EP2347970A1 - Assembly with at least one semiconductor module and a transport package - Google Patents

Assembly with at least one semiconductor module and a transport package Download PDF

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Publication number
EP2347970A1
EP2347970A1 EP10192500A EP10192500A EP2347970A1 EP 2347970 A1 EP2347970 A1 EP 2347970A1 EP 10192500 A EP10192500 A EP 10192500A EP 10192500 A EP10192500 A EP 10192500A EP 2347970 A1 EP2347970 A1 EP 2347970A1
Authority
EP
European Patent Office
Prior art keywords
power semiconductor
semiconductor module
arrangement
molded body
plastic molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10192500A
Other languages
German (de)
French (fr)
Other versions
EP2347970B1 (en
Inventor
Stefan Starovecky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Semikron Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG, Semikron Elektronik GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of EP2347970A1 publication Critical patent/EP2347970A1/en
Application granted granted Critical
Publication of EP2347970B1 publication Critical patent/EP2347970B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/325—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil
    • B65D75/327—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet being recessed, and the other being a flat not- rigid sheet, e.g. puncturable or peelable foil and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • B65D75/367—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed and forming several compartments
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D81/00—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents
    • B65D81/02—Containers, packaging elements, or packages, for contents presenting particular transport or storage problems, or adapted to be used for non-packaging purposes after removal of contents specially adapted to protect contents from mechanical damage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2575/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes or webs of flexible sheet material, e.g. in folded wrappers
    • B65D2575/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by association or interconnecting two or more sheets or blanks
    • B65D2575/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D2575/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D2575/3209—Details
    • B65D2575/3218—Details with special means for gaining access to the contents
    • B65D2575/3245—Details with special means for gaining access to the contents by peeling off the non-rigid sheet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D2585/00—Containers, packaging elements or packages specially adapted for particular articles or materials
    • B65D2585/68—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form
    • B65D2585/86—Containers, packaging elements or packages specially adapted for particular articles or materials for machines, engines, or vehicles in assembled or dismantled form for electrical components

Definitions

  • the invention describes an arrangement for mostly au ßer istlichen transport of at least one power semiconductor module.
  • Simple cardboard boxes for example, according to DE 39 09 898 A1
  • a further disadvantage is that such packaging must be opened by way of example for tests under a customs procedure and thus the power semiconductor modules can be touched directly, which may possibly lead to damage due to electrostatic discharge or due to contact with sensitive surfaces, for example silver-coated connection elements.
  • the so-called Skin- packaging as exemplified by the DE 199 28 368 A1 are known, form a starting point of this invention and are a combination of a carton with the plastic film enclosing the goods to be packaged.
  • Such packages are known to have the significant disadvantage that they can not protect sufficiently sensitive parts of the goods to be packaged.
  • the invention has for its object to provide an arrangement with at least one power semiconductor module and a transport packaging, which is particularly robust against occurring during transport mechanical effects, at least in combination with another outer packaging, and in principle the protection against electrostatic discharge as well as a legibility of the label mounted at least one power semiconductor module without opening the transport packaging is accessible.
  • the inventive idea is based on the above-mentioned skin packaging.
  • This is developed into an arrangement with at least one power semiconductor module.
  • this arrangement has at least one power semiconductor module, but preferably a plurality of power semiconductor modules arranged in a one- or two-dimensional matrix and a transport packaging.
  • the power semiconductor module has a base element, preferably a metallic base plate, a housing made of an insulating material, and connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate.
  • a base element preferably a metallic base plate
  • a housing made of an insulating material
  • connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate.
  • the transport packaging of the arrangement according to the invention in turn has a cover layer, a cover film and at least one trough-like molded plastic body per power semiconductor module.
  • the cover layer preferably designed as a composite cardboard which can be dissipated in its entirety, has a planar design and thus forms the basis of the transport packaging.
  • the respective power semiconductor module is in this case arranged to the at least one plastic molded body and partially enclosed by this, wherein the plastic molded body is not completely applied to the power semiconductor module, but is spaced in sections thereof.
  • the plastic molding has at least one stop surface, with which it rests directly on the power semiconductor module. Adjacent thereto, at least one cavity is then provided between the plastics molding and the power semiconductor module.
  • this cavity when it is provided on the bottom element, can protect a heat-conducting paste structure applied there from contact.
  • the at least one cavity can protect connection elements from mechanical contact during transport.
  • this plastic molded body completely covers one side of the power semiconductor module and has a wall which rests against the adjacent sides of the power semiconductor module and covers these adjacent sides only partially.
  • the at least one plastic molded article thus forms a spacer element between the power semiconductor module and the remaining parts of the packaging, whereby these parts of the packaging in the region of the plastic molded article do not rest directly but only indirectly on it.
  • plastic molded body between the power semiconductor module and the cover layer in order to protect, for example, a thermal compound layer, as well as alternatively or additionally a further plastic molded article may be provided on the opposite side of the power semiconductor module to protect local connection elements.
  • a plastic molded body forms a protection of the cover sheet against the connection elements, since they could damage the cover sheet with appropriate design, and thus the protection of the power semiconductor module would be no longer available before contact.
  • an intermediate layer on the first main surface of the cover layer, this recess having in each case one associated power semiconductor module.
  • the covering film largely only with this intermediate layer and only in the region of their recesses, is connected to the cover layer, whereby an easy-to-open transport packaging is formed.
  • cover film and / or the respective plastic molded body consists of a conductive or dissipative plastic with or without metallbedampfter outer surface. It is equally advantageous to form the cover film and / or the respective plastic molding at least in sections, but preferably completely, transparently.
  • a further preferred embodiment results if, in a plurality of power semiconductor modules arranged in a one-dimensional or two-dimensional matrix, they have a distance apart from one another in at least one dimension parallel to the main surface of the cover layer and parallel to a surface normal of the housing which is greater than the width of the housing arranged plastic molding in this dimension.
  • Fig. 1 shows a section through a first embodiment of an arrangement according to the invention.
  • Fig. 2 and 3 shows a section through a second embodiment of an arrangement according to the invention.
  • Fig. 4 shows in three-dimensional representation two arrangements according to the invention similar to those according to Fig. 1, 2 and 3 ,
  • Fig. 1 shows a section of a section along a line AA (see. Fig. 4 ) by a first arrangement (1) according to the invention.
  • Shown here is the cover layer (10) of the transport packaging (2) with its first (100) and second main surface (110).
  • the power semiconductor module (5) to be packaged are arranged in a matrix-like manner at the same distance from each other.
  • the power semiconductor modules (5) to be packaged only one bottom element (40), one housing (50) and one connection element (60) are shown.
  • connection elements (60) lie on the side of the power semiconductor module (5) opposite the cover layer (10).
  • the bottom element (40) of the respective power semiconductor module (5) here has a thermal paste layer (42), as known from the prior art.
  • a thermal paste layer (42) to protect this pasty layer (42) between the power semiconductor module (5) and the cover layer (10) of the transport packaging (2) a molded plastic body (80), whereby the power semiconductor module (5) not directly on the first major surface (100) of the cover layer (10).
  • the plastic molding (80) is formed like a trough and has circumferentially a flat support edge (82). On this support surface (82) are not provided with thermal compound (42) edge region of the bottom element (40) of the power semiconductor module (5). Alternatively, depending on the design of the power semiconductor module (5), also a part of the housing (50) rest on this support surface (82). Between the heat-conducting paste (42) provided with the bottom element (40) and the cover layer (10) of the plastic molded body (80) forms a cavity (86), which serves the mechanical protection of the thermal paste (42).
  • cover film (30) as well as the parts of the plastic molded body (80) adjacent to the power semiconductor module (5) are here and hereafter shown spaced apart from the cover layer (10) as well as at a distance from the power semiconductor modules (5), for clarity purposes only.
  • the cover film (30) is adhesively bonded to the first main surface (100) of the cover layer (10).
  • cover film (30) Due to the design of the cover film (30) and preferably also of the plastic molded body (80) of a conductive or dissipative plastic with or without metallbedampfter outer surface and the cover layer (10) of a conductive or dissipative composite cardboard, a transport packaging (2), which provides sufficient Protection of the power semiconductor modules (5) against electrostatic charging offers. Since the cover film (30) is formed at least in sections, but preferably completely, transparently, it is not necessary for various control purposes to open this protective packaging (2).
  • the inventive arrangement (1) according to Fig. 2 is further configured such that the distance (700) of the power semiconductor modules (5) with arranged plastic molding (80) to each other is greater than the width (500) of a power semiconductor module (5), whereby it is possible a second arrangement (1 ') according to Fig. 4 offset by half the distance to the first arrangement (1) and provided rotated by 180 °, resulting in a compact overall arrangement with high packing density with simultaneous sufficient fixation of the individual power semiconductor modules (5) to each other.
  • the Fig. 2 and 3 shows in each case a section along a line BB (see. Fig. 4 ) by a second arrangement according to the invention (1), wherein the transport packaging (2) is shown again educated.
  • This now has an additional intermediate layer (20), each with a power semiconductor module (5) associated with recesses (230), whereby the associated power semiconductor module (5) in its lower part but does not encompass directly and completely enclosed.
  • the edge (220) of the recess (230) On the entire circumference of the power semiconductor module (5), it is advantageous for the edge (220) of the recess (230) to abut a maximum of 50%, preferably only a maximum of 25%, directly on the associated power semiconductor module (5) and the remaining part of the Edge (220) has a distance of at least 2mm to the power semiconductor module (5) and thus forms an intermediate region (240).
  • cover sheet (30) and the intermediate layer (20) it is basically preferred but not necessarily necessary, in addition to the adhesive bond between the cover sheet (30) and the intermediate layer (20), also between the cover layer (10) and the cover sheet (30) in the intermediate region (240) described above, as well as between the cover layer (10) and the intermediate layer (20) provide adhesive connections.
  • the first-mentioned adhesive bond does not have to be designed as a detachable connection.
  • Fig. 2 shows an arrangement 1 with a power semiconductor module (5) and a transport packaging (2).
  • the cover layer (10) is shown partially separated from the intermediate layer (20).
  • This representation corresponds to the opening of the transport packaging (2) to remove a power semiconductor module (5) from this.
  • the detachable connection between the cover layer (10) and the intermediate layer (20) and / or that between the cover layer (10) and the cover film (30) in the intermediate region (240) is separated.
  • the intermediate layer (20) as well as the cover layer (10) consists of cardboard or cardboard or composite cardboard. It has proved to be particularly advantageous for protection against electrostatic discharge, the intermediate layer (20) and, but preferably only, the cover layer (10) of conductive or conductive composite cardboard. This then has, by way of example, a conductive or dissipative film interlayer.
  • the plastic molded body (80) has a stop surface (82) with the load connection elements (60), and adjacent to each one a cavity (86) for the auxiliary connection elements on. This cavity (86) prevents the respective auxiliary connection elements (62) from damaging the cover film (30) due to their configuration as a plug.
  • this plastic molded body (80) covers the entire connecting elements having side of the power semiconductor module (5).
  • the plastic molded body (80) further has at least two opposite, but preferably on all sides of a wall (84).
  • This wall (84) abuts those sides of the power semiconductor module (5) which adjoin the covered side. It is hereby preferred that these walls (84) only partially cover the respective sides.
  • Typical dimensions of said power semiconductor modules (5) are, without being limited thereto, a length in the range of 3cm to 15cm at a width (500) including plastic moldings (80) and also a height of 1cm to 6cm.
  • the cover layer (10) of the transport packaging (2) has a typical thickness of 0.2 mm to 1 mm
  • the intermediate layer (20) has a thickness of 0.5 to 3 mm
  • the cover film (30) has a thickness of the order of 100 ⁇ m having.
  • the plastic molding (80) preferably has a thickness which is at least a factor of 5 higher than that of the cover film (30).
  • Fig. 3 now shows a further step of removing a power semiconductor module (5) from the transport packaging (2).
  • the intermediate layer (20) was pressed in the direction of the surface normal of its first major surface (200) until the intermediate layer (20) lies approximately on the plane formed by the upper side of the housing (50).
  • the cover film (30) at least partially detached from the housing (50) of the power semiconductor module (5), and then lies exclusively or at least almost exclusively on the walls (84) of the plastic molded body (80) whereby the power semiconductor module (5) can be removed from this plastic molding (80) simply and without the use of tools.
  • Fig. 4 shows three-dimensional representation of two inventive arrangements (1, 1 '), similar to those according to Fig. 1, 2 and 3 , each with a transport packaging (2) and a plurality of power semiconductor modules (5).
  • the housing (50) and a plurality of connecting elements (60, 62) is shown.
  • floor element (40, cf. Fig. 1 ) here a metallic base plate
  • these power semiconductor modules (5) in a two-dimensional matrix on the first main surface (100) of the cover layer (10) of the respective transport packaging (2) are arranged by the bottom element (40, see FIG. Fig. 2 ) directly or as described above indirectly with an interposed plastic molded body (80) comes to lie here.
  • This intermediate layer (20) has a plurality of recesses (230) which are each associated with a power semiconductor module (5).
  • the power semiconductor module (5) is arranged in this recess (230) such that the edge (220) of the recess (230) rests directly on the housing (50) of the power semiconductor module (5) only at a few sections.
  • a gap is provided between the housing (50) of the power semiconductor module (5) and the edge (220) of the recess (230), which forms an intermediate region (240).
  • the transparent cover film (30) and the respective plastic moldings (80) themselves.
  • the transport packaging ( 2), here only shown in the second arrangement (1 ') between the respective power semiconductor components (5) has a perforation (70) in order to simplify the separation of the packaged power semiconductor modules (5).

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)

Abstract

The arrangement (1) comprises a transportation packaging (2) provided with a planar sheet (10), a covering film (30), and a drip-tray type plastic structure (80). The plastic structure partly encloses the power semiconductor module (5). The side of power semiconductor module directly or indirectly rests on the major surface of the planar sheet. The farthest sides of power semiconductor module are covered by the covering film.

Description

Beschreibungdescription

Die Erfindung beschreibt eine Anordnung zum meist au ßerbetrieblichen Transport von mindestens einem Leistungshalbleitermodul. Hierbei ist es bevorzugt eine Mehrzahl von Leistungshalbleitermodulen in einer ein- oder zweidimensionalen Matrix in einer Transportverpackung anzuordnen.The invention describes an arrangement for mostly au ßerbetrieblichen transport of at least one power semiconductor module. In this case, it is preferable to arrange a plurality of power semiconductor modules in a one- or two-dimensional matrix in a transport packaging.

Es ist grundsätzlich eine Vielzahl verschiedener Transportverpackungen für Leistungshalbleitermodule, wie einfache Kartonagen oder Kunststoffblister mit Grundkörper und Deckel bekannt. Aus der Verpackung von Gütern für Endverbraucher sind sog. Skin- Verpackungen bekannt. Einfache Kartonagen beispielsweise gemäß der DE 39 09 898 A1 weisen in der Regel den Nachteil auf, dass sie die Leistungshalbleitermodule nicht ausreichend vor mechanischen Einwirkungen beim Transport schützen. Ein weiterer Nachteil ist, dass derartige Verpackung beispielhaft für Prüfungen im Rahmen eines Zollverfahren geöffnet werden müssen und somit die Leistungshalbleitermodule direkt berührt werden können, was möglicherweise zu Schäden aufgrund elektrostatischer Entladung oder aufgrund der Berührung empfindlicher Oberflächen, beispielhaft silberbeschichteter Anschlusselemente, führen kann.It is basically a variety of different transport packaging for power semiconductor modules, such as simple cardboard boxes or plastic blister with body and lid known. From the packaging of consumer goods so-called skin packaging is known. Simple cardboard boxes, for example, according to DE 39 09 898 A1 As a rule, they have the disadvantage that they do not adequately protect the power semiconductor modules against mechanical influences during transport. A further disadvantage is that such packaging must be opened by way of example for tests under a customs procedure and thus the power semiconductor modules can be touched directly, which may possibly lead to damage due to electrostatic discharge or due to contact with sensitive surfaces, for example silver-coated connection elements.

Die sog. Skin- Verpackungen, wie sie beispielhaft aus der DE 199 28 368 A1 bekannt sind, bilden einen Ausgangspunkt dieser Erfindung und sind eine Kombination eines Kartons mit einer das zu verpackende Gut umschließenden Kunststofffolie. Derartige Verpackungen weisen bekanntermaßen den wesentlichen Nachteil auf, dass sie besonders empfindliche Teile des zu verpackenden Guts nicht ausreichend schützen können.The so-called Skin- packaging, as exemplified by the DE 199 28 368 A1 are known, form a starting point of this invention and are a combination of a carton with the plastic film enclosing the goods to be packaged. Such packages are known to have the significant disadvantage that they can not protect sufficiently sensitive parts of the goods to be packaged.

Der Erfindung liegt die Aufgabe zugrunde eine Anordnung mit mindestens einem Leistungshalbleitermodul und einer Transportverpackung zu schaffen, wobei diese zumindest in Kombination mit einer weiteren Umverpackung besonders robust gegen beim Transport auftretende mechanische Einwirkungen ist, sowie grundsätzlich dem Schutz vor elektrostatischer Entladung wie auch einer Lesbarkeit von auf dem mindestens einen Leistungshalbleitermodul angebrachter Kennzeichnung ohne öffnen der Transportverpackung zugänglich ist.The invention has for its object to provide an arrangement with at least one power semiconductor module and a transport packaging, which is particularly robust against occurring during transport mechanical effects, at least in combination with another outer packaging, and in principle the protection against electrostatic discharge as well as a legibility of the label mounted at least one power semiconductor module without opening the transport packaging is accessible.

Die Aufgabe wird erfindungsgemäß gelöst, durch eine Anordnung mit den Merkmalen des Anspruchs 1. Bevorzugte Ausführungsformen sind in den abhängigen Ansprüchen beschrieben.The object is achieved by an arrangement with the features of claim 1. Preferred embodiments are described in the dependent claims.

Der erfinderische Gedanke geht aus von der oben genannten Skin- Verpackung. Diese wird zu einer Anordnung mit mindestens einem Leistungshalbleitermodul weitergebildet. Hierbei weist diese Anordnung mindestens ein Leistungshalbleitermodul, vorzugsweise aber eine Mehrzahl von, in einer ein- oder zweidimensionalen Matrix angeordneten, Leistungshalbleitermodulen und eine Transportverpackung auf.The inventive idea is based on the above-mentioned skin packaging. This is developed into an arrangement with at least one power semiconductor module. In this case, this arrangement has at least one power semiconductor module, but preferably a plurality of power semiconductor modules arranged in a one- or two-dimensional matrix and a transport packaging.

Das Leistungshalbleitermodul weist in seiner allgemeinen Ausbildung ein Bodenelement, vorzugsweise eine metallische Grundplatte, ein Gehäuse aus einem Isolierstoff und Anschlusselemente zur externen Kontaktierung der intern isoliert zur Bodenplatte angeordneten Leistungshalbleiterbauelemente auf. Wobei hier unter dem Begriff Leistungshalbleitermodul zu diesen elektrisch isoliert gegen das Bodenelement aufgebauten Leistungshalbleitermodule, auch Scheibenzellen verstanden werden sollen, wie sie seit langem Stand der Technik sind und zwei flächige Anschlusselement und einen dazwischen angeordneten loslierstoffkörper aus Keramik oder Kunststoff aufweisen. Die Transportverpackung der erfindungsgemäßen Anordnung weist ihrerseits eine Decklage eine Deckfolie und mindestens einen wannenartigen Kunststoffformkörper pro Leistungshalbleitermodul auf. Die, vorzugsweise als ein in seiner Gesamtheit ableitfähiger Verbundkarton ausgebildet, Decklage ist flächig ausgestaltet und bildet somit die Basis der Transportverpackung.In its general construction, the power semiconductor module has a base element, preferably a metallic base plate, a housing made of an insulating material, and connecting elements for external contacting of the power semiconductor components which are internally insulated from the base plate. Whereby the term power semiconductor module to this electrically insulated against the bottom element constructed power semiconductor modules, disc cells are to be understood, as they are state of the art and have two surface connecting element and a between them arranged loslierstoffkörper of ceramic or plastic. The transport packaging of the arrangement according to the invention in turn has a cover layer, a cover film and at least one trough-like molded plastic body per power semiconductor module. The cover layer, preferably designed as a composite cardboard which can be dissipated in its entirety, has a planar design and thus forms the basis of the transport packaging.

Das jeweilige Leistungshalbleitermodul wird hierbei zu dem mindestens einen Kunststoffformkörper angeordnet und von diesem teilweise umschlossen, wobei der Kunststoffformkörper nicht vollständig an dem Leistungshalbleitermodul anliegt, sondern in Abschnitten von diesem beabstandet ist. Hierzu ist es bevorzugt, wenn der Kunststoffformkörper mindestens eine Anschlagfläche aufweist, mit der er direkt an dem Leistungshalbleitermodul anliegt. Benachbart hierzu ist dann mindestens ein Hohlraum zwischen dem Kunststoffformkörper und dem Leistungshalbleitermodul vorgesehen. Dieser Hohlraum kann beispielhaft, wenn er an dem Bodenelement vorgesehen ist eine dort aufgebrachte Wärmeleitpastenstruktur vor Kontakt schützen. Ebenso kann der mindestens eine Hohlraum Anschlusselemente vor einem mechanischen Kontakt während des Transports schützen.The respective power semiconductor module is in this case arranged to the at least one plastic molded body and partially enclosed by this, wherein the plastic molded body is not completely applied to the power semiconductor module, but is spaced in sections thereof. For this purpose, it is preferred if the plastic molding has at least one stop surface, with which it rests directly on the power semiconductor module. Adjacent thereto, at least one cavity is then provided between the plastics molding and the power semiconductor module. By way of example, this cavity, when it is provided on the bottom element, can protect a heat-conducting paste structure applied there from contact. Likewise, the at least one cavity can protect connection elements from mechanical contact during transport.

Zur gegenseitigen Fixierung des Leistungshalbleitermodul und des mindestens einen hierzu angeordneten Kunststoffformkörpers ist es vorteilhaft, wenn dieser Kunststoffformkörper eine Seite des Leistungshalbleitermoduls vollständig überdeckt und eine Wandung aufweist, die an den benachbarten Seiten des Leistungshalbleitermoduls anliegt und diese benachbarten Seiten nur teilweise überdeckt.For mutually fixing the power semiconductor module and the at least one plastic molded body arranged therefor, it is advantageous if this plastic molded body completely covers one side of the power semiconductor module and has a wall which rests against the adjacent sides of the power semiconductor module and covers these adjacent sides only partially.

Der mindestens eine Kunststoffformkörper bildet somit ein Abstandselement zwischen dem Leistungshalbleitermodul und den übrigen Teilen der Verpackung aus, wodurch diese Teile der Verpackung im Bereich des Kunststoffformkörpers nicht direkt sondern nur indirekt an diesem anliegen.The at least one plastic molded article thus forms a spacer element between the power semiconductor module and the remaining parts of the packaging, whereby these parts of the packaging in the region of the plastic molded article do not rest directly but only indirectly on it.

Es kann bevorzugt sein, den Kunststoffformkörper zwischen Leistungshalbleitermodul und Decklage vorzusehen, um beispielhaft eine Wärmeleitpastenschicht zu schützen, ebenso kann alternativ oder zusätzlich ein weiterer Kunststoffformkörper auf der gegenüberliegenden Seite des Leistungshalbleitermoduls vorgesehen sein um dortige Anschlusselemente zu schützen. Ebenso bildet ein derart angeordneter Kunststoffformkörper einen Schutz der Deckfolie gegen die Anschlusselemente, da diese bei entsprechender Ausgestaltung, die Deckfolie beschädigen könnten und somit der Schutz des Leistungshalbleitermoduls vor Berührung nicht mehr gegeben wäre.It may be preferable to provide the plastic molded body between the power semiconductor module and the cover layer in order to protect, for example, a thermal compound layer, as well as alternatively or additionally a further plastic molded article may be provided on the opposite side of the power semiconductor module to protect local connection elements. Likewise, such a plastic molded body forms a protection of the cover sheet against the connection elements, since they could damage the cover sheet with appropriate design, and thus the protection of the power semiconductor module would be no longer available before contact.

Es kann zusätzlich bevorzugt sein auf der ersten Hauptfläche der Decklage eine Zwischenlage anzuordnen, wobei diese Ausnehmung für jeweils ein zugeordnetes Leistungshalbleitermodul aufweist. Hierbei ist es vorteilhaft, wenn die Deckfolie weitgehend nur mit der dieser Zwischenlage und nur, im Bereich ihrer Ausnehmungen, mit der Decklage verbunden ist, wodurch eine leicht zu öffnende Transportverpackung ausgebildet wird.It may additionally be preferred to arrange an intermediate layer on the first main surface of the cover layer, this recess having in each case one associated power semiconductor module. In this case, it is advantageous if the covering film largely only with this intermediate layer and only in the region of their recesses, is connected to the cover layer, whereby an easy-to-open transport packaging is formed.

Es ist für den Schutz der Leistungshalbleitermodule gegen elektrostatische Entladung bevorzugt, wenn die Deckfolie und / oder der jeweilige Kunststoffformkörper aus einem leitfähigen oder ableitfähigen Kunststoff mit oder ohne metallbedampfter Außenfläche besteht. Ebenso vorteilhaft ist es die Deckfolie und / oder den jeweiligen Kunststoffformkörper zumindest abschnittsweise, aber bevorzugt vollständig, transparent auszubilden.It is preferred for the protection of the power semiconductor modules against electrostatic discharge when the cover film and / or the respective plastic molded body consists of a conductive or dissipative plastic with or without metallbedampfter outer surface. It is equally advantageous to form the cover film and / or the respective plastic molding at least in sections, but preferably completely, transparently.

Durch die erfindungsgemäß Ausgestaltung der Anordnung ist es möglich

  • die verpackten Leistungshalbleitermodule mechanisch gegeneinander und voneinander beabstandet zu fixieren und gleichzeitig empfindliche Stellen des Leistungshalbleitermoduls gegen mechanische Beschädigung zu schützen;
  • die auf jedem Leistungshalbleitermodul angebrachte Kennzeichnung, auch mittels opto- elektronischer Hilfsmittel wie Handscanner, zu lesen ohne die Transportverpackung öffnen zu müssen;
  • die Transportverpackung als Schutz gegen elektrostatische Aufladung auszubilden;
  • die Transportverpackung als Schutz gegen direkte Einwirkung auf das Leistungshalbleitermodul, auch von Schadgasen aus der Umwelt, auszubilden, wobei es weiterhin vorteilhaft sein kann auf den das Leistungshalbleitermodul umschließenden Abschnitten der Decklage und / oder der Deckfolie einen Korrosionsinhibitor zu Schutz der Anschlusselemente des Leistungshalbleitermoduls vorzusehen sowie
  • eine einfache und umweltgerechte Entsorgung der Verpackung durch deren Trennung, wie auch durch das gegenüber sonstigen Verpackungen geringe Volumen und Masse zu gewährleisten.
The inventive design of the arrangement, it is possible
  • mechanically fixing the packaged power semiconductor modules to each other and spaced from each other while protecting sensitive areas of the power semiconductor module against mechanical damage;
  • to read the label affixed to each power semiconductor module, also using opto-electronic aids such as hand-held scanners, without having to open the transport packaging;
  • to form the transport packaging as protection against electrostatic charge;
  • to form the transport packaging as protection against direct action on the power semiconductor module, including noxious gases from the environment, where it may also be advantageous to provide a corrosion inhibitor for protecting the terminal elements of the power semiconductor module on the power semiconductor module enclosing portions of the cover layer and / or the cover sheet
  • a simple and environmentally sound disposal of the packaging by their separation, as well as by the other packaging to ensure low volume and mass.

Eine weitere bevorzugte Ausführung ergibt sich, wenn bei einer Mehrzahl in einer ein- oder zweidimensionalen Matrix angeordneten Leistungshalbleitermodulen diese in mindestens einer Dimension parallel zur Hauptfläche der Decklage und parallel zu einer Flächennormalen der Gehäuse einen Abstand voneinander aufweisen der größer ist als die Breite des Gehäuses mit angeordnetem Kunststoffformkörper in dieser Dimension. Somit ist es möglich zwei derartige Anordnungen mit den ersten Hauptflächen der Deckflächen zueinander und um den halben Abstand zweier Leistungshalbleitermodule gegeneinander versetzt zu einer Gesamtanordnung hoher Packungsdichte der Leistungshalbleitermodule zu kombinieren.A further preferred embodiment results if, in a plurality of power semiconductor modules arranged in a one-dimensional or two-dimensional matrix, they have a distance apart from one another in at least one dimension parallel to the main surface of the cover layer and parallel to a surface normal of the housing which is greater than the width of the housing arranged plastic molding in this dimension. Thus, it is possible to have two such arrangements with the first major surfaces of the Cover surfaces to each other and offset by half the distance between two power semiconductor modules offset from each other to form an overall arrangement of high packing density of the power semiconductor modules.

Die erfinderische Lösung wird an Hand der Ausführungsbeispiele der Fig. 1 bis 4 weiter erläutert.The inventive solution is based on the embodiments of the Fig. 1 to 4 further explained.

Fig. 1 zeigt einen Schnitt durch eine erste Ausgestaltung einer erfindungsgemäßen Anordnung. Fig. 1 shows a section through a first embodiment of an arrangement according to the invention.

Fig. 2 und 3 zeigt einen Schnitt durch eine zweite Ausgestaltung einer erfindungsgemäßen Anordnung. Fig. 2 and 3 shows a section through a second embodiment of an arrangement according to the invention.

Fig. 4 zeigt in dreidimensionaler Darstellung zwei erfindungsgemäße Anordnungen ähnlich denjenigen gemäß Fig. 1, 2 und 3. Fig. 4 shows in three-dimensional representation two arrangements according to the invention similar to those according to Fig. 1, 2 and 3 ,

Fig. 1 zeigt ausschnittsweise einen Schnitt entlang einer Linie A-A (vgl. Fig. 4) durch eine erste erfindungsgemäße Anordnung (1). Dargestellt ist hier die Decklage (10) der Transportverpackung (2) mit ihrer ersten (100) und zweiten Hauptfläche (110). Auf der ersten Hauptfläche (100) der Decklage (10) sind matrixartig mit gleichem Abstand zueinander die zu verpackenden Leistungshalbleitermodul (5) angeordnet. Von den zu verpackenden Leistungshalbleitermodulen (5) sind nur ein Bodenelement (40), ein Gehäuse (50) und ein Anschlusselement (60) dargestellt. Fig. 1 shows a section of a section along a line AA (see. Fig. 4 ) by a first arrangement (1) according to the invention. Shown here is the cover layer (10) of the transport packaging (2) with its first (100) and second main surface (110). On the first main surface (100) of the cover layer (10), the power semiconductor module (5) to be packaged are arranged in a matrix-like manner at the same distance from each other. Of the power semiconductor modules (5) to be packaged, only one bottom element (40), one housing (50) and one connection element (60) are shown.

Es ist vorteilhaft allerdings nicht einschränkend diese Leistungshalbleitermodule (5) mit ihrem Bodenelement (40), das üblicherweise eine metallisch Grundplatte oder auch direkt das Substrat der internen Schaltung sein kann, in Richtung der ersten Hauptfläche (100) der Decklage (10) anzuordnen. Bei der hier vorgesehenen Ausgestaltung liegen die Anschlusselemente (60) auf der der Decklage (10) gegenüberliegender Seite des Leistungshalbleitermoduls (5).It is advantageous but not restrictive to arrange these power semiconductor modules (5) with their bottom element (40), which usually can be a metallic base plate or directly the substrate of the internal circuit, in the direction of the first main surface (100) of the cover layer (10). In the embodiment provided here, the connection elements (60) lie on the side of the power semiconductor module (5) opposite the cover layer (10).

Das Bodenelement (40) des jeweiligen Leistungshalbleitermoduls (5) weist hier eine Wärmeleitpastenschicht (42) auf, wie sie aus dem Stand der Technik bekannt ist. Zum Schutz dieser pastösen Schicht (42) ist zwischen dem Leistungshalbleitermodul (5) und der Decklage (10) der Transportverpackung (2) ein Kunststoffformkörper (80) angeordnet, wodurch das Leistungshalbleitermodul (5) nicht direkt auf der ersten Hauptfläche (100) der Decklage (10) aufliegt.The bottom element (40) of the respective power semiconductor module (5) here has a thermal paste layer (42), as known from the prior art. To protect this pasty layer (42) between the power semiconductor module (5) and the cover layer (10) of the transport packaging (2) a molded plastic body (80), whereby the power semiconductor module (5) not directly on the first major surface (100) of the cover layer (10).

Der Kunststoffformkörper (80) ist hier wannenartig ausgebildet und weist umlaufend eine flächige Abstützkante (82) auf. Auf dieser Abstützfläche (82) liege der nicht mit Wärmeleitpaste(42) versehene Randbereich des Bodenelements (40) des Leistungshalbleitermoduls (5) auf. Alternativ kann abhängig von der Ausbildung des Leistungshalbleitermoduls (5) auch ein Teil des Gehäuses (50) auf dieser Abstützfläche (82) aufliegen. Zwischen dem mit Wärmeleitpaste (42) versehenen Bodenelement (40) und der Decklage (10) bildet der Kunststoffformkörper (80) einen Hohlraum (86) aus, der dem mechanischen Schutz der Wärmeleitpaste (42) dient.The plastic molding (80) is formed like a trough and has circumferentially a flat support edge (82). On this support surface (82) are not provided with thermal compound (42) edge region of the bottom element (40) of the power semiconductor module (5). Alternatively, depending on the design of the power semiconductor module (5), also a part of the housing (50) rest on this support surface (82). Between the heat-conducting paste (42) provided with the bottom element (40) and the cover layer (10) of the plastic molded body (80) forms a cavity (86), which serves the mechanical protection of the thermal paste (42).

Die Deckfolie (30) wie auch die am Leistungshalbleitermodul (5) anliegenden Teile des Kunststoffformkörpers (80) sind hier und im Folgenden ausschließlich zur besseren Übersichtlichkeit beabstandet von der Decklage (10) wie auch beabstandet von den Leistungshalbleitermodulen (5) dargestellt. Im Übrigen ist die Deckfolie (30) mit der ersten Hauptfläche (100) der Decklage (10) klebetechnisch verbunden.The cover film (30) as well as the parts of the plastic molded body (80) adjacent to the power semiconductor module (5) are here and hereafter shown spaced apart from the cover layer (10) as well as at a distance from the power semiconductor modules (5), for clarity purposes only. Incidentally, the cover film (30) is adhesively bonded to the first main surface (100) of the cover layer (10).

Durch die Ausgestaltung der Deckfolie (30) und vorzugsweise auch des Kunststoffformkörpers (80) aus einem leitfähigen oder ableitfähigen Kunststoff mit oder ohne metallbedampfter Außenfläche und der Decklage (10) aus einem leitfähigen oder ableitfähigen Verbundkarton, entsteht eine Transportverpackung (2), die einen ausreichenden Schutz der Leistungshalbleitermodule (5) gegen elektrostatische Aufladung bietet. Da die Deckfolie (30) zumindest abschnittsweise, aber bevorzugt vollständig, transparent ausgebildet ist, ist es auch zu verschiedenen Kontrollzwecken nicht notwendig diese Schutzverpackung (2) zu öffnen.Due to the design of the cover film (30) and preferably also of the plastic molded body (80) of a conductive or dissipative plastic with or without metallbedampfter outer surface and the cover layer (10) of a conductive or dissipative composite cardboard, a transport packaging (2), which provides sufficient Protection of the power semiconductor modules (5) against electrostatic charging offers. Since the cover film (30) is formed at least in sections, but preferably completely, transparently, it is not necessary for various control purposes to open this protective packaging (2).

Die erfindungsgemäße Anordnung (1) gemäß Fig. 2 ist weiterhin derart ausgestaltet, dass der Abstand (700) der Leistungshalbleitermodule (5) mit angeordnetem Kunststoffformkörper (80) zueinander größer ist als die Breite (500) eines Leistungshalbleitermoduls (5), wodurch es möglich ist eine zweite Anordnung (1') gemäß Fig. 4 um den halben Abstand versetzt zur ersten Anordnung (1) und um 180° gedreht vorzusehen, wodurch sich eine kompakte Gesamtanordnung mit hoher Packungsdichte bei gleichzeitiger ausreichender Fixierung der einzelnen Leistungshalbleitermodule (5) zueinander ergibt.The inventive arrangement (1) according to Fig. 2 is further configured such that the distance (700) of the power semiconductor modules (5) with arranged plastic molding (80) to each other is greater than the width (500) of a power semiconductor module (5), whereby it is possible a second arrangement (1 ') according to Fig. 4 offset by half the distance to the first arrangement (1) and provided rotated by 180 °, resulting in a compact overall arrangement with high packing density with simultaneous sufficient fixation of the individual power semiconductor modules (5) to each other.

Die Fig. 2 und 3 zeigt jeweils einen Schnitt entlang einer Linie B-B (vgl. Fig. 4) durch eine zweite erfindungsgemäße Anordnung (1), wobei die Transportverpackung (2) nochmals weitergebildet dargestellt ist. Diese weist nun eine zusätzliche Zwischenlage (20) mit je einer einem Leistungshalbleitermodul (5) zugeordneten Ausnehmungen (230) auf, wodurch das zugeordnete Leistungshalbleitermodul (5) in seinem unteren Bereich umfasst aber nicht direkt und vollständig anliegen umschlossen ist. Auf dem gesamten Umfang des Leistungshalbleitermodul (5) ist es vorteilhaft, dass der Rand (220) der Ausnehmung (230) zu maximal 50%, bevorzugt nur zu maximal 25%, direkt an dem zugeordneten Leistungshalbleitermodul (5) anliegt und der verbleibende Teil des Randes (220) einen Abstand von mindestens 2mm zum Leistungshalbleitermodul (5) aufweist und somit einen Zwischenbereich (240) ausbildet. Ein direktes Anliegen ist allerdings zumindest an einigen Stellen, vorzugsweise in den Ecken des Leistungshalbleitermoduls (5) sinnvoll, damit die Fixierung der Leistungshalbleitermodul (5) in ihrer Position zueinander gewährleistet wird.The Fig. 2 and 3 shows in each case a section along a line BB (see. Fig. 4 ) by a second arrangement according to the invention (1), wherein the transport packaging (2) is shown again educated. This now has an additional intermediate layer (20), each with a power semiconductor module (5) associated with recesses (230), whereby the associated power semiconductor module (5) in its lower part but does not encompass directly and completely enclosed. On the entire circumference of the power semiconductor module (5), it is advantageous for the edge (220) of the recess (230) to abut a maximum of 50%, preferably only a maximum of 25%, directly on the associated power semiconductor module (5) and the remaining part of the Edge (220) has a distance of at least 2mm to the power semiconductor module (5) and thus forms an intermediate region (240). A direct concern, however, at least in some places, preferably in the corners of the power semiconductor module (5) makes sense, so that the fixation of the power semiconductor module (5) is ensured in their position to each other.

Es ist grundsätzlich bevorzugt aber nicht zwangsläufig notwendig, neben der Klebeverbindung zwischen der Deckfolie (30) und der Zwischenlage (20), auch zwischen der Decklage (10) und der Deckfolie (30) in dem oben beschriebenen Zwischenbereich (240), wie auch zwischen der Decklage (10) und der Zwischenlage (20) Klebeverbindungen vorzusehen. Die erstgenannte Klebeverbindung muss hierbei nicht als lösbare Verbindung ausgebildet sein.It is basically preferred but not necessarily necessary, in addition to the adhesive bond between the cover sheet (30) and the intermediate layer (20), also between the cover layer (10) and the cover sheet (30) in the intermediate region (240) described above, as well as between the cover layer (10) and the intermediate layer (20) provide adhesive connections. The first-mentioned adhesive bond does not have to be designed as a detachable connection.

Fig. 2 zeigt eine Anordnung 1 mit einem Leistungshalbleitermodul (5) sowie einer Transportverpackung (2). Hierbei ist die Decklage (10) teilweise von der Zwischenlage (20) getrennt dargestellt. Diese Darstellung entspricht dem Öffnen der Transportverpackung (2), um ein Leistungshalbleitermodul (5) aus dieser zu entnehmen. Hierbei wird die lösbare Verbindung zwischen der Decklage (10) und der Zwischenlage (20) und / oder diejenige zwischen der Decklage (10) und der Deckfolie (30) in dem Zwischenbereich (240) getrennt. Fig. 2 shows an arrangement 1 with a power semiconductor module (5) and a transport packaging (2). Here, the cover layer (10) is shown partially separated from the intermediate layer (20). This representation corresponds to the opening of the transport packaging (2) to remove a power semiconductor module (5) from this. Here, the detachable connection between the cover layer (10) and the intermediate layer (20) and / or that between the cover layer (10) and the cover film (30) in the intermediate region (240) is separated.

Vorzugsweise aber nicht beschränkend besteht die die Zwischenlage (20) wie auch die Decklage (10) aus Pappe oder Karton oder Verbundkarton. Als besonders vorteilhaft zum Schutz gegen elektrostatische Entladung hat es sich erweisen die Zwischenlage (20) und, aber bevorzugt nur, die Decklage (10) aus leitfähigem oder ableitfähigem Verbundkarton vorzusehen. Dieser weist dann beispielhaft eine leitfähige oder ableitfähige Folienzwischenlage auf.Preferably, but not limiting, the intermediate layer (20) as well as the cover layer (10) consists of cardboard or cardboard or composite cardboard. It has proved to be particularly advantageous for protection against electrostatic discharge, the intermediate layer (20) and, but preferably only, the cover layer (10) of conductive or conductive composite cardboard. This then has, by way of example, a conductive or dissipative film interlayer.

In dieser Ausgestaltung ist der Kunststoffformkörper (80) auf der der Decklage (10) abgewandeten Seite des Leistungshalbleitermoduls (5) angeordnet um dort die Anschlusselemente (60, 62) von Last- und Hilfsanschlüssen gegen mechanische Beschädigung während des Transports zu schützen. Hierzu weist der Kunststoffformkörper (80) eine Anschlagfläche (82) mit den Lastanschlusselementen (60), sowie hierzu benachbart jeweils ein Hohlraum (86) für die Hilfsanschlusselemente auf. Dieser Hohlraum (86) verhindert, dass die jeweiligen Hilfsanschlusselemente (62) aufgrund ihrer Ausgestaltung als Stecker die Deckfolie (30) beschädigen können. Ebenso können somit andere, filigran ausgebildete, Anschlusselemente (60, 62) vor Beschädigung von Außen geschützt werden. Dieser Kunststoffformkörper (80) überdeckt hier, wie es allgemein bevorzugt ist, die gesamte Anschlusselemente aufweisende Seite des Leistungshalbleitermoduls (5).In this embodiment, the plastic molded body (80) on the cover layer (10) facing away from the power semiconductor module (5) arranged there to protect the connection elements (60, 62) of load and auxiliary terminals against mechanical damage during transport. For this purpose, the plastic molded body (80) has a stop surface (82) with the load connection elements (60), and adjacent to each one a cavity (86) for the auxiliary connection elements on. This cavity (86) prevents the respective auxiliary connection elements (62) from damaging the cover film (30) due to their configuration as a plug. Likewise, other filigree, connecting elements (60, 62) can thus be protected from damage from the outside. Here, as is generally preferred, this plastic molded body (80) covers the entire connecting elements having side of the power semiconductor module (5).

Der Kunststoffformkörper (80) weist weiterhin an mindestens zwei gegenüberliegenden, vorzugsweise aber an allen Seiten eine Wandung (84) auf. Diese Wandung (84) liegt an denjenigen Seiten des Leistungshalbleitermoduls (5) an, die sich an die überdeckte Seite anschließen. Es ist hierbei bevorzugt, dass diese Wandungen (84) die jeweiligen Seiten nur teilweise überdecken.The plastic molded body (80) further has at least two opposite, but preferably on all sides of a wall (84). This wall (84) abuts those sides of the power semiconductor module (5) which adjoin the covered side. It is hereby preferred that these walls (84) only partially cover the respective sides.

Typische Abmessungen der genannten Leistungshalbleitermodule (5) sind, ohne hieraus eine Beschränkung abzuleiten, eine Länge im Bereich von 3cm bis 15cm bei einer Breite (500) einschließlich Kunststoffformkörper (80) und gleichfalls einer Höhe von 1 cm bis 6cm. Die Decklage (10) der Transportverpackung (2) weist eine typische Dicke von 0,2mm bis 1 mm auf, die Zwischenlage (20) ein Dicke von 0,5 bis 3mm, während die Deckfolie (30) eine Dicke in der Größeordnung von 100µm aufweist. Der Kunststoffformkörper (80) weist bevorzugt eine Dicke auf die mindestens um den Faktor 5 über derjenigen der Deckfolie (30) liegt.Typical dimensions of said power semiconductor modules (5) are, without being limited thereto, a length in the range of 3cm to 15cm at a width (500) including plastic moldings (80) and also a height of 1cm to 6cm. The cover layer (10) of the transport packaging (2) has a typical thickness of 0.2 mm to 1 mm, the intermediate layer (20) has a thickness of 0.5 to 3 mm, while the cover film (30) has a thickness of the order of 100 μm having. The plastic molding (80) preferably has a thickness which is at least a factor of 5 higher than that of the cover film (30).

Fig. 3 zeigt nun einen weiteren Schritt der Entnahme eines Leistungshalbleitermoduls (5) aus der Transportverpackung (2). Hierbei wurde die Zwischenlage (20) in Richtung der Flächennormalen ihrer ersten Hauptfläche (200) gedrückt, bis die Zwischenlage (20) annährend auf der durch die Oberseite des Gehäuses (50) gebildeten Ebene liegt. Bei dieser Verschiebung der Zwischenlage (20) löst sich die Deckfolie (30) zumindest teilweise von dem Gehäuse (50) des Leistungshalbleitermoduls (5), und liegt dann ausschließlich oder zumindest fast ausschließlich noch an den Wandungen (84) des Kunststoffformkörpers (80) an, wodurch das Leistungshalbleitermodul (5) aus diesem Kunststoffformkörper (80) einfach und ohne Anwendung von Werkzeug entnommen werden kann. Fig. 3 now shows a further step of removing a power semiconductor module (5) from the transport packaging (2). In this case, the intermediate layer (20) was pressed in the direction of the surface normal of its first major surface (200) until the intermediate layer (20) lies approximately on the plane formed by the upper side of the housing (50). In this displacement of the intermediate layer (20), the cover film (30) at least partially detached from the housing (50) of the power semiconductor module (5), and then lies exclusively or at least almost exclusively on the walls (84) of the plastic molded body (80) whereby the power semiconductor module (5) can be removed from this plastic molding (80) simply and without the use of tools.

Fig. 4 zeigt in dreidimensionaler Darstellung zwei erfindungsgemäße Anordnungen (1, 1'), ähnlich denjenigen gemäß Fig. 1, 2 und 3, mit jeweils einer Transportverpackung (2) und einer Mehrzahl von Leistungshalbleitermodulen (5). Von diesen Leistungshalbleitermodulen (5) ist jeweils das Gehäuse (50) und eine Mehrzahl von Anschlusselementen (60, 62) dargestellt. Mit ihrem nicht sichtbaren Bodenelement (40, vgl. Fig. 1), hier einer metallischen Grundplatte, sind diese Leistungshalbleitermodule (5) in einer zweidimensionalen Matrix auf der ersten Hauptfläche (100) der Decklage (10) der jeweiligen Transportverpackung (2) angeordnet, indem das Bodenelement (40, vgl. Fig. 2) jeweils direkt oder wie oben beschrieben indirekt mit einem dazwischen angeordnetem Kunststoffformkörper (80) hierauf zu liegen kommt. Fig. 4 shows three-dimensional representation of two inventive arrangements (1, 1 '), similar to those according to Fig. 1, 2 and 3 , each with a transport packaging (2) and a plurality of power semiconductor modules (5). Of these power semiconductor modules (5) in each case the housing (50) and a plurality of connecting elements (60, 62) is shown. With its invisible floor element (40, cf. Fig. 1 ), here a metallic base plate, these power semiconductor modules (5) in a two-dimensional matrix on the first main surface (100) of the cover layer (10) of the respective transport packaging (2) are arranged by the bottom element (40, see FIG. Fig. 2 ) directly or as described above indirectly with an interposed plastic molded body (80) comes to lie here.

Auf dieser ersten Hauptfläche (100) der Decklage (10) ist eine Zwischenlage (20) mit ihrer zweiten Hauptfläche (210) angeordnet. Diese Zwischenlage (20) weist eine Mehrzahl von Ausnehmungen (230) auf, die jeweils einem Leistungshalbleitermodul (5) zugeordnet sind. Hierbei ist das Leistungshalbleitermodul (5) in dieser Ausnehmung (230) derart angeordnet, dass der Rand (220) der Ausnehmung (230) nur an wenigen Abschnitten direkt an dem Gehäuse (50) des Leistungshalbleitermoduls (5) anliegt. Überwiegend ist zwischen dem Gehäuse (50) des Leistungshalbleitermoduls (5) und dem Rand (220) der Ausnehmung (230) ein Abstand vorgesehen, der einen Zwischenbereich (240) ausbildet.An intermediate layer (20) with its second main surface (210) is arranged on this first main surface (100) of the cover layer (10). This intermediate layer (20) has a plurality of recesses (230) which are each associated with a power semiconductor module (5). In this case, the power semiconductor module (5) is arranged in this recess (230) such that the edge (220) of the recess (230) rests directly on the housing (50) of the power semiconductor module (5) only at a few sections. Mostly, a gap is provided between the housing (50) of the power semiconductor module (5) and the edge (220) of the recess (230), which forms an intermediate region (240).

Nicht dargestellt sind die transparente Deckfolie (30) sowie die jeweiligen Kunststoffformkörper (80) selbst. Bei einer hier dargestellten Mehrzahl von Leistungshalbleitermodulen (5) in einer zweidimensionalen Matrixanordnung ist es weiterhin, ebenso wie auch bei einer eindimensionalen Anordnung, vorteilhaft, wenn die Transportverpackung (2), hier nur dargestellt bei der zweiten Anordnung (1'), zwischen den jeweiligen Leistungshalbleiterbauelementen (5) eine Perforierung (70) aufweist, um das Vereinzeln der verpackten Leistungshalbleitermodule (5) zu vereinfachen.Not shown are the transparent cover film (30) and the respective plastic moldings (80) themselves. In a plurality of power semiconductor modules (5) shown here in a two-dimensional matrix arrangement, it is furthermore, as well as in a one-dimensional arrangement, advantageous if the transport packaging ( 2), here only shown in the second arrangement (1 '), between the respective power semiconductor components (5) has a perforation (70) in order to simplify the separation of the packaged power semiconductor modules (5).

Claims (12)

Anordnung (1) mit mindestens einem Leistungshalbleitermodul (5) und einer Transportverpackung (2), wobei das Leistungshalbleitermodul (5) ein Bodenelement (40), ein Gehäuse (50) und Anschlusselemente (60, 62) aufweist und die Transportverpackung (2) eine flächig ausgebildete Decklage (10), eine Deckfolie (30) und mindestens einen wannenartigen Kunststoffformkörper (80) pro Leistungshalbleitermodul (5) aufweist
wobei dieser mindestens eine Kunststoffformkörper (80) das zugeordnete Leistungshalbleitermodul (5) nur teilweise umschließt und dabei ein Teil des Kunststoffformkörpers (80) nicht direkt an dem Leistungshalbleitermodul (5) anliegt und wobei eine erste Seite des mindestens einen Leistungshalbleitermoduls (5) direkt oder indirekt auf der ersten Hauptfläche (100) der Decklage zu liegen kommt und wobei die Deckfolie (30) die weiteren Seiten des Leistungshalbleitermoduls (5) direkt und / oder indirekt überdeckt, und hierbei zumindest teilweise an dem Kunststoffformkörper (80) anliegt.Arrangement (1) with at least one power semiconductor module (5) and a transport packaging (2), wherein the power semiconductor module (5) has a bottom element (40), a housing (50) and connection elements (60, 62) and the transport packaging (2) having a flat cover layer (10), a cover film (30) and at least one trough-like molded plastic body (80) per power semiconductor module (5)
wherein said at least one plastic molded body (80) encloses the associated power semiconductor module (5) only partially and a part of the plastic molded body (80) is not directly applied to the power semiconductor module (5) and wherein a first side of the at least one power semiconductor module (5) directly or indirectly on the first main surface (100) of the cover layer comes to lie and wherein the cover film (30) the other sides of the power semiconductor module (5) directly and / or indirectly covered, and in this case at least partially against the plastic molded body (80). Anordnung (1) nach Anspruch 1, wobei
der Kunststoffformkörper (80) mindestens eine Anschlagfläche (82) aufweist, mit der er direkt an dem Leistungshalbleitermodul (5) anliegt und benachbart hierzu mindestens ein Hohlraum (86) zwischen dem Kunststoffformkörper (80) und dem Leistungshalbleitermodul (5) ausgebildet ist.Arrangement (1) according to claim 1, wherein
the plastic molded body (80) has at least one stop surface (82), with which it rests directly on the power semiconductor module (5) and adjacent thereto at least one cavity (86) between the plastic molded body (80) and the power semiconductor module (5) is formed. Anordnung (1) nach Anspruch 1 oder 2, wobei
der Kunststoffformkörper (80) eine Seite des zugeordneten Leistungshalbleitermoduls (5) vollständig überdeckt und dieser eine Wandung (84) aufweist, die an den benachbarten Seiten des Leistungshalbleitermoduls (5) anliegt und diese benachbarten Seiten hierbei nur teilweise überdecken.Arrangement (1) according to claim 1 or 2, wherein
the plastic molded body (80) completely covers one side of the associated power semiconductor module (5) and has a wall (84) which bears against the adjacent sides of the power semiconductor module (5) and covers these adjacent sides only partially. Anordnung (1) nach Anspruch 1, wobei
die Deckfolie (30) und / oder der Kunststoffformkörper (80) aus einem leitfähigen oder ableitfähigen Kunststoff mit oder ohne metallbedampfter Außenfläche ausgebildet ist.Arrangement (1) according to claim 1, wherein
the cover film (30) and / or the plastic molded body (80) is formed from a conductive or dissipative plastic with or without a metallized outer surface. Anordnung (1) nach Anspruch 1, wobei
die Deckfolie (30) und / oder der Kunststoffformkörper (80) zumindest abschnittsweise, aber bevorzugt vollständig, transparent ausgebildet ist.Arrangement (1) according to claim 1, wherein
the cover film (30) and / or the plastic molding (80) is formed at least in sections, but preferably completely, transparently. Anordnung (1) nach Anspruch 1, wobei
die Deckfolie (30) ein Dicke aufweist, die mindestens um den Faktor 5 geringer ist als diejenige des Kunststoffformkörpers (80) und dieser somit mechanisch stabiler ausgebildet ist.Arrangement (1) according to claim 1, wherein
the cover film (30) has a thickness which is at least by a factor of 5 lower than that of the plastic molded body (80) and thus is mechanically more stable. Anordnung (1) nach Anspruch 1, wobei
die Transportverpackung (2) eine zusätzliche Zwischenlage (20) mit jeweils einer dem mindestens einen Leistungshalbleitermodul (5) zugeordneten Ausnehmungen (230) aufweist und diese Zwischenlage mit Ihrer zweiten Hauptfläche (210) auf der ersten Hauptfläche (100) der Decklage (10) angeordnet ist und hierbei in dieser mindestens einen Ausnehmungen (230) der Zwischenlage (20) das Leistungshalbleitermodul (5) angeordnet ist.Arrangement (1) according to claim 1, wherein
the transport packaging (2) has an additional intermediate layer (20) each having a recesses (230) associated with the at least one power semiconductor module (5) and arranging this intermediate layer with its second main surface (210) on the first main surface (100) of the cover layer (10) is and in this case the power semiconductor module (5) is arranged in this at least one recesses (230) of the intermediate layer (20). Anordnung (1) nach Anspruch 7, wobei
die Decklage (10) und die Zwischenlage (20) lösbar miteinander verbunden sind.Arrangement (1) according to claim 7, wherein
the cover layer (10) and the intermediate layer (20) are releasably connected to each other. Anordnung (1) nach Anspruch 7, wobei
die Deckfolie (30) in einem durch die jeweilige Ausnehmung (230) der Zwischenlage (20) neben dem Leistungshalbleiterbauelement (5) frei gesparten Zwischenbereich (240) mit der ersten Hauptfläche (100) der Decklage (10) lösbar verbunden ist.Arrangement (1) according to claim 7, wherein
the cover film (30) is releasably connected to the first main surface (100) of the cover layer (10) in an intermediate region (240) which is freely saved by the respective recess (230) of the intermediate layer (20) next to the power semiconductor component (5). Anordnung (1) nach Anspruch 1 oder 7, wobei
die Zwischenlage (20) und / oder Decklage (10) aus Pappe oder Karton oder Verbundkarton besteht.Arrangement (1) according to claim 1 or 7, wherein
the intermediate layer (20) and / or cover layer (10) consists of cardboard or cardboard or composite cardboard. Anordnung (1) nach Anspruch 1, wobei
bei einer Mehrzahl in einer ein- oder zweidimensionalen Matrix angeordneten Leistungshalbleitermodulen (5) diese in mindestens einer Dimension parallel zur Hauptfläche der Decklage (10) und parallel zu einer Flächennormalen der Gehäuse (50) einen Abstand (700) voneinander aufweisen der größer ist als die Breite (500) des Gehäuses (50) mit angeordnetem Kunststoffformkörper (80) in dieser Dimension.Arrangement (1) according to claim 1, wherein
in a plurality in a one- or two-dimensional matrix arranged power semiconductor modules (5) in at least one dimension parallel to the main surface of the cover layer (10) and parallel to a surface normal of the housing (50) have a distance (700) from each other is greater than that Width (500) of the housing (50) with arranged plastic molded body (80) in this dimension. Anordnung (1) nach Anspruch 1, wobei
bei einer Mehrzahl in einer ein- oder zweidimensionalen Matrix angeordneten Leistungshalbleitermodulen (5) die Transportverpackung (2) zwischen den jeweiligen Leistungshalbleiterbauelementen (5) eine Perforierung (70) aufweist.Arrangement (1) according to claim 1, wherein
in the case of a plurality of power semiconductor modules (5) arranged in a one- or two-dimensional matrix, the transport packaging (2) has a perforation (70) between the respective power semiconductor components (5).
EP10192500.6A 2010-01-20 2010-11-25 Assembly with at least one semiconductor module and a transport package Active EP2347970B1 (en)

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KR20110085871A (en) 2011-07-27
CN102145794B (en) 2015-04-01
DE102010005047B4 (en) 2014-10-23
JP5732261B2 (en) 2015-06-10
US8247892B2 (en) 2012-08-21
JP2011173654A (en) 2011-09-08
DE102010005047A1 (en) 2011-07-21
EP2347970B1 (en) 2013-06-19
CN102145794A (en) 2011-08-10
US20110180918A1 (en) 2011-07-28

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