EP2096685A1 - LED module with cooling bodies containing mounting elements - Google Patents
LED module with cooling bodies containing mounting elements Download PDFInfo
- Publication number
- EP2096685A1 EP2096685A1 EP08102125A EP08102125A EP2096685A1 EP 2096685 A1 EP2096685 A1 EP 2096685A1 EP 08102125 A EP08102125 A EP 08102125A EP 08102125 A EP08102125 A EP 08102125A EP 2096685 A1 EP2096685 A1 EP 2096685A1
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- EP
- European Patent Office
- Prior art keywords
- led
- led module
- heat sink
- module according
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
- F21S41/153—Light emitting diodes [LED] arranged in one or more lines arranged in a matrix
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to an LED module, which is intended for installation in a lighting unit, wherein the LED module comprises a plurality of LED components which are mounted on a circuit board such that they directly or indirectly with a to dissipate the heat loss of the LED -Building elements provided heatsink are connected.
- Such lighting units can be used both for purposes of interior lighting and outdoor lighting. In particular, a use of such lighting units is also possible in or on motor vehicles.
- LED light emitting diode
- optical semiconductor components in the form of light-emitting diodes in particular light-emitting diode chips (LED chips) can be used.
- LED chips light-emitting diode chips
- a plurality of LED components are arranged in an array, wherein the LEDs are preferably mounted as surface-mounted SMD (SMD) element by soldering or gluing on a support or a printed circuit board.
- SMD surface-mounted SMD
- LEDs are increasingly being used because they have some significant advantages over conventional light bulbs. LEDs have a longer life, a smaller size and a better efficiency in the conversion of electrical energy into light. Furthermore, LEDs are characterized by insensitivity to shocks and vibrations from, which represents a considerable advantage, especially in motor vehicles.
- the waste heat that occurs as a loss has to be dissipated against the backdrop of constantly increasing performance, even in LEDs, in order to prevent overheating and thus functional impairment or even destruction of the LEDs.
- the waste heat is dissipated from the underside of the LED components via their electrical connections and / or via a serving as a heat connection third contact to a metallic heat sink.
- flexible printed circuit boards are usually equipped with LEDs in a two-dimensional plane, and then the flexible structure thus obtained is glued to a heat sink.
- the heat sink can, as it is from the DE 199 22 176 A1 is known, for example, made of copper or aluminum, which have the desired application for the desired three-dimensional shape and be provided on the side facing away from the circuit board surfaces with cooling fins.
- the printed circuit board is preferably attached to the heat sink with a thermal paste, a thermal adhesive, a heat-conducting foil or the like, with an exact alignment of the LED components is difficult and just like the sticking of the circuit board to the heatsink means a considerable assembly effort.
- LED lighting modules also called LED modules for short
- LED modules in which a certain number of LEDs are combined in a specific arrangement into a module in order to achieve the required amount of light for specific applications.
- Such modules can be mounted relatively easily in a lighting unit.
- the LEDs are soldered or glued onto a structured circuit carrier, which may be formed by a rigid or flexible printed circuit board or by an IMS substrate.
- a structured circuit carrier which may be formed by a rigid or flexible printed circuit board or by an IMS substrate.
- a third contact via which the heat loss of the LED is dissipated.
- This heat connection which is generally non-floating, is soldered or glued to a surface area of the circuit carrier that is designed so that it is not in electrical contact with the rest of the circuit. The heat is subsequently applied via an electrical insulating layer in the circuit carrier discharged to a metallic cooling carrier.
- an LED module with a plurality of LEDs is arranged, which are arranged on a flexible printed circuit board, which is attached to a heat sink.
- the flexible circuit board is provided with holes through which the individual LEDs are in direct contact with the heat sink.
- Object of the present invention is to provide an improved LED module of the type mentioned, which allows for improved heat dissipation easier and more accurate installation of the individual light points of the LED module.
- the LED module comprises at least one heat sink, which is connected to at least one LED component, and that the heat sink or at least one, preferably all heatsink, mounting means for a positive and / or non-positive mounting having on another element of the LED module or the LED module receiving luminous unit.
- a prefabricated and easy-to-install LED assembly is created, which not only allows a particularly good heat dissipation, but in particular a quick and easy to perform mountability with improved positioning accuracy of the individual LEDs. So can the mounted on the heat sinks, in particular soldered LEDs are positioned in the assembly of the LED module together with the positive or non-positive attachment and alignment of the heat sink in a lighting unit.
- the LED module according to the invention according to claim 1 thus has over the previously known embodiments in particular the advantage that an alignment of the individual LEDs when applying the printed circuit board on an arbitrarily shaped three-dimensional element due to the previously executed in a two-dimensional plane connection with the form-fitting and / or frictionally mountable heat sinks can be omitted, which significantly reduces the cost and therefore the manufacturing cost of equipped with such LED modules lighting unit.
- the LED module comprises a plurality of heat sinks and the circuit board is provided with openings, wherein the LED components are mounted on the circuit board such that they are each connected through an opening with a heat sink.
- the heat loss of the LEDs due to the direct contact with a heat sink can be dissipated particularly quickly and effectively, since the heat is passed only on metallic and highly thermally conductive materials.
- the individual heat sinks can also be arranged movably relative to one another and connected to one another via the flexible printed circuit board, which can be advantageous, for example, in the case of cornering light or cornering light applications.
- each LED component is connected to its own separate heat sink.
- each LED component is connected to its own separate heat sink.
- even more complex arrangements with a plurality of LEDs can be placed in a particularly accurate position on a three-dimensionally shaped support.
- particularly close tolerances of the individual LEDs are achievable to each other.
- this will ensures a particularly simple way of electrical insulation of the heat connections of the individual LEDs to each other.
- the mounting means of the heat sink each comprise at least one recess which can be positively placed on a respective projection of an aggregate element. It is achieved by the direct positive positioning of the heat sink and an indirectly form-fitting positioning of the associated LEDs. If a plurality of heat sinks are provided, the printed circuit board is advantageously made flexible in order to ensure a certain relative mobility of the heat sinks to one another. It is also possible to turn the two elements cooperating with one another in a form-fitting manner, so that a projection is provided on the heat sink, which projection can be inserted in a form-locking manner into a recess provided on an aggregate element.
- the projections may preferably be formed integrally on an element or embossed out of a contour.
- a thermal adhesive between the projections and recesses are applied to achieve a cohesive grip.
- the recess has a self-centering shape.
- the recess may in particular have a hemispherical, conical, frusto-conical or similar tapering inner contour.
- a particularly preferred embodiment provides that the heat sinks provided separately for each LED are each formed by a sleeve or sleeve closed on one side with a conical wall.
- This embodiment of the positive mounting not only a structurally particularly simple embodiment, but above all, a particularly effective heat dissipation is achieved.
- the heat dissipation takes place on the one hand on the inside of the sleeve directly to the form-fitting associated projection of the corresponding unit element as well as on the other hand by free convection on the outside of the soldered directly to the heat connection of the LED socket.
- the dissipated via the free convection in the interior of a lighting unit heat can be used in the case of a headlight advantageously also for heating or defrosting the protective glass of the headlamp.
- the heat sink bush formed in this way is made of copper.
- the overall heat sink may preferably be formed in a manner known per se as a heat sink and have a plurality of cooling fins.
- the mounting means of the heat sink in each case comprise at least one elastically resilient holding region, by means of which the heat sink can be fastened non-positively or latchingly on an element of the LED module or the lighting unit.
- the heatsink can be used in addition to their function for dissipating the heat loss at the same time as retaining clips for mounting the LED module or individual portions thereof.
- each holding region for positive engagement has at least one projection and / or a recess or opening through which the heat sink to another element form-fitting and / or frictionally engaged. This allows a particularly simple and quickly executable mounting of the LED module to other elements.
- optical means in particular a plastic optics, are provided in the LED module. These can be connected in a particularly simple manner via the elastically resilient holding areas latching with the heat sinks.
- a flexible LED chain can advantageously be formed with a plurality of LEDs attached to each other, each attached to a heat sink designed according to the invention, which are particularly simple and quick by clipping the individual Heatsink in a lighting unit, in particular in a headlight housing, can be mounted.
- the present invention further relates to a lighting unit with a plurality of LED components and a plurality of heat sinks, via which the heat loss of the LEDs can be removed, wherein the lighting unit comprises at least one, but preferably a plurality of LED modules of the type described above, the at least one flexible circuit board and / or are interconnected by at least one flexible flat cable.
- a lighting unit is due to the prefabricated and easily assembled LED modules in total very fast and easy to assemble, which allows a cost-effective production.
- the lighting unit has at least one serving as an LED support total heat sink, can be dissipated via the heat loss of all LEDs, the total heat sink more as a fixed point for each LED serving projections, on each of which a heat sink of an LED component is seated.
- the heat sink can also be mounted on projections of other elements of the lighting unit.
- the lighting unit according to the invention is a headlamp, in particular a motor vehicle headlamp, which comprises a headlamp heat sink, on which at least one LED module is positively received or clipped.
- the present invention can thus be used advantageously in particular in the automotive sector, but also in general lighting applications.
- the present invention furthermore relates to a method for mounting an LED module according to the above-described first particularly preferred embodiment of the invention, in which module the mounting means of the heat sink each comprise at least one recess which is positively connected to a respective projection of an aggregate element or the LED. Module can be placed.
- This mounting method according to the invention is characterized in that a negative pressure is applied to at least some projections of the unit element or the LED module via a line system opening into the projections.
- openings are provided in the projections, to which the preferably formed by bores, channels, and / or hoses line system connects, which is connected to a pump for generating a negative pressure.
- the heatsink are sucked when the negative pressure on the projections and tightened there, which further simplifies the assembly considerably further.
- the suction force required for a cohesive hold of the heat sink can be applied by the suction of the heat sink to the unit element or to the LED module.
- LED module 1 is intended for installation in a not shown in the figures lighting unit. It comprises a flexible printed circuit board 2 serving as a circuit carrier, on which a multiplicity of LED components 3 are arranged, each of which is embodied here as a surface-mounted LED chip. Each individual LED chip 3 is connected to a separate heat sink 4, which is designed here in the form of a bottom-side closed socket with a conical wall 5.
- the printed circuit board 2 has an opening at each LED component 3, through which a central third contact provided for the dissipation of the lost heat of the LED 3 is firmly connected to the base 6 of the associated heat sink 4 by soldering.
- the two electrical terminals 7 of the LED components 3 are connected to the heat sinks 4 opposite top of the circuit board 2 with the printed conductors applied thereto ( FIG. 1 ).
- the individual heat sink bushes 4 have between their conical inner walls 5 a recess 8, which is open to the end facing away from the circuit board 2 end. About these recesses 8, the heat sink 4 are each form-fitting on a respective frustoconical projection 9 can be placed, which is integrally formed on a serving as an LED support heat sink 10 of the lighting unit ( FIG. 2 ).
- the projections 9 fill as complementary counterparts the cavity or the recess 8 of the heat sink 4 completely, so that an optimal heat transfer is ensured only by metallic, good heat conducting materials.
- the existing of copper heatsink bushes 4 serve as heatspreader, while the existing aluminum here total heat sink 10 with a plurality of molded cooling fins 11 serves as heatsink ( FIG. 3 ).
- the outer sides of the copper sleeves 4 are heated by free convection directly into the interior of the lighting unit.
- a dissipation of the heat loss takes place via the inside of the copper sleeve 4 to the entire heat sink 10, from where the heat is dissipated to the environment of the lighting unit.
- the inside of the heat sink bushing 4 can also be connected via a thermal adhesive with the associated positive projection 9 of the overall heat sink 10.
- the conical design of the projections 9 and the complementary recesses 8 of the associated heat sink 4 results in the assembly of the LED module 1 according to the invention automatically self-adjustment of the heat sink 4 and thus also the attached LED components 3.
- the heat sink bushings 4 align themselves with the LED components 3 soldered to the fixed points formed by the projections 9, so that with ease of mounting improved positional accuracy can be achieved.
- FIG. 4 arrangement shown several LED groups for different lighting functions on a common flexible printed circuit board 2 are arranged.
- the entire circuit board 2 is first equipped in a two-dimensional plane with the surface mountable LED components 3 and then applied to a plurality of three-dimensionally shaped LED support plates or overall heat sink 10.
- the exact position of the individual LEDs 3 is determined by the fixed points formed by the projections 9 of the overall heat sink 10, resulting in a particularly favorable tolerance chain.
- FIG. 4 shown arrangement advantageously no connections between the individual LED modules 1 required.
- the control electronics required for controlling the individual LED modules 1 and optionally further electronic circuits can likewise be arranged on the printed circuit board 2 and accommodated in the lighting unit equipped with the LED modules 1.
- first openings 12 are punched into the printed circuit board 2b formed here by a flexible flat cable ( FIG. 6 ), through which the LED components 3b contact the bottoms 6b at a central extent 13 ( Fig. 7 ).
- the individual heatsinks 4b are bonded to the circuit board 2b prior to connection to the LEDs 3b.
- an elastically resilient, outwardly bendable holding region 14 with an opening 15 introduced therein is formed in each case.
- the heat sink 4b can be mounted positively and / or non-positively on other elements of the LED module 1b or a lighting unit accommodating the LED module 1b via these two elastically outwardly bendable holding regions 14.
- any number of LED chips 3b can be provided in any arrangement in the LED module 1b depending on the purpose.
- an LED module 1c is provided in each case a heat sink 4c for each six series-connected LED components 3c.
- the construction of the heat sink 4c substantially corresponds to the construction of the heat sink 4b from the Figure 5 to 7 .
- two openings 15 are formed here, via which in the in the FIG. 9 and 10 illustrated embodiment, a plastic optics 16 for the respective LED module 1c is snap-mounted.
- the plastic optics 16 has for this purpose laterally projecting projections 17 with an inlet slope 18, which engage in the mounted state in the openings 15 of the holding regions 14.
- LED modules 1c can be interconnected by an FFC matrix of flexible ribbon cables 2c.
- a thus obtained flexible network with chained LED modules 1c is relatively easy to mount in a lighting unit, for example in a car headlight.
- the LED modules 1c can then be individually adjusted, whereas the individual LED components 3c within the LED modules 1c are already adjusted in advance.
- the flexible networks of LED modules 1c can be particularly easily adapted to the different headlights of different vehicle types.
- generously dimensioned heat paths even with the ribbon cables 2c, offer the possibility of dissipating the dissipated heat loss to corresponding total heat sinks or into more favorable zones.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Die vorliegende Erfindung betrifft ein LED-Modul, das zum Einbau in ein Leuchtaggregat bestimmt ist, wobei das LED-Modul mehrere LED-Bauelemente umfasst, die derart auf einer Leiterplatte montiert sind, dass sie unmittelbar oder mittelbar mit einem zur Abfuhr der Verlustwärme der LED-Bauelemente vorgesehenen Kühlkörper verbunden sind.The present invention relates to an LED module, which is intended for installation in a lighting unit, wherein the LED module comprises a plurality of LED components which are mounted on a circuit board such that they directly or indirectly with a to dissipate the heat loss of the LED -Building elements provided heatsink are connected.
Derartige Leuchtaggregate können sowohl zu Zwecken der Innenraumbeleuchtung als auch bei der Außenbeleuchtung eingesetzt werden. Insbesondere ist ein Einsatz von solchen Leuchtaggregate auch in oder an Kraftfahrzeugen möglich. Als lichtabgebende LED-Bauelemente (LED = light emitting diode) können optische Halbleiterbauelemente in der Form von Leuchtdioden, insbesondere Leuchtdiodenchips (LED-Chips) eingesetzt werden. Üblicherweise wird dabei eine Vielzahl von LED-Bauelementen (im folgenden auch LEDs genannt) zu einem Array angeordnet, wobei die LEDs vorzugsweise als oberflächenmontiertes SMD-Element (SMD = surface mounted device) durch Löten oder Kleben auf einem Träger oder einer Leiterplatte montiert werden.Such lighting units can be used both for purposes of interior lighting and outdoor lighting. In particular, a use of such lighting units is also possible in or on motor vehicles. As light-emitting LED components (LED = light emitting diode), optical semiconductor components in the form of light-emitting diodes, in particular light-emitting diode chips (LED chips) can be used. Usually, a plurality of LED components (also called LEDs hereinafter) are arranged in an array, wherein the LEDs are preferably mounted as surface-mounted SMD (SMD) element by soldering or gluing on a support or a printed circuit board.
Nicht nur bei Kraftfahrzeugen werden zunehmend LEDs eingesetzt, da sie gegenüber konventionellen Glühlampen einige wesentliche Vorteile aufweisen. So haben LEDs eine längere Lebensdauer, eine geringere Baugröße sowie einen besseren Wirkungsgrad bei der Umwandlung elektrischer Energie in Licht. Ferner zeichnen sich LEDs durch eine Unempfindlichkeit gegenüber Stößen und Erschütterungen aus, was insbesondere bei Kraftfahrzeugen einen erheblichen Vorteil darstellt.Not only in motor vehicles, LEDs are increasingly being used because they have some significant advantages over conventional light bulbs. LEDs have a longer life, a smaller size and a better efficiency in the conversion of electrical energy into light. Furthermore, LEDs are characterized by insensitivity to shocks and vibrations from, which represents a considerable advantage, especially in motor vehicles.
Trotz der im Vergleich zu Glühlampen geringeren Wärmeabgabe muss vor dem Hintergrund einer ständig fortschreitenden Leistungssteigerung auch bei LEDs die als Verlust auftretende Abwärme abgeführt werden, um eine Überhitzung und damit eine Funktionsbeeinträchtigung oder sogar eine Zerstörung der LEDs zu verhindern. Üblicherweise wird die Abwärme von der Unterseite der LED-Bauelemente über ihre elektrischen Anschlüsse und/oder über einen als Wärmeanschluss dienenden dritten Kontakt an einen metallischen Kühlkörper abgeführt.Despite the lower heat dissipation compared to incandescent lamps, the waste heat that occurs as a loss has to be dissipated against the backdrop of constantly increasing performance, even in LEDs, in order to prevent overheating and thus functional impairment or even destruction of the LEDs. Usually, the waste heat is dissipated from the underside of the LED components via their electrical connections and / or via a serving as a heat connection third contact to a metallic heat sink.
Um beispielsweise in einem Scheinwerfer eines Kraftfahrzeugs mehrere LEDs oder mehrere LED-Gruppen anzuordnen, werden üblicherweise flexible Leiterplatten in einer zweidimensionalen Ebene mit LEDs bestückt, und danach wird das so erhaltene flexible Gebilde auf einen Kühlkörper aufgeklebt. Der Kühlkörper kann dabei, wie es aus der
Ferner ist es bekannt, vorgefertigte LED-Leuchtmodule (kurz auch LED-Module genannt) einzusetzen, bei denen eine bestimmte Anzahl von LEDs in einer bestimmten Anordnung zu einem Modul zusammengefasst sind, um die geforderte Menge Licht für bestimmte Applikationen zu erreichen. Derartige Module lassen sich relativ einfach in einem Leuchtaggregat montieren.Furthermore, it is known to use prefabricated LED lighting modules (also called LED modules for short) in which a certain number of LEDs are combined in a specific arrangement into a module in order to achieve the required amount of light for specific applications. Such modules can be mounted relatively easily in a lighting unit.
Auch in den LED-Modulen werden die LEDs auf einen strukturierten Schaltungsträger gelötet oder geklebt, welcher durch eine starre oder flexible Leiterplatte bzw. durch ein IMS-Substrat gebildet sein kann. High-Brightness-LEDs haben dabei neben den beiden elektrischen Anschlusskontakten noch einen dritten Kontakt, über den die Verlustwärme der LED abgeführt wird. Dieser Wärmeanschluss, der im allgemeinen nicht potentialfrei ist, wird auf einen Flächebereich des Schaltungsträgers gelötet bzw. geklebt, der über das Layout so gestaltet ist, dass er nicht mit der restlichen Schaltung in elektrischem Kontakt steht Die Wärme wird anschließend über eine elektrische Isolierschicht im Schaltungsträger an einen metallischen Kühlträger abgeführt.Also in the LED modules, the LEDs are soldered or glued onto a structured circuit carrier, which may be formed by a rigid or flexible printed circuit board or by an IMS substrate. Have high-brightness LEDs In addition to the two electrical connection contacts, a third contact via which the heat loss of the LED is dissipated. This heat connection, which is generally non-floating, is soldered or glued to a surface area of the circuit carrier that is designed so that it is not in electrical contact with the rest of the circuit. The heat is subsequently applied via an electrical insulating layer in the circuit carrier discharged to a metallic cooling carrier.
Aus der
Aufgabe der vorliegenden Erfindung ist es, ein verbessertes LED-Modul der eingangs genannten Art zu schaffen, das bei verbesserter Wärmeableitung eine einfachere und exaktere Montage der einzelnen Lichtpunkte des LED-Moduls ermöglicht.Object of the present invention is to provide an improved LED module of the type mentioned, which allows for improved heat dissipation easier and more accurate installation of the individual light points of the LED module.
Diese Aufgabe wird durch ein LED-Modul nach Anspruch 1 gelöst.This object is achieved by an LED module according to
Die der vorliegenden Erfindung zugrundeliegende Idee besteht darin, dass das LED-Modul mindestens einen Kühlkörper umfasst, der mit mindestens einem LED-Bauelement verbunden ist, und dass der Kühlkörper oder zumindest einer, vorzugsweise alle Kühlkörper, Montagemittel für eine formschlüssige und/oder kraftschlüssige Montage an einem anderen Element des LED-Moduls oder des das LED-Modul aufnehmenden Leuchtaggregats aufweist.The idea underlying the present invention is that the LED module comprises at least one heat sink, which is connected to at least one LED component, and that the heat sink or at least one, preferably all heatsink, mounting means for a positive and / or non-positive mounting having on another element of the LED module or the LED module receiving luminous unit.
Auf diese Weise wird eine vorgefertigte und einfach zu verbauende LED-Baugruppe geschaffen, die nicht nur eine besonders gute Wärmeabfuhr, sondern insbesondere auch eine schnell und einfach auszuführende Montierbarkeit mit verbesserter Positioniergenauigkeit der einzelnen LEDs gestattet. So können die an den Kühlkörpern befestigten, insbesondere angelöteten LEDs bei der Montage des LED-Moduls zusammen mit der form- oder kraftschlüssig erfolgenden Anbringung und Ausrichtung der Kühlkörper in einem Leuchtaggregat positioniert werden.In this way, a prefabricated and easy-to-install LED assembly is created, which not only allows a particularly good heat dissipation, but in particular a quick and easy to perform mountability with improved positioning accuracy of the individual LEDs. So can the mounted on the heat sinks, in particular soldered LEDs are positioned in the assembly of the LED module together with the positive or non-positive attachment and alignment of the heat sink in a lighting unit.
Das erfindungsgemäße LED-Modul nach Anspruch 1 weist somit gegenüber den vorbekannten Ausführungsformen vor allem den Vorteil auf, dass eine Ausrichtung der einzelnen LEDs beim Aufbringen der Leiterplatte auf ein beliebig geformtes dreidimensionales Element aufgrund der vorab in einer zweidimensionalen Ebene ausgeführten Verbindung mit den formschlüssig und/oder kraftschlüssig montierbaren Kühlkörpern entfallen kann, was den Aufwand und damit auch die Herstellungskosten eines mit derartigen LED-Modulen ausgestatteten Leuchtaggregats deutlich reduziert.The LED module according to the invention according to
Vorteilhafte Weiterbildungen und Verbesserungen des erfindungsgemäßen LED-Moduls ergeben sich aus den abhängigen Ansprüchen.Advantageous developments and improvements of the LED module according to the invention will become apparent from the dependent claims.
So ist es beispielsweise besonders günstig, wenn das LED-Modul mehrere Kühlkörper umfasst und die Leiterplatte mit Öffnungen versehen ist, wobei die LED-Bauelemente derart auf der Leiterplatte montiert sind, dass sie jeweils durch eine Öffnung hindurch mit einem Kühlkörper verbunden sind. Auf diese Weise kann die Verlustwärme der LEDs aufgrund des direktes Kontakts zu einem Kühlkörper besonders schnell und effektiv abgeführt werden, da die Wärme nur über metallische und gut wärmeleitende Materialien geführt wird. Bei einer flexiblen Leiterplatte können die einzelnen Kühlkörper auch beweglich zueinander angeordnet und über die flexible Leiteplatte miteinander verbunden sein, was beispielsweise bei Abbiegelicht- bzw. Kurvenlicht-Anwendungen von Vorteil sein kann.Thus, for example, it is particularly advantageous if the LED module comprises a plurality of heat sinks and the circuit board is provided with openings, wherein the LED components are mounted on the circuit board such that they are each connected through an opening with a heat sink. In this way, the heat loss of the LEDs due to the direct contact with a heat sink can be dissipated particularly quickly and effectively, since the heat is passed only on metallic and highly thermally conductive materials. In the case of a flexible printed circuit board, the individual heat sinks can also be arranged movably relative to one another and connected to one another via the flexible printed circuit board, which can be advantageous, for example, in the case of cornering light or cornering light applications.
Weiterhin ist es besonders vorteilhaft, wenn jedes LED-Bauelement mit einem eigenen separaten Kühlkörper verbunden ist. Hierdurch können auch komplexere Anordnungen mit einer Vielzahl von LEDs besonders positionsgenau an einem dreidimensional geformten Träger platziert werden. Auch sind dabei besonders enge Lagetoleranzen der einzelnen LEDs zueinander erzielbar. Ferner wird hierdurch auf besonders einfache Weise eine elektrische Isolation der Wärmeanschlüsse der einzelnen LEDs zueinander gewährleistet.Furthermore, it is particularly advantageous if each LED component is connected to its own separate heat sink. As a result, even more complex arrangements with a plurality of LEDs can be placed in a particularly accurate position on a three-dimensionally shaped support. Also, particularly close tolerances of the individual LEDs are achievable to each other. Furthermore, this will ensures a particularly simple way of electrical insulation of the heat connections of the individual LEDs to each other.
Gemäß einer ersten besonders bevorzugten Ausführungsform der Erfindung ist vorgesehen, dass die Montagemittel der Kühlkörper jeweils mindestens eine Ausnehmung umfassen, die formschlüssig auf jeweils einen Vorsprung eines Aggregatelements aufgesetzt werden kann. Dabei wird durch die unmittelbare formschlüssige Positionierung der Kühlkörper auch eine mittelbar formschlüssige Positionierung der damit verbundenen LEDs erreicht. Sofern mehrere Kühlkörper vorgesehen sind ist die Leiterplatte vorteilhafterweise flexibel ausgeführt, um eine gewisse relative Beweglichkeit der Kühlkörper zueinander zu gewährleisten. Ebenso ist es möglich, die beiden formschlüssig miteinander zusammenwirkenden Elemente umzudrehen, so dass am Kühlkörper ein Vorsprung vorgesehen ist, der formschlüssig in eine an einem Aggregatelement vorgesehene Ausnehmung einsetzbar ist. In beiden Fällen wird durch den Formschluss eine besonders exakte, dauerhaft zuverlässige sowie reproduzierbare Ausrichtung der Kühlkörper und somit auch der vorab damit verbundenen LEDs an den vorab feststehenden Fixpunkten des Aggregatelements erreicht. Die Vorsprünge können vorzugsweise massiv an ein Element angeformt oder erhaben aus einer Kontur herausgeprägt sein. Zusätzlich kann ein Wärmeleitkleber zwischen die Vorsprünge und Ausnehmungen aufgebracht werden, um einen stoffschlüssigen Halt zu erzielen.According to a first particularly preferred embodiment of the invention it is provided that the mounting means of the heat sink each comprise at least one recess which can be positively placed on a respective projection of an aggregate element. It is achieved by the direct positive positioning of the heat sink and an indirectly form-fitting positioning of the associated LEDs. If a plurality of heat sinks are provided, the printed circuit board is advantageously made flexible in order to ensure a certain relative mobility of the heat sinks to one another. It is also possible to turn the two elements cooperating with one another in a form-fitting manner, so that a projection is provided on the heat sink, which projection can be inserted in a form-locking manner into a recess provided on an aggregate element. In both cases, a particularly precise, permanently reliable and reproducible alignment of the heat sink and thus also the previously associated LEDs at the previously fixed fixed points of the unit element is achieved by the positive locking. The projections may preferably be formed integrally on an element or embossed out of a contour. In addition, a thermal adhesive between the projections and recesses are applied to achieve a cohesive grip.
Besonders vorteilhaft ist es dabei, wenn die Ausnehmung eine selbstzentrierende Form hat. So kann die Ausnehmung insbesondere eine halbkugelförmig, kegelförmig, kegelstumpfförmig oder ähnlich zulaufende Innenkontur aufweisen. Auf diese Weise erfolgt bei der Montage des LED-Moduls eine Selbstjustage der LEDs an den entsprechenden Fix-Punkten des Aggregatelements. Beim Aufbringen der bestückten flexiblen Leiterplatte auf das Aggregatelement richten sich die Kühlkörper und somit auch die damit verbundenen LEDs zumindest in gewissen Grenzen selbständig aus. Dadurch können die Nachteile einer gewissen Positionsungenauigkeit bei der Bestückung einer großflächigen Flexboard bzw. der Nachteil von möglichen Längungen in deren Material weitestgehend korrigiert werden.It is particularly advantageous if the recess has a self-centering shape. Thus, the recess may in particular have a hemispherical, conical, frusto-conical or similar tapering inner contour. In this way, during the assembly of the LED module, a self-adjustment of the LEDs takes place at the corresponding fixed points of the unit element. When applying the assembled flexible printed circuit board on the aggregate element, the heat sink and thus the associated LEDs align themselves, at least within certain limits. As a result, the disadvantages of a certain position inaccuracy in the assembly of a large-area flexboard or the disadvantage of possible elongations in their material can be largely corrected.
Eine besonders bevorzugte Ausführungsform sieht dabei vor, dass die für jede LED separat vorgesehenen Kühlkörper jeweils durch eine einseitig geschlossene Buchse bzw. Hülse mit einer konischen Wandung gebildet sind. Durch diese Ausführung der formschlüssigen Montage wird nicht nur eine konstruktiv besonders einfache Ausführungsform, sondern vor allem auch eine besonders effektive Wärmeableitung erreicht. Die Wärmeableitung erfolgt dabei einerseits an der Innenseite der Hülse unmittelbar zum formschlüssig damit verbundenen Vorsprung des entsprechenden Aggregatelementes sowie andererseits auch durch freie Konvektion an der Außenseite der direkt an den Wärmeanschluss der LED gelöteten Buchse. Die über die frei Konvektion in den Innenraum eines Leuchtaggregats abgeführte Wärme kann im Falle eines Scheinwerfers vorteilhafterweise auch zur Erwärmung bzw. zum Abtauen der Schutzscheibe des Scheinwerfers genutzt werden. Vorzugsweise besteht die so gebildete Kühlkörperbuchse aus Kupfer.A particularly preferred embodiment provides that the heat sinks provided separately for each LED are each formed by a sleeve or sleeve closed on one side with a conical wall. This embodiment of the positive mounting not only a structurally particularly simple embodiment, but above all, a particularly effective heat dissipation is achieved. The heat dissipation takes place on the one hand on the inside of the sleeve directly to the form-fitting associated projection of the corresponding unit element as well as on the other hand by free convection on the outside of the soldered directly to the heat connection of the LED socket. The dissipated via the free convection in the interior of a lighting unit heat can be used in the case of a headlight advantageously also for heating or defrosting the protective glass of the headlamp. Preferably, the heat sink bush formed in this way is made of copper.
Besonders günstig ist es ferner, wenn die einzelnen Kühlkörper mit ihren Ausnehmungen wärmeleitend auf komplementären Vorsprüngen eines als LED-Träger dienenden Gesamtkühlkörpers des LED-Moduls oder des Leuchtaggregats aufsitzen, der vorzugsweise aus Aluminium bestehen kann. Hierdurch erfolgt die Wärmeableitung über die mit den LEDs verbundenen einzelnen Kühlkörper durch unmittelbaren Kontakt vorzugsweise metallischer, gut wärmeleitender Materialien an einen Gesamtkühlkörper, der für mehrere oder vorzugsweise für alle LEDs des erfindungsgemäßen LED-Moduls oder des das LED-Modul aufnehmenden Leuchtaggregats vorgesehen ist. Der Gesamtkühlkörper kann vorzugsweise in an sich bekannter Weise als Heatsink ausgebildet sein und mehrere Kühlrippen aufweisen.It is also particularly advantageous if the individual heatsink with its recesses heat-conducting on complementary projections of serving as an LED carrier heat sink overall of the LED module or the lighting unit, which may preferably be made of aluminum. As a result, the heat dissipation via the individual heat sink connected to the LEDs by direct contact preferably metallic, good heat conducting materials to a total heat sink, which is provided for several or preferably for all LEDs of the LED module according to the invention or the LED module receiving luminous unit. The overall heat sink may preferably be formed in a manner known per se as a heat sink and have a plurality of cooling fins.
Gemäß einer zweiten bevorzugten Ausführungsform der Erfindung wird vorgeschlagen, dass die Montagemittel der Kühlkörper jeweils mindestens einen elastisch federnden Haltebereich umfassen, über den der Kühlkörper kraftschlüssig oder rastend an einem Element des LED-Moduls oder des Leuchtaggregats befestigt werden kann. Auf diese Weise können die Kühlkörper neben ihrer Funktion zum Abführen der Verlustwärme gleichzeitig auch als Halteclipse zur Befestigung des LED-Moduls oder einzelner Teilbereiche davon genutzt werden.According to a second preferred embodiment of the invention it is proposed that the mounting means of the heat sink in each case comprise at least one elastically resilient holding region, by means of which the heat sink can be fastened non-positively or latchingly on an element of the LED module or the lighting unit. In this way, the heatsink can be used in addition to their function for dissipating the heat loss at the same time as retaining clips for mounting the LED module or individual portions thereof.
Besonders vorteilhaft ist es dabei, wenn die Kühlkörper jeweils clipsförmig mit zwei einander gegenüberliegenden elastisch federnden Haltebereichen ausgebildet sind, wobei jeder Haltebereich zum formschlüssigen Einrasten mindestens einen Vorsprung und/oder eine Ausnehmung oder Öffnung aufweist, über die der Kühlkörper an einen anderen Element formschlüssig und/oder kraftschlüssig einrastbar ist. Dadurch wird eine besonders einfache und schnell ausführbare Montage des LED-Moduls an anderen Elementen ermöglicht.It is particularly advantageous if the heat sinks are each formed in a clip shape with two mutually opposite elastically resilient holding regions, each holding region for positive engagement has at least one projection and / or a recess or opening through which the heat sink to another element form-fitting and / or frictionally engaged. This allows a particularly simple and quickly executable mounting of the LED module to other elements.
Günstig für eine gewünschte Lichtabgabe kann es weiterhin sein, wenn optische Mittel, insbesondere eine Kunststoffoptik in dem LED-Modul vorgesehen sind. Diese können auf besonders einfache Weise über die elastisch federnden Haltebereiche rastend mit den Kühlkörpern verbunden werden.It may also be favorable for a desired light output if optical means, in particular a plastic optics, are provided in the LED module. These can be connected in a particularly simple manner via the elastically resilient holding areas latching with the heat sinks.
Wenn die Leiterplatte durch ein flexibles flaches Kabel (FFC = flexible flat cable) gebildet ist, kann vorteilhafterweise eine flexible LED-Kette mit mehreren aneinander gereihten, jeweils an einem erfindungsgemäß ausgeführten Kühlkörper befestigten LEDs gebildet werden, die besonders einfach und schnell durch Aufclipsen der einzelnen Kühlkörper in einem Leuchtaggregat, insbesondere in einem Scheinwerfergehäuse, montierbar ist.If the printed circuit board is formed by a flexible flat cable (FFC), a flexible LED chain can advantageously be formed with a plurality of LEDs attached to each other, each attached to a heat sink designed according to the invention, which are particularly simple and quick by clipping the individual Heatsink in a lighting unit, in particular in a headlight housing, can be mounted.
Die vorliegende Erfindung betrifft ferner ein Leuchtaggregat mit mehreren LED-Bauelementen und mehreren Kühlkörpern, über die die Verlustwärme der LEDs abgeführt werden kann, wobei das Leuchtaggregat mindestens ein, vorzugsweise aber mehrere LED-Module der vorangehend beschriebenen Art umfasst, die über mindestens eine flexible Leiterplatte und/oder durch mindestens ein flexibles flaches Kabel miteinander verbunden sind. Ein derartiges Leuchtaggregat ist aufgrund der vorgefertigten und leicht montierbaren LED-Module insgesamt besonders schnell und einfach zu montieren, was eine kostengünstige Fertigung ermöglicht.The present invention further relates to a lighting unit with a plurality of LED components and a plurality of heat sinks, via which the heat loss of the LEDs can be removed, wherein the lighting unit comprises at least one, but preferably a plurality of LED modules of the type described above, the at least one flexible circuit board and / or are interconnected by at least one flexible flat cable. Such a lighting unit is due to the prefabricated and easily assembled LED modules in total very fast and easy to assemble, which allows a cost-effective production.
Besonders vorteilhaft ist es dabei, wenn das Leuchtaggregat mindestens einen als LED-Träger dienenden Gesamtkühlkörper aufweist, über die Verlustwärme aller LEDs abgeführt werden kann, wobei der Gesamtkühlkörper mehrere jeweils als Fixpunkt für je eine LED dienende Vorsprünge aufweist, auf denen jeweils ein Kühlkörper eines LED-Bauelementes aufsitzt. Hierdurch wird eine besonders effektive Abführung der Verlustwärme der LEDs erreicht. Grundsätzlich aber sind die Kühlkörper auch auf Vorsprüngen anderer Elemente des Leuchtaggregats montierbar.It is particularly advantageous if the lighting unit has at least one serving as an LED support total heat sink, can be dissipated via the heat loss of all LEDs, the total heat sink more as a fixed point for each LED serving projections, on each of which a heat sink of an LED component is seated. As a result, a particularly effective dissipation of the heat loss of the LEDs is achieved. In principle, however, the heat sink can also be mounted on projections of other elements of the lighting unit.
Besonders vorteilhaft ist es ferner, wenn das erfindungsgemäße Leuchtaggregat ein Scheinwerfer, insbesondere ein Kraftfahrzeugscheinwerfer ist, der einen Scheinwerferkühlkörper umfasst, auf dem mindestens ein LED-Modul formschlüssig aufgenommen oder angeclipst ist. Die vorliegende Erfindung kann somit insbesondere im Automotive-Bereich, aber auch bei generellen Beleuchtungsanwendungen in vorteilhafter Weise zum Einsatz kommen.It is also particularly advantageous if the lighting unit according to the invention is a headlamp, in particular a motor vehicle headlamp, which comprises a headlamp heat sink, on which at least one LED module is positively received or clipped. The present invention can thus be used advantageously in particular in the automotive sector, but also in general lighting applications.
Gegenstand der vorliegenden Erfindung ist ferner ein Verfahren zur Montage eines LED-Moduls gemäß der oben beschriebenen ersten besonders bevorzugten Ausführungsform der Erfindung, bei welchem Modul die Montagemittel der Kühlkörper jeweils mindestens eine Ausnehmung umfassen, die formschlüssig auf jeweils einen Vorsprung eines Aggregatelements oder des LED-Moduls aufgesetzt werden kann. Dieses erfindungsgemäße Montageverfahren zeichnet sich dadurch aus, dass an zumindest einige Vorsprünge des Aggregat-Elements oder des LED-Moduls über ein in den Vorsprüngen mündendes Leitungssystem ein Unterdruck angelegt wird. Dazu sind in den Vorsprüngen Öffnungen vorgesehen, an die sich das vorzugsweise durch Bohrungen, Kanäle, und/oder Schläuche gebildete Leitungssystem anschließt, welches mit einer Pumpe zum Erzeugen eines Unterdrucks verbunden ist. Dadurch werden die Kühlkörper bei Anlegen des Unterdrucks auf die Vorsprünge aufgesaugt und dort fest angezogen, was die Montage nochmals erheblich weiter vereinfacht. Insbesondere wenn zwischen den Vorsprüngen und den Ausnehmungen ein wärmeleitender Klebstoff aufgebracht wird, kann durch das Ansaugen der Kühlkörper an das Aggregatelement oder an das LED-Modul die für einen stoffschlüssigen Halt der Kühlkörper erforderliche Andrückkraft aufgebracht werden.The present invention furthermore relates to a method for mounting an LED module according to the above-described first particularly preferred embodiment of the invention, in which module the mounting means of the heat sink each comprise at least one recess which is positively connected to a respective projection of an aggregate element or the LED. Module can be placed. This mounting method according to the invention is characterized in that a negative pressure is applied to at least some projections of the unit element or the LED module via a line system opening into the projections. For this purpose, openings are provided in the projections, to which the preferably formed by bores, channels, and / or hoses line system connects, which is connected to a pump for generating a negative pressure. As a result, the heatsink are sucked when the negative pressure on the projections and tightened there, which further simplifies the assembly considerably further. In particular, when a thermally conductive adhesive is applied between the projections and the recesses, the suction force required for a cohesive hold of the heat sink can be applied by the suction of the heat sink to the unit element or to the LED module.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
In den Zeichnungen sind Ausführungsbeispiele der Erfindung dargestellt, die in der nachfolgenden Beschreibung näher erläutert werden. Es zeigen:
- Figur 1:
- Dreidimensionale, teilweise geschnittene Darstellung eines erfindungsgemäßen LED-Moduls;
- Figur2:
- Dreidimensionale Darstellung eines Kühlkörpers, an dem das LED-
Modul aus Figur 1 montierbar ist; - Figur 3:
- Dreidimensionale, teilweise geschnittene Darstellung des Kühlkörpers aus
Figur 2 mit daran montiertem LED-Modul aus Figur 1 ; - Figur 4:
- Dreidimensionale Darstellung einer Anordnung mit mehreren erfindungsgemäßen LED-Modulen;
- Figur 5:
- Dreidimensionale Darstellung einer zweiten Ausführungsform eines erfindungsgemäßen LED-Moduls;
- Figur 6:
- Flexible Leiterplatte des
Moduls von Figur 5 ; - Figur 7:
- Darstellung eines einzelnen Kühlkörpers des Moduls aus
Figur 5 ; - Figur 8:
- Dreidimensionale Darstellung einer dritten Ausführungsvariante eines erfindungsgemäßen LED-Moduls;
- Figur 9:
- Teilweise geschnittene Ansicht eines LED-
Moduls nach Figur 8 mit daran befestigter Kunststoffoptik; und - Figur 10:
- Darstellung einer Anordnung mit mehreren miteinander verketteten Modulen nach
Figur 9 .
- FIG. 1:
- Three-dimensional, partially cut representation of an LED module according to the invention;
- Figur2:
- Three-dimensional representation of a heat sink on which the LED module off
FIG. 1 can be mounted; - FIG. 3:
- Three-dimensional, partially cut representation of the heat sink
FIG. 2 with LED module mounted on itFIG. 1 ; - FIG. 4:
- Three-dimensional representation of an arrangement with several LED modules according to the invention;
- FIG. 5:
- Three-dimensional representation of a second embodiment of an LED module according to the invention;
- FIG. 6:
- Flexible PCB of the module of
FIG. 5 ; - FIG. 7:
- Representation of a single heat sink of the module
FIG. 5 ; - FIG. 8:
- Three-dimensional representation of a third embodiment of an LED module according to the invention;
- FIG. 9:
- Partial sectional view of an LED module after
FIG. 8 with attached plastic optics; and - FIG. 10:
- Representation of an arrangement with several concatenated modules after
FIG. 9 ,
Das in den
Die einzelnen Kühlkörperbuchsen 4 haben zwischen ihren konisch verlaufenden Innenwandungen 5 eine Ausnehmung 8, die zu dem von der Leiterplatte 2 abgewandten Ende hin offen ist. Über diese Ausnehmungen 8 sind die Kühlkörper 4 jeweils formschlüssig auf je einen kegelstumpfförmig ausgebildeten Vorsprung 9 aufsetzbar, der einstückig an einem als LED-Träger dienenden Gesamtkühlkörper 10 des Leuchtaggregats ausgeformt ist (
Die Außenseiten der Kupferhülsen 4 werden über freie Konvektion direkt in den Innenraum des Leuchtaggregats entwärmt. Zusätzlich erfolgt eine Ableitung der Verlustwärme über die Innenseite der Kupferhülse 4 an den Gesamtkühlkörper 10, von wo aus die Wärme an die Umgebung des Leuchtaggregats abgeleitet wird. Dabei kann die Innenseite der Kühlkörperbuchse 4 zusätzlich auch über einen Wärmeleitkleber mit dem zugehörigen formschlüssigen Vorsprung 9 des Gesamtkühlkörpers 10 verbunden werden.The outer sides of the
Aufgrund der konischen Ausbildung der Vorsprünge 9 und der komplementären Ausnehmungen 8 der zugehörigen Kühlkörper 4 ergibt sich bei der Montage des erfindungsgemäßen LED-Moduls 1 automatisch eine Selbstjustage der Kühlkörper 4 und somit auch der daran befestigten LED-Bauelemente 3. Beim Aufbringen der bestückten flexiblen Leiterplatte 2 auf den Gesamtkühlkörper 10 richten sich die Kühlkörperbuchsen 4 mit den daran angelöteten LED-Bauelementen 3 an den durch die Vorsprünge 9 gebildeten Fixpunkten selbstständig aus, so dass bei einfacher Montierbarkeit eine verbesserte Positionsgenauigkeit erreicht werden kann.Due to the conical design of the
Bei der in
Bei dem in
An zwei einander gegenüber liegenden Rändern des Bodens 6b ist jeweils ein elastisch federnder, nach außen aufbiegbarer Haltebereich 14 mit einer darin eingebrachten Öffnung 15 angeformt. Über diese beiden elastisch nach außen biegbaren Haltebereiche 14 kann der Kühlkörper 4b formschlüssig und/oder kraftschlüssig an weiteren Elementen des LED-Moduls 1b oder eines das LED-Modul 1b aufnehmenden Leuchtaggregats montiert werden. Grundsätzlich können je nach Einsatzzweck beliebig viele LED-Chips 3b in beliebiger Anordnung in dem LED-Modul 1b vorgesehen werden.At two mutually opposite edges of the bottom 6b an elastically resilient, outwardly
Bei dem in den
Auf die in
Claims (14)
dadurch gekennzeichnet,
dass das LED-Modul (1, 1b, 1c) mindestens einen Kühlkörper (4, 4b, 4c) umfasst, der mit mindestens einem LED-Bauelement (3, 3b, 3c) verbunden ist, und dass der Kühlkörper (4, 4b, 4c) oder zumindest einer von mehreren Kühlkörpern (4, 4b, 4c) Montagemittel (8, 14, 15) für eine formschlüssige und/oder kraftschlüssige Montage an einem anderen Element (10, 16) des LED-Moduls (1, 1b, 1c) oder des Leuchtaggregats aufweist.LED module for installation in a lighting unit, comprising a plurality of LED components (3, 3b, 3c), which are mounted on a printed circuit board (2, 2b, 2c) such that they are directly or indirectly connected to a heat sink (4, 4b, 4c) are connected,
characterized,
that the LED module (1, 1b, 1c) at least one cooling body (4, 4b, 4c), which is connected with at least one LED component (3, 3b, 3c), and that the cooling body (4, 4b, 4c) or at least one of a plurality of heat sinks (4, 4b, 4c) mounting means (8, 14, 15) for a positive and / or non-positive mounting to another element (10, 16) of the LED module (1, 1b, 1c ) or of the lighting unit.
Priority Applications (1)
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EP08102125A EP2096685A1 (en) | 2008-02-28 | 2008-02-28 | LED module with cooling bodies containing mounting elements |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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EP08102125A EP2096685A1 (en) | 2008-02-28 | 2008-02-28 | LED module with cooling bodies containing mounting elements |
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EP08102125A Withdrawn EP2096685A1 (en) | 2008-02-28 | 2008-02-28 | LED module with cooling bodies containing mounting elements |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2461151A (en) * | 2008-05-29 | 2009-12-30 | Integration Technology Ltd | Led device and cooling arrangement |
WO2011147644A3 (en) * | 2010-05-25 | 2012-04-26 | Osram Ag | Semiconductor luminous device, method for producing a carrier substrate and method for applying a carrier substrate to a heat sink |
US20130170145A1 (en) * | 2012-01-02 | 2013-07-04 | Tem Products Inc. | Thermal connector |
DE102012112070A1 (en) * | 2012-12-11 | 2014-06-12 | Hella Kgaa Hueck & Co. | Housing unit for motor car, has fastening element including outer contour, which is pivotably mounted about axis on support element such that tolerance of fastening element is effectively decoupled from tolerance range of module |
US9267659B2 (en) | 2012-05-14 | 2016-02-23 | Sl Corporation | Vehicle lamp |
WO2017008643A1 (en) * | 2015-07-15 | 2017-01-19 | 福建永德吉灯业股份有限公司 | Led lamp with radiator and lamp cap integrated structure |
WO2020011452A1 (en) | 2018-07-11 | 2020-01-16 | Robert Bosch Gmbh | Carrier device for the electrical connection of at least one lighting element |
WO2022048954A1 (en) * | 2020-09-01 | 2022-03-10 | HELLA GmbH & Co. KGaA | Assembly for a motor vehicle lamp |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19922176A1 (en) | 1999-05-12 | 2000-11-23 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement |
US20010030866A1 (en) * | 2000-03-31 | 2001-10-18 | Relume Corporation | LED integrated heat sink |
US20050212439A1 (en) | 2004-03-25 | 2005-09-29 | Integrated Illumination Systems, Inc. | Integrating flex circuitry and rigid flexible circuitry, with high power/high brightness LEDs |
US20060131602A1 (en) * | 2004-12-21 | 2006-06-22 | Ouderkirk Andrew J | Illumination assembly and method of making same |
WO2006122392A1 (en) * | 2005-05-20 | 2006-11-23 | Tir Systems Ltd. | Cove illumination module and system |
US20070007540A1 (en) * | 2003-05-26 | 2007-01-11 | Matsushita Electric Works, Ltd. | Light-emitting device |
-
2008
- 2008-02-28 EP EP08102125A patent/EP2096685A1/en not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19922176A1 (en) | 1999-05-12 | 2000-11-23 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement |
US20010030866A1 (en) * | 2000-03-31 | 2001-10-18 | Relume Corporation | LED integrated heat sink |
US20070007540A1 (en) * | 2003-05-26 | 2007-01-11 | Matsushita Electric Works, Ltd. | Light-emitting device |
US20050212439A1 (en) | 2004-03-25 | 2005-09-29 | Integrated Illumination Systems, Inc. | Integrating flex circuitry and rigid flexible circuitry, with high power/high brightness LEDs |
US20060131602A1 (en) * | 2004-12-21 | 2006-06-22 | Ouderkirk Andrew J | Illumination assembly and method of making same |
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