EP2396590B1 - Dispositif d'éclairage - Google Patents

Dispositif d'éclairage Download PDF

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Publication number
EP2396590B1
EP2396590B1 EP10707236.5A EP10707236A EP2396590B1 EP 2396590 B1 EP2396590 B1 EP 2396590B1 EP 10707236 A EP10707236 A EP 10707236A EP 2396590 B1 EP2396590 B1 EP 2396590B1
Authority
EP
European Patent Office
Prior art keywords
carrier
lighting device
heat sink
layer
driver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP10707236.5A
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German (de)
English (en)
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EP2396590A1 (fr
Inventor
Thomas Preuschl
Florian Zeus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
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Filing date
Publication date
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Publication of EP2396590A1 publication Critical patent/EP2396590A1/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting device, in particular an LED retrofit lamp or an LED module for a retrofit lamp.
  • the LED retrofit lamp has a driver for operating the LED (s), which comprises a voltage regulator for converting a mains voltage, for example 230 V, to a voltage of approximately 10 V to 25 V, typically a transformer.
  • the efficiency of a SELV driver is typically between 70% and 80%.
  • insulation distances between a primary side and a secondary side with respect to the voltage regulator of at least 5 mm must be maintained in order to avoid electric shock caused by leakage currents.
  • overvoltage pulses of up to 4 KV should be kept away from the secondary side, so that even then there is no danger to the user if he electrically conductive touchable parts such. B. touches the heat sink during the occurrence of the pulse.
  • LED retrofit lamps may be constructed so that the LED (s) are mounted on a carrier which is bolted to the heat sink and is electrically isolated therefrom.
  • a necessary length of the creepage distance or insulation between electrically conductive or electrically conductive surface areas (contact fields, conductor traces, etc., eg on copper and / or conductive paste with, for example, silver) and the heat sink is achieved in that, firstly, the potential-carrying surface areas keep a distance of at least 5 mm to an edge of the carrier and secondly an electrical insulating area of at least 5 mm around the screwing points is maintained.
  • the potential-carrying surface areas keep a distance of at least 5 mm to an edge of the carrier and secondly an electrical insulating area of at least 5 mm around the screwing points is maintained.
  • such a design has a large space requirement.
  • the US 2006 / 227558A1 shows in the figures 14 and 15, a lighting device according to the preamble of claim 1.
  • a disadvantage is the complex positioning of the support for the semiconductor light source, which takes place via a screw which takes up much space on the support.
  • the lighting device comprises: a heat sink with at least one carrier applied to its outside for at least one semiconductor light source; a recess for receiving a driver; and at least one electrically insulating supply which connects the recess to the outside of the heat sink; wherein the supply has a flush on the outside of the heat sink adjacent support surface, which is at least partially covered by the carrier. Furthermore, the feed has a protrusion projecting outward on the outside of the heat sink, wherein a surface of the projection and the support surface form a step.
  • the carrier may, for example, be configured as a substrate, a printed circuit board or the like.
  • the heat sink may advantageously consist of a good heat-conducting material with ⁇ > 10 W / (m ⁇ K), particularly preferably ⁇ > 100 W / (m ⁇ K), in particular of a metal such as aluminum, copper or an alloy thereof.
  • the heat sink can also be completely or partially made of an art consist of material; Particularly advantageous for the electrical insulation and extension of the creepage distances is a good heat-conducting and electrically insulating plastic, but it is also the use of a highly thermally conductive and electrically conductive plastic possible.
  • the heat sink may preferably be symmetrical, in particular rotationally symmetric, z. B. about a longitudinal axis.
  • the heat sink may advantageously comprise cooling elements, for. B. cooling fins or cooling pins.
  • the type of semiconductor light source is not limited in principle, but an LED is preferred as the emitter.
  • the semiconductor light source may include one or more emitters.
  • the semiconductor emitter or semiconductors may be mounted on the carrier on which other electronic components such as resistors, capacitors, logic devices, etc. may be mounted.
  • the semiconductor emitters may, for example, be applied to the carrier by means of conventional soldering methods.
  • the semiconductor emitters may also be connected to a substrate by chip-level connection types, such as bonding (wire bonding, flip-chip bonding), etc. (“submount”), e.g. B. by equipping a substrate made of AlN with LED chips.
  • one or more submounts may be mounted on a circuit board.
  • the semiconductor emitters can at least partially also have a different jet color, z. Red (R), green (G), blue (B), amber (A) and / or white (W).
  • R red
  • G green
  • B blue
  • A amber
  • W white
  • a beam color of the light source can be tuned, and it can be set any color point.
  • semiconductor emitters of different jet color can produce a white mixed light.
  • z. B. based on InGaN or AlInGaP
  • organic LEDs OLEDs
  • z. B. diode lasers are used.
  • the carrier may be implemented as a circuit board or other substrate, e.g. B. as a compact ceramic body.
  • the carrier may include one or more wiring layers.
  • the recess has an insertion opening for insertion of a driver, for. B. a driver board.
  • the insertion opening of the recess may advantageously be located on a rear side of the heat sink.
  • the Einzhouöffnüng and the feeder are advantageously located on opposite sides of the recess.
  • the recess may for example be designed cylindrical.
  • the recess may advantageously be electrically insulated from the heat sink to avoid direct creepage distances, z. B. by means of an electrically insulating lining (also housing the driver cavity, GTK, called), z. B. in the form of an inserted through the insertion opening into the recess plastic pipe.
  • the liner may include one or more fasteners for securing the driver.
  • the supply serves to supply or carry out at least one electrical line between the driver located in the recess and the at least one semiconductor light source or the carrier equipped therewith.
  • the feeder and liner may be integrally formed as a single element. With the insertion of the lining into the recess, the supply is then simultaneously pushed through a passage opening of the cooling body.
  • the at least one electrical lead which may be configured, for example, as a wire, cable or connector of any type, may be contacted by any suitable method, e.g. B. by soldering, resistance welding, laser welding, etc.
  • the driver may be a general drive circuit for driving the at least one semiconductor light source.
  • the driver is designed as a non-SELV driver, in particular as a transformerless non-SELV driver.
  • a non-SELV driver has over a SELV driver higher efficiency of typically more than 90% and can also be built more cost-effectively.
  • a separation between the primary side and the secondary side rather takes place primarily between the carrier and the heat sink.
  • the transformer can advantageously be replaced by a coil or a buck configuration / a step-down converter.
  • the part of the outside of the heat sink on which the carrier is mounted, and the flush-fitting contact surface of the feed can advantageously form a common planar surface.
  • the carrier can partially rest on a flat front side or front side of the heat sink and partially on the flush and coplanar adjoining support surface or cover it.
  • the carrier does not need to lie flat over the entire surface covered by it, but may for example also be partially spaced over a gap from the surface covered by it.
  • the creepage distance can be shortened laterally and thus a laterally more compact lighting device can be achieved.
  • the creepage distance may be extended by the lateral distance of the inner edge of the electrically conductive heat sink. Consequently, potential-carrying surfaces of the carrier can be positioned closer to the edge by the same distance, which in turn enables the carrier to have a smaller lateral (lateral) extent.
  • a creepage distance in the region of the support surface of the feed can be extended by its electrically insulating design, since the leakage currents then have to travel a long distance to the heat sink.
  • Electrically conductive, in particular potential, surfaces can advantageously copper and / or conductive pastes with z. B. have silver.
  • the carrier may be secured to the heat sink by means of an electrically insulating transition layer.
  • the electrically insulating transition layer can advantageously be adhesive on both sides for reliable connection between the carrier and the heat sink.
  • the transition layer may advantageously be a thermal interface material (TIM) such as a thermal grease (eg, silicone oil with additions of alumina, zinc oxide, boron nitride, or silver powder), a film, or an adhesive.
  • the film may for example be provided on both sides with an adhesive in the manner of a double-sided adhesive tape.
  • the adhesive can be applied, for example, by means of a dispersion process and a subsequent doctoring.
  • the transitional layer may also have the advantages of high dielectric strength and elongation of the creepage path. Also, by the transitional position, a screwless structure can be achieved by which an otherwise required isolation area on the carrier can be omitted around the screw passages to the heat sink around. This also supports a compact construction of the lighting device.
  • the carrier may in principle be attached to the heat sink in other ways.
  • the carrier can also be screwed by means of one or more plastic screws with the heat sink or through the heat sink with the lining of the driver cavity.
  • Another way of securing the carrier is to use a plastic pin integrated in the lining of the driver cavity which projects through the heat sink and through the carrier. The pin can be hot-staked for fastening the carrier, for example.
  • a fastening by means of riveting in particular Taumelnietens possible, especially using plastic rivets.
  • an attachment for example by means of a centrally guided by the carrier screw, in particular plastic screw possible; Among other things, in this case, the supply may be arranged off-center.
  • Another possibility of attachment consists in a magnetic attachment, for example, with a magnetic pole in the Liner integrated or attached and attached to a magnetic opposite pole to the carrier, for. B. by gluing etc.
  • the feed may also be arranged off-center, for. B. offset laterally from the longitudinal axis of the heat sink or the substrate.
  • the feed can also be arranged outside a lateral extent of the carrier. Then, the at least one electrical line can be guided from the outside to the outside of the carrier.
  • the thermal interface material may laterally extend beyond an inner edge and / or an outer edge beyond the carrier.
  • the creepage distance at the respective edge can be lengthened by the length by which the thermal transfer material projects laterally beyond the respective edge.
  • the support may advantageously have at least one electrically insulating insulation layer.
  • an insulating layer may consist of a material or composite material which is thermally well and electrically poorly conductive, at least in the thickness direction.
  • an insulating layer of ceramic such. With Al 2 O 3 , AlN, BN or SiC.
  • the insulating layer may be configured as a multilayer ceramic carrier, z. In LTCC technology. In this case, for example, layers can be used with different materials, eg. B. with different ceramics. These may, for example, be alternately highly dielectric and low dielectric.
  • the at least one insulating layer may consist of a typical circuit board base material, such as FR4, which is less thermally advantageous but very inexpensive.
  • the insulation layer can be applied on one side or on both sides. In particular, the use of an insulated metal substrate (IMS) or a metal core board (MCPCB) as a carrier is conceivable.
  • IMS insulated metal substrate
  • MCPCB metal core board
  • the carrier may advantageously have a dielectric strength of at least 4 KV, so that overvoltage pulses of at least this magnitude do not strike through the carrier.
  • the carrier may comprise at least one insulating layer and a metal layer arranged on the underside thereof, wherein the underside metal layer is retracted laterally at an inner edge of the carrier.
  • a creepage distance at an edge of the carrier can be further extended, since a leakage current then has to travel an additional distance from the edge of the base material layer to the metal layer and further from the base material layer to the edge of the thermal transfer material.
  • the underside metal layer is retracted by more than 1 mm from the inner or inner edge of the carrier. Together with the thermal transition material thus results in a particularly compact in the lateral plane creepage distance or isolation distance, which is S-shaped in depth.
  • the underside metal layer may advantageously be a DCB (Direct Copper Bonding) layer of copper.
  • the carrier can also have a DCB layer on the upper side.
  • the carrier has at least one insulating layer and a metal layer arranged thereon on the underside, wherein the underside metal layer is retracted laterally at an outer edge of the carrier.
  • a thickness of the carrier can advantageously be in the range between 0.16 mm and 1 mm.
  • a creepage path is at least 1 mm long, particularly preferably at least 5 mm.
  • An at least local thermal conductivity or heat spread of the carrier may advantageously be between 20 (W / m * K) and 400 (W / m * K), e.g. B. about 400 (W / m ⁇ K) for a copper layer.
  • the feed has a protrusion projecting outwards on the outside of the heat sink, wherein a surface of the projection and the support surface form a rectangular step.
  • the projection may advantageously be perpendicular to a flat surface of the heat sink, for. B. a flat face, projecting.
  • the carrier can be placed with close clearance (a small distance around the outward-facing projection of the feeder around, which also supports a compact design.)
  • the projection can serve as a centering aid during assembly of the carrier on the heat sink to have a central opening.
  • the carrier is arranged circumferentially and concentrically or coaxially to the feed. Also, a small lateral extent of the carrier is achieved relative to a longitudinal axis of the heat sink. It may be advantageous for compliance with predetermined isolation distances, when the LEDs are arranged uniformly in the circumferential direction.
  • the lighting device further comprises at least one pressing element for pressing the carrier on the heat sink.
  • the pressure element can advantageously have a circumferential or partially rotating, in particular sectored, ring of a - in particular electrically insulating - material.
  • the lighting device can advantageously have a (at least partially translucent) piston (eg, clamped on the heat sink), which has a Anpressyak pressing on the carrier and / or the pressure element to an additional contact pressure on the heat sink enable.
  • the piston can be equipped with a contact pressure in the form of a circumferential hold-down for the carrier.
  • the carrier can advantageously have on the upper side at least one electrically conductive surface region which maintains a minimum distance from an inner edge of the carrier and / or an outer edge of the carrier, in particular a minimum distance of 3.5 mm or more.
  • the semiconductor light source may advantageously be powered by means of a non-SELV voltage, but use with a safety extra-low voltage (SELV) is also possible.
  • SELV safety extra-low voltage
  • the lighting device can be configured particularly advantageously as retrofit lamp, in particular LED retrofit lamp, or as a module for this purpose.
  • FIG. 1 shows in plan an LED retrofit lamp 1 according to a first embodiment.
  • the LED retrofit lamp 1 serves to replace a conventional light bulb with Edison base and therefore has an outer contour, which roughly reproduces the contour of the conventional light bulb in its basic form (see also FIG. 3 ).
  • the LED retrofit lamp 1 has an outer shell 2, into which an LED module 3 is inserted.
  • the LED module 3 has an aluminum heat sink 4, on the upper side or front surface 5 shown here, an Al 2 O 3 carrier 6 is fixed with an octagonal outer contour.
  • the carrier 6 is equipped with semiconductor light sources in the form of light-emitting diodes 7.
  • the light-emitting diodes 7 shine in the upper half-space, ie in this illustration with a main emission direction out of the image plane.
  • the carrier 6 has a central hole, with which the carrier 6 can be inserted tightly over a feed formed here as a cable channel 8.
  • the cable channel 8 serves as an element for the passage of electrical lines (o. Fig.) Of a in the heat sink
  • the carrier 6 and the cable channel 8 are thus positioned coaxially with respect to a vertically projecting from the image axis longitudinal axis L of the lighting device 1, wherein the longitudinal axis L extends centrally through the cable channel 8.
  • FIG. 2 shows in supervision the carrier 6 FIG. 1 in a more detailed presentation.
  • a front surface 5 of the carrier 6 is equipped with three white LEDs 7, which are arranged approximately angularly symmetrical about a longitudinal axis L, wherein the longitudinal axis L extends centrally through the hole 9 of the carrier 6.
  • the LEDs 7 are electrically contacted to their power supply by means of contact surfaces 10 a with the carrier 6.
  • electrical lines o. Fig.
  • the electrical conductor tracks used for current conduction are formed by a correspondingly structured (here greatly simplified) outer-side copper layer 11.
  • Both the contact surfaces 10 a and the cable connection surfaces 10 b and the copper layer 11 represent potential-carrying surface areas, which are electrically insulated against the heat sink 4 over sufficiently long isolation distances, at least by means of the carrier 6.
  • the copper layer 11 is not executed completely circumferential, but has a radially with respect to the longitudinal axis L extending gap 12 in order to avoid a short circuit.
  • FIG. 3 shows the LED retrofit lamp 1 according to the first embodiment as a sectional view along the section line AA FIG. 1 ,
  • the LED retrofit lamp 1 does not surmount the outer contour of a conventional incandescent lamp and can be used with its Edison base 13 as a substitute for a corresponding incandescent lamp.
  • a cylindrical recess in the form of a driver cavity 14 is present, which on its lateral lateral surface 15 and upper end surface 16 with an electrically insulating lining 17 (hereinafter also "housing the driver cavity", GTK, called) is made of a plastic.
  • a lower insertion opening 18 is electrically sealed against the heat sink 4 by an attachment 19, which also includes the Edison base 13.
  • a driver board 20 is accommodated, which has all or at least some of the required for operating the light emitting diodes 7 elements.
  • the driver board 20 is electrically connected to the Edisonsockel 13 for power supply and outputs the required for operating the light emitting diodes 7 voltage and / or current via electrical cable 21 to the light emitting diodes 7 on.
  • the driver board 20 is connected via the electrical cable 21 with suitable cable connection surfaces 10b.
  • the driver implemented on the driver board 20 is here a transformerless non-SELV driver. A separation between the primary side and the secondary side takes place primarily between the carrier 6 and the heat sink 4.
  • the transformerless non-SELV driver may have a coil or buck configuration / step-down converter for voltage conversion.
  • the upper end surface 16 has a passage opening 22.
  • the liner 17 is configured so that the cable channel 8 is integrally integrated into the liner 17 connecting the recess 14 and the interior of the liner 17 to the front surface 5 of the heat sink 4.
  • the front surface 5 is covered with an opaque or light-scattering piston 27 for its protection and for the homogenization of the light emitted by the lighting device 1.
  • the piston 27 may be clamped to the heat sink 4 and e.g. be equipped with a circumferential Anpress kau in the form of a hold-down for the carrier.
  • FIG. 4 shows a section B from the LED retrofit lamp 1 FIG. 3 , as indicated by the circle B there.
  • a section C of the LED retrofit lamp 1 in the region of the support surface 24 is shown.
  • the cable channel 8 has a radially widened region 23, the upper surface of which serves as a bearing surface 24 for the support 6 when the lining is inserted and rests flush on the front surface 5 of the cooling body 4.
  • a plane 5, 24 which is planar on the front side and perpendicular to the longitudinal axis L is created for supporting the carrier 6.
  • the lining 17 or the cable duct 8 integrated into it has a projection 25 directed perpendicularly from the heat sink 4 to the outside (here: in the longitudinal direction L).
  • the projection 25 and the bearing surface 24 of the lining form a right-angled step 26.
  • the carrier 6 closely surrounds the projection 25 (with little play or tolerance), so that the projection 25 can serve as a centering aid in an assembly of the carrier 6.
  • the carrier 6 completely covers the support surface 24, and the flat front surface 5 of the heat sink 4 partially.
  • the carrier 6 is connected on the underside with the support surface 24 and the flat front surface 5 via an electrically insulating and adhesive transition layer 28 of a thermal transfer material (TIM).
  • TIM thermal transfer material
  • the transitional layer 28 also extends on the inside to the projection 25 and protrudes on the outside (in a lateral direction perpendicular to the longitudinal axis L) beyond the carrier 6.
  • the carrier 6 is pressed by means of a pressure element 35, which is present here in the form of an electrically insulating, circumferential plastic ring, on the heat sink 4.
  • the pressing element 35 itself can be pressed onto the carrier 6 by means of a pressing aid ('hold-down'), not shown here, wherein the pressing aid is located on the piston for easy mounting.
  • the Anpress kau can be performed, for example, rotating.
  • a beginning M of the shortest inner creepage distance K on the copper layer 11 can begin and radially to the inner edge 29 of the carrier (to the right in FIG. 4 ), from there over the inner edge 29 of the carrier 6 and the transition layer 28 down (neglecting the thickness of the transitional layer 28), and again outwards (to the left in FIG. 4 ) over the support surface 24 to a next point N on the heat sink 4.
  • a sufficiently long inner creepage distance K or isolation distance can be provided in a laterally particularly compact manner.
  • the creepage distance should be selected so that requirements for the safety of the device are met. Regulations for this are made in various standards. In general, a creepage distance of more than 6.4 mm has proven to be sufficiently safe for the common applications.
  • This results in an entire outer Creepage distance of also 5.9 mm, in which case the lateral space gain corresponds to the thickness of the carrier 6 of d2 0.4 mm.
  • FIG. 5 shows in one too FIG. 4 analogous representation of a section in the region of a cable channel 8 from a LED retrofit lamp 31 according to a second embodiment, in which now compared to the first embodiment of the carrier 32 is designed differently.
  • the carrier 32 is now multi-layered in that it has an identical to the support 6 of the first embodiment Al 2 O 3 insulation layer 33, on the upper side, the copper layer 11 is attached, but now at the bottom of the insulating layer 33 a Metal layer in the form of a lower copper layer 34 is attached.
  • the carrier 32 can then be embodied particularly simply as a double-sided DCB ("Direct Copper Bonding") -bonded carrier 32.
  • the lower copper layer 34 is thus located between two electrically insulating layers, namely the transition layer 28 and the insulating layer 33.
  • Fig. 6 shows an example of the attachment of the carrier 6 by means of a pressing element 35.
  • the carrier 6 with the LEDs 7 surrounds the cable channel 8 and is fixed on the heat sink 4 and the transitional layer 28 of 4 retaining tabs 36.
  • the retaining tabs 36 together with a retaining ring 37 substantially the pressure element 35.
  • To Positontechnik and fixing serve retaining pins 38.
  • a circumferential Anpress kau 39 is provided.
  • the retaining pins may be designed according to the knowledge of the skilled person, for example as press-fit pins, snap connectors, screws or as H formulateverstemmwind.
  • the present invention is not limited to the embodiments shown.
  • at least one of the distances d1 to d7 is at least 1 mm long, preferably between 1 mm and 5 mm.
  • the length of the creepage paths or creepage distances is at least 1 mm, particularly preferably at least 5 mm.
  • the material of the cooling body except pure aluminum and an aluminum alloy or another metal or its alloy or even have a good heat conducting plastic.
  • the cable channel can also be arranged eccentrically (laterally offset with respect to the longitudinal axis).
  • the supply can generally be a separate component or, for example, integrated into the lining of the recess and / or in the heat sink, for example in one piece.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Claims (14)

  1. Dispositif d'éclairage (1 ; 31), présentant
    - un corps de refroidissement (4) avec au moins un support (6 ; 32), installé au niveau de son côté externe (5), pour au moins une source lumineuse à semi-conducteur (2), en particulier une diode électroluminescente ;
    - un évidement (14) destiné à accueillir un circuit d'attaque (20) ;
    - au moins une alimentation électriquement isolante (8), qui relie l'évidement (24) au côté externe (5) du corps de refroidissement (4) ;
    - dans lequel l'alimentation (8) présente une surface d'appui (24) contiguë à ras du côté externe (5) du corps de refroidissement, ladite surface d'appui étant recouverte au moins partiellement par le support (6 ; 32), caractérisé en ce que l'alimentation (8) présente une avancée (25) faisant saillie vers l'extérieur par rapport au côté externe (5) du corps de refroidissement (4), dans lequel une surface de l'avancée (25) et la surface d'appui (24) forment un étagement (26).
  2. Dispositif d'éclairage (1 ; 31) selon la revendication 1, dans lequel le support (6 ; 32) est fixé sur le corps de refroidissement (4) au moyen d'une couche de jonction (28) électriquement isolante.
  3. Dispositif d'éclairage (1 ; 31) selon la revendication 2, dans lequel la couche de jonction (28) dépasse de manière latérale un bord intérieur (29) et/ou un bord extérieur (30) du support (6 ; 32).
  4. Dispositif d'éclairage (31) selon la revendication 2 ou 3, dans lequel le support (32) présente une couche d'isolation (33) et une couche métallique (34) agencée côté inférieur par rapport à celle-ci,
    dans lequel la couche métallique côté inférieur (34) est rétractée latéralement au niveau d'un bord intérieur (29) et/ou d'un bord extérieur (30) du support (32).
  5. Dispositif d'éclairage (31) selon la revendication 4, dans lequel la couche métallique côté inférieur (34) est une couche DCB.
  6. Dispositif d'éclairage (1 ; 31) selon l'une quelconque des revendications précédentes, dans lequel une surface de l'avancée (25) et la surface d'appui (24) forment un étagement (26) à angle droit.
  7. Dispositif d'éclairage (1 ; 31) selon l'une quelconque des revendications précédentes, dans lequel le support (6 ; 32) est agencé tournant et concentrique par rapport à l'alimentation (8).
  8. Dispositif d'éclairage (1) selon l'une quelconque des revendications précédentes, présentant en outre au moins un élément presseur (35) destiné à presser le support (6) sur le corps de refroidissement (4).
  9. Dispositif d'éclairage (1) selon la revendication 8, dans lequel l'élément presseur (35) présente un anneau tournant ou partiellement tournant en une matière électriquement isolante.
  10. Dispositif d'éclairage selon la revendication 8 ou 9, qui présente une ampoule (27), laquelle ampoule présente une aide à la pression, laquelle aide presse sur le support (6) et/ou l'élément presseur (35).
  11. Dispositif d'éclairage (1 ; 31) selon l'une quelconque des revendications précédentes, dans lequel le support (6 ; 32) présente côté supérieur au moins un secteur superficiel électriquement conducteur (10, 11), qui respecte un espacement minimum (d1, d4) par rapport à un bord intérieur (29) du support (6 ; 32) et/ou à un bord extérieur (30) du support (6 ; 32), en particulier un espacement minimum (d1) supérieur ou égal à 3,5 mm.
  12. Dispositif d'éclairage (1 ; 31) selon l'une quelconque des revendications précédentes, dans lequel la source lumineuse à semi-conducteur (7) est alimentée avec une tension non TBTS.
  13. Dispositif d'éclairage (1 ; 31) selon la revendication 12, dans lequel le circuit d'attaque est un circuit d'attaque non TBTS sans transformateur.
  14. Dispositif d'éclairage (1 ; 31) selon l'une quelconque des revendications précédentes, qui est conçu en tant que lampe rétrofit à DEL ou en tant que module DEL pour une lampe rétrofit à DEL.
EP10707236.5A 2009-02-12 2010-02-11 Dispositif d'éclairage Active EP2396590B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009008637.4A DE102009008637B4 (de) 2009-02-12 2009-02-12 Leuchtvorrichtung
PCT/EP2010/051703 WO2010092110A1 (fr) 2009-02-12 2010-02-11 Dispositif d'éclairage

Publications (2)

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EP2396590A1 EP2396590A1 (fr) 2011-12-21
EP2396590B1 true EP2396590B1 (fr) 2016-06-29

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US (1) US8622587B2 (fr)
EP (1) EP2396590B1 (fr)
JP (1) JP2012517681A (fr)
CN (1) CN102317674B (fr)
DE (1) DE102009008637B4 (fr)
WO (1) WO2010092110A1 (fr)

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JP5348410B2 (ja) * 2009-06-30 2013-11-20 東芝ライテック株式会社 口金付ランプおよび照明器具
DE102009054519A1 (de) * 2009-12-10 2011-06-16 Osram Gesellschaft mit beschränkter Haftung Led-Lampe
EP2447597A4 (fr) * 2010-03-04 2013-02-13 Panasonic Corp Lampe à diodes électroluminescentes du type ampoule électrique et appareil d'éclairage
CN203549432U (zh) * 2011-01-18 2014-04-16 松下电器产业株式会社 灯泡形灯及照明装置
JP5773810B2 (ja) * 2011-09-05 2015-09-02 三菱電機株式会社 照明器具
DE102011084795B4 (de) 2011-10-19 2013-11-07 Osram Gmbh Halbleiterleuchtvorrichtung mit einem galvanisch nicht-isolierten Treiber
KR101933189B1 (ko) 2012-01-31 2019-04-05 서울반도체 주식회사 발광다이오드 패키지
KR101349513B1 (ko) 2012-03-20 2014-01-09 엘지이노텍 주식회사 조명장치 및 이를 포함하는 조명 제어 시스템
CN103807623B (zh) * 2012-11-09 2017-11-17 欧司朗有限公司 发光装置和一种包括该发光装置的照明装置
JP2014207112A (ja) * 2013-04-12 2014-10-30 パナソニック株式会社 照明器具
BR112016010823B1 (pt) * 2013-11-12 2023-04-11 Interdigital Ce Patent Holdings Dispositivo e decodificador de sinais
CN105023987B (zh) * 2014-04-23 2018-01-09 光宝光电(常州)有限公司 Led承载座及其制造方法
TWI589814B (zh) * 2014-07-24 2017-07-01 光寶電子（廣州）有限公司 發光裝置
JP6180469B2 (ja) * 2015-07-03 2017-08-16 三菱電機照明株式会社 照明装置
GB2543139B (en) * 2015-08-17 2018-05-23 Jiaxing Super Lighting Electric Appliance Co Ltd LED light bulb and LED filament thereof
US20230025975A1 (en) * 2021-07-21 2023-01-26 Lumileds Llc Late configurable led module and vehicle headlight

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US20110310624A1 (en) 2011-12-22
DE102009008637A1 (de) 2010-12-09
DE102009008637B4 (de) 2022-05-12
WO2010092110A1 (fr) 2010-08-19
US8622587B2 (en) 2014-01-07
CN102317674B (zh) 2013-08-07
CN102317674A (zh) 2012-01-11
JP2012517681A (ja) 2012-08-02
EP2396590A1 (fr) 2011-12-21

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