, lesdits éléments piégés se libérant de ladite portion de matériau sous forme gazeuse lors du chauffage dudit matériau.

Figure imgaf001
A method of making an encapsulation structure (100) comprising the steps of:
- Realization of at least a portion of material (110) capable of releasing at least one gas when said material is heated, the portion of material communicating with the interior of a cavity (102) hermetically sealed the encapsulation structure ,
heating all or part of said portion of material such that at least a portion of the gas is released from said portion of material into the cavity,

and wherein said portion of material capable of releasing at least one gas when said material is heated comprises elements trapped in said portion of material, said trapped elements freeing from said portion of material in gaseous form during heating of said material.
Figure imgaf001
EP12182855.2A 2011-09-08 2012-09-03 Method for producing a structure with a cavity sealed hermetically under a controlled atmosphere Not-in-force EP2571048B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1157975A FR2980034B1 (en) 2011-09-08 2011-09-08 METHOD OF MAKING A CLOSED CAVITY STRUCTURE HERMETICALLY AND UNDER CONTROLLED ATMOSPHERE

Publications (3)

Publication Number Publication Date
EP2571048A2 EP2571048A2 (en) 2013-03-20
EP2571048A3 true EP2571048A3 (en) 2014-08-20
EP2571048B1 EP2571048B1 (en) 2016-08-10

Family

ID=46727157

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12182855.2A Not-in-force EP2571048B1 (en) 2011-09-08 2012-09-03 Method for producing a structure with a cavity sealed hermetically under a controlled atmosphere

Country Status (4)

Country Link
US (1) US8962069B2 (en)
EP (1) EP2571048B1 (en)
JP (1) JP2013056413A (en)
FR (1) FR2980034B1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3014241B1 (en) 2013-11-29 2017-05-05 Commissariat Energie Atomique ENCAPSULATION STRUCTURE COMPRISING PARTIALLY FILLED TRENCHES OF MATERIAL GETTER
US9365411B2 (en) * 2014-02-03 2016-06-14 Seiko Epson Corporation MEMS device and method for manufacturing the same
SE538346C2 (en) * 2014-02-07 2016-05-24 Silex Microsystems Ab Control of pressure in cavities on substrate
US9416003B2 (en) * 2014-02-24 2016-08-16 Freescale Semiconductor, Inc. Semiconductor die with high pressure cavity
DE102015224483A1 (en) * 2015-12-08 2017-06-08 Robert Bosch Gmbh Targeted control of the absorption behavior during laser resealing
CN107777656A (en) * 2016-08-26 2018-03-09 深迪半导体(上海)有限公司 A kind of MEMS and cavity air pressure control method
JP6990997B2 (en) * 2017-06-06 2022-01-12 株式会社日立製作所 MEMS device
DE102017125140B4 (en) * 2017-10-26 2021-06-10 Infineon Technologies Ag Method for producing a hermetically sealed housing with a semiconductor component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
WO2005089348A2 (en) * 2004-03-15 2005-09-29 Georgia Tech Research Corporation Packaging for micro electro-mechanical systems and methods of fabricating thereof
DE102007022509A1 (en) * 2007-05-14 2008-11-20 Robert Bosch Gmbh Micromechanical device with thin-film capping and manufacturing process
US20110048129A1 (en) * 2009-04-17 2011-03-03 Hitachi, Ltd. Inertial Sensor and Method of Manufacturing the Same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2756973B1 (en) 1996-12-09 1999-01-08 Commissariat Energie Atomique METHOD FOR INTRODUCING A GASEOUS PHASE IN A CLOSED CAVITY
US6936491B2 (en) * 2003-06-04 2005-08-30 Robert Bosch Gmbh Method of fabricating microelectromechanical systems and devices having trench isolated contacts
US7803665B2 (en) * 2005-02-04 2010-09-28 Imec Method for encapsulating a device in a microcavity
FR2903678B1 (en) * 2006-07-13 2008-10-24 Commissariat Energie Atomique ENCAPSULATED MICROCOMPONENT EQUIPPED WITH AT LEAST ONE GETTER
WO2008085779A1 (en) * 2007-01-05 2008-07-17 Miradia Inc. Methods and systems for wafer level packaging of mems structures
FR2933390B1 (en) * 2008-07-01 2010-09-03 Commissariat Energie Atomique METHOD FOR ENCAPSULATING A MICROELECTRONIC DEVICE BY A GETTER MATERIAL
US9171964B2 (en) * 2010-11-23 2015-10-27 Honeywell International Inc. Systems and methods for a three-layer chip-scale MEMS device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030183916A1 (en) * 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
WO2005089348A2 (en) * 2004-03-15 2005-09-29 Georgia Tech Research Corporation Packaging for micro electro-mechanical systems and methods of fabricating thereof
DE102007022509A1 (en) * 2007-05-14 2008-11-20 Robert Bosch Gmbh Micromechanical device with thin-film capping and manufacturing process
US20110048129A1 (en) * 2009-04-17 2011-03-03 Hitachi, Ltd. Inertial Sensor and Method of Manufacturing the Same

Also Published As

Publication number Publication date
US20130243942A1 (en) 2013-09-19
EP2571048A2 (en) 2013-03-20
FR2980034A1 (en) 2013-03-15
JP2013056413A (en) 2013-03-28
FR2980034B1 (en) 2014-07-04
EP2571048B1 (en) 2016-08-10
US8962069B2 (en) 2015-02-24

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