EP2229555A1 - Arrangement for cooling semiconductor light sources and floodlight having this arrangement - Google Patents
Arrangement for cooling semiconductor light sources and floodlight having this arrangementInfo
- Publication number
- EP2229555A1 EP2229555A1 EP08707877A EP08707877A EP2229555A1 EP 2229555 A1 EP2229555 A1 EP 2229555A1 EP 08707877 A EP08707877 A EP 08707877A EP 08707877 A EP08707877 A EP 08707877A EP 2229555 A1 EP2229555 A1 EP 2229555A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- condensation zone
- arrangement according
- heat
- condensation
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 230000005494 condensation Effects 0.000 claims abstract description 59
- 238000009833 condensation Methods 0.000 claims abstract description 59
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 239000002918 waste heat Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/60—Heating of lighting devices, e.g. for demisting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to an arrangement for cooling semiconductor light sources, wherein the semiconductor light sources are arranged on a thermally conductive module, which is in operative connection with an evaporator zone of a heat pipe, and a first condensation zone of the heat pipe is connected to a first heat sink.
- the arrangement is suitable for example for headlights of all kinds, but especially for headlights in the automotive sector.
- a heat pipe is a tubular device that can carry large amounts of heat energy between its two ends by evaporating / condensing a working fluid.
- US2004 / 213016 A1 discloses a cooling system for autonomous light arrangements which cools the semiconductor light sources by means of a heat pipe with a heat sink remote from the semiconductor light sources.
- WO2006 / 52022 A1 discloses a motor vehicle headlamp with semiconductor light sources which are cooled by a heat pipe.
- the heat sink is above the
- the object is achieved with respect to the arrangement by an arrangement for cooling semiconductor light sources, wherein the semiconductor light sources are arranged on a thermally conductive module, which is in operative connection with an evaporator zone of a heat pipe, and a first condensation zone of the evaporator tube with a first heat sink wherein the heat pipe is connected to a second condensation zone with a second heat sink is connected and a heat flow between the condensation zones is switchable.
- the heat sinks can be used as a controlled heating for other purposes, as can be switched by the switching of the heat flow at any time to the second heat sink, and thus no restriction in the operation of the semiconductor light sources occurs.
- the second heat sink is designed so that it can absorb the waste heat of the semiconductor light sources at any time.
- the switching of the condensation zones is done with a 3-way valve.
- the 3-way valve contains a permanent magnetic double cone, wherein the conical tips in each case close the evaporator tube of a condensation zone alternately.
- a 2-way valve is conceivable in which only one condensation zone is switched on and off. This has the advantage that a first cooling path into a first condensation zone is always open, while a second cooling path can be connected in a second condensation zone if necessary.
- the double cone closes only the evaporator tube and not the capillary area of the heat pipe.
- the drive of the double cone is arranged outside the heat pipe and takes place magnetically. Outside the heat pipe there is usually enough space available for the drive, and the magnetic drive does not require any sealing measures.
- the heat sink (33) of the first condensation zone (23) is preferably in operative connection with a heating device. As a result, the waste heat produced can advantageously be used for another task.
- the evaporator tube is advantageously open to the first condensation zone and the evaporator tube is closed to the second condensation zone.
- the switching of the condensation zones is dependent on the temperature of the first condensation zone.
- the power supply of the semiconductor light sources via the heat pipe via the heat pipe.
- This has the advantage of a simpler and more reliable design.
- simple and inexpensive tubes can be used as a power supply, wherein the two poles of the power supply are formed by the two coaxial tubes.
- FIG. 1 A perspective view of a semiconductor light source module connected to a heat pipe with a rosette-shaped heat sink connected to the heat pipe in an embodiment according to the prior art.
- FIG. 2 A detail drawing of the sectioned light source module with the illustrated end of the incorporated heat pipe.
- FIG. 3 A perspective view of the above arrangement installed in a lampshade.
- FIG. 4 A perspective view of an arrangement according to the invention for cooling semiconductor light sources with two independent heat sinks which are each connected to a condensation zone, it being possible to switch between the condensation zones.
- FIG. 5 A schematic side view of an arrangement according to the invention for cooling semiconductor light sources.
- FIG. 6 A perspective detail view of a changeover valve according to the invention.
- FIG. 1 shows an embodiment of an arrangement for cooling semiconductor light sources according to the prior art with only one condensation zone, which is enclosed by a rosette-shaped heat sink 31, which dissipates the accumulating heat of condensation.
- a multi-chip LED 5 (not shown) with an attached primary optics 51 is mounted on a light-emitting diode module 11.
- the light-emitting diode module 11 is made of a good heat-conducting material in order to be able to dissipate the accumulated heat loss of the multi-chip LED 5 quickly and safely.
- the light-emitting diode module 11 is embedded in a housing 13 which, in addition to the light-emitting diode module 11, also has a control electronics 15 for the multichip light-emitting diode 5.
- the housing 13 is made of a poorly heat-conducting material in order to minimize the temperature load on the control electronics 15 through the multi-chip LED 5.
- a heat pipe 20 leads from the light-emitting diode module 11 to a heat sink 31.
- FIG. 2 shows a detail section through the light-emitting diode module 11 with the housing 13.
- the heat pipe 20 is incorporated with its evaporator-side end 27 into the light-emitting diode module 11, and reaches as far as the multichip light-emitting diode 5 in order to reduce the heat loss to be able to move away as efficiently as possible.
- the heat is transported from the heat pipe via the vaporized working medium in the condensation zone and there from the heat sink 31 (not shown in Fig. 2) absorbed.
- FIG. 3 shows the entire arrangement installed in a reflector screen 53.
- the heat sink 31 is mounted centrally on the reflector screen 53. All generated heat is thus discharged to the reflector screen 53 out.
- the space at the front of a motor vehicle headlamp is limited, so that the size of a heat sink mounted there is often not sufficient to always be able to completely absorb the heat energy generated by the LEDs during operation of the headlamp 1 in a warm environment.
- FIG. 4 shows a perspective view of an inventive arrangement for cooling semiconductor light sources, which solves the above-mentioned problem.
- the arrangement is in this case a motor vehicle headlamp, in which the waste heat of the multi-chip LED 5 is passed through a heat pipe 20 to a condensation zone 23, which is cooled by a heat sink 33 and thus heats the scattering disk 37.
- the inventive arrangement for cooling semiconductor light sources has two switchable heat sinks 33, 35. The switching is accomplished by means of a temperature-controlled valve in the heat pipe 20.
- the first heat sink 33 is used as above besc written as heating, for example, the headlight deicing.
- the temperature control is designed so that primarily this task is solved, this heat sink 33 is thus only as long in operation as here heat energy is needed. If the setpoint temperature is reached, is switched to a second heat sink 35. This is designed to be the to be able to absorb any heat flow at any time and at any time.
- the second heat sink 35 may be a sufficiently large heat sink. But it is also conceivable that the second heat sink 35 is connected to an existing or to be created for cooling system.
- the second heat sink 35 may be e.g. be connected to the water cooling of the motor vehicle. But it can also be e.g. a Peltier element may be provided which is connected to the second heat sink 35.
- the heat pipe 20 has a switching valve 21, by means of which it is possible to switch between two condensation zones 23, 25 with the correspondingly connected heat sinks 33, 35.
- the first heat sink 33 is formed as a ring around the diffuser 37 of the headlamp 1. This makes it possible to heat the diffuser 37 in bad weather conditions to the extent that an ice crystal formation is reliably prevented.
- the control of the changeover valve 21 is such that from a certain temperature of the ring is switched to the second condensation zone 25 to the diffusion plate 37 in order to ensure efficient cooling of the multi-chip LED 5 and to prevent overheating of the heat sink 33.
- the power supply to the multi-chip LEDs 5 is thereby accomplished by the heat pipe itself, which consists of an electrically conductive material such as aluminum or copper. If two of these conductive tubes are arranged coaxially with one another with insulation in between, a cost-effective and robust construction results Power supply for the multi-chip LEDs 5 and arranged on the module 11 electronics.
- FIG. 5 shows a schematic side view of the arrangement according to the invention for cooling semiconductor light sources.
- the switching valve 21 is controlled so that after switching on the multi-chip LED 5, the first condensation zone 23 with the first heat sink 33 is active. If the first heat sink has reached a certain temperature, the changeover valve 21 switches over to the second condensation zone 25 with the second heat sink 35. This is arranged behind the lampshade 53, and is sized in size so that they can absorb the heat energy generated at any time. If the temperature is not reached due to cold weather conditions, the first heat sink 33 remains permanently active in order to prevent ice crystal formation on the diffusing screen 37 as much as possible.
- Fig. 6 shows a schematic detail drawing of the switching valve 21. It consists of a T-shaped piece of pipe, in which a permanent magnetic double cone is introduced. This consists of two conical parts 411, 412, which are aligned at the base same profile or congruent to each other, so that the conical tips point in opposite directions. Between the two base surfaces can still be a cylindrical portion 413 lie. However, the base surfaces can also be arranged offset from each other (not shown), so that a zy-shaped slope arises between the two base surfaces. The base surfaces of the cones 411, 412 may also have an oval or ovate shape have (not shown). Polygons are also possible as a form of the base surface.
- the cone 411, 412 is then shaped corresponding to the base surface (not shown).
- This double cone 41 sits in the center of the T-shaped pipe piece.
- the outer shell consists of a gas-tight tube 47 into which a capillary tube 45 made of a porous material is introduced.
- the capillary tube 45 Within the capillary tube 45 is the evaporator tube 43.
- the capillary tube In the region of the double cone, the capillary tube is recessed or at least the wall thickness is formed weaker.
- the base diameter of the double cone 41 is larger than the diameter of the evaporator tube 43.
- the tips of the double cone 41 each have to the first and second condensation onszone 23, 25.
- the cone 41 can penetrate far enough into the evaporator tube 43 until it has completely closed.
- the capillary tube 45 remains unaffected, so that working fluid flowing back into the evaporator zone 27 can pass. This contributes to an efficient operation of the heat pipe 20.
- Externally attached to the tee are suitable controlled solenoids (not shown). These can, depending on the control, press the permanent-magnetic double cone 41 into the end of the evaporator tube 43 of the first or the second condensation zone 23, 25 and thus close it. Thus, it is possible to switch between the two cooling paths without affecting the heat flow altogether. Due to the construction as a 3-way valve 21, a heat flow into one of the condensation zones 23, 25 is always ensured. LIST OF REFERENCE NUMBERS
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2008/050324 WO2009089903A1 (en) | 2008-01-14 | 2008-01-14 | Arrangement for cooling semiconductor light sources and floodlight having this arrangement |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2229555A1 true EP2229555A1 (en) | 2010-09-22 |
EP2229555B1 EP2229555B1 (en) | 2011-11-02 |
Family
ID=39712436
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08707877A Active EP2229555B1 (en) | 2008-01-14 | 2008-01-14 | Arrangement for cooling semiconductor light sources and floodlight having this arrangement |
Country Status (8)
Country | Link |
---|---|
US (1) | US8342728B2 (en) |
EP (1) | EP2229555B1 (en) |
JP (1) | JP5210394B2 (en) |
KR (1) | KR20100114077A (en) |
CN (1) | CN101910715B (en) |
AT (1) | ATE532003T1 (en) |
TW (1) | TW200940894A (en) |
WO (1) | WO2009089903A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5425024B2 (en) * | 2010-09-07 | 2014-02-26 | シャープ株式会社 | Vehicle headlamp |
US8833975B2 (en) | 2010-09-07 | 2014-09-16 | Sharp Kabushiki Kaisha | Light-emitting device, illuminating device, vehicle headlamp, and method for producing light-emitting device |
US8482924B2 (en) * | 2010-10-11 | 2013-07-09 | Richard Redpath | Heat spreader facet plane apparatus |
EP2505913B1 (en) * | 2011-03-30 | 2016-03-23 | Nxp B.V. | An active thermal management device and thermal management method |
DE102012206447A1 (en) * | 2012-04-19 | 2013-10-24 | Osram Gmbh | LED MODULE |
SE536661C2 (en) * | 2012-09-24 | 2014-05-06 | Scania Cv Ab | ILLUMINATOR |
CN104696845A (en) * | 2015-02-07 | 2015-06-10 | 朱惠冲 | Refrigeration structure for LED headlamp |
JP5970572B1 (en) * | 2015-02-13 | 2016-08-17 | 株式会社フジクラ | Vehicle headlamp |
GB201509767D0 (en) * | 2015-06-05 | 2015-07-22 | Europ Thermodynamics Ltd | A lamp |
USD776336S1 (en) * | 2015-11-05 | 2017-01-10 | Koncept Technologies, Inc | Lamp |
CN105633259B (en) * | 2016-02-03 | 2019-12-06 | 张国生 | High-power LED light source based on heat pipe principle |
GB2596062B (en) * | 2020-06-10 | 2023-01-18 | Baldwin Tech Limited | LED array |
CN112178589B (en) * | 2020-09-30 | 2022-09-06 | 广州光科技术有限公司 | Heat dissipation system for automobile headlamp |
Family Cites Families (23)
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TW237589B (en) | 1991-02-27 | 1995-01-01 | Gen Electric | |
US7028899B2 (en) * | 1999-06-07 | 2006-04-18 | Metrologic Instruments, Inc. | Method of speckle-noise pattern reduction and apparatus therefore based on reducing the temporal-coherence of the planar laser illumination beam before it illuminates the target object by applying temporal phase modulation techniques during the transmission of the plib towards the target |
US7048412B2 (en) * | 2002-06-10 | 2006-05-23 | Lumileds Lighting U.S., Llc | Axial LED source |
JP2004127782A (en) * | 2002-10-04 | 2004-04-22 | Ichikoh Ind Ltd | Vehicle lamp and lighting device |
US6910794B2 (en) * | 2003-04-25 | 2005-06-28 | Guide Corporation | Automotive lighting assembly cooling system |
TWI225713B (en) * | 2003-09-26 | 2004-12-21 | Bin-Juine Huang | Illumination apparatus of light emitting diodes and method of heat dissipation thereof |
KR101097486B1 (en) * | 2004-06-28 | 2011-12-22 | 엘지디스플레이 주식회사 | back light unit of liquid crystal display device |
JP5179875B2 (en) | 2004-09-15 | 2013-04-10 | ソウル セミコンダクター カンパニー リミテッド | LIGHT EMITTING ELEMENT HAVING HEAT PIPE AND METHOD FOR PRODUCING HEAT PIPE LEAD FOR LIGHT EMITTING ELEMENT |
DE102004047324A1 (en) * | 2004-09-29 | 2006-04-13 | Osram Opto Semiconductors Gmbh | LED array |
US7331691B2 (en) * | 2004-10-29 | 2008-02-19 | Goldeneye, Inc. | Light emitting diode light source with heat transfer means |
JP4629558B2 (en) * | 2004-11-12 | 2011-02-09 | 昭和電工株式会社 | Vehicle lamp and lighting device |
WO2006052022A1 (en) | 2004-11-12 | 2006-05-18 | Showa Denko K.K. | Automotive lighting fixture and lighting device |
JP2006140084A (en) * | 2004-11-15 | 2006-06-01 | Koito Mfg Co Ltd | Vehicle lamp |
CN2748778Y (en) * | 2004-11-24 | 2005-12-28 | 超众科技股份有限公司 | Heat radiation arrangement for light-emitting diode lighting apparatus |
JP4265560B2 (en) * | 2005-03-31 | 2009-05-20 | 市光工業株式会社 | Vehicle lighting |
JP4527024B2 (en) * | 2005-07-28 | 2010-08-18 | 株式会社小糸製作所 | Vehicle lighting |
EP1916467A1 (en) * | 2005-08-19 | 2008-04-30 | NeoBulb Technologies, Inc. | Led illumination device with high power and high heat dissipation rate |
JP2007147257A (en) * | 2005-11-01 | 2007-06-14 | Showa Denko Kk | Heat radiator |
TWI307756B (en) * | 2006-12-08 | 2009-03-21 | Delta Electronics Inc | Light-emitting diode heat-dissipating module and display apparatus applied thereto |
TW200829852A (en) * | 2007-01-09 | 2008-07-16 | Univ Tamkang | Loop heat pipe with a flat plate evaporator structure |
US20080247177A1 (en) * | 2007-02-09 | 2008-10-09 | Toyoda Gosei Co., Ltd | Luminescent device |
CN101440949A (en) * | 2007-11-23 | 2009-05-27 | 富准精密工业(深圳)有限公司 | Heat radiating device |
FR2940407B1 (en) * | 2008-12-18 | 2013-11-22 | Valeo Vision Sas | COOLING DEVICE OF AN OPTICAL MODULE FOR AUTOMOTIVE PROJECTOR |
-
2008
- 2008-01-14 WO PCT/EP2008/050324 patent/WO2009089903A1/en active Application Filing
- 2008-01-14 EP EP08707877A patent/EP2229555B1/en active Active
- 2008-01-14 AT AT08707877T patent/ATE532003T1/en active
- 2008-01-14 CN CN2008801247080A patent/CN101910715B/en not_active Expired - Fee Related
- 2008-01-14 JP JP2010542535A patent/JP5210394B2/en not_active Expired - Fee Related
- 2008-01-14 KR KR1020107018004A patent/KR20100114077A/en active IP Right Grant
- 2008-01-14 US US12/812,939 patent/US8342728B2/en active Active
-
2009
- 2009-01-12 TW TW098100894A patent/TW200940894A/en unknown
Non-Patent Citations (1)
Title |
---|
See references of WO2009089903A1 * |
Also Published As
Publication number | Publication date |
---|---|
WO2009089903A1 (en) | 2009-07-23 |
US8342728B2 (en) | 2013-01-01 |
ATE532003T1 (en) | 2011-11-15 |
KR20100114077A (en) | 2010-10-22 |
CN101910715B (en) | 2012-11-07 |
JP5210394B2 (en) | 2013-06-12 |
EP2229555B1 (en) | 2011-11-02 |
CN101910715A (en) | 2010-12-08 |
JP2011510438A (en) | 2011-03-31 |
TW200940894A (en) | 2009-10-01 |
US20110051449A1 (en) | 2011-03-03 |
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