EP2167888A1 - Condenser heatsink - Google Patents
Condenser heatsinkInfo
- Publication number
- EP2167888A1 EP2167888A1 EP08750669A EP08750669A EP2167888A1 EP 2167888 A1 EP2167888 A1 EP 2167888A1 EP 08750669 A EP08750669 A EP 08750669A EP 08750669 A EP08750669 A EP 08750669A EP 2167888 A1 EP2167888 A1 EP 2167888A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heatsink
- cabinet
- condenser pipe
- heat transfer
- enclosure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 238000010521 absorption reaction Methods 0.000 claims abstract description 21
- 238000012546 transfer Methods 0.000 claims abstract description 21
- 238000005057 refrigeration Methods 0.000 claims description 15
- 238000009413 insulation Methods 0.000 claims description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 239000000284 extract Substances 0.000 claims 1
- 238000009792 diffusion process Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 239000012782 phase change material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B15/00—Sorption machines, plants or systems, operating continuously, e.g. absorption type
- F25B15/10—Sorption machines, plants or systems, operating continuously, e.g. absorption type with inert gas
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B17/00—Sorption machines, plants or systems, operating intermittently, e.g. absorption or adsorption type
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
- F25B39/026—Evaporators specially adapted for sorption type systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/04—Condensers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
- F25D11/02—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures
- F25D11/025—Self-contained movable devices, e.g. domestic refrigerators with cooling compartments at different temperatures using primary and secondary refrigeration systems
Definitions
- the invention relates to improvements in performance of diffusion-absorption cycle refrigerator systems, in particular for use with temperature controlled enclosures for containing temperature-sensitive electrical and electronic equipment.
- control equipment and in particular, the standby or backup battery power supplies thereof.
- Such control equipment may be found in power distribution, telecommunication, transport and security systems and may often be situated in isolated and exposed outdoor and indoor locations. Installing such equipment in an enclosure for protection from rain or other precipitation can often increase temperature variations, in that sunlight on the enclosure will tend to heat the contents of the enclosure to far higher temperatures than would otherwise be the case. Additionally, in some applications, heat emitting equipment situated close to the sensitive equipment may add to the thermal stress. Thus, there is a requirement to provide cooling or air conditioning to the most temperature sensitive items.
- a diffusion-absorption refrigerator system comprising a condenser pipe passing through and surrounded by a heatsink, the heatsink comprising a sealed enclosure defining an internal cavity surrounding the condenser pipe for containing a heat transfer liquid, a cross-section of the heatsink transverse the condenser pipe tapering to a minimum thickness towards an upper end when oriented for use of the refrigerator system
- a diffusion absorption refrigeration cycle systems in accordance with the invention leads to a lower cost and higher efficiency for a wider range of ambient temperatures than with existing solutions
- the temperature of industrial batteries can then be cooled more effectively, as the batteries can easily be thermally separated from other items of equipment in small enclosures that emit only a small amount of heat when on trickle charge
- cooiinp performance can be enhanced and COPs improved
- Using a heatsink in the form of the liquid-filled sealed enclosure of the invention results in various improvements in performance of the diffusion absorption cycle system, including that of an improved thermal performance in dissipating heat from the condenser pipe into a heat transfer liquid within the enclosure
- the heat transfer liquid is preferably a mixture of water and glycol, used due to its high heat capacity
- aspects of the invention can be obtained at low cost by modification of a standard diffusion absorption system through the addition of the sealed enclosure by 'wrapping' the enclosure around the condenser pipe
- the sealed enclosure may be formed from one or a limited number of pieces of material, which improves the ease of manufacture of the enclosure and the ease of installation around an existing condenser pipe
- a fan may optionally be added to the system to further enhance cooling performance, but at the cost of increased complexity
- ⁇ T temperature difference
- a temperature difference in the region of 15°C, between the inside of a temperature-controlled enclosure (e g for industrial batteries) and an external ambient environment
- ⁇ T temperature difference
- Using a modified system with a heatsink according to the invention results in an enhancement of typically over 5°C in this temperature difference
- the modified system is therefoie typically able to operate effectively in ambient temperatures of up to 60 0 C while maintaining the contents of the enclosure below 45°C, and is able to maintain an effective ⁇ T of 15 0 C down to room temperature.
- figure 1 is a perspective view of a diffusion absorption refrigeration cycle system having a fluid filled enclosure on the condenser pipe
- figure 2 is a cross-sectional view of the diffusion absorption refrigeration cycle system of figure 1 , when attached to a wall of an equipment enclosure
- figure 3 is a perspective view of a standard diffusion absorption refrigeration cycle system having a heatsink comprising metal fins on the condenser pipe
- figure 4 is an isometric sketch view of an exemplary heatsink
- figure 5 is an isometric sketch view of a standard finned condenser pipe heatsink.
- FIG. 1 illustrates an exemplary diffusion absorption refrigeration cycle system 5 according to an aspect of the invention.
- the system 5 comprises an evaporator pipe 4 for extracting heat from a connected system, as described further in relation to figure 2, and a condenser pipe 16 for transporting this heat to an external environment.
- a heatsink 11 is attached around the condenser pipe 16, described in more detail below.
- the diffusion absorption refrigeration cycle system 5 of figure 1 is illustrated in cross-section.
- the system 5 is attached to a wall 9 of a temperature- controllable cabinet such that the interior 8 of the cabinet is cooled by the evaporator pipe 4 of the system 5, and heat extracted from the interior 8 is pumped by the system 5 to the exterior 7 of the cabinet.
- the wall 9 comprises a layer of insulation 10, which may itself form the external surface of the wall 9 or be further enclosed by another layer of material such as a metal sheet or casing.
- the cabinet is preferably configured and used for containing temperature-sensitive electrical and electronic equipment, so as to maintain the equipment within a desired temperature range by operation of the refrigeration system.
- a typical temperature range is around room temperature (i.e. 20-25°C) or above, within which equipment such as lead-acid batteries tend to operate most efficiently.
- a liquid-filled enclosure, or thermo-siphon 3 is attached to the inside of the wall 9, forming a sealed vessel surrounding the evaporator pipe 4.
- the enclosure 3 comprises one or more fillinrj points for introducing liquid 12 into the enclosure once it has been fixed in place around the evaporator pipe 4
- the liquid filled enclosure 3 may be attached to the structural insulation 10, or to a material enclosing the insulation, by way of welding, gluing or other mechanical fixing methods for example at fixing points 2a, 2b on the edge of the enclosure 3
- the enclosure 3 may have one or more sides or faces in common with the structural insulation 10 or a material enclosing the insulation, for example along an interface 13 between the internal volume of the enclosure 6 and the insulation 10
- the external surface 15 of the enclosure 3 may be in direct contact with the contents of the temperature controlled enclosure, or may act as a cooling element across the internal wall 15 for cooling air within the cabinet
- thermo-siphon is preferably optimised to provide a balance between thermal efficiency in heat transfer, cost of manufacture, fit with the refrigeration cycle and weight of fluid
- the embodiment shown illustrates a particular preferred embodiment, where the enclosure 3 is in a substantially planar form extending across the internal surface of the wall, so as to maximise the cooling effect within the cabinet and minimise the quantity of heat transfer liquid required
- the evaporator pipe 4 is located towards an upper end of the enclosure 3, extending through the enclosure in a substantially horizontal direction
- the upper location of the pipe 4 allows for the convection effect to be optimised, since cool liquid within the enclosure 3 in contact with the evaporator pipe 4 will sink away from the pipe 4 As the liquid 3 absorbs heat from the internal volume 8 of the cabinet, the liquid rises and is then cooled again by the evaporator pipe 4, creating a convection cycle between the evaporator pipe 4 and the bottom of the enclosure 3
- Any volume of liquid above the evaporator pipe 4, however, is not able to contribute to the convection cycle, due to a thermocline being set up within the liquid 12 around the level of the evaporator pipe 4
- the evaporator pipe 4 therefore preferably passes through an upper portion of the enclosure 3, and more preferably as near to the top of the enclosure as practical, so as to maximise the efficiency of the thermo-siphon effect
- the liquid-filled sealed enclosure 6 surrounding the evaporator pipe 4 has the advantage of preventing ice forming on the evaporator pipe in use, and allows a more even temperature distribution throughout the interior of the cabinet
- the use of the fu st sealed enclosure in the form of a heatsink 11 around the condenser pipe together with a second sealed enclosure 6 around the evaporator pipe 4 allows for an improved refrigerator system that operates more efficiently and requires less maintenance
- the heatsink 11 is configured to facilitate heat flow away from the condenser pipe 16 around which it is attached
- the heatsink 11 is preferably formed by a metal sheet being wrapped around the condenser pipe 16, and sealed at the upper edge 21 and opposing side portions 21 a, 21b (figure 1 ) This forms a sealed cavity for containing a heat transfer liquid 17 within
- a filling port 18 is provided for introducing the heat transfer liquid, which may comprise water or another suitable liquid such as a water-glycoi mixture Expansion of the heat transfer liquid due to heating can be accommodated by flexing of the side walls 23 of the heatsink 11 Introduction of the heat transfer liquid can be carried out once the heatsink 11 is fixed in place around the condenser pipe 16
- the heatsink fins normally present on the condenser pipe 16 see figures 3 and 5 have been removed, although this is not a prerequisite for improving the system 5
- the heatsink 11 may be attached to the condenser pipe 16 by way of welding, gluing or other mechanical fixing means, provided a liquid seal is made to prevent any liquid being lost to the environment
- the side portions 21 a, 21 b are shown attached to the condenser pipe 16 along a weld line 7
- the enclosure formed by the heatsink 11 is preferably widest in cross-section at the point where the heatsink 11 wraps around the condenser pipe 16, so as to encourage convective flow in the liquid 17 around the hot condenser pipe 16
- figure 3 illustrates a standard diffusion absorption refrigeration cycle system 30 comprising a condenser pipe 16 having a heatsink 31 m the form of solid metal fins, configured to increase the available surface area for improving heat dissipation away from the condenser pipe 16
- heatsinks rely mainly on thermal conduction through the metal fins to dissipate heat away from the condenser pipe 16
- the heatsink 11 in the form of the liquid-filled enclosure of the present invention has the benefit of liquid convention to accelerate heat transport away from the condenser pipe 16
- a temperature difference across the liquid filled heatsink 11 of 4O 0 C (95 0 C to 45 0 C figure 4) is possible, compared with 3O 0 C (95 0 C to 65 0 C figure 5) for the conventional solid metal heatsink 30
- the general preferred shape of the enclosure 2 is that of a wing i e having the form of a substantially uniform cross-section with a rounded lower end and a tapering upper end Such a cross-sectional shape results in a further benefit from convective flow of air around the enclosure 2, thereby further improving heat dissipation from the condenser pipe 16
- the size of the heatsink is preferably optimised to provide a balance between ⁇ ) thermal efficiency in dissipating heat, ⁇ ) cost of manufacture, in) fit with the refrigeration cycle system to which it is to be attached, and tv) weight of the heat transfer liquid
- the heatsink may be required to fit within the available footprint around the equipment enclosure
- the heatsink being shaped in the form of a wing orientated vertically allows the most effective and uninterrupted hot air flow up the side of the equipment cabinet, from the base of the system to the external ambient environment
- a typical heatsink will have a surface area of a sufficient size to reduce the temperature at the end of the condenser pipe by 2O 0 C when compared to an equivalent finned condenser pipe
- a vent may be added to the cabinet to ensure that noxious or explosive gases (such as hydrogen) are dissipated to the external environment, thus avoiding any explosive build up of gas within the cabinet, which could be generated during operation of the equipment therein
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
A diffusion-absorption refrigerator system (1) comprising a condenser pipe (6) passing through and surrounded by a heatsink (2), the heatsink comprising a sealed enclosure defining an internal cavity surrounding the condenser pipe for containing a heat transfer liquid, a cross-section of the heatsink transverse the condenser pipe tapering to a minimum thickness towards an upper end when oriented for use of the refrigerator system.
Description
CONDENSER HEATSINK
Field of the Invention
The invention relates to improvements in performance of diffusion-absorption cycle refrigerator systems, in particular for use with temperature controlled enclosures for containing temperature-sensitive electrical and electronic equipment.
Background
Many items of electrical and electronic equipment have increased susceptibility to failure, malfunction or generally accelerated degradation and shortened lifespan when exposed to large variations in temperature, humidity and other ambient conditions, The problem is particularly significant for items of equipment that must be left for extended periods of time in environments that are relatively unprotected from atmospheric conditions.
One example is items of control equipment, and in particular, the standby or backup battery power supplies thereof. Such control equipment may be found in power distribution, telecommunication, transport and security systems and may often be situated in isolated and exposed outdoor and indoor locations. Installing such equipment in an enclosure for protection from rain or other precipitation can often increase temperature variations, in that sunlight on the enclosure will tend to heat the contents of the enclosure to far higher temperatures than would otherwise be the case. Additionally, in some applications, heat emitting equipment situated close to the sensitive equipment may add to the thermal stress. Thus, there is a requirement to provide cooling or air conditioning to the most temperature sensitive items.
In particular, battery back-up power supplies for power distribution control systems and telecommunication systems in the field have been observed to have a service life substantially lower than expected largely due to degradation caused by temperature and/or humidity variation. Solutions in the prior art have provided temperature controlled enclosures for the sensitive equipment ranging from a simple ventilated enclosure through to complete air conditioning systems. These solutions and systems incorporate technologies such as thermoelectric devices, forced convection, heat pipes, phase change material and vapour compression cycles.
A problem to be addressed in such temperature controlled enclosures is to make them as thermally efficient as possible, whilst at the same time developing devices that have no
moving components which removes the need for regular and expensive maintenance due to the failure of those components as a result of mechanical wear and tear Components which can be removed include mechanical parts such as fans, pumps and compressors and consumables such as filters
An alternative refrigeration cycle or cooling mechanism to those noted which can be adapted to be used with electronic and electrical equipment is the diffusion absorption cycle This cycle completely avoids the use of mechanical energy and instead it relies on direct thermal energy as a power source They also use environmentally benign fluids, are reliable, silent and relatively inexpensive to build and have no moving parts However they have a relatively low refrigeration Coefficient of Performance ('COP'), which needs to be improved so that electronic and electrical equipment such as industrial reserve power batteries can efficiently be cooled
One of key reasons for poor performance of existing diffusion-absorption cycle refrigerator systems is the poor heat transfer from heatsink fins on the condenser to the external ambient environment In general heatsink fin geometries, the region of the fins further from the base plays less of a role in the total heat transfer rate compared with the region closest to the fin base, which dominates the rate of heat transfer In typical traditional diffusion absorption cycle systems the condenser fin arrangement leads to sub optimal heat transfer away from the condenser meaning that the cycle runs at higher temperatures and lower efficiencies
It is an object of this present invention to provide more efficient diffusion-absorption refrigerator systems for use with temperature controlled enclosures for electrical and electronic components such as industi ial reserve power batteries
Summary of the Invention
In accordance with the invention there is provided a diffusion-absorption refrigerator system comprising a condenser pipe passing through and surrounded by a heatsink, the heatsink comprising a sealed enclosure defining an internal cavity surrounding the condenser pipe for containing a heat transfer liquid, a cross-section of the heatsink transverse the condenser pipe tapering to a minimum thickness towards an upper end when oriented for use of the refrigerator system
Using improved diffusion absorption refrigeration cycle systems in accordance with the invention leads to a lower cost and higher efficiency for a wider range of ambient temperatures than with existing solutions The temperature of industrial batteries can then be cooled more effectively, as the batteries can easily be thermally separated from other items of equipment in small enclosures that emit only a small amount of heat when on trickle charge With adaptations to the systems as described herein, cooiinp performance can be enhanced and COPs improved
Using a heatsink in the form of the liquid-filled sealed enclosure of the invention results in various improvements in performance of the diffusion absorption cycle system, including that of an improved thermal performance in dissipating heat from the condenser pipe into a heat transfer liquid within the enclosure The heat transfer liquid is preferably a mixture of water and glycol, used due to its high heat capacity
Aspects of the invention can be obtained at low cost by modification of a standard diffusion absorption system through the addition of the sealed enclosure by 'wrapping' the enclosure around the condenser pipe
The sealed enclosure may be formed from one or a limited number of pieces of material, which improves the ease of manufacture of the enclosure and the ease of installation around an existing condenser pipe
No moving parts such as fans are required, which would increase maintenance costs of the equipment Instead, heat dissipation from the condenser pipe is achieved more effectively without the need for forced convection A fan may optionally be added to the system to further enhance cooling performance, but at the cost of increased complexity
Testing has indicated that a temperature difference (ΔT) in the region of 15°C, between the inside of a temperature-controlled enclosure (e g for industrial batteries) and an external ambient environment, can be obtained using a standard 8OW diffusion absorption cycle system Using a modified system with a heatsink according to the invention results in an enhancement of typically over 5°C in this temperature difference This enables the system to be used at higher ambient temperatures, while still keeping the contents of the enclosure within their ideal operating temperature range The modified system is therefoie typically able to operate effectively in ambient temperatures of up to 600C while
maintaining the contents of the enclosure below 45°C, and is able to maintain an effective ΔT of 150C down to room temperature.
Detailed Description The invention will now be described by way of example, and with reference to the enclosed drawings in which: figure 1 is a perspective view of a diffusion absorption refrigeration cycle system having a fluid filled enclosure on the condenser pipe; figure 2 is a cross-sectional view of the diffusion absorption refrigeration cycle system of figure 1 , when attached to a wall of an equipment enclosure; figure 3 is a perspective view of a standard diffusion absorption refrigeration cycle system having a heatsink comprising metal fins on the condenser pipe; figure 4 is an isometric sketch view of an exemplary heatsink; and figure 5 is an isometric sketch view of a standard finned condenser pipe heatsink.
Figure 1 illustrates an exemplary diffusion absorption refrigeration cycle system 5 according to an aspect of the invention. The system 5 comprises an evaporator pipe 4 for extracting heat from a connected system, as described further in relation to figure 2, and a condenser pipe 16 for transporting this heat to an external environment. A heatsink 11 is attached around the condenser pipe 16, described in more detail below.
With reference to figure 2, the diffusion absorption refrigeration cycle system 5 of figure 1 is illustrated in cross-section. The system 5 is attached to a wall 9 of a temperature- controllable cabinet such that the interior 8 of the cabinet is cooled by the evaporator pipe 4 of the system 5, and heat extracted from the interior 8 is pumped by the system 5 to the exterior 7 of the cabinet. The wall 9 comprises a layer of insulation 10, which may itself form the external surface of the wall 9 or be further enclosed by another layer of material such as a metal sheet or casing. The cabinet is preferably configured and used for containing temperature-sensitive electrical and electronic equipment, so as to maintain the equipment within a desired temperature range by operation of the refrigeration system. A typical temperature range is around room temperature (i.e. 20-25°C) or above, within which equipment such as lead-acid batteries tend to operate most efficiently.
A liquid-filled enclosure, or thermo-siphon 3, is attached to the inside of the wall 9, forming a sealed vessel surrounding the evaporator pipe 4. The enclosure 3 comprises one or more fillinrj points for introducing liquid 12 into the enclosure once it has been fixed in
place around the evaporator pipe 4 The liquid filled enclosure 3 may be attached to the structural insulation 10, or to a material enclosing the insulation, by way of welding, gluing or other mechanical fixing methods for example at fixing points 2a, 2b on the edge of the enclosure 3
The enclosure 3 may have one or more sides or faces in common with the structural insulation 10 or a material enclosing the insulation, for example along an interface 13 between the internal volume of the enclosure 6 and the insulation 10 The external surface 15 of the enclosure 3 may be in direct contact with the contents of the temperature controlled enclosure, or may act as a cooling element across the internal wall 15 for cooling air within the cabinet
The size of the thermo-siphon is preferably optimised to provide a balance between thermal efficiency in heat transfer, cost of manufacture, fit with the refrigeration cycle and weight of fluid The embodiment shown illustrates a particular preferred embodiment, where the enclosure 3 is in a substantially planar form extending across the internal surface of the wall, so as to maximise the cooling effect within the cabinet and minimise the quantity of heat transfer liquid required
Preferably, the evaporator pipe 4 is located towards an upper end of the enclosure 3, extending through the enclosure in a substantially horizontal direction The upper location of the pipe 4 allows for the convection effect to be optimised, since cool liquid within the enclosure 3 in contact with the evaporator pipe 4 will sink away from the pipe 4 As the liquid 3 absorbs heat from the internal volume 8 of the cabinet, the liquid rises and is then cooled again by the evaporator pipe 4, creating a convection cycle between the evaporator pipe 4 and the bottom of the enclosure 3 Any volume of liquid above the evaporator pipe 4, however, is not able to contribute to the convection cycle, due to a thermocline being set up within the liquid 12 around the level of the evaporator pipe 4 The evaporator pipe 4 therefore preferably passes through an upper portion of the enclosure 3, and more preferably as near to the top of the enclosure as practical, so as to maximise the efficiency of the thermo-siphon effect
The liquid-filled sealed enclosure 6 surrounding the evaporator pipe 4 has the advantage of preventing ice forming on the evaporator pipe in use, and allows a more even temperature distribution throughout the interior of the cabinet The use of the fu st sealed enclosure in the form of a heatsink 11 around the condenser pipe together with a second
sealed enclosure 6 around the evaporator pipe 4 allows for an improved refrigerator system that operates more efficiently and requires less maintenance
The heatsink 11 is configured to facilitate heat flow away from the condenser pipe 16 around which it is attached The heatsink 11 is preferably formed by a metal sheet being wrapped around the condenser pipe 16, and sealed at the upper edge 21 and opposing side portions 21 a, 21b (figure 1 ) This forms a sealed cavity for containing a heat transfer liquid 17 within A filling port 18 is provided for introducing the heat transfer liquid, which may comprise water or another suitable liquid such as a water-glycoi mixture Expansion of the heat transfer liquid due to heating can be accommodated by flexing of the side walls 23 of the heatsink 11 Introduction of the heat transfer liquid can be carried out once the heatsink 11 is fixed in place around the condenser pipe 16 In the embodiment shown in figure 1 , the heatsink fins normally present on the condenser pipe 16 (see figures 3 and 5) have been removed, although this is not a prerequisite for improving the system 5
The heatsink 11 may be attached to the condenser pipe 16 by way of welding, gluing or other mechanical fixing means, provided a liquid seal is made to prevent any liquid being lost to the environment In figure 1 , the side portions 21 a, 21 b are shown attached to the condenser pipe 16 along a weld line 7 The enclosure formed by the heatsink 11 is preferably widest in cross-section at the point where the heatsink 11 wraps around the condenser pipe 16, so as to encourage convective flow in the liquid 17 around the hot condenser pipe 16
For comparison, figure 3 illustrates a standard diffusion absorption refrigeration cycle system 30 comprising a condenser pipe 16 having a heatsink 31 m the form of solid metal fins, configured to increase the available surface area for improving heat dissipation away from the condenser pipe 16 Such heatsinks rely mainly on thermal conduction through the metal fins to dissipate heat away from the condenser pipe 16 By comparison, the heatsink 11 in the form of the liquid-filled enclosure of the present invention has the benefit of liquid convention to accelerate heat transport away from the condenser pipe 16 As shown in sketch form in figure 4 and figure 5, a temperature difference across the liquid filled heatsink 11 of 4O0C (950C to 450C figure 4) is possible, compared with 3O0C (950C to 650C figure 5) for the conventional solid metal heatsink 30
The general preferred shape of the enclosure 2 is that of a wing i e having the form of a substantially uniform cross-section with a rounded lower end and a tapering upper end
Such a cross-sectional shape results in a further benefit from convective flow of air around the enclosure 2, thereby further improving heat dissipation from the condenser pipe 16
The size of the heatsink is preferably optimised to provide a balance between ι) thermal efficiency in dissipating heat, ιι) cost of manufacture, in) fit with the refrigeration cycle system to which it is to be attached, and tv) weight of the heat transfer liquid For example, the heatsink may be required to fit within the available footprint around the equipment enclosure
The heatsink being shaped in the form of a wing orientated vertically allows the most effective and uninterrupted hot air flow up the side of the equipment cabinet, from the base of the system to the external ambient environment A typical heatsink will have a surface area of a sufficient size to reduce the temperature at the end of the condenser pipe by 2O0C when compared to an equivalent finned condenser pipe
Because the equipment cabinet to which the system of the invention is configured to be attached is required to be thermally isolated from the external environment, a vent may be added to the cabinet to ensure that noxious or explosive gases (such as hydrogen) are dissipated to the external environment, thus avoiding any explosive build up of gas within the cabinet, which could be generated during operation of the equipment therein
Other embodiments are intentionally within the scope of the invention, as defined by the appended claims
Claims
1 . A diffusion-absorption refrigerator system comprising a condenser pipe passing through and surrounded by a heatsink, the heatsink comprising a sealed enclosure defining an internal cavity surrounding the condenser pipe for containing a heat transfer liquid, a cross-section of the heatsink transverse the condenser pipe tapering to a minimum thickness towards an upper end when oriented for use of the refrigerator system.
2. The system of claim 1 wherein the heatsink is shaped in the form of a wing having a substantially uniform cross-section with a rounded lower end and a tapering upper end.
3. The system of claim 1 or claim 2 wherein the heatsink comprises a section sealed at opposing ends by first and second end portions defining the cross-section, the middle section wrapping around the condenser pipe.
4. The system of any preceding claim wherein the heatsink comprises a filling port for introducing the heat transfer liquid into the cavity.
5. The system of any preceding claim wherein the cross-section of the heatsink is substantially uniform along a length direction parallel to the condenser pipe.
6. A temperature-controlled enclosure comprising a diffusion-absorption refrigerator system according to any preceding claim.
7. A temperature-controllable equipment cabinet comprising the diffusion-absorption refrigeration cycle system of any one of claims 1 to 5, wherein an evaporator pipe of the refrigeration system extends through a wall of the cabinet and passes through a second sealed enclosure for containing a heat transfer liquid, the sealed enclosure extending across and forming part of an internal surface of the cabinet such that the refrigeration system in use extracts heat from within the cabinet to an external environment.
8. The equipment cabinet of claim 7 wherein the wall of the cabinet comprises a layer of thermal insulation through which the evaporator pipe extends. 9 The equipment cabinet of claim 7 or claim 8 wherein the evaporator pipe passes through a recess provided in the wall
10 The equipment cabinet of any one of claims 7 to 9 wherein the second sealed enclosure is substantially planar in construction across the internal surface of the wall
1 1 The equipment cabinet of any one of claims 7 to 10 wherein the evaporator pipe passes in a horizontal direction through an upper portion of the second sealed enclosure when the cabinet is oriented for use such that, in use, convective flow of the heat transfer liquid aids heat transfer from within the cabinet
12 The system of any of claims 1 to 5 wherein the internal cavity of the sealed enclosure contains a mixture of water and glycol as the heat transfer liquid.
13 A diffusion-absorption refrigerator system substantially as described herein, with reference to the accompanying drawings in figures 1 , 2 and 4
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0709739A GB0709739D0 (en) | 2007-05-22 | 2007-05-22 | Improvment to dispenser heat dissipation in diffusion absolption cycles |
GB0709748A GB2456741A (en) | 2007-05-22 | 2007-05-22 | Thermosiphon Enclosure Surrounding an Evaporator Pipe |
GB0805661A GB2449523A (en) | 2007-05-22 | 2008-03-28 | Absorption refrigerator system comprising a condenser pipe surrounded by a tapered fluid filled enclosure |
PCT/GB2008/001746 WO2008142414A1 (en) | 2007-05-22 | 2008-05-22 | Condenser heatsink |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2167888A1 true EP2167888A1 (en) | 2010-03-31 |
Family
ID=39386918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP08750669A Withdrawn EP2167888A1 (en) | 2007-05-22 | 2008-05-22 | Condenser heatsink |
Country Status (6)
Country | Link |
---|---|
US (2) | US20100154466A1 (en) |
EP (1) | EP2167888A1 (en) |
BR (1) | BRPI0811899A2 (en) |
GB (2) | GB2449522A (en) |
RU (1) | RU2431088C2 (en) |
WO (2) | WO2008142414A1 (en) |
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GB2449522A (en) * | 2007-05-22 | 2008-11-26 | 4Energy Ltd | Temperature controlled equipment cabinet comprising an absorption refrigerator system with an evaporator pipe located within a fluid containing enclosure |
GB2456541B (en) | 2008-01-17 | 2010-02-10 | 4Energy Ltd | Air filter |
US9175888B2 (en) | 2012-12-03 | 2015-11-03 | Whirlpool Corporation | Low energy refrigerator heat source |
US9593870B2 (en) | 2012-12-03 | 2017-03-14 | Whirlpool Corporation | Refrigerator with thermoelectric device for ice making |
JP6267250B2 (en) * | 2016-02-25 | 2018-01-24 | 株式会社Subaru | Hydraulic circuit abnormality detection device and hydraulic circuit abnormality detection method |
US10718558B2 (en) * | 2017-12-11 | 2020-07-21 | Global Cooling, Inc. | Independent auxiliary thermosiphon for inexpensively extending active cooling to additional freezer interior walls |
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- 2008-05-22 WO PCT/GB2008/001746 patent/WO2008142414A1/en active Application Filing
- 2008-05-22 EP EP08750669A patent/EP2167888A1/en not_active Withdrawn
- 2008-05-22 US US12/601,140 patent/US20100154466A1/en not_active Abandoned
- 2008-05-22 RU RU2009147441/06A patent/RU2431088C2/en not_active IP Right Cessation
- 2008-05-22 WO PCT/GB2008/001742 patent/WO2008142412A1/en active Application Filing
- 2008-05-22 US US12/601,122 patent/US20100242530A1/en not_active Abandoned
- 2008-05-22 BR BRPI0811899-0A2A patent/BRPI0811899A2/en not_active Application Discontinuation
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Also Published As
Publication number | Publication date |
---|---|
US20100242530A1 (en) | 2010-09-30 |
RU2431088C2 (en) | 2011-10-10 |
BRPI0811899A2 (en) | 2014-11-18 |
WO2008142414A1 (en) | 2008-11-27 |
GB0805661D0 (en) | 2008-04-30 |
GB2449522A (en) | 2008-11-26 |
GB2449523A (en) | 2008-11-26 |
US20100154466A1 (en) | 2010-06-24 |
WO2008142412A1 (en) | 2008-11-27 |
GB0805660D0 (en) | 2008-04-30 |
RU2009147441A (en) | 2011-06-27 |
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