EP2024532A2 - Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen - Google Patents
Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygenInfo
- Publication number
- EP2024532A2 EP2024532A2 EP07797890A EP07797890A EP2024532A2 EP 2024532 A2 EP2024532 A2 EP 2024532A2 EP 07797890 A EP07797890 A EP 07797890A EP 07797890 A EP07797890 A EP 07797890A EP 2024532 A2 EP2024532 A2 EP 2024532A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- precursor
- silicon
- chamber
- substrate
- anneal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000002243 precursor Substances 0.000 title claims abstract description 77
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title claims abstract description 76
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 66
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 9
- 229910052710 silicon Inorganic materials 0.000 title claims description 9
- 239000010703 silicon Substances 0.000 title claims description 9
- 238000005229 chemical vapour deposition Methods 0.000 title claims description 7
- 235000012239 silicon dioxide Nutrition 0.000 title description 6
- 239000000377 silicon dioxide Substances 0.000 title description 6
- 238000000034 method Methods 0.000 claims abstract description 111
- 238000000151 deposition Methods 0.000 claims abstract description 79
- 230000008021 deposition Effects 0.000 claims abstract description 69
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000012686 silicon precursor Substances 0.000 claims abstract description 57
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 55
- 239000007789 gas Substances 0.000 claims description 41
- 238000006243 chemical reaction Methods 0.000 claims description 22
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 20
- 238000000137 annealing Methods 0.000 claims description 18
- 239000001301 oxygen Substances 0.000 claims description 15
- 229910052760 oxygen Inorganic materials 0.000 claims description 15
- 238000002156 mixing Methods 0.000 claims description 13
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 229910052786 argon Inorganic materials 0.000 claims description 10
- 239000012159 carrier gas Substances 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000010494 dissociation reaction Methods 0.000 claims description 8
- 230000005593 dissociations Effects 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 7
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical group O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 7
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 7
- 229910001882 dioxygen Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000203 mixture Substances 0.000 claims description 7
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 5
- 239000001307 helium Substances 0.000 claims description 5
- 229910052734 helium Inorganic materials 0.000 claims description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 5
- -1 DEMS Chemical compound 0.000 claims description 4
- HMMGMWAXVFQUOA-UHFFFAOYSA-N octamethylcyclotetrasiloxane Chemical compound C[Si]1(C)O[Si](C)(C)O[Si](C)(C)O[Si](C)(C)O1 HMMGMWAXVFQUOA-UHFFFAOYSA-N 0.000 claims description 4
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 4
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 4
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- UCXUKTLCVSGCNR-UHFFFAOYSA-N diethylsilane Chemical compound CC[SiH2]CC UCXUKTLCVSGCNR-UHFFFAOYSA-N 0.000 claims description 3
- OIKHZBFJHONJJB-UHFFFAOYSA-N dimethyl(phenyl)silicon Chemical compound C[Si](C)C1=CC=CC=C1 OIKHZBFJHONJJB-UHFFFAOYSA-N 0.000 claims description 3
- UBHZUDXTHNMNLD-UHFFFAOYSA-N dimethylsilane Chemical compound C[SiH2]C UBHZUDXTHNMNLD-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 claims description 3
- PARWUHTVGZSQPD-UHFFFAOYSA-N phenylsilane Chemical compound [SiH3]C1=CC=CC=C1 PARWUHTVGZSQPD-UHFFFAOYSA-N 0.000 claims description 3
- 229910000077 silane Inorganic materials 0.000 claims description 3
- CZDYPVPMEAXLPK-UHFFFAOYSA-N tetramethylsilane Chemical compound C[Si](C)(C)C CZDYPVPMEAXLPK-UHFFFAOYSA-N 0.000 claims description 3
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 claims description 3
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- 239000007795 chemical reaction product Substances 0.000 claims description 2
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052724 xenon Inorganic materials 0.000 claims description 2
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 2
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 claims 2
- 238000006303 photolysis reaction Methods 0.000 claims 1
- 230000008569 process Effects 0.000 description 38
- 229910052799 carbon Inorganic materials 0.000 description 20
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 18
- 235000012431 wafers Nutrition 0.000 description 18
- 238000012545 processing Methods 0.000 description 14
- 229910018540 Si C Inorganic materials 0.000 description 10
- 229910010271 silicon carbide Inorganic materials 0.000 description 10
- 238000009826 distribution Methods 0.000 description 9
- 239000003989 dielectric material Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 238000004590 computer program Methods 0.000 description 5
- 238000005755 formation reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011800 void material Substances 0.000 description 5
- 150000001282 organosilanes Chemical class 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 208000029523 Interstitial Lung disease Diseases 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004320 controlled atmosphere Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- CSJDCSCTVDEHRN-UHFFFAOYSA-N methane;molecular oxygen Chemical compound C.O=O CSJDCSCTVDEHRN-UHFFFAOYSA-N 0.000 description 1
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/401—Oxides containing silicon
- C23C16/402—Silicon dioxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/452—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by activating reactive gas streams before their introduction into the reaction chamber, e.g. by ionisation or addition of reactive species
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02164—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
- H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02337—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a gas or vapour
Definitions
- the size and distance between device structures continue to decrease.
- the narrower widths in the gaps of the structures and the trenches between structures increases the ratio of height to width ⁇ i.e., the aspect ratio) in these formations.
- the continued miniaturization of integrated circuit elements is shrinking the horizontal width within and between these elements faster than their vertical height.
- gaps were relatively easy to fill with a rapid deposit of a dielectric material.
- the deposition material would blanket the sides and bottom of the gap and continue to fill from the bottom up until the crevice or trench was fully filled.
- aspect ratios increased however, it became more difficult to fill the deep, narrow trench without having a blockage start a void or seam in the fill volume.
- Voids and seams in a dielectric layer cause create problems both during semiconductor device fabrication and in the finished devices.
- the voids and seams are formed randomly in the dielectric layer and have unpredictable sizes, shapes, locations and population densities. This results in unpredictable and inconsistent post-deposition processing of the layer, such as even etching, polishing, annealing, etc.
- the voids and seams in the finished devices also create variations in the dielectric qualities of gaps and trenches in device structures. This can result in uneven, and inferior device performance due to electrical crosstalk, charge leakage, and even shorting within and between device elements.
- Another technique to control void formation is to increase the flowability of the deposited dielectric material.
- a material with more flowability can more quickly fill a void or seam and prevent it from becoming a permanent defect in the fill volume.
- Increasing the flowability of an silicon oxide dielectric material often involves adding water vapor or peroxide ⁇ e.g., H 2 O 2 ) to the mix of precursors used to form the oxide layer. The water vapor creates more Si-OH bonds in the deposited film, which impart an increased flowability to the film.
- Embodiments of the invention include methods of depositing a silicon oxide layer on a substrate.
- the methods may include the steps of providing a substrate to a deposition chamber, generating an atomic oxygen precursor outside the deposition chamber, and introducing the atomic oxygen precursor into the chamber.
- the methods may also include introducing a silicon precursor to the deposition chamber, where the silicon precursor and the atomic oxygen precursor are first mixed in the chamber.
- the silicon precursor and the atomic oxygen precursor react to form the silicon oxide layer on the substrate.
- the methods may also include annealing the deposited silicon oxide layer.
- Embodiments of the invention also include methods of forming a silicon oxide layer on a substrate.
- the methods may include the steps of providing a silicon wafer substrate to a reaction chamber, and generating an atomic oxygen precursor from a dissociation of molecular oxygen in a high-density argon plasma.
- the atomic oxygen precursor may be generated in a remote plasma generating chamber that is external to the reaction chamber.
- the methods may also include mixing the atomic oxygen precursor with a silicon precursor in the reaction chamber, where the atomic oxygen precursor and the silicon precursor are not mixed before reaching the reaction chamber.
- the silicon oxide layer deposited on the substrate includes the reaction products from the reaction of the atomic oxygen with the silicon precursor.
- Embodiments of the invention may still further include systems to deposit a silicon oxide layer on a substrate.
- the systems may include a deposition chamber in which the substrate is held, and a remote plasma generating system coupled to the deposition chamber, where the plasma generating system is used to generate an atomic oxygen precursor.
- the systems may also include a silicon precursor source used to supply a silicon precursor to the deposition chamber, and precursor handling system used to direct flows of the atomic oxygen precursor and the silicon precursor into the deposition chamber.
- the precursor handling system may be configured to keep the atomic oxygen and silicon precursors from mixing before they enter the deposition chamber.
- FIG. 1 is a flowchart showing steps in methods of forming oxide layers on substrates according to embodiments of the invention
- FIG. 2 illustrates steps in methods of forming oxide layers according to additional embodiments of the invention
- FIG. 3 shows steps in methods of forming oxide layers that use different chambers for depositing and curing the layers according to embodiments of the invention
- Fig. 4 is a flowchart showing steps in methods of forming oxide layers from non Si- C bond containing silicon precursors according to embodiments of the invention.
- Fig. 5 is a flowchart showing steps in methods of forming oxide layers from silicon precursors that contain Si-C bonds according to embodiments of the invention
- Fig. 6A shows a vertical cross-sectional view of a substrate processing system that maybe used to form silicon oxide layers according to embodiments of the invention.
- Fig. 6B is a simplified diagram of a system monitor/controller component of a substrate processing system according to embodiments of the invention.
- Systems and methods are described for depositing a silicon oxide layer with high flowability that is then cured (i.e., annealed) into a high-quality oxide layer or fill.
- the high flowability of the initially formed oxide allows it to fill high aspect ratio gaps and trenches (e.g., aspect ratios greater than 5:1) without gaps or seams.
- the curing step then drives out moisture to leave behind a dense oxide film having a wet etch rate ratio (WERR) that may approach the practical limit for silicon oxide films (e.g., WERRs down to about 1.8 to about 1.4).
- WERR wet etch rate ratio
- low-k oxide films may be produced that also have high initial flowability and high post-cure quality.
- the methods of the invention include the remote generation of reactive atomic oxygen outside a deposition/reaction chamber.
- the atomic oxygen is first mixed with a silicon precursor in the deposition chamber, where they quickly react even at low temperatures and pressures and deposit silicon oxide on a substrate.
- the oxide formed is rich in hydroxyl groups bonded to the silicon, which make the oxide highly flowable. Once deposited, the oxide will flow quickly even at low temperatures to fill nascent voids and seams during a gap or trench fill.
- the curing step converts many of the Si-OH groups into pure silicon dioxide and water vapor, which is driven out of the deposited film.
- the curing process may be divided into a first step to eliminate the carbon by hydrolyzing the Si-C bonds into Si-OH bonds, followed by a second step to eliminate the hydroxyl groups and drive off the resulting moisture. This may be done by first performing a wet anneal (e.g., steam anneal up to about 950°C), were H 2 O hydrolyzes the Si-C bonds into Si-OH bonds, followed by a dry anneal (e.g., dry N 2 at 900 0 C) to convert the Si-OH into silicon oxide.
- a wet anneal e.g., steam anneal up to about 950°C
- a dry anneal e.g., dry N 2 at 900 0 C
- Fig 1 shows a flowchart that includes steps in a method 100 of forming an oxide layers on a substrate according to embodiments of the invention.
- the method 100 includes providing a substrate to a deposition chamber 102.
- the substrate may be a semiconductor wafer ⁇ e.g., silicon wafer having a diameter of about 300 mm or less; a silicon wafer with a diameter of about 100 mm, 150 mm, 200 mm, 300 mm, 400 mm, etc.) and may include structures, device components, etc., formed in earlier processes.
- the substrate may include gaps, trenches, etc., with high height to width aspect ratios ⁇ e.g., an aspect ratio of 5:1 or more, 6:1 or more, 7:1 or more, 8:1 or more, 9:1 or more, 10:1 or more, 11:1 or more, 12:1 more, etc.).
- the method 100 also includes the remote generation of an atomic oxygen precursor at a location outside the deposition chamber 104.
- the atomic oxygen may be generated by the dissociation of an oxygen containing precursor such as molecular oxygen (O 2 ), ozone (O 3 ), an nitrogen-oxygen compound ⁇ e.g., NO, NO 2 , N 2 O, etc), a hydrogen-oxygen compound ⁇ e.g., H 2 O, H 2 O 2 , etc.), a carbon-oxygen compound ⁇ e.g., CO, CO 2 , etc), as well as other oxygen containing precursors and combinations of precursors.
- an oxygen containing precursor such as molecular oxygen (O 2 ), ozone (O 3 ), an nitrogen-oxygen compound ⁇ e.g., NO, NO 2 , N 2 O, etc), a hydrogen-oxygen compound ⁇ e.g., H 2 O, H 2 O 2 , etc.), a carbon-oxygen compound ⁇ e.g., CO, CO 2 , etc),
- the dissociation of the oxygen containing precursor to generate the atomic oxygen may be done by thermal dissociation, ultraviolet light dissociation, and/or plasma dissociation, among other methods.
- Plasma dissociation may involve striking a plasma from helium, argon, hydrogen (H 2 ), xenon, ammonia (NH 3 ), etc., in a remote plasma generating chamber and introducing the oxygen precursor to the plasma to generate the atomic oxygen precursor.
- the reactive atomic oxygen plasma is then introduced to the deposition chamber 106 where it may mix for the first time with a silicon precursor, which is also introduced to the chamber 108.
- the highly reactive atomic oxygen will react with the silicon precursor (and other deposition precursors that may be present in the reaction chamber) at moderate temperatures ⁇ e.g., reaction temperatures less than 100°C) and pressures ⁇ e.g., about 0.1 Torr to about 10 Torr; 0.5 to 6 Torr total chamber pressure, etc.) to form a silicon oxide film 110.
- the wafer may be adjusted ⁇ i.e., heated or cooled) by a wafer pedestal that supports the wafer to a temperature of about 0 0 C to about 150°C.
- the silicon precursor may include an organosilane compound and/or silicon compound that does not contain carbon. Silicon precursors without carbon may include silane (SiH 4 ), among others. Organosilane compounds may include compounds with direct Si-C bonding and/or compounds with Si-O-C bonding.
- organosilane silicon precursors may include dimethylsilane, trimethylsilane, tetramethylsilane, diethylsilane, tetramethylorthosilicate (TMOS), tetraethylorthosilicate (TEOS), octamethyltrisiloxane (OMTS), octamethylcyclotetrasiloxane (OMCTS), tetramethyldimethyldimethoxydisilane, tetramethylcyclotetrasiloxane (TOMCATS), DMDMOS, DEMS, methyl triethoxysilane (MTES), phenyldimethylsilane, and phenylsilane, among others.
- TMOS tetramethylorthosilicate
- TEOS tetraethylorthosilicate
- OMTS octamethyltrisiloxane
- OMCATS octamethylcyclotetrasiloxane
- the silicon precursor may be mixed with a carrier gas before or during its introduction to the deposition chamber.
- a carrier gas may be an inactive gas that does not unduly interfere with the formation of the oxide film on the substrate.
- carrier gases include helium, neon, argon, nitrogen (N 2 ), and hydrogen (H 2 ), among other gases.
- the atomic oxygen and silicon precursors are not mixed before being introduced to the deposition chamber.
- the precursors may enter the chamber through separate spatially separated precursor inlets distributed around reaction chamber.
- the atomic oxygen precursor may enter from an inlet (or inlets) at the top of the chamber and positioned directly above the substrate.
- the inlet directs the flow of the oxygen precursor in a direction perpendicular to the substrate deposition surface.
- the silicon precursor may enter from one or more inlets around the sides of the deposition chamber. The inlets may direct the flow of the silicon precursor in a direction approximately parallel to the deposition surface.
- Additional embodiments include sending the atomic oxygen and silicon precursors through separate ports of a multi-port showerhead.
- a showerhead positioned above the substrate may include a pattern of openings for the precursors to enter the deposition chamber.
- One subset of openings may be supplied by the atomic oxygen precursor, while a second subset of openings is supplied by the silicon precursor.
- Precursors traveling through different sets of opening may be fluidly isolated from each other until exiting into the deposition chamber. Additional details about types and designs of precursor handling equipment is described in a co-assigned U.S. Provisional Application No. 60/803,499 by Lubomirsky, filed May 30, 2006 and titled "PROCESS CHAMBER FOR DIELECTRIC GAPFILL", and the subsequent U.S.
- the atomic oxygen and silicon precursors react in the deposition chamber, they form the silicon oxide layer on the substrate deposition surface 112.
- the initial oxide layer has excellent flowability, and can quickly migrate into gaps, trenches, voids, seams, etc., in the structures present at the deposition surface.
- Si-OH bonds silicon-hydroxyl group bonds. It's believed these bonds impart the increased flowability to the silicon oxide layer.
- the Si-OH bonds also increase the wet etch rate ratio (WERR) and dielectric constant of the deposited layer, which can reduce the quality of the deposited oxide, and its effectiveness as a electrical insulator.
- WERR wet etch rate ratio
- dielectric constant of the deposited layer which can reduce the quality of the deposited oxide, and its effectiveness as a electrical insulator.
- the concentration of the Si-OH bonds are reduced by annealing ⁇ i.e., curing) the silicon oxide layer 114 following the deposition.
- a post deposition anneal of the deposited silicon oxide layer 114 may be done in a single step, or multiple steps.
- a single step anneal may be done, for example, by heating the deposited layer to about 300°C to about 1000 0 C ⁇ e.g., about 600 0 C to about 900 0 C) in a substantially dry atmosphere ⁇ e.g., dry nitrogen, helium, argon, etc.).
- the anneal removes moisture from the deposited layer and converts Si-OH groups into silicon oxide.
- the annealed silicon oxide layer has improved film quality ⁇ e.g., a WERR of about 6 to about 3, or less) and improved qualities as a dielectric ⁇ e.g. , a k- value approaching or equal to pure silicon dioxide).
- Multi-step anneals may include a two-step anneal where the layer first undergoes a wet anneal stage, such as heating the layer to, for example, up to about 950°C (e.g., 65O 0 C) in the presence of steam. This may be followed by a dry anneal stage, where the layer is heated ⁇ e.g., about 900 0 C) in an atmosphere that is substantially free of moisture ⁇ e.g., dry N 2 ).
- a wet anneal stage such as heating the layer to, for example, up to about 950°C (e.g., 65O 0 C) in the presence of steam.
- a dry anneal stage where the layer is heated ⁇ e.g., about 900 0 C) in an atmosphere that is substantially free of moisture ⁇ e.g., dry N 2 ).
- multi-step anneals may be used in conjunction with an organosilicon precursor that forms a silicon oxide layer with substantial amounts of carbon ⁇ e.g.,
- the first, wet anneal helps replace a number of Si-C bonds with Si-OH bonds, while the dry anneal converts the Si-OH into silicon oxide bonds and drives off moisture from the layer.
- other annealing techniques may be used to anneal the silicon oxide layer 114. These include a steam anneal, a plasma anneal, an ultraviolet light anneal, an e-beam anneal, and/or a microwave anneal, among others.
- the method 200 includes providing a substrate 202 to a reaction chamber and performing an pretreatment etch on the substrate 204.
- the pretreatment etch may include a plasma etch (e.g., a high-density plasma etch with an argon plasma) to smooth substrate structures and remove surface impurities.
- the method also includes generating a plasma in a remote plasma chamber 206 and supplying an oxygen containing gas (e.g., molecular oxygen) to the plasma chamber 208 to generate an atomic oxygen plasma 210.
- an oxygen containing gas e.g., molecular oxygen
- Embodiments of method 200 include using the plasma generated in the remote plasma chamber for the pretreatment etch on the substrate 204 before generating the atomic oxygen precursor.
- the oxygen containing gas is introduced to the remote plasma chamber to generate the atomic oxygen precursor 210.
- the flow of plasma to the reaction chamber may be discontinued between the pretreatment and silicon oxide deposition steps, or may be allowed to flow continuously between the steps.
- the remotely generated atomic oxygen precursor is introduced to the reaction chamber 212 as well as the silicon precursor 214 (e.g., TEOS, OMCATS).
- the silicon precursor 214 e.g., TEOS, OMCATS.
- the two precursors react 216, and form a silicon oxide layer on the substrate 218.
- the oxide layer may be formed at a rate of about 250 A/min to about 2 ⁇ m/min.
- Embodiments of method 200 include using a carbon containing silicon precursor which adds a significant amount of carbon (e.g., Si-C and/or Si-O-C bonds) to the oxide layer.
- a two-step anneal is performed starting with a steam anneal at a first anneal temperature 220, followed by a dry anneal at a second anneal temperature 222.
- the first anneal temperature e.g., about 600°C to about 950°C
- the second anneal temperature e.g., about 900°C to about 1000°C; about 950°C, etc.
- Fig. 3 shows embodiments of a method 300 of forming an oxide layer that uses different chambers for depositing and curing the layer.
- the method 300 includes providing a substrate to the deposition chamber 302 and introducing the atomic oxygen precursor 304 and silicon precursor 306 to the chamber. The precursors react in the deposition chamber and form the silicon oxide layer on the substrate 308.
- the flow of the precursors to the deposition chamber is stopped, and the substrate is removed. It is then provided to a separate anneal chamber 310, where the anneal of the silicon oxide layer is performed 312.
- the transfer of the substrate from the deposition to the anneal chambers may be done under vacuum and/or in an inert atmosphere to prevent particulates, oxygen, and other contaminants from contacting the deposited layer.
- the deposition and anneal chambers may be part of a larger group of chambers that form semiconductor device structures, PMDs, ILDs, metallization structures, cap layers, etc. on a wafer substrate. Movement of the wafer from one chamber to another is done by automated mechanisms (e.g., robotic arms, conveyor belts, etc.) in a controlled atmosphere.
- FIG. 4 shows steps in an embodiment of a method 400 of forming oxide layers from non Si-C bond containing silicon precursor.
- the method 400 includes providing a substrate to the deposition chamber 402, and introducing the atomic oxygen precursor 404 and the non-carbon containing silicon precursor 406 to the chamber.
- the precursors react in the chamber to form a silicon oxide layer on the substrate 408, followed by an anneal.
- the anneal of the silicon oxide layer 410 may be a single step anneal in a dry nitrogen atmosphere at about 800°C to about 1000°C. Because no carbon is used in the silicon precursor, the carbon level in the deposited oxide is low, and a steam anneal to remove the carbon is not necessary.
- Method 500 shown in Fig. 5 uses a carbon containing silicon precursor (e.g., an organosilane) that leaves an significant amount of carbon in the initial silicon oxide layer deposited on the substrate.
- a carbon containing silicon precursor e.g., an organosilane
- the embodiment of the method 500 shown in Fig. 5 includes providing a substrate to a deposition chamber 502, and introducing an atomic oxygen precursor to the chamber 504.
- the silicon precursor introduced is a carbon-containing organosilane precursor 506.
- the atomic oxygen and organosilane precursor react to form a carbon containing silicon oxide layer on the substrate 508.
- a two-stage anneal is performed, starting with a first anneal to reduce the carbon level in the silicon oxide layer 510, and followed with a second anneal to reduce the moisture levels (i.e., the H 2 O and Si-OH levels) levels in the layer 512.
- the first anneal may include a steam anneal that hydrolyzes at least a portion of the Si-C bonds, and/or a plasma etch, e-beam, or UV light anneal that decomposes larger organic molecules into smaller ones.
- the second anneal may further oxidize the smaller carbon molecules into CO, CO 2 , formic acid, etc., that are removed with the moisture.
- the first anneal is a steam anneal and the second anneal is a dry nitrogen anneal.
- Figs. 1-5 are just some of the many embodiments that may be used to deposit an oxide layer on a substrate according to the present invention. Additional embodiments may include additional steps, and different sequences of steps to form the oxide layer.
- Fig. 1 shows atomic oxygen introduced in an earlier step than the silicon precursor, introducing both precursors at the same time, or introducing the silicon precursor before the atomic oxygen precursor are also contemplated by method 100.
- Deposition systems that may implement embodiments of the present invention may include high-density plasma chemical vapor deposition (HDP-CVD) systems, plasma enhanced chemical vapor deposition (PECVD) systems, sub-atmospheric chemical vapor deposition (SACVD) systems, and thermal chemical vapor deposition systems, among other types of systems.
- HDP-CVD high-density plasma chemical vapor deposition
- PECVD plasma enhanced chemical vapor deposition
- SACVD sub-atmospheric chemical vapor deposition
- thermal chemical vapor deposition systems among other types of systems.
- Specific examples of CVD systems include the CENTURA ULTIMATM HDP-CVD chambers/systems, and
- PRODUCERTM PECVD chambers/systems available from Applied Materials, Inc. of Santa Clara, California.
- FIG. 6A is vertical, cross-sectional views of a CVD system 10, having a vacuum or processing chamber 15 that includes a chamber wall 15a and a chamber lid assembly 15b.
- the CVD system 10 contains a gas distribution manifold 11 for dispersing process gases to a substrate (not shown) that rests on a heated pedestal 12 centered within the process chamber 15.
- Gas distribution manifold 11 may be formed from an electrically conducting material in order to serve as an electrode for forming a capacitive plasma.
- the substrate e.g. a semiconductor wafer
- a centerboard includes sensors for providing information on the position of the wafers.
- Deposition and carrier gases are introduced into the chamber 15 through perforated holes 13b of a conventional flat, circular gas distribution faceplate 13 a. More specifically, deposition process gases flow into the chamber through the inlet manifold 11, through a conventional perforated blocker plate 42 and then through holes 13b in gas distribution faceplate 13 a.
- deposition and carrier gases are input from gas sources 7 through gas supply lines 8 into a mixing system 9 where they are combined and then sent to manifold 11.
- the supply line for each process gas includes (i) several safety shut-off valves (not shown) that can be used to automatically or manually shut-off the flow of process gas into the chamber, and (ii) mass flow controllers (also not shown) that measure the flow of gas through the supply line.
- the several safety shut-off valves are positioned on each gas supply line in conventional configurations.
- the deposition process performed in the CVD system 10 can be either a thermal process or a plasma-enhanced process.
- an RF power supply 44 applies electrical power between the gas distribution faceplate 13a and the pedestal 12 so as to excite the process gas mixture to form a plasma within the cylindrical region between the faceplate 13a and the pedestal 12. (This region will be referred to herein as the "reaction region"). Constituents of the plasma react to deposit a desired film on the surface of the semiconductor wafer supported on pedestal 12.
- RF power supply 44 is a mixed frequency RF power supply that typically supplies power at a high RF frequency (RFl) of 13.56 MHz and at a low RF frequency (RF2) of 360 KHz to enhance the decomposition of reactive species introduced into the vacuum chamber 15.
- RFl high RF frequency
- RF2 low RF frequency
- the RF power supply 44 would not be utilized, and the process gas mixture thermally reacts to deposit the desired films on the surface of the semiconductor wafer supported on the pedestal 12, which is resistively heated to provide thermal energy for the reaction.
- the plasma heats the entire process chamber 10, including the walls of the chamber body 15a surrounding the exhaust passageway 23 and the shut-off valve 24.
- a hot liquid is circulated through the walls 15a of the process chamber 15 to maintain the chamber at an elevated temperature.
- the passages in the remainder of the chamber walls 15a are not shown.
- Fluids used to heat the chamber walls 15a include the typical fluid types, i.e., water-based ethylene glycol or oil-based thermal transfer fluids.
- heating beneficially reduces or eliminates condensation of undesirable reactant products and improves the elimination of volatile products of the process gases and other contaminants that might contaminate the process if they were to condense on the walls of cool vacuum passages and migrate back into the processing chamber during periods of no gas flow.
- the remainder of the gas mixture that is not deposited in a layer, including reaction byproducts, is evacuated from the chamber 15 by a vacuum pump (not shown). Specifically, the gases are exhausted through an annular, slot-shaped orifice 16 surrounding the reaction region and into an annular exhaust plenum 17.
- the annular slot 16 and the plenum 17 are defined by the gap between the top of the chamber's cylindrical side wall 15a (including the upper dielectric lining 19 on the wall) and the bottom of the circular chamber lid 20.
- the 360.degree. circular symmetry and uniformity of the slot orifice 16 and the plenum 17 are important to achieving a uniform flow of process gases over the wafer so as to deposit a uniform film on the wafer.
- the wafer support platter of the pedestal 12 (preferably aluminum, ceramic, or a combination thereof) is resistively heated using an embedded single-loop embedded heater element configured to make two full turns in the form of parallel concentric circles. An outer portion of the heater element runs adjacent to a perimeter of the support platter, while an inner portion runs on the path of a concentric circle having a smaller radius.
- the wiring to the heater element passes through the stem of the pedestal 12.
- any or all of the chamber lining, gas inlet manifold faceplate, and various other reactor hardware are made out of material such as aluminum, anodized aluminum, or ceramic.
- An example of such a CVD apparatus is described in co-assigned U.S. Pat. No. 5,558,717 entitled "CVD Processing Chamber,” issued to Zhao et al, and hereby incorporated by reference in its entirety.
- a lift mechanism and motor 32 raises and lowers the heater pedestal assembly 12 and its wafer lift pins 12b as wafers are transferred into and out of the body of the chamber 15 by a robot blade (not shown) through an insertion/removal opening 26 in the side of the chamber 10.
- the motor 32 raises and lowers pedestal 12 between a processing position 14 and a lower, wafer-loading position.
- the motor, valves or flow controllers connected to the supply lines 8, gas delivery system, throttle valve, RF power supply 44, and chamber and substrate heating systems are all controlled by a system controller over control lines 36, of which only some are shown.
- Controller 34 relies on feedback from optical sensors to determine the position of movable mechanical assemblies such as the throttle valve and susceptor which are moved by appropriate motors under the control of controller 34.
- the system controller includes a hard disk drive (memory 38), a floppy disk drive and a processor 37.
- the processor contains a single-board computer (SBC), analog and digital input/output boards, interface boards and stepper motor controller boards.
- SBC single-board computer
- Various parts of CVD system 10 conform to the Versa Modular European (VME) standard which defines board, card cage, and connector dimensions and types.
- VME Versa Modular European
- the VME standard also defines the bus structure as having a 16-bit data bus and a 24-bit address bus.
- System controller 34 controls all of the activities of the CVD machine.
- the system controller executes system control software, which is a computer program stored in a computer-readable medium such as a memory 38.
- the memory 38 is a hard disk drive, but the memory 38 may also be other kinds of memory.
- the computer program includes sets of instructions that dictate the timing, mixture of gases, chamber pressure, chamber temperature, RF power levels, susceptor position, and other parameters of a particular process.
- Other computer programs stored on other memory devices including, for example, a floppy disk or other another appropriate drive, may also be used to operate controller 34.
- a process for depositing a film on a substrate or a process for cleaning the chamber 15 can be implemented using a computer program product that is executed by the controller 34.
- the computer program code can be written in any conventional computer readable programming language: for example, 68000 assembly language, C, C++, Pascal, Fortran or others.
- Suitable program code is entered into a single file, or multiple files, using a conventional text editor, and stored or embodied in a computer usable medium, such as a memory system of the computer. If the entered code text is in a high level language, the code is compiled, and the resultant compiler code is then linked with an object code of precompiled Microsoft Windows® library routines. To execute the linked, compiled object code the system user invokes the object code, causing the computer system to load the code in memory. The CPU then reads and executes the code to perform the tasks identified in the program.
- FIG. 6B is a simplified diagram of the system monitor and CVD system 10 in a substrate processing system, which may include one or more chambers.
- two monitors 50a are used, one mounted in the clean room wall for the operators and the other behind the wall for the service technicians.
- the monitors 50a simultaneously display the same information, but only one light pen 50b is enabled.
- a light sensor in the tip of light pen 50b detects light emitted by CRT display. To select a particular screen or function, the operator touches a designated area of the display screen and pushes the button on the pen 50b.
- the touched area changes its highlighted color, or a new menu or screen is displayed, confirming communication between the light pen and the display screen.
- Other devices such as a keyboard, mouse, or other pointing or communication device, may be used instead of or in addition to light pen 50b to allow the user to communicate with controller 34.
- FIG. 6 A shows a remote plasma generator 60 mounted on the lid assembly 15b of the process chamber 15 including the gas distribution faceplate 13a and the gas distribution manifold 11.
- a mounting adaptor 64 mounts the remote plasma generator 60 on the lid assembly 15b, as best seen in FIG. 6 A.
- the adaptor 64 is typically made of metal.
- a mixing device 70 is coupled to the upstream side of the gas distribution manifold 11 (FIG. 6A).
- the mixing device 70 includes a mixing insert 72 disposed inside a slot 74 of a mixing block for mixing process gases.
- a ceramic isolator 66 is placed between the mounting adaptor 64 and the mixing device 70 (FIGS. 6A).
- the ceramic isolator 66 may be made of a ceramic material such as Al 2 O 3 (99% purity), Teflon®, or the like. When installed, the mixing device 70 and ceramic isolator 66 may form part of the lid assembly 15b. The isolator 66 isolates the metal adaptor 64 from the mixing device 70 and gas distribution manifold 11 to minimize the potential for a secondary plasma to form in the lid assembly 15b as discussed in more detail below.
- a three-way valve 77 controls the flow of the process gases to the process chamber 15 either directly or through the remote plasma generator 60.
- the remote plasma generator 60 is desirably a compact, self-contained unit that can be conveniently mounted on the lid assembly 15b and be easily retrofitted onto existing chambers without costly and time-consuming modifications.
- One suitable unit is the ASTRON® generator available from Applied Science and Technology, Inc. of Woburn,
- the ASTRON® generator utilizes a low-field toroidal plasma to dissociate a process gas.
- the plasma dissociates a process gas including a fluorine-containing gas such as NF 3 and a carrier gas such as argon to generate free fluorine which is used to clean film deposits in the process chamber 15.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Inorganic Chemistry (AREA)
- Formation Of Insulating Films (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80348306P | 2006-05-30 | 2006-05-30 | |
US11/754,440 US7825038B2 (en) | 2006-05-30 | 2007-05-29 | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen |
PCT/US2007/069999 WO2007140424A2 (en) | 2006-05-30 | 2007-05-30 | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2024532A2 true EP2024532A2 (en) | 2009-02-18 |
EP2024532A4 EP2024532A4 (en) | 2014-08-06 |
Family
ID=38779452
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07797890.6A Withdrawn EP2024532A4 (en) | 2006-05-30 | 2007-05-30 | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2024532A4 (en) |
JP (1) | JP2009539268A (en) |
WO (1) | WO2007140424A2 (en) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9257302B1 (en) | 2004-03-25 | 2016-02-09 | Novellus Systems, Inc. | CVD flowable gap fill |
US7498273B2 (en) | 2006-05-30 | 2009-03-03 | Applied Materials, Inc. | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes |
US9245739B2 (en) | 2006-11-01 | 2016-01-26 | Lam Research Corporation | Low-K oxide deposition by hydrolysis and condensation |
US7541297B2 (en) | 2007-10-22 | 2009-06-02 | Applied Materials, Inc. | Method and system for improving dielectric film quality for void free gap fill |
US7964040B2 (en) | 2007-11-08 | 2011-06-21 | Applied Materials, Inc. | Multi-port pumping system for substrate processing chambers |
JP6258569B2 (en) * | 2008-08-04 | 2018-01-10 | ザ、トラスティーズ オブ プリンストン ユニバーシティ | Hybrid dielectric materials for thin film transistors |
JP2010103495A (en) * | 2008-09-29 | 2010-05-06 | Adeka Corp | Semiconductor device, and apparatus and method for manufacturing the same |
US8557712B1 (en) * | 2008-12-15 | 2013-10-15 | Novellus Systems, Inc. | PECVD flowable dielectric gap fill |
US8980382B2 (en) | 2009-12-02 | 2015-03-17 | Applied Materials, Inc. | Oxygen-doping for non-carbon radical-component CVD films |
US8278224B1 (en) | 2009-09-24 | 2012-10-02 | Novellus Systems, Inc. | Flowable oxide deposition using rapid delivery of process gases |
US20110151677A1 (en) * | 2009-12-21 | 2011-06-23 | Applied Materials, Inc. | Wet oxidation process performed on a dielectric material formed from a flowable cvd process |
US9285168B2 (en) | 2010-10-05 | 2016-03-15 | Applied Materials, Inc. | Module for ozone cure and post-cure moisture treatment |
US9719169B2 (en) | 2010-12-20 | 2017-08-01 | Novellus Systems, Inc. | System and apparatus for flowable deposition in semiconductor fabrication |
US20120180954A1 (en) | 2011-01-18 | 2012-07-19 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US10283321B2 (en) | 2011-01-18 | 2019-05-07 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US8466073B2 (en) | 2011-06-03 | 2013-06-18 | Applied Materials, Inc. | Capping layer for reduced outgassing |
WO2012165166A1 (en) * | 2011-06-03 | 2012-12-06 | 株式会社日立国際電気 | Method for manufacturing semiconductor device, substrate processing method, and substrate processing apparatus |
US9404178B2 (en) | 2011-07-15 | 2016-08-02 | Applied Materials, Inc. | Surface treatment and deposition for reduced outgassing |
US8617989B2 (en) | 2011-09-26 | 2013-12-31 | Applied Materials, Inc. | Liner property improvement |
US8551891B2 (en) | 2011-10-04 | 2013-10-08 | Applied Materials, Inc. | Remote plasma burn-in |
US8846536B2 (en) | 2012-03-05 | 2014-09-30 | Novellus Systems, Inc. | Flowable oxide film with tunable wet etch rate |
GB201209693D0 (en) * | 2012-05-31 | 2012-07-18 | Dow Corning | Silicon wafer coated with a passivation layer |
US8889566B2 (en) | 2012-09-11 | 2014-11-18 | Applied Materials, Inc. | Low cost flowable dielectric films |
JP5943888B2 (en) * | 2013-08-28 | 2016-07-05 | 株式会社東芝 | Manufacturing method of semiconductor device |
US9847222B2 (en) | 2013-10-25 | 2017-12-19 | Lam Research Corporation | Treatment for flowable dielectric deposition on substrate surfaces |
US9412581B2 (en) | 2014-07-16 | 2016-08-09 | Applied Materials, Inc. | Low-K dielectric gapfill by flowable deposition |
US10049921B2 (en) | 2014-08-20 | 2018-08-14 | Lam Research Corporation | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor |
US10388546B2 (en) | 2015-11-16 | 2019-08-20 | Lam Research Corporation | Apparatus for UV flowable dielectric |
US9916977B2 (en) | 2015-11-16 | 2018-03-13 | Lam Research Corporation | Low k dielectric deposition via UV driven photopolymerization |
CN108603287B (en) * | 2015-12-21 | 2021-11-02 | 弗萨姆材料美国有限责任公司 | Compositions for depositing silicon-containing films and methods of using the same |
JP6573578B2 (en) * | 2016-05-31 | 2019-09-11 | 株式会社Kokusai Electric | Semiconductor device manufacturing method, substrate processing apparatus, and program |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6141763A (en) * | 1984-04-24 | 1986-02-28 | Anelva Corp | Thin film manufacturing apparatus |
US6383299B1 (en) * | 1997-05-21 | 2002-05-07 | Nec Corporation | Silicon oxide film, method of forming the silicon oxide film, and apparatus for depositing the silicon oxide film |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5314724A (en) * | 1991-01-08 | 1994-05-24 | Fujitsu Limited | Process for forming silicon oxide film |
JPH0982696A (en) * | 1995-09-18 | 1997-03-28 | Toshiba Corp | Manufacture of semiconductor device and semiconductor manufacturing equipment |
JPH09251997A (en) * | 1996-03-18 | 1997-09-22 | Toshiba Corp | Method for forming silicon oxide film |
JPH09260369A (en) * | 1996-03-25 | 1997-10-03 | Toshiba Corp | Forming method of insulating film |
US6114216A (en) * | 1996-11-13 | 2000-09-05 | Applied Materials, Inc. | Methods for shallow trench isolation |
US5873781A (en) * | 1996-11-14 | 1999-02-23 | Bally Gaming International, Inc. | Gaming machine having truly random results |
US6413583B1 (en) * | 1998-02-11 | 2002-07-02 | Applied Materials, Inc. | Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound |
US20010052323A1 (en) * | 1999-02-17 | 2001-12-20 | Ellie Yieh | Method and apparatus for forming material layers from atomic gasses |
JP3245136B2 (en) * | 1999-09-01 | 2002-01-07 | キヤノン販売株式会社 | Method of improving film quality of insulating film |
US7080528B2 (en) * | 2002-10-23 | 2006-07-25 | Applied Materials, Inc. | Method of forming a phosphorus doped optical core using a PECVD process |
-
2007
- 2007-05-30 EP EP07797890.6A patent/EP2024532A4/en not_active Withdrawn
- 2007-05-30 JP JP2009513437A patent/JP2009539268A/en active Pending
- 2007-05-30 WO PCT/US2007/069999 patent/WO2007140424A2/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6141763A (en) * | 1984-04-24 | 1986-02-28 | Anelva Corp | Thin film manufacturing apparatus |
US6383299B1 (en) * | 1997-05-21 | 2002-05-07 | Nec Corporation | Silicon oxide film, method of forming the silicon oxide film, and apparatus for depositing the silicon oxide film |
Non-Patent Citations (1)
Title |
---|
See also references of WO2007140424A2 * |
Also Published As
Publication number | Publication date |
---|---|
EP2024532A4 (en) | 2014-08-06 |
JP2009539268A (en) | 2009-11-12 |
WO2007140424A3 (en) | 2008-02-21 |
WO2007140424A2 (en) | 2007-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7825038B2 (en) | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen | |
US7902080B2 (en) | Deposition-plasma cure cycle process to enhance film quality of silicon dioxide | |
WO2007140424A2 (en) | Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen | |
KR101115750B1 (en) | A novel deposition-plasma cure cycle process to enhance film quality of silicon dioxide | |
KR101161074B1 (en) | Methods for forming a silicon oxide layer over a substrate | |
US7825044B2 (en) | Curing methods for silicon dioxide multi-layers | |
US7498273B2 (en) | Formation of high quality dielectric films of silicon dioxide for STI: usage of different siloxane-based precursors for harp II—remote plasma enhanced deposition processes | |
US20110151676A1 (en) | Methods of thin film process | |
US20110217851A1 (en) | Conformal layers by radical-component cvd | |
KR20140050059A (en) | Surface treatment and deposition for reduced outgassing | |
US20100022067A1 (en) | Deposition methods for releasing stress buildup |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20070925 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK RS |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20140709 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/316 20060101ALI20140703BHEP Ipc: C23C 16/40 20060101AFI20140703BHEP Ipc: C23C 16/452 20060101ALI20140703BHEP Ipc: C23C 16/56 20060101ALI20140703BHEP Ipc: H01L 21/02 20060101ALI20140703BHEP Ipc: H01L 21/3105 20060101ALI20140703BHEP |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20141202 |