EP2328392A2 - Converter, in particular multi-phase alternating current converter - Google Patents
Converter, in particular multi-phase alternating current converter Download PDFInfo
- Publication number
- EP2328392A2 EP2328392A2 EP10014505A EP10014505A EP2328392A2 EP 2328392 A2 EP2328392 A2 EP 2328392A2 EP 10014505 A EP10014505 A EP 10014505A EP 10014505 A EP10014505 A EP 10014505A EP 2328392 A2 EP2328392 A2 EP 2328392A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- board
- converter according
- power module
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 239000003990 capacitor Substances 0.000 claims description 16
- 238000005476 soldering Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 abstract description 10
- 238000010276 construction Methods 0.000 description 15
- 238000009434 installation Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 230000009977 dual effect Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 210000004907 gland Anatomy 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14322—Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1031—Surface mounted metallic connector elements
- H05K2201/10318—Surface mounted metallic pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Definitions
- the invention relates to a converter, in particular a multi-phase three-phase converter, having a DC voltage intermediate circuit and a power module having at least one power semiconductor.
- Such multiphase converters for example, three-phase inverters or frequency converters, are used for feeding electric drive machines from a DC voltage source.
- Such inverters are used, for example, as frequency converters, which drive a traction motor, for example an asynchronous motor, of a mobile electrically operated vehicle, for example an industrial truck, from a DC voltage source.
- the DC voltage can be provided from a battery or a generator as a DC voltage source.
- a generator a DC voltage generator or a three-phase generator can be used, whose generated three-phase current is rectified in a rectifier.
- a generic inverter is from the EP 1 083 599 B1 known.
- the DC electrical DC link is formed by a printed circuit board, which is arranged above a power module.
- the power module consists of several identically constructed rectangular substrates, which are provided on the longitudinal sides with electrical contact surfaces.
- the substrates are arranged side by side in such a way that two adjacent contact surfaces of two adjacent substrates are at the same potential and can be electrically contacted by a pressing device in the form of electrically conductive pressure pieces.
- the plungers are also used to contact the substrates to a heat sink to ensure cooling of the power semiconductors.
- Umrichern is a possible low-inductance structure desired as a further constraint.
- the switching of the power semiconductors of the power module is made difficult by stray inductance resulting from the path lengths of the mechanical structure between the DC link and the power semiconductors of the power module.
- This stray inductance degrades the switching behavior of the power semiconductors and can lead to overvoltages, which can lead to a destruction of the power semiconductors, and increased switching losses.
- the cause is the self-induction voltage generated in the stray inductance due to large di / dt, which is superimposed on the intermediate circuit voltage and can lead to impermissibly high voltages and corresponding voltage peaks on the power semiconductors.
- a power connector for connection to a printed circuit board formed by a main body and an eccentric body.
- a power cable is fastened via a screw.
- the eccentric body of the power connector serves via a further screw for attaching the power connector to the circuit board.
- a rotation in the form of a retaining lug on the main body is provided, which engages in a recess of the circuit board.
- a corresponding high friction can be applied by the screw connection of the power connector to the circuit board as rotation.
- Such a thing Power connector has due to the design with the main body and the eccentric body, which is integrally formed on the main body, and the required anti-rotation on a complex structure with high construction costs.
- the present invention has for its object to provide a converter of the type mentioned available, the mechanical structure is further improved in terms of leakage inductance and has a cost-effective design with low installation costs and low space requirement.
- the DC voltage intermediate circuit of a plate-shaped, provided with at least one capacitor board and the power module are formed by a printed circuit board, which are arranged directly above one another in parallel planes, wherein the power current terminals of the power module are each formed of a strip-shaped busbar fixed to at least one metal body and electrically connected to the circuit board via the metal body and fixed to the circuit board.
- the construction of the converter from a board of the DC intermediate circuit and a circuit board of the power module results in a simple structure with few components, wherein the current-carrying connection lines of corresponding low-inductive tracks in the circuit board and the board can be formed with short path lengths.
- the distance between the DC voltage intermediate circuit and the power module compared to known inverter assemblies can be further reduced and a small space requirement of the inverter according to the invention can be achieved.
- the power current connections formed by the strip-shaped busbars and thus the motor phase outlets of the power module which are electrically connected via at least one metal body to the circuit board and fixed to the circuit board of the power module, allow for a low construction cost and installation effort a stable execution of the motor phase outlets by appropriate design of the busbars and a simple and stable mounting of the busbars to the circuit board of the power module, whereby the structure of the inverter in terms of a cost-effective design and ease of assembly can be further improved.
- the power current terminals of the power module and thus the motor phase outlets can be formed by such strip-shaped busbars with low construction costs.
- the busbars are arranged above the board and extend the metal body through a respective recess of the board. In this way, a particularly space-saving arrangement of the busbars in a further parallel plane above the board of the DC intermediate circuit can be achieved.
- the busbars between the capacitors of the DC intermediate circuit are arranged, which are arranged on the board, whereby a space-saving and space-saving arrangement of the busbars can be achieved within the height of the capacitors of the DC intermediate circuit.
- the busbar is provided in a laterally arranged next to the board area with a connection, in particular a bolt, for a saustromabschreib.
- the busbars of the power current connections can be brought out laterally from the board by the arrangement between the capacitors of the DC intermediate circuit and be provided in the laterally led out area with a connection as Motorphasenab réelle. This results in low construction costs good accessibility for the motor phase outgoing, where appropriate motor cables can be connected safely and with good accessibility.
- busbar is bent in the region of the connection in the direction of the board.
- an arrangement of the capacitors formed, for example, in the form of a bolt can be achieved in a space-saving manner within the height extent of the capacitors arranged on the printed circuit board.
- the metal body is formed according to a preferred embodiment as a sleeve, wherein the bus bar is fastened by means of a screw on the sleeve.
- the busbars are thus fastened by means of the screw on the sleeve and pressed onto the sleeves, which in a simple and cost-effective manner electrical contacting of the busbars with the sleeves and attachment of the busbars on the sleeves can be achieved.
- the arrangement of the busbars above the board of the DC intermediate circuit here a good accessibility of the fittings for a simple mounting of the busbars is achieved.
- the metal body can in this case be soldered for electrical contacting with the current-carrying conductor tracks of the circuit board of the power module.
- a solder joint allows with low production costs, an electrical contacting of the metal body with the circuit board of the power module and an attachment of the metal body on the circuit board.
- the metal body formed by a sleeve according to a preferred embodiment of the invention by means of the screw with the circuit board of the power module is compressible.
- the sleeve can also be fastened to the printed circuit board by the existing screw connection for fastening the busbar to the sleeve and can be electrically contacted with the printed circuit board.
- the cooling of the power semiconductor of the power module can be ensured in a simple manner, if, according to an advantageous embodiment of the invention, the circuit board rests with a bottom side opposite the board to a heat sink.
- a particularly simple structure with a low installation cost of the converter according to the invention is in this case achieved when the screw is designed as electrically insulated fittings and the circuit board of the power module according to a preferred embodiment of the invention by means of the screw on the heat sink can be fastened.
- the electrically insulated fittings thus fulfill a dual function and serve on the one hand for fastening the busbars to the sleeves and thus to the electrical Contacting the busbars and optionally further for electrical contacting of the circuit board with the sleeves and thus for electrical contacting of the sleeves with the circuit board of the power module and on the other hand for mechanical attachment of the circuit board on the heat sink.
- the power module heats up due to the waste heat of the power semiconductors, whereby a bi-metal effect occurs, which can lead to a lifting of the circuit board from the heat sink.
- a pressure frame is provided according to an advantageous embodiment of the invention for pressing the circuit board to the heat sink.
- the printing frame is in operative connection with the circumference of the printed circuit board, which reliably prevents lifting of the printed circuit board of the power module on the outer circumference in the inverter according to the invention, in which the printed circuit board of the line module is fastened to the heat sink via the screw connections of the busbars arranged between the capacitors of the DC intermediate circuit can be and thus an effective cooling can be achieved.
- the pressure frame is fastened according to a preferred embodiment of the invention by means of at least one screw on the heat sink, whereby attachment of the pressure frame to the heat sink and thus a peripheral contact pressure of the power module is achieved on the heat sink with little additional installation effort and construction costs.
- a cover covering the inverter is provided which can be fastened to the printing frame by means of the screw connection.
- the screw of the printing frame thus also fulfills a dual function for attaching the printing frame to the heat sink and for attaching the lid to the printing frame, so that can reduce the installation effort and construction costs on.
- the board of the DC intermediate circuit and the circuit board of the power module can be electrically connected via a pressure contact, which is formed for example by corresponding spring-loaded or jammed or screwed pressure pieces.
- a pressure contact which is formed for example by corresponding spring-loaded or jammed or screwed pressure pieces.
- the circuit board of the power module and the board of the DC intermediate circuit can thus be formed as a pre-assembly.
- a simple and inexpensive construction without additional fastening means is achieved and achieved a simple assembly of the inverter according to the invention.
- the arrangement of the circuit board of the intermediate circuit and the circuit board of the power module directly above each other and the use of the solder pins for mechanical and electrical connection, the distance between the DC link and the power module over known inverter assemblies can be further reduced.
- the contacting by means of solder pins in continuous or alternating load operation, especially in thermal alternating load operation, over the life of the inverter is reliable.
- solder pins for contacting in comparison to pressure contacting with pressure pieces.
- solder pins have a simple structure with low manufacturing costs and can be mounted in a simple manner on the top of the circuit board of the power module or on the underside of the board of the DC intermediate circuit, in particular fully automatically equipped, thereby simplifying the manufacturing effort and assembly of the inverter according to the invention becomes.
- the solder pins are mounted according to a preferred embodiment of the invention on the circuit board facing top of the circuit board and extending through receiving holes of the board, the solder pins have a diameter paragraph for holding the board.
- the soldering pins can be soldered or pressed to the printed circuit board in order to be contacted with the current-carrying printed conductors of the printed circuit board of the line module.
- the diameter paragraph on the solder pins in this case allows easy installation and attachment of the board of the DC intermediate circuit, since the board of the DC intermediate circuit can be plugged with the mounting holes in a simple manner on the solder pins and supported.
- the printed circuit board is formed according to a preferred embodiment of the invention as an IMS (insulated metal substrates) printed circuit board, which is equipped with the power semiconductors.
- IMS insulated metal substrates
- the current-carrying conductor tracks for connecting the solder pins to terminals of the power semiconductors can be guided with low induction and used as thick-film metal tracks for heat dissipation.
- such an IMS circuit board can be easily equipped with the power semiconductors and other discrete components and the solder pins.
- an inverter 1 for example, a three-phase inverter as a frequency converter, shown for driving an electric motor.
- the converter 1 has a DC intermediate circuit 2 and a power module 3.
- the DC intermediate circuit 2 is formed by a plate-shaped board 4, which is provided with capacitors 5.
- the power module 3 is formed by a printed circuit board 6, preferably an IMS printed circuit board, which is equipped with power semiconductors 7, for example power transistors, and further discrete components.
- the converter 1 according to the invention has a structure with three identical half-bridges H1, H2, H3, each of which can be formed by a plurality of line semiconductors 7.
- the power semiconductors 7 of the power module 3 are each connected to a negative pole and a positive pole of the DC intermediate circuit 2.
- the power semiconductors 7 of a half-bridge H1 or H2 or H3 are each connected to one of the three current-carrying motor phase outputs.
- the board 4 of the DC intermediate circuit 2 and the circuit board 6 of the power module 3 are sandwiched one above the other, wherein the board 4 of the DC intermediate circuit 2 is arranged directly above the circuit board 6 of the power module 3 in a further parallel plane.
- a plurality of surface-mounted solder pins 10a, 10b, 10c are provided for electrical contacting and mechanical connection of the DC voltage intermediate circuit 2 and the power module 3.
- FIGS. 1 and 2 Furthermore, a heat sink 21, a pressure frame 25 and a cover 28 are shown, which will be described in more detail later.
- solder pins 10a and 10b are arranged symmetrically on the outer sides, for example, the longitudinal sides of the inverter 1, wherein the solder pins 10a and 10b, for example, form the positive pole. In a longitudinal center plane of the inverter 3 more solder pins 10c are arranged, for example, form the negative pole.
- connectors For electrical contacting of a control line of the power semiconductor 7 in the circuit board 6 of the power module 3 not shown in detail connectors can be provided.
- the solder pins 10a, 10b, 10c are arranged at the top of the circuit board 6 of the power module 3 and in the printed circuit board 6, preferably soldered to the circuit board 6, whereby they are electrically contacted with corresponding current-carrying conductor tracks of the board 6 and attached to the circuit board 6 are.
- the solder pins 10a, 10b, 10c have at the upper end a diameter paragraph 11, wherein the solder pins 10a, 10b, 10c extend with the reduced diameter through a matched to the diameter of the solder pins receiving bore 12 of the board 4 of the DC intermediate circuit 2.
- the board 4 can be attached to the surface-mounted solder pins 10a, 10b, 10c with the mounting holes 12 and held at the fürmesserab arrangementsn 11 of the solder pins 10a, 10b, 10c at a distance from the circuit board 6 with little installation effort.
- soldering the solder pins 10a, 10b, 10c with corresponding tracks of the board 4 of the DC intermediate circuit 2 the electrical contacting of the solder pins 10a, 10b, 10c with the board 4 and the mechanical connection of the board 4 to the circuit board 6 can be made in a simple manner.
- the three phase outputs of the motor phases and thus the power current connections of the converter 1 according to the invention are - as shown in FIG. 1 is visible - formed by a respective strip-shaped busbar 15, of which in the FIG. 4 the phase output of the half-bridge H1 is shown.
- the phase outputs of the half bridges H2 and H3 are - as shown in FIG. 1 is apparent - identically constructed.
- the busbars 15 are in this case arranged within the vertical extent of the capacitors 5 of the DC intermediate circuit 2.
- the board 4 of the DC intermediate circuit 2 is provided for insulating passage of the metal body 16 a, 16 b, each with a corresponding bore-shaped recess 17 whose diameter is greater than the outer diameter of the sleeves.
- the metal body 16a, 16b formed by the sleeves are in this case in contact with the lower end face with current-carrying conductor tracks of the printed circuit board 6 of the power module 3.
- the corresponding bus bar 15 is placed on the upper end side of the metal body 16 a, 16 b formed by the sleeves.
- the bus bars 15 are arranged between the capacitors 5 of the respective half-bridge H1, H2, H3 and at the in the FIG. 4 left side out of the inverter assembly led out and provided at the protruding end with a terminal 18, in particular a bolt, for a saustromabgriff as motor phase outlet.
- the busbar 15 is bent downwards in the direction of the circuit board 4 and the printed circuit board 6, in order to achieve a space-saving arrangement of the terminals 18 within the vertical extent of the converter 1.
- a screw connection 20a, 20b is respectively provided, with which the busbar 15 is fastened to the metal bodies 16a, 16b and electrically contacted.
- the metal bodies 16a, 16b are in this case preferably soldered to the printed circuit board 6 of the power module 3.
- the screw 20a, 20b is in this case arranged concentrically to the sleeve in a receiving bore of the sleeve.
- the heat sink 21 of the inverter 1 according to the invention is shown, on which the circuit board 6 of the power module 3 rests for cooling with the power semiconductors 7 opposite bottom.
- the screw 20a, 20b have a dual function and are used in addition to the compression of the busbars 15 with the metal bodies 16a, 16b and thus the function attachment of the busbars 15 and electrical contacting of the motor phase outlets continue to function attachment and compression of the power module. 3 on the heat sink 21.
- the screw connections 20a, 20b are in each case formed by electrically insulated screws which extend through the metal bodies 16a, 16b formed by the sleeves and can be screwed into corresponding threaded receivers 22a, 22b of the heat sink 21.
- each screw connection 20a, 20b is provided with an insulating sleeve 23a, 23b, which is clamped between the screw head of the screw connection 20a, 20b and the upper side of the busbar 15 and extends downwards into the sleeve, around the screw head and electrically isolating the screw shank of the screw 20a, 20b from the bus bar 15 and the corresponding metal body 16a, 16b, respectively.
- connection of the DC intermediate circuit 2 to the positive pole and the negative pole also via strip-shaped busbar 35, 36, which are similar in construction to the busbars 15 of the three motor phase outlets.
- The, for example, the positive pole forming busbar 35 is in this case arranged between the capacitors of the adjacent half-bridges H1 and H2.
- the negative pole forming bus bar 36 is disposed between the capacitors of the adjacent half bridges H2 and H3.
- the busbars 35, 36 are led out to the same side as the busbars 15 laterally from the inverter assembly and in the laterally led out area also bent down in the direction of the board 4 and the circuit board 6 to to achieve a space-saving arrangement of the corresponding terminals of the positive pole and negative pole within the height extent of the inverter 1.
- the converter 1 according to the invention is - as in FIG FIG. 5 is shown - provided with the pressure frame 25 for additional contact pressure of the power module 3 on the heat sink 21 to ensure a full-surface concerns of the circuit board 6 on the heat sink 21.
- the pressure frame 25 is in this case in operative connection with the outer circumference of the printed circuit board 6 of the power module 3 and is provided with at least one corresponding, in particular a frame-like circumferential, retaining lug 26 which cooperates with the upper side of the printed circuit board 6 at its outer periphery.
- the retaining lug 26 on the frame-like pressure frame 25 may in this case be interrupted in the region of the three busbars 15 and of the busbars 35, 36.
- the screw 27 can continue - as in the FIGS. 1 . 2 and 5 is clarified - the lid 28 are attached to the pressure frame 25, which covers the inverter 1 upwards.
- the screw 27 are preferably arranged at the corner regions or the front and / or longitudinal sides of the frame-like encircling pressure frame 25, whereby with a small number of screw 27 and a correspondingly low installation costs, a circumferential compression of the circuit board 6 on the heat sink 21 and optionally one Attachment of the lid 28 is achieved.
- the converter 1 has a number of advantages. Due to the arrangement of the board 4 of the DC intermediate circuits 2 directly above the board 6 of the power module 3 and the use of surface mounted Solder pins 10a, 10b, 10c for electrical and mechanical connection of the power module 3 to the DC link 2, the distance of the power module 3 can be minimized by the DC link 2 in order to achieve an improved low-inductance structure with minimized leakage inductances.
- the solder pins 10a, 10b, 10c can be equipped fully automatically, whereby the monthly expenditure is reduced.
- the dual function of the solder pins 10a, 10b, 10c for mechanical and electrical connection of the DC intermediate circuit 2 with the power module 3 results in a simple and inexpensive construction.
- the bus bars 15 according to the invention which are fastened to the metal bodies 16a, 16b and fastened to the printed circuit board 6 via the metal bodies 16a, 16b and are electrically contacted with the printed circuit board 6, allow a space-saving and stable execution of the motor phase outlets with a low construction cost and installation effort.
- the electrically insulated fittings 20a, 20b and their dual function the motor phase outputs of the power module 3, which are formed by the busbars 15 and the metal bodies 16a, 16b, and the mechanical attachment of the power module 3 to the heat sink 21 with low manufacturing costs realized in a cost effective manner are still with a simple assembly is achieved.
- the arrangement of the busbars 15 above the board 4 of the DC voltage circuit 2 between the capacitors 5 of the DC intermediate circuit 2 allows a space-saving arrangement of the motor phase outlets with a small space requirement of the inverter 1 and facilitates the good accessibility of the fittings 20a, 20b, the assembly of the inverter 1 according to the invention further.
- About the pressure frame 25 is a simple circumferential contact pressure of the power module 3 on the heat sink 21 for effective cooling of the inverter 1 can be achieved.
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Abstract
Description
Die Erfindung betrifft einen Umrichter, insbesondere mehrphasiger Drehstromumrichter, mit einem Gleichspannungszwischenkreis und einem mindestens einen Leistungshalbleiter aufweisenden Leistungsmodul.The invention relates to a converter, in particular a multi-phase three-phase converter, having a DC voltage intermediate circuit and a power module having at least one power semiconductor.
Derartige mehrphasige Umrichter, beispielsweise dreiphasige Wechselrichter oder Frequenzumrichter, werden zur Speisung von elektrischen Antriebsmaschinen aus einer Gleichspannungsquelle verwendet. Eingesetzt werden derartige Umrichter beispielsweise als Frequenzumrichter, die aus einer Gleichspannungsquelle einen Fahrmotor, beispielsweise einen Asynchronmotor, eines mobilen elektrisch betriebenen Fahrzeugs, beispielsweise eines Flurförderzeugs, ansteuern.Such multiphase converters, for example, three-phase inverters or frequency converters, are used for feeding electric drive machines from a DC voltage source. Such inverters are used, for example, as frequency converters, which drive a traction motor, for example an asynchronous motor, of a mobile electrically operated vehicle, for example an industrial truck, from a DC voltage source.
Die Gleichspannung kann aus einer Batterie oder einem Generator als Gleichspannungsquelle bereitgestellt werden. Als Generator kann ein Gleichspannungsgenerator oder ein Drehstromgenerator eingesetzt werden, dessen erzeugter Drehstrom in einem Gleichrichter gleichgerichtet wird.The DC voltage can be provided from a battery or a generator as a DC voltage source. As a generator, a DC voltage generator or a three-phase generator can be used, whose generated three-phase current is rectified in a rectifier.
Ein gattungsgemäßer Umrichter ist aus der
Die Kontaktsicherheit von derartigen Druckkontaktaufbauten ist bei Dauer- oder Wechsellastbetrieb von entscheidender Bedeutung für die Funktionssicherheit. Bei Druckstücken kann durch Erlahmen der Druckkräfte eine Funktionsstörung des Umrichters auftreten.The contact reliability of such Druckkontaktaufbauten is in continuous or alternating load operation of crucial importance for reliability. In the case of pressure pieces, a malfunction of the converter can occur due to a reduction in the pressure forces.
Bei derartigen Umrichern ist als weitere Randbedingung ein möglichst induktivitätsarmer Aufbau erwünscht. Das Schalten der Leistungshalbleiter des Leistungsmoduls wird durch Streuinduktivität, die aus den Weglängen des mechanischen Aufbaus zwischen Gleichstromzwischenkreis und den Leistungshalbleitern des Leistungsmoduls resultieren, erschwert. Diese Streuinduktivität verschlechtert das Schaltverhalten der Leistungshalbleiter und kann zu Überspannungen, die zu einer Zerstörung der Leistungshalbleiter führen können, und erhöhten Schaltverlusten führen. Ursache ist die in der Streuinduktivität, durch großes di/dt erzeugte Selbstinduktionsspannung, welche sich der Zwischenkreisspannung überlagert und zu unzulässig hohen Spannungen und entsprechenden Spannungsspitzen an den Leistungshalbleitern führen kann.In such Umrichern is a possible low-inductance structure desired as a further constraint. The switching of the power semiconductors of the power module is made difficult by stray inductance resulting from the path lengths of the mechanical structure between the DC link and the power semiconductors of the power module. This stray inductance degrades the switching behavior of the power semiconductors and can lead to overvoltages, which can lead to a destruction of the power semiconductors, and increased switching losses. The cause is the self-induction voltage generated in the stray inductance due to large di / dt, which is superimposed on the intermediate circuit voltage and can lead to impermissibly high voltages and corresponding voltage peaks on the power semiconductors.
Aus der oben genannten
Aus der
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, einen Umrichter der eingangs genannten Gattung zur Verfügung zu stellen, dessen mechanischer Aufbau hinsichtlich der Streuinduktivität weiter verbessert ist und der einen kostengünstigen Aufbau mit geringem Montageaufwand und geringem Bauraumbedarf aufweist.The present invention has for its object to provide a converter of the type mentioned available, the mechanical structure is further improved in terms of leakage inductance and has a cost-effective design with low installation costs and low space requirement.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, dass der Gleichspannungszwischenkreis von einer plattenförmigen, mit zumindest einem Kondensator versehenen Platine und das Leistungsmodul von einer Leiterplatte gebildet sind, die in parallelen Ebenen direkt übereinander angeordnet sind, wobei die Leistungsstromanschlüsse des Leistungsmoduls von jeweils einer streifenförmigen Stromschiene gebildet sind, die an mindestens einem Metallkörper befestigt ist und über den Metallkörper mit der Leiterplatte elektrisch verbunden und an der Leiterplatte befestigt ist. Der Aufbau des Umrichters aus einer Platine des Gleichspannungszwischenkreises und einer Leiterplatte des Leistungsmoduls ergibt einen einfachen Aufbau mit wenigen Bauteilen, wobei die stromführenden Verbindungsleitungen von entsprechenden niederinduktiven Leiterbahnen in der Leiterplatte und der Platine mit kurzen Weglängen gebildet werden können. Durch die Anordnung der mit den Kondensatoren versehenen Platine des Zwischenkreises und der Leiterplatte des Leistungsmoduls direkt übereinander kann der Abstand zwischen dem Gleichspannungszwischenkreis und dem Leistungsmodul gegenüber bekannten Umrichteraufbauten weiter verringert werden und ein geringer Bauraumbedarf des erfindungsgemäßen Umrichters erzielt werden. Die von den streifenförmigen Stromschienen gebildeten Leistungsstromanschlüsse und somit die Motorphasenabgänge des Leistungsmoduls, die über mindestens einen Metallkörper mit der Leiterplatte elektrisch verbunden und an der Leiterplatte des Leistungsmoduls befestigt sind, ermöglichen bei einem geringen Bauaufwand und Montageaufwand eine stabile Ausführung der Motorphasenabgänge durch entsprechende Gestaltung der Stromschienen und eine einfache und stabile Befestigung der Stromschienen an der Leiterplatte des Leistungsmoduls, wodurch sich der Aufbau des Umrichters hinsichtlich einer kostengünstigen Bauweise und einer einfachen Montage weiter verbessern lässt. Die Leistungsstromanschlüsse des Leistungsmoduls und somit die Motorphasenabgänge können von derartigen streifenförmigen Stromschienen mit geringem Bauaufwand gebildet werden.This object is achieved in that the DC voltage intermediate circuit of a plate-shaped, provided with at least one capacitor board and the power module are formed by a printed circuit board, which are arranged directly above one another in parallel planes, wherein the power current terminals of the power module are each formed of a strip-shaped busbar fixed to at least one metal body and electrically connected to the circuit board via the metal body and fixed to the circuit board. The construction of the converter from a board of the DC intermediate circuit and a circuit board of the power module results in a simple structure with few components, wherein the current-carrying connection lines of corresponding low-inductive tracks in the circuit board and the board can be formed with short path lengths. By arranging the circuit board provided with the capacitors of the intermediate circuit and the circuit board of the power module directly above one another, the distance between the DC voltage intermediate circuit and the power module compared to known inverter assemblies can be further reduced and a small space requirement of the inverter according to the invention can be achieved. The power current connections formed by the strip-shaped busbars and thus the motor phase outlets of the power module, which are electrically connected via at least one metal body to the circuit board and fixed to the circuit board of the power module, allow for a low construction cost and installation effort a stable execution of the motor phase outlets by appropriate design of the busbars and a simple and stable mounting of the busbars to the circuit board of the power module, whereby the structure of the inverter in terms of a cost-effective design and ease of assembly can be further improved. The power current terminals of the power module and thus the motor phase outlets can be formed by such strip-shaped busbars with low construction costs.
Gemäß einer vorteilhaften Weiterbildung der Erfindung sind die Stromschienen oberhalb der Platine angeordnet und erstrecken sich die Metallkörper durch jeweils eine Ausnehmung der Platine. Hierdurch kann eine besonders platzsparende Anordnung der Stromschienen in einer weiteren parallelen Ebene oberhalb der Platine des Gleichspannungszwischenkreises erzielt werden.According to an advantageous embodiment of the invention, the busbars are arranged above the board and extend the metal body through a respective recess of the board. In this way, a particularly space-saving arrangement of the busbars in a further parallel plane above the board of the DC intermediate circuit can be achieved.
Bevorzugt sind hierbei die Stromschienen zwischen den Kondensatoren des Gleichspannungszwischenkreises angeordnet, die auf der Platine angeordnet sind, wodurch sich eine platzsparende und bauraumsparende Anordnung der Stromschienen innerhalb der Bauhöhe der Kondensatoren des Gleichspannungszwischenkreises erzielen lässt.Preferably, the busbars between the capacitors of the DC intermediate circuit are arranged, which are arranged on the board, whereby a space-saving and space-saving arrangement of the busbars can be achieved within the height of the capacitors of the DC intermediate circuit.
Gemäß einer vorteilhaften Weiterbildung der Erfindung ist die Stromschiene in einem seitlich neben der Platine angeordneten Bereich mit einem Anschluss, insbesondere einem Bolzen, für einen Leistungsstromabgriff versehen. Die Stromschienen der Leistungsstromanschlüsse können durch die Anordnung zwischen den Kondensatoren des Gleichstromzwischenkreises auf einfache Weise seitlich aus der Platine herausgeführt werden und in dem seitlich herausgeführten Bereich mit einem Anschluss als Motorphasenabgänge versehen werden. Hierdurch ergibt sich bei geringem Bauaufwand eine gute Zugänglichkeit für die Motorphasenabgänge, an denen entsprechende Motorkabel sicher und bei guter Zugänglichkeit angeschlossen werden können.According to an advantageous embodiment of the invention, the busbar is provided in a laterally arranged next to the board area with a connection, in particular a bolt, for a Leistungsstromabgriff. The busbars of the power current connections can be brought out laterally from the board by the arrangement between the capacitors of the DC intermediate circuit and be provided in the laterally led out area with a connection as Motorphasenabgänge. This results in low construction costs good accessibility for the motor phase outgoing, where appropriate motor cables can be connected safely and with good accessibility.
Hinsichtlich eines geringen Bauraumbedarfs sind weitere Vorteile erzielbar, wenn die Stromschiene im Bereich des Anschlusses in Richtung zu der Platine abgekröpft ist. Bei den oberhalb der Platine angeordneten Stromschienen kann durch eine entsprechende Abkröpfung nach unten in Richtung der Platine eine Anordnung der von den beispielsweise als Bolzen ausgebildeten Anschlüssen in bauraumsparender Weise innerhalb der Höhenerstreckung der auf der Platine angeordneten Kondensatoren erzielt werden.With regard to a small space requirement further advantages can be achieved if the busbar is bent in the region of the connection in the direction of the board. In the busbars arranged above the printed circuit board, by means of a corresponding downward bend in the direction of the printed circuit board, an arrangement of the capacitors formed, for example, in the form of a bolt can be achieved in a space-saving manner within the height extent of the capacitors arranged on the printed circuit board.
Der Metallkörper ist gemäß einer bevorzugten Ausführungsform als Hülse ausgebildet, wobei die Stromschiene mittels einer Verschraubung an der Hülse befestigt ist. Die Stromschienen werden somit mittels der Verschraubungen an der Hülse befestigt und auf die Hülsen gepresst, wodurch auf einfache und kostengünstige Weise eine elektrische Kontaktierung der Stromschienen mit den Hülsen und Befestigung der Stromschienen an den Hülsen erzielbar ist. Durch die Anordnung der Stromschienen oberhalb der Platine des Gleichspannungszwischenkreises wird hierbei eine gute Zugänglichkeit der Verschraubungen für eine einfache Montage der Stromschienen erzielt.The metal body is formed according to a preferred embodiment as a sleeve, wherein the bus bar is fastened by means of a screw on the sleeve. The busbars are thus fastened by means of the screw on the sleeve and pressed onto the sleeves, which in a simple and cost-effective manner electrical contacting of the busbars with the sleeves and attachment of the busbars on the sleeves can be achieved. The arrangement of the busbars above the board of the DC intermediate circuit here a good accessibility of the fittings for a simple mounting of the busbars is achieved.
Der Metallkörper kann hierbei zur elektrischen Kontaktierung mit den stromführenden Leiterbahnen der Leiterplatte des Leistungsmoduls verlötet sein. Eine Lötverbindung ermöglicht mit geringem Herstellungsaufwand eine elektrische Kontaktierung der Metallkörper mit der Leiterplatte des Leistungsmoduls und eine Befestigung der Metallkörper auf der Leiterplatte.The metal body can in this case be soldered for electrical contacting with the current-carrying conductor tracks of the circuit board of the power module. A solder joint allows with low production costs, an electrical contacting of the metal body with the circuit board of the power module and an attachment of the metal body on the circuit board.
Hinsichtlich eines geringen Bauaufwandes und eines einfachen Aufbaus ergeben sich Vorteile, wenn der von einer Hülse gebildete Metallkörper gemäß einer bevorzugten Ausgestaltungsform der Erfindung mittels der Verschraubungen mit der Leiterplatte des Leistungsmoduls verpressbar ist. Hierdurch kann von der bereits vorhandenen Verschraubung zur Befestigung der Stromschiene an der Hülse ebenfalls die Hülse an der Leiterplatte befestigt und mit der Leiterplatte elektrisch kontaktiert werden.With regard to a low construction cost and a simple structure, there are advantages if the metal body formed by a sleeve according to a preferred embodiment of the invention by means of the screw with the circuit board of the power module is compressible. As a result, the sleeve can also be fastened to the printed circuit board by the existing screw connection for fastening the busbar to the sleeve and can be electrically contacted with the printed circuit board.
Die Kühlung der Leistungshalbleiter des Leistungsmoduls kann auf einfache Weise sichergestellt werden, wenn gemäß einer vorteilhaften Weiterbildung der Erfindung die Leiterplatte mit einer der Platine gegenüberliegenden Unterseite an einem Kühlkörper anliegt.The cooling of the power semiconductor of the power module can be ensured in a simple manner, if, according to an advantageous embodiment of the invention, the circuit board rests with a bottom side opposite the board to a heat sink.
Ein besonders einfacher Aufbau mit einem geringen Montageaufwand des erfindungsgemäßen Umrichters ist hierbei erzielbar, wenn die Verschraubung als elektrisch isolierter Verschraubungen ausgebildet ist und die Leiterplatte des Leistungsmoduls gemäß einer bevorzugten Ausgestaltungsform der Erfindung mittels der Verschraubung an dem Kühlkörper befestigbar ist. Die elektrisch isolierten Verschraubungen erfüllen somit eine Doppelfunktion und dienen einerseits zur Befestigung der Stromschienen an den Hülsen und somit zur elektrischen Kontaktierung der Stromschienen sowie gegebenenfalls weiterhin zur elektrischen Kontaktierung der Leiterplatte mit den Hülsen und somit zur elektrischen Kontaktierung der Hülsen mit der Leiterplatte des Leistungsmoduls und andererseits zur mechanischen Befestigung der Leiterplatte auf dem Kühlkörper. Durch diese Doppelfunktion der Verschraubungen sind keine zusätzlichen Befestigungsmittel zur Befestigung des Leistungsmoduls an dem Kühlkörper erforderlich. Mit den Verschraubungen lassen sich die Befestigung und elektrische Kontaktierung der Stromschienen und die Befestigung des Leistungsmoduls an dem Kühlkörper in kostengünstiger Weise bei geringem Montageaufwand und platzsparend realisieren.A particularly simple structure with a low installation cost of the converter according to the invention is in this case achieved when the screw is designed as electrically insulated fittings and the circuit board of the power module according to a preferred embodiment of the invention by means of the screw on the heat sink can be fastened. The electrically insulated fittings thus fulfill a dual function and serve on the one hand for fastening the busbars to the sleeves and thus to the electrical Contacting the busbars and optionally further for electrical contacting of the circuit board with the sleeves and thus for electrical contacting of the sleeves with the circuit board of the power module and on the other hand for mechanical attachment of the circuit board on the heat sink. By this dual function of the glands no additional fastening means for mounting the power module to the heat sink are required. With the glands, the attachment and electrical contacting of the busbars and the attachment of the power module to the heat sink can be realized in a cost effective manner with low installation costs and space.
Das Leistungsmodul erwärmt sich aufgrund der Abwärme der Leistungshalbleiter, wodurch ein Bi-Metall-Effekt auftritt, der zu einem Abheben der Leiterplatte vom Kühlkörper führen kann. Um ein derartiges Abheben des Leistungsmoduls von dem Kühlkörper zu vermeiden, ist gemäß einer vorteilhaften Weiterbildung der Erfindung zur Anpressung der Leiterplatte an dem Kühlkörper ein Druckrahmen vorgesehen.The power module heats up due to the waste heat of the power semiconductors, whereby a bi-metal effect occurs, which can lead to a lifting of the circuit board from the heat sink. In order to avoid such a lifting of the power module of the heat sink, a pressure frame is provided according to an advantageous embodiment of the invention for pressing the circuit board to the heat sink.
Bevorzugt steht der Druckrahmen mit dem Umfang der Leiterplatte in Wirkverbindung, wodurch bei dem erfindungsgemäßen Umrichter, bei dem die Leiterplatte des Leitungsmoduls über die Verschraubungen der zwischen den Kondensatoren des Gleichspannungszwischenkreises angeordneten Stromschienen am Kühlkörper befestigt ist, ein Abheben der Leiterplatte des Leistungsmoduls am Außenumfang sicher vermieden werden kann und somit eine wirksame Kühlung erzielt werden kann.Preferably, the printing frame is in operative connection with the circumference of the printed circuit board, which reliably prevents lifting of the printed circuit board of the power module on the outer circumference in the inverter according to the invention, in which the printed circuit board of the line module is fastened to the heat sink via the screw connections of the busbars arranged between the capacitors of the DC intermediate circuit can be and thus an effective cooling can be achieved.
Der Druckrahmen ist gemäß einer bevorzugten Ausführungsform der Erfindung mittels mindestens einer Schraubverbindung an dem Kühlkörper befestigbar, wodurch mit geringem zusätzlichem Montageaufwand und Bauaufwand eine Befestigung des Druckrahmens an dem Kühlkörper und somit eine umfangsseitige Anpressung des Leistungsmoduls an dem Kühlkörper erzielt wird.The pressure frame is fastened according to a preferred embodiment of the invention by means of at least one screw on the heat sink, whereby attachment of the pressure frame to the heat sink and thus a peripheral contact pressure of the power module is achieved on the heat sink with little additional installation effort and construction costs.
Bevorzugt ist ein den Umrichter abdeckender Deckel vorgesehen, der mittels der Schraubverbindung an dem Druckrahmen befestigbar ist. Die Schraubverbindung des Druckrahmens erfüllt somit ebenfalls eine Doppelfunktion zur Befestigung des Druckrahmens an dem Kühlkörper und zur Befestigung des Deckels an dem Druckrahmen, so dass sich der Montageaufwand und der Bauaufwand weiter verringern lassen.Preferably, a cover covering the inverter is provided which can be fastened to the printing frame by means of the screw connection. The screw of the printing frame thus also fulfills a dual function for attaching the printing frame to the heat sink and for attaching the lid to the printing frame, so that can reduce the installation effort and construction costs on.
Die Platine des Gleichspannungszwischenkreises und die Leiterplatte des Leistungsmoduls kann über eine Druckkontaktierung elektrisch verbunden sein, die beispielsweise von entsprechenden federbelasteten bzw. verklemmten oder verschraubten Druckstücken gebildet ist. Besondere Vorteile sind bei dem erfindungsgemäßen Umrichter erzielbar, wenn die Platine des Gleichspannungszwischenkreises und die Leiterplatte des Leistungsmoduls mittels Lötstiften elektrisch und mechanisch miteinander verbunden sind. Die Lötstifte weisen bei dem erfindungsgemäßen Umrichter eine Doppelfunktion auf und dienen neben der elektrischen Kontaktierung der Platine des Zwischenkreises mit der Leiterplatte des Leistungsmoduls weiterhin zur mechanischen Befestigung der Platine des Zwischenkreises an der Leiterplatte des Leistungsmoduls. Die Lötstifte sind zumindest mit der Platine des Gleichspannungszwischenkreises und/oder der Leiterplatte des Leistungsmoduls verlötet. Die Leiterplatte des Leistungsmoduls und die Platine des Gleichspannungszwischenkreises können somit als Vormontagebaugruppe ausgebildet werden. Hierdurch wird ein einfacher und kostengünstiger Aufbau ohne zusätzliche Befestigungsmittel erzielt und eine einfache Montage des erfindungsgemäßen Umrichters erzielt. Durch die Anordnung der Platine des Zwischenkreises und der Leiterplatte des Leistungsmoduls direkt übereinander und der Verwendung der Lötstifte zur mechanischen und elektrischen Verbindung kann der Abstand zwischen dem Gleichspannungszwischenkreis und dem Leistungsmodul gegenüber bekannten Umrichteraufbauten weiter verringert werden. Im Gegensatz zu einer Druckkontaktierung ist die Kontaktierung mittels Lötstiften im Dauer- oder Wechsellastbetrieb, vor allem im thermischen Wechsellastbetrieb, über die Lebensdauer des Umrichters funktionssicher. Zudem kann der für die Streuinduktivitäten verantwortliche Abstand zwischen der Platine des Gleichspannungszwischenkreises und der Leiterplatte des Leistungsmoduls durch die Verwendung von Lötstiften zur Kontaktierung im Vergleich zu einer Druckkontaktierung mit Druckstücken weiter minimiert werden. Darüber hinaus weisen Lötstifte einen einfachen Aufbau mit geringem Herstellaufwand auf und können auf einfache Weise an der Oberseite der Leiterplatte des Leistungsmoduls bzw. an der Unterseite der Platine des Gleichspannungszwischenkreises montiert werden, insbesondere vollautomatisch bestückt werden, wodurch der Herstellaufwand und die Montage des erfindungsgemäßen Umrichters vereinfacht wird.The board of the DC intermediate circuit and the circuit board of the power module can be electrically connected via a pressure contact, which is formed for example by corresponding spring-loaded or jammed or screwed pressure pieces. Particular advantages can be achieved in the converter according to the invention, when the board of the DC intermediate circuit and the circuit board of the power module are electrically and mechanically connected to each other by means of solder pins. The solder pins have a dual function in the inverter according to the invention and are used in addition to the electrical contacting of the circuit board of the DC link with the circuit board of the power module for mechanical attachment of the circuit board of the DC link to the circuit board of the power module. The solder pins are soldered at least to the board of the DC intermediate circuit and / or the circuit board of the power module. The circuit board of the power module and the board of the DC intermediate circuit can thus be formed as a pre-assembly. As a result, a simple and inexpensive construction without additional fastening means is achieved and achieved a simple assembly of the inverter according to the invention. The arrangement of the circuit board of the intermediate circuit and the circuit board of the power module directly above each other and the use of the solder pins for mechanical and electrical connection, the distance between the DC link and the power module over known inverter assemblies can be further reduced. In contrast to a pressure contact, the contacting by means of solder pins in continuous or alternating load operation, especially in thermal alternating load operation, over the life of the inverter is reliable. In addition, the distance between the board of the DC intermediate circuit and the circuit board of the power module, which is responsible for the stray inductances, can be further minimized by the use of solder pins for contacting in comparison to pressure contacting with pressure pieces. In addition, solder pins have a simple structure with low manufacturing costs and can be mounted in a simple manner on the top of the circuit board of the power module or on the underside of the board of the DC intermediate circuit, in particular fully automatically equipped, thereby simplifying the manufacturing effort and assembly of the inverter according to the invention becomes.
Hinsichtlich eines einfachen Bauaufwandes und einer einfachen Montage ergeben sich Vorteile, wenn die Lötstifte gemäß einer bevorzugten Ausgestaltungsform der Erfindung an der der Platine zugewandten Oberseite der Leiterplatte montiert sind und sich durch Aufnahmebohrungen der Platine erstrecken, wobei die Lötstifte einen Durchmesserabsatz zur Halterung der Platine aufweisen. Die Lötstifte können hierbei mit der Leiterplatte verlötet oder verpresst sein, um mit den stromführenden Leiterbahnen der Leiterplatte des Leitungsmoduls kontaktiert zu werden. Der Durchmesserabsatz an den Lötstiften ermöglicht hierbei eine einfache Montage und Befestigung der Platine des Gleichspannungszwischenkreises, da die Platine des Gleichspannungszwischenkreises mit den Aufnahmebohrungen auf einfache Weise auf die Lötstifte aufgesteckt und gehaltert werden kann.With regard to a simple construction effort and a simple assembly, there are advantages if the solder pins are mounted according to a preferred embodiment of the invention on the circuit board facing top of the circuit board and extending through receiving holes of the board, the solder pins have a diameter paragraph for holding the board. In this case, the soldering pins can be soldered or pressed to the printed circuit board in order to be contacted with the current-carrying printed conductors of the printed circuit board of the line module. The diameter paragraph on the solder pins in this case allows easy installation and attachment of the board of the DC intermediate circuit, since the board of the DC intermediate circuit can be plugged with the mounting holes in a simple manner on the solder pins and supported.
Die Leiterplatte ist gemäß einer bevorzugten Ausführungsform der Erfindung als IMS-(Insulated-Metal-Substrate) Leiterplatte ausgebildet, die mit den Leistungshalbleitern bestückt ist. Bei einer derartigen IMS-Leiterplatte können die stromführenden Leiterbahnen zur Verbindung der Lötstifte mit Anschlüssen der Leistungshalbleiter induktionsarm geführt werden und als Dickschichtmetallbahnen für den Wärmeabtransport genutzt werden. Zudem kann eine derartige IMS-Leiterplatte auf einfache Weise mit den Leistungshalbleitern und weiteren diskreten Bauelementen sowie den Lötstiften bestückt werden.The printed circuit board is formed according to a preferred embodiment of the invention as an IMS (insulated metal substrates) printed circuit board, which is equipped with the power semiconductors. In such an IMS printed circuit board, the current-carrying conductor tracks for connecting the solder pins to terminals of the power semiconductors can be guided with low induction and used as thick-film metal tracks for heat dissipation. In addition, such an IMS circuit board can be easily equipped with the power semiconductors and other discrete components and the solder pins.
Weitere Vorteile und Einzelheiten der Erfindung werden anhand der in den schematischen Figuren dargestellten Ausführungsbeispiele näher erläutert. Hierbei zeigt
Figur 1- eine perspektivische Explosionsdarstellung des erfindungsgemäßen Umrichters,
Figur 2- den Umrichter in einer weiteren Explosionsdarstellung,
Figur 3- einen Schnitt entlang der Linie A-A der
Figur 1 , Figur 4- einen Schnitt entlang der Line
B-B der Figur 1 mit angebauter Stromschiene und Kühlkörper und Figur 5- eine Detailansicht des Umrichters mit einem umfangsseitig angeordneten Druckrahmen.
- FIG. 1
- an exploded perspective view of the inverter according to the invention,
- FIG. 2
- the inverter in a further exploded view,
- FIG. 3
- a section along the line AA the
FIG. 1 . - FIG. 4
- a section along the line BB the
FIG. 1 with mounted busbar and heat sink and - FIG. 5
- a detailed view of the inverter with a circumferentially arranged print frame.
In den
Der Umrichter 1 weist einen Gleichspannungszwischenkreis 2 und ein Leistungsmodul 3 auf. Der Gleichspannungszwischenkreis 2 ist von einer plattenförmigen Platine 4 gebildet, die mit Kondensatoren 5 versehen ist. Das Leistungsmodul 3 ist von einer Leiterplatte 6, bevorzugt einer IMS-Leiterplatte, gebildet, die mit Leistungshalbleitern 7, beispielsweise Leistungstransistoren, und weiteren diskreten Bauteilen bestückt ist.The
Der erfindungsgemäße Umrichter 1 weist einen Aufbau mit drei identischen Halbbrücken H1, H2, H3 auf, die jeweils von mehreren Leitungshalbleitern 7 gebildet werden können.The
Die Leistungshalbleiter 7 des Leistungsmoduls 3 sind jeweils mit einem Minuspol und einem Pluspol des Gleichspannungszwischenkreises 2 verbunden. Die Leistungshalbleiter 7 einer Halbbrücke H1 bzw. H2 bzw. H3 sind jeweils zu einem der drei stromführenden Motorphasenausgänge zusammengeschlossen.The
Bei dem erfindungsgemäßen Umrichter 1 sind die Platine 4 des Gleichspannungszwischenkreises 2 und die Leiterplatte 6 des Leistungsmoduls 3 sandwichartig übereinander angeordnet, wobei die Platine 4 des Gleichspannungszwischenkreises 2 direkt oberhalb der Leiterplatte 6 des Leistungsmoduls 3 in einer weiteren parallelen Ebene angeordnet ist. Zur elektrischen Kontaktierung und mechanischen Verbindung des Gleichspannungszwischenkreises 2 und des Leistungsmoduls 3 sind mehrere oberflächenmontierte Lötstifte 10a, 10b, 10c vorgesehen.In the
In den
Wie aus der
Zur elektrischen Kontaktierung einer Steuerleitung der Leistungshalbleiter 7 in der Leiterplatte 6 des Leistungsmoduls 3 können nicht näher dargestellte Steckverbindungen vorgesehen werden.For electrical contacting of a control line of the
Die Lötstifte 10a, 10b, 10c sind an der Oberseite der Leiterplatte 6 des Leistungsmodul 3 angeordnet und in der Leiterplatte 6 bestückt, bevorzugt mit der Leiterplatte 6 verlötet, wodurch diese mit entsprechenden stromführenden Leiterbahnen der Platine 6 elektrisch kontaktiert sind und an der Leiterplatte 6 befestigt sind. Die Lötstifte 10a, 10b, 10c weisen am oberen Ende einen Durchmesserabsatz 11 auf, wobei sich die Lötstifte 10a, 10b, 10c mit dem verringerten Durchmesser durch eine an den Durchmesser der Lötstifte angepasste Aufnahmebohrung 12 der Platine 4 des Gleichspannungszwischenkreises 2 erstrecken. Hierdurch kann die Platine 4 mit geringem Montageaufwand auf die oberflächenmontierten Lötstifte 10a, 10b, 10c mit den Aufnahmebohrungen 12 aufgesteckt werden und an den Durchmesserabsätzen 11 der Lötstifte 10a, 10b, 10c im Abstand zu der Leiterplatte 6 gehalten werden. Durch Verlöten der Lötstifte 10a, 10b, 10c mit entsprechenden Leiterbahnen der Platine 4 des Gleichstromzwischenkreises 2 kann die elektrische Kontaktierung der Lötstifte 10a, 10b, 10c mit der Platine 4 und die mechanische Verbindung der Platine 4 mit der Leiterplatte 6 auf einfache Weise hergestellt werden.The solder pins 10a, 10b, 10c are arranged at the top of the
Die drei Phasenabgänge der Motorphasen und somit die Leistungsstromanschlüsse des erfindungsgemäßen Umrichters 1 werden - wie aus der
Die von einem flachstahlförmigen, beispielsweise Kupfer- oder Stahlbauteil, gebildete Stromschiene 15 ist bei dem erfindungsgemäßen Umrichter 1 oberhalb der Platine 4 des Gleichspannungszwischenkreises 2 in einer weiteren parallelen Ebene angeordnet und steht mittels mindestens eines von einer Hülse gebildeten elektrisch leitenden Metallkörpers 16a, 16b mit den Ausgängen der zugeordneten Leistungshalbleiter 7 der entsprechenden Halbbrücke H1, H2 bzw. H3 in Verbindung. Die Stromschienen 15 sind hierbei innerhalb der Höhenerstreckung der Kondensatoren 5 des Gleichspannungszwischenkreises 2 angeordnet.The
Die Platine 4 des Gleichspannungszwischenkreises 2 ist zur isolierenden Durchführung der Metallkörper 16a, 16b mit jeweils einer entsprechenden bohrungsförmigen Ausnehmung 17 versehen, deren Durchmesser größer als der Außendurchmesser der Hülsen ist. Die von den Hülsen gebildeten Metallkörper 16a, 16b stehen hierbei mit der unteren Stirnseite mit stromführenden Leiterbahnen der Leiterplatte 6 des Leistungsmoduls 3 in Kontakt. Auf die obere Stirnseite der von den Hülsen gebildeten Metallkörper 16a, 16b ist die entsprechende Stromschiene 15 aufgesetzt.The
Wie in Verbindung mit der
In dem seitlich herausgeführten Bereich ist die Stromschiene 15 nach unten in Richtung der Platine 4 und der Leiterplatte 6 abgekröpft, um eine platzsparende Anordnung der Anschlüsse 18 innerhalb der Höhenerstreckung des Umrichters 1 zu erzielen.In the laterally led out area, the
Zur Befestigung der Stromschiene 15 auf den Metallkörpern 16a, 16b ist jeweils eine Verschraubung 20a, 20b vorgesehen, mit der die Stromschiene 15 an den Metallkörpern 16a, 16b befestigt und elektrisch kontaktiert wird. Die Metallkörper 16a, 16b sind hierbei bevorzugt mit der Leiterplatte 6 des Leistungsmoduls 3 verlötet. Die Verschraubung 20a, 20b ist hierbei in einer Aufnahmebohrung der Hülse konzentrisch zu der Hülse angeordnet.For fastening the
In der
Bei dem erfindungsgemäßen Umrichter 1 weisen die Verschraubungen 20a, 20b eine Doppelfunktion auf und dienen neben der Verpressung der Stromschienen 15 mit den Metallkörpern 16a, 16b und somit der Funktion Befestigung der Stromschienen 15 und elektrischer Kontaktierung der Motorphasenabgänge weiterhin zur Funktion Befestigung und Verpressung des Leistungsmoduls 3 auf dem Kühlkörper 21.In the
Die Verschraubungen 20a, 20b sind hierbei jeweils von elektrisch isolierten Schrauben gebildet, die sich durch die von den Hülsen gebildeten Metallkörper 16a, 16b erstrecken und in entsprechende Gewindeaufnahmen 22a, 22b des Kühlkörpers 21 eingeschraubt werden können. Zur Isolation der Verschraubungen 20a, 20b ist jede Verschraubung 20a, 20b mit einer Isolationshülse 23a, 23b versehen, die zwischen dem Schraubenkopf der Verschraubung 20a, 20b und der Oberseite der Stromschiene 15 eingespannt ist und sich nach unten in die Hülse erstreckt, um den Schraubenkopf und den Schraubenschaft der Verschraubung 20a, 20b gegenüber der Stromschiene 15 und dem entsprechenden Metallkörper 16a bzw. 16b elektrisch zu isolieren.The screw connections 20a, 20b are in each case formed by electrically insulated screws which extend through the
Durch das Verschrauben der Verschraubungen 20a, 20b in dem Kühlkörper 21 können weiterhin von den Verschraubungen 20a, 20b die Metallkörper 16a, 16b mit der unteren Stirnseite an die stromführenden Leiterbahnen der Leiterplatte 6 alternativ zu einer Lötverbindung gepresst werden, wodurch von den Verschraubungen 20a, 20b zusätzlich die elektrische Kontaktierung der Metallkörper 16a 16b mit der Leiterplatte 6 des Leistungsmoduls 3 und somit die elektrische Kontaktierung der Motorphasenabgänge erzielt wird.By screwing the screw 20a, 20b in the
Wie aus der
Durch die Verschraubungen 20a, 20b und die von den Hülsen gebildeten Metallkörper 16a, 16b kann eine flächige Verpressung der Leiterplatte 6 auf den Kühlkörper 21 um den Bereich der Hülsen im inneren Bereich der Leiterplatte 6 erzielt werden. Um bei einer Erwärmung des Leistungsmoduls 3 ein Abheben des Leiterplatte 6 von dem Kühlkörper 21 zu vermeiden, ist der erfindungsgemäße Umrichter 1 - wie in der
Über die Schraubverbindungen 27 kann weiterhin - wie in den
Der erfindungsgemäße Umrichter 1 weist eine Reihe von Vorteilen auf. Durch die Anordnung der Platine 4 des Gleichspannungszwischenkreise 2 direkt oberhalb der Platine 6 des Leistungsmoduls 3 und die Verwendung von oberflächenmontierten Lötstiften 10a, 10b,10c zur elektrischen und mechanischen Verbindung des Leistungsmoduls 3 mit dem Gleichspannungszwischenkreis 2 kann der Abstand des Leistungsmoduls 3 von dem Gleichspannungszwischenkreis 2 minimiert werden, um einen verbesserten induktionsarmen Aufbau mit minimierten Streuinduktivitäten zu erzielen. Die Lötstifte 10a, 10b, 10c können vollautomatisch bestückt werden, wodurch der Monatageaufwand vermindert wird. Die Doppelfunktion der Lötstifte 10a, 10b, 10c zur mechanischen und elektrischen Verbindung des Gleichspannungszwischenkreises 2 mit dem Leistungsmodul 3 ergibt einen einfachen und kostengünstigen Aufbau. Die erfindungsgemäßen Stromschienen 15, die an den Metallkörpern 16a, 16b befestigt und über die Metallkörper 16a, 16b an der Leiterplatte 6 befestigt und mit der Leiterplatte 6 elektrisch kontaktiert sind, ermöglich eine platzsparende und stabile Ausführung der Motorphasenabgänge bei einem geringen Bauaufwand und Montageaufwand. Durch die elektrisch isolierten Verschraubungen 20a, 20b und deren Doppelfunktion können die Motorphasenabgänge des Leistungsmoduls 3, die von den Stromschienen 15 und den Metallkörpern 16a, 16b gebildet werden, und die mechanische Befestigung des Leistungsmoduls 3 an dem Kühlkörper 21 mit geringem Herstellaufwand in kostengünstiger Weise realisiert werden, wobei weiterhin eine einfache Montage erzielt wird. Die Anordnung der Stromschienen 15 oberhalb der Platine 4 des Gleichspannungskreises 2 zwischen den Kondensatoren 5 des Gleichspannungszwischenkreises 2 ermöglicht eine platzsparende Anordnung der Motorphasenabgänge mit einem geringen Bauraumbedarf des erfindungsgemäßen Umrichters 1 und erleichtert über die gute Zugänglichkeit der Verschraubungen 20a, 20b die Montage des erfindungsgemäßen Umrichters 1 weiter. Gleiches gilt für die Anordnung und Befestigung der den Pluspol und den Minuspol bildenden Stromschienen 35, 36. Über den Druckrahmen 25 ist eine einfache umfangsseitige Anpressung des Leistungsmoduls 3 an dem Kühlkörper 21 zur wirksamen Kühlung des Umrichters 1 erzielbar. In Verbindung mit den im inneren Bereich der Leiterplatte 6 angeordneten Verschraubungen 20a, 20b kann mit dem Druckrahmen 25 eine vollflächiges Anliegen der Leiterplatte 6 auf dem Kühlkörper 21 erzielt werden und ein Abheben der Leiterplatte 6 von dem Kühlkörper 21 verhindert werden. Über die Schraubverbindungen 27 des Druckrahmens 25 kann weiterhin ein den Umrichter 1 abdeckender Deckel 28 auf einfache Weise an dem Druckrahmen 25 befestigt werden. Durch den erfindungsgemäßen mechanischen Aufbau des Umrichters 1 können einfache und kostengünstige Löttechnologien verwendet werden, wodurch die Herstellung weiter vereinfacht und verbilligt wird.The
Claims (17)
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DE102009053998A DE102009053998A1 (en) | 2009-11-19 | 2009-11-19 | Inverter, in particular multi-phase three-phase converter |
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EP2328392A2 true EP2328392A2 (en) | 2011-06-01 |
EP2328392A3 EP2328392A3 (en) | 2011-11-30 |
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US11777235B2 (en) | 2018-12-21 | 2023-10-03 | Safran Electrical & Power | Electrical distribution module comprising pedestals jointly supporting power bars and power components |
CN109862694A (en) * | 2019-01-28 | 2019-06-07 | 四川富肯斯科技有限公司 | A kind of high power high density DC converter plate |
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Also Published As
Publication number | Publication date |
---|---|
EP2328392A3 (en) | 2011-11-30 |
DE102009053998A1 (en) | 2011-05-26 |
EP2328392B1 (en) | 2013-06-05 |
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