EP2286126A1 - Compression valve and method for producing it - Google Patents

Compression valve and method for producing it

Info

Publication number
EP2286126A1
EP2286126A1 EP09761549A EP09761549A EP2286126A1 EP 2286126 A1 EP2286126 A1 EP 2286126A1 EP 09761549 A EP09761549 A EP 09761549A EP 09761549 A EP09761549 A EP 09761549A EP 2286126 A1 EP2286126 A1 EP 2286126A1
Authority
EP
European Patent Office
Prior art keywords
substrate
recess
pinch valve
valve according
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09761549A
Other languages
German (de)
French (fr)
Inventor
Manuela Schmidt
Jochen Rupp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2286126A1 publication Critical patent/EP2286126A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B43/00—Machines, pumps, or pumping installations having flexible working members
    • F04B43/12—Machines, pumps, or pumping installations having flexible working members having peristaltic action
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0003—Constructional types of microvalves; Details of the cutting-off member
    • F16K99/0015—Diaphragm or membrane valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0034—Operating means specially adapted for microvalves
    • F16K99/0042—Electric operating means therefor
    • F16K99/0044—Electric operating means therefor using thermo-electric means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0034—Operating means specially adapted for microvalves
    • F16K99/0055—Operating means specially adapted for microvalves actuated by fluids
    • F16K99/0057—Operating means specially adapted for microvalves actuated by fluids the fluid being the circulating fluid itself, e.g. check valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0034—Operating means specially adapted for microvalves
    • F16K99/0055—Operating means specially adapted for microvalves actuated by fluids
    • F16K99/0059—Operating means specially adapted for microvalves actuated by fluids actuated by a pilot fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K99/0001—Microvalves
    • F16K99/0034—Operating means specially adapted for microvalves
    • F16K99/0055—Operating means specially adapted for microvalves actuated by fluids
    • F16K99/0061—Operating means specially adapted for microvalves actuated by fluids actuated by an expanding gas or liquid volume
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K2099/0073—Fabrication methods specifically adapted for microvalves
    • F16K2099/008—Multi-layer fabrications
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K99/00—Subject matter not provided for in other groups of this subclass
    • F16K2099/0082—Microvalves adapted for a particular use
    • F16K2099/0094—Micropumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0402—Cleaning, repairing, or assembling
    • Y10T137/0491—Valve or valve element assembling, disassembling, or replacing
    • Y10T137/0497—Fluid actuated or retarded
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
    • Y10T137/218—Means to regulate or vary operation of device
    • Y10T137/2191—By non-fluid energy field affecting input [e.g., transducer]
    • Y10T137/2196—Acoustical or thermal energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/206—Flow affected by fluid contact, energy field or coanda effect [e.g., pure fluid device or system]
    • Y10T137/2224—Structure of body of device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/7722—Line condition change responsive valves
    • Y10T137/7758—Pilot or servo controlled
    • Y10T137/7762—Fluid pressure type
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49405—Valve or choke making
    • Y10T29/49412—Valve or choke making with assembly, disassembly or composite article making

Definitions

  • the present invention relates to a pinch valve, a chip comprising such a pinch valve, a peristaltic pump comprising such a pinch valve and a method for the production thereof.
  • Fluidigm on fluidic chips uses such valves under the name “Nanoflex.”
  • the fluidic chip and the valves thereon are made of an elastic solid material, for example
  • the inventive pinch valve according to claim 1, the chip according to the invention as claimed in claim 10, the peristaltic pump according to the invention and the method according to claim 12 have the advantage that the manufacturing costs, in particular due to low material costs and a small number of Procedural steps are small.
  • a pinch valve and method according to the invention allows the use of a variety of materials for forming the third substrate, whereby the function of the valve can be optimized.
  • Fig. 1 a is a schematic cross-section along the line A-A 'through a first
  • FIG. 1b shows a schematic cross-section along the line B-B 'through the first embodiment of a valve according to the invention shown in FIG. 1a
  • 1c shows a schematic cross-section along the line A-A 'through the first embodiment of a valve according to the invention shown in FIG. 1a in the closed state
  • Figure 2a is a schematic cross-section along the line C-C through a second embodiment of a valve according to the invention in the open state.
  • FIG. 2b shows a schematic cross-section along the line D-D 'through the second embodiment of a valve according to the invention shown in FIG. 2a
  • FIG. 2c shows a schematic cross section along the line C-C through the second embodiment of a valve according to the invention shown in FIG. 2a in the closed state
  • FIG. 3a shows a schematic cross section along the line E-E 'by a third
  • Embodiment of a valve according to the invention in the closed state shows a schematic cross section along the line F-F 'through the third embodiment of a valve according to the invention shown in FIG. 3a;
  • FIG. 3c shows a schematic cross-section along the line E-E 'through the third embodiment of a valve according to the invention shown in FIG. 3a in the open state;
  • Fig. 4 is a schematic plan view of a first, second or third substrate and illustrating the arrangement of a fusing line printed on the substrate with respect to a recess in the substrate or with respect to a recess in a substrate arranged above or below it; and 5 shows a direction generator structure for producing a valve or chip by means of ultrasonic welding.
  • FIG. 1a is a schematic cross-section along the line A-A 'through a first embodiment of a valve according to the invention in the open state.
  • FIG. 1 a shows that the pinch valve according to the invention comprises a first 1, a second 2 and a third 3 substrate.
  • the third substrate 3 is formed of an elastic material and, in particular sandwich-like, arranged between the first 1 and second 2 substrate.
  • the first substrate 1 adjoins the third substrate 3 and has at least one first recess 4 on the side adjacent to the third substrate 3.
  • the second substrate 2 is adjacent to the third
  • Substrate 3 and has at the adjacent to the third substrate 3 side at least a second recess 5.
  • the first 1 and second 2 substrates can have further structuring in the context of the present invention.
  • Figure 1 a shows that the first recess 4 and the second recess 5 are arranged opposite each other. In other words, the first 4 and second 5 slots completely overlap each other.
  • the first recess 4 and the second recess 5 it is likewise possible for the first recess 4 and the second recess 5 to be arranged only partially opposite one another or to overlap one another only partially.
  • Figure Ib is a schematic cross-section along the line B-B 'through the first embodiment of a valve according to the invention shown in Figure Ia.
  • Figure Ib and in the cross-sectional drawings 2b and 3c arranged over the cutting plane elements and reference numerals are shown by two-dot chain.
  • FIG. 1b shows that, in the context of the first and second embodiment according to the invention, the longitudinal axes of the first 4 and second 5 recesses are arranged at an angle of more than zero degrees, for example of more than 20 degrees, in particular at a right angle to one another are.
  • the pinch valve according to the invention is based on the principle that the region of the third, elastic substrate 3 arranged between the first 4 and second recess 3 can expand into the recess 4, 5 at the lower pressure at different pressures in the recesses 4, 5 ,
  • the region of the third, elastic substrate 3 arranged between the first 4 and second recess 5 expands by an increase in pressure in the first recess 4, which may also be referred to as a valve control channel.
  • Recess 5 which may be, for example, a fluid channel, in and narrows or closes the second recess 5 and the fluid channel.
  • the pinch valve is normally, for example, at normal pressure in the first recess 4, open and is characterized by a
  • the pinch valve according to the invention may be a microfluidic pinch valve in all its embodiments.
  • microfluidic means that the amount of manipulated liquid is typically in the range of a few 100 .mu.l to a few nanoliters.
  • the cross-sectional area of the second recess 5, in particular of the fluid channel, may be ⁇ 90000 ⁇ m 2 , for example ⁇ 300 ⁇ m ⁇ 300 ⁇ m, in particular ⁇ 50 ⁇ m (height) ⁇ 100 ⁇ m (width).
  • the region of the third, elastic substrate 3, in particular the area between the valve control channel and the fluid channel, which is arranged between the first 4 and second 5 recesses, can be ⁇ 250000 ⁇ m, for example ⁇ 500 ⁇ m ⁇ 500 ⁇ m.
  • the pinch valve according to the invention may be a valve for a microfluidic chip, in particular a biochip.
  • Figures 2a and 2c show a schematic cross section along the line C-C through a second embodiment of a valve according to the invention in the open and in the closed state.
  • FIG. 2 a shows that the second embodiment according to the invention differs from the first embodiment in that the first recess 4 is provided with an electrically heatable pressure chamber 6, in particular for opening and closing the valve, and not with an external one Printing device is connected.
  • the first recess 4 in the context of this embodiment together with the pressure chamber 6 forms a closed unit. That is, it advantageously requires no gas and / or liquid-permeable connection of the first recess 4 and / or the pressure chamber 6 with an external device, such as an external printing device.
  • Figure 2b is a schematic cross-section along the line D-D 'through the second embodiment of a valve according to the invention shown in Figure 2a.
  • the electrically heatable pressure chamber 6, like the first recess 4, preferably comprises a gas and / or a liquid.
  • a heating coil 8 can be arranged in the pressure chamber 6, said heating coil 8 being connected to an external voltage and / or voltage conductor via two printed conductors 7 a, 7 b routed through the first substrate 1
  • Power supply device 9 is connected.
  • a gas located in the pressure chamber 6 and / or recess 4 and / or a liquid located in the pressure chamber 6 and / or recess 4 can be heated, whereby the gas and / or the liquid expands and thus the pressure in the first recess 4 increases.
  • the pressure in the first recess 4 can thus be regulated by the electrically heatable pressure chamber 6.
  • Such a structure is particularly advantageous because the pressure in the first recess 4 is electrically controlled, a few peripheral elements are required, "on-chip" can be generated and, especially in microsystems, a fast cycle time between heating and cooling and thus between pressure increase and pressure reduction can be achieved.
  • FIGS. 3 a and 3 c show a schematic cross section along the line EE 'through a third embodiment of a valve according to the invention in the closed state and in the open state.
  • FIG. 3 a shows that the second substrate 2 has, on the side adjoining the third substrate 3, at least one third recess 5b, which is arranged adjacent to the second recess 5a, wherein both the second recess 5a and the third recess 5b are at least partially are arranged opposite the first recess 4.
  • Figure 3a shows that the first recess 4 at least partially overlaps both the second 5a and the third 5b recess.
  • the third recess 5b is separated from the second recess 5a by a web 10.
  • the pinch valve of the third embodiment according to the invention is a "normally off" valve. That is, the pinch valve of the third embodiment of the present invention is normally closed, for example, at normal pressure in the first recess 4, and is activated by, for example, an external pressure device by an increase in pressure in the second 5a and / or third 5a recess as shown in Figure 3c or partially or completely open.
  • Normally off valves are usually more expensive to produce than normally-on valves, whereas a normally-off valve according to the invention shown in FIGS. 3a to 3c has the advantage that it can be manufactured in a simple manner.
  • FIG. 3b is a schematic cross-section along the line F-F 'through the third embodiment of a valve according to the invention shown in FIG. 3a.
  • Figure 3b shows that the longitudinal axes of the first recess 4 in the context of this embodiment, for example, substantially parallel to the longitudinal axis of the second recess 5a and arranged substantially parallel to the longitudinal axis of the third recess 5b. Essentially, this means that deviations from the parallelism are included insofar as the valve function described in connection with FIGS. 3a to 3c is not impaired thereby.
  • the third substrate 3 is preferably layered, in particular an elastomeric film.
  • the third substrate 3 may be an elastomeric film having a film thickness of> 0.01 ⁇ m to ⁇ 100 ⁇ m, for example from> 0.1 ⁇ m to ⁇ 50 ⁇ m, in particular from> 15 ⁇ m to ⁇ 35 ⁇ m.
  • the third substrate 3 or the material from which the third substrate 3 is formed has a Young's modulus of> 0.01 GPa to ⁇ 0.1 GPa, in particular of> 0.05 GPa to ⁇ 0.08 GPa
  • the third substrate 3 is preferably formed in the context of the present invention from a biocompatible material.
  • Biocompatible means that the material receives as few, in particular no, interactions with, in particular biochemical, analytes and samples.
  • the material should receive as few, in particular no, interactions with, in particular biochemical, analytes and samples, which must be specific for the application of the analytes and samples
  • the third substrate 3 can be formed from one, in particular weldable, thermoplastic as well as a non-thermoplastic elastomer.
  • the third substrate 3 is preferably formed from a thermoplastic, in particular weldable, elastomer.
  • a thermoplastic in particular weldable, elastomer.
  • thermoplastic olefin-based elastomers TPE-O
  • TPE-U urethane-based thermoplastic elastomers
  • TPE-E polyester-based thermoplastic elastomers
  • TPE-S styrene-based thermoplastic elastomers
  • thermoplastic elastomer in particular a thermoplastic elastomeric film
  • the materials of the first 1, second 2 and third 3 substrates are preferably selected such that the melting and / or softening temperature of the third substrate 3 is lower than the melting and / or softening temperature of the first 1 and second substrate 2.
  • the melting and / or softening temperature of the third substrate 3 in a range of> 50 0 C to ⁇ 200 0 C, for example from> 90 0 C to ⁇ 190 0 C, in particular from> 130 0 C to
  • the melting and / or softening temperature of the first 1 and second 2 substrate higher for example> 5 0 C to ⁇ 40 0 C higher, in particular> 10 0 C to ⁇ 20 0 C higher than that of the third substrate.
  • the melting and / or softening temperature of the first 1 and second 2 substrate for example,> 100 0 C or> 150 0 C or> 200 0 C in particular> 130 0 C or> 230 0 C, be.
  • the third substrate 3 may also be made of a non-thermoplastic elastomer be educated.
  • silicones, polyurethanes, ethylene-propylene-diene rubber (EPDM), butadiene rubber, polyacrylate rubbers or styrene rubbers or mixtures thereof are suitable for this purpose.
  • the first 1 and second 2 substrates in the context of the present invention are preferably made of a biocompatible material.
  • first 1 and second 2 substrates can be formed independently of one another, in particular of a weldable, thermoplastic and a non-thermoplastic elastomer.
  • the first 1 and second 2 substrates are preferably formed independently of one another from a thermoplastic, in particular weldable, elastomer.
  • polymers such as polyolefins, in particular polypropylene (PP), polyethylene (PE) or polystyrene (PS), polycarbonates (PC), poly (meth) acrylates, in particular polymethyl methacrylate (PMMA), cyclo are suitable for the formation of the first 1 and second 2 substrates - Olefm copolymers (COC) or cyclo-olefin polymers (COP) or mixtures thereof.
  • each of the first 1 and second 2 substrates may be independently formed of a polycarbonate or cyclo-olefin copolymer or a mixture thereof.
  • first and second substrates may also be formed independently of one another from a non-thermoplastic elastomer.
  • a non-thermoplastic elastomer for example, silicones, polyurethanes, ethylene-propylene-diene rubber (EPDM), butadiene rubber, polyacrylate rubbers, or styrene rubbers or mixtures thereof are suitable for this purpose.
  • the first 1 and second 2 substrate can be produced in the context of the present invention, for example by an injection molding or hot stamping process.
  • the recesses 4, 5 located in the first 1 and second 2 substrates can likewise be produced in the course of the injection molding or hot stamping process.
  • the recesses 4, 5 located in the first 1 and second 2 substrates can likewise be produced in the course of the injection molding or hot stamping process.
  • Recesses 4, 5 subsequently by photolithography in the first 1 and / or second second Substrate are formed.
  • the first 1 and second 2 substrates can be produced with the same technology.
  • the first 1 and second 2 substrates may be layered in the context of the present invention.
  • the first 1 and second 2 substrates may independently of each other
  • Layer thickness of> 1 micron to ⁇ 2 mm for example from> 10 microns to ⁇ 500 microns, in particular from> 15 microns to ⁇ 30 microns, have.
  • the first 4, second 5, 5a and third 5b recess can, in the context of the present invention, independently of one another have a cross-sectional area of ⁇ 25 mm (for example of
  • ⁇ 5 mm ⁇ 5 mm or of ⁇ 250000 ⁇ m 2 (for example of ⁇ 500 ⁇ m ⁇ 500 ⁇ m), in particular of ⁇ 100 ⁇ m (for example of ⁇ 10 ⁇ m ⁇ 10 ⁇ m).
  • the chip can be realized in that the first 1, second 2 and / or third substrate 3 comprises, in addition to the elements relevant for the valve function, in particular recesses 4, 5, 5a, 5b, further elements, such as further fluid channels, reagent chambers
  • the present invention relates to a peristaltic pump comprising at least one pinch valve according to the invention.
  • Both the at least three valves of the peristaltic pump may be pinch valves according to the invention, and the peristaltic pump may comprise one or more other valves.
  • a peristaltic pump according to the invention with three pinch valves may comprise a first 1, second 2 and third 3 substrate, wherein the third substrate 3 is formed from an elastic material and is arranged between the first 1 and second 2 substrate, the first substrate 1 is adjacent to the third substrate 3 and at the side adjacent to the third substrate 3 side at least a first 4, a fourth and a fifth recess, wherein the second substrate 2 adjacent to the third substrate 3 and at least one second recess 5 on the side adjacent to the third substrate 3, the first 4, fourth and fifth recesses being arranged at least partially opposite the second recess 5.
  • Embodiment be connected to an external pressure device or in analogy to the second embodiment of the invention with an electrically heated pressure chamber.
  • the second substrate 2 may have, on the side adjacent to the third substrate 3, at least one third 5b, 6th and 7th recess arranged in series with the second recess 5a, the second recess 5a and the second recess 5a third recess 5b are arranged at least partially opposite to the first recess 4, wherein the third 5b and sixth recess are at least partially disposed opposite to the fourth recess, wherein the sixth and seventh recess are at least partially opposite to the fifth recess.
  • the second recess 5a is from the third recess 5b by a
  • the present invention relates to a method for producing a pinch valve according to the invention, a chip according to the invention and / or a peristaltic pump according to the invention, comprising the method steps:
  • the method according to the invention can, prior to the joining step, comprise the method step: arranging the third substrate 3 between the first 1 and second 2 substrates, wherein the sides of the first 1 and second 2 substrates having at least one recess are respectively connected to the third substrate 3 adjoin.
  • the first 1 and second 2 substrate can be provided in the context of the present invention, for example by an injection molding or hot stamping process, optionally in combination with photolithography.
  • the substrates 1, 2, 3 in the context of the method according to the invention by a welding and / or bonding technique, such as a lamination technique, are interconnected.
  • the third substrate 3 can advantageously also be formed from an elastomer without a thermoplastic component.
  • the substrates 1, 2, 3 can be interconnected by thermocompression welding, laser transmission welding and / or ultrasonic welding.
  • the first 1 and / or second 2 and / or third substrate 3 expediently comprises a black dye and / or another absorber, and / or has at least one bond line 11 made of a black dye and / or another absorber ,
  • Substances which absorb a wavelength or a wavelength range which is used in laser transmission welding are, for example, suitable as “other absorbers.”
  • Substances of this type are, for example, BASF under the trade name “Lumogen” and Clearweld under the trade name “Clearweld "commercially available.
  • the first 1 and third 3 substrates may be transparent and the second substrate 2 may comprise a black dye and / or another absorber; or - the second 2 and third 3 substrates are transparent and the first substrate 2 is a black one
  • Dye and / or another absorber include; or the first 1 and second 2 substrates are transparent and the third substrate 3 comprises a black dye and / or another absorber; or the first 1, the second 2 and the third 3 substrate are transparent and the first 1 and / or second 2 and / or third 3 substrate have at least one joint line 11 of a black dye and / or another absorber.
  • two or more of the substrates 1, 2, 3 comprise a black dye and / or another absorber or are provided with at least one such joint line 11.
  • the method according to the invention preferably comprises at least one of the method steps, in particular before arranging the substrates: introduction of a black dye and / or another absorber into a substrate 1, 2, 3 and / or printing on at least one joint line 11 on at least one substrate 1 , 2, 3.
  • the printing of the joint line 11 can, for example, by means of a dispenser, by screen printing or by means of an ink jet
  • the fin line (s) 11 is / are printed onto the side of the first 1 and / or second 2 substrate adjacent to the third substrate 3 so as to partially or completely circumscribe the recess opening; and / or the joint line / s 11 is / are printed on at least one side of the third substrate 3 adjacent to the first 1 or second substrate 3 such that the joint line 11 partially or partially opens the recess openings of an adjacent substrate 2, 3 completely, circumscribe adjacent.
  • the arrangement of such a joint line 11 printed on the substrate with respect to a recess in the substrate or with respect to a recess in a substrate arranged above or below is illustrated by FIG.
  • the laser transmission welding has proved in the context of the present invention over the thermo-compression welding advantageous because not all joining partners are completely heated, but only the areas to be welded in the joining plane are selectively heated and melted. As a result, sensitive microstructures are not heated and / or deformed.
  • the third substrate 3, in particular the elastomeric film is not thermally stressed and deformed over the entire surface, which could possibly impair the subsequent valve function.
  • the third substrate 3, in particular the thermoplastic elastomer film a similar or even a something have higher melting and / or softening point than the material of the structured first 1 and second 2 substrate.
  • welds can be targeted, which increases the design possibilities.
  • heat-sensitive reagents such as enzymes and antibodies, can be introduced into the channels without being destroyed during the welding process by heating the entire composite.
  • the method according to the invention therefore comprises the method step of introducing at least one, in particular heat-sensitive, reagent into at least one recess, in particular into a recess 5, 5a, 5b in the second substrate.
  • the first 1 and / or second 2 and / or third 3 substrate expediently has at least one direction generator structure 12, in particular an energy direction generator structure 12.
  • FIG. 5 shows such a direction generator structure 12 in the first 1 and second 2 substrate of a pinch valve according to the invention.
  • FIG. 5 shows that the third substrate 3 is squeezed between the first 1 and second substrate and welded together at the location where the directional encoder structure is located.
  • Such a direction generator structure 12 may be introduced into the first 1 and second 2 substrates by an injection molding or hot stamping process and / or by photolithography.
  • the ultrasonic welding has also proved to be advantageous in the context of the present invention over the thermo-compression welding, since not all joining partners are completely heated, but are heated only in the joining plane.
  • the ultrasonic welding is advantageously a very favorable process with very short cycle times. Compared to the laser transmission welding, it also has the advantage that all joining partners can be transparent and absorber-free.
  • Valve a chip according to the invention and / or a pump according to the invention in microfluidic, in particular pressure-driven, systems; for opening and closing channels, in particular in 2 1 AO structures; for changing the fluidic resistance, in particular by local adjustment of the channel cross-section; as a peristaltic pump by means of three valves connected in series which are periodically opened and closed; for measuring liquid volumes, in particular by defined distance of the valves to each other; and / or for mixing liquids.

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Abstract

The present invention relates to a compression valve, a chip which comprises a compression valve of this type, a peristaltic pump which comprises a compression valve of this type, and a method for producing it. The compression valve comprises a first (1), second (2) and third (3) substrate, wherein the third substrate is formed from an elastic material and is arranged between the first and second substrates, - wherein the first substrate adjoins the third substrate and has at least one first cut-out (4) on the side which adjoins the third substrate, - wherein the second substrate adjoins the third substrate and has at least one second cut-out (5) on the side which adjoins the third substrate, - wherein the first cut-out and the second cut-out are arranged at least partially opposite one another.

Description

Titel title
Quetschventil und Verfahren zu dessen HerstellungPinch valve and method for its production
Beschreibungdescription
Die vorliegende Erfindung betrifft ein Quetschventil, einen ein derartiges Quetschventil umfassenden Chip, eine ein derartiges Quetschventil umfassende peristaltische Pumpe und ein Verfahren zu deren Herstellung.The present invention relates to a pinch valve, a chip comprising such a pinch valve, a peristaltic pump comprising such a pinch valve and a method for the production thereof.
Stand der TechnikState of the art
In mikrofluidischen, insbesondere biologischen, Anwendungen werden häufig Quetschventile genutzt, um Flüssigkeiten zu manipulieren. Beispielsweise verwendet die Firma Fluidigm auf fluidischen Chips derartige Ventile unter dem Namen „Nanoflex". Der fluidische Chip sowie die darauf befindlichen Ventile sind dabei aus einem elastischem Vollmaterial, beispielsweiseIn microfluidic, especially biological, applications pinch valves are often used to manipulate fluids. For example, Fluidigm on fluidic chips uses such valves under the name "Nanoflex." The fluidic chip and the valves thereon are made of an elastic solid material, for example
Polydimethylsiloxan, ausgebildet. Insbesondere da zahlreiche Herstellungsschritte notwendig sind, ist die Herstellung derartiger Ventile und Chips jedoch aufwendig und kostspielig. Darüber hinaus sind die Möglichkeiten beim Ventil- und Chipdesign eingeschränkt.Polydimethylsiloxane formed. In particular, since numerous manufacturing steps are necessary, the production of such valves and chips, however, is complicated and expensive. In addition, the possibilities for valve and chip design are limited.
Offenbarung der ErfindungDisclosure of the invention
Vorteile der ErfindungAdvantages of the invention
Das erfindungsgemäße Quetschventil nach Anspruch 1 , der erfindungsgemäße Chip nach Anspruch 10, die erfindungsgemäße peristaltische Pumpe nach Anspruch 12 und das erfindungsgemäße Verfahren nach Anspruch 12 haben den Vorteil, dass die Herstellungskosten, insbesondere aufgrund geringer Materialkosten und einer geringen Anzahl von Verfahrensschritten, gering sind. Darüber hinaus ermöglicht ein erfindungsgemäßes Quetschventil und Verfahren den Einsatz einer Vielzahl von Materialien zur Ausbildung des dritten Substrats, wodurch die Funktion des Ventils optimiert werden kann.The inventive pinch valve according to claim 1, the chip according to the invention as claimed in claim 10, the peristaltic pump according to the invention and the method according to claim 12 have the advantage that the manufacturing costs, in particular due to low material costs and a small number of Procedural steps are small. In addition, a pinch valve and method according to the invention allows the use of a variety of materials for forming the third substrate, whereby the function of the valve can be optimized.
Zeichnungendrawings
Weitere Vorteile und vorteilhafte Ausgestaltungen des erfindungsgemäßen Gegenstandes werden durch die Zeichnungen veranschaulicht und in der nachfolgenden Beschreibung erläutert. Dabei ist zu beachten, dass die Figuren nur beschreibenden Charakter haben und nicht dazu gedacht sind, die Erfindung in irgendeiner Form einzuschränken. Es zeigtFurther advantages and advantageous embodiments of the subject invention are illustrated by the drawings and explained in the following description. It should be noted that the figures have only descriptive character and are not intended to limit the invention in any way. It shows
Fig. 1 a einen schematischer Querschnitt entlang der Linie A-A' durch eine ersteFig. 1 a is a schematic cross-section along the line A-A 'through a first
Ausführungsform eines erfindungsgemäßen Ventils im offenen Zustand; Fig. Ib einen schematischer Querschnitt entlang der Linie B-B' durch die in Fig. Ia gezeigte, erste Ausführungsform eines erfindungsgemäßen Ventils; Fig. Ic einen schematischer Querschnitt entlang der Linie A-A' durch die in Fig. Ia gezeigte, erste Ausführungsform eines erfindungsgemäßen Ventils im geschlossenen Zustand; Fig. 2a einen schematischer Querschnitt entlang der Linie C-C durch eine zweite Ausführungsform eines erfindungsgemäßen Ventils im offenen Zustand;Embodiment of a valve according to the invention in the open state; FIG. 1b shows a schematic cross-section along the line B-B 'through the first embodiment of a valve according to the invention shown in FIG. 1a; 1c shows a schematic cross-section along the line A-A 'through the first embodiment of a valve according to the invention shown in FIG. 1a in the closed state; Figure 2a is a schematic cross-section along the line C-C through a second embodiment of a valve according to the invention in the open state.
Fig. 2b einen schematischer Querschnitt entlang der Linie D-D' durch die in Fig. 2a gezeigte, zweite Ausführungsform eines erfindungsgemäßen Ventils; Fig. 2c einen schematischer Querschnitt entlang der Linie C-C durch die in Fig. 2a gezeigte, zweite Ausführungsform eines erfindungsgemäßen Ventils im geschlossenen Zustand; Fig. 3a einen schematischer Querschnitt entlang der Linie E-E' durch eine dritteFIG. 2b shows a schematic cross-section along the line D-D 'through the second embodiment of a valve according to the invention shown in FIG. 2a; FIG. 2c shows a schematic cross section along the line C-C through the second embodiment of a valve according to the invention shown in FIG. 2a in the closed state; FIG. 3a shows a schematic cross section along the line E-E 'by a third
Ausführungsform eines erfindungsgemäßen Ventils im geschlossenen Zustand; Fig. 3b einen schematischer Querschnitt entlang der Linie F-F' durch die in Fig. 3 a gezeigte, dritte Ausführungsform eines erfindungsgemäßen Ventils; Fig. 3c einen schematischer Querschnitt entlang der Linie E-E' durch die in Fig. 3a gezeigte, dritte Ausführungsform eines erfindungsgemäßen Ventils im offenen Zustand;Embodiment of a valve according to the invention in the closed state; 3b shows a schematic cross section along the line F-F 'through the third embodiment of a valve according to the invention shown in FIG. 3a; FIG. 3c shows a schematic cross-section along the line E-E 'through the third embodiment of a valve according to the invention shown in FIG. 3a in the open state; FIG.
Fig. 4 ist eine schematische Draufsicht auf ein erstes, zweites oder drittes Substrat und veranschaulicht die Anordnung einer auf das Substrat aufgedruckten Fügelinie bezüglich einer Aussparung in dem Substrat beziehungsweise bezüglich einer Aussparung in einem darüber oder darunter angeordneten Substrat; und Fig. 5 eine Richtungsgeberstruktur zur Herstellung eines Ventils beziehungsweise Chips mittels Ultraschallschweißen.Fig. 4 is a schematic plan view of a first, second or third substrate and illustrating the arrangement of a fusing line printed on the substrate with respect to a recess in the substrate or with respect to a recess in a substrate arranged above or below it; and 5 shows a direction generator structure for producing a valve or chip by means of ultrasonic welding.
Figur 1 a ist ein schematischer Querschnitt entlang der Linie A-A' durch eine erste Ausführungsform eines erfindungsgemäßen Ventils im offenen Zustand. Figur 1 a zeigt, dass das erfindungsgemäße Quetschventil ein erstes 1, zweites 2 und drittes 3 Substrat umfasst. Das dritte Substrat 3 ist aus einem elastischen Material ausgebildet ist und, insbesondere Sandwichartig, zwischen dem ersten 1 und zweiten 2 Substrat angeordnet. Dabei grenzt das erste Substrat 1 an das dritte Substrate 3 an und weist an der an das dritte Substrat 3 angrenzenden Seite mindestens eine erste Aussparung 4 auf. Ebenso grenzt das zweite Substrat 2 an das dritteFIG. 1a is a schematic cross-section along the line A-A 'through a first embodiment of a valve according to the invention in the open state. FIG. 1 a shows that the pinch valve according to the invention comprises a first 1, a second 2 and a third 3 substrate. The third substrate 3 is formed of an elastic material and, in particular sandwich-like, arranged between the first 1 and second 2 substrate. In this case, the first substrate 1 adjoins the third substrate 3 and has at least one first recess 4 on the side adjacent to the third substrate 3. Likewise, the second substrate 2 is adjacent to the third
Substrate 3 an und weist an der an das dritte Substrat 3 angrenzenden Seite mindestens eine zweite Aussparung 5 auf. Neben den in Figur 1 a gezeigten Aussparungen können das erste 1 und zweite 2 Substrat im Rahmen der vorliegenden Erfindung noch weitere Strukturierungen aufweisen. Figur 1 a zeigt, dass die erste Aussparung 4 und die zweite Aussparung 5 dabei einander gegenüber angeordnet sind. Mit anderen Worten, die erste 4 und zweite 5 Aussparung überlappen sich gegenseitig vollständig. Im Rahmen der vorliegenden Erfindung, beispielsweise in der in den Figuren 3a bis 3c gezeigten, dritten Ausführungsform, ist es jedoch ebenso möglich, dass die erste Aussparung 4 und die zweite Aussparung 5 nur teilweise gegenüber einander angeordnet sind beziehungsweise sich nur teilweise gegenseitig überlappen.Substrate 3 and has at the adjacent to the third substrate 3 side at least a second recess 5. In addition to the recesses shown in FIG. 1 a, the first 1 and second 2 substrates can have further structuring in the context of the present invention. Figure 1 a shows that the first recess 4 and the second recess 5 are arranged opposite each other. In other words, the first 4 and second 5 slots completely overlap each other. However, in the context of the present invention, for example in the third embodiment shown in FIGS. 3a to 3c, it is likewise possible for the first recess 4 and the second recess 5 to be arranged only partially opposite one another or to overlap one another only partially.
Figur Ib ist ein schematischer Querschnitt entlang der Linie B-B' durch die in Figur Ia gezeigte, erste Ausführungsform eines erfindungsgemäßen Ventils. In Figur Ib sowie in den Querschnittszeichnungen 2b und 3c sind über der Schnittebene angeordnete Elemente und Bezugszeichen strichzweipunktiert dargestellt. Figur Ib zeigt ebenso wie Figur 2b, dass im Rahmen der ersten und zweiten erfindungsgemäßen Ausführungsform die Längsachsen der ersten 4 und zweiten 5 Aussparung in einem Winkel von mehr als null Grad, beispielsweise von mehr als 20 Grad, insbesondere in einem rechten Winkel, zueinander angeordnet sind.Figure Ib is a schematic cross-section along the line B-B 'through the first embodiment of a valve according to the invention shown in Figure Ia. In Figure Ib and in the cross-sectional drawings 2b and 3c arranged over the cutting plane elements and reference numerals are shown by two-dot chain. As well as FIG. 2b, FIG. 1b shows that, in the context of the first and second embodiment according to the invention, the longitudinal axes of the first 4 and second 5 recesses are arranged at an angle of more than zero degrees, for example of more than 20 degrees, in particular at a right angle to one another are.
Dem erfindungsgemäßen Quetschventil liegt das Prinzip zu Grunde, dass sich der zwischen der ersten 4 und zweiten 5 Aussparung angeordnete Bereich des dritten, elastischen Substrates 3 bei unterschiedlichen Drücken in den Aussparungen 4, 5 in die Aussparung 4, 5 mit dem geringeren Druck hinein dehnen kann. In den in den Figur 1 a bis 2c gezeigten, erfmdungsgemäßen Ausführungsformen, dehnt sich der zwischen der ersten 4 und zweiten 5 Aussparung angeordnete Bereich des dritten, elastischen Substrates 3 durch eine Druckerhöhung in der ersten Aussparung 4, welche auch als Ventilkontrollkanal bezeichnet werden kann, in die zweite - A -The pinch valve according to the invention is based on the principle that the region of the third, elastic substrate 3 arranged between the first 4 and second recess 3 can expand into the recess 4, 5 at the lower pressure at different pressures in the recesses 4, 5 , In the embodiments according to the invention shown in FIGS. 1a to 2c, the region of the third, elastic substrate 3 arranged between the first 4 and second recess 5 expands by an increase in pressure in the first recess 4, which may also be referred to as a valve control channel. in the second - A -
Aussparung 5, welche beispielsweise ein Fluidkanal sein kann, hinein aus und verengt beziehungsweise verschließt dabei die zweite Aussparung 5 beziehungsweise den Fluidkanal. Im Rahmen der in den Figur 1 a bis 2c gezeigten, erfindungsgemäßen Ausführungsformen handelt es sich um ein „normally on" Ventil, das heißt das Quetschventil ist normalerweise, beispielsweise bei Normaldruck in der ersten Aussparung 4, offen und wird durch eineRecess 5, which may be, for example, a fluid channel, in and narrows or closes the second recess 5 and the fluid channel. In the context of the embodiments shown in Figures 1 a to 2c, it is a "normally on" valve, that is, the pinch valve is normally, for example, at normal pressure in the first recess 4, open and is characterized by a
Druckerhöhung in der ersten Aussparung 4, wie in Figur Ic gezeigt aktiviert beziehungsweise teilweise oder vollständig geschlossen.Pressure increase in the first recess 4, as shown in Figure Ic activated or partially or completely closed.
Im Rahmen der in den Figuren Ia bis Ic gezeigten ersten Ausführungsform der vorliegenden Erfindung wird der Druck in der ersten Aussparung 4 durch eine externe, das heißt beispielsweise durch eine außerhalb der Substrate 1, 2, 3 angeordnete, Druckvorrichtung geregelt. Dies wird in Figur Ic durch den mit dem Bezugszeichen p gekennzeichneten Pfeil veranschaulicht.In the context of the first embodiment of the present invention shown in Figures Ia to Ic, the pressure in the first recess 4 by an external, that is, for example, by an outside of the substrates 1, 2, 3 arranged, printing device regulated. This is illustrated in FIG. 1c by the arrow marked with the reference symbol p.
Das erfindungsgemäße Quetschventil kann in all seinen Ausführungsformen ein mikrofluidisches Quetschventil sein. Dabei bedeutet mikrofluidisch, dass die Menge an manipulierter Flüssigkeit typischerweise im Bereich einiger 100 μl bis wenige Nanoliter liegt. Die Querschnittsfläche der zweiten Aussparung 5, insbesondere des Fluidkanals, kann < 90000 μm2, beispielsweise < 300 μm x 300 μm, insbesondere < 50 μm (Höhe) x 100 μm (Breite), betragen. Der zwischen der ersten 4 und zweiten 5 Aussparung angeordnete Bereich des dritten, elastischen Substrates 3, insbesondere die Fläche zwischen Ventilkontrollkanal und Fluidkanal, kann < 250000 μm , beispielsweise < 500 μm x 500 μm betragen. Beispielsweise kann es sich bei dem erfindungsgemäßen Quetschventil um ein Ventil für einen mikrofluidischen Chip, insbesondere Biochip, handeln.The pinch valve according to the invention may be a microfluidic pinch valve in all its embodiments. In this case, microfluidic means that the amount of manipulated liquid is typically in the range of a few 100 .mu.l to a few nanoliters. The cross-sectional area of the second recess 5, in particular of the fluid channel, may be <90000 μm 2 , for example <300 μm × 300 μm, in particular <50 μm (height) × 100 μm (width). The region of the third, elastic substrate 3, in particular the area between the valve control channel and the fluid channel, which is arranged between the first 4 and second 5 recesses, can be <250000 μm, for example <500 μm × 500 μm. For example, the pinch valve according to the invention may be a valve for a microfluidic chip, in particular a biochip.
Die Figuren 2a und 2c zeigen einen schematischen Querschnitt entlang der Linie C-C durch eine zweite Ausführungsform eines erfindungsgemäßen Ventils im offenen und im geschlossenen Zustand.Figures 2a and 2c show a schematic cross section along the line C-C through a second embodiment of a valve according to the invention in the open and in the closed state.
Figur 2a zeigt, dass sich die zweite erfindungsgemäße Ausführungsform dadurch von der ersten unterscheidet, das die erste Aussparung 4 mit einer elektrisch beheizbaren, insbesondere in das erste Substrat 1 integrierten, Druckkammer 6, insbesondere zum Öffnen und Schließen des Ventils, und nicht mit einer externen Druckvorrichtung verbunden ist. Insbesondere bildet die erste Aussparung 4 im Rahmen dieser Ausführungsform zusammen mit der Druckkammer 6 eine geschlossene Einheit. Das heißt, es bedarf vorteilhafterweise keiner gas- und/oder flüssigkeitsdurchlässigen Verbindung der ersten Aussparung 4 und/oder der Druckkammer 6 mit einem externen Gerät, beispielsweise einer externen Druckvorrichtung.FIG. 2 a shows that the second embodiment according to the invention differs from the first embodiment in that the first recess 4 is provided with an electrically heatable pressure chamber 6, in particular for opening and closing the valve, and not with an external one Printing device is connected. In particular, the first recess 4 in the context of this embodiment together with the pressure chamber 6 forms a closed unit. That is, it advantageously requires no gas and / or liquid-permeable connection of the first recess 4 and / or the pressure chamber 6 with an external device, such as an external printing device.
Figur 2b ist ein schematischer Querschnitt entlang der Linie D-D' durch die in Figur 2a gezeigte, zweite Ausführungsform eines erfindungsgemäßen Ventils. Im Rahmen der vorliegenden Erfindung umfasst die elektrisch beheizbare Druckkammer 6 ebenso wie die erste Aussparung 4 vorzugsweise ein Gas und/oder eine Flüssigkeit. Beispielsweise eignen sich hierfür Luft, Stickstoff, Edelgase, Wasser und/oder Öle. Figur 2b zeigt, dass in der Druckkammer 6 ein Heizwendel 8 angeordnet sein kann, der über zwei durch das erste Substrat 1 geführte Leiterbahnen 7a, 7b an eine externe Spannungs- und/oderFigure 2b is a schematic cross-section along the line D-D 'through the second embodiment of a valve according to the invention shown in Figure 2a. In the context of the present invention, the electrically heatable pressure chamber 6, like the first recess 4, preferably comprises a gas and / or a liquid. For example, air, nitrogen, noble gases, water and / or oils are suitable for this purpose. FIG. 2 b shows that a heating coil 8 can be arranged in the pressure chamber 6, said heating coil 8 being connected to an external voltage and / or voltage conductor via two printed conductors 7 a, 7 b routed through the first substrate 1
Stromversorgungsvorrichtung 9 angeschlossen ist.Power supply device 9 is connected.
Durch einen derartigen Aufbau kann ein in der Druckkammer 6 und/oder Aussparung 4 befindliches Gas und/oder eine in der Druckkammer 6 und/oder Aussparung 4 befindliche Flüssigkeit erwärmt werden, wodurch sich das Gas und/oder die Flüssigkeit ausdehnt und damit den Druck in der ersten Aussparung 4 erhöht. Der Druck in der ersten Aussparung 4 kann somit durch die elektrisch beheizbare Druckkammer 6 geregelt werden.By means of such a construction, a gas located in the pressure chamber 6 and / or recess 4 and / or a liquid located in the pressure chamber 6 and / or recess 4 can be heated, whereby the gas and / or the liquid expands and thus the pressure in the first recess 4 increases. The pressure in the first recess 4 can thus be regulated by the electrically heatable pressure chamber 6.
Ein derartiger Aufbau ist besonders vorteilhaft, da der Druck in der ersten Aussparung 4 elektrisch ansteuerbar ist, wenige Peripherieelemente benötigt werden, „on-Chip" erzeugbar ist und, insbesondere in Mikrosystemen, eine schnelle Taktzeit zwischen Heizen und Abkühlen und damit zwischen Druckerhöhung und Druckerniedrigung erzielt werden kann.Such a structure is particularly advantageous because the pressure in the first recess 4 is electrically controlled, a few peripheral elements are required, "on-chip" can be generated and, especially in microsystems, a fast cycle time between heating and cooling and thus between pressure increase and pressure reduction can be achieved.
Die Figuren 3 a und 3 c zeigen einen schematischen Querschnitt entlang der Linie E-E' durch eine dritte Ausführungsform eines erfindungsgemäßen Ventils im geschlossenen Zustand und im offenen Zustand. Figur 3 a zeigt, dass das zweite Substrat 2 an der an das dritte Substrate 3 angrenzenden Seite mindestens eine dritte Aussparung 5b aufweist, welche zu der zweiten Aussparung 5a benachbart angeordnet ist, wobei sowohl die zweite Aussparung 5a als auch die dritte Aussparung 5b zumindest teilweise gegenüber der ersten Aussparung 4 angeordnet sind. Mit anderen Worten, Figur 3 a zeigt, dass die erste Aussparung 4 sowohl die zweite 5a als auch die dritte 5b Aussparung zumindest teilweise überlappt. Die dritte Aussparung 5b ist dabei von der zweiten Aussparung 5a durch einen Steg 10 getrennt. Ferner zeigen die Figuren 3a bis 3c, dass die erste Aussparung 4 geschlossen sein kann. Das heißt, es bedarf nicht notwendigerweise einer gas- und/oder flüssigkeitsdurchlässigen Verbindung nach Außen. Im Gegensatz zu den Quetschventilen der ersten und zweiten erfindungsgemäßen Ausführungsform, handelt es sich bei dem Quetschventil der dritten erfindungsgemäßen Ausführungsform um ein „normally off Ventil. Das heißt, das Quetschventil der dritten erfindungsgemäßen Ausführungsform ist normalerweise, beispielsweise bei Normaldruck in der ersten Aussparung 4 geschlossen und wird, beispielsweise durch eine externe Druckvorrichtung, durch eine Druckerhöhung in der zweiten 5a und/oder dritten 5a Aussparung, wie in Figur 3c gezeigt aktiviert beziehungsweise teilweise oder vollständig geöffnet.FIGS. 3 a and 3 c show a schematic cross section along the line EE 'through a third embodiment of a valve according to the invention in the closed state and in the open state. FIG. 3 a shows that the second substrate 2 has, on the side adjoining the third substrate 3, at least one third recess 5b, which is arranged adjacent to the second recess 5a, wherein both the second recess 5a and the third recess 5b are at least partially are arranged opposite the first recess 4. In other words, Figure 3a shows that the first recess 4 at least partially overlaps both the second 5a and the third 5b recess. The third recess 5b is separated from the second recess 5a by a web 10. Furthermore, FIGS. 3 a to 3 c show that the first recess 4 can be closed. That is, it does not necessarily require a gas and / or liquid permeable connection to the outside. In contrast to the pinch valves of the first and second embodiments according to the invention, the pinch valve of the third embodiment according to the invention is a "normally off" valve. That is, the pinch valve of the third embodiment of the present invention is normally closed, for example, at normal pressure in the first recess 4, and is activated by, for example, an external pressure device by an increase in pressure in the second 5a and / or third 5a recess as shown in Figure 3c or partially or completely open.
„Normally off Ventile sind üblicherweise aufwendiger herzustellen als „normally on" Ventile. Ein erfindungsgemäßes, in den Figuren 3a bis 3c gezeigtes, „normally off Ventil hat hingegen den Vorteil, dass es auf einfache Weise hergestellt werden kann.Normally off valves are usually more expensive to produce than normally-on valves, whereas a normally-off valve according to the invention shown in FIGS. 3a to 3c has the advantage that it can be manufactured in a simple manner.
Figur 3b ist ein schematischer Querschnitt entlang der Linie F-F' durch die in Figur 3 a gezeigte, dritte Ausführungsform eines erfindungsgemäßen Ventils. Figur 3b zeigt, dass die Längsachsen der ersten Aussparung 4 im Rahmen dieser Ausführungsform beispielsweise im Wesentlichen parallel zu der Längsachse der zweiten Aussparung 5a und im Wesentlichen parallel zu der Längsachse der dritten Aussparung 5b angeordnet ist. Dabei bedeutet im Wesentlichen, dass Abweichungen von der Parallelität insofern eingeschlossen sind als dass die im Zusammenhang mit den Figuren 3a bis 3c beschriebene Ventilfunktion dadurch nicht beeinträchtigt wird.FIG. 3b is a schematic cross-section along the line F-F 'through the third embodiment of a valve according to the invention shown in FIG. 3a. Figure 3b shows that the longitudinal axes of the first recess 4 in the context of this embodiment, for example, substantially parallel to the longitudinal axis of the second recess 5a and arranged substantially parallel to the longitudinal axis of the third recess 5b. Essentially, this means that deviations from the parallelism are included insofar as the valve function described in connection with FIGS. 3a to 3c is not impaired thereby.
Im Rahmen der vorliegenden Erfindung ist das dritte Substrat 3 vorzugsweise schichtförmig, insbesondre eine Elastomerfolie. Vorzugsweise ist das dritte Substrat 3, insbesondere die Elastomerfolie, dabei um > 5 % dehnbar. Beispielsweise kann das dritte Substrat 3 eine Elastomerfolie mit einer Foliendicke von > 0,01 μm bis < 100 μm, beispielsweise von > 0,1 μm bis < 50 μm, insbesondere von > 15 μm bis < 35 μm, ist. Vorzugsweise weist das dritte Substrat 3 beziehungsweise das Material aus dem das dritte Substrat 3 ausgebildet ist ein Young-Modul von > 0,01 GPa bis < 0,1 GPa, insbesondere von > 0,05 GPa bis < 0,08 GPa, aufIn the context of the present invention, the third substrate 3 is preferably layered, in particular an elastomeric film. Preferably, the third substrate 3, in particular the elastomeric film, thereby stretchable by> 5%. For example, the third substrate 3 may be an elastomeric film having a film thickness of> 0.01 μm to <100 μm, for example from> 0.1 μm to <50 μm, in particular from> 15 μm to <35 μm. Preferably, the third substrate 3 or the material from which the third substrate 3 is formed has a Young's modulus of> 0.01 GPa to <0.1 GPa, in particular of> 0.05 GPa to <0.08 GPa
Das dritte Substrat 3 ist im Rahmen der vorliegenden Erfindung vorzugsweise aus einem biokompatiblen Material ausgebildet. Dabei bedeutet biokompatibel, dass das Material möglichst wenige, insbesondere keine, Wechselwirkungen mit, insbesondere biochemischen, Analyten und Proben eingeht. Insbesondere soll das Material möglichst wenige, insbesondere keine, Wechselwirkungen mit, insbesondere biochemischen, Analyten und Proben eingehen, welche die für die Anwendung der Analyten und Proben notwendigen spezifischenThe third substrate 3 is preferably formed in the context of the present invention from a biocompatible material. Biocompatible means that the material receives as few, in particular no, interactions with, in particular biochemical, analytes and samples. In particular, the material should receive as few, in particular no, interactions with, in particular biochemical, analytes and samples, which must be specific for the application of the analytes and samples
Eigenschaften verändern. Im Rahmen der vorliegenden Erfindung kann das dritte Substrat 3 sowohl aus einem, insbesondere schweißbarem, thermoplastischen als auch einem nicht-thermoplastischen Elastomer ausgebildet sein.Change properties. In the context of the present invention, the third substrate 3 can be formed from one, in particular weldable, thermoplastic as well as a non-thermoplastic elastomer.
Im Rahmen eines auf einer Schweißtechnik basierenden erfindungsgemäßen Herstellungsverfahrens ist das dritte Substrat 3 vorzugsweise aus einem thermoplastischen, insbesondere schweißbaren, Elastomer ausgebildet. Beispielsweise eignen sich zur Ausbildung des dritten Substrats 3 thermoplastische Elastomere auf Olefinbasis (TPE-O), thermoplastische Elastomere auf Urethanbasis (TPE-U), thermoplastische Elastomere auf Polyestherbasis (TPE-E), oder thermoplastische Elastomere auf Styrolbasis (TPE-S) oder Mischungen davon.In the context of a manufacturing method based on a welding technique according to the invention, the third substrate 3 is preferably formed from a thermoplastic, in particular weldable, elastomer. For example, to form the third substrate 3, thermoplastic olefin-based elastomers (TPE-O), urethane-based thermoplastic elastomers (TPE-U), polyester-based thermoplastic elastomers (TPE-E), or styrene-based thermoplastic elastomers (TPE-S) or Mixtures thereof.
Die Verwendung einer Schweißtechnik und der Einsatz eines schweißbarem thermoplastischen Elastomers, insbesondere einer thermoplastischen Elastomerfolie, hat sich im Rahmen der vorliegenden Erfindung als vorteilhaft herausgestellt, da das Elastomer neben der Ventilfunktion auch die Verbindung des ersten 1, zweiten 2 und dritten 3 Substrates sowie die Absichtung erfüllt.The use of a welding technique and the use of a weldable thermoplastic elastomer, in particular a thermoplastic elastomeric film, has proven to be advantageous in the context of the present invention, since the elastomer in addition to the valve function, the compound of the first 1, second 2 and third 3 substrate as well as the intention Fulfills.
Im Rahmen eines auf einer Thermokompressionsschweißtechnik basierenden erfindungsgemäßen Herstellungsverfahrens werden die Materialien des ersten 1, zweiten 2 und dritten 3 Substrats vorzugsweise derart ausgewählt, dass die Schmelz- und/oder Erweichungstemperatur des dritten Substrats 3 niedriger als die Schmelz- und/oder Erweichungstemperatur des ersten 1 und zweiten 2 Substrats ist. Beispielsweise kann die Schmelz- und/oder Erweichungstemperatur des dritten Substrats 3 in einem Bereich von > 50 0C bis < 200 0C, beispielsweise von > 90 0C bis < 190 0C, insbesondere von > 130 0C bisIn the context of a production method based on a thermo-compression welding technique according to the invention, the materials of the first 1, second 2 and third 3 substrates are preferably selected such that the melting and / or softening temperature of the third substrate 3 is lower than the melting and / or softening temperature of the first 1 and second substrate 2. For example, the melting and / or softening temperature of the third substrate 3 in a range of> 50 0 C to <200 0 C, for example from> 90 0 C to <190 0 C, in particular from> 130 0 C to
< 1500C, liegen, wobei die Schmelz- und/oder Erweichungstemperatur des ersten 1 und zweiten 2 Substrats höher, beispielsweise > 5 0C bis < 40 0C höher, insbesondere > 10 0C bis < 20 0C höher, als die des dritten Substrats sein kann. Die Schmelz- und/oder Erweichungstemperatur des ersten 1 und zweiten 2 Substrats kann beispielsweise > 100 0C oder > 150 0C oder > 200 0C insbesondere > 130 0C oder > 230 0C, sein.<150 0 C, wherein the melting and / or softening temperature of the first 1 and second 2 substrate higher, for example> 5 0 C to <40 0 C higher, in particular> 10 0 C to <20 0 C higher than that of the third substrate. The melting and / or softening temperature of the first 1 and second 2 substrate, for example,> 100 0 C or> 150 0 C or> 200 0 C in particular> 130 0 C or> 230 0 C, be.
Dadurch wird vorteilhafterweise gewährleistet, dass Strukturen, insbesondere Mikrostrukturen, im ersten 1 und zweiten 2 Substrat nicht beim Fügen verändert oder zerstört werden.This advantageously ensures that structures, in particular microstructures, in the first 1 and second 2 substrate are not changed or destroyed during joining.
Im Rahmen eines auf einer Klebetechnik basierenden erfindungsgemäßen Herstellungsverfahrens kann das dritte Substrat 3 auch aus einem nicht-thermoplastischen Elastomer ausgebildet sein. Beispielsweise eignen sich hierfür Silikone, Polyurethane, Ethylen-Propylen- Dien-Kautschuk (EPDM), Butadienkautschuk, Polyacrylatkautschuke, oder Styrolkautschuke oder Mischungen davon.In the context of a production method based on an adhesive technique according to the invention, the third substrate 3 may also be made of a non-thermoplastic elastomer be educated. For example, silicones, polyurethanes, ethylene-propylene-diene rubber (EPDM), butadiene rubber, polyacrylate rubbers or styrene rubbers or mixtures thereof are suitable for this purpose.
Ebenso wie das dritte Substrat 3 sind das erste 1 und zweite 2 Substrat im Rahmen der vorliegenden Erfindung vorzugsweise aus einem biokompatiblen Material ausgebildet.Like the third substrate 3, the first 1 and second 2 substrates in the context of the present invention are preferably made of a biocompatible material.
Wie auch das dritte Substrat 3 können das erste 1 und zweite 2 Substrat im Rahmen der vorliegenden Erfindung unabhängig voneinander sowohl aus einem, insbesondere schweißbarem, thermoplastischen als auch einem nicht-thermoplastischen Elastomer ausgebildet sein.Like the third substrate 3, in the context of the present invention the first 1 and second 2 substrates can be formed independently of one another, in particular of a weldable, thermoplastic and a non-thermoplastic elastomer.
Im Rahmen eines auf einer Schweißtechnik basierenden erfindungsgemäßen Herstellungsverfahrens sind vorzugsweise das erste 1 und zweite 2 Substrat unabhängig voneinander aus einem thermoplastischen, insbesondere schweißbaren, Elastomer ausgebildet.In the context of a manufacturing method based on a welding technique according to the invention, the first 1 and second 2 substrates are preferably formed independently of one another from a thermoplastic, in particular weldable, elastomer.
Beispielsweise eignen sich zur Ausbildung des ersten 1 und zweiten 2 Substrats Polymer wie Polyolefϊne, insbesondere Polypropylen (PP), Polyethylen (PE) oder Polystyrol (PS), Polycarbonate (PC), Poly(meth)acrylate, insbesondere Polymethylmethacrylat (PMMA), Cyclo- Olefm-Copolymere (COC) oder Cyclo-Olefin-Polymere (COP) oder Mischungen davon. Insbesondere können das erste 1 und zweite 2 Substrat jeweils unabhängig voneinander aus einem Polycarbonat oder Cyclo-Olefm-Copolymer oder einer Mischung davon ausgebildet sein. Diese Polymere haben sich im Rahmen der vorliegenden Erfindung als besonders Vorteilhaft erwiesen, da sie sowohl biokompatibel als auch thermoplastisch und somit schweißbar sind.For example, polymers such as polyolefins, in particular polypropylene (PP), polyethylene (PE) or polystyrene (PS), polycarbonates (PC), poly (meth) acrylates, in particular polymethyl methacrylate (PMMA), cyclo are suitable for the formation of the first 1 and second 2 substrates - Olefm copolymers (COC) or cyclo-olefin polymers (COP) or mixtures thereof. In particular, each of the first 1 and second 2 substrates may be independently formed of a polycarbonate or cyclo-olefin copolymer or a mixture thereof. These polymers have proven to be particularly advantageous in the context of the present invention, since they are both biocompatible and thermoplastic and thus weldable.
Im Rahmen eines auf einer Klebetechnik basierenden erfindungsgemäßenAs part of an adhesive technology based inventive
Herstellungsverfahrens können das erste 1 und zweite 2 Substrat jedoch auch unabhängig voneinander aus einem aus einem nicht-thermoplastischen Elastomer ausgebildet sein. Beispielsweise eignen sich hierfür Silikone, Polyurethane, Ethylen-Propylen-Dien-Kautschuk (EPDM), Butadienkautschuk, Polyacrylatkautschuke, oder Styrolkautschuke oder Mischungen davon.However, the first and second substrates may also be formed independently of one another from a non-thermoplastic elastomer. For example, silicones, polyurethanes, ethylene-propylene-diene rubber (EPDM), butadiene rubber, polyacrylate rubbers, or styrene rubbers or mixtures thereof are suitable for this purpose.
Das erste 1 und zweite 2 Substrat können im Rahmen der vorliegenden Erfindung beispielsweise durch ein Spritzguss- oder Heißprägeverfahren hergestellt werden. Die in dem ersten 1 und zweiten 2 Substrat befindlichen Aussparungen 4, 5 können ebenfalls im Zuge des Spritzguss- oder Heißprägeverfahren hergestellt werden. Darüber hinaus können dieThe first 1 and second 2 substrate can be produced in the context of the present invention, for example by an injection molding or hot stamping process. The recesses 4, 5 located in the first 1 and second 2 substrates can likewise be produced in the course of the injection molding or hot stamping process. In addition, the
Aussparungen 4, 5 nachträglich durch Photolithographie in dem ersten 1 und/oder zweiten 2 Substrat ausgebildet werden. Vorteilhafterweise können das erste 1 und zweite 2 Substrat im Rahmen der vorliegenden Erfindung mit derselben Technologie hergestellt werden.Recesses 4, 5 subsequently by photolithography in the first 1 and / or second second Substrate are formed. Advantageously, in the context of the present invention, the first 1 and second 2 substrates can be produced with the same technology.
Das erste 1 und zweite 2 Substrat können im Rahmen der vorliegenden Erfindung schichtformig sein. Beispielsweise können das erste 1 und zweite 2 Substrat unabhängig voneinander eineThe first 1 and second 2 substrates may be layered in the context of the present invention. For example, the first 1 and second 2 substrates may independently of each other
Schichtdicke von > 1 μm bis < 2 mm, beispielsweise von > 10 μm bis < 500 μm, insbesondere von > 15 μm bis < 30 μm, aufweisen.Layer thickness of> 1 micron to <2 mm, for example from> 10 microns to <500 microns, in particular from> 15 microns to <30 microns, have.
Die erste 4, zweite 5, 5a und dritte 5b Aussparung können im Rahmen der vorliegenden Erfindung unabhängig voneinander eine Querschnittsfläche von < 25 mm (beispielsweise vonThe first 4, second 5, 5a and third 5b recess can, in the context of the present invention, independently of one another have a cross-sectional area of <25 mm (for example of
< 5 mm x 5 mm), oder von < 250000 μm2 (beispielsweise von < 500 μm x 500 μm), insbesondere von < 100 μm (beispielsweise von < 10 μm x 10 μm), aufweisen.<5 mm × 5 mm), or of <250000 μm 2 (for example of <500 μm × 500 μm), in particular of <100 μm (for example of <10 μm × 10 μm).
Hinsichtlich weiterer Merkmale und Vorteile des erfindungsgemäßen Ventils wird hiermit explizit auf die Beschreibung des erfindungsgemäßen Verfahrens verwiesen.With regard to further features and advantages of the valve according to the invention, reference is hereby explicitly made to the description of the method according to the invention.
Ein weiterer Gegenstand der vorliegenden Erfindung ist ein mikrofluidischer Chip, insbesondere ein Biochip, der mindestens ein erfindungsgemäßes Quetschventil umfasst. Erfindungsgemäß kann der Chip dadurch realisiert werden, dass das erste 1, zweite 2 und/oder dritte 3 Substrat neben den für die Ventilfunktion relevanten Elementen, insbesondere Aussparungen 4, 5, 5a, 5b, weitere Elemente, wie weitere Fluidkanäle, Reagenzienkammern, umfasstAnother object of the present invention is a microfluidic chip, in particular a biochip, which comprises at least one pinch valve according to the invention. According to the invention, the chip can be realized in that the first 1, second 2 and / or third substrate 3 comprises, in addition to the elements relevant for the valve function, in particular recesses 4, 5, 5a, 5b, further elements, such as further fluid channels, reagent chambers
Ferner betrifft die vorliegende Erfindung eine peristaltische Pumpe, die mindestens ein erfindungsgemäßes Quetschventil umfasst. Dabei können sowohl alle der mindestens drei Ventile der peristaltischen Pumpe erfindungsgemäße Quetschventile sein, als auch kann die peristaltische Pumpe ein oder mehrere andere Ventile umfassen.Furthermore, the present invention relates to a peristaltic pump comprising at least one pinch valve according to the invention. Both the at least three valves of the peristaltic pump may be pinch valves according to the invention, and the peristaltic pump may comprise one or more other valves.
Beispielsweise kann eine erfindungsgemäße peristaltische Pumpe mit drei erfindungsgemäßen Quetschventilen ein erstes 1, zweites 2 und drittes 3 Substrat umfassen, wobei das dritte Substrat 3 aus einem elastischen Material ausgebildet ist und zwischen dem ersten 1 und zweiten 2 Substrat angeordnet ist, wobei das erste Substrat 1 an das dritte Substrate 3 angrenzt und an der an das dritte Substrat 3 angrenzenden Seite mindestens eine erste 4, eine vierte und eine fünfte Aussparung aufweist, wobei das zweite Substrat 2 an das dritte Substrate 3 angrenzt und an der an das dritte Substrat 3 angrenzenden Seite mindestens eine zweite Aussparung 5 aufweist, wobei die erste 4, vierte und fünfte Aussparung zumindest teilweise gegenüber der zweiten Aussparung 5 angeordnet sind.For example, a peristaltic pump according to the invention with three pinch valves according to the invention may comprise a first 1, second 2 and third 3 substrate, wherein the third substrate 3 is formed from an elastic material and is arranged between the first 1 and second 2 substrate, the first substrate 1 is adjacent to the third substrate 3 and at the side adjacent to the third substrate 3 side at least a first 4, a fourth and a fifth recess, wherein the second substrate 2 adjacent to the third substrate 3 and at least one second recess 5 on the side adjacent to the third substrate 3, the first 4, fourth and fifth recesses being arranged at least partially opposite the second recess 5.
Dabei kann die vierte und/oder fünfte Aussparung in Analogie zur ersten erfindungsgemäßenIn this case, the fourth and / or fifth recess in analogy to the first invention
Ausführungsform mit einer externen Druckvorrichtung oder in Analogie zur zweiten erfindungsgemäßen Ausführungsform mit einer elektrisch beheizbaren Druckkammer verbunden sein. In Analogie zur dritten erfindungsgemäßen Ausführungsform kann das zweite Substrat 2 an der an das dritte Substrate 3 angrenzenden Seite mindestens eine dritte 5b, sechste und siebte Aussparung aufweisen, welche mit der zweiten Aussparung 5a benachbart in Reihe angeordnet sind, wobei die zweite Aussparung 5a und die dritte Aussparung 5b zumindest teilweise gegenüber der ersten Aussparung 4 angeordnet sind, wobei die dritte 5b und sechste Aussparung zumindest teilweise gegenüber der vierten Aussparung angeordnet sind, wobei die sechste und siebte Aussparung zumindest teilweise gegenüber der fünften Aussparung angeordnet sind. Die zweite Aussparung 5a ist dabei von der dritten Aussparung 5b durch einenEmbodiment be connected to an external pressure device or in analogy to the second embodiment of the invention with an electrically heated pressure chamber. In analogy to the third embodiment according to the invention, the second substrate 2 may have, on the side adjacent to the third substrate 3, at least one third 5b, 6th and 7th recess arranged in series with the second recess 5a, the second recess 5a and the second recess 5a third recess 5b are arranged at least partially opposite to the first recess 4, wherein the third 5b and sixth recess are at least partially disposed opposite to the fourth recess, wherein the sixth and seventh recess are at least partially opposite to the fifth recess. The second recess 5a is from the third recess 5b by a
Steg 10 getrennt, wobei die dritte Aussparung von der sechsten Aussparung sowie die sechste Aussparung von der siebten Aussparung durch zwei weitere Stege voneinander getrennt sind.Web 10 separated, wherein the third recess of the sixth recess and the sixth recess of the seventh recess are separated by two further webs.
Hinsichtlich weiterer Merkmale und Vorteile wird hiermit explizit auf die Beschreibung der ersten, zweiten und dritten Ausführungsform eines erfindungsgemäßen Ventils verwiesen.With regard to further features and advantages, reference is hereby explicitly made to the description of the first, second and third embodiment of a valve according to the invention.
Darüber hinaus betrifft die vorliegende Erfindung ein Verfahren zur Herstellung eines erfindungsgemäßen Quetschventils, eines erfindungsgemäßen Chips und/oder einer erfindungsgemäßen peristaltischen Pumpe, umfassend die Verfahrensschritte:Moreover, the present invention relates to a method for producing a pinch valve according to the invention, a chip according to the invention and / or a peristaltic pump according to the invention, comprising the method steps:
Bereitstellen eines ersten 1 und eines zweites 2 Substrats mit jeweils mindestens einer Aussparung 4, 5;Providing a first 1 and a second 2 substrate each having at least one recess 4, 5;
Bereitstellen eines dritten elastischen Substrates 3; undProviding a third elastic substrate 3; and
Verbinden des ersten Substrates 1 mit dem dritten Substrat 3 und des dritten Substrates 3 mit dem zweiten Substrat 2.Connecting the first substrate 1 with the third substrate 3 and the third substrate 3 with the second substrate. 2
Ein derartiges Verfahren hat sich im Rahmen der vorliegenden Erfindung als besonders vorteilhaft erwiesen, da es keiner Strukturierung des dritten Substrates bedarf und einfach eine Elastomerfolie eingesetzt werden kann. Insbesondere kann das erfindungsgemäße Verfahren vor dem Verfahrensschritt des Verbindens den Verfahrensschritt: Anordnen des dritten Substrates 3 zwischen dem ersten 1 und zweiten 2 Substrat, wobei jeweils die Seiten des ersten 1 und zweiten 2 Substrates, welche mindesten eine Aussparung aufweisen, an das dritte Substrat 3 angrenzen, aufweisen.Such a method has proven to be particularly advantageous in the context of the present invention, since it requires no structuring of the third substrate and can easily be used an elastomeric film. In particular, the method according to the invention can, prior to the joining step, comprise the method step: arranging the third substrate 3 between the first 1 and second 2 substrates, wherein the sides of the first 1 and second 2 substrates having at least one recess are respectively connected to the third substrate 3 adjoin.
Wie bereits im Zusammenhang mit der Beschreibung des erfindungsgemäßen Ventils erläutert, können das erste 1 und zweite 2 Substrat im Rahmen der vorliegenden Erfindung beispielsweise durch ein Spritzguss- oder Heißprägeverfahren, optional in Kombination mit Photolithographie, bereitgestellt werden.As already explained in connection with the description of the valve according to the invention, the first 1 and second 2 substrate can be provided in the context of the present invention, for example by an injection molding or hot stamping process, optionally in combination with photolithography.
Beispielsweise können die Substrate 1, 2, 3 im Rahmen des erfindungsgemäßen Verfahrens durch eine Schweiß- und/oder Klebetechnik, beispielsweise eine Laminiertechnik, miteinander verbunden werden.For example, the substrates 1, 2, 3 in the context of the method according to the invention by a welding and / or bonding technique, such as a lamination technique, are interconnected.
Wie bereits erläutert, kann beim Einsatz einer Klebetechnik das dritte Substrat 3 vorteilhafterweise auch aus einem Elastomer ohne thermoplastischen Anteil ausgebildet sein.As already explained, when using an adhesive technique, the third substrate 3 can advantageously also be formed from an elastomer without a thermoplastic component.
Insbesondere können die Substrate 1, 2, 3 durch Thermokompressionsschweißen, Laserdurchstrahlschweißen und/oder Ultraschallschweißen miteinander verbunden werden.In particular, the substrates 1, 2, 3 can be interconnected by thermocompression welding, laser transmission welding and / or ultrasonic welding.
Zur Durchführung des Laserdurchstrahlschweißens, umfasst das erste 1 und/oder zweite 2 und/oder dritte 3 Substrat zweckmäßigerweise einen schwarzen Farbstoff und/oder einen anderen Absorber, und/oder weist mindestens eine Fügelinie 11 aus einem schwarzen Farbstoff und/oder einem anderen Absorber auf.To carry out the laser transmission welding, the first 1 and / or second 2 and / or third substrate 3 expediently comprises a black dye and / or another absorber, and / or has at least one bond line 11 made of a black dye and / or another absorber ,
Als „anderer Absorber" sind beispielsweise Substanzen geeignet, die eine Wellenlänge beziehungsweise einen Wellenlängenbereich absorbieren, welche/r beim Laserdurchstrahlschweißen verwendet wird. Derartige Substanzen sind beispielsweise bei der Firma BASF unter dem Markennamen „Lumogen" und bei der Firma Clearweld unter dem Markennamen „Clearweld" kommerziell erhältlich.Substances which absorb a wavelength or a wavelength range which is used in laser transmission welding are, for example, suitable as "other absorbers." Substances of this type are, for example, BASF under the trade name "Lumogen" and Clearweld under the trade name "Clearweld "commercially available.
Zur Durchführung des Laserdurchstrahlschweißens können beispielsweise das erste 1 und dritte 3 Substrate transparent sein und das zweite Substrat 2 einen schwarzen Farbstoff und/oder einen anderen Absorber umfassen; oder - das zweite 2 und dritte 3 Substrate transparent sein und das erste Substrat 2 einen schwarzenTo carry out the laser transmission welding, for example, the first 1 and third 3 substrates may be transparent and the second substrate 2 may comprise a black dye and / or another absorber; or - the second 2 and third 3 substrates are transparent and the first substrate 2 is a black one
Farbstoff und/oder einen anderen Absorber umfassen; oder das erste 1 und zweite 2 Substrate transparent sein und das dritte Substrat 3 einen schwarzen Farbstoff und/oder einen anderen Absorber umfassen; oder das erste 1, das zweite 2 und das dritte 3 Substrat transparent sein und das erste 1 und/oder zweite 2 und/oder dritte 3 Substrat mindestens eine Fügelinie 11 aus einem schwarzen Farbstoff und/oder einem anderen Absorber aufweisen.Dye and / or another absorber include; or the first 1 and second 2 substrates are transparent and the third substrate 3 comprises a black dye and / or another absorber; or the first 1, the second 2 and the third 3 substrate are transparent and the first 1 and / or second 2 and / or third 3 substrate have at least one joint line 11 of a black dye and / or another absorber.
Im Rahmen der vorliegenden Erfindung ist es jedoch ebenso möglich, dass zwei oder mehr der Substrate 1, 2, 3 einen schwarzen Farbstoff und/oder einen anderen Absorber umfassen oder mit mindestens einer derartigen Fügelinie 11 versehen sind.In the context of the present invention, however, it is also possible that two or more of the substrates 1, 2, 3 comprise a black dye and / or another absorber or are provided with at least one such joint line 11.
Vorzugsweise umfasst das erfindungsgemäße Verfahren, insbesondere vor dem Anordnen der Substrate, mindestens einen der Verfahrensschritte: Einbringen eines schwarzen Farnstoffs und/oder eines anderen Absorbers in ein Substrat 1, 2, 3 und/oder Aufdrucken von mindesten einer Fügelinie 11 auf mindestens ein Substrat 1, 2, 3. Das Aufdrucken der Fügelinie 11 kann dabei beispielsweise mittels eines Dispensers, mittels Siebdruck oder mittels eines Ink- Jet-The method according to the invention preferably comprises at least one of the method steps, in particular before arranging the substrates: introduction of a black dye and / or another absorber into a substrate 1, 2, 3 and / or printing on at least one joint line 11 on at least one substrate 1 , 2, 3. The printing of the joint line 11 can, for example, by means of a dispenser, by screen printing or by means of an ink jet
Verfahren erfolgen.Procedure done.
Im Rahmen einer bevorzugten Ausführungsform der vorliegenden Erfindung wird/werden die Fügelinie/n 11 derart auf die an das dritte Substrat 3 angrenzende Seite des ersten 1 und/oder zweiten 2 Substrats aufgedruckt, dass sie die Aussparungsöffnung teilweise oder vollständig, benachbart umlaufen; und/oder die Fügelinie/n 11 wird/werden derart auf mindestens eine an das erste 1 oder zweite 2 Substrat 3 angrenzende Seite des dritten Substrats 3 aufgedruckt, dass die Fügelinie/n 11 die Aussparungsöffhung/en eines angrenzenden Substrats 2, 3 teilweise oder vollständig, benachbart umlaufen. Die Anordnung einer derartigen auf das Substrat aufgedruckten Fügelinie 11 bezüglich einer Aussparung in dem Substrat beziehungsweise bezüglich einer Aussparung in einem darüber oder darunter angeordneten Substrat wird durch Figur 4 veranschaulicht.In a preferred embodiment of the present invention, the fin line (s) 11 is / are printed onto the side of the first 1 and / or second 2 substrate adjacent to the third substrate 3 so as to partially or completely circumscribe the recess opening; and / or the joint line / s 11 is / are printed on at least one side of the third substrate 3 adjacent to the first 1 or second substrate 3 such that the joint line 11 partially or partially opens the recess openings of an adjacent substrate 2, 3 completely, circumscribe adjacent. The arrangement of such a joint line 11 printed on the substrate with respect to a recess in the substrate or with respect to a recess in a substrate arranged above or below is illustrated by FIG.
Das Laserdurchstrahlschweißen hat sich im Rahmen der vorliegenden Erfindung gegenüber dem Thermokompressionsschweißen als vorteilhaft erwiesen, da nicht alle Fügepartner komplett erwärmt werden, sondern nur die zu verschweißenden Bereiche in der Fügeebene punktuell erhitzt und aufgeschmolzen werden. Dadurch werden empfindliche Mikrostrukturen nicht erhitzt und/oder verformt. Ebenso wird das dritte Substrat 3, insbesondere die Elastomerfolie nicht ganzflächig thermisch gestresst und verformt, wodurch gegebenenfalls die spätere Ventilfunktion beeinträchtigen werden könnte. Unter anderem kann auch das dritte Substrat 3, insbesondere die thermoplastische Elastomerfolie, einen ähnlichen oder sogar einen etwas höheren Schmelz- und/oder Erweichungspunkt als das Material des strukturierten ersten 1 und zweiten 2 Substrats haben. Darüber hinaus können Schweißnähte gezielt gelegt werden, wodurch die Designmöglichkeiten erhöht werden. Ferner können vor dem Verbinden der Substrate 1, 2, 3 hitzeempfindliche Reagenzien, wie Enzyme und Antikörper, in die Kanäle eingebracht werden, werden ohne dass diese beim Schweißvorgang durch Erhitzen des gesamten Verbunds zerstört werden.The laser transmission welding has proved in the context of the present invention over the thermo-compression welding advantageous because not all joining partners are completely heated, but only the areas to be welded in the joining plane are selectively heated and melted. As a result, sensitive microstructures are not heated and / or deformed. Likewise, the third substrate 3, in particular the elastomeric film is not thermally stressed and deformed over the entire surface, which could possibly impair the subsequent valve function. Among other things, the third substrate 3, in particular the thermoplastic elastomer film, a similar or even a something have higher melting and / or softening point than the material of the structured first 1 and second 2 substrate. In addition, welds can be targeted, which increases the design possibilities. Further, prior to bonding the substrates 1, 2, 3, heat-sensitive reagents, such as enzymes and antibodies, can be introduced into the channels without being destroyed during the welding process by heating the entire composite.
Daher umfasst das erfindungsgemäße Verfahren im Rahmen einer Ausführungsform, insbesondere vor dem Verbinden der Substrate, den Verfahrensschritt: Einbringen von mindestens einer, insbesondere hitzeempfindlichen Reagenz in mindestens eine Aussparung, insbesondere in eine Aussparung 5, 5a, 5b im zweiten Substrat.In the context of one embodiment, in particular before connecting the substrates, the method according to the invention therefore comprises the method step of introducing at least one, in particular heat-sensitive, reagent into at least one recess, in particular into a recess 5, 5a, 5b in the second substrate.
Zur Durchführung des Ultraschallschweißens weist das erste 1 und/oder zweite 2 und/oder dritte 3 Substrat zweckmäßigerweise mindestens eine Richtungsgeberstruktur 12, insbesondere eine Energierichtungsgeberstruktur 12, auf. Figur 5 zeigt eine derartige Richtungsgeberstruktur 12 im ersten 1 und zweiten 2 Substrat eines erfindungsgemäßen Quetschventils. Figur 5 zeigt, dass das dritte Substrat 3 zwischen dem ersten 1 und zweiten Substrat gequetscht und an der Stellen, an der sich die Richtungsgeberstruktur befindet, mit verschweißt wird. Eine derartige Richtungsgeberstruktur 12 kann durch ein Spritzguss- oder Heißprägeverfahren und/oder durch Photolithographie, in das erste 1 und zweite 2 Substrat eingebracht werden.To carry out the ultrasonic welding, the first 1 and / or second 2 and / or third 3 substrate expediently has at least one direction generator structure 12, in particular an energy direction generator structure 12. FIG. 5 shows such a direction generator structure 12 in the first 1 and second 2 substrate of a pinch valve according to the invention. FIG. 5 shows that the third substrate 3 is squeezed between the first 1 and second substrate and welded together at the location where the directional encoder structure is located. Such a direction generator structure 12 may be introduced into the first 1 and second 2 substrates by an injection molding or hot stamping process and / or by photolithography.
Das Ultraschallschweißen hat sich im Rahmen der vorliegenden Erfindung ebenfalls gegenüber dem Thermokompressionsschweißen als vorteilhaft erwiesen, da nicht alle Fügepartner komplett erwärmt werden, sondern nur in der Fügeebene erwärmt werden. Darüber hinaus ist das Ultraschallschweißen vorteilhafterweise ein sehr günstiges Verfahren mit sehr kurzen Taktzeiten. Gegenüber dem Laserdurchstrahlschweißen weist es ferner den Vorteil auf, dass alle Fügepartner transparent und Absorber- frei sein können.The ultrasonic welding has also proved to be advantageous in the context of the present invention over the thermo-compression welding, since not all joining partners are completely heated, but are heated only in the joining plane. In addition, the ultrasonic welding is advantageously a very favorable process with very short cycle times. Compared to the laser transmission welding, it also has the advantage that all joining partners can be transparent and absorber-free.
Hinsichtlich weiterer verfahrenstechnischer Merkmale und Vorteile wird hiermit explizit auf die Beschreibung des erfindungsgemäßen Ventils verwiesen.With regard to further procedural features and advantages, reference is hereby explicitly made to the description of the valve according to the invention.
Schließlich betrifft die vorliegende Erfindung die Verwendung eines erfindungsgemäßenFinally, the present invention relates to the use of an inventive
Ventils, eines erfindungsgemäßen Chips und/oder einer erfindungsgemäßen Pumpe in mikrofluidischen, insbesondere druckgetriebenen, Systemen; zum Öffnen und Schließen von Kanälen, insbesondere in 2 1AO Strukturen; zur Änderung des fluidischen Widerstandes, insbesondere durch lokales Einstellen des Kanalquerschnitts; als peristaltische Pumpe mittels drei hintereinander geschalteten Ventilen die periodisch geöffnet und geschlossen werden; zum Messen von Flüssigkeitsvolumina, insbesondere durch definierten Abstand der Ventile zueinander; und/oder zum Mischen von Flüssigkeiten. Valve, a chip according to the invention and / or a pump according to the invention in microfluidic, in particular pressure-driven, systems; for opening and closing channels, in particular in 2 1 AO structures; for changing the fluidic resistance, in particular by local adjustment of the channel cross-section; as a peristaltic pump by means of three valves connected in series which are periodically opened and closed; for measuring liquid volumes, in particular by defined distance of the valves to each other; and / or for mixing liquids.

Claims

Ansprüche claims
1. Quetschventil, insbesondere mikrofluidisches Quetschventil, umfassend ein erstes (1), zweites (2) und drittes (3) Substrat,A pinch valve, in particular a microfluidic pinch valve, comprising a first (1), second (2) and third (3) substrate,
- wobei das dritte Substrat (3) aus einem elastischen Material ausgebildet ist und zwischen dem ersten (1) und zweiten (2) Substrat angeordnet ist,- wherein the third substrate (3) is formed of an elastic material and is arranged between the first (1) and second (2) substrate,
- wobei das erste Substrat (1) an das dritte Substrate (3) angrenzt und an der an das dritte Substrat (3) angrenzenden Seite mindestens eine erste Aussparung (4) aufweist,wherein the first substrate (1) adjoins the third substrate (3) and has at least one first recess (4) on the side adjacent to the third substrate (3),
- wobei das zweite Substrat (2) an das dritte Substrate (3) angrenzt und an der an das dritte Substrat (3) angrenzenden Seite mindestens eine zweite Aussparung (5) aufweist, - wobei die erste Aussparung (4) und die zweite Aussparung (5) einander zumindest teilweise gegenüber angeordnet sind.wherein the second substrate (2) adjoins the third substrate (3) and has at least one second recess (5) on the side adjoining the third substrate (3), wherein the first recess (4) and the second recess ( 5) are arranged at least partially opposite each other.
2. Quetschventil nach Anspruch 1, dadurch gekennzeichnet, dass das Quetschventil durch eine externe Druckvorrichtung aktivierbar, insbesondere teilweise oder vollständig schließbar oder offenbar ist.2. Pinch valve according to claim 1, characterized in that the pinch valve can be activated by an external pressure device, in particular partially or completely closed or apparently.
3. Quetschventil nach Anspruch 1, dadurch gekennzeichnet, dass die erste Aussparung (4) mit einer elektrisch beheizbaren, insbesondere in das erste Substrat (1) integrierten, Druckkammer (6) verbunden ist.3. pinch valve according to claim 1, characterized in that the first recess (4) with an electrically heatable, in particular in the first substrate (1) integrated pressure chamber (6) is connected.
4. Quetschventil nach Anspruch 3, dadurch gekennzeichnet, dass in der Druckkammer (6) ein Heizwendel (8) angeordnet ist, der über zwei durch das erste Substrat (1) geführte Leiterbahnen (7a, 7b) an eine externe Spannungs- und/oder Stromversorgungsvorrichtung (9) angeschlossen ist. 4. pinch valve according to claim 3, characterized in that in the pressure chamber (6) a heating coil (8) is arranged, which via two through the first substrate (1) guided conductor tracks (7 a, 7 b) to an external voltage and / or Power supply device (9) is connected.
5. Quetschventil nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das zweite Substrat (2) an der an das dritte Substrate (3) angrenzenden Seite mindestens eine dritte Aussparung (5b) aufweist, welche zu der zweiten Aussparung (5a) benachbart angeordnet ist, wobei die zweite Aussparung (5a) und die dritte Aussparung (5b) zumindest teilweise gegenüber der ersten Aussparung (4) angeordnet sind.5. Pinch valve according to one of the preceding claims, characterized in that the second substrate (2) on the third substrate (3) adjacent side at least one third recess (5b), which is arranged adjacent to the second recess (5a) wherein the second recess (5a) and the third recess (5b) are arranged at least partially opposite the first recess (4).
6. Quetschventil nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das dritte Substrat (3) eine Elastomerfolie ist.6. pinch valve according to one of the preceding claims, characterized in that the third substrate (3) is an elastomeric film.
7. Quetschventil nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das das erste (1), zweite (2) und/oder dritte (3) Substrat aus einem thermoplastischen Elastomer ausgebildet ist.7. Pinch valve according to one of the preceding claims, characterized in that the first (1), second (2) and / or third (3) substrate is formed of a thermoplastic elastomer.
8. Mikrofluidischer Chip, insbesondere Biochip, umfassend mindestens ein Quetschventil nach einem der Ansprüche 1 bis 9.8. microfluidic chip, in particular biochip, comprising at least one pinch valve according to one of claims 1 to 9.
9. Peristaltische Pumpe, umfassend mindestens ein Quetschventil nach einem der Ansprüche 1 bis 7.9. peristaltic pump, comprising at least one pinch valve according to one of claims 1 to 7.
10. Verfahren zur Herstellung eines Quetschventils nach einem der Ansprüche 1 bis 7 und/oder eines Chips nach Anspruch 8 und/oder einer peristaltischen Pumpe nach Anspruch 9, umfassend die Verfahrensschritte:10. A method for producing a pinch valve according to one of claims 1 to 7 and / or a chip according to claim 8 and / or a peristaltic pump according to claim 9, comprising the method steps:
- Bereitstellen eines ersten (1) und eines zweites (2) Substrats mit jeweils mindestens einer Aussparung (4, 5); - Bereitstellen eines dritten elastischen Substrates (3); und- Providing a first (1) and a second (2) substrate, each having at least one recess (4, 5); - Providing a third elastic substrate (3); and
- Verbinden des ersten Substrates (1) mit dem dritten Substrat (3) und des dritten Substrates (3) mit dem zweiten Substrat (2).- Connecting the first substrate (1) with the third substrate (3) and the third substrate (3) with the second substrate (2).
11. Verfahren nach Anspruch 10, dadurch gekennzeichnet, dass die Substrate (1, 2, 3) durch eine Schweiß- und/oder Klebetechnik miteinander verbunden werden. 11. The method according to claim 10, characterized in that the substrates (1, 2, 3) are joined together by a welding and / or gluing technique.
12. Verfahren nach Anspruch 10 oder 11, dadurch gekennzeichnet, dass die Substrate (1, 2, 3) durch Thermokompressionsschweißen, Laserdurchstrahlschweißen und/oder Ultraschallschweißen miteinander verbunden werden.12. The method according to claim 10 or 11, characterized in that the substrates (1, 2, 3) are interconnected by thermo-compression welding, laser transmission welding and / or ultrasonic welding.
13. Verfahren nach einem der Ansprüche 10 bis 12, dadurch gekennzeichnet, dass das erste (1) und/oder zweite (2) und/oder dritte (3) Substrat einen schwarzen Farbstoff und/oder einen anderen Absorber umfasst und/oder mindestens eine Fügelinie (11) aus einem schwarzen Farbstoff und/oder einem anderen Absorber aufweist.13. The method according to any one of claims 10 to 12, characterized in that the first (1) and / or second (2) and / or third (3) substrate comprises a black dye and / or another absorber and / or at least one Feintline (11) of a black dye and / or another absorber.
14. Verfahren nach einem der Ansprüche 10 bis 13, dadurch gekennzeichnet, dass das14. The method according to any one of claims 10 to 13, characterized in that the
Verfahren mindestens einen der Verfahrensschritte:Method at least one of the method steps:
- Einbringen eines schwarzen Farnstoffs und/oder eines anderen Absorbers in ein Substrat (1, 2, 3); und/oder- Introducing a black Farnstoffs and / or another absorber in a substrate (1, 2, 3); and or
- Aufdrucken von mindesten einer Fügelinie (11) auf mindestens ein Substrat (1, 2, 3) umfasst.- Imprinting of at least one feint line (11) on at least one substrate (1, 2, 3).
15. Verfahren nach einem der Ansprüche 10 bis 14, dadurch gekennzeichnet, dass das erste (1) und/oder zweite (2) und/oder dritte (3) Substrat mindestens eine Richtungsgeberstruktur (12), insbesondere eine Energierichtungsgeberstruktur (12), aufweist. 15. The method according to any one of claims 10 to 14, characterized in that the first (1) and / or second (2) and / or third (3) substrate at least one direction sensor structure (12), in particular a Energierichtungsgeberstruktur (12) ,
EP09761549A 2008-06-10 2009-04-23 Compression valve and method for producing it Withdrawn EP2286126A1 (en)

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US20110076204A1 (en) 2011-03-31

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