EP2005471A1 - Stand, in particular for power electronic component, power module comprising such a stand, assembly comprising the module and electrical member controlled by said module - Google Patents

Stand, in particular for power electronic component, power module comprising such a stand, assembly comprising the module and electrical member controlled by said module

Info

Publication number
EP2005471A1
EP2005471A1 EP07731857A EP07731857A EP2005471A1 EP 2005471 A1 EP2005471 A1 EP 2005471A1 EP 07731857 A EP07731857 A EP 07731857A EP 07731857 A EP07731857 A EP 07731857A EP 2005471 A1 EP2005471 A1 EP 2005471A1
Authority
EP
European Patent Office
Prior art keywords
support
layer
mass
heat
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07731857A
Other languages
German (de)
French (fr)
Inventor
Jean-Michel Morelle
Laurent Vivet
Blaise Rouleau
Mathieu Medina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Comfort and Driving Assistance SAS
Original Assignee
Valeo Etudes Electroniques SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Etudes Electroniques SAS filed Critical Valeo Etudes Electroniques SAS
Publication of EP2005471A1 publication Critical patent/EP2005471A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • Support in particular for electronic power component, power module comprising this support, together comprising the module and electrical device controlled by this module.
  • the present invention relates to a support for an element capable of generating heat, in particular for an electronic power component, a power module comprising such a support, and an assembly comprising the power module and an electrical component controlled by this module.
  • a power module forming a control device of an electrical component of a motor vehicle such as for example an alternator, a motor, etc.
  • the support of the power module is intended to be attached to a heat dissipation mass.
  • the heat dissipation mass is a radiator, for example aluminum or copper, so that the support must electrically isolate the conductive track from the heat dissipation mass, while ensuring a conduction of heat towards this mass of dissipation.
  • an element support capable of releasing heat, in particular for electronic power component, intended to be attached to a heat dissipation mass and being of the type comprising a plate electrical insulation and a heat conduction plate to the heat dissipation mass, contiguous with the electrical insulation plate.
  • a support is described, for example, in WO-A-2004/006423.
  • this document describes a power module comprising a support carrying an electronic power component. More specifically, the heat conduction plate is made of a thermally conductive metal material and is intended in particular to stiffen the support.
  • the support is attached by screwing on a conventional cooling radiator forming the dissipation mass.
  • This document proposes to optimize the contact surfaces of the metal plate with the radiator, by slightly conveying the face of the metal plate in contact with the radiator.
  • the surface of a radiator is relatively flat and even so that the curved side deforms and is plated on the radiator when screwing the support on the radiator and ensuring good contact between the radiator and the support.
  • the surface irregularities of the dissipation mass may pierce the conduction plate and tear the electrical insulation plate.
  • the object of the invention is in particular to provide a reduced space support, which can be attached to a relatively irregular surface of a heat dissipation mass, while guaranteeing relatively good electrical insulation of the support and relatively good transfer of the heat by the support towards the mass of dissipation.
  • the subject of the invention is a support carrying at least one element capable of creating heat, a support of the aforementioned type, characterized in that the heat conduction plate comprises a junction layer with the mass of heat dissipation said lower layer and a stiffening layer of the so-called intermediate layer heat conduction plate, the intermediate layer being made of a material of hardness greater than that of the lower layer.
  • the heat conduction plate is made with at least one relatively hard intermediate layer interposed between the insulation plate and the dissipation mass, the insulation plate is not likely to be torn by irregularities. the surface of the dissipation mass.
  • the lower layer is made of a relatively ductile material, the contact surfaces of the conduction plate and the dissipation mass are optimal.
  • the lower and middle layers may be relatively thin. As a result, the support has a small footprint.
  • Such a support makes it possible to guarantee a relatively good conduction of the heat towards the dissipation mass and a relatively good electrical insulation.
  • a support according to the invention may further comprise one or more of the following features: -
  • the heat conduction plate comprises a junction layer with the electrical insulation plate, said upper layer, the upper layer being made of a material having thermal expansion properties similar to that of the lower layer; the upper layer is made of a material identical to that of the lower layer;
  • the lower layer essentially comprises copper; a seal forming mass intended to be interposed between the lower layer and the heat dissipation mass;
  • the seal-forming mass comprises a material chosen from a glass cloth impregnated with an epoxy resin, a thermoplastic resin with a phase change, a thermoconductive glue comprising glass beads and a double-sided adhesive tape;
  • the electrical insulation plate comprises a material chosen from a glass cloth impregnated with an epoxy resin, a thermoplastic resin with a phase change, a thermoconductive glue comprising glass beads and a double-sided adhesive tape; the intermediate layer essentially comprises nickel.
  • the invention also relates to a power module of the type comprising an electrically conductive track, on which is reported an electronic power component carried by a support, characterized in that the support is according to the invention, the conductive track being in contact with the insulation plate.
  • the invention also relates to an assembly comprising an electrical member provided with a body and a power module forming an electrical device for controlling the electrical member, characterized in that the module is according to the invention and the body of the electrical member forms the mass of heat dissipation on which the support is reported.
  • FIG. 1 shows a set designated by the general reference 10.
  • the assembly 10 comprises an electrical member 12, in particular of a motor vehicle, such as, for example, an alternator, a motor, etc.
  • the electrical member 12 is provided with a body 14.
  • the body 14 has surface irregularities on a zone Z1, such as, for example, peaks 16, recesses 18 or loose particles. of the body 14.
  • the assembly 10 further comprises a power module 22. More particularly, the power module 22 forms a device for controlling the electric member 12.
  • the power module 22 comprises a power electronic component 24, semiconductor chip type.
  • the power module 22 further comprises an electrically conductive track 26 on which the component 24 is attached.
  • the conductive track 26 is made of a metallic material comprising, for example, copper and may optionally comprise a coating (not shown) made of a metallic material. comprising nickel.
  • FIG. 1 shows that a solder mass 28 is interposed between the component 24 and the conductive track 26.
  • the solder mass 28 may optionally be formed by the coating of the conductive track 26.
  • the part made of synthetic material PS is overmolded on the track 26.
  • the power module 10 further comprises a support 30 carrying the track 26 and the part made of synthetic material PS.
  • the electrically conductive track 26 extends on a first face F1 of the support 30.
  • the power component 24 requires, in a manner known per se, a supply of strong currents, the track 26 is traversed by a current of high intensity and therefore is likely to generate heat, particularly in the support 30, but also in the part made of synthetic material PS. Moreover, the component 24 is also likely to generate heat. Since solder mass 28 forms an electrical and thermal joint between the component 24 and the track 26, the heat released by the component 24 is transmitted essentially to the track 26.
  • the support 30 is attached to the body 14 of the electrical member 12, the body 14 then forming a mass of heat dissipation.
  • a zone Z2 of a second face F2 of the support 30, opposite the first face F1 is in contact with the zone Z1 of the body 14 of the electrical member 12.
  • the support 30 of the module 22 is, in the example illustrated, assembled on the body 14 by means of screws 32.
  • screw holes 34 have been formed in the part made of synthetic material PS and the support 30, these screw holes 34 extending into the body 14 of the electric member 12.
  • the support 30 comprises an electrical insulation plate 36.
  • the electrical insulation plate 36 comprises a material selected from a glass cloth impregnated with an epoxy glass resin, a thermoplastic change-over resin, a heat-conducting glue comprising glass beads and a double-sided adhesive tape. face.
  • the support 30 also comprises a plate 38 for conduction of heat towards the dissipation mass 14, joined to the electrical insulating plate 36.
  • the heat conduction plate 38 comprises a layer 40 of junction with the body 14 of the electrical member 12, said lower layer and a stiffening layer 42 of the conduction plate 38, said intermediate layer.
  • the intermediate layer 42 is made of a material having a hardness greater than that of the material of the lower layer 40.
  • the lower layer 40 essentially comprises copper and the intermediate layer 42 essentially comprises nickel.
  • the lower layer 40 has a thickness of between 0.5 mm and 1 mm.
  • the intermediate layer 42 has a thickness of between 0.25 mm and 0.5 mm.
  • the heat conduction plate 38 also comprises a layer 44 of junction with the electrical insulation plate 36, said upper layer.
  • the upper layer 44 is made of a material having thermal expansion properties similar to that of the lower layer 40.
  • the three layers 40, 42, 44 are assembled together, for example, by bonding. Because the intermediate layer 42 is interposed between two layers 40, 44 made of materials having similar thermal expansion properties, the relative deformations of the layers together under the effect of thermal variations are limited.
  • the upper layer 44 has a thickness substantially identical to that of the lower layer 40.
  • the conduction plate 38 then has a thickness of between 1.25 mm and 2.5 mm.
  • the upper layer 44 is made of a material identical to that of the lower layer 40.
  • the support 30 also comprises a mass 46 forming a seal intended to be interposed between the lower layer 40 and the dissipation mass of the heat 14.
  • the seal-forming mass 46 comprises a material selected, for example, from a glass cloth impregnated with an epoxy glass resin, a thermoplastic change-over resin, a heat-conducting glue comprising glass beads and an adhesive tape double sided.
  • the seal forming mass 46 has, before assembly of the module 22 on the body 14 of the electrical member 12, as illustrated in Figure 2, a general form of plate.
  • the electrical insulation plate 36 is delimited on the one hand by the first face F1 of the support 30 in contact with the conductive track 26 and on the other hand by an internal face F1 'in contact with the heat conduction plate 38 Furthermore, it can be seen in FIG. 2 that the seal-forming mass 46 is delimited on the one hand by the second face F2 of the support 30 intended to be in contact with the body 14 of the electric member 12 and a face F2 ' internal contact with the heat conduction plate 38.
  • the heat conduction plate 38 being interposed between the electrical insulation plate 36 and the seal forming mass 46, is then delimited on the one hand by the internal face F1 'of the insulation plate 36 and on the other hand part through the inner face F2 'of the joint forming mass 46.
  • the intermediate layer 42 of the relatively hard conduction plate 38 the electrical insulation plate 36 is protected from the surface irregularities of the body 14 of the electrical member 12.
  • the electronic power component 24 and the conductive track 26 are effectively electrically isolated from the body 14 of the electrical member 12 by the electrical insulation plate 36 protected from any risk of drilling by the intermediate layer 42.
  • the lower layer 40, in contact with the body 14 of the electrical member 12, is relatively ductile, the conduction plate 24 can be deformed and adapt to the surface irregularities of the body 26 of the member, as is apparent from the figures .
  • the second face F2 of the support 30 Before assembly of the module 22 on the body 14, the second face F2 of the support 30 is relatively smooth (see Figure 2), whereas after mounting the module 22 on the body 14, the second face F2 is deformed by the surface irregularities of the body 14 (see Figure 1).
  • the surface of the zones Z1 and Z2 in contact with the support 30 and the body 14 of the electrical member 12 is then optimal.
  • the heat conduction plate 38 allows efficient transfer of heat from the electrically conductive track 26 to the body 14 of the electrical member 12.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention concerns a stand (30) designed to be directly mounted on a heat dissipating mass (14). The stand (30) comprises an electrically insulating plate (36) and a plate (38) conducting heat towards the heat dissipating mass (14). In particular, the heat conducting plate (38) is adjacent the electrically insulating plate (36). The heat insulating plate (38) comprises a layer (40) adjoining the heat dissipating mass (14), or lower layer, and a layer for stiffening the heat conducting plate (38), or intermediate layer. More particularly, the stiffening layer (42) is made of a material having a hardness higher than that of the material of the lower layer (40).

Description

Support, notamment pour composant électronique de puissance, module de puissance comprenant ce support, ensemble comprenant le module et organe électrique piloté par ce module. Support, in particular for electronic power component, power module comprising this support, together comprising the module and electrical device controlled by this module.
La présente invention concerne un support pour élément susceptible de dégager de la chaleur, notamment pour composant électronique de puissance, un module de puissance comprenant un tel support, et un ensemble comprenant le module de puissance et un organe électrique piloté par ce module.The present invention relates to a support for an element capable of generating heat, in particular for an electronic power component, a power module comprising such a support, and an assembly comprising the power module and an electrical component controlled by this module.
Elle s'applique plus particulièrement à un module de puissance formant dispositif de pilotage d'un organe électrique d'un véhicule automobile, tel que par exemple un alternateur, un moteur, etc.It applies more particularly to a power module forming a control device of an electrical component of a motor vehicle, such as for example an alternator, a motor, etc.
De façon classique, afin d'évacuer la chaleur dégagée par le composant électronique de puissance, le support du module de puissance est destiné à être rapporté sur une masse de dissipation de la chaleur. En général, la masse de dissipation de la chaleur est un radiateur, par exemple en aluminium ou en cuivre, de sorte que le support doit isoler électriquement la piste conductrice de la masse de dissipation de la chaleur, tout en assurant une conduction de la chaleur vers cette masse de dissipation.Conventionally, in order to evacuate the heat generated by the electronic power component, the support of the power module is intended to be attached to a heat dissipation mass. In general, the heat dissipation mass is a radiator, for example aluminum or copper, so that the support must electrically isolate the conductive track from the heat dissipation mass, while ensuring a conduction of heat towards this mass of dissipation.
Ainsi, on a proposé dans l'état de la technique, un support pour élément susceptible de dégager de la chaleur, notamment pour composant électronique de puissance, destiné à être rapporté sur une masse de dissipation de la chaleur et étant du type comprenant une plaque d'isolation électrique et une plaque de conduction de la chaleur vers la masse de dissipation de la chaleur, jointive avec la plaque d'isolation électrique. Un tel support est décrit, par exemple, dans WO-A-2004/006423.Thus, it has been proposed in the state of the art, an element support capable of releasing heat, in particular for electronic power component, intended to be attached to a heat dissipation mass and being of the type comprising a plate electrical insulation and a heat conduction plate to the heat dissipation mass, contiguous with the electrical insulation plate. Such a support is described, for example, in WO-A-2004/006423.
Ainsi, ce document décrit un module de puissance comprenant un support portant un composant électronique de puissance. Plus précisément, la plaque de conduction de la chaleur est réalisée dans un matériau métallique thermo-conducteur et est destinée notamment à rigidifier le support. Le support est rapporté par vissage sur un radiateur de refroidissement classique formant la masse de dissipation.Thus, this document describes a power module comprising a support carrying an electronic power component. More specifically, the heat conduction plate is made of a thermally conductive metal material and is intended in particular to stiffen the support. The support is attached by screwing on a conventional cooling radiator forming the dissipation mass.
Ce document propose d'optimiser les surfaces de contact de la plaque métallique avec le radiateur, en bombant légèrement la face de la plaque métallique en contact avec le radiateur. Habituellement, la surface d'un radiateur est relativement plane et régulière de sorte que la face bombée se déforme et se plaque sur le radiateur lors du vissage du support sur le radiateur et en assurant un bon contact entre le radiateur et le support. Toutefois, on souhaite pouvoir rapporter le support sur une masse de dissipation de la chaleur comportant des irrégularités de surface, telles que des pics, des particules, des creux, etc, relativement marquées, ce qui incité à réaliser la plaque métallique dans un matériau relativement ductile, tel que du cuivre, comme le suggère le documentThis document proposes to optimize the contact surfaces of the metal plate with the radiator, by slightly conveying the face of the metal plate in contact with the radiator. Usually, the surface of a radiator is relatively flat and even so that the curved side deforms and is plated on the radiator when screwing the support on the radiator and ensuring good contact between the radiator and the support. However, it is desired to report the support on a heat dissipation mass comprising surface irregularities, such as peaks, particles, troughs, etc., which are relatively marked, which makes it possible to produce the metal plate in relatively ductile, such as copper, as the document suggests
Or, en réalisant la plaque métallique dans un matériau ductile, les irrégularités de surface de la masse de dissipation risquent de percer la plaque de conduction et de déchirer la plaque d'isolation électrique.However, by producing the metal plate in a ductile material, the surface irregularities of the dissipation mass may pierce the conduction plate and tear the electrical insulation plate.
Par conséquent, afin de protéger la plaque d'isolation électrique, il est nécessaire dans ce cas, de prévoir une plaque de conduction relativement épaisse, ceci ayant pour effet d'augmenter l'encombrement du support et donc du module de puissance.Therefore, in order to protect the electrical insulation plate, it is necessary in this case, to provide a relatively thick conduction plate, this having the effect of increasing the size of the support and therefore the power module.
L'invention a notamment pour but de proposer un support d'encombrement réduit, pouvant être rapporté sur une surface relativement irrégulière d'une masse de dissipation de la chaleur, tout en garantissant une relativement bonne isolation électrique du support et un relativement bon transfert de la chaleur par le support vers la masse de dissipation.The object of the invention is in particular to provide a reduced space support, which can be attached to a relatively irregular surface of a heat dissipation mass, while guaranteeing relatively good electrical insulation of the support and relatively good transfer of the heat by the support towards the mass of dissipation.
A cet effet, l'invention a pour objet un support portant au moins un élément susceptible de créer de la chaleur, un support du type précité, caractérisé en ce que la plaque de conduction de la chaleur comprend une couche de jonction avec la masse de dissipation de la chaleur dite couche inférieure et une couche de rigidification de la plaque de conduction de la chaleur dite couche intermédiaire, la couche intermédiaire étant réalisée dans un matériau de dureté supérieure à celle de la couche inférieure.For this purpose, the subject of the invention is a support carrying at least one element capable of creating heat, a support of the aforementioned type, characterized in that the heat conduction plate comprises a junction layer with the mass of heat dissipation said lower layer and a stiffening layer of the so-called intermediate layer heat conduction plate, the intermediate layer being made of a material of hardness greater than that of the lower layer.
Ainsi, du fait que la plaque de conduction de la chaleur est réalisée avec au moins une couche intermédiaire relativement dure intercalée entre la plaque d'isolation et la masse de dissipation, la plaque d'isolation ne risque pas d'être déchirée par des irrégularités de surface de la masse de dissipation.Thus, because the heat conduction plate is made with at least one relatively hard intermediate layer interposed between the insulation plate and the dissipation mass, the insulation plate is not likely to be torn by irregularities. the surface of the dissipation mass.
Par ailleurs, du fait que la couche inférieure est réalisée dans un matériau relativement ductile, les surfaces de contact de la plaque de conduction et de la masse de dissipation sont optimales. Les couches inférieure et intermédiaire peuvent être relativement peu épaisses. De ce fait, le support a un encombrement réduit.Furthermore, because the lower layer is made of a relatively ductile material, the contact surfaces of the conduction plate and the dissipation mass are optimal. The lower and middle layers may be relatively thin. As a result, the support has a small footprint.
Un tel support permet de garantir une relativement bonne conduction de la chaleur vers la masse de dissipation et une relativement bonne isolation électrique.Such a support makes it possible to guarantee a relatively good conduction of the heat towards the dissipation mass and a relatively good electrical insulation.
Un support selon l'invention peut en outre comporter l'une ou plusieurs des caractéristiques suivantes : - la plaque de conduction de la chaleur comprend une couche de jonction avec la plaque d'isolation électrique, dite couche supérieure, cette couche supérieure étant réalisée dans un matériau ayant des propriétés de dilatation thermique similaires à celui de la couche inférieure ; - la couche supérieure est réalisée dans un matériau identique à celui de la couche inférieure ;A support according to the invention may further comprise one or more of the following features: - The heat conduction plate comprises a junction layer with the electrical insulation plate, said upper layer, the upper layer being made of a material having thermal expansion properties similar to that of the lower layer; the upper layer is made of a material identical to that of the lower layer;
- la couche supérieure a une épaisseur sensiblement identique à celle de la couche inférieure ;the upper layer has a thickness substantially identical to that of the lower layer;
- la couche inférieure comprend essentiellement du cuivre ; - une masse formant joint destinée à être intercalée entre la couche inférieure et la masse de dissipation de la chaleur ;the lower layer essentially comprises copper; a seal forming mass intended to be interposed between the lower layer and the heat dissipation mass;
- la masse formant joint comprend un matériau choisi parmi un tissu de verre imprégné d'une résine époxy, une résine thermoplastique à changement de phase, une colle thermoconductrice comprenant des billes de verre et un ruban adhésif double face ;the seal-forming mass comprises a material chosen from a glass cloth impregnated with an epoxy resin, a thermoplastic resin with a phase change, a thermoconductive glue comprising glass beads and a double-sided adhesive tape;
- la plaque d'isolation électrique comprend un matériau choisi parmi un tissu de verre imprégné d'une résine époxy, une résine thermoplastique à changement de phase, une colle thermoconductrice comprenant des billes de verre et un ruban adhésif double face ; - la couche intermédiaire comprend essentiellement du nickel.the electrical insulation plate comprises a material chosen from a glass cloth impregnated with an epoxy resin, a thermoplastic resin with a phase change, a thermoconductive glue comprising glass beads and a double-sided adhesive tape; the intermediate layer essentially comprises nickel.
L'invention a encore pour objet un module de puissance du type comprenant une piste conductrice électriquement, sur laquelle est rapporté un composant électronique de puissance, portée par un support, caractérisé en ce que le support est selon l'invention, la piste conductrice étant en contact avec la plaque d'isolation. L'invention a encore pour objet un ensemble comprenant un organe électrique muni d'un corps et un module de puissance formant un dispositif électrique de pilotage de l'organe électrique, caractérisé en ce que le module est selon l'invention et le corps de l'organe électrique forme la masse de dissipation de la chaleur sur laquelle est rapporté le support. L'invention sera mieux comprise à la lecture de la description qui va suivre, donnée uniquement à titre d'exemple et faite en se référant aux dessins dans lesquels : la figure 1 est une vue en coupe d'un ensemble comprenant un organe électrique et un module de puissance pilotant cet organe selon l'invention ; la figure 2 est une vue en coupe du module de puissance de la figure 1 avant montage de ce module sur l'organe électrique. -A-The invention also relates to a power module of the type comprising an electrically conductive track, on which is reported an electronic power component carried by a support, characterized in that the support is according to the invention, the conductive track being in contact with the insulation plate. The invention also relates to an assembly comprising an electrical member provided with a body and a power module forming an electrical device for controlling the electrical member, characterized in that the module is according to the invention and the body of the electrical member forms the mass of heat dissipation on which the support is reported. The invention will be better understood on reading the description which follows, given solely by way of example and with reference to the drawings in which: FIG. 1 is a sectional view of an assembly comprising an electrical member and a power module driving this member according to the invention; Figure 2 is a sectional view of the power module of Figure 1 before mounting this module on the electrical member. -AT-
On a représenté sur la figure 1 , un ensemble désigné par la référence générale 10.FIG. 1 shows a set designated by the general reference 10.
L'ensemble 10 comprend un organe électrique 12, notamment de véhicule automobile, tel que par exemple, un alternateur, un moteur, etc. L'organe électrique 12 est muni d'un corps 14. Dans l'exemple illustré, le corps 14 présente des irrégularités de surface sur une zone Z1 , telles que, par exemple des pics 16, des creux 18 ou encore des particules 20 détachées du corps 14.The assembly 10 comprises an electrical member 12, in particular of a motor vehicle, such as, for example, an alternator, a motor, etc. The electrical member 12 is provided with a body 14. In the example shown, the body 14 has surface irregularities on a zone Z1, such as, for example, peaks 16, recesses 18 or loose particles. of the body 14.
L'ensemble 10 comprend encore un module de puissance 22. Plus particulièrement, le module de puissance 22 forme un dispositif de pilotage de l'organe électrique 12.The assembly 10 further comprises a power module 22. More particularly, the power module 22 forms a device for controlling the electric member 12.
Le module de puissance 22 comprend un composant électronique de puissance 24, de type pastille semi-conductrice.The power module 22 comprises a power electronic component 24, semiconductor chip type.
Le module de puissance 22 comprend encore une piste 26 électriquement conductrice sur laquelle est rapporté le composant 24. La piste conductrice 26 est réalisée dans un matériau métallique comprenant par exemple du cuivre et peut éventuellement comporter un revêtement (non représenté) métallique réalisé dans un matériau comprenant du nickel.The power module 22 further comprises an electrically conductive track 26 on which the component 24 is attached. The conductive track 26 is made of a metallic material comprising, for example, copper and may optionally comprise a coating (not shown) made of a metallic material. comprising nickel.
Dans l'exemple décrit, le composant 24 est soudé sur la piste conductrice 26 avec apport de matière. A cet effet, on voit sur la figure 1 qu'une masse de brasure 28 est intercalée entre le composant 24 et la piste conductrice 26.In the example described, the component 24 is welded to the conductive track 26 with material supply. For this purpose, FIG. 1 shows that a solder mass 28 is interposed between the component 24 and the conductive track 26.
La masse de brasure 28 peut éventuellement être formée par le revêtement de la piste conductrice 26.The solder mass 28 may optionally be formed by the coating of the conductive track 26.
Dans l'exemple illustré sur la figure 1 , on voit que la piste 26 est bordée par une partie en matériau synthétique PS. Cette partie en matériau synthétique PS forme une masse de cohésion de la piste 26 avec d'autres pistes électriquement conductricesIn the example illustrated in Figure 1, we see that the track 26 is bordered by a portion of synthetic material PS. This synthetic material part PS forms a cohesion mass of the track 26 with other electrically conductive tracks
(non représentées). Dans cet exemple, la partie en matériau synthétique PS est surmoulée sur la piste 26.(not shown) In this example, the part made of synthetic material PS is overmolded on the track 26.
Le module de puissance 10 comporte encore un support 30 portant la piste 26 et la partie en matériau synthétique PS. Dans l'exemple décrit, la piste électriquement conductrice 26 s'étend sur une première face F1 du support 30.The power module 10 further comprises a support 30 carrying the track 26 and the part made of synthetic material PS. In the example described, the electrically conductive track 26 extends on a first face F1 of the support 30.
Comme le composant de puissance 24 requiert, de façon connue en soi, une alimentation en courants forts, la piste 26 est parcourue par un courant d'intensité élevée et de ce fait, est susceptible de dégager de la chaleur notamment dans le support 30 mais également dans la partie en matériau synthétique PS. Par ailleurs, le composant 24 est également susceptible de dégager de la chaleur. Comme la masse de brasure 28 forme un joint électrique et thermique entre le composant 24 et la piste 26, la chaleur dégagée par le composant 24 est transmise essentiellement vers la piste 26.Since the power component 24 requires, in a manner known per se, a supply of strong currents, the track 26 is traversed by a current of high intensity and therefore is likely to generate heat, particularly in the support 30, but also in the part made of synthetic material PS. Moreover, the component 24 is also likely to generate heat. Since solder mass 28 forms an electrical and thermal joint between the component 24 and the track 26, the heat released by the component 24 is transmitted essentially to the track 26.
Afin d'évacuer la chaleur dégagée par la piste 26 et le composant 24, le support 30 est rapporté sur le corps 14 de l'organe électrique 12, ce corps 14 formant alors une masse de dissipation de la chaleur.In order to evacuate the heat generated by the track 26 and the component 24, the support 30 is attached to the body 14 of the electrical member 12, the body 14 then forming a mass of heat dissipation.
Ainsi, une zone Z2 d'une deuxième face F2 du support 30, opposée à la première face F1 , est en contact avec la zone Z1 du corps 14 de l'organe électrique 12.Thus, a zone Z2 of a second face F2 of the support 30, opposite the first face F1, is in contact with the zone Z1 of the body 14 of the electrical member 12.
Le support 30 du module 22 est, dans l'exemple illustré, assemblé sur le corps 14 au moyen de vis 32. A cet effet, des trous de vissage 34 ont été ménagés dans la partie en matériau synthétique PS et le support 30, ces trous de vissages 34 se prolongeant dans le corps 14 de l'organe électrique 12.The support 30 of the module 22 is, in the example illustrated, assembled on the body 14 by means of screws 32. For this purpose, screw holes 34 have been formed in the part made of synthetic material PS and the support 30, these screw holes 34 extending into the body 14 of the electric member 12.
Afin d'isoler électriquement la piste 26 et le composant 24, le support 30 comprend une plaque d'isolation électrique 36.In order to electrically isolate the track 26 and the component 24, the support 30 comprises an electrical insulation plate 36.
De préférence, la plaque d'isolation électrique 36 comprend un matériau choisi parmi un tissu de verre imprégné d'une résine de verre époxy, une résine thermoplastique à changement de face, une colle thermoconductrice comprenant des billes de verre et un ruban adhésif double-face.Preferably, the electrical insulation plate 36 comprises a material selected from a glass cloth impregnated with an epoxy glass resin, a thermoplastic change-over resin, a heat-conducting glue comprising glass beads and a double-sided adhesive tape. face.
Le support 30 comprend également une plaque 38 de conduction de la chaleur vers la masse de dissipation 14, jointive avec la plaque d'isolation électrique 36. Conformément à l'invention, la plaque de conduction de la chaleur 38 comprend une couche 40 de jonction avec le corps 14 de l'organe électrique 12, dite couche inférieure et une couche 42 de rigidification de la plaque de conduction 38, dite couche intermédiaire.The support 30 also comprises a plate 38 for conduction of heat towards the dissipation mass 14, joined to the electrical insulating plate 36. According to the invention, the heat conduction plate 38 comprises a layer 40 of junction with the body 14 of the electrical member 12, said lower layer and a stiffening layer 42 of the conduction plate 38, said intermediate layer.
Plus précisément, la couche intermédiaire 42 est réalisée dans un matériau ayant une dureté supérieure à celle du matériau de la couche inférieure 40.More specifically, the intermediate layer 42 is made of a material having a hardness greater than that of the material of the lower layer 40.
De préférence, la couche inférieure 40 comprend essentiellement du cuivre et Ia couche intermédiaire 42 comprend essentiellement du nickel.Preferably, the lower layer 40 essentially comprises copper and the intermediate layer 42 essentially comprises nickel.
Par exemple, la couche inférieure 40 a une épaisseur comprise entre 0,5 mm et 1 mm. La couche intermédiaire 42 a une épaisseur comprise entre 0,25 mm et 0,5mm. De préférence, la plaque de conduction de la chaleur 38 comprend également une couche 44 de jonction avec la plaque d'isolation électrique 36, dite couche supérieure.For example, the lower layer 40 has a thickness of between 0.5 mm and 1 mm. The intermediate layer 42 has a thickness of between 0.25 mm and 0.5 mm. Preferably, the heat conduction plate 38 also comprises a layer 44 of junction with the electrical insulation plate 36, said upper layer.
Avantageusement, la couche supérieure 44 est réalisée dans un matériau ayant des propriétés de dilatation thermique similaires à celui de la couche inférieure 40. Les trois couches 40, 42, 44 sont assemblées entre elles, par exemple, par colaminage. Du fait que la couche intermédiaire 42 est intercalée entre deux couches 40, 44 réalisées dans des matériaux ayant des propriétés de dilation thermique similaires, les déformations relatives des couches entre elles sous l'effet de variations thermiques sont limitées. De préférence, la couche supérieure 44 a une épaisseur sensiblement identique à celle de la couche inférieure 40.Advantageously, the upper layer 44 is made of a material having thermal expansion properties similar to that of the lower layer 40. The three layers 40, 42, 44 are assembled together, for example, by bonding. Because the intermediate layer 42 is interposed between two layers 40, 44 made of materials having similar thermal expansion properties, the relative deformations of the layers together under the effect of thermal variations are limited. Preferably, the upper layer 44 has a thickness substantially identical to that of the lower layer 40.
La plaque de conduction 38 a alors une épaisseur comprise entre 1 ,25 mm et 2,5mm.The conduction plate 38 then has a thickness of between 1.25 mm and 2.5 mm.
Dans l'exemple décrit, la couche supérieure 44 est réalisée dans un matériau identique à celui de la couche inférieure 40.In the example described, the upper layer 44 is made of a material identical to that of the lower layer 40.
De façon optionnelle, afin d'optimiser la surface des zones en contact Z1 du corps 14 et Z2 du support 30, le support 30 comprend encore une masse 46 formant joint destinée à être intercalée entre la couche inférieure 40 et la masse de dissipation de la chaleur 14. La masse formant joint 46 comprend un matériau choisi, par exemple, parmi un tissu de verre imprégné d'une résine de verre époxy, une résine thermoplastique à changement de face, une colle thermoconductrice comprenant des billes de verre et un ruban adhésif double-face.Optionally, in order to optimize the area of the zones in contact Z1 of the body 14 and Z2 of the support 30, the support 30 also comprises a mass 46 forming a seal intended to be interposed between the lower layer 40 and the dissipation mass of the heat 14. The seal-forming mass 46 comprises a material selected, for example, from a glass cloth impregnated with an epoxy glass resin, a thermoplastic change-over resin, a heat-conducting glue comprising glass beads and an adhesive tape double sided.
Eventuellement, la masse formant joint 46 a, avant montage du module 22 sur le corps 14 de l'organe électrique 12, comme illustré sur la figure 2, une forme générale de plaque.Optionally, the seal forming mass 46 has, before assembly of the module 22 on the body 14 of the electrical member 12, as illustrated in Figure 2, a general form of plate.
La plaque d'isolation électrique 36 est délimitée d'une part par la première face F1 du support 30 en contact avec la piste conductrice 26 et d'autre part par une face F1' interne en contact avec la plaque de conduction de la chaleur 38. Par ailleurs, on voit sur la figure 2 que la masse formant joint 46 est délimitée d'une part par la deuxième face F2 du support 30 destinée à être en contact avec le corps 14 de l'organe électrique 12 et une face F2' interne en contact avec la plaque de conduction de la chaleur 38.The electrical insulation plate 36 is delimited on the one hand by the first face F1 of the support 30 in contact with the conductive track 26 and on the other hand by an internal face F1 'in contact with the heat conduction plate 38 Furthermore, it can be seen in FIG. 2 that the seal-forming mass 46 is delimited on the one hand by the second face F2 of the support 30 intended to be in contact with the body 14 of the electric member 12 and a face F2 ' internal contact with the heat conduction plate 38.
La plaque de conduction de la chaleur 38, étant intercalée entre la plaque d'isolation électrique 36 et la masse formant joint 46, est alors délimitée d'une part par la face interne F1 ' de la plaque d'isolation 36 et d'autre part par la face interne F2' de la masse formant joint 46.The heat conduction plate 38, being interposed between the electrical insulation plate 36 and the seal forming mass 46, is then delimited on the one hand by the internal face F1 'of the insulation plate 36 and on the other hand part through the inner face F2 'of the joint forming mass 46.
Parmi les avantages de l'invention on notera les suivants. Grâce à la couche intermédiaire 42 de la plaque de conduction 38, relativement dure, la plaque d'isolation électrique 36 est protégée des irrégularités de surface du corps 14 de l'organe électrique 12. Ainsi, le composant électronique de puissance 24 et la piste conductrice 26 sont efficacement isolés électriquement du corps 14 de l'organe électrique 12 par la plaque d'isolation électrique 36 protégée de tout risque de perçage par la couche intermédiaire 42. Du fait que la couche inférieure 40, en contact avec le corps 14 de l'organe électrique 12, est relativement ductile, la plaque de conduction 24 peut se déformer et s'adapter aux irrégularités de surface du corps 26 de l'organe, comme cela ressort des figures.Among the advantages of the invention will be noted the following. Thanks to the intermediate layer 42 of the relatively hard conduction plate 38, the electrical insulation plate 36 is protected from the surface irregularities of the body 14 of the electrical member 12. Thus, the electronic power component 24 and the conductive track 26 are effectively electrically isolated from the body 14 of the electrical member 12 by the electrical insulation plate 36 protected from any risk of drilling by the intermediate layer 42. Because the lower layer 40, in contact with the body 14 of the electrical member 12, is relatively ductile, the conduction plate 24 can be deformed and adapt to the surface irregularities of the body 26 of the member, as is apparent from the figures .
Avant montage du module 22 sur le corps 14, la deuxième face F2 du support 30 est relativement lisse (voir figure 2), alors que, après montage du module 22 sur le corps 14, la deuxième face F2 est déformée par les irrégularités de surface du corps 14 (voir figure 1).Before assembly of the module 22 on the body 14, the second face F2 of the support 30 is relatively smooth (see Figure 2), whereas after mounting the module 22 on the body 14, the second face F2 is deformed by the surface irregularities of the body 14 (see Figure 1).
La surface des zones Z1 et Z2 en contact du support 30 et du corps 14 de l'organe électrique 12 est alors optimale. De ce fait, la plaque de conduction de la chaleur 38 permet un transfert efficace de la chaleur de la piste électriquement conductrice 26 vers le corps 14 de l'organe électrique 12. The surface of the zones Z1 and Z2 in contact with the support 30 and the body 14 of the electrical member 12 is then optimal. As a result, the heat conduction plate 38 allows efficient transfer of heat from the electrically conductive track 26 to the body 14 of the electrical member 12.

Claims

REVENDICAT1ONS REVENDICAT1ONS
1. Support (30) pour élément susceptible de dégager de la chaleur, notamment pour composant électronique de puissance (24), le support (30) étant destiné à être rapporté sur une masse (14) de dissipation de la chaleur et étant du type comprenant une plaque (36) d'isolation électrique et une plaque (38) de conduction de la chaleur vers la masse de dissipation de la chaleur (14), jointive avec la plaque d'isolation électrique (36), caractérisé en ce que la plaque de conduction de la chaleur (38) comprend une couche (40) de jonction avec la masse de dissipation de la chaleur (14), dite couche inférieure, et une couche (42) de rigidification de la plaque de conduction de la chaleur (38), dite couche intermédiaire, cette couche intermédiaire (42) étant réalisée dans un matériau ayant une dureté supérieure à celle du matériau de la couche inférieure (40).1. Support (30) for an element capable of generating heat, in particular for an electronic power component (24), the support (30) being intended to be attached to a mass (14) of dissipation of heat and being of the type comprising an electric insulation board (36) and a heat conduction plate (38) to the heat dissipation mass (14), joined to the electrical insulation board (36), characterized in that the heat conduction plate (38) comprises a layer (40) connecting with the heat-dissipating mass (14), said lower layer, and a layer (42) for stiffening the heat conduction plate ( 38), said intermediate layer, this intermediate layer (42) being made of a material having a hardness greater than that of the material of the lower layer (40).
2. Support (30) selon la revendication 1 , dans lequel la plaque de conduction de la chaleur (38) comprend une couche (44) de jonction avec la plaque d'isolation électrique (36), dite couche supérieure, cette couche supérieure (44) étant réalisée dans un matériau ayant des propriétés de dilatation thermique similaires à celui de la couche inférieure (40).2. Support (30) according to claim 1, wherein the heat conduction plate (38) comprises a layer (44) of junction with the electrical insulation plate (36), said upper layer, this upper layer ( 44) being made of a material having thermal expansion properties similar to that of the lower layer (40).
3. Support (30) selon la revendication 2, dans lequel la couche supérieure (44) a une épaisseur sensiblement identique à celle de la couche inférieure (40).3. Support (30) according to claim 2, wherein the upper layer (44) has a thickness substantially identical to that of the lower layer (40).
4. Support (30) selon la revendication 2 ou 3, dans lequel la couche supérieure (44) est réalisée dans un matériau identique à celui de la couche inférieure (40).4. Support (30) according to claim 2 or 3, wherein the upper layer (44) is made of a material identical to that of the lower layer (40).
5. Support (30) selon l'une quelconque des revendications 1 à 4, dans lequel la couche inférieure (40) comprend essentiellement du cuivre.5. Support (30) according to any one of claims 1 to 4, wherein the lower layer (40) comprises substantially copper.
6. Support (30) selon l'une quelconque des revendications 1 à 5, comprenant une masse (46) formant joint destinée à être intercalée entre la couche inférieure (40) et la masse de dissipation de la chaleur (14).6. Support (30) according to any one of claims 1 to 5, comprising a mass (46) forming a seal to be interposed between the lower layer (40) and the heat dissipation mass (14).
7. Support (30) selon la revendication 6, dans lequel la masse (46) formant joint comprend un matériau choisi parmi un tissu de verre imprégné d'une résine époxy, une résine thermoplastique à changement de phase, une colle thermoconductrice comprenant des billes de verre et un ruban adhésif double face.7. Support (30) according to claim 6, wherein the mass (46) forming a seal comprises a material selected from a glass cloth impregnated with an epoxy resin, a thermoplastic resin with phase change, a thermally conductive adhesive comprising beads glass and double-sided tape.
8. Support (30) selon l'une quelconque des revendications 1 à 7, dans lequel la plaque d'isolation électrique (36) comprend un matériau choisi parmi un tissu de verre imprégné d'une résine époxy, une résine thermoplastique à changement de phase, une colle thermoconductrice comprenant des billes de verre et un ruban adhésif double face. 8. Support (30) according to any one of claims 1 to 7, wherein the electrical insulation plate (36) comprises a material selected from a glass cloth impregnated with an epoxy resin, a thermoplastic resin with a change of phase, a thermoconductive glue comprising glass beads and a double-sided adhesive tape.
9. Support (30) selon l'une quelconque des revendications 1 à 8, dans lequel la couche intermédiaire (42) comprend essentiellement du nickel.9. Support (30) according to any one of claims 1 to 8, wherein the intermediate layer (42) comprises substantially nickel.
10. Module de puissance (22) du type comprenant une piste (26) conductrice électriquement, sur laquelle est rapporté un composant électronique de puissance (24), portée par un support (30), caractérisé en ce que le support est selon l'une quelconque des revendications 1 à 9, la piste conductrice (26) étant en contact avec la plaque d'isolation (36).Power module (22) of the type comprising an electrically conductive track (26), to which is connected an electronic power component (24), carried by a support (30), characterized in that the support is according to the any one of claims 1 to 9, the conductive track (26) being in contact with the insulation board (36).
11. Ensemble (10) comprenant un organe électrique (12) muni d'un corps (14) et un module de puissance (22) formant un dispositif électrique de pilotage de l'organe électrique (12), caractérisé en ce que le module (22) est selon la revendication 10 et le corps (14) de l'organe électrique (12) forme la masse de dissipation de la chaleur (14) sur laquelle est rapporté le support (30). 11. Assembly (10) comprising an electric member (12) provided with a body (14) and a power module (22) forming an electrical device for controlling the electric member (12), characterized in that the module (22) is according to claim 10 and the body (14) of the electrical member (12) forms the mass of heat dissipation (14) on which is reported the support (30).
EP07731857A 2006-04-06 2007-04-02 Stand, in particular for power electronic component, power module comprising such a stand, assembly comprising the module and electrical member controlled by said module Withdrawn EP2005471A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0603049A FR2899763B1 (en) 2006-04-06 2006-04-06 SUPPORT, ESPECIALLY FOR POWER ELECTRONIC COMPONENT, POWER MODULE COMPRISING THIS SUPPORT, ASSEMBLY COMPRISING THE MODULE AND ELECTRICAL MEMBER PILOTED BY THIS MODULE
PCT/FR2007/051053 WO2007116172A1 (en) 2006-04-06 2007-04-02 Stand, in particular for power electronic component, power module comprising such a stand, assembly comprising the module and electrical member controlled by said module

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EP2005471A1 true EP2005471A1 (en) 2008-12-24

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EP07731857A Withdrawn EP2005471A1 (en) 2006-04-06 2007-04-02 Stand, in particular for power electronic component, power module comprising such a stand, assembly comprising the module and electrical member controlled by said module

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US (1) US20090175005A1 (en)
EP (1) EP2005471A1 (en)
JP (1) JP2009532892A (en)
FR (1) FR2899763B1 (en)
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FR2899763B1 (en) 2008-07-04
US20090175005A1 (en) 2009-07-09
FR2899763A1 (en) 2007-10-12
JP2009532892A (en) 2009-09-10
WO2007116172A1 (en) 2007-10-18

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