EP2226590B1 - Throughflow heater - Google Patents

Throughflow heater Download PDF

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Publication number
EP2226590B1
EP2226590B1 EP10162910.3A EP10162910A EP2226590B1 EP 2226590 B1 EP2226590 B1 EP 2226590B1 EP 10162910 A EP10162910 A EP 10162910A EP 2226590 B1 EP2226590 B1 EP 2226590B1
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EP
European Patent Office
Prior art keywords
heating module
power component
cooling
conductor board
heater according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
EP10162910.3A
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German (de)
French (fr)
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EP2226590A1 (en
Inventor
Markus Helminger
Christian Lindert
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BSH Hausgeraete GmbH
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BSH Hausgeraete GmbH
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Publication of EP2226590A1 publication Critical patent/EP2226590A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H9/00—Details
    • F24H9/20—Arrangement or mounting of control or safety devices
    • F24H9/2007—Arrangement or mounting of control or safety devices for water heaters
    • F24H9/2014—Arrangement or mounting of control or safety devices for water heaters using electrical energy supply
    • F24H9/2028—Continuous-flow heaters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H15/00—Control of fluid heaters
    • F24H15/40—Control of fluid heaters characterised by the type of controllers
    • F24H15/407—Control of fluid heaters characterised by the type of controllers using electrical switching, e.g. TRIAC
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/10—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium
    • F24H1/101—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium using electric energy supply
    • F24H1/102—Continuous-flow heaters, i.e. heaters in which heat is generated only while the water is flowing, e.g. with direct contact of the water with the heating medium using electric energy supply with resistance

Definitions

  • the invention relates to a water heater according to the preamble of claim 1.
  • Such a flow-through heating according to the preamble of claim 1 is in the EP 0 686 815 A1 discloses, wherein the power circuit is provided via a power semiconductor.
  • the power semiconductor is thermally coupled via a heat sink to the media tube of the flow heater.
  • the cooling interface is located on a cooling-only copper pipe loop in the cold water inlet region, wherein the power component is pressed with a resilient clamp against a flat pinched contact surface of the copper pipe. Since the copper pipe conducts electricity, the power component requires a direct ground connection. This construction principle requires many parts, a cumbersome wiring and the grounding of each power component. This results in a high manufacturing and assembly costs.
  • the electronic control conventionally at least one printed circuit board is provided on which optionally further components of the control are arranged, and which are provided with their own fastening elements, e.g. Screws, is fixed to prepared mounting points of the heating module. In operation, heat dissipating power components are conventionally placed on the cooling interface, grounded, and connected to the controller. Therefore, the independent determination and positioning of the circuit board also increases the manufacturing and assembly costs.
  • the invention has for its object to provide a water heater of the type mentioned, which can be produced with reduced effort.
  • the task also includes avoiding the expense of grounding the cooled power component or separate fasteners for the printed circuit board or these two aspects.
  • the power component such as a triac, electrically opposite to the water, so that the cooling interface or the Power component no grounding required, and yet the equipment safety complies with the regulations.
  • the ceramic cooling element effectively transfers heat to cool the power device.
  • high thermal conductivity ceramic material is used, which also has good mechanical properties, which ensure the necessary flatness in the contact area of the component, and also withstand the fastening forces and thermal influences during operation.
  • the cooling element can be relatively small, so that the cooling interface can even be largely arranged without additional expenditure within a given cold water inlet region.
  • the ceramic cooling element is expediently used for cooling a power component, which is pressed resiliently against the cooling element with a retaining element, the retaining element also being able to fix a printed circuit board of the electronic control unit carrying the power component, if necessary, on the heating module.
  • the ceramic cooling element can also be used profitably when the circuit board is fixed to the heating module in a conventional manner.
  • the holding element that positions the power component on the cooling interface also defines the printed circuit board on the heating module, the manufacturing and assembly costs are significantly reduced, since separate fastening elements are eliminated.
  • the circuit board can be fixed to the holding member for the power device even at the heating module, when the power device is cooled differently than with a ceramic cooling element.
  • a particularly advantageous embodiment is characterized in that the ceramic cooling element for cooling the power component is conveniently incorporated into the heating module so that a piping can be omitted only for cooling purposes.
  • the expediently mounted directly on the circuit board power component is placed with a holding element on the cooling element and pressed by the holding element on the circuit board against the cooling element. Finally, the printed circuit board is fixed to the heating module by the holding element, which presses the power component to the cooling element. If any, auxiliary supports are sufficient for final positioning of the printed circuit board which may be populated with other electronic components to properly secure the printed circuit board during operation and transportation.
  • the ceramic cooling element between the outside of the heating module and the cold water inlet area in the heating module is used watertight.
  • the cooling interface in the heating module thereby only minor modifications in the inlet area are required.
  • the ceramic cooling element during or after the shaping of the heating module or of a heating module component.
  • One possibility would be direct overmolding during the injection molding process.
  • the cooling element could also be subsequently used by pressing, welding, gluing or latching.
  • a sealing element e.g. an O-ring, with built-in.
  • the power component is held by a resilient retaining element in cooling contact with the cooling element.
  • the holding element could be used, in order to fix even the loosely attached cooling element waterproof.
  • a platelet, disc or cap-shaped ceramic cooling element is inexpensive and can be produced with high dimensional accuracy and dimensional accuracy. These geometric shapes also provide sufficient structural strength to allow the cooling element to easily cope with mechanical, thermal and hydraulic loads.
  • the cap shape presents the contact surface for the power component easily accessible. In the cap edge area there is sufficient attack surface for fixing and / or sealing.
  • the cooling element is arranged substantially perpendicular to the inflow direction of the cold water to the cooling interface. This allows effective heat transfer from the cooling element into the water.
  • the inflow surface of the cooling element could be designed aerodynamically, eg concave, to reduce the risk of unwanted turbulence. It would also be possible to structure the inflow surface in such a way that the surface coming into contact with the water flow is increased, for example by ribs, which can also contribute to the flow guidance.
  • a water dome having an opening is arranged on the heating module, which contains an inlet channel and an outlet channel.
  • the channels can merge on the cooling element.
  • the ceramic cooling element is arranged waterproof in the opening.
  • the water dome means only a minor modification of the cold water inlet area of the heating module.
  • the water dome can be easily formed from the material of the heating module and / or the cold water inlet area, and makes it possible to place the used cooling element exposed where the power component is easy to assemble.
  • the water dome is in the component group of the electronic control, or vice versa.
  • an overflow threshold is provided in the water dome lead to the flow guide, bring the incoming cold water substantially perpendicular to the inflow of the cooling element and dissipate the outflowing water as quickly as possible to force along the inflow of a favorable for the cooling effect, intensive flow dynamics.
  • the holding element is expediently a U-shaped spring clip, which can be produced inexpensively, for example as a sheet metal stamped bent part.
  • the retaining element could also be a spring clip with more than two retaining legs and a spring structure for pressing the power component.
  • plug-in slots formed for the holding leg of the support member.
  • the abutments for the holding element near the cooling interface are also expedient if the holding element is not only used for pressing the power component to the cooling element, but also for at least partially setting the circuit board of the electronic control on Walkermodul.
  • positioning elements for the printed circuit board can be integrally formed on the heating module, which improve the positioning and the seat of the printed circuit board under the holding force of the holding element.
  • the holding element can in this case the power component, the is suitably mounted directly on the circuit board, indirectly press on the circuit board to the cooling element.
  • the same retaining element can be used, e.g. a U-shaped spring clip.
  • the printed circuit board can be larger in area and heavier than the power component, it would be possible to set the printed circuit board to use a larger and / or stronger holding element with a different shape.
  • a good resilient contact pressure for the power component and / or the circuit board can be achieved if the trained as a U-spring clip retaining element in the transverse web is alternately bent in and out.
  • longitudinal stiffening beads may be formed which, preferably, e.g. exclude unintentional buckling or twisting of the retaining legs during assembly of the spring clip.
  • the power component to be cooled is a triac switching element that generates heat during operation of the instantaneous water heater and is cooled by the incoming cooling water by means of the ceramic cooling element.
  • a water heater D with electronic control or control S is in Fig. 1 shown in section a part of a heating module M, which consists of two interconnected module moldings 1, 2 (for example injection molded parts).
  • the heating module M is dashed in the operating position of the water heater D of one indicated hood F covered.
  • the heating module M is connected to not shown Wasserzuund procedures and electrically connected to the mains.
  • the electronic control S for at least one heating element, not shown, in the heating module has a printed circuit board P with components mounted thereon and at least one electronic power component B, which in FIG Fig. 1 is mounted on the printed circuit board P.
  • the power component B is, for example, a triac switching element that generates heat during operation of the instantaneous water heater D and requires cooling. For this reason, the power component B is placed at a cooling interface K with the cold water inlet of the heating module M.
  • the power component B is held by means of at least one holding element H in contact with a ceramic cooling element E, which electrically isolates the power component B from the water at the cooling interface K and forms a heat transfer body to the water.
  • the holding element H acts on the printed circuit board P in order to hold the power component B indirectly via the printed circuit board P in contact with the cooling element E.
  • the holding element H serves here simultaneously to set the circuit board P on the heating module M.
  • the holding element H could apply the power component B arranged separately from the printed circuit board P directly and hold it in contact with the cooling element E.
  • the circuit board P would then be mounted differently.
  • the heating module moldings 1, 2 define an internal cold water inlet channel 3, in which the cold water flows in the direction of arrow R before heating.
  • the cold water comes from a preferably integrally molded into the molding 1 water dome 4, which has an opening 5, in which the ceramic cooling element E is used watertight, for example by means of an O-ring 13.
  • the edge of the opening 5 is, for example, plastically deformed or flanged to set the cooling element E tight.
  • the cooling element E could be held only by the holding pressure of the retaining element H in sealing engagement.
  • inlet channel 6 connected to the cold water inlet not shown inlet channel 6 is formed, which is separated by a flow channel 9 through a partition 7, which ends at an overhead overflow threshold 8 at a distance from the ceramic cooling element E.
  • partition wall 7 forms substantially perpendicular to the cooling element E oriented flow guide so that the indicated by the arc arrow Z cold water flow the cooling element E as intense as possible and vortexing acted upon (s. Fig. 2 ).
  • the positioning elements 11 may have depth stops 12 for securing the printed circuit board P.
  • the power component B In the illustrated manner of mounting the power component B is electrically isolated from the water, and the incoming cold water in the heating module M at the interface K no metallic piping, so that the power component B need not be separately grounded.
  • the printed circuit board P is usually grounded anyway.
  • Fig. 2 illustrates on an enlarged scale, as designed as a cap 14 formed ceramic cooling element E with its lower, widened cap edge on the O-ring 13, which is inserted into a socket 5 of the opening.
  • the cooling element E as mentioned, for example, be determined by crimping the opening edge or encapsulation, gluing, and similar types of connection in its illustrated sealing position. However, it is also possible to use only the holding force of the holding element H for producing the sealing flow for the cooling element E.
  • the cooling element could also be a plate or a disc of ceramic material with good thermal conductivity.
  • the exposed top of the cooling element E forms in Fig. 2 a flat contact surface 15 for the power component B, while the inner or underside of the cap 14 forms a here, for example cup-shaped inflow surface 16 for the cold water from the inlet channel 6.
  • the overflow threshold 8 is opposite the inflow surface 16 with a distance which is selected such that there are optimal flow conditions along the inflow surface 16 for efficient heat removal.
  • the retaining element H is a U-shaped spring clip with a transverse web 17 and, for example, two retaining legs 19.
  • the crosspiece 17 has a plurality of alternating bends 18 with regard to a desirable spring action.
  • sawtooth-like locking projections 20 formed in the abutments 19 are formed on the retaining legs 19 10 anchor automatically, if necessary.
  • the abutment 10 are serrated inside. Longitudinal stiffening beads 21 increase the structural strength of the retaining legs 19.
  • the retaining element H of Fig. 1 and 2 is expedient a sheet metal stamping bent part made of a suitable metal.
  • the holding element could also be a plastic molded part or a composite part.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Resistance Heating (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Insulated Conductors (AREA)
  • Non-Reversible Transmitting Devices (AREA)

Description

Die Erfindung betrifft einen Durchlauferhitzer gemäß Oberbegriff des Anspruchs 1.The invention relates to a water heater according to the preamble of claim 1.

Bei in der Praxis bekannten Durchlauferhitzern mit elektronischer Steuerung werden Leistungsbauteile, wie Triacs, durch das zulaufende Kaltwasser an einer Kühlschnittstelle gekühlt, damit die Leistungsbauteile im Betrieb eine Temperaturgrenze von ca. 70°C nicht überschreiten.In known in practice instantaneous water heaters with electronic control power components, such as triacs are cooled by the incoming cold water at a cooling interface, so that the power components do not exceed a temperature limit of about 70 ° C in operation.

Ein solcher Durchlauferhitzen gemäß dem Oberbegriff des Anspruchs 1 ist in der EP 0 686 815 A1 offenbart, wobei die Leistungsschaltung über einen Leistungshalbleiter bereitgestellt wird. Der Leistungshalbleiter ist über einen Kühlkörper an das Medienrohr des Durchflussheizelements thermisch angekoppelt.Such a flow-through heating according to the preamble of claim 1 is in the EP 0 686 815 A1 discloses, wherein the power circuit is provided via a power semiconductor. The power semiconductor is thermally coupled via a heat sink to the media tube of the flow heater.

Die Kühlschnittstelle befindet sich an einer nur für Kühlzwecke vorgesehenen Kupferrohr-Schleife im Kaltwasserzulaufbereich, wobei der Leistungsbauteil mit einer federnden Klammer gegen eine flach gequetschte Kontaktfläche des Kupferrohres gedrückt wird. Da das Kupferrohr elektrisch leitet, benötigt der Leistungsbauteil einen direkten Erdungsanschluss. Dieses Bauprinzip erfordert viele Einzelteile, eine umständliche Verkabelung und die Erdung jedes Leistungsbauteils. Daraus resultiert ein hoher Herstellungs- und Montageaufwand. In der elektronischen Steuerung ist konventionell wenigstens eine Leiterplatte vorgesehen, an der gegebenenfalls weitere Bauteile der Steuerung angeordnet sind, und die mit eigenen Befestigungselementen, z.B. Schrauben, an dafür vorbereiteten Befestigungsstellen des Heizmoduls festgelegt wird. Im Betrieb wärmeabgebende Leistungsbauteile werden konventionell an der Kühlschnittstelle platziert, geerdet und mit der Steuerung verbunden. Deshalb erhöht die eigenständige Festlegung und Positionierung der Leiterplatte ebenfalls den Herstellungs- und Montageaufwand.The cooling interface is located on a cooling-only copper pipe loop in the cold water inlet region, wherein the power component is pressed with a resilient clamp against a flat pinched contact surface of the copper pipe. Since the copper pipe conducts electricity, the power component requires a direct ground connection. This construction principle requires many parts, a cumbersome wiring and the grounding of each power component. This results in a high manufacturing and assembly costs. In the electronic control conventionally at least one printed circuit board is provided on which optionally further components of the control are arranged, and which are provided with their own fastening elements, e.g. Screws, is fixed to prepared mounting points of the heating module. In operation, heat dissipating power components are conventionally placed on the cooling interface, grounded, and connected to the controller. Therefore, the independent determination and positioning of the circuit board also increases the manufacturing and assembly costs.

Der Erfindung liegt die Aufgabe zugrunde, einen Durchlauferhitzer der eingangs erwähnten Art zu schaffen, der sich mit verringertem Aufwand herstellen lässt. Die Aufgabe umfasst auch den Aufwand zur Erdung des gekühlten Leistungsbauteils oder gesonderte Befestigungseinrichtungen für die Leiterplatte zu vermeiden bzw. diese beiden Aspekte.The invention has for its object to provide a water heater of the type mentioned, which can be produced with reduced effort. The task also includes avoiding the expense of grounding the cooled power component or separate fasteners for the printed circuit board or these two aspects.

Die gestellte Aufgabe wird durch die Merkmale des Anspruchs 1 gelöst.The stated object is solved by the features of claim 1.

Vorzugsweise isoliertem keramisches Kühlelement den Leistungsbauteil, z.B. einen Triac, elektrisch gegenüber dem Wasser, so dass die Kühlschnittstelle bzw. der Leistungsbauteil keine Erdung benötigt, und dennoch die Gerätesicherheit den Vorschriften entspricht. Das keramische Kühlelement überträgt effektiv Wärme bzw. Kälte, um den Leistungsbauteil zu kühlen. Zweckmäßig wird deshalb Keramikmaterial mit hohem thermischen Leitwert verwendet, das außerdem gute mechanische Eigenschaften hat, die die notwendige Ebenheit im Kontaktbereich des Bauteils gewährleisten, und auch den Befestigungskräften und thermischen Einflüssen im Betrieb widerstehen. Das Kühlelement kann relativ klein sein, so dass sich die Kühlschnittstelle ohne Mehraufwand sogar weitgehend innerhalb eines gegebenen Kaltwasserzulaufbereiches anordnen lässt. Das keramische Kühlelement wird zweckmäßig zur Kühlung eines Leistungsbauteils eingesetzt, der mit einem Halteelement federnd gegen das Kühlelement gedrückt wird, wobei das Halteelement auch eine ggfs. den Leistungsbauteil tragende Leiterplatte der elektronischen Steuerung am Heizmodul festlegen kann. Jedoch lässt sich das keramische Kühlelement auch gewinnbringend verwenden, wenn die Leiterplatte auf herkömmliche Weise am Heizmodul festgelegt wird.Preferably insulated ceramic cooling element, the power component, such as a triac, electrically opposite to the water, so that the cooling interface or the Power component no grounding required, and yet the equipment safety complies with the regulations. The ceramic cooling element effectively transfers heat to cool the power device. Advantageously, therefore, high thermal conductivity ceramic material is used, which also has good mechanical properties, which ensure the necessary flatness in the contact area of the component, and also withstand the fastening forces and thermal influences during operation. The cooling element can be relatively small, so that the cooling interface can even be largely arranged without additional expenditure within a given cold water inlet region. The ceramic cooling element is expediently used for cooling a power component, which is pressed resiliently against the cooling element with a retaining element, the retaining element also being able to fix a printed circuit board of the electronic control unit carrying the power component, if necessary, on the heating module. However, the ceramic cooling element can also be used profitably when the circuit board is fixed to the heating module in a conventional manner.

Wenn das den Leistungsbauteil an der Kühlschnittstelle positionierende Halteelement auch die Leiterplatte am Heizmodul festlegt, wird der Herstellungs- und Montageaufwand deutlich reduziert, da separate Befestigungselemente entfallen. Die Leiterplatte kann mit dem Halteelement für den Leistungsbauteil auch dann am Heizmodul festgelegt werden, wenn der Leistungsbauteil anders als mit einem keramischen Kühlelement gekühlt wird.If the holding element that positions the power component on the cooling interface also defines the printed circuit board on the heating module, the manufacturing and assembly costs are significantly reduced, since separate fastening elements are eliminated. The circuit board can be fixed to the holding member for the power device even at the heating module, when the power device is cooled differently than with a ceramic cooling element.

Eine besonders vorteilhafte Ausführungsform zeichnet sich dadurch aus, dass das keramische Kühlelement zur Kühlung des Leistungsbauteils günstig so in den Heizmodul eingegliedert ist, dass eine Verrohrung nur zu Kühlzwecken entfallen kann. Der zweckmäßig direkt an der Leiterplatte montierte Leistungsbauteil wird mit einem Halteelement am Kühlelement platziert und vom Halteelement über die Leiterplatte gegen das Kühlelement gepresst. Schließlich wird die Leiterplatte durch das Halteelement, das den Leistungsbauteil an das Kühlelement presst, am Heizmodul festgelegt. Falls überhaupt, genügen Hilfsabstützungen zur endgültigen Positionierung der Leiterplatte, die mit weiteren elektronischen Bauteilen bestückt sein kann, um die Leiterplatte im Betrieb und beim Transport ordnungsgemäß festzulegen.A particularly advantageous embodiment is characterized in that the ceramic cooling element for cooling the power component is conveniently incorporated into the heating module so that a piping can be omitted only for cooling purposes. The expediently mounted directly on the circuit board power component is placed with a holding element on the cooling element and pressed by the holding element on the circuit board against the cooling element. Finally, the printed circuit board is fixed to the heating module by the holding element, which presses the power component to the cooling element. If any, auxiliary supports are sufficient for final positioning of the printed circuit board which may be populated with other electronic components to properly secure the printed circuit board during operation and transportation.

Bei einer zweckmäßigen Ausführungsform wird das keramische Kühlelement zwischen der Außenseite des Heizmoduls und dem Kaltwasserzulaufbereich im Heizmodul wasserdicht eingesetzt. Zum Eingliedern der Kühlschnittstelle in den Heizmodul sind dadurch nur geringfügige Modifikationen im Zulaufbereich erforderlich. Für die Eingliederung des keramischen Kühlelementes bei oder nach der Formung des Heizmoduls bzw. eines Heizmodul-Bauteils gibt es beispielsweise verschiedene Möglichkeiten. Eine Möglichkeit wäre direktes Umspritzen beim Spritzgussprozess. Technisch einfach könnte das Kühlelement auch nachträglich durch Einpressen, Schweißen, Kleben oder Verrasten eingesetzt werden. Dabei könnte ein Dichtelement, z.B. ein O-Ring, mit eingebaut werden.In an expedient embodiment, the ceramic cooling element between the outside of the heating module and the cold water inlet area in the heating module is used watertight. To incorporate the cooling interface in the heating module thereby only minor modifications in the inlet area are required. For example, there are various possibilities for the incorporation of the ceramic cooling element during or after the shaping of the heating module or of a heating module component. One possibility would be direct overmolding during the injection molding process. Technically simple, the cooling element could also be subsequently used by pressing, welding, gluing or latching. Thereby a sealing element, e.g. an O-ring, with built-in.

Zweckmäßig wird der Leistungsbauteil durch ein federndes Halteelement in Kühlkontakt mit dem Kühlelement gehalten. Das Halteelement könnte mit herangezogen werden, um auch das nur lose angebrachte Kühlelement wasserdicht festzulegen. Einer Lösung, bei der das Kühlelement für sich wasserdicht festgelegt ist und seine freiliegende Kontaktfläche zum Aufliegen des Leistungsbauteils gut zugänglich präsentiert, ist der Vorzug zu geben.Suitably, the power component is held by a resilient retaining element in cooling contact with the cooling element. The holding element could be used, in order to fix even the loosely attached cooling element waterproof. A solution in which the cooling element is fixed watertight on its own and presents its exposed contact surface for resting the power component easily accessible, is to be preferred.

Ein plättchen-, scheiben- oder kappenförmiges keramisches Kühlelement ist kostengünstig und mit hoher Formtreue und Maßgenauigkeit herstellbar. Diese geometrischen Formen bieten auch ausreichende Gestaltfestigkeit, damit das Kühlelement der mechanischen, thermischen und der hydraulischen Belastung problemlos gewachsen ist. Die Kappenform präsentiert die Kontaktfläche für den Leistungsbauteil gut zugänglich. Im Kappenrandbereich liegt genügend Angriffsfläche zum Fixieren und/oder Abdichten vor.A platelet, disc or cap-shaped ceramic cooling element is inexpensive and can be produced with high dimensional accuracy and dimensional accuracy. These geometric shapes also provide sufficient structural strength to allow the cooling element to easily cope with mechanical, thermal and hydraulic loads. The cap shape presents the contact surface for the power component easily accessible. In the cap edge area there is sufficient attack surface for fixing and / or sealing.

Zur Optimierung der Kühlwirkung ist zweckmäßig, wenn das Kühlelement im Wesentlichen senkrecht zur Zuströmrichtung des Kaltwassers zur Kühlschnittstelle angeordnet ist. Dadurch lässt sich ein effektiver Wärmetransfer vom Kühlelement ins Wasser erreichen. Die Anströmfläche des Kühlelementes könnte strömungsgünstig gestaltet sein, z.B. konkav, um die Gefahr unerwünschter Turbulenzen zu reduzieren. Es wäre auch möglich, die Anströmfläche so zu strukturieren, dass die mit dem Wasserstrom in Kontakt kommende Oberfläche vergrößert wird, z.B. durch Rippen, die auch zur Strömungsführung beitragen können.To optimize the cooling effect is expedient if the cooling element is arranged substantially perpendicular to the inflow direction of the cold water to the cooling interface. This allows effective heat transfer from the cooling element into the water. The inflow surface of the cooling element could be designed aerodynamically, eg concave, to reduce the risk of unwanted turbulence. It would also be possible to structure the inflow surface in such a way that the surface coming into contact with the water flow is increased, for example by ribs, which can also contribute to the flow guidance.

Bei einer bevorzugten Ausführungsform ist am Heizmodul ein eine Öffnung aufweisender Wasserdom angeordnet, der einen Zulaufkanal und einen Ablaufkanal enthält. Die Kanäle können sich am Kühlelement vereinigen. Das keramische Kühlelement ist wasserdicht in der Öffnung angeordnet. Der Wasserdom bedeutet nur eine geringfügige Modifizierung des Kaltwasserzulaufbereiches des Heizmoduls. Der Wasserdom lässt sich aus dem Material des Heizmoduls und/oder des Kaltwasserzulaufbereichs problemlos formen, und ermöglicht es, das eingesetzte Kühlelement exponiert dort zu platzieren, wo der Leistungsbauteil gut montierbar ist. Zweckmäßig befindet sich der Wasserdom in der Bauteilgruppe der elektronischen Steuerung, oder umgekehrt.In a preferred embodiment, a water dome having an opening is arranged on the heating module, which contains an inlet channel and an outlet channel. The channels can merge on the cooling element. The ceramic cooling element is arranged waterproof in the opening. The water dome means only a minor modification of the cold water inlet area of the heating module. The water dome can be easily formed from the material of the heating module and / or the cold water inlet area, and makes it possible to place the used cooling element exposed where the power component is easy to assemble. Suitably, the water dome is in the component group of the electronic control, or vice versa.

Zweckmäßig ist im Wasserdom eine Überlaufschwelle vorgesehen, zu der Strömungsleitflächen führen, die das zulaufende Kaltwasser im Wesentlichen senkrecht auf die Anströmfläche des Kühlelementes bringen und das abströmende Wasser möglichst schnell abführen, um entlang der Anströmfläche eine für den Kühleffekt günstige, intensive Strömungsdynamik zu erzwingen.Appropriately, an overflow threshold is provided in the water dome lead to the flow guide, bring the incoming cold water substantially perpendicular to the inflow of the cooling element and dissipate the outflowing water as quickly as possible to force along the inflow of a favorable for the cooling effect, intensive flow dynamics.

Das Halteelement ist zweckmäßig eine U-förmige Federklammer, die sich kostengünstig, beispielsweise als Blechstanz-Biegeteil, herstellen lässt. Das Halteelement könnte aber auch eine Federklammer mit mehr als zwei Halteschenkeln und einer Federstruktur zum Anpressen des Leistungsbauteils sein.The holding element is expediently a U-shaped spring clip, which can be produced inexpensively, for example as a sheet metal stamped bent part. The retaining element could also be a spring clip with more than two retaining legs and a spring structure for pressing the power component.

Am Wasserdom sind zweckmäßig außen Widerlager, beispielsweise Steckschächte, für die Halteschenkel des Halteelements angeformt. Dort gibt es eine günstige Haltetiefe für die Federklammer.At the water dome expedient outside abutment, for example, plug-in slots, formed for the holding leg of the support member. There is a favorable holding depth for the spring clip.

Die Widerlager für das Halteelement nahe der Kühlschnittstelle sind auch zweckmäßig, wenn das Halteelement nicht nur zum Anpressen des Leistungsbauteils an das Kühlelement verwendet wird, sondern auch zum zumindest teilweisen Festlegen der Leiterplatte der elektronischen Steuerung am Heizmodul. Zusätzlich können am Heizmodul Positionierelemente für die Leiterplatte angeformt sein, die unter der Haltekraft des Halteelements die Positionierung und den Sitz der Leiterplatte verbessern. Das Halteelement kann in diesem Fall den Leistungsbauteil, der zweckmäßig an der Leiterplatte direkt montiert ist, mittelbar über die Leiterplatte an das Kühlelement anpressen.The abutments for the holding element near the cooling interface are also expedient if the holding element is not only used for pressing the power component to the cooling element, but also for at least partially setting the circuit board of the electronic control on Heizmodul. In addition, positioning elements for the printed circuit board can be integrally formed on the heating module, which improve the positioning and the seat of the printed circuit board under the holding force of the holding element. The holding element can in this case the power component, the is suitably mounted directly on the circuit board, indirectly press on the circuit board to the cooling element.

Unabhängig davon, ob das Halteelement nur zum Anpressen des Leistungsbauteils an das Kühlelement oder auch zum zumindest teilweisen Festlegen der Leiterplatte am Heizmodul verwendet wird, lässt sich dasselbe Halteelement verwenden, z.B. eine U-förmige Federklammer. Im Hinblick darauf, dass die Leiterplatte großflächiger und schwerer sein kann als der Leistungsbauteil, wäre es zum Festlegen der Leiterplatte möglich, ein größeres und/oder stärkeres Halteelement mit einer anderen Form zu verwenden.Regardless of whether the retaining element is used only for pressing the power component to the cooling element or for at least partially fixing the circuit board to the heating module, the same retaining element can be used, e.g. a U-shaped spring clip. In view of the fact that the printed circuit board can be larger in area and heavier than the power component, it would be possible to set the printed circuit board to use a larger and / or stronger holding element with a different shape.

Eine gute federnde Anpresswirkung für den Leistungsbauteil und/oder die Leiterplatte lässt sich erzielen, wenn das als U-Federklammer ausgebildete Halteelement im Quersteg abwechselnd ein- und auswärts gebogen ist.A good resilient contact pressure for the power component and / or the circuit board can be achieved if the trained as a U-spring clip retaining element in the transverse web is alternately bent in and out.

In den Halteschenkeln können längsverlaufende Versteifungssicken geformt sein, die, vorzugsweise, z.B. bei der Montage der Federklammer ein ungewolltes Ausknicken oder Verwinden der Halteschenkel ausschließen.In the retaining legs, longitudinal stiffening beads may be formed which, preferably, e.g. exclude unintentional buckling or twisting of the retaining legs during assembly of the spring clip.

Typischerweise ist der zu kühlende Leistungsbauteil ein Triac-Schaltglied, das im Betrieb des Durchlauferhitzers Wärme generiert und mittels des keramischen Kühlelementes vom zulaufenden Kaltwasser gekühlt wird.Typically, the power component to be cooled is a triac switching element that generates heat during operation of the instantaneous water heater and is cooled by the incoming cooling water by means of the ceramic cooling element.

Anhand der Zeichnung werden Ausführungsformen des Erfindungsgegenstandes erläutert. Es zeigen:

Fig. 1
einen schematischen Schnitt eines Teils eines Durchlauferhitzers, und
Fig. 2
perspektivisch einen Ausschnitt aus Fig. 1.
Reference to the drawings, embodiments of the subject invention will be explained. Show it:
Fig. 1
a schematic section of a portion of a water heater, and
Fig. 2
in perspective, a section Fig. 1 ,

Von einem Durchlauferhitzer D mit elektronischer Regelung oder Steuerung S, ist in Fig. 1 im Schnitt ein Teil eines Heizmoduls M gezeigt, der aus zwei miteinander verbundenen Modul-Formteilen 1, 2 (beispielsweise Spritzguss-Formteilen) besteht. Der Heizmodul M wird in Betriebslage des Durchlauferhitzers D von einer gestrichelt angedeuteten Haube F abgedeckt. Der Heizmodul M ist an nicht gezeigte Wasserzuund -abläufe und elektrisch an das Stromnetz angeschlossen.From a water heater D with electronic control or control S, is in Fig. 1 shown in section a part of a heating module M, which consists of two interconnected module moldings 1, 2 (for example injection molded parts). The heating module M is dashed in the operating position of the water heater D of one indicated hood F covered. The heating module M is connected to not shown Wasserzuund procedures and electrically connected to the mains.

Die elektronische Steuerung S für wenigstens ein nicht gezeigtes Heizelement im Heizmodul weist eine Leiterplatte P mit daran montierten Bauteilen und wenigstens einen elektronischen Leistungsbauteil B auf, der in Fig. 1 an der Leiterplatte P montiert ist. Bei dem Leistungsbauteil B handelt es sich beispielsweise um ein Triac-Schaltglied, das im Betrieb des Durchlauferhitzers D Wärme generiert und einer Kühlung bedarf. Aus diesem Grund ist der Leistungsbauteil B an einer Kühlschnittstelle K mit dem Kaltwasserzulauf des Heizmoduls M platziert. Der Leistungsbauteil B ist mittels wenigstens eines Halteelementes H in Anlage an einem keramischen Kühlelement E gehalten, das an der Kühlschnittstelle K den Leistungsbauteil B elektrisch gegenüber dem Wasser isoliert und einen Wärmeübertragungskörper zum Wasser bildet.The electronic control S for at least one heating element, not shown, in the heating module has a printed circuit board P with components mounted thereon and at least one electronic power component B, which in FIG Fig. 1 is mounted on the printed circuit board P. The power component B is, for example, a triac switching element that generates heat during operation of the instantaneous water heater D and requires cooling. For this reason, the power component B is placed at a cooling interface K with the cold water inlet of the heating module M. The power component B is held by means of at least one holding element H in contact with a ceramic cooling element E, which electrically isolates the power component B from the water at the cooling interface K and forms a heat transfer body to the water.

Bei der gezeigten Ausführungsform beaufschlagt das Halteelement H die Leiterplatte P, um den Leistungsbauteil B mittelbar über die Leiterplatte P in Anlage am Kühlelement E zu halten. Das Halteelement H dient hier gleichzeitig zum Festlegen der Leiterplatte P am Heizmodul M.In the embodiment shown, the holding element H acts on the printed circuit board P in order to hold the power component B indirectly via the printed circuit board P in contact with the cooling element E. The holding element H serves here simultaneously to set the circuit board P on the heating module M.

Bei einer nicht gezeigten Alternative könnte das Halteelement H den getrennt von der Leiterplatte P angeordneten Leistungsbauteil B direkt beaufschlagen und in Anlage am Kühlelement E halten. Die Leiterplatte P wäre dann anders angebracht.In an alternative, not shown, the holding element H could apply the power component B arranged separately from the printed circuit board P directly and hold it in contact with the cooling element E. The circuit board P would then be mounted differently.

Die Heizmodul-Formteile 1, 2 begrenzen einen innenliegenden Kaltwasser-Zulaufkanal 3, in dem das Kaltwasser vor dem Aufheizen in Richtung des Pfeiles R strömt. Das Kaltwasser kommt aus einem in den Formteil 1 vorzugsweise einstückig eingeformten Wasserdom 4, der eine Öffnung 5 besitzt, in die das keramische Kühlelement E wasserdicht eingesetzt ist, beispielsweise mittels eines O-Ringes 13. Der Rand der Öffnung 5 ist beispielsweise plastisch verformt oder umgebördelt, um das Kühlelement E dicht festzulegen. Alternativ ist es denkbar, das Kühlelement E einzukleben oder bereits beim Formen des Formteils 1 mit einzuformen, z.B. zu umspritzen. Als weitere Alternative könnte das Kühlelement E auch nur durch den Haltedruck des Halteelements H in Dichtschluss gehalten sein.The heating module moldings 1, 2 define an internal cold water inlet channel 3, in which the cold water flows in the direction of arrow R before heating. The cold water comes from a preferably integrally molded into the molding 1 water dome 4, which has an opening 5, in which the ceramic cooling element E is used watertight, for example by means of an O-ring 13. The edge of the opening 5 is, for example, plastically deformed or flanged to set the cooling element E tight. Alternatively, it is conceivable to glue in the cooling element E or to mold it during the molding of the molded part 1, for example by overmoulding. As a further alternative, the cooling element E could be held only by the holding pressure of the retaining element H in sealing engagement.

Im Wasserdom 4 ist ein beispielsweise an den nicht gezeigten Kaltwasserzulauf angeschlossener Zulaufkanal 6 geformt, der von einem Ablaufkanal 9 durch eine Trennwand 7 getrennt ist, die an einer oben liegenden Überlaufschwelle 8 im Abstand vom keramischen Kühlelement E endet. Zumindest die Trennwand 7 bildet im Wesentlichen senkrecht gegen das Kühlelement E orientierte Strömungsleitflächen, damit die durch den Bogenpfeil Z angedeutete Kaltwasserströmung das Kühlelement E möglichst intensiv und verwirbelungsarm beaufschlagt (s. Fig. 2).In the water dome 4, for example, connected to the cold water inlet not shown inlet channel 6 is formed, which is separated by a flow channel 9 through a partition 7, which ends at an overhead overflow threshold 8 at a distance from the ceramic cooling element E. At least the partition wall 7 forms substantially perpendicular to the cooling element E oriented flow guide so that the indicated by the arc arrow Z cold water flow the cooling element E as intense as possible and vortexing acted upon (s. Fig. 2 ).

Bei der gezeigten Ausführungsform sind nahe des Wasserdoms 4 am Formteil 1 Widerlager 10, z.B. Steckschächte, für das Haltelement H vorgesehen, in denen das Haltelement H in der in Fig. 1 gezeigten Betriebslage verankert ist.. Zur zusätzlichen Festlegung der Leiterplatte P können weiteren Positionierelemente 11, z.B. Stützfüße am Formteil 1, vorgesehen sein, auf denen die Leiterplatte P unter der Haltekraft des Halteelementes H aufsitzt, und die, vorzugsweise, zumindest zwei Ecken der Leiterplatte P auch seitlich umfassen. Die Positionierelemente 11 können Tiefenanschläge 12 zur Sicherung der Leiterplatte P besitzen.In the embodiment shown are near the water dome 4 on the molded part 1 abutment 10, for example, plug-in slots, provided for the holding element H, in which the holding element H in the in Fig. 1 For additional determination of the printed circuit board P further positioning elements 11, eg support feet on the molded part 1 may be provided, on which the circuit board P is seated under the holding force of the holding element H, and, preferably, at least two corners of the printed circuit board P. also include laterally. The positioning elements 11 may have depth stops 12 for securing the printed circuit board P.

Bei der dargestellten Montageweise ist der Leistungsbauteil B elektrisch gegenüber dem Wasser isoliert, und benötigt das zulaufende Kaltwasser im Heizmodul M an der Schnittstelle K keine metallische Verrohrung, so dass der Leistungsbauteil B nicht separat geerdet zu werden braucht. Die Leiterplatte P wird üblicherweise ohnedies geerdet.In the illustrated manner of mounting the power component B is electrically isolated from the water, and the incoming cold water in the heating module M at the interface K no metallic piping, so that the power component B need not be separately grounded. The printed circuit board P is usually grounded anyway.

Fig. 2 verdeutlicht in vergrößertem Maßstab, wie das als eine Kappe 14 ausgebildete keramische Kühlelement E mit seinem unteren, verbreiterten Kappenrand auf dem O-Ring 13 aufliegt, der in eine Fassung der Öffnung 5 eingelegt ist. Das Kühlelement E kann, wie erwähnt, beispielsweise durch Umbördeln des Öffnungsrandes oder Umspritzen, Kleben, und ähnlichen Verbindungsarten in seiner gezeigten Abdichtlage festgelegt sein. Es ist allerdings auch möglich, nur die Haltekraft des Halteelementes H zum Herstellen des Dichtflusses für das Kühlelement E zu verwenden. Fig. 2 illustrates on an enlarged scale, as designed as a cap 14 formed ceramic cooling element E with its lower, widened cap edge on the O-ring 13, which is inserted into a socket 5 of the opening. The cooling element E, as mentioned, for example, be determined by crimping the opening edge or encapsulation, gluing, and similar types of connection in its illustrated sealing position. However, it is also possible to use only the holding force of the holding element H for producing the sealing flow for the cooling element E.

Abweichend von der Kappenform könnte das Kühlelement auch ein Plättchen oder eine Scheibe aus keramischem Material mit guter Wärmeleitfähigkeit sein. Die freiliegende Oberseite des Kühlelementes E bildet in Fig. 2 eine ebene Kontaktfläche 15 für den Leistungsbauteil B, während die Innen- oder Unterseite der Kappe 14 eine hier beispielsweise topfförmige Anströmfläche 16 für das Kaltwasser aus dem Zulaufkanal 6 bildet. Die Überlaufschwelle 8 liegt der Anströmfläche 16 mit einem Abstand gegenüber, der so gewählt wird, dass entlang der Anströmfläche 16 für eine effiziente Wärmeabfuhr optimale Strömungsverhältnisse vorliegen.Notwithstanding the cap shape, the cooling element could also be a plate or a disc of ceramic material with good thermal conductivity. The exposed top of the cooling element E forms in Fig. 2 a flat contact surface 15 for the power component B, while the inner or underside of the cap 14 forms a here, for example cup-shaped inflow surface 16 for the cold water from the inlet channel 6. The overflow threshold 8 is opposite the inflow surface 16 with a distance which is selected such that there are optimal flow conditions along the inflow surface 16 for efficient heat removal.

Das Haltelement H ist eine U-förmiger Federklammer mit einem Quersteg 17 und z.B. zwei Halteschenkeln 19. Der Quersteg 17 hat im Hinblick auf eine wünschenswerte Federwirkung mehrere abwechselnde Umbiegungen 18. An den Halteschenkeln 19 sind beispielsweise sägezahnartige Verriegelungsvorsprünge 20 geformt, die sich in den Widerlagern 10 selbsttätig verankern, ggfs. sind auch die Widerlager 10 innen gezahnt. Längsverlaufende Versteifungssicken 21 erhöhen die Gestaltfestigkeit der Halteschenkel 19. Das Haltelement H der Fig. 1 und 2 ist zweckmäßig ein Blechstanzbiegeteil aus einem geeigneten Metall. Alternativ könnte das Halteelement auch ein Kunststoffformteil oder ein Verbundteil sein.The retaining element H is a U-shaped spring clip with a transverse web 17 and, for example, two retaining legs 19. The crosspiece 17 has a plurality of alternating bends 18 with regard to a desirable spring action. For example, sawtooth-like locking projections 20 formed in the abutments 19 are formed on the retaining legs 19 10 anchor automatically, if necessary. The abutment 10 are serrated inside. Longitudinal stiffening beads 21 increase the structural strength of the retaining legs 19. The retaining element H of Fig. 1 and 2 is expedient a sheet metal stamping bent part made of a suitable metal. Alternatively, the holding element could also be a plastic molded part or a composite part.

Claims (7)

  1. Throughflow heater (D), in particular shower heater, with a heating module (M), with an electronic controller (S) for the heating module (M), at least one electronic power component (B) being positioned on the heating module (M) at a cooling interface (K) with the cold water supply (Z), and a conductor board (P) being fixed on said heating module (M), characterised in that the power component (B) with at least one retaining element (H) is positioned on the cooling interface (K), with which the conductor board (P) is also fixed on the heating module (M).
  2. Throughflow heater according to claim 1, characterised in that supports (10) for the retaining element (H) and, preferably, positioning elements (11) for the conductor board (P) are provided on the heating module (M) in the region of the cooling interface (K).
  3. Throughflow heater according to claim 1 or 2, characterised in that a, preferably ceramic, cooling element (E) with a contact surface (15) for the power component (B) is arranged in a watertight manner on the cooling interface (K), preferably in an opening (5) of a header tank (4), that the power component (B) is mounted on the conductor board (P) and is pressed via the conductor board (P) and the retaining element (H) on the contact surface (15) of the cooling element (E), that the contact surface (15) forms a positioning element for the conductor board (P) and that further positioning elements (11), for instance in the form of supporting feet, preferably with depth stops (12), for the conductor board (P), preferably for the conductor board corners, are provided on the heating module (M).
  4. Throughflow heater according to one of the preceding claims, characterised in that the retaining element (H) is an approximately U-shaped spring clamp, preferably a punched and bent sheet-metal part or strip material bent part with at least two retaining limbs (19) supporting saw-teeth-shaped projections (20) and a transverse web (17), preferably embodied to be elastic, which rests indirectly or directly on the power component (B).
  5. Throughflow heater according to claim 4, characterised in that the transverse web (17) is bent inwards and outwards compared with a straight course.
  6. Throughflow heater according to claim 4, characterised in that longitudinally running reinforcing beads (21) are formed in the retaining limbs (19).
  7. Throughflow heater according to at least one of the preceding claims, characterised in that the power component (B) is a triac switching element.
EP10162910.3A 2003-03-21 2004-03-11 Throughflow heater Expired - Fee Related EP2226590B1 (en)

Applications Claiming Priority (2)

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DE10312728A DE10312728A1 (en) 2003-03-21 2003-03-21 Heater
EP04719441A EP1608919B1 (en) 2003-03-21 2004-03-11 Instantaneous water heater

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EP04719441.0 Division 2004-03-11
EP04719441A Division EP1608919B1 (en) 2003-03-21 2004-03-11 Instantaneous water heater

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EP2226590A1 EP2226590A1 (en) 2010-09-08
EP2226590B1 true EP2226590B1 (en) 2016-10-05

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EP04719441A Expired - Fee Related EP1608919B1 (en) 2003-03-21 2004-03-11 Instantaneous water heater
EP10162910.3A Expired - Fee Related EP2226590B1 (en) 2003-03-21 2004-03-11 Throughflow heater

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DE102008054835A1 (en) * 2008-12-17 2010-07-01 BSH Bosch und Siemens Hausgeräte GmbH Laundry dryer has temperature heat sink system with two fluid streams, where temperature heat sink system guides part of waste heat of control unit
EP2489956B2 (en) 2011-02-21 2020-09-09 Gerdes Holding GmbH & Co. KG Cooling system of an electric construction element that heats up
DE102011013972A1 (en) * 2011-03-14 2012-09-20 Stiebel Eltron Gmbh & Co. Kg Domestic electrical heater i.e. geyser, has cooling body including two sides attached with each other, where water partially flows against body at one of sides, and seal is arranged in region of body and inserted into hole of discharge body
CN202126082U (en) * 2011-05-25 2012-01-25 上海科勒电子科技有限公司 Instantaneous heater applied to kitchen and bathroom products
WO2015018950A1 (en) * 2013-08-09 2015-02-12 Talleres Del Agua, S.L. Sociedad Unipersonal Heat exchanger for heating water
DE102017003416A1 (en) * 2017-04-07 2018-10-11 Stiebel Eltron Gmbh & Co. Kg Electric water heating system

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US4762980A (en) * 1986-08-07 1988-08-09 Thermar Corporation Electrical resistance fluid heating apparatus
DE4106273C1 (en) * 1991-02-28 1992-05-21 Stiebel Eltron Gmbh & Co Kg, 3450 Holzminden, De Through-flow electric water heater - controls heating elements power using triacs cooled by pipe connected to cold water supply
DE4327895A1 (en) * 1993-08-19 1995-02-23 Abb Management Ag Power converter module
DE4420493A1 (en) * 1994-06-12 1995-12-14 Ego Elektro Blanc & Fischer Electronic flow heating element for media
US6055154A (en) * 1998-07-17 2000-04-25 Lucent Technologies Inc. In-board chip cooling system

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PL396722A1 (en) 2011-12-19
PL211167B1 (en) 2012-04-30
WO2004083739A1 (en) 2004-09-30
EP1608919A1 (en) 2005-12-28
PL377405A1 (en) 2006-02-06
EP1608919B1 (en) 2010-08-25
PL219136B1 (en) 2015-03-31
DE10312728A1 (en) 2004-09-30
EP2226590A1 (en) 2010-09-08
CN1761845B (en) 2010-06-16

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