EP2289100A2 - Method for the manufacture of an electronic assembly - Google Patents
Method for the manufacture of an electronic assemblyInfo
- Publication number
- EP2289100A2 EP2289100A2 EP09765709A EP09765709A EP2289100A2 EP 2289100 A2 EP2289100 A2 EP 2289100A2 EP 09765709 A EP09765709 A EP 09765709A EP 09765709 A EP09765709 A EP 09765709A EP 2289100 A2 EP2289100 A2 EP 2289100A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic component
- layer
- conductive
- electronic
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000011888 foil Substances 0.000 claims abstract description 30
- 239000004020 conductor Substances 0.000 claims abstract description 29
- 239000002131 composite material Substances 0.000 claims description 16
- 239000004033 plastic Substances 0.000 claims description 16
- 229920003023 plastic Polymers 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000000712 assembly Effects 0.000 description 7
- 238000000429 assembly Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- OJRUSAPKCPIVBY-KQYNXXCUSA-N C1=NC2=C(N=C(N=C2N1[C@H]3[C@@H]([C@@H]([C@H](O3)COP(=O)(CP(=O)(O)O)O)O)O)I)N Chemical compound C1=NC2=C(N=C(N=C2N1[C@H]3[C@@H]([C@@H]([C@H](O3)COP(=O)(CP(=O)(O)O)O)O)O)I)N OJRUSAPKCPIVBY-KQYNXXCUSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 229940125758 compound 15 Drugs 0.000 description 4
- 239000006223 plastic coating Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000002985 plastic film Substances 0.000 description 3
- 229920006255 plastic film Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 238000011105 stabilization Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
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- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5387—Flexible insulating substrates
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- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- H05K1/00—Printed circuits
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- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
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- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16237—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area disposed in a recess of the surface of the item
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
Definitions
- the invention relates to a method for producing an electronic assembly comprising at least one electronic component and a conductor track structure, with which the at least one electronic component is contacted.
- Electronic components used to manufacture the electronic package include integrated circuits (IC), for example. These are, for example, in order to encapsulate and increase the land use on the electronic circuit substrate, accommodated in a substrate. As a result, a protection of the electronic components is possible. From US Pat. No. 6,512,182 it is known, for example, to mill receptacles in a printed circuit board substrate into which the electronic components are inserted. After inserting the electronic components, the recordings are filled, then smoothed and overlaminated. By embedding the electronic components, a smooth surface of the electronic assembly can be achieved.
- IC integrated circuits
- a disadvantage of this module is that first recordings are milled into the printed circuit board substrate, in which the electronic components are used. An exact positioning of the electronic components is difficult in this way possible.
- a method for producing an electrical circuit comprising electrical components which are mechanically interconnected by a potting compound is known from DE-A 10 2005 003 125.
- On at least one side of the potting compound at least one layer of conductor tracks is provided, which electrically connects the components to one another.
- the components are applied to a carrier film and then encapsulated with a potting compound. Subsequently, the carrier film is removed and on the side on which the components were connected to the carrier film, one or more layers of conductor tracks are applied, which electrically connect the components to one another. In order to ensure a functional interconnection of the However, it must be ensured that the carrier film must be removed without residue.
- An inventive method for producing an electronic assembly comprising at least one electronic component and a conductor track structure, with which the at least one electronic component is contacted, comprises the following steps:
- Components with which the printed conductor structure is equipped are, for example, integrated circuits (IC), batteries, solar modules or other electronic components known to the person skilled in the art, which are usually used for the production of electronic assemblies.
- IC integrated circuits
- batteries batteries
- solar modules or other electronic components known to the person skilled in the art, which are usually used for the production of electronic assemblies.
- a film deformable assemblies can be made for example of a thermoplastic material.
- the thermoplastic film is, for example, the further film laminated onto the conductive film or a deformable, for example thermoplastic film is used as carrier film, which is connected to the conductive film.
- the further foil which is laminated onto the conductive foil populated with the at least one electronic component is likewise a conductive foil which is equipped with at least one electronic component.
- the lamination is preferably carried out in such a way that the electronic components of the two films face each other, so that the conductive films are located on the outside of the layer composite. In this way, the land use can be significantly increased.
- the layer which is introduced between the two conductive films is a plastic layer.
- a plastic for example, a thermoplastic is used. However, it is also possible to use any other plastic.
- the layer which is introduced between the two conductive films is preferably used to fix the components and to ensure the contact.
- plastic coating can be applied before or after the structuring of the film to form the conductor track structure.
- the application of the plastic coating prior to structuring of the conductive film has the advantage that a continuous base is maintained by the plastic layer, on which the metal layer is patterned. This can not be done by, for example, careless handling moving or kinking of individual tracks.
- the conductive foil is not provided with a plastic layer, it is necessary to leave the conductive foil on a support, the structured foil then being handled so carefully that no displacement or kinking of the individual tracks of the structure occurs ,
- the plastic layer it is also possible, for example, for the plastic layer to be applied to the foil on which the at least one electronic component is positioned only after the conductive foil has been loaded on the side. Furthermore, it is also possible that after loading the conductive foil, a further plastic layer is applied to the foil. In this case, the plastic coating that has been applied before the placement of the conductive foil may be arranged on the side on which the foil has been fitted with the electronic components or on the side of the foil facing away from the components.
- vias may be introduced for a connection of the conductor track structures structured from the conductive foils.
- the introduction of the plated-through holes can take place, for example, in that holes are formed and these are then metallized.
- the plated-through holes it is also possible for the plated-through holes to be produced, for example, by a deep drawing process in which the upper layer of the conductive foil is pressed through the dielectric via a mandrel until it contacts the lower conductive foil.
- an insulating layer is applied to at least one of the outwardly facing sides of the electronic assembly.
- the insulating layer is usually made of a dielectric material.
- Particularly preferred as an insulating layer are plastics.
- the insulation layer is made of a thermoplastic material.
- thermoplastics or thermosetting plastics it is alternatively also possible to use, for example, elastomers or ductile silicones for the dielectric and optionally the at least one insulating layer.
- elastomers or stretchable silicones in conjunction with suitably designed interconnect structures, electronic circuits can be produced which are flexible in all spatial directions.
- electronic assemblies can also be stretched, for example.
- a forming force must generally be used for stretching or recalculation and, if appropriate, the electronic assembly should be heated.
- At least two electronic assemblies are connected together to form a composite layer. Due to the layer composite, more than just two layers of the printed circuit board equipped with electronic components can also be used. structures are interconnected. The individual layers can be electrically contacted by plated-through holes.
- an electrically conductive foil to be equipped on its upper side and on its lower side with at least one electronic component. In this case, further films are laminated both at the top and at the bottom of the electrically conductive film.
- a dielectric is introduced in each case between two films.
- the dielectric is, for example, a plastic or a silicone.
- the electronic component In order to achieve an improved encapsulation of the electronic component, it is preferable to additionally enclose the electronic component with a molding compound.
- a molding compound By enclosing the component with a molding compound, for example, an additional stabilization of the electronic component and the contact can be achieved, so that this does not break, for example, in a bending of the electronic assembly.
- the electronic assembly is formed into a molding in a final step.
- the forming can be done for example by deep drawing or other forming processes. Forming is possible in particular when a deformable material is used as the dielectric. In order to avoid that electronic components with which the film is loaded, are damaged in the forming process, it is on the one hand possible to design the assembly that no electronic components are applied to bending points or kinks of the molded part. Alternatively, it is also possible, for example, to use flexible electronic components that can be bent, for example.
- the inventive method by the use of flexible electronics completely flexible and deformable circuits can be produced by the inventive method.
- the electronic component which is formed into a molded part in a concluding step, can also be used, for example, as a housing part.
- the housing parts can be connected, for example, by gluing or embossing with the actual housing and contacted if necessary.
- FIGS. 1 to 7 show steps of a method for producing an electronic assembly
- FIG. 8 shows an electronic assembly produced according to the invention.
- an electrically conductive film 1 is structured to form a conductor track structure.
- the structuring takes place here only on an electrically conductive layer 3 of the electrically conductive film 1.
- the electrically conductive layer 3 is applied to an electrically non-conductive layer 5.
- the electrically non-conductive layer 5 serves as a carrier layer and is not structured.
- the electrically non-conductive layer 5 is, for example, a plastic layer.
- As an electrically conductive layer 3 are particularly suitable special metals, for example copper or silver. Also suitable are gold, palladium or laminates, for example NiPdAu.
- the electrically non-conductive layer 5 may be applied to the electrically conductive layer 3, for example, by lamination or doctoring. The application of the electrically non-conductive layer 5 can take place either after the structuring of the electrically conductive layer 3 or before the structuring of the electrically conductive layer 3.
- an electrically conductive film 1 which has only one electrically conductive layer 3.
- the electrically conductive film 1 is equipped with electronic components 9.
- the loading of the electrically conductive foil 1 takes place, for example, in flip-chip technology.
- 9 contact points 11 (bumps) are attached to the electronic components.
- the contact points 11 are pressed through the electrically non-conductive layer so that they contact the conductor track structure 7, which has been structured from the electrically conductive layer 3.
- the electrically non-conductive layer 5 can serve here simultaneously as a connection medium.
- connection of the contact points 11 with the conductor track structure 7 takes place, for example, by a temperature and pressure process, for example so-called heatsealing. Also suitable is an NCA process (non-conductive adhesive). Alternatively, it is also possible, for example, to contact the electronic components 9 by a soldering process to the printed conductor structure 7. In this case, for example, acids contained in the electrically non-conductive layer 5 can serve as a flux for the soldering process. As a material for the electrically non-conductive layer 5 is suitable in this case, for example, an epoxy resin.
- the electrically conductive film 1 consists only of the electrically conductive layer 3 and no electrically non-conductive layer 5 is provided, it is possible to solder the electronic components 9 first with contact points 11 on the wiring pattern 7 and then the electronic component 9 with an adhesive to underfill. Alternatively, so-called ICA bonding (isotropic conductive adhesive) is possible.
- a second carrier strip 13 can optionally also be produced, for example.
- the second carrier strip 13 likewise comprises a conductive film 1 with an electrically conductive layer 3, from which a printed conductor structure 7 has been patterned, and an electrically non-conductive layer 5.
- the electrically non-conductive layer 5 is at least one other structure in another structure applied an electronic component 9, which is provided with a contact point 11.
- the contact point 11 is pressed through the electrically non-conductive layer 5 and contacts the electronic component 9 with the conductor track structure 7.
- the first carrier strip 12 and second carrier strip 13 produced in this way can later be connected to form a layer composite.
- the placement and structure of the conductor tracks of the first carrier strip 12 and of the second carrier strip 13 usually differs.
- An additional stabilization of the electronic components 9 can be achieved, for example, by enclosing them, as shown in FIG. 4, by a molding compound 15.
- enclosing the electronic components 9 with the molding compound 15 is only necessary if the electronic components 9 are very sensitive or, for example, even if the carrier strip is to be bent, without the electronic components being bent.
- the molding compound 15 serves as additional mechanical stabilization.
- the second carrier strip 13 connected to the first carrier strip 12 is shown in FIG.
- the first carrier strip 12 and the second carrier strip 13 are connected to one another such that the electrically conductive layer 3 of the two carrier strips 12, 13 lies on the outer side in each case.
- the electrically non-conductive layer 5 of the first carrier strip 12 and of the second carrier strip 13 forms a dielectric, by which it is avoided that the electrically conductive layers 3, which form the conductor track structure 7, are contacted with one another at undesired positions.
- the connection of the carrier strips 12, 13 takes place by means of a conventional laminating method known to the person skilled in the art.
- a dielectric is suitable in this case, for example, a plastic film.
- the two carrier strips 12, 13 laminated together with the intervening plastic film.
- the second carrier strip 13 As an alternative to laminating the second carrier strip 13 onto the first carrier strip 12, it is also possible, for example, to laminate a dielectric onto the first carrier strip 12 and to provide only one conductive layer. Furthermore, it is also possible to apply a dielectric to the outside of the electrically conductive layer 3 and to laminate a further electrically conductive layer. In this case, for example, at least one electronic element 9 can also be arranged on the upper side and the lower side of the electrically conductive layer 3. In this case, it is furthermore preferred for the electrically conductive layer 3 to be provided with an electrically nonconductive layer on the second side after structuring to form the conductor track structure 7.
- the strip conductor structures 7, which have been patterned from the electrically conductive layers 3, can be connected to one another by plated-through holes 17.
- the through contacts 17 can be produced, for example, by introducing bores into the circuit carrier and then metallizing the bores.
- the electrically conductive layer 3 of one of the two carrier strips 12, 13 is pressed over a mandrel through the dielectric which is formed by the electrically non-conductive layer 5 until it is the second electrically conductive layer 3 contacted.
- an insulating layer 19 is preferably applied to the outside.
- the insulation layer 19 for example, a plastic film can be applied to the layer composite of the first carrier strip 12 and the second carrier strip 13. Alternatively, it is also possible to apply a plastic layer by any other method on the composite layer.
- the insulation layer 19 which is applied to the outside of the composite layer, can be optionally structured, for example, to be able to attach connectors or cables. This makes it possible to contact the electronic module.
- this can be embossed in any shape.
- a flexible film-like circuit This is shown in FIG.
- electronic components 9 are applied to an electrically conductive foil which has been patterned into a conductor track structure 7, which are enclosed by the molding compound 15 in order to protect it from damage.
- a dielectric 21 is applied to the layer in order to achieve a uniform layer thickness and a further encapsulation of the electronic components 9.
- a material for the dielectric 21 a material is selected which is flexible and allows deformation of the layer composite.
- Such a flexible film-like circuit can be used for example in garments.
- Such apparel-integrated electronics are useful, for example, in skis or mountaineering equipment, for example, to locate a wearer of such garment that may have been spilled by an avalanche.
- the electronics can be used, for example, as theft protection. It is also possible, for example, to store product information on a corresponding circuit.
- circuit is not used as a flexible film-like circuit, it is also possible, for example, to transform the layer composite into a molded part. This is done for example by embossing the layer composite, as shown in Figure 7. As a result, for example, a housing with integrated electronics can be generated.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008002532A DE102008002532A1 (en) | 2008-06-19 | 2008-06-19 | Method for producing an electronic assembly |
PCT/EP2009/056286 WO2009153129A2 (en) | 2008-06-19 | 2009-05-25 | Method for the manufacture of an electronic assembly |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2289100A2 true EP2289100A2 (en) | 2011-03-02 |
Family
ID=40905909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09765709A Ceased EP2289100A2 (en) | 2008-06-19 | 2009-05-25 | Method for the manufacture of an electronic assembly |
Country Status (6)
Country | Link |
---|---|
US (1) | US8505198B2 (en) |
EP (1) | EP2289100A2 (en) |
JP (1) | JP2011524645A (en) |
CN (1) | CN102124560B (en) |
DE (1) | DE102008002532A1 (en) |
WO (1) | WO2009153129A2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010014579A1 (en) * | 2010-04-09 | 2011-10-13 | Würth Elektronik Rot am See GmbH & Co. KG | Producing electronic assembly, comprises providing electrically conductive film including support film and electrical component with electrical contact point, and forming component with electrical contact point on conductive film |
DE102010030528A1 (en) * | 2010-06-25 | 2011-12-29 | Robert Bosch Gmbh | Encapsulated control module for a motor vehicle |
US10820437B2 (en) * | 2016-09-28 | 2020-10-27 | Intel Corporation | Flexible packaging for a wearable electronic device |
DE102017203381A1 (en) * | 2017-03-02 | 2018-04-05 | Robert Bosch Gmbh | Microelectronic component arrangement and corresponding manufacturing method |
WO2021148137A1 (en) * | 2020-01-24 | 2021-07-29 | Huawei Technologies Co., Ltd. | Functional housing structure for an electronic device |
DE102021108701A1 (en) | 2021-04-08 | 2022-10-13 | Innome Gmbh | Sensor component and method of manufacturing the same |
Citations (4)
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US20030137045A1 (en) * | 2002-01-23 | 2003-07-24 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method of manufacturing the same |
US20050006142A1 (en) * | 2003-07-09 | 2005-01-13 | Matsushita Electric Industrial Co., Ltd. | Circuit board with in-built electronic component and method for manufacturing the same |
US20050218491A1 (en) * | 2004-03-31 | 2005-10-06 | Alps Electric Co., Ltd. | Circuit component module and method of manufacturing the same |
US20070099449A1 (en) * | 2005-10-31 | 2007-05-03 | Daigo Suzuki | Printed circuit board, electronic device, and manufacturing method for printed circuit board |
Family Cites Families (11)
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JP2816028B2 (en) * | 1991-02-18 | 1998-10-27 | 株式会社東芝 | Method for manufacturing semiconductor device |
US5686172A (en) * | 1994-11-30 | 1997-11-11 | Mitsubishi Gas Chemical Company, Inc. | Metal-foil-clad composite ceramic board and process for the production thereof |
DE59803887D1 (en) * | 1998-01-22 | 2002-05-23 | Fraunhofer Ges Forschung | MICROSYSTEM AND METHOD FOR PRODUCING A MICROSYSTEM |
DE19830540A1 (en) * | 1998-07-08 | 2000-01-13 | Siemens Ag | Electronic flexible type circuit board especially for power semiconductors, sensors and passive components |
JP2000151057A (en) * | 1998-11-09 | 2000-05-30 | Hitachi Ltd | Electronic component mounting structure, manufacture thereof, wireless ic card and manufacture thereof |
US6512182B2 (en) | 2001-03-12 | 2003-01-28 | Ngk Spark Plug Co., Ltd. | Wiring circuit board and method for producing same |
JP2005045228A (en) * | 2003-07-09 | 2005-02-17 | Matsushita Electric Ind Co Ltd | Circuit board with built-in electronic component and its manufacturing method |
US6928726B2 (en) * | 2003-07-24 | 2005-08-16 | Motorola, Inc. | Circuit board with embedded components and method of manufacture |
TW200539246A (en) * | 2004-05-26 | 2005-12-01 | Matsushita Electric Ind Co Ltd | Semiconductor device and method for manufacturing the same |
DE102005003125A1 (en) | 2005-01-21 | 2006-07-27 | Robert Bosch Gmbh | High-frequency electrical circuit for multi-chip module, has electrical components mechanically connected with each other by sealing compound and provided with conductive strip layers, which electrically connects components with each other |
DE102006055576A1 (en) * | 2006-11-21 | 2008-05-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for manufacturing a stretchable circuit carrier and expandable circuit carrier |
-
2008
- 2008-06-19 DE DE102008002532A patent/DE102008002532A1/en not_active Withdrawn
-
2009
- 2009-05-25 CN CN200980132214.1A patent/CN102124560B/en not_active Expired - Fee Related
- 2009-05-25 JP JP2011513971A patent/JP2011524645A/en active Pending
- 2009-05-25 EP EP09765709A patent/EP2289100A2/en not_active Ceased
- 2009-05-25 US US12/999,834 patent/US8505198B2/en active Active
- 2009-05-25 WO PCT/EP2009/056286 patent/WO2009153129A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20030137045A1 (en) * | 2002-01-23 | 2003-07-24 | Matsushita Electric Industrial Co., Ltd. | Circuit component built-in module and method of manufacturing the same |
US20050006142A1 (en) * | 2003-07-09 | 2005-01-13 | Matsushita Electric Industrial Co., Ltd. | Circuit board with in-built electronic component and method for manufacturing the same |
US20050218491A1 (en) * | 2004-03-31 | 2005-10-06 | Alps Electric Co., Ltd. | Circuit component module and method of manufacturing the same |
US20070099449A1 (en) * | 2005-10-31 | 2007-05-03 | Daigo Suzuki | Printed circuit board, electronic device, and manufacturing method for printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
CN102124560B (en) | 2014-05-07 |
CN102124560A (en) | 2011-07-13 |
WO2009153129A3 (en) | 2010-03-04 |
JP2011524645A (en) | 2011-09-01 |
US20110138620A1 (en) | 2011-06-16 |
DE102008002532A1 (en) | 2009-12-24 |
WO2009153129A2 (en) | 2009-12-23 |
US8505198B2 (en) | 2013-08-13 |
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