EP2044629A4 - Systeme de camera et methodes associees - Google Patents

Systeme de camera et methodes associees

Info

Publication number
EP2044629A4
EP2044629A4 EP07796897A EP07796897A EP2044629A4 EP 2044629 A4 EP2044629 A4 EP 2044629A4 EP 07796897 A EP07796897 A EP 07796897A EP 07796897 A EP07796897 A EP 07796897A EP 2044629 A4 EP2044629 A4 EP 2044629A4
Authority
EP
European Patent Office
Prior art keywords
camera system
associated methods
methods
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07796897A
Other languages
German (de)
English (en)
Other versions
EP2044629A2 (fr
Inventor
Michael R Feldman
James E Morris
Robert D Tekolste
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Flir Systems Trading Belgium BVBA
Original Assignee
DigitalOptics Corp East
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/487,580 external-priority patent/US8049806B2/en
Application filed by DigitalOptics Corp East filed Critical DigitalOptics Corp East
Publication of EP2044629A2 publication Critical patent/EP2044629A2/fr
Publication of EP2044629A4 publication Critical patent/EP2044629A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/003—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having two lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/0035—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having three lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0055—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element
    • G02B13/006—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing a special optical element at least one element being a compound optical element, e.g. cemented elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0085—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras employing wafer level optics
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Lens Barrels (AREA)
  • Studio Devices (AREA)
  • Cameras In General (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
EP07796897A 2006-07-17 2007-07-17 Systeme de camera et methodes associees Withdrawn EP2044629A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/487,580 US8049806B2 (en) 2004-09-27 2006-07-17 Thin camera and associated methods
US85536506P 2006-10-31 2006-10-31
PCT/US2007/016156 WO2008011003A2 (fr) 2006-07-17 2007-07-17 Système de caméra et méthodes associées

Publications (2)

Publication Number Publication Date
EP2044629A2 EP2044629A2 (fr) 2009-04-08
EP2044629A4 true EP2044629A4 (fr) 2012-08-01

Family

ID=38957311

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07796897A Withdrawn EP2044629A4 (fr) 2006-07-17 2007-07-17 Systeme de camera et methodes associees

Country Status (5)

Country Link
EP (1) EP2044629A4 (fr)
JP (2) JP5292291B2 (fr)
KR (1) KR101185881B1 (fr)
CN (1) CN101512768B (fr)
WO (1) WO2008011003A2 (fr)

Families Citing this family (46)

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US20080118241A1 (en) * 2006-11-16 2008-05-22 Tekolste Robert Control of stray light in camera systems employing an optics stack and associated methods
WO2008102776A1 (fr) * 2007-02-19 2008-08-28 Konica Minolta Opto, Inc. Lentille et dispositif d'imagerie, terminal portable et procédé de fabrication de lentille d'imagerie
WO2008102773A1 (fr) * 2007-02-19 2008-08-28 Konica Minolta Opto, Inc. Lentille et dispositif d'imagerie, terminal portable et procédé de fabrication de lentille d'imagerie
EP2527898A3 (fr) * 2007-02-19 2014-06-25 Konica Minolta Opto, Inc. Objectif et dispositif d'imagerie, et terminal mobile
WO2009004965A1 (fr) 2007-07-04 2009-01-08 Konica Minolta Opto, Inc. Lentilles d'imagerie, dispositif d'imagerie, et terminal mobile
US20110031510A1 (en) * 2007-11-27 2011-02-10 Heptagon Oy Encapsulated lens stack
TW200937642A (en) 2007-12-19 2009-09-01 Heptagon Oy Wafer stack, integrated optical device and method for fabricating the same
JP5293614B2 (ja) 2008-02-20 2013-09-18 コニカミノルタ株式会社 撮像レンズ、撮像装置、携帯端末、および撮像レンズの製造方法
US9118825B2 (en) 2008-02-22 2015-08-25 Nan Chang O-Film Optoelectronics Technology Ltd. Attachment of wafer level optics
CN103323893B (zh) * 2008-04-28 2015-07-29 柯尼卡美能达精密光学株式会社 晶圆透镜聚合体的制造方法及晶圆透镜聚合体
WO2009137022A1 (fr) * 2008-05-06 2009-11-12 Tessera North America, Inc. Système de caméra comprenant un blindage contre les rayonnements et procédé de blindage contre les rayonnements
FR2931587B1 (fr) * 2008-05-21 2011-05-13 Commissariat Energie Atomique Procede de realisation d'un dispositif optique a composants optoelectroniques integres
US20090321861A1 (en) * 2008-06-26 2009-12-31 Micron Technology, Inc. Microelectronic imagers with stacked lens assemblies and processes for wafer-level packaging of microelectronic imagers
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NL1036360C2 (nl) 2008-12-23 2010-06-24 Anteryon B V Optische eenheid.
TWM364865U (en) 2009-05-07 2009-09-11 E Pin Optical Industry Co Ltd Miniature stacked glass lens module
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KR101648540B1 (ko) 2009-08-13 2016-08-16 삼성전자주식회사 웨이퍼-레벨 렌즈 모듈 및 이를 구비하는 촬상 장치
US9419032B2 (en) 2009-08-14 2016-08-16 Nanchang O-Film Optoelectronics Technology Ltd Wafer level camera module with molded housing and method of manufacturing
TW201109165A (en) 2009-09-11 2011-03-16 E Pin Optical Industry Co Ltd Stacked disk-shaped optical lens array, stacked disk-shaped lens module array and the method of manufacturing thereof
US8305699B2 (en) 2009-09-23 2012-11-06 Samsung Electronics Co., Ltd. Wafer-level lens module with extended depth of field and imaging device including the wafer-level lens module
JP2011085625A (ja) * 2009-10-13 2011-04-28 Toppan Printing Co Ltd カメラモジュール及びその製造方法
JP5556140B2 (ja) * 2009-11-20 2014-07-23 凸版印刷株式会社 カメラモジュール及びその製造方法
US20130162882A1 (en) * 2010-06-14 2013-06-27 Heptagon Oy Method of Manufacturing Plurality of Optical Devices
NL2005164C2 (nl) 2010-07-28 2012-01-31 Anteryon Internat B V Optische eenheid.
FR2966936B1 (fr) 2010-11-02 2012-12-07 Commissariat Energie Atomique Systeme optique de formation d'image sur une surface spherique concave
CN102478695B (zh) * 2010-11-25 2016-05-11 鸿富锦精密工业（深圳）有限公司 镜头模组阵列、制造方法及镜头
US9910239B2 (en) * 2010-11-30 2018-03-06 Flir Systems Trading Belgium Bvba Wafer level optical elements and applications thereof
KR101262470B1 (ko) 2011-01-31 2013-05-08 엘지이노텍 주식회사 렌즈 어셈블리 및 카메라 모듈
NL2006373C2 (nl) 2011-03-11 2012-09-17 Anteryon Internat B V Optische eenheid.
US8345360B2 (en) * 2011-06-03 2013-01-01 Visera Technologies Company Limited Camera unit and macro lens thereof
WO2012173252A1 (fr) * 2011-06-17 2012-12-20 コニカミノルタアドバンストレイヤー株式会社 Procédé de fabrication de lentille de tranche, lentille de tranche, procédé de fabrication d'unité de lentilles et unité de lentilles
JP2013007969A (ja) * 2011-06-27 2013-01-10 Sharp Corp 撮像レンズ、レンズアレイ、撮像レンズの製造方法、および撮像モジュール
US20130122247A1 (en) 2011-11-10 2013-05-16 Omnivision Technologies, Inc. Spacer Wafer For Wafer-Level Camera And Method For Manufacturing Same
JP5469235B2 (ja) * 2012-12-20 2014-04-16 オリンパス株式会社 レンズモジュールの製造方法
WO2015126328A1 (fr) * 2014-02-18 2015-08-27 Heptagon Micro Optics Pte. Ltd. Modules optiques comprenant des éléments d'espacement adaptés sur mesure destinés au réglage de la longueur focale et/ou à la réduction de l'inclinaison, et procédé de fabrication desdits modules optiques
JP6254680B2 (ja) * 2014-04-04 2018-01-10 シャープ株式会社 レンズ素子および撮像装置
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US9829698B2 (en) 2015-08-31 2017-11-28 Panasonic Corporation Endoscope
JP6744119B2 (ja) * 2016-04-05 2020-08-19 パナソニックｉ−ＰＲＯセンシングソリューションズ株式会社 内視鏡
US9778443B2 (en) 2015-10-05 2017-10-03 Omnivision Technologies, Inc. Three-surface wide field-of-view lens system
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US10677964B2 (en) 2017-10-23 2020-06-09 Omnivision Technologies, Inc. Lens wafer assembly and associated method for manufacturing a stepped spacer wafer
US11311187B2 (en) 2018-04-06 2022-04-26 Amo Development, Llc Methods and systems for corneal topography with in-focus scleral imaging
KR102555577B1 (ko) * 2019-01-28 2023-07-18 삼성전자주식회사 카메라 모듈을 포함하는 전자 장치

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EP1239519A2 (fr) * 2001-03-05 2002-09-11 Canon Kabushiki Kaisha Module de prise de vues et dispositif de prise de vues
US20040047274A1 (en) * 2002-06-27 2004-03-11 Olumpus Optical Co., Ltd. Image pickup lens unit and image pickup device
WO2004027880A2 (fr) * 2002-09-17 2004-04-01 Koninklijke Philips Electronics N.V. Dispositif camera, procede de fabrication associe, ensemble tranche
US20050285016A1 (en) * 2004-06-29 2005-12-29 Yung-Cheol Kong Image sensor module structure comprising wire bonding package and method of manufacturing the image sensor module structure
US20060043262A1 (en) * 2004-08-30 2006-03-02 Micron Technology, Inc. Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers

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Title
See also references of WO2008011003A2 *

Also Published As

Publication number Publication date
JP5372280B2 (ja) 2013-12-18
WO2008011003A3 (fr) 2008-06-26
CN101512768A (zh) 2009-08-19
WO2008011003A2 (fr) 2008-01-24
CN101512768B (zh) 2012-11-21
KR20090034981A (ko) 2009-04-08
JP2013153537A (ja) 2013-08-08
EP2044629A2 (fr) 2009-04-08
KR101185881B1 (ko) 2012-09-25
JP5292291B2 (ja) 2013-09-18
JP2009544226A (ja) 2009-12-10

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