EP2274770A4 - Mosfet with integrated field effect rectifier - Google Patents

Mosfet with integrated field effect rectifier

Info

Publication number
EP2274770A4
EP2274770A4 EP09739614A EP09739614A EP2274770A4 EP 2274770 A4 EP2274770 A4 EP 2274770A4 EP 09739614 A EP09739614 A EP 09739614A EP 09739614 A EP09739614 A EP 09739614A EP 2274770 A4 EP2274770 A4 EP 2274770A4
Authority
EP
European Patent Office
Prior art keywords
mosfet
field effect
integrated field
effect rectifier
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09739614A
Other languages
German (de)
French (fr)
Other versions
EP2274770A1 (en
Inventor
Alexei Ankoudinov
Vladimir Rodov
Richard Cordell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics NV Switzerland
STMicroelectronics NV
Original Assignee
STMicroelectronics NV Switzerland
STMicroelectronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics NV Switzerland, STMicroelectronics NV filed Critical STMicroelectronics NV Switzerland
Publication of EP2274770A1 publication Critical patent/EP2274770A1/en
Publication of EP2274770A4 publication Critical patent/EP2274770A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7813Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7803Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device
    • H01L29/7804Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode
    • H01L29/7805Vertical DMOS transistors, i.e. VDMOS transistors structurally associated with at least one other device the other device being a pn-junction diode in antiparallel, e.g. freewheel diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
EP09739614A 2008-04-28 2009-04-28 Mosfet with integrated field effect rectifier Withdrawn EP2274770A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US4833608P 2008-04-28 2008-04-28
PCT/US2009/041996 WO2009134812A1 (en) 2008-04-28 2009-04-28 Mosfet with integrated field effect rectifier

Publications (2)

Publication Number Publication Date
EP2274770A1 EP2274770A1 (en) 2011-01-19
EP2274770A4 true EP2274770A4 (en) 2012-12-26

Family

ID=41255381

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09739614A Withdrawn EP2274770A4 (en) 2008-04-28 2009-04-28 Mosfet with integrated field effect rectifier

Country Status (3)

Country Link
EP (1) EP2274770A4 (en)
CN (1) CN102037548B (en)
WO (1) WO2009134812A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9018048B2 (en) 2012-09-27 2015-04-28 Stmicroelectronics S.R.L. Process for manufactuirng super-barrier rectifiers
FR3012699A1 (en) * 2013-10-31 2015-05-01 St Microelectronics Tours Sas CONTROL CIRCUIT FOR DIODES IN HALF-BRIDGE

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0807979A2 (en) * 1996-05-15 1997-11-19 SILICONIX Incorporated Diode
US6281547B1 (en) * 1997-05-08 2001-08-28 Megamos Corporation Power transistor cells provided with reliable trenched source contacts connected to narrower source manufactured without a source mask
US20020177324A1 (en) * 2001-05-23 2002-11-28 Metzler Richard A. Vertical metal oxide silicon field effect semiconductor diodes
US20080073707A1 (en) * 2006-09-27 2008-03-27 Darwish Mohamed N Power MOSFET with recessed field plate

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3156300B2 (en) * 1991-10-07 2001-04-16 株式会社デンソー Vertical semiconductor device
US5559355A (en) * 1994-03-04 1996-09-24 Fuji Electric Co., Ltd. Vertical MOS semiconductor device
US5744994A (en) * 1996-05-15 1998-04-28 Siliconix Incorporated Three-terminal power mosfet switch for use as synchronous rectifier or voltage clamp
DE19743342C2 (en) * 1997-09-30 2002-02-28 Infineon Technologies Ag Field packing transistor with high packing density and method for its production
US6100145A (en) * 1998-11-05 2000-08-08 Advanced Micro Devices, Inc. Silicidation with silicon buffer layer and silicon spacers
US6593620B1 (en) * 2000-10-06 2003-07-15 General Semiconductor, Inc. Trench DMOS transistor with embedded trench schottky rectifier
US6621107B2 (en) * 2001-08-23 2003-09-16 General Semiconductor, Inc. Trench DMOS transistor with embedded trench schottky rectifier
US7719054B2 (en) * 2006-05-31 2010-05-18 Advanced Analogic Technologies, Inc. High-voltage lateral DMOS device
JP2005079339A (en) * 2003-08-29 2005-03-24 National Institute Of Advanced Industrial & Technology Semiconductor device, power converter using semiconductor device, driving inverter, general-purpose inverter, and high power high frequency communication equipment
CN100364093C (en) * 2004-04-06 2008-01-23 世界先进积体电路股份有限公司 High-voltage electrostatic discharging protector with gap structure
JP4832731B2 (en) * 2004-07-07 2011-12-07 株式会社東芝 Power semiconductor device
US7135740B2 (en) * 2004-09-27 2006-11-14 Teledyne Licensing, Llc High voltage FET switch with conductivity modulation

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0807979A2 (en) * 1996-05-15 1997-11-19 SILICONIX Incorporated Diode
US6281547B1 (en) * 1997-05-08 2001-08-28 Megamos Corporation Power transistor cells provided with reliable trenched source contacts connected to narrower source manufactured without a source mask
US20020177324A1 (en) * 2001-05-23 2002-11-28 Metzler Richard A. Vertical metal oxide silicon field effect semiconductor diodes
US20080073707A1 (en) * 2006-09-27 2008-03-27 Darwish Mohamed N Power MOSFET with recessed field plate

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009134812A1 *

Also Published As

Publication number Publication date
EP2274770A1 (en) 2011-01-19
WO2009134812A1 (en) 2009-11-05
CN102037548A (en) 2011-04-27
CN102037548B (en) 2014-04-23

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20101022

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AX Request for extension of the european patent

Extension state: AL BA RS

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20121126

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 29/78 20060101AFI20121120BHEP

RIN1 Information on inventor provided before grant (corrected)

Inventor name: ANKOUDINOV, ALEXEI

Inventor name: CORDELL, RICHARD

Inventor name: RODOV, VLADIMIR

17Q First examination report despatched

Effective date: 20140131

STAA Information on the status of an ep patent application or granted ep patent

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Effective date: 20171103