EP2229555A1 - Arrangement for cooling semiconductor light sources and floodlight having this arrangement - Google Patents

Arrangement for cooling semiconductor light sources and floodlight having this arrangement

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Publication number
EP2229555A1
EP2229555A1 EP08707877A EP08707877A EP2229555A1 EP 2229555 A1 EP2229555 A1 EP 2229555A1 EP 08707877 A EP08707877 A EP 08707877A EP 08707877 A EP08707877 A EP 08707877A EP 2229555 A1 EP2229555 A1 EP 2229555A1
Authority
EP
European Patent Office
Prior art keywords
condensation zone
arrangement according
heat
condensation
semiconductor light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP08707877A
Other languages
German (de)
French (fr)
Other versions
EP2229555B1 (en
Inventor
Alois Biebl
Stefan Dietz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2229555A1 publication Critical patent/EP2229555A1/en
Application granted granted Critical
Publication of EP2229555B1 publication Critical patent/EP2229555B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
    • F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
    • F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
    • F21S41/141—Light emitting diodes [LED]
    • F21S41/143—Light emitting diodes [LED] the main emission direction of the LED being parallel to the optical axis of the illuminating device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40—Cooling of lighting devices
    • F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/60—Heating of lighting devices, e.g. for demisting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/54—Cooling arrangements using thermoelectric means, e.g. Peltier elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2102/00—Exterior vehicle lighting devices for illuminating purposes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an arrangement for cooling semiconductor light sources, wherein the semiconductor light sources are arranged on a thermally conductive module, which is in operative connection with an evaporator zone of a heat pipe, and a first condensation zone of the heat pipe is connected to a first heat sink.
  • the arrangement is suitable for example for headlights of all kinds, but especially for headlights in the automotive sector.
  • a heat pipe is a tubular device that can carry large amounts of heat energy between its two ends by evaporating / condensing a working fluid.
  • US2004 / 213016 A1 discloses a cooling system for autonomous light arrangements which cools the semiconductor light sources by means of a heat pipe with a heat sink remote from the semiconductor light sources.
  • WO2006 / 52022 A1 discloses a motor vehicle headlamp with semiconductor light sources which are cooled by a heat pipe.
  • the heat sink is above the
  • the object is achieved with respect to the arrangement by an arrangement for cooling semiconductor light sources, wherein the semiconductor light sources are arranged on a thermally conductive module, which is in operative connection with an evaporator zone of a heat pipe, and a first condensation zone of the evaporator tube with a first heat sink wherein the heat pipe is connected to a second condensation zone with a second heat sink is connected and a heat flow between the condensation zones is switchable.
  • the heat sinks can be used as a controlled heating for other purposes, as can be switched by the switching of the heat flow at any time to the second heat sink, and thus no restriction in the operation of the semiconductor light sources occurs.
  • the second heat sink is designed so that it can absorb the waste heat of the semiconductor light sources at any time.
  • the switching of the condensation zones is done with a 3-way valve.
  • the 3-way valve contains a permanent magnetic double cone, wherein the conical tips in each case close the evaporator tube of a condensation zone alternately.
  • a 2-way valve is conceivable in which only one condensation zone is switched on and off. This has the advantage that a first cooling path into a first condensation zone is always open, while a second cooling path can be connected in a second condensation zone if necessary.
  • the double cone closes only the evaporator tube and not the capillary area of the heat pipe.
  • the drive of the double cone is arranged outside the heat pipe and takes place magnetically. Outside the heat pipe there is usually enough space available for the drive, and the magnetic drive does not require any sealing measures.
  • the heat sink (33) of the first condensation zone (23) is preferably in operative connection with a heating device. As a result, the waste heat produced can advantageously be used for another task.
  • the evaporator tube is advantageously open to the first condensation zone and the evaporator tube is closed to the second condensation zone.
  • the switching of the condensation zones is dependent on the temperature of the first condensation zone.
  • the power supply of the semiconductor light sources via the heat pipe via the heat pipe.
  • This has the advantage of a simpler and more reliable design.
  • simple and inexpensive tubes can be used as a power supply, wherein the two poles of the power supply are formed by the two coaxial tubes.
  • FIG. 1 A perspective view of a semiconductor light source module connected to a heat pipe with a rosette-shaped heat sink connected to the heat pipe in an embodiment according to the prior art.
  • FIG. 2 A detail drawing of the sectioned light source module with the illustrated end of the incorporated heat pipe.
  • FIG. 3 A perspective view of the above arrangement installed in a lampshade.
  • FIG. 4 A perspective view of an arrangement according to the invention for cooling semiconductor light sources with two independent heat sinks which are each connected to a condensation zone, it being possible to switch between the condensation zones.
  • FIG. 5 A schematic side view of an arrangement according to the invention for cooling semiconductor light sources.
  • FIG. 6 A perspective detail view of a changeover valve according to the invention.
  • FIG. 1 shows an embodiment of an arrangement for cooling semiconductor light sources according to the prior art with only one condensation zone, which is enclosed by a rosette-shaped heat sink 31, which dissipates the accumulating heat of condensation.
  • a multi-chip LED 5 (not shown) with an attached primary optics 51 is mounted on a light-emitting diode module 11.
  • the light-emitting diode module 11 is made of a good heat-conducting material in order to be able to dissipate the accumulated heat loss of the multi-chip LED 5 quickly and safely.
  • the light-emitting diode module 11 is embedded in a housing 13 which, in addition to the light-emitting diode module 11, also has a control electronics 15 for the multichip light-emitting diode 5.
  • the housing 13 is made of a poorly heat-conducting material in order to minimize the temperature load on the control electronics 15 through the multi-chip LED 5.
  • a heat pipe 20 leads from the light-emitting diode module 11 to a heat sink 31.
  • FIG. 2 shows a detail section through the light-emitting diode module 11 with the housing 13.
  • the heat pipe 20 is incorporated with its evaporator-side end 27 into the light-emitting diode module 11, and reaches as far as the multichip light-emitting diode 5 in order to reduce the heat loss to be able to move away as efficiently as possible.
  • the heat is transported from the heat pipe via the vaporized working medium in the condensation zone and there from the heat sink 31 (not shown in Fig. 2) absorbed.
  • FIG. 3 shows the entire arrangement installed in a reflector screen 53.
  • the heat sink 31 is mounted centrally on the reflector screen 53. All generated heat is thus discharged to the reflector screen 53 out.
  • the space at the front of a motor vehicle headlamp is limited, so that the size of a heat sink mounted there is often not sufficient to always be able to completely absorb the heat energy generated by the LEDs during operation of the headlamp 1 in a warm environment.
  • FIG. 4 shows a perspective view of an inventive arrangement for cooling semiconductor light sources, which solves the above-mentioned problem.
  • the arrangement is in this case a motor vehicle headlamp, in which the waste heat of the multi-chip LED 5 is passed through a heat pipe 20 to a condensation zone 23, which is cooled by a heat sink 33 and thus heats the scattering disk 37.
  • the inventive arrangement for cooling semiconductor light sources has two switchable heat sinks 33, 35. The switching is accomplished by means of a temperature-controlled valve in the heat pipe 20.
  • the first heat sink 33 is used as above besc written as heating, for example, the headlight deicing.
  • the temperature control is designed so that primarily this task is solved, this heat sink 33 is thus only as long in operation as here heat energy is needed. If the setpoint temperature is reached, is switched to a second heat sink 35. This is designed to be the to be able to absorb any heat flow at any time and at any time.
  • the second heat sink 35 may be a sufficiently large heat sink. But it is also conceivable that the second heat sink 35 is connected to an existing or to be created for cooling system.
  • the second heat sink 35 may be e.g. be connected to the water cooling of the motor vehicle. But it can also be e.g. a Peltier element may be provided which is connected to the second heat sink 35.
  • the heat pipe 20 has a switching valve 21, by means of which it is possible to switch between two condensation zones 23, 25 with the correspondingly connected heat sinks 33, 35.
  • the first heat sink 33 is formed as a ring around the diffuser 37 of the headlamp 1. This makes it possible to heat the diffuser 37 in bad weather conditions to the extent that an ice crystal formation is reliably prevented.
  • the control of the changeover valve 21 is such that from a certain temperature of the ring is switched to the second condensation zone 25 to the diffusion plate 37 in order to ensure efficient cooling of the multi-chip LED 5 and to prevent overheating of the heat sink 33.
  • the power supply to the multi-chip LEDs 5 is thereby accomplished by the heat pipe itself, which consists of an electrically conductive material such as aluminum or copper. If two of these conductive tubes are arranged coaxially with one another with insulation in between, a cost-effective and robust construction results Power supply for the multi-chip LEDs 5 and arranged on the module 11 electronics.
  • FIG. 5 shows a schematic side view of the arrangement according to the invention for cooling semiconductor light sources.
  • the switching valve 21 is controlled so that after switching on the multi-chip LED 5, the first condensation zone 23 with the first heat sink 33 is active. If the first heat sink has reached a certain temperature, the changeover valve 21 switches over to the second condensation zone 25 with the second heat sink 35. This is arranged behind the lampshade 53, and is sized in size so that they can absorb the heat energy generated at any time. If the temperature is not reached due to cold weather conditions, the first heat sink 33 remains permanently active in order to prevent ice crystal formation on the diffusing screen 37 as much as possible.
  • Fig. 6 shows a schematic detail drawing of the switching valve 21. It consists of a T-shaped piece of pipe, in which a permanent magnetic double cone is introduced. This consists of two conical parts 411, 412, which are aligned at the base same profile or congruent to each other, so that the conical tips point in opposite directions. Between the two base surfaces can still be a cylindrical portion 413 lie. However, the base surfaces can also be arranged offset from each other (not shown), so that a zy-shaped slope arises between the two base surfaces. The base surfaces of the cones 411, 412 may also have an oval or ovate shape have (not shown). Polygons are also possible as a form of the base surface.
  • the cone 411, 412 is then shaped corresponding to the base surface (not shown).
  • This double cone 41 sits in the center of the T-shaped pipe piece.
  • the outer shell consists of a gas-tight tube 47 into which a capillary tube 45 made of a porous material is introduced.
  • the capillary tube 45 Within the capillary tube 45 is the evaporator tube 43.
  • the capillary tube In the region of the double cone, the capillary tube is recessed or at least the wall thickness is formed weaker.
  • the base diameter of the double cone 41 is larger than the diameter of the evaporator tube 43.
  • the tips of the double cone 41 each have to the first and second condensation onszone 23, 25.
  • the cone 41 can penetrate far enough into the evaporator tube 43 until it has completely closed.
  • the capillary tube 45 remains unaffected, so that working fluid flowing back into the evaporator zone 27 can pass. This contributes to an efficient operation of the heat pipe 20.
  • Externally attached to the tee are suitable controlled solenoids (not shown). These can, depending on the control, press the permanent-magnetic double cone 41 into the end of the evaporator tube 43 of the first or the second condensation zone 23, 25 and thus close it. Thus, it is possible to switch between the two cooling paths without affecting the heat flow altogether. Due to the construction as a 3-way valve 21, a heat flow into one of the condensation zones 23, 25 is always ensured. LIST OF REFERENCE NUMBERS

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

An arrangement for cooling semiconductor light sources (5), wherein the semiconductor light sources (5) are arranged on a heat-conducting module (11), which is operatively connected to an evaporator zone (27) of a heat pipe (20), wherein a first condensation zone (23) of the heat pipe (20) is connected to a first heat sink (33), wherein the heat pipe (20) is connected to at least one second condensation zone (25) with at least one second heat sink (25), and a heat flow can be switched over between the condensation zones (23, 25) or the second condensation zone (25) can be switched in.

Description

Beschreibung description
[1] Anordnung zur Kühlung von Halbleiterlichtquellen und Scheinwerfer mit dieser Anordnung.[1] Arrangement for cooling semiconductor light sources and headlights with this arrangement.
Technisches GebietTechnical area
[2] Die Erfindung betrifft eine Anordnung zur Kühlung von Halbleiterlichtquellen, wobei die Halbleiterlichtquellen auf einem wärmeleitenden Modul angeordnet sind, das mit einer Verdampferzone eines Wärmerohrs in Wirkverbindung steht, und eine erste Kondensationszone des Wärmerohrs mit einer ersten Wärmesenke verbunden ist. Die Anordnung ist beispielsweise für Scheinwerfer aller Art geeignet, insbesondere aber für Scheinwerfer im Kfz- Bereich.The invention relates to an arrangement for cooling semiconductor light sources, wherein the semiconductor light sources are arranged on a thermally conductive module, which is in operative connection with an evaporator zone of a heat pipe, and a first condensation zone of the heat pipe is connected to a first heat sink. The arrangement is suitable for example for headlights of all kinds, but especially for headlights in the automotive sector.
[3] Als Wärmerohr (engl. Heat Pipe) wird im Folgenden eine rohrförmige Vorrichtung bezeichnet, die durch Ver- dampfen/Kondensieren einer Arbeitsflüssigkeit große Mengen an Wärmeenergie zwischen ihren zwei Enden transportieren kann.[3] In the following, a heat pipe is a tubular device that can carry large amounts of heat energy between its two ends by evaporating / condensing a working fluid.
Stand der TechnikState of the art
[4] Aus der US2004/213016 Al ist ein Kühlsystem für au- tomobile Lichtanordnungen bekannt, das die Halbleiterlichtquellen mittels eines Wärmerohrs mit entfernt von den Halbleiterlichtquellen liegender Wärmesenke kühlt.[0004] US2004 / 213016 A1 discloses a cooling system for autonomous light arrangements which cools the semiconductor light sources by means of a heat pipe with a heat sink remote from the semiconductor light sources.
[5] Die WO2006/52022 Al offenbart einen Kfz-Scheinwerfer mit Halbleiterlichtquellen, die über ein Wärmerohr ge- kühlt werden. Die Wärmesenke ist hierbei oberhalb der[5] WO2006 / 52022 A1 discloses a motor vehicle headlamp with semiconductor light sources which are cooled by a heat pipe. The heat sink is above the
Halbleiterlichtquellen an der Rückseite des Scheinwerfers platziert . [6] Es stellt sich jedoch das Problem dar, dass die Abwärme der Halbleiterlichtquellen oftmals an anderer Stelle als Heizwärme gebraucht würde. Da die Heizung aber meistens geregelt sein soll, ist die oben beschriebene Anordnung in so einem Fall nicht brauchbar.Semiconductor light sources placed on the back of the headlight. [6] However, the problem arises that the waste heat of the semiconductor light sources would often be needed elsewhere than thermal heat. However, since the heater should be mostly regulated, the arrangement described above is not useful in such a case.
Aufgabetask
[7] Es ist Aufgabe der Erfindung, eine Anordnung zur Kühlung von Halbleiterlichtquellen zu schaffen, wobei die Halbleiterlichtquellen auf einem wärmeleitenden Modul an- geordnet sind, das mit einer Verdampferzone eines Wärmerohrs in Wirkverbindung steht, und eine erste Kondensationszone des Verdampferrohrs mit einer ersten Wärmesenke verbunden ist, und die Anordnung gleichzeitig die ganze oder einen Teil der Wärmeenergie einer anderen Verwendung zuführen kann.[7] It is an object of the invention to provide an arrangement for cooling semiconductor light sources, wherein the semiconductor light sources are arranged on a thermally conductive module which is in operative connection with an evaporator zone of a heat pipe, and a first condensation zone of the evaporator tube with a first heat sink is connected, and at the same time the arrangement can supply all or part of the heat energy to another use.
[8] Es ist weiterhin Aufgabe der Erfindung, ein Verfahren zu schaffen, das zur Kühlung von Halbleiterlichtquellen dient und bei dem gleichzeitig die ganze oder ein Teil der Wärmeenergie einer anderen Verwendung zugeführt wird.It is a further object of the invention to provide a method which is used for cooling of semiconductor light sources and in which at the same time all or part of the heat energy is supplied to another use.
Darstellung der ErfindungPresentation of the invention
[9] Die Aufgabe wird bezüglich der Anordnung gelöst durch eine Anordnung zur Kühlung von Halbleiterlichtquellen, wobei die Halbleiterlichtquellen auf einem wärmelei- tenden Modul angeordnet sind, das mit einer Verdampferzone eines Wärmerohrs in Wirkverbindung steht, und eine erste Kondensationszone des Verdampferrohrs mit einer ersten Wärmesenke verbunden ist wobei das Wärmerohr an eine zweite Kondensationszone mit einer zweiten Wärmesenke angeschlossen ist und ein Wärmestrom zwischen den Kondensationszonen umschaltbar ist. Damit kann eine der Wärmesenken als geregelte Heizung für andere Zwecke benutzt werden, da durch die Umschaltung der Wärmestrom jederzeit auf die zweite Wärmesenke geschaltet werden kann, und somit keine Einschränkung beim Betrieb der Halbleiterlichtquellen auftritt. Die zweite Wärmesenke ist dabei so ausgelegt, dass sie die Abwärme der Halbleiterlichtquellen jederzeit absorbieren kann.[9] The object is achieved with respect to the arrangement by an arrangement for cooling semiconductor light sources, wherein the semiconductor light sources are arranged on a thermally conductive module, which is in operative connection with an evaporator zone of a heat pipe, and a first condensation zone of the evaporator tube with a first heat sink wherein the heat pipe is connected to a second condensation zone with a second heat sink is connected and a heat flow between the condensation zones is switchable. Thus, one of the heat sinks can be used as a controlled heating for other purposes, as can be switched by the switching of the heat flow at any time to the second heat sink, and thus no restriction in the operation of the semiconductor light sources occurs. The second heat sink is designed so that it can absorb the waste heat of the semiconductor light sources at any time.
[10] Die Aufgabe wird weiterhin bezüglich des Verfahrens gelöst durch ein Verfahren mit den Merkmalen des Anspruchs 16.[10] The object is further achieved with respect to the method by a method having the features of claim 16.
[11] Vorteilhafterweise geschieht die Umschaltung der Kondensationszonen mit einem 3-Wege Ventil. Dabei enthält das 3-Wege Ventil einen permanentmagnetischen Doppelkegel, wobei die Kegelspitzen jeweils das Verdampferrohr einer Kondensationszone abwechselnd verschließen. Dies hat den Vorteil, dass immer ein Kühlpfad geöffnet ist und ein Versagen der Halbleiterlichtquellen aufgrund Überhit- zung somit ausgeschlossen wird. Durch diese Konstruktion ist ein magnetischer Antrieb des Doppelkegels möglich, der keine Probleme bezüglich der Abdichtung generiert.Advantageously, the switching of the condensation zones is done with a 3-way valve. In this case, the 3-way valve contains a permanent magnetic double cone, wherein the conical tips in each case close the evaporator tube of a condensation zone alternately. This has the advantage that a cooling path is always open and thus failure of the semiconductor light sources due to overheating is ruled out. By this construction, a magnetic drive of the double cone is possible, which generates no problems with the seal.
[12] Alternativ ist auch ein 2-Wege Ventil denkbar, bei dem nur eine Kondensationszone Ein- und Ausgeschaltet wird. Dies hat den Vorteil, dass ein erster Kühlpfad in eine erste Kondensationszone immer offen ist, während ein zweiter Kühlpfad in eine zweite Kondensationszone bei Bedarf hinzugeschaltet werden kann.Alternatively, a 2-way valve is conceivable in which only one condensation zone is switched on and off. This has the advantage that a first cooling path into a first condensation zone is always open, while a second cooling path can be connected in a second condensation zone if necessary.
[13] Bevorzugt verschließt der Doppelkegel nur das Ver- dampferrohr und nicht den Kapillarbereich des Wärmerohrs. Dadurch kann zurückfliessende Arbeitsflüssigkeit wieder in den Arbeitskreislauf gelangen, was zu erhöhter Effizienz und Betriebssicherheit führt. Der Antrieb des Doppelkegels ist dabei außerhalb des Wärmerohrs angeordnet und erfolgt magnetisch. Außerhalb des Wärmerohrs steht gewöhnlich genügend Platz für den Antrieb zur Verfügung, und durch den magnetischen Antrieb sind keine Dichtungsmaßnahmen notwendig.[13] Preferably, the double cone closes only the evaporator tube and not the capillary area of the heat pipe. As a result, returning working fluid can get back into the working cycle, which leads to increased efficiency and reliability. The drive of the double cone is arranged outside the heat pipe and takes place magnetically. Outside the heat pipe there is usually enough space available for the drive, and the magnetic drive does not require any sealing measures.
[14] Die Wärmesenke (33) der ersten Kondensationszone (23) steht dabei vorzugsweise mit einer Heizvorrichtung in Wirkverbindung Dadurch kann die entstehende Abwärme vorteilhaft für eine andere Aufgabe genutzt werden.The heat sink (33) of the first condensation zone (23) is preferably in operative connection with a heating device. As a result, the waste heat produced can advantageously be used for another task.
[15] Beim Einschalten der Halbleiterlichtquellen ist das Verdampferrohr Vorteilhafterweise zur ersten Kondensati- onszone offen und das Verdampferrohr zur zweiten Kondensationszone verschlossen. Die Umschaltung der Kondensationszonen erfolgt abhängig von der Temperatur der ersten Kondensationszone. Dadurch kann die vorgenannte Heizvorrichtung geregelt ausgeführt werden, und durch diese Vor- rangschaltung ist ein definierter Betrieb der Anordnung zur Kühlung von Halbleiterlichtquellen möglich.[15] When the semiconductor light sources are switched on, the evaporator tube is advantageously open to the first condensation zone and the evaporator tube is closed to the second condensation zone. The switching of the condensation zones is dependent on the temperature of the first condensation zone. As a result, the abovementioned heating device can be designed to be regulated, and by means of this pre-switching circuit, a defined operation of the arrangement for cooling semiconductor light sources is possible.
[16] In einer Ausführungsform erfolgt die Stromzuführung der Halbleiterlichtquellen über das Wärmerohr. Dies hat den Vorteil einer einfacheren und zuverlässigeren Kon- struktion. Bei einer koaxialen Konstruktion des Wärmerohrs können einfache und kostengünstige Rohre als Stromzuführung verwendet werden, wobei die beiden Pole der Stromzuführung durch die beiden koaxialen Rohre gebildet werden .[16] In one embodiment, the power supply of the semiconductor light sources via the heat pipe. This has the advantage of a simpler and more reliable design. In a coaxial construction of the heat pipe simple and inexpensive tubes can be used as a power supply, wherein the two poles of the power supply are formed by the two coaxial tubes.
Kurze Beschreibung der Zeichnung (en) [17] Die Erfindung wird nachstehend anhand von Ausführungsbeispielen näher erläutert. Es zeigen:Short description of the drawing (s) [17] The invention will be explained in more detail below with reference to exemplary embodiments. Show it:
[18] Fig. 1 Eine perspektivische Ansicht eines an ein Wärmerohr angeschlossenes Halbleiterlicht- quellenmodul mit einem an das Wärmerohr angeschlossenen rosettenförmigen Kühlkörper in einer Ausführungsform nach dem Stand der Technik.[18] FIG. 1 A perspective view of a semiconductor light source module connected to a heat pipe with a rosette-shaped heat sink connected to the heat pipe in an embodiment according to the prior art.
[19] Fig. 2 Eine Detailzeichnung des geschnittenen HaIb- leiterlichtquellenmoduls mit dem dargestellten Ende des eingearbeiteten Wärmerohrs.[19] Fig. 2 A detail drawing of the sectioned light source module with the illustrated end of the incorporated heat pipe.
[20] Fig. 3 Eine perspektivische Ansicht der obigen Anordnung, eingebaut in einen Lampenschirm.[20] Fig. 3 A perspective view of the above arrangement installed in a lampshade.
[21] Fig. 4 Eine perspektivische Ansicht einer erfin- dungsgemäßen Anordnung zur Kühlung von Halbleiterlichtquellen mit zwei unabhängigen Wärmesenken die an je eine Kondensationszone angeschlossen sind, wobei zwischen den Kondensationszonen umgeschaltet werden kann.[21] FIG. 4 A perspective view of an arrangement according to the invention for cooling semiconductor light sources with two independent heat sinks which are each connected to a condensation zone, it being possible to switch between the condensation zones.
[22] Fig. 5 Eine schematische Seitenansicht einer erfindungsgemäßen Anordnung zur Kühlung von Halbleiterlichtquellen .[22] FIG. 5 A schematic side view of an arrangement according to the invention for cooling semiconductor light sources.
[23] Fig. 6 Eine perspektivische Detailansicht eines erfindungsgemäßen Umschaltventils.[23] Fig. 6 A perspective detail view of a changeover valve according to the invention.
Bevorzugte Ausführung der Erfindung [24] Fig. 1 zeigt eine Ausführungsform einer Anordnung zur Kühlung von Halbleiterlichtquellen nach dem Stand der Technik mit lediglich einer Kondensationszone, die von einem rosettenförmigen Kühlkörper 31 umschlossen ist, der die anfallende Kondensationswärme abführt. Eine Multi- chip-Leuchtdiode 5 (nicht gezeigt) mit einer aufgesetzten Primäroptik 51 ist auf einem Leuchtdiodenmodul 11 angebracht. Das Leuchtdiodenmodul 11 ist aus einem gut wärmeleitenden Material hergestellt, um die anfallende Ver- lustwärme der Multichip-Leuchtdiode 5 schnell und sicher abführen zu können. Das Leuchtdiodenmodul 11 ist in ein Gehäuse 13 eingebettet, das neben dem Leuchtdiodenmodul 11 noch eine Ansteuerelektronik 15 für die Multichip- Leuchtdiode 5 aufweist. Das Gehäuse 13 ist dabei aus ei- nem schlecht Wärme leitenden Material ausgeführt, um die Temperaturbelastung der Ansteuerelektronik 15 durch die Multichip-Leuchtdiode 5 zu minimieren. Ein Wärmerohr 20 führt vom Leuchtdiodenmodul 11 zu einem Kühlkörper 31.Preferred embodiment of the invention [24] FIG. 1 shows an embodiment of an arrangement for cooling semiconductor light sources according to the prior art with only one condensation zone, which is enclosed by a rosette-shaped heat sink 31, which dissipates the accumulating heat of condensation. A multi-chip LED 5 (not shown) with an attached primary optics 51 is mounted on a light-emitting diode module 11. The light-emitting diode module 11 is made of a good heat-conducting material in order to be able to dissipate the accumulated heat loss of the multi-chip LED 5 quickly and safely. The light-emitting diode module 11 is embedded in a housing 13 which, in addition to the light-emitting diode module 11, also has a control electronics 15 for the multichip light-emitting diode 5. In this case, the housing 13 is made of a poorly heat-conducting material in order to minimize the temperature load on the control electronics 15 through the multi-chip LED 5. A heat pipe 20 leads from the light-emitting diode module 11 to a heat sink 31.
[25] Fig. 2 zeigt einen Detailschnitt durch das Leuchtdi- odenmodul 11 mit dem Gehäuse 13. Das Wärmerohr 20 ist mit seinem verdampferseitigem Ende 27 in das Leuchtdiodenmodul 11 eingearbeitet, und reicht bis an die Multichip- Leuchtdiode 5 heran, um die anfallende Verlustwärme möglichst effizient abtransportieren zu können. Die Wärme wird vom Wärmerohr über das verdampfte Arbeitsmedium in die Kondensationszone transportiert und dort vom Kühlkörper 31 (In Fig. 2 nicht gezeigt) absorbiert.FIG. 2 shows a detail section through the light-emitting diode module 11 with the housing 13. The heat pipe 20 is incorporated with its evaporator-side end 27 into the light-emitting diode module 11, and reaches as far as the multichip light-emitting diode 5 in order to reduce the heat loss to be able to move away as efficiently as possible. The heat is transported from the heat pipe via the vaporized working medium in the condensation zone and there from the heat sink 31 (not shown in Fig. 2) absorbed.
[26] Fig. 3 zeigt die ganze Anordnung in einen Reflektorschirm 53 eingebaut. Der Kühlkörper 31 ist mittig am Re- flektorschirm 53 angebracht. Sämtliche erzeugte Wärme wird also zum Reflektorschirm 53 hin abgeleitet. [27] Bei Kfz-Scheinwerfern nach dem Stand der Technik besteht jedoch oft das Problem der Vereisung der Streuscheibe. Diese muss im Winter geheizt werden, sonst bilden sich Eiskristalle an der Außenseite, die zu starker Blendung des Gegenverkehrs führen können. Daher würde es sich anbieten, die Abwärme der Leuchtdioden zur Heizung der Streuscheibe zu verwenden. Der Bauraum an der Vorderseite eines Kfz-Scheinwerfers ist jedoch begrenzt, so dass die Größe eines dort angebrachten Kühlkörpers oft nicht ausreichend ist, um die von den Leuchtdioden erzeugte Wärmeenergie beim Betrieb des Scheinwerfers 1 in warmer Umgebung immer komplett absorbieren zu können.FIG. 3 shows the entire arrangement installed in a reflector screen 53. The heat sink 31 is mounted centrally on the reflector screen 53. All generated heat is thus discharged to the reflector screen 53 out. However, in motor vehicle headlights according to the prior art, there is often the problem of icing of the lens. This must be heated in winter, otherwise ice crystals form on the outside, which can lead to strong glare of oncoming traffic. Therefore, it would be useful to use the waste heat of the LEDs for heating the lens. However, the space at the front of a motor vehicle headlamp is limited, so that the size of a heat sink mounted there is often not sufficient to always be able to completely absorb the heat energy generated by the LEDs during operation of the headlamp 1 in a warm environment.
[28] Fig. 4 zeigt eine perspektivische Ansicht einer erfindungsgemäßen Anordnung zur Kühlung von Halbleiter- lichtquellen, die das oben genannte Problem löst. Die Anordnung ist in diesem Fall ein Kfz-Scheinwerfer, bei dem die Abwärme der Multichip-Leuchtdiode 5 über ein Wärmerohr 20 zur einer Kondensationszone 23 geführt wird, die von einer Wärmesenke 33 gekühlt wird und damit die Streu- Scheibe 37 heizt. Die erfindungsgemäße Anordnung zur Kühlung von Halbleiterlichtquellen weist zwei umschaltbare Wärmesenken 33, 35 auf. Die Umschaltung wird mittels eines temperaturgesteuerten Ventils im Wärmerohr 20 bewerkstelligt. Die erste Wärmesenke 33 dient wie oben besc hrieben als Heizung, z.B. zur Scheinwerferenteisung. Die Temperatursteuerung ist so ausgelegt, dass vorrangig diese Aufgabe gelöst wird, diese Wärmesenke 33 ist also nur so lange in Betrieb wie hier Wärmeenergie benötigt wird. Ist die Solltemperatur erreicht, wird auf eine zweite Wärmesenke 35 umgeschaltet. Diese ist dazu ausgelegt, den anfallenden Wärmestrom immer und zu jeder Zeit absorbieren zu können.[28] FIG. 4 shows a perspective view of an inventive arrangement for cooling semiconductor light sources, which solves the above-mentioned problem. The arrangement is in this case a motor vehicle headlamp, in which the waste heat of the multi-chip LED 5 is passed through a heat pipe 20 to a condensation zone 23, which is cooled by a heat sink 33 and thus heats the scattering disk 37. The inventive arrangement for cooling semiconductor light sources has two switchable heat sinks 33, 35. The switching is accomplished by means of a temperature-controlled valve in the heat pipe 20. The first heat sink 33 is used as above besc written as heating, for example, the headlight deicing. The temperature control is designed so that primarily this task is solved, this heat sink 33 is thus only as long in operation as here heat energy is needed. If the setpoint temperature is reached, is switched to a second heat sink 35. This is designed to be the to be able to absorb any heat flow at any time and at any time.
[29] Die zweite Wärmesenke 35 kann dabei ein genügend großer Kühlkörper sein. Es ist aber auch denkbar, das die zweite Wärmesenke 35 an ein bestehendes oder dafür zu schaffendes Kühlsystem angeschlossen ist. Die zweite Wärmesenke 35 kann dabei z.B. an die Wasserkühlung des Kraftfahrzeugs angeschlossen sein. Es kann aber auch z.B. ein Peltierelement vorgesehen sein, das an die zweite Wärmesenke 35 angeschlossen ist.[29] The second heat sink 35 may be a sufficiently large heat sink. But it is also conceivable that the second heat sink 35 is connected to an existing or to be created for cooling system. The second heat sink 35 may be e.g. be connected to the water cooling of the motor vehicle. But it can also be e.g. a Peltier element may be provided which is connected to the second heat sink 35.
[30] Das Wärmerohr 20 weist ein Umschaltventil 21 auf, mittels dem zwischen zwei Kondensationszonen 23, 25 mit den entsprechend angeschlossenen Wärmesenken 33, 35 umgeschaltet werden kann. Die erste Wärmesenke 33 ist dabei als Ring um die Streuscheibe 37 des Scheinwerfers 1 ausgebildet. Dies ermöglicht es die Streuscheibe 37 bei schlechter Witterung soweit aufzuheizen, dass eine Eiskristallbildung sicher unterbunden wird. Dabei ist die Steuerung des Umschaltventils 21 so beschaffen, dass ab einer bestimmten Temperatur des Rings um die Streuscheibe 37 auf die zweite Kondensationszone 25 umgeschaltet wird, um eine effiziente Kühlung der Multichip-Leuchtdiode 5 zu gewährleisten und eine Überhitzung der Wärmesenke 33 zu verhindern .The heat pipe 20 has a switching valve 21, by means of which it is possible to switch between two condensation zones 23, 25 with the correspondingly connected heat sinks 33, 35. The first heat sink 33 is formed as a ring around the diffuser 37 of the headlamp 1. This makes it possible to heat the diffuser 37 in bad weather conditions to the extent that an ice crystal formation is reliably prevented. In this case, the control of the changeover valve 21 is such that from a certain temperature of the ring is switched to the second condensation zone 25 to the diffusion plate 37 in order to ensure efficient cooling of the multi-chip LED 5 and to prevent overheating of the heat sink 33.
[31] Die Stromzuführung zu den Multichip-Leuchtdioden 5 wird dabei durch das Wärmerohr selbst bewerkstelligt, das aus einem elektrisch leitenden Material wie Aluminium o- der Kupfer besteht. Werden zwei dieser leitenden Rohre mit einer Isolierung dazwischen koaxial ineinander ange- ordnet, so entsteht eine kostengünstige und robuste Stromzuführung für die Multichip-Leuchtdioden 5 und die auf dem Modul 11 angeordnete Elektronik.[31] The power supply to the multi-chip LEDs 5 is thereby accomplished by the heat pipe itself, which consists of an electrically conductive material such as aluminum or copper. If two of these conductive tubes are arranged coaxially with one another with insulation in between, a cost-effective and robust construction results Power supply for the multi-chip LEDs 5 and arranged on the module 11 electronics.
[32] Fig. 5 zeigt eine schematische Seitenansicht der erfindungsgemäßen Anordnung zur Kühlung von Halbleiter- lichtquellen . Wie oben schon angedeutet, wird das Umschaltventil 21 so gesteuert, dass nach dem Einschalten der Multichip-Leuchtdiode 5 die erste Kondensationszone 23 mit der ersten Wärmesenke 33 aktiv ist. Hat die erste Wärmesenke eine bestimmte Temperatur erreicht, so schal- tet das Umschaltventil 21 auf die zweite Kondensationszone 25 mit der zweiten Wärmesenke 35 um. Diese ist hinter dem Lampenschirm 53 angeordnet, und ist von der Größe her so bemessen, dass sie die anfallende Wärmeenergie jederzeit absorbieren kann. Wird die Temperatur aufgrund kalter Witterungsverhältnisse nicht erreicht, so bleibt permanent die erste Wärmesenke 33 aktiv, um Eiskristallbildung auf der Streuscheibe 37 möglichst zu verhindern.[32] FIG. 5 shows a schematic side view of the arrangement according to the invention for cooling semiconductor light sources. As already indicated above, the switching valve 21 is controlled so that after switching on the multi-chip LED 5, the first condensation zone 23 with the first heat sink 33 is active. If the first heat sink has reached a certain temperature, the changeover valve 21 switches over to the second condensation zone 25 with the second heat sink 35. This is arranged behind the lampshade 53, and is sized in size so that they can absorb the heat energy generated at any time. If the temperature is not reached due to cold weather conditions, the first heat sink 33 remains permanently active in order to prevent ice crystal formation on the diffusing screen 37 as much as possible.
[33] Fig. 6 zeigt eine schematische Detailzeichnung des Umschaltventils 21. Es besteht aus einem T-förmigen Rohrstück, in das ein permanentmagnetischer Doppelkegel eingebracht ist. Dieser besteht aus zwei Kegelförmigen Teilen 411, 412, die an der Basis profilgleich oder deckungsgleich zueinander ausgerichtet sind, so dass die Kegelspitzen in entgegengesetzte Richtungen zeigen. Zwischen den beiden Basisflächen kann noch ein zylinderförmiger Abschnitt 413 liegen. Die Basisflächen können aber auch gegeneinander versetzt angeordnet sein (nicht gezeigt) , so dass zwischen den beiden Basisflächen eine zy- linderförmige Schräge entsteht. Die Basisflächen der Kegel 411, 412 können auch eine ovale oder eiförmige Form aufweisen (nicht gezeigt) . Auch Vielecke sind als Form der Basisfläche möglich. Der Kegel 411, 412 ist dann entsprechend der Basisfläche geformt (nicht gezeigt) . Dieser Doppelkegel 41 sitzt im Zentrum des T-förmigen Rohr- Stücks. An den geschnittenen Enden ist der Querschnitt des Wärmerohrs 20 gezeigt. Die äußere Hülle besteht aus einem gasdichten Rohr 47, in das ein Kapillarrohr 45 aus einem porösen Material eingebracht ist. Innerhalb des Kapillarrohrs 45 liegt das Verdampferrohr 43. Im Bereich des Doppelkegels ist das Kapillarrohr ausgespart oder zumindest die Wanddicke schwächer ausgebildet. Der Basisdurchmesser des Doppelkegels 41 ist größer als der Durchmesser des Verdampferrohrs 43. Die Spitzen des Doppelkegels 41 weisen jeweils zur ersten und zweiten Kondensati- onszone 23, 25. Der Kegel 41 kann soweit in das Verdampferrohr 43 eindringen, bis er es komplett verschlossen hat. Das Kapillarrohr 45 bleibt davon unberührt, so dass zurückfließendes Arbeitsmittel wieder in die Verdampferzone 27 gelangen kann. Dies trägt zu einer effizienten Arbeitsweise des Wärmerohrs 20 bei. Außen an dem T-Stück sind geeignete gesteuerte Elektromagnete angeordnet (nicht gezeigt) . Diese können je nach Ansteuerung den permanentmagnetischen Doppelkegel 41 in das Ende des Verdampferrohrs 43 der ersten oder der zweiten Kondensati- onszone 23, 25 drücken und dieses somit verschließen. Somit kann zwischen den beiden Kühlpfaden umgeschaltet werden, ohne dass der Wärmefluss insgesamt beeinträchtigt wird. Durch die Konstruktion als 3-Wege Ventil 21 ist ein Wärmefluss in eine der Kondensationszonen 23, 25 immer gewährleistet. Bezugszeichenliste[33] Fig. 6 shows a schematic detail drawing of the switching valve 21. It consists of a T-shaped piece of pipe, in which a permanent magnetic double cone is introduced. This consists of two conical parts 411, 412, which are aligned at the base same profile or congruent to each other, so that the conical tips point in opposite directions. Between the two base surfaces can still be a cylindrical portion 413 lie. However, the base surfaces can also be arranged offset from each other (not shown), so that a zy-shaped slope arises between the two base surfaces. The base surfaces of the cones 411, 412 may also have an oval or ovate shape have (not shown). Polygons are also possible as a form of the base surface. The cone 411, 412 is then shaped corresponding to the base surface (not shown). This double cone 41 sits in the center of the T-shaped pipe piece. At the cut ends, the cross section of the heat pipe 20 is shown. The outer shell consists of a gas-tight tube 47 into which a capillary tube 45 made of a porous material is introduced. Within the capillary tube 45 is the evaporator tube 43. In the region of the double cone, the capillary tube is recessed or at least the wall thickness is formed weaker. The base diameter of the double cone 41 is larger than the diameter of the evaporator tube 43. The tips of the double cone 41 each have to the first and second condensation onszone 23, 25. The cone 41 can penetrate far enough into the evaporator tube 43 until it has completely closed. The capillary tube 45 remains unaffected, so that working fluid flowing back into the evaporator zone 27 can pass. This contributes to an efficient operation of the heat pipe 20. Externally attached to the tee are suitable controlled solenoids (not shown). These can, depending on the control, press the permanent-magnetic double cone 41 into the end of the evaporator tube 43 of the first or the second condensation zone 23, 25 and thus close it. Thus, it is possible to switch between the two cooling paths without affecting the heat flow altogether. Due to the construction as a 3-way valve 21, a heat flow into one of the condensation zones 23, 25 is always ensured. LIST OF REFERENCE NUMBERS
1 Scheinwerfer1 headlight
11 Leuchtdiodenmodul aus gut wärmeleitenden Material11 Light-emitting diode module made of good heat-conducting material
13 Gehäuse 15 Ansteuerelektronik13 housing 15 control electronics
20 Wärmerohr20 heat pipe
21 Umschaltventil des Wärmerohrs21 Changeover valve of the heat pipe
31 Kühlkörper31 heat sink
23 Erste Kondensationszone 33 Wärmesenke für die erste Kondensationszone23 First condensation zone 33 Heat sink for the first condensation zone
25 Zweite Kondensationszone25 second condensation zone
27 Verdampferzone27 evaporator zone
35 Wärmesenke für die zweite Kondensationszone35 heat sink for the second condensation zone
37 Streuscheibe 41 permanentmagnetischer Doppelkegel37 Diffuser 41 permanent magnetic double cone
411 Erster Kegel411 First cone
412 Zweiter Kegel412 Second cone
413 Kegelmittelstück 43 Verdampferrohr 45 Kapillarrohr413 Taper middle piece 43 Evaporator tube 45 Capillary tube
47 Äußeres gasdichtes Rohr47 Outer gastight tube
5 Multichip-Leuchtdiode5 multi-chip LED
51 Primäroptik51 Primary optics
53 Lampenschirm 53 lampshade

Claims

Ansprüche claims
1. Anordnung zur Kühlung von Halbleiterlichtquellen (5), wobei die Halbleiterlichtquellen (5) auf einem wärmeleitenden Modul (11) angeordnet sind, das mit einer Verdampferzone (27) eines Wärmerohrs (20) in Wirkver- bindung steht, wobei eine erste Kondensationszone (23) des Wärmerohrs (20) mit einer ersten Wärmesenke (33) verbunden ist, dadurch gekennzeichnet, dass das Wärmerohr (20) an mindestens eine zweite Kondensationszone (25) mit mindestens einer zweiten Wärmesenke (35) angeschlossen ist und ein Wärmestrom zwischen den Kondensationszonen (23, 25) umschaltbar ist oder die zweite Kondensationszone (25) zuschaltbar ist.1. Arrangement for cooling semiconductor light sources (5), wherein the semiconductor light sources (5) are arranged on a thermally conductive module (11), which is in operative connection with an evaporator zone (27) of a heat pipe (20), wherein a first condensation zone ( 23) of the heat pipe (20) is connected to a first heat sink (33), characterized in that the heat pipe (20) is connected to at least one second condensation zone (25) with at least one second heat sink (35) and a heat flow between the condensation zones (23, 25) is switchable or the second condensation zone (25) is switchable.
2. Anordnung nach Anspruch 1, dadurch gekennzeichnet, dass das die Anordnung ein 3-Wege Ventil (21) zur Um- Schaltung des Wärmestroms in die Kondensationszonen (23, 25) aufweist.2. Arrangement according to claim 1, characterized in that the arrangement comprises a 3-way valve (21) for switching the heat flow in the condensation zones (23, 25).
3. Anordnung nach Anspruch 2, dadurch gekennzeichnet, dass das 3-Wege Ventil einen permanentmagnetischen Doppelkegel (41) enthält, und die Kegelspitzen jeweils das Ende des Verdampferrohrs (43) einer Kondensationszone abwechselnd verschließen.3. Arrangement according to claim 2, characterized in that the 3-way valve contains a permanent magnetic double cone (41), and the conical tips in each case close the end of the evaporator tube (43) of a condensation zone alternately.
4. Anordnung nach Anspruch 1-3, dadurch gekennzeichnet, dass ein Kapillarrohr (45) das koaxial um das Verdampferrohr (43) herum angeordnet ist, immer offen ist.4. Arrangement according to claim 1-3, characterized in that a capillary tube (45) which is arranged coaxially around the evaporator tube (43) around, is always open.
5. Anordnung nach Anspruch 3 oder 4, dadurch gekennzeichnet, dass ein Antrieb des Doppelkegels (41) außerhalb des Wärmerohrs (20) angeordnet ist. 5. Arrangement according to claim 3 or 4, characterized in that a drive of the double cone (41) outside of the heat pipe (20) is arranged.
6. Anordnung nach einem der Ansprüche 3-5, dadurch gekennzeichnet, dass der Antrieb des Doppelkegels (41) magnetisch erfolgt.6. Arrangement according to one of claims 3-5, characterized in that the drive of the double cone (41) takes place magnetically.
7. Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass bei Inbetriebnahme der7. Arrangement according to one of the preceding claims, characterized in that at start-up of
Halbleiterlichtquellen (5) das Verdampferrohr zur ersten Kondensationszone (23) geöffnet und das Verdampferrohr zur zweiten Kondensationszone (25) verschlossen ist.Semiconductor light sources (5) the evaporator tube to the first condensation zone (23) opened and the evaporator tube to the second condensation zone (25) is closed.
8. Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass sie eine Vorrichtung zum Umschalten des Wärmestroms in die Kondensationszonen (23, 25) abhängig von der Temperatur der ersten Kondensationszone (23) aufweist.8. Arrangement according to one of the preceding claims, characterized in that it comprises a device for switching the heat flow in the condensation zones (23, 25) depending on the temperature of the first condensation zone (23).
9. Anordnung nach Anspruch 1, dadurch gekennzeichnet, dass sie ein 2-Wege Ventil zur Ein- und Ausschaltung des Wärmestroms in die zweite Kondensationszone aufweist, wobei der Wärmestrom in die erste Kondensationszone immer möglich ist.9. Arrangement according to claim 1, characterized in that it comprises a 2-way valve for switching on and off of the heat flow in the second condensation zone, wherein the heat flow into the first condensation zone is always possible.
10. Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Wärmerohr (20) gleichzeitig mindestens eine Stromzuführung für die Halbleiterlichtquellen (5) ist.10. Arrangement according to one of the preceding claims, characterized in that the heat pipe (20) at the same time at least one power supply for the semiconductor light sources (5).
11. Anordnung nach Anspruch 9, dadurch gekennzeichnet, dass die Stromzuführung über mindestens zwei koaxiale Rohre bewerkstelligt wird. 11. Arrangement according to claim 9, characterized in that the power supply is accomplished via at least two coaxial tubes.
12. Anordnung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Wärmesenke (33) der ersten Kondensationszone (23) mit einer Heizvorrichtung in Wirkverbindung steht.12. Arrangement according to one of the preceding claims, characterized in that the heat sink (33) of the first condensation zone (23) is in operative connection with a heating device.
13. Scheinwerfer (1) mit einer Anordnung nach Anspruch 11, dadurch gekennzeichnet, dass die Anordnung die Heizvorrichtung zum Beheizen einer Streuscheibe (37) des Scheinwerfers (1) aufweist.13. Headlight (1) with an arrangement according to claim 11, characterized in that the arrangement comprises the heating device for heating a lens (37) of the headlight (1).
14. Scheinwerfer (1) nach Anspruch 12, dadurch gekenn- zeichnet, dass die zweite Kondensationszone (25) unterhalb des Scheinwerfers (1) angeordnet und fahrtwindgekühlt ist.14. Headlight (1) according to claim 12, characterized in that the second condensation zone (25) below the headlight (1) is arranged and cooled by wind.
15. Scheinwerfer (1) nach Anspruch 14, dadurch gekennzeichnet, dass die zweite Kondensationszone (25) hin- ter dem Scheinwerfer (1) angeordnet ist.15. Headlight (1) according to claim 14, characterized in that the second condensation zone (25) is arranged behind the headlight (1).
16. Verfahren zur Kühlung von Halbleiterlichtquellen (5) mit einer Anordnung nach einem der Ansprüche 1-15, gekennzeichnet durch folgende Schritte:16. A method for cooling semiconductor light sources (5) with an arrangement according to one of claims 1-15, characterized by the following steps:
- Einschalten einer ersten Kondensationszone (23) bei Inbetriebnahme- Turning on a first condensation zone (23) at startup
- Bei Überschreiten einer vorbestimmten Temperatur der ersten Kondensationszone (23) Abschalten dieser Kondensationszone und Einschalten einer zweiten Kondensationszone (25) oder Zuschalten einer zweiten Kondensationszone (25) .- When a predetermined temperature of the first condensation zone (23) is exceeded, switching off this condensation zone and switching on a second condensation zone (25) or connecting a second condensation zone (25).
- Bei Unterschreiten einer vorbestimmten Temperatur der ersten Kondensationszone (23) Umschalten auf die erste Kondensationszone (23) oder Abschalten der zweiten Kondensationszone (25) . - When falling below a predetermined temperature of the first condensation zone (23) switching to the first condensation zone (23) or switching off the second condensation zone (25).
EP08707877A 2008-01-14 2008-01-14 Arrangement for cooling semiconductor light sources and floodlight having this arrangement Active EP2229555B1 (en)

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US8342728B2 (en) 2013-01-01
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CN101910715B (en) 2012-11-07
JP5210394B2 (en) 2013-06-12
EP2229555B1 (en) 2011-11-02
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TW200940894A (en) 2009-10-01
US20110051449A1 (en) 2011-03-03

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