EP2370987A2 - Système de contrôle thermique pour un panneau d'affichage électronique - Google Patents

Système de contrôle thermique pour un panneau d'affichage électronique

Info

Publication number
EP2370987A2
EP2370987A2 EP09837994A EP09837994A EP2370987A2 EP 2370987 A2 EP2370987 A2 EP 2370987A2 EP 09837994 A EP09837994 A EP 09837994A EP 09837994 A EP09837994 A EP 09837994A EP 2370987 A2 EP2370987 A2 EP 2370987A2
Authority
EP
European Patent Office
Prior art keywords
assembly
channel
display
electronic
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09837994A
Other languages
German (de)
English (en)
Other versions
EP2370987A4 (fr
Inventor
William R. Dunn
Timothy Hubbard
Ware Bedell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MRI Inc
Manufacturing Resources International Inc
Original Assignee
MRI Inc
Manufacturing Resources International Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MRI Inc, Manufacturing Resources International Inc filed Critical MRI Inc
Publication of EP2370987A2 publication Critical patent/EP2370987A2/fr
Publication of EP2370987A4 publication Critical patent/EP2370987A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133382—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385—Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20972—Forced ventilation, e.g. on heat dissipaters coupled to components
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/36—Airflow channels, e.g. constructional arrangements facilitating the flow of air

Definitions

  • the exemplary embodiments generally relate to cooling systems and in particular to cooling systems for electronic displays.
  • Conductive and convective heat transfer systems for electronic displays generally attempt to remove heat from the electronic components in a display through as many sidewalls of the display as possible.
  • the systems of the past have relied primarily on fans for moving internal air within the housing past the components to be cooled and out of the display.
  • These components are typically power supplies.
  • the heated air is moved into convectively thermal communication with fins.
  • cooling devices for electronic displays of the past have generally used convective heat dissipation systems that function to cool only the rear interior portion of the display. When used outdoors or in other warm environments, this is not adequate, especially when radiative heat transfer from the sun through a front display surface becomes a major factor. In many applications 200 Watts or more of power through a front display surface is common. Furthermore, the market is demanding larger screen sizes for displays. With increased electronic display screen size and corresponding front display surface size more heat will be generated and more heat will be transmitted into the displays.
  • the ambient air may contain contaminates (dust, dirt, pollen, water vapor, brake dust, sand, smoke, etc.) which, if ingested into the display for cooling the interior can cause damage to the interior components of the display.
  • contaminates dust, dirt, pollen, water vapor, brake dust, sand, smoke, etc.
  • Modern displays have become increasingly brighter, with some backlights producing 1 ,000-2,000 nits or more.
  • illumination devices such as CCFL assemblies, LEDs, organic LEDs, and plasma assemblies may produce a relatively large amount of heat.
  • the illumination devices require a relatively large amount of power in order to generate the required brightness level. This large amount of power is typically supplied through one or more power supplies for the display. These power supplies may also become a significant source of heat for the display.
  • a preferred embodiment may cause convective heat transfer from the front face of the image assembly as well (the side which faces an intended viewer).
  • These preferred embodiments may comprise two separate flow paths for gas through an electronic display.
  • a first flow path may be a closed loop and a second flow path may be an open loop.
  • the closed loop path travels across the front surface of the image assembly, continues to the rear of the display where it may enter a heat exchanger, finally returning to the front surface of the image assembly.
  • the open loop path draws gas (ex. ambient air) through the rear of the display (possibly through a heat exchanger) and then exhausts it out of the display housing.
  • a heat exchanger may be used to transfer heat from the closed loop to the open loop and exhausted out of the display.
  • the open loop may also be forced behind the image assembly (sometimes a backlight other times an OLED or other type of image-producing assembly), in order to cool the image assembly and/or backlight assembly (if a backlight is necessary for the particular type of display being used).
  • a cross-flow heat exchanger may be used in an exemplary embodiment.
  • FIG. 1 For embodiments, Other embodiments relate to a system for cooling the following portions of an electronic display, either alone or in combination: (1 ) power module(s), (2) backlight, and (3) front display surface.
  • Power modules with heat dissipating assemblies (ex. cold plates and/or heat sinks) may be used with some embodiments where the side of the power module containing the heat dissipating assembly is placed in the path of ambient gas while the side of the power module containing sensitive electrical components remains in a separate environment.
  • An isolating structure may provide the necessary gaseous (and sometimes particulate/contaminate) isolation between the two sides of the power modules.
  • the closed loop may or may not be used when cooling the power modules with an open loop of ambient gas.
  • Backlights with a front and rear sides may be used with some embodiments for LCD displays where the front side contains the illumination devices and the rear side contains a thermally conductive surface for dissipating the heat from the illumination devices. Ideally, there should be a low level of thermal resistance between the front and rear sides of the backlights.
  • Other embodiments may place the power modules in thermal communication with a plurality of thermally conductive ribs where the ribs are placed in the path of cooling air (sometimes ambient gas).
  • the heat from the power modules is distributed throughout the ribs and removed by the cooling air. It has been discovered that forcing air through the relatively narrow channels defined by the ribs improves the ability to remove heat from the power modules.
  • both the power modules and the display backlight (or image assembly) are in thermal communication with the ribs.
  • a single path of cooling air (sometimes ambient gas) can be used to cool two of the warmest components of a typical electronic display.
  • LED arrays are commonly used as the illumination devices for LCD displays. It has been found that the optical properties of LEDs (and other illumination devices) can vary depending on temperature. Thus, when an LED is exposed to room temperatures, it may output light with a certain luminance, wavelength, and/or color temperature. However, when the same LED is exposed to high temperatures, the luminance, wavelength, color temperature, and other properties can vary.
  • the image assembly (rather than a backlight) is in thermal communication with the ribs.
  • the image assembly may comprise any form of electronic assembly for generating an image, including but not limited to: LCD, light emitting diode (LED), organic light emitting diode (OLED), field emitting displays (FED), light-emitting polymers (LEP), plasma displays, and any other flat/thin panel displays.
  • LCD light emitting diode
  • OLED organic light emitting diode
  • FED field emitting displays
  • LEP light-emitting polymers
  • plasma displays any other flat/thin panel displays.
  • the ribs may provide an isolated chamber from the rest of the display so that ambient air can be ingested and used to cool the ribs. This is beneficial for situations where the display is being used in an outdoor environment and the ingested air may contain contaminates (pollen, dirt, dust, water, smoke, etc.) that would damage the sensitive electronic components of the display.
  • a backlight with front and rear sides may be used where the front side contains the illumination devices and the rear side contains a thermally conductive surface for dissipating the heat from the illumination devices. Ideally, there should be a low level of thermal resistance between the front and rear sides of the backlights.
  • An exemplary embodiment contains a metal core PCB with LEDs on the front side and a metallic surface on the rear side.
  • FIGURE 1 is a perspective view of a typical power module
  • FIGURE 2 is a perspective view of two power modules installed within an isolating structure
  • FIGURE 3 is a perspective view of an embodiment where the cooling air may be used to cool the power modules and a backlight assembly;
  • FIGURE 4 is a perspective view of an embodiment which is similar to that which was shown in Figure 3 with the exception that a heat sink is now being used with the power modules;
  • FIGURE 5 shows a perspective view of an embodiment where a plurality of channels are created between the backlight assembly and the isolating structure
  • FIGURE 7 shows a perspective section view of another embodiment which uses a thermally-conductive plate and thermally-conductive ribs
  • FIGURE 8 shows a perspective section view of another embodiment where the ribs are used to distribute heat from and cool a backlight assembly
  • FIGURE 9 is a rear perspective view of an embodiment where the rear cover of the display has been removed.
  • FIGURE 1OA is a perspective section view of another embodiment showing the closed loop and open loop channels
  • FIGURE 1OB is a perspective section view similar to the view shown in Figure
  • FIGURE 11 is a perspective section view of another embodiment showing inlet and exhaust apertures for the ambient gas which is used only within the heat exchanger and not within additional optional channels;
  • FIGURE 12 is a perspective section view of an exemplary embodiment where a cross-flow heat exchanger is used to separate high power and low power electrical assemblies.
  • FIGURE 1 shows one embodiment of a typical power module 7 which may be used with some of the embodiment described herein.
  • a printed circuit board 6 may be attached to the power module 7 and may contain a plurality of electronic components 5 which may be necessary to operate and control the power module 7. These electronic components 5 may include, but are no means limited to resistors, capacitors, op-amps, wire harnesses, connectors, and inductors.
  • a baseplate 8 may be attached to the power module 7 and may act as a heat dissipating assembly for the power module 7, such that heat which is generated by the power module 7 is transferred to the baseplate 8. In some embodiments there may be more components used, such as a conductive pad located between the power module and the baseplate 8. Also, as discussed further below, any type of heat sink or fin assembly may be used with the baseplate 8 to further enhance its thermodynamic properties. There may be conductive pads placed between the baseplate 8 and a heat sink assembly also.
  • FIGURE 2 shows two power modules installed within an isolating structure 9 which substantially prevents gaseous and contaminate communication between the two sides of the power module.
  • the baseplates 8 of the power modules are shown on the side of the isolating structure 9 where surrounding-environment cooling air 4 is designed to pass over the baseplates 8.
  • Gaskets 1 1 may be used to provide a gaseous (and/or contaminate) seal between the power modules and the isolating structure 9.
  • Cooling air 4 is sometimes drawn from the environment surrounding the display. This environment may contain harmful contaminates which could damage various electrical components in the display. These harmful contaminates include, but are not limited to: dust, smoke, pollen, water vapor, other harmful particulate and other harmful gases.
  • one of the purposes for the isolating structure 9 is to prevent the surrounding-environment cooling air 4 from contacting some of the sensitive electronic components of the display, including but not limited to the electronic components 5 (shown in Figure 1 ) which are required to operate and control the power modules.
  • surrounding-environment cooling air 4 can be drawn into the display housing and forced over the baseplates 8 (and optional heatsinks and fins) in order to cool the power modules. This can be accomplished without exposing sensitive electronic components to the potentially harmful surrounding-environment cooling air 4.
  • FIGURES 3 and 4 show embodiments where the cooling air 4 may be used to cool the power modules and a backlight assembly 140.
  • a backlight assembly 140 which contains a plurality of illumination devices (ex. LEDs) 141 which are mounted to a printed circuit board (PCB).
  • An exemplary embodiment would use a metal core PCB or any other mounting structure which would have a relatively low level of thermal resistance so that heat can transfer from the illumination devices 141 to the rear surface of the backlight assembly 140 where it can be removed by the cooling air 4.
  • the illumination devices 141 could be LED, halogen, CCFL, or any other device which produces light.
  • a backlight assembly may not even be necessary for some embodiments such as plasma, OLED, LEP, or FED displays.
  • FIGURE 4 shows an embodiment which is similar to that which was shown in Figure 3 with the exception that a heat sink 12 is now in thermal communication with the power modules in order to further facilitate the transfer of heat away from the power modules.
  • a heat sink 12 is now in thermal communication with the power modules in order to further facilitate the transfer of heat away from the power modules.
  • FIGURE 5 shows another embodiment where a plurality of channels 15 are created between the backlight assembly 140 and the isolating structure 9.
  • Channel separators 16 may be used to separate each channel 15 and provide structural rigidity to the overall assembly.
  • the channel separators 16 would preferably be fabricated out of thermally conductive material so that they may also transfer heat between the backlight assembly 140 and the isolating structure 9.
  • a thermally conductive channel separator 16 can also extract heat from either the backlight assembly 140 or the isolating structure 9 and may dissipate the heat into the air moving through the channel 15.
  • some channel separators 16 may contain fins or heat sinks in order to facilitate heat transfer to the air moving through the channel 15.
  • FIGURE 6 shows a view down a single channel 15 which contains the heat sink 12 for a power module which is mounted within the isolating structure 9. Some channels 15 may contain power modules and others may not.
  • a channel fan 17 may be used to draw air through the channel 15 in order to cool the heat sink 12 (if used) and the channel separators 16 (if thermally conductive) as well as the backlight 140 (or LED assembly for an LED display).
  • Each channel 15 may contain one or more channel fans 17.
  • Some channels may not contain a fan at all, but may rely solely on natural convection to allow heat to rise and exit the channel. As will be discussed at length below, the fans can be placed anywhere in the display assembly and may be used to draw air through the channels, push air through the channels, or a combination of both.
  • the channel fans 17 may run continuously.
  • temperature sensing devices may be placed in each channel and used to measure the temperature within the channel or any of the channel components (backlight or display assembly, isolating structure, or channel separators). Based on data received from these temperature sensing devices, the various fans may be selectively engaged depending on which channel requires cooling.
  • fans 17 which draw air through channels 15 which contain power modules may run more often or at higher speeds due to the greater amount of heat coming from the power modules.
  • channels which contain power modules may contain larger fans or a plurality of fans in order to cool the channel.
  • FIGURE 7 shows another embodiment which uses a thermally-conductive plate 10 and ribs 18.
  • the baseplate 8 of the power module would be in thermal communication with the thermally-conductive plate 10.
  • a baseplate 8 may not be used and instead, the power module 7 would be in direct thermal communication with the thermally conductive plate 10. Due to the thermally-conductive nature of the plate 10 and ribs 18 and the thermal communication between them, heat which is produced by the power modules would be distributed throughout the plate 10 and ribs 18.
  • a path of cooling air 20 ambient gas
  • a natural convection process could also be used to allow the heat to escape the plate 10 and ribs 18.
  • a plurality of mounting posts may be used to mount electronic assemblies such as PCBs, hard drives, timing and control boards, inductors, and even the power modules if desired.
  • the mounting posts may also be thermally conductive so that the heat which is generated by these electronic assemblies can also be transferred to the plate 10 and the ribs 18 and removed by the cooling air 20.
  • the plate 10 would provide a gaseous and contaminate barrier between the side containing the ribs 18 (and cooling air 20) and the side containing the mounting posts, power modules, and any other electronic assemblies. If the plate 10 provides an adequate barrier, ambient air may be ingested as cooling air 20 and the risk of contaminates entering the side of the plate 10 containing the sensitive electronic components may be reduced or eliminated.
  • An inlet aperture 25 may be used to accept the cooling air 20 and direct it along the ribs 18.
  • the ribs 18 shown in this embodiment contain a hollow rectangular cross- section, but this is not required.
  • FIGURE 8 shows another embodiment where the ribs 18 are used to distribute heat from and cool a backlight assembly.
  • the backlight assembly in this embodiment includes a plurality of illumination devices 32 which are mounted on a thermally conductive substrate 30.
  • the illumination devices 32 would be LEDs and the thermally conductive substrate 30 would be a PCB and more preferably a metal core PCB.
  • the thermally conductive substrate 30 On the surface of the thermally conductive substrate 30 which faces the ribs 18 there may be a thermally conductive surface 35.
  • the thermally conductive surface 35 would be metallic and more preferably aluminum. It is preferred that the ribs 18 are in thermal communication with the rear surface 35 and that the rear surface 35 is in thermal communication with the thermally conductive substrate 30.
  • the thermally conductive substrate 30 may comprise traditional PCB materials rather than a metal core PCB or any highly thermally conductive materials. It is most preferable that there is a low level of thermal resistance between the illumination devices 32 and the ribs 18.
  • Cooling air 20 may again be forced along the ribs 18 in order to remove heat from the backlight assembly.
  • An image assembly (such as an OLED display which may not utilize a backlight) could also be used in place of the backlight assembly in order to cool the image assembly.
  • many illumination devices especially LEDs and OLEDs
  • these hot spots can result in irregularities in the resulting image which might be visible to the end user.
  • the heat which may be generated by the backlight assembly can be distributed throughout the various ribs and thermally-conductive surfaces to remove hot spots and cool the backlight.
  • the ribs 18 may be used to cool both the backlight assembly and the power modules. In a further exemplary embodiment, the ribs 18 can also be used to cool any additional electronic assemblies by placing them in thermal communication with the thermally-conductive plate 10.
  • the thermally-conductive plate 10 the thermally-conductive plate 10.
  • a single path of cooling air can then be used to cool the interior of the display while the various hot spots can distribute heat throughout the ribs and other thermally conductive surfaces to provide the most efficient cooling. This can be accomplished without having to expose sensitive electrical components to the contaminates and/or particulate of ambient gas.
  • FIGURE 9 shows the rear of an exemplary electronic display 100, where the rear cover for the display housing has been removed in order to show the internal components.
  • fan assemblies 102 and 103 for a closed loop of circulating gas may be placed along two opposing edges of a heat exchanger 101.
  • fan assembly 102 is the inlet for the heat exchanger and fan assembly 103 is the exit for the heat exchanger 101.
  • These assemblies can optionally be reversed however, where fan assembly 103 is the inlet and fan assembly 102 is the exit. Further, both assemblies 102 and 103 are not required.
  • Some embodiments may use only one fan assembly for the closed loop of circulating gas.
  • Fan assemblies 104 and 105 for an open loop of ambient gas may be placed along two opposing edges of the display housing. Again, both assemblies 104 and 105 are not required as some embodiments may use only one assembly and may use the open loop fan assemblies in a push or pull design.
  • the circulating gas which is being forced by the closed loop fan assemblies is primarily circulating around the display.
  • the circulating gas travels in a loop where it contacts the front surface of the image assembly (see Figures 10A-10B) and transfers heat from the image assembly to the circulating gas.
  • the circulating gas is then preferably directed (or forced, pulled, etc.) into the heat exchanger 101 in order to transfer heat from the circulating gas to the ambient gas.
  • the circulating gas exits the heat exchanger 101 and may return to the front surface of the image assembly.
  • the circulating gas may also pass over several electronic components 1 10 in order to extract heat from these devices as well.
  • the electronic components 1 10 may be any components or assemblies used to operate the display including, but not limited to: transformers, circuit boards, resistors, capacitors, batteries, power modules, motors, inductors, illumination devices, wiring and wiring harnesses, lights, thermoelectric devices, and switches.
  • the electrical components 1 10 may also include heaters, when the display assembly might be used in cold-weather environments.
  • ambient gas is ingested into the display housing by the open loop fan assembly 104 and/or 105.
  • the ambient gas may simply be ambient air which is surrounding the display 100.
  • the ambient gas may be air conditioned prior to being drawn into the display by one or more air conditioning assemblies (not shown).
  • the ambient gas Once the ambient gas is ingested into the display, it may be directed (or forced) through the heat exchanger 101 and optionally also across the rear surface of the backlight assembly or image assembly (see Figures 10A-10B) or though ribs/channels as shown above or across power modules as shown above.
  • the heat exchanger 101 By using the heat exchanger 101 , heat is transferred from the circulating gas to the ambient gas. The heated ambient gas is then expelled out of the display housing. [0045] Although not required, it is preferable that the circulating gas and ambient gas do not mix.
  • the heat exchanger 101 would be a cross-flow heat exchanger. However, many types of heat exchangers are known and can be used with any of the embodiments herein.
  • the heat exchanger 101 may be a cross-flow, parallel flow, or counter-flow (tube-within-a-tube or otherwise) heat exchanger. In an exemplary embodiment, the heat exchanger 101 would be a cross-flow and would be comprised of a plurality of stacked layers of thin plates.
  • the plates may have a corrugated or honeycomb design, where a plurality of channels or pathways travel down the plate length-wise.
  • the plates may be stacked such that the directions of the pathways are alternated with each adjacent plate, so that each plate's pathways are substantially perpendicular to the pathways of the adjacent plates.
  • gas may enter the heat exchanger only through plates whose channels or pathways travel parallel to the path of the gas. Because the plates are alternated, the closed loop and ambient gases may travel in plates which are adjacent to one another and heat may be transferred between the two gases without mixing the gases themselves (if the heat exchanger is adequately sealed, which is preferable but not required).
  • an open gap may be placed in between pairs of channelized or honeycomb plates.
  • the open gap may travel in a direction which is perpendicular to the channels of the plates.
  • This open gap may be created by running two strips of material or tape (esp. very high bond (VHB) tape) between two opposite edges of the plates in a direction that is perpendicular to the direction of the channels in the adjacent plates.
  • VHB very high bond
  • gas may travel through the open gap (parallel to the strips or tape) but would not pass through the open gap in a direction which is perpendicular to the strips or tape (parallel to the channels of the adjacent plates).
  • Other types of cross-flow heat exchangers could include a plurality of tubes which contain the first gas and travel perpendicular to the path of the second gas.
  • An exemplary heat exchanger may have plates where the sidewalls are relatively thin so that heat can easily be exchanged between the two paths of gas.
  • a plurality of materials can be used to create the heat exchanger.
  • the material used should be corrosion resistant, rot resistant, light weight, and inexpensive.
  • Metals are typically used for heat exchangers because of their high thermal conductivity.
  • plastics and composites can also satisfy the thermal conditions for electronic displays.
  • An exemplary embodiment would utilize polypropylene as the material for constructing the plates for the heat exchanger.
  • an exemplary heat exchanger would be made of plastic and would thus produce a display assembly that is thin and lightweight.
  • corrugated or honeycomb plastic may be used for each plate layer.
  • both inlet and exit fan assemblies are not required for the embodiments.
  • only a single fan assembly may be used for each loop.
  • only an inlet fan assembly may be used with the closed loop and only an exhaust fan assembly may be used with the open loop.
  • one of the loops may have both inlet and exit fan assemblies while the other loop only has either an inlet or exit assembly.
  • the gas used in both loops can be any number of gaseous matters.
  • air may be used as the gas for both loops.
  • the gas which travels through the closed loop should be substantially clear, so that when it passes in front of the image assembly it will not affect the appearance of the image to a viewer.
  • the gas which travels through the closed loop should also be substantially free of contaminates and/or particulate (ex. dust, dirt, pollen, water vapor, smoke, etc.) in order to prevent an adverse effect on the image quality and damage to the internal electronic components. It may also be preferable to keep the gas within the open loop from having contaminates.
  • An optional filter may be used to ensure that the air (either in the closed or open loop) stays free of contaminates.
  • the open loop may be designed so that contaminates could possibly be present within the ambient gas but this will not harm the display.
  • the heat exchanger (and the optional path behind the image assembly or backlight or through the ribs) is properly sealed so that any contaminates in the ambient gas would not enter sensitive portions of the display.
  • ingesting ambient air for the ambient gas even if the ambient air contains contaminates, will not harm the display. This can be particularly beneficial when the display is used in outdoor environments or indoor environments where contaminates are present in the ambient air.
  • FIGURE 1OA shows a cross-section of another embodiment of a display 200.
  • the rear cover 250 and side covers 251 and 252 are shown to illustrate one method for sealing the overall display 200.
  • the image assembly 220 is shown near the front of the display 200.
  • the image assembly 220 may comprise any form of electronic assembly for generating an image, including but not limited to: LCD, light emitting diode (LED), organic light emitting diode (OLED), field emitting displays (FED), light-emitting polymers (LEP), plasma displays, and any other flat/thin panel displays.
  • the front display surface 221 is placed in front of the image assembly 220, defining a channel 290 through which the circulating gas may flow.
  • the front display surface 221 may be any transparent material (glass, plastic, or composite) and may comprise several layers for polarizing light, reducing glare or reflections, and protecting the internal display components.
  • the front display surface 221 would comprise two panes of glass which are laminated together with optical adhesive (preferably index-matching).
  • a polarizing layer may be attached to one of the panes of glass in order to reduce the internal reflections and solar loading on the image assembly 220. It is most preferable that the polarizing layer be attached to the inner surface of the front display surface 221 (the one facing the closed loop channel 290) and also contain an anti-reflective (AR) coating.
  • AR anti-reflective
  • the image assembly 220 may be an LCD stack with a backlight assembly 222.
  • Some backlights may use cold cathode fluorescent lamps (CCFLs) to produce the illumination necessary for generating an image.
  • the backlight assembly 222 would comprise a printed circuit board (PCB) with a plurality of LEDs (light emitting diodes) on the front surface.
  • PCB printed circuit board
  • LEDs light emitting diodes
  • an exemplary embodiment would have a low level of thermal resistance between the front surface of the backlight assembly 222 and the rear surface 223 of the backlight.
  • a metallic PCB may be used for this purpose.
  • the rear surface 223 of the backlight may contain a thermally conductive material, such as a metal.
  • Aluminum may be an exemplary material for the rear surface 223.
  • a second surface (or plate) 224 may be placed in close proximity behind the rear surface 223 of the backlight assembly 222.
  • the space between the rear surface 223 of the backlight and the second surface 224 may define an additional optional open loop channel 225 through which ambient gas may travel in order to cool the backlight assembly 222.
  • This open loop channel 225 may be similar to the channel 15 shown above, except open loop channel 225 may be narrower.
  • FIGURE 1OB shows the same cross section from Figure 1 OA with the rear cover 250 and side covers 251 and 252 removed and the closed and open loop air flows shown for explanatory purposes.
  • the closed loop fan assembly 202 is used to propel the circulating gas 210 around the closed loop.
  • a first open loop fan assembly 203 may be used to draw ambient gas 21 1 through the heat exchanger 201.
  • a second open loop fan assembly 204 may be used to draw ambient gas 212 through the optional channel 225 for cooling the backlight assembly 222.
  • the optional second open loop fan assembly 204 can also be used to exhaust ambient gas which has traveled through the heat exchanger 201 and through the channel 225. If a second open loop fan assembly 204 is not used, the first open loop fan assembly 203 may be used to exhaust the ambient gas 21 1 that has traveled through the heat exchanger 201.
  • the ambient gas does not mix with the circulating gas. It may be important for the image quality that the circulating gas remains free of particulate and contaminates as this gas travels in front of the image assembly 220. Since gas for the open loop may contain various contaminates, a preferable embodiment should be adequately sealed to prevent the gas from the two loops from mixing. This is not necessary however, as filters (either removable or permanent) may be used to minimize the effect of particulate for both the open and closed loops.
  • FIGURE 11 is a perspective section view of another embodiment of a display assembly 600 showing inlet 60 and exhaust 65 apertures for the ambient gas 20.
  • the inlet aperture 60 may contain a screen or filter (removable or permanent) to remove any particulate (although this may not be necessary).
  • One or more fans 50 may be used to draw the ambient gas 20 into the inlet aperture 60 and through the heat exchanger 201.
  • the ambient gas 20 is only drawn through the heat exchanger 201 and not through any additional optional channels or ribs.
  • This embodiment may be used when the display assembly 80 (or backlight assembly) does not require the additional cooling of an additional channel.
  • this embodiment 600 may be used when an OLED is used as the image assembly 80.
  • this embodiment 600 may be used when the LCD backlight is not generating large amounts of heat because it is not required to be extremely bright (perhaps because it is not used in direct sunlight). Still further, this embodiment may be used when the ambient gas 20 contains particulate or contaminates which may damage the display. In these situations, it may be desirable to limit the exposure of the display to the ambient gas 20. Thus, in these situations it may be desirable to only ingest ambient gas 20 into the heat exchanger 201 and not through any additional cooling channels. [0056] In some embodiments, the ambient gas 20 may be air conditioned (or otherwise cooled) before it is directed into the heat exchanger 201. A front display surface 221 may be used to create an anterior (front) wall of the channel 290 and/or protect the image assembly 80 from damage.
  • An exemplary front display surface 221 may be glass. Another embodiment for the front display surface 221 may be two panes of glass which are laminated together using optical adhesive. Solar loading (radiative heat transfer from the sun through the front display surface 221 may result in a heat buildup on the image assembly 80 (ex. OLED or LCD assembly). This heat may be transferred to the circulating gas, where this heat may then be transferred to the ambient gas 20 and expelled from the display.
  • the image assembly could be any one of the following: LCD, plasma display assembly, OLED, light emitting polymer (LEP) assembly, organic electro luminescence (OEL) assembly, or LED display assembly.
  • FIGURE 12 shows an exemplary embodiment where a circulating gas 400 is forced between a front display surface 221 and an image assembly 80 and then through a heat exchanger 201 in order to remove at least a portion of the heat absorbed from the image assembly 80 and front display surface 221.
  • the circulating gas 400 may be propelled by a closed loop fan assembly 410.
  • the heat exchanger 201 may accept circulating gas 400 in one direction while accepting ambient gas 310 in a substantially perpendicular direction such that heat may transfer between the two gases.
  • an optional additional flow of ambient gas 300 is accepted through the inlet aperture 350 and directed along channel 225 in order to cool the rear portion of the image assembly 80 (possibly a backlight).
  • This embodiment uses a set of ribs 18, similar to the designs shown above in Figures 7 and 8.
  • This embodiment also uses a thermally-conductive plate 10, similar to the one shown in Figure 7.
  • the anterior (front) surface 500 of the channel 225 be thermally conductive and preferably in thermal communication with at least a portion (preferably the rear portion) of the image assembly 80.
  • Inlet aperture 350 may accept both ambient gas 310 and 300, or there may be separate inlet apertures for each flow of gas 310 and 300.
  • the circulating gas 400 also passes over electronic assemblies in order to accept heat from these electronic assemblies. In this exemplary embodiment, the electronic assemblies have been separated by the heat exchanger 201 into two groups.
  • the first group of electronic assemblies 900 may be considered the high power assemblies and may include but are not limited to: power modules, inductors, transformers, and other power- related devices.
  • the second group of electronic assemblies 910 may be considered the low power assemblies and may include but are not limited to: timing and control boards, hard drives and other storage devices, video cards, software drivers, microprocessors, and other control devices. It is known to those skilled in the art that some high power electronic assemblies can cause electrical interference with other electronic assemblies that may be sensitive to electrical interference. Thus, in the exemplary embodiment shown, the heat exchanger 201 is used to separate the lower power electronic assemblies 910 from the high power electronic assemblies 900 to ensure a minimum amount of interference between the two. Further, some high power electronic assemblies 900 are known to also generate heat.
  • This heat may be transferred to the circulating gas 400 prior to introducing this gas into the heat exchanger 201.
  • ambient air can be ingested as the ambient gas 310 and there is little risk of damage to the electrical assemblies 910 and 900 because the ambient gas 310 would preferably never contact these electrical assemblies.
  • the electrical assemblies 910 and 900 will remain cool (as well as clean and dry) because of the cross-flow from the circulating gas 400.
  • the cooling system described herein may run continuously. However, if desired, temperature sensing devices (not shown) may be incorporated within the electronic display to detect when temperatures have reached a predetermined threshold value. In such a case, the various cooling fans may be selectively engaged when the temperature in the display reaches a predetermined value.
  • Predetermined thresholds may be selected and the system may be configured to advantageously keep the display within an acceptable temperature range.
  • Typical thermostat assemblies can be used to accomplish this task.
  • Thermocouples may be used as the temperature sensing devices.
  • the speed of the various fan assemblies can also be varied depending on the temperature within the display.
  • embodiments may be used in conjunction with any of the following: LCD (all types), light emitting diode (LED), organic light emitting diode (OLED), field emitting display (FED), light emitting polymer (LEP), organic electro luminescence (OEL), plasma displays, and any other type of thin/flat panel display.
  • LCD all types
  • LED light emitting diode
  • OLED organic light emitting diode
  • FED field emitting display
  • LEP light emitting polymer
  • OEL organic electro luminescence
  • plasma displays any other type of thin/flat panel display.
  • embodiments may be used with displays of other types including those not yet discovered.
  • the system may be well suited for use with large LED backlit, high definition (108Oi or 108Op or greater) liquid crystal displays (LCD). While the embodiments described herein are well suited for outdoor environments, they may also be appropriate for indoor applications (e.g., factory/industrial environments, spas, locker rooms, kitchens, bathrooms) where thermal stability of the display may be at risk
  • cooling channels that are shown in the figures may be shown in a horizontal or vertical arrangement but it is clearly contemplated that this can be reversed or changed depending on the particular embodiment.
  • the closed loop may run horizontally or vertically and in a clockwise or counter-clockwise direction.
  • the open loop may also be horizontal or vertical and can run left to right, right to left, and top to bottom, or bottom to top.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Liquid Crystal (AREA)

Abstract

La présente invention concerne un ensemble de refroidissement pour un ensemble d'images électronique et un ensemble d'affichage contenant un tel ensemble. Certains modes de réalisation utilisent du gaz ambiant pour refroidir des modules de puissance et/ou un ensemble d'image (des fois un rétroéclairage). D'autres modes de réalisation utilisent une boucle fermée de circulation de gaz qui traversent la surface avant d'un ensemble d'image et un échangeur thermique. Une boucle ouverte traverse l'échangeur thermique et extrait la chaleur depuis le gaz de circulation. De l'air ambiant peut être utilisé comme gaz ambiant. Un canal supplémentaire facultatif peut être utilisé pour refroidir la partie arrière de l'ensemble d'image ou le rétroéclairage avec du gaz ambiant. Certains modes de réalisation utilisent également des plaques et des nervures conductrices de chaleur pour distribuer la chaleur et éviter des points chauds dans l'écran d'affichage. L'ensemble de refroidissement peut être utilisé avec n'importe quel type d'ensemble électronique pour la production d'une image.
EP09837994.4A 2008-12-18 2009-12-18 Système de contrôle thermique pour un panneau d'affichage électronique Withdrawn EP2370987A4 (fr)

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US13873608P 2008-12-18 2008-12-18
US15287909P 2009-02-16 2009-02-16
US25229509P 2009-10-16 2009-10-16
PCT/US2009/068770 WO2010080624A2 (fr) 2008-12-18 2009-12-18 Système de contrôle thermique pour un panneau d'affichage électronique

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CN (1) CN102326224A (fr)
AU (1) AU2009335644A1 (fr)
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Cited By (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9797588B2 (en) 2008-03-03 2017-10-24 Manufacturing Resources International, Inc. Expanded heat sink for electronic displays
US9801305B2 (en) 2008-03-03 2017-10-24 Manufacturing Resources International, Inc. Heat exchanger for an electronic display
US9894800B2 (en) 2008-03-03 2018-02-13 Manufacturing Resources International, Inc. Constricted convection cooling system for an electronic display
US10088702B2 (en) 2013-07-08 2018-10-02 Manufacturing Resources International, Inc. Figure eight closed loop cooling system for electronic display
US10194564B2 (en) 2014-04-30 2019-01-29 Manufacturing Resources International, Inc. Back to back electronic display assembly
US10212845B2 (en) 2014-03-11 2019-02-19 Manufacturing Resources International, Inc. Hybrid rear cover and mounting bracket for electronic display
US10278311B2 (en) 2015-02-17 2019-04-30 Manufacturing Resources International, Inc. Perimeter ventilation system
US10314212B2 (en) 2008-12-18 2019-06-04 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
US10398066B2 (en) 2017-04-27 2019-08-27 Manufacturing Resources International, Inc. System and method for preventing display bowing
US10485113B2 (en) 2017-04-27 2019-11-19 Manufacturing Resources International, Inc. Field serviceable and replaceable display
US10524397B2 (en) 2013-03-15 2019-12-31 Manufacturing Resources International, Inc. Heat exchanger assembly for an electronic display
US10524384B2 (en) 2013-03-15 2019-12-31 Manufacturing Resources International, Inc. Cooling assembly for an electronic display
US10559965B2 (en) 2017-09-21 2020-02-11 Manufacturing Resources International, Inc. Display assembly having multiple charging ports
US10660245B2 (en) 2012-10-16 2020-05-19 Manufacturing Resources International, Inc. Back pan cooling assembly for electronic display
US10736245B2 (en) 2009-11-13 2020-08-04 Manufacturing Resources International, Inc. Electronic display assembly with combined conductive and convective cooling
US10795413B1 (en) 2019-04-03 2020-10-06 Manufacturing Resources International, Inc. Electronic display assembly with a channel for ambient air in an access panel
US10820445B2 (en) 2016-03-04 2020-10-27 Manufacturing Resources International, Inc. Cooling system for double sided display assembly
US10827656B2 (en) 2008-12-18 2020-11-03 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
US11019735B2 (en) 2018-07-30 2021-05-25 Manufacturing Resources International, Inc. Housing assembly for an integrated display unit
US11096317B2 (en) 2019-02-26 2021-08-17 Manufacturing Resources International, Inc. Display assembly with loopback cooling
US11470749B2 (en) 2020-10-23 2022-10-11 Manufacturing Resources International, Inc. Forced air cooling for display assemblies using centrifugal fans
US11477923B2 (en) 2020-10-02 2022-10-18 Manufacturing Resources International, Inc. Field customizable airflow system for a communications box
US11744054B2 (en) 2021-08-23 2023-08-29 Manufacturing Resources International, Inc. Fan unit for providing improved airflow within display assemblies
US11762231B2 (en) 2021-08-23 2023-09-19 Manufacturing Resources International, Inc. Display assemblies inducing turbulent flow
US11778757B2 (en) 2020-10-23 2023-10-03 Manufacturing Resources International, Inc. Display assemblies incorporating electric vehicle charging equipment
US11919393B2 (en) 2021-08-23 2024-03-05 Manufacturing Resources International, Inc. Display assemblies inducing relatively turbulent flow and integrating electric vehicle charging equipment
US11966263B2 (en) 2021-07-28 2024-04-23 Manufacturing Resources International, Inc. Display assemblies for providing compressive forces at electronic display layers
US11968813B2 (en) 2021-11-23 2024-04-23 Manufacturing Resources International, Inc. Display assembly with divided interior space
US12010813B2 (en) 2022-07-22 2024-06-11 Manufacturing Resources International, Inc. Self-contained electronic display assembly, mounting structure and methods for the same
US12035486B1 (en) 2022-07-25 2024-07-09 Manufacturing Resources International, Inc. Electronic display assembly with fabric panel communications box
US12052850B2 (en) 2022-08-26 2024-07-30 Manufacturing Resources International, Inc. Field customizable airflow system for a communications box

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2764487A1 (fr) 2009-06-03 2010-12-09 Manufacturing Resources International, Inc. Retroeclairage a del a gradation dynamique
JP2013537721A (ja) 2010-08-20 2013-10-03 マニュファクチャリング・リソーシズ・インターナショナル・インコーポレーテッド 少ないノイズ放射で電子ディスプレイを熱制御するシステム
WO2014158642A1 (fr) * 2013-03-14 2014-10-02 Manufacturing Resources International, Inc. Ensemble d'affichage à cristaux liquides du type rigide
WO2015003130A1 (fr) 2013-07-03 2015-01-08 Manufacturing Resources International, Inc. Ensemble de rétroéclairage de guide d'air
US10191212B2 (en) 2013-12-02 2019-01-29 Manufacturing Resources International, Inc. Expandable light guide for backlight
US10527276B2 (en) 2014-04-17 2020-01-07 Manufacturing Resources International, Inc. Rod as a lens element for light emitting diodes
US10649273B2 (en) 2014-10-08 2020-05-12 Manufacturing Resources International, Inc. LED assembly for transparent liquid crystal display and static graphic
US10261362B2 (en) 2015-09-01 2019-04-16 Manufacturing Resources International, Inc. Optical sheet tensioner
KR102347941B1 (ko) * 2016-05-20 2022-01-07 엘지전자 주식회사 디스플레이용 냉각기 및 이를 적용한 디스플레이 장치
KR20170131095A (ko) 2016-05-20 2017-11-29 엘지전자 주식회사 디스플레이용 냉각기 및 이를 적용한 디스플레이 장치
RU168792U1 (ru) * 2016-06-02 2017-02-21 Акционерное общество "РТСофт" Универсальная вычислительная платформа с отводом тепла от тепловыделяющих компонентов
KR102236771B1 (ko) 2016-12-02 2021-04-06 삼성전자주식회사 실외 디스플레이장치
CN110573946B (zh) * 2017-04-23 2022-03-04 Lg电子株式会社 显示设备
KR102037323B1 (ko) * 2017-04-23 2019-10-28 엘지전자 주식회사 디스플레이 장치
GB2565997B (en) * 2017-04-28 2019-10-16 Amscreen Group Ltd Crossflow heat-exchangers
KR102193772B1 (ko) * 2017-07-14 2020-12-22 삼성전자주식회사 디스플레이 장치 및 그 제어방법
CN107393423A (zh) * 2017-09-12 2017-11-24 南京宝丽晶电子科技有限公司 一种散热式平板显示屏
KR102052706B1 (ko) * 2017-12-04 2019-12-05 엘지전자 주식회사 디스플레이 냉각장치
TWI693448B (zh) * 2018-07-04 2020-05-11 光遠科技股份有限公司 熱交換裝置及顯示裝置
CN110850619A (zh) * 2019-11-07 2020-02-28 深圳市华星光电半导体显示技术有限公司 显示装置
CN111006362B (zh) * 2019-12-11 2021-07-23 珠海格力电器股份有限公司 空调器
RU199413U1 (ru) * 2020-04-30 2020-08-31 Общество с ограниченной ответственностью «Системы накопления энергии» Стеллаж для размещения аккумуляторной батареи

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5991153A (en) * 1997-10-31 1999-11-23 Lacerta Enterprises, Inc. Heat transfer system and method for electronic displays
EP1408476A1 (fr) * 2002-10-10 2004-04-14 Barco N.V. Arrangements d'écran d'affichage luminescent
GB2402205A (en) * 2003-05-20 2004-12-01 Densitron Technologies Plc A display system cabinet and display system including heat removal means
EP1951020A1 (fr) * 2007-01-26 2008-07-30 ISL media Singapore PTE LTD Boîtier de réception d'appareils électriques ou électroniques
US20080285290A1 (en) * 2007-05-15 2008-11-20 Hitachi, Ltd. Liquid crystal display device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU815980A1 (ru) * 1977-05-20 1981-03-23 Предприятие П/Я В-8872 Оптическа проекционна система
SE505272C2 (sv) * 1994-12-14 1997-07-28 Ericsson Telefon Ab L M Kylsystem för telekommunikationsutrustning
KR20060070176A (ko) * 2004-12-20 2006-06-23 삼성전자주식회사 냉각장치와 이를 포함하는 액정표시장치
JP4227969B2 (ja) * 2005-03-17 2009-02-18 Ｎｅｃディスプレイソリューションズ株式会社 投写型表示装置
KR100949501B1 (ko) * 2005-12-29 2010-03-24 엘지디스플레이 주식회사 냉각 장비 및 그를 이용한 액정표시소자의 제조방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5991153A (en) * 1997-10-31 1999-11-23 Lacerta Enterprises, Inc. Heat transfer system and method for electronic displays
EP1408476A1 (fr) * 2002-10-10 2004-04-14 Barco N.V. Arrangements d'écran d'affichage luminescent
GB2402205A (en) * 2003-05-20 2004-12-01 Densitron Technologies Plc A display system cabinet and display system including heat removal means
EP1951020A1 (fr) * 2007-01-26 2008-07-30 ISL media Singapore PTE LTD Boîtier de réception d'appareils électriques ou électroniques
US20080285290A1 (en) * 2007-05-15 2008-11-20 Hitachi, Ltd. Liquid crystal display device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2010080624A2 *

Cited By (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10506738B2 (en) 2008-03-03 2019-12-10 Manufacturing Resources International, Inc. Constricted convection cooling for an electronic display
US10506740B2 (en) 2008-03-03 2019-12-10 Manufacturing Resources International, Inc. Electronic display with cooling
US9801305B2 (en) 2008-03-03 2017-10-24 Manufacturing Resources International, Inc. Heat exchanger for an electronic display
US11013142B2 (en) 2008-03-03 2021-05-18 Manufacturing Resources International, Inc. Electronic display with cooling
US11596081B2 (en) 2008-03-03 2023-02-28 Manufacturing Resources International, Inc. Electronic display with cooling
US9797588B2 (en) 2008-03-03 2017-10-24 Manufacturing Resources International, Inc. Expanded heat sink for electronic displays
US11540418B2 (en) 2008-03-03 2022-12-27 Manufacturing Resources International, Inc. Electronic display with cooling
US10721836B2 (en) 2008-03-03 2020-07-21 Manufacturing Resources International, Inc. Electronic display with cooling
US9894800B2 (en) 2008-03-03 2018-02-13 Manufacturing Resources International, Inc. Constricted convection cooling system for an electronic display
US10314212B2 (en) 2008-12-18 2019-06-04 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
US10827656B2 (en) 2008-12-18 2020-11-03 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
US11191193B2 (en) 2008-12-18 2021-11-30 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
US10736245B2 (en) 2009-11-13 2020-08-04 Manufacturing Resources International, Inc. Electronic display assembly with combined conductive and convective cooling
US10660245B2 (en) 2012-10-16 2020-05-19 Manufacturing Resources International, Inc. Back pan cooling assembly for electronic display
US10524397B2 (en) 2013-03-15 2019-12-31 Manufacturing Resources International, Inc. Heat exchanger assembly for an electronic display
US10524384B2 (en) 2013-03-15 2019-12-31 Manufacturing Resources International, Inc. Cooling assembly for an electronic display
US10088702B2 (en) 2013-07-08 2018-10-02 Manufacturing Resources International, Inc. Figure eight closed loop cooling system for electronic display
US10359659B2 (en) 2013-07-08 2019-07-23 Manufactruing Resources Internatonal, Inc. Cooling system for electronic display
US10212845B2 (en) 2014-03-11 2019-02-19 Manufacturing Resources International, Inc. Hybrid rear cover and mounting bracket for electronic display
US10973156B2 (en) 2014-04-30 2021-04-06 Manufacturing Resources International, Inc. Dual electronic display assembly
US10194564B2 (en) 2014-04-30 2019-01-29 Manufacturing Resources International, Inc. Back to back electronic display assembly
US10687446B2 (en) 2014-04-30 2020-06-16 Manufacturing Resources International, Inc. Back to back electronic display assembly
US10278311B2 (en) 2015-02-17 2019-04-30 Manufacturing Resources International, Inc. Perimeter ventilation system
US10548247B2 (en) 2015-02-17 2020-01-28 Manufacturing Resources International, Inc. Perimeter ventilation system
US10820445B2 (en) 2016-03-04 2020-10-27 Manufacturing Resources International, Inc. Cooling system for double sided display assembly
US11744036B2 (en) 2016-03-04 2023-08-29 Manufacturing Resources International, Inc. Cooling system for double sided display assembly
US10499516B2 (en) 2017-04-27 2019-12-03 Manufacturing Resources International, Inc. Field serviceable and replaceable assembly
US11934054B2 (en) 2017-04-27 2024-03-19 Manufacturing Resources International, Inc. Field serviceable and replaceable assembly
US10925174B2 (en) 2017-04-27 2021-02-16 Manufacturing Resources International, Inc. Field serviceable and replaceable assembly
US10757844B2 (en) 2017-04-27 2020-08-25 Manufacturing Resources International, Inc. System and method for reducing or combating display bowing
US10485113B2 (en) 2017-04-27 2019-11-19 Manufacturing Resources International, Inc. Field serviceable and replaceable display
US10624218B2 (en) 2017-04-27 2020-04-14 Manufacturing Resources International, Inc. Field serviceable and replaceable display assembly
US11032923B2 (en) 2017-04-27 2021-06-08 Manufacturing Resources International, Inc. Field serviceable display assembly
US10716224B2 (en) 2017-04-27 2020-07-14 Manufacturing Resources International, Inc. Field serviceable and replaceable assembly
US10398066B2 (en) 2017-04-27 2019-08-27 Manufacturing Resources International, Inc. System and method for preventing display bowing
US11822171B2 (en) 2017-04-27 2023-11-21 Manufacturing Resources International, Inc. Field serviceable and replaceable assembly
US10559965B2 (en) 2017-09-21 2020-02-11 Manufacturing Resources International, Inc. Display assembly having multiple charging ports
US11889636B2 (en) 2018-07-30 2024-01-30 Manufacturing Resources International, Inc. Housing assembly for an integrated display unit
US12004311B2 (en) 2018-07-30 2024-06-04 Manufacturing Resources International, Inc. Housing assembly for an integrated display unit
US11019735B2 (en) 2018-07-30 2021-05-25 Manufacturing Resources International, Inc. Housing assembly for an integrated display unit
US12010824B2 (en) 2019-02-26 2024-06-11 Manufacturing Resources International, Inc. Display assembly with loopback cooling
US11617287B2 (en) 2019-02-26 2023-03-28 Manufacturing Resources International, Inc. Display assembly with loopback cooling
US11096317B2 (en) 2019-02-26 2021-08-17 Manufacturing Resources International, Inc. Display assembly with loopback cooling
US11507141B2 (en) 2019-04-03 2022-11-22 Manufacturing Resources International, Inc. Electronic display assembly with a channel for ambient air in an access panel
US11989059B2 (en) 2019-04-03 2024-05-21 Manufacturing Resources International, Inc. Electronic display assembly with a channel for ambient air in an access panel
US10795413B1 (en) 2019-04-03 2020-10-06 Manufacturing Resources International, Inc. Electronic display assembly with a channel for ambient air in an access panel
US11477923B2 (en) 2020-10-02 2022-10-18 Manufacturing Resources International, Inc. Field customizable airflow system for a communications box
US11470749B2 (en) 2020-10-23 2022-10-11 Manufacturing Resources International, Inc. Forced air cooling for display assemblies using centrifugal fans
US11778757B2 (en) 2020-10-23 2023-10-03 Manufacturing Resources International, Inc. Display assemblies incorporating electric vehicle charging equipment
US12004310B2 (en) 2020-10-23 2024-06-04 Manufacturing Resources International, Inc. Display assemblies incorporating electric vehicle charging equipment
US12022624B2 (en) 2020-10-23 2024-06-25 Manufacturing Resources International, Inc. Display assemblies incorporating electric vehicle charging equipment
US11966263B2 (en) 2021-07-28 2024-04-23 Manufacturing Resources International, Inc. Display assemblies for providing compressive forces at electronic display layers
US11919393B2 (en) 2021-08-23 2024-03-05 Manufacturing Resources International, Inc. Display assemblies inducing relatively turbulent flow and integrating electric vehicle charging equipment
US11762231B2 (en) 2021-08-23 2023-09-19 Manufacturing Resources International, Inc. Display assemblies inducing turbulent flow
US11744054B2 (en) 2021-08-23 2023-08-29 Manufacturing Resources International, Inc. Fan unit for providing improved airflow within display assemblies
US11968813B2 (en) 2021-11-23 2024-04-23 Manufacturing Resources International, Inc. Display assembly with divided interior space
US12010813B2 (en) 2022-07-22 2024-06-11 Manufacturing Resources International, Inc. Self-contained electronic display assembly, mounting structure and methods for the same
US12035486B1 (en) 2022-07-25 2024-07-09 Manufacturing Resources International, Inc. Electronic display assembly with fabric panel communications box
US12052850B2 (en) 2022-08-26 2024-07-30 Manufacturing Resources International, Inc. Field customizable airflow system for a communications box

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CA2747724A1 (fr) 2010-07-15
CN102326224A (zh) 2012-01-18
KR20110099134A (ko) 2011-09-06
WO2010080624A3 (fr) 2010-09-23
AU2009335644A1 (en) 2011-07-14
RU2513043C2 (ru) 2014-04-20
EP2370987A4 (fr) 2014-04-23
RU2011129607A (ru) 2013-01-27
WO2010080624A2 (fr) 2010-07-15
TW201034558A (en) 2010-09-16

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