EP2300835A1 - Messsonde - Google Patents
MesssondeInfo
- Publication number
- EP2300835A1 EP2300835A1 EP09776813A EP09776813A EP2300835A1 EP 2300835 A1 EP2300835 A1 EP 2300835A1 EP 09776813 A EP09776813 A EP 09776813A EP 09776813 A EP09776813 A EP 09776813A EP 2300835 A1 EP2300835 A1 EP 2300835A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- signal
- coupling structure
- probe
- measuring probe
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0878—Sensors; antennas; probes; detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/07—Non contact-making probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
- G01R31/002—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing where the device under test is an electronic circuit
Definitions
- the present invention relates to a measuring probe, in particular for a contactless vector network analysis system, comprising a housing and at least one coupling structure arranged on the housing, which is designed for coupling out an HF signal from a signal line, according to the preamble of claim 1.
- EMC electromagnetic compatibility
- H. Whiteside, RWP King "The loop antenna as a probe”
- IEEE Transaction on Antenna and Propagation Vol. No. 3, pp. 291-297, May 1964
- M. Kanda "An electromagnetic near-field sensor for simultaneous electric and magnetic-field measurements”
- IEEE Transaction on Electromagnetic Compatibility Vol. 26, No. 3, pp. 102-110, August 1984, or MEG Upton, AC Marvin, " Improvements to an electromagnetic near-field sensor for simultaneous electric and magnetic field measurements, "IEEE Transaction on Electromagnetic Compatibility, Vol. 35, No. 1, pp. 96-98, February 1993.
- a directional coupler is a four-port, which usually consists of two interconnected lines has the task of separating the waves flowing back and forth on a pipe.
- a possible coupling structure for separating the traveling and returning waves is the loop-directional coupler, which PP Lombardini, RF Schwartz, PJ Kelly, "Criteria for the design of loop-type Directional couplers for the L band" IEEE Transaction on Microwave Theory and Techniques, Vol 4, No. 4, pp. 234-239, October 1956 and B. Mower, "An L-band loop-type coupler” IEEE Transactions on Microwave Theory and Techniques, Vol. 9, No. 4, pp. 362-363, July 1961 describe.
- One Loop-wise coupler consists of a conductor loop which is positioned over or in a waveguide. In this case, any waveguide such as hollow lines, planar strip lines or coaxial cables can be used.
- Schleifenrichtkopplers The application of a Schleifenrichtkopplers is varied. For example, F. De Groote et al. in 2005 (loc. cit.) and Yhland et al. 2006 (loc. Cit.) A loop-wise coupler as a component in a contactless measuring system.
- the probes are in electromagnetic
- Coupling structures are either the current and / or the voltage of a
- Signal line which is connected directly to the test object determined.
- the waves traveling back and forth on the signal line are also measured, with directional couplers, in particular loop-wise couplers, being used as coupling structures for separating the two waves.
- directional couplers in particular loop-wise couplers, being used as coupling structures for separating the two waves.
- conventional calibration methods such as TRL (G.F.
- At least one measuring probe for example a conductor loop or two capacitive probes, is required for each test port of an unknown test object (DUT).
- DUT unknown test object
- contactless conductor loops made of coaxial semi-rigid leads are used (see F. De Groote, J. Verspecht, C. Tsironis, D. Barataud and J.-P.
- contactless vector network analysis has the potential to characterize components without contact, no contactless scatter parameter measurement has been performed by RF and microwave components embedded within a circuit. So far, the positions of the contactless probes have not been changed during and after the calibration, which is necessary, however, when measuring within a circuit.
- a pseudo-contactless measurement were described in T. Zelder, B. Geck, M. Wollitzer, I. Rolfes, and H. EuI, "Contactless network analysis system for the calibrated measurement of the scattering parameters of planar two-port devices ", Proceedings of the 37th European Microwave Conference, Kunststoff, Germany, pp. 246-249, October 2007.
- a pseudo-contactless measurement means that printed coupling structures are used instead of completely contactless probes.
- two contactless loop probes are connected to two measuring points each of a vectorial network analyzer.
- the probes are positioned bilaterally in the near field of the DUT's leads to characterize a DUT (Devide Under Test) embedded between multiple devices.
- DUT Demo Under Test
- Scattering parameters measure the return waves of the DUT in two different states.
- a network analyzer has a toggle switch so that the signal can be put into the circuit once from the left or right. Be for both
- Switch position I see Fig. 3
- he has a very high input resistance
- Switch 54 as usual in the contactless vector network analysis, instead of interconnected as shown in Fig. 3 with the planar line 16 at the positions 36 and 46, then results only for the switch position I evaluable results.
- the invention has for its object to provide a probe of o.g. To improve the type of measurement accuracy and application spectrum.
- At least one signal probe for coupling an electrical signal is arranged in the signal line.
- the signal probe is expediently designed as a contactless conductor loop or as a measuring tip electrically and mechanically contacting the signal line, wherein the measuring tip is arranged and configured such that the coupling structure is located at least in the near field of the signal line or electrically and mechanically contacts the signal line when the measuring tip Signal line electrically and mechanically contacted.
- the contactless signal probe is designed as a purely inductive, purely capacitive or combined inductive and capacitive probe.
- the coupling structure is designed as a contactless conductor loop or as a measuring tip electrically and mechanically contacting the signal line.
- the contactless coupling structure is designed as a purely inductive, purely capacitive or combined inductive and capacitive probe.
- a ground contact of the coupling structure and the signal probe are electrically connected together.
- the coupling structure is impedance-controlled, a high directivity and a high input impedance is achieved and less sheath waves are generated, whereby the probe also analytically better describable and the cutoff frequency is higher than in non-impedance-controlled probes.
- an electrical signal amplifier is arranged in an input path of the signal probe and / or in an output path of the coupling structure.
- the signal probe and / or the coupling structure is / is subjected to a DC voltage.
- the housing is made of a metallic material, an absorber material and / or a plastic.
- the housing is sheathed with an absorber material.
- a device for determining a distance of the coupling structure from the signal conductor is additionally provided.
- the device for determining the distance comprises an optical, electrical, mechanical and / or electromechanical distance sensor.
- a device for determining a position of the probe in space is additionally provided.
- the device for determining a position of the measuring probe in space is an image sensor.
- the measuring probe additionally has at least one positioning device for positioning it in space, so that the measuring probe can be displaced in at least one spatial direction.
- the positioning device has, for example, at least one positioning motor, in particular a stepping motor, and is preferably arranged on the housing.
- the measuring probe for the coupling structure and the signal probe each have a separate positioning device.
- FIG. 1 shows a schematic representation of a preferred embodiment of a measuring probe according to the invention in a measuring setup
- Fig. 2 is a plan view of the preferred embodiment of FIG. 1 and Fig. 3 is a schematic representation of a measurement setup with a vectorial network analyzer (VNA).
- VNA vectorial network analyzer
- FIGS. 1 and 2 preferred embodiment of a probe according to the invention comprises a housing 10, a coupling structure 12 in the form of a contactless loop or loop probe and a signal probe 14 in the form of a signal line 16 electrically and mechanically contacting probe tip.
- the coupling structure 12 is formed with a first port 18 and a second port 20, which form an output path, such that it decouples an electrical signal from the signal line 16.
- the signal probe 14 is formed with an input 22 such that it couples an electrical signal into the signal line 16.
- the signal probe 14 is arranged and configured in such a way that the coupling structure 12 is in the near field of the signal line 16, ie decouples a signal without contact from the signal line 16 when the signal probe 14 electrically and mechanically contacts the signal line 16, as shown in FIG.
- the signal line 16 is part of an electrical or electronic circuit on a printed circuit board 30, which comprises an electrical or electronic, embedded component under test (DUT) as well as further electrical or electronic components 26, 28.
- the signal line 16 is formed, for example, as a stripline.
- the electronic circuit additionally comprises electronic components 32 and 34, which are designed, for example, as amplifiers, which can only be operated in the forward direction and have a very high intrinsic resistance in the other direction.
- the components 26, 28, 32 and 34 as well as the DUT 24 are essentially two-ported into the signal line 16 are looped.
- 36 denotes a first position, 38 a second position, 40 a third position, 42 a fourth position, 44 a fifth position and 46 a sixth position on the printed circuit board 30.
- Reference levels are designated 48.
- the VNA 50 comprises a signal source 52, a switch 54, with a switch position I and a switch position II, a first measuring port 56, a second measuring port 58, a third measuring port 60 and a fourth measuring port 62.
- Denoted at 64 is a complex device resistance Z 9 .
- the signal source 52 is connected via the switch 54 to an input 22 of one of the signal probes 14.
- the measuring ports 56, 58, 60 and 62 are connected to the outputs 18 and 20.
- the signal of the signal source 52 is coupled depending on the position of the switch 54 on different sides of the DUT 24 in the signal line 16 through the signal probes 14.
- the measuring probe By means of the measuring probe according to the invention, it is possible not to conduct the power of the signal coupled into the signal line 16 across all the components 26, 28, 32, 34 to the DUT 24, but to feed it directly in front of the DUT 24 by means of the signal probes 12. After or downstream of the supply of power, the coupling structures 12 are then positioned in each case.
- the contactless coupling structure 12 and the contact-type signal probe are combined to form one unit, preferably in a housing.
- Another advantage of a combined probe is that an optimized combination requires significantly less space for positioning. As a rule, the distance between two measuring objects, such as the components 24, 26, 28, 32, 34 of the electronic circuit, is very limited. Another advantage is that a DC voltage supply via bias to possibly present in the probe amplifiers is possible.
- FIG. 2 shows by way of example how the structure of a planar microstrip circuit to be examined on the circuit board 30 is modified for the use of the combined measuring probe according to the invention.
- a contact surface with a via 66 to ground is provided.
- the shape of the feeding signal probe 14 corresponds, for example, to that of a conventional on-wafer probe connected to the non-contact probe 12 via the housing.
- the combination measuring probe comprises at least one coupling structure 12, which partially decouples an electromagnetic wave running on an external line 16, and at least one signal probe 14, which has the task of transmitting power to the external line 16.
- coupling structure 12 and signal probe 14 may both be contactless or contact-based or of a combination of contactless and contact-type.
- at least one coupling structure 12 is combined with at least one signaling measuring tip 14 to form a measuring probe unit.
- the mass of the two types of probe (coupling structure 12 and signal probe 14) is suitably electrically connected to each other.
- the two types of probes have a common housing and a common holder.
- the combination measuring probe according to the invention is particularly suitable for use in a contactless vector network analysis system, as shown in FIG. Other applications are also possible.
- the geometry of the contact probe 14 corresponds to the geometry of a conventional on-wafer probe.
- the measuring tip 14 has at least one contact plate with which an electrical contact with a (planar) waveguide 16 to which the DUT 24 is electrically connected is made.
- the contact plates (e) are optionally connected via an inner waveguide (within the housing 10 of the measuring probe) to an outer transition (for example an SMA plug).
- the outer transition serves to connect the measuring tip 14 to a generator 52.
- the measuring tip 14 and the coupling structure are each impedance-controlled, i. the input reflection attenuation is maximized.
- inductive probes for example, inductive probes, capacitive probes and combinations of purely inductive and purely capacitive probes are used as the coupling structure 12 or signal probe 14.
- the contactless coupling structure 12 is designed, for example, as a loop probe.
- the combination measuring probe according to the invention becomes an active measuring probe.
- an active measuring probe it may be useful to connect the measuring tip 14 and the coupling structure 12 to a direct current source (bias) in order to provide a DC voltage superimposed on the HF test signal to the amplifiers for setting the operating point.
- bias direct current source
- the housing of the combination measuring probe according to the invention can be made of any materials.
- a metal housing is provided, which is sheathed with an absorber material.
- a plastic housing or an absorber housing is provided.
- the combination measuring probe according to the invention has, for example, sensors for automatic positioning or for detecting a three-dimensional position.
- At least one waveguide is preferably connected to the coupling structure 12, wherein the end of the waveguide forms a transition. If two waveguides are connected, one usually speaks of a probe loop. It is also possible for more than one or two waveguides to be connected to the coupling structure 12.
- the coupling structure 12 may also comprise individual probes (for example, capacitive probes).
- the combination measuring probe according to the invention has in a preferred development a three-dimensional adjustment, so that, for example, the distance of the contactless coupling structure 12 to the waveguide 16 to which the DUT 24 is connected, can be adjusted.
- the relative position of the coupling structure 12 to the measuring tip 14 is changed with a three-dimensional adjustment (for example, X-Y-Z linear stage).
- the adjustment is designed, for example, mechanically or electrically controllable.
- the adjustment process can be automated so that the best coupling position is always selected.
- the position device is for example integrated in the housing 16 or connected via a holder with the combination measuring probe.
- the position device is manually operated and / or motorized, for example. It is active or passive.
- the position device preferably contains a control line for control.
- the combination measuring probe according to the invention has, for example, two separate position devices which make it possible for the contact-type signal probe 14 and the contactless coupling structure 12 to be positioned independently of one another or for the position to be set independently of one another.
- the coupling structure (12) can also comprise a plurality of individual capacitive, inductive and / or inductively and capacitively coupling probes.
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202008009469U DE202008009469U1 (de) | 2008-07-15 | 2008-07-15 | Messsonde |
PCT/EP2009/004527 WO2010006683A1 (de) | 2008-07-15 | 2009-06-23 | Messsonde |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2300835A1 true EP2300835A1 (de) | 2011-03-30 |
Family
ID=39744708
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09776813A Ceased EP2300835A1 (de) | 2008-07-15 | 2009-06-23 | Messsonde |
Country Status (8)
Country | Link |
---|---|
US (1) | US8760184B2 (de) |
EP (1) | EP2300835A1 (de) |
JP (1) | JP5826628B2 (de) |
CN (1) | CN102099693B (de) |
CA (1) | CA2725636C (de) |
DE (1) | DE202008009469U1 (de) |
HK (1) | HK1157017A1 (de) |
WO (1) | WO2010006683A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
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DE202008013687U1 (de) * | 2008-10-15 | 2009-01-02 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Messanordnung mit Kalibriersubstrat und elektronischer Schaltung |
DE202008013982U1 (de) * | 2008-10-20 | 2009-01-08 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Messsystem zum Bestimmen von Streuparametern |
CN102736007A (zh) * | 2011-04-07 | 2012-10-17 | 旺矽科技股份有限公司 | 高频耦合信号调整方法及其测试装置 |
CN106062568B (zh) * | 2014-03-07 | 2020-02-07 | 是德科技股份有限公司 | 双向电光探测器 |
US10230202B2 (en) | 2014-11-04 | 2019-03-12 | X-Microwave, Llc | Modular building block system for RF and microwave design of components and systems from concept to production |
US11268983B2 (en) | 2017-06-30 | 2022-03-08 | Intel Corporation | Chevron interconnect for very fine pitch probing |
US10775414B2 (en) * | 2017-09-29 | 2020-09-15 | Intel Corporation | Low-profile gimbal platform for high-resolution in situ co-planarity adjustment |
EP3495808B1 (de) | 2017-12-05 | 2024-07-10 | Airbus Helicopters | Sonde zur eingriffsfreien erfassung von fehlstellen in einem testobjekt |
EP3495809A1 (de) | 2017-12-05 | 2019-06-12 | Airbus Helicopters | Verfahren zur nichtintrusiven detektion von imperfektionen in einem testobjekt |
US11061068B2 (en) | 2017-12-05 | 2021-07-13 | Intel Corporation | Multi-member test probe structure |
US11204555B2 (en) | 2017-12-28 | 2021-12-21 | Intel Corporation | Method and apparatus to develop lithographically defined high aspect ratio interconnects |
US11543454B2 (en) | 2018-09-25 | 2023-01-03 | Intel Corporation | Double-beam test probe |
US11125779B2 (en) * | 2018-11-15 | 2021-09-21 | Rohde & Schwarz Gmbh & Co. Kg | Probe with radio frequency power detector, test system and test method |
CN110045269A (zh) * | 2019-05-09 | 2019-07-23 | 肇庆学院 | 一种芯片测试装置及方法 |
JP7443017B2 (ja) * | 2019-10-17 | 2024-03-05 | 株式会社日本マイクロニクス | 検査プローブ、検査プローブの製造方法および検査装置 |
EP4170332A1 (de) | 2021-10-20 | 2023-04-26 | Airbus Helicopters | Vorrichtung und verfahren zur nichtintrusiven detektion von fehlstellen in einem testobjekt |
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US4853613A (en) * | 1987-10-27 | 1989-08-01 | Martin Marietta Corporation | Calibration method for apparatus evaluating microwave/millimeter wave circuits |
JPH0864643A (ja) * | 1994-08-19 | 1996-03-08 | Sanyo Electric Co Ltd | 高周波集積回路装置および高周波測定システム |
US5508630A (en) * | 1994-09-09 | 1996-04-16 | Board Of Regents, University Of Texas Systems | Probe having a power detector for use with microwave or millimeter wave device |
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JP3344682B2 (ja) * | 1995-04-05 | 2002-11-11 | 日本電信電話株式会社 | 電磁妨害波侵入経路の特定方法及び電磁妨害波探索装置 |
JP2001124809A (ja) * | 1999-10-26 | 2001-05-11 | Advantest Corp | 負荷容量付き水晶振動子の測定方法 |
JP3758439B2 (ja) * | 1999-12-20 | 2006-03-22 | 日本精工株式会社 | 曲面を有する被検査体の欠陥を曲面に沿って非接触で検出する方法 |
JP2001242207A (ja) * | 2000-02-25 | 2001-09-07 | Anritsu Corp | 高周波デバイス測定プログラムを記録した記憶媒体並びに高周波デバイス測定装置及び方法 |
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US20030115008A1 (en) * | 2001-12-18 | 2003-06-19 | Yutaka Doi | Test fixture with adjustable pitch for network measurement |
JP3613269B2 (ja) | 2002-08-28 | 2005-01-26 | 日本電気株式会社 | ノイズイミュニティ評価装置及びノイズイミュニティ評価方法 |
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JP4150296B2 (ja) * | 2003-06-18 | 2008-09-17 | 日本電産リード株式会社 | 基板検査装置 |
JP2005207868A (ja) * | 2004-01-22 | 2005-08-04 | Yamaha Corp | 半導体装置の試験装置 |
EP1615335B1 (de) * | 2004-07-08 | 2007-10-31 | Alcatel Lucent | Kopplungsanordnung für RF Differenzsignal-Übertragung |
US7088109B2 (en) * | 2004-09-30 | 2006-08-08 | Agilent Technologies, Inc. | Method and apparatus for measuring a digital device |
US7548069B2 (en) * | 2005-06-10 | 2009-06-16 | Maury Microwave, Inc. | Signal measurement systems and methods |
US7362106B2 (en) * | 2005-06-29 | 2008-04-22 | Agilent Technologies, Inc. | Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes |
US7606592B2 (en) * | 2005-09-19 | 2009-10-20 | Becker Charles D | Waveguide-based wireless distribution system and method of operation |
JP2007101330A (ja) * | 2005-10-04 | 2007-04-19 | Nec Corp | 磁界センサ |
US7195404B1 (en) * | 2006-03-03 | 2007-03-27 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Fiber optic transceiver module with electromagnetic interference absorbing material and method for making the module |
US7235982B1 (en) * | 2006-03-31 | 2007-06-26 | Agilent Technologies, Inc. | Re-calculating S-parameter error terms after modification of a calibrated port |
DE102006030630B3 (de) * | 2006-07-03 | 2007-10-25 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | HF-Messvorrichtung, Verfahren zu deren Kalibrierung sowie Verfahren zum Bestimmen von Streuparametern mit dieser HF-Messvorrichtung |
DE202007010784U1 (de) * | 2007-08-03 | 2007-10-04 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Kontaktloses Messsystem |
US7705681B2 (en) * | 2008-04-17 | 2010-04-27 | Infineon Technologies Ag | Apparatus for coupling at least one of a plurality of amplified input signals to an output terminal using a directional coupler |
-
2008
- 2008-07-15 DE DE202008009469U patent/DE202008009469U1/de not_active Expired - Lifetime
-
2009
- 2009-06-23 EP EP09776813A patent/EP2300835A1/de not_active Ceased
- 2009-06-23 JP JP2011517770A patent/JP5826628B2/ja active Active
- 2009-06-23 US US13/003,704 patent/US8760184B2/en active Active
- 2009-06-23 CN CN200980127983.2A patent/CN102099693B/zh active Active
- 2009-06-23 WO PCT/EP2009/004527 patent/WO2010006683A1/de active Application Filing
- 2009-06-23 CA CA2725636A patent/CA2725636C/en active Active
-
2011
- 2011-10-20 HK HK11111263.4A patent/HK1157017A1/xx not_active IP Right Cessation
Non-Patent Citations (2)
Title |
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None * |
See also references of WO2010006683A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN102099693A (zh) | 2011-06-15 |
US8760184B2 (en) | 2014-06-24 |
CN102099693B (zh) | 2014-07-02 |
JP2011528107A (ja) | 2011-11-10 |
HK1157017A1 (en) | 2012-06-22 |
JP5826628B2 (ja) | 2015-12-02 |
DE202008009469U1 (de) | 2008-09-11 |
US20110163773A1 (en) | 2011-07-07 |
CA2725636A1 (en) | 2010-01-21 |
CA2725636C (en) | 2016-01-19 |
WO2010006683A1 (de) | 2010-01-21 |
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