EP1995510A1 - LED lampe - Google Patents

LED lampe Download PDF

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Publication number
EP1995510A1
EP1995510A1 EP07252176A EP07252176A EP1995510A1 EP 1995510 A1 EP1995510 A1 EP 1995510A1 EP 07252176 A EP07252176 A EP 07252176A EP 07252176 A EP07252176 A EP 07252176A EP 1995510 A1 EP1995510 A1 EP 1995510A1
Authority
EP
European Patent Office
Prior art keywords
heat
thermally
heat sinks
led
conductive sleeve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07252176A
Other languages
English (en)
French (fr)
Inventor
Chin Sung Tsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Kuan Tech Co Ltd
Original Assignee
Hong Kuan Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hong Kuan Tech Co Ltd filed Critical Hong Kuan Tech Co Ltd
Priority to EP07252176A priority Critical patent/EP1995510A1/de
Publication of EP1995510A1 publication Critical patent/EP1995510A1/de
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
    • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to a LED (light emitting diode) lamp, and more particularly to a LED lamp having a LED unit and a plurality of heat sinks surrounding the LED unit for efficiently dissipating the heat generated by the LED unit.
  • projection lamps have a considerable market share among all of commercially available lamps. Especially, when various power-saving electronic lamps are used to replace traditional fluorescent lamps, the projection lamps still play an important role due to the fact that the projection lamps further providing a particular illuminating effect. For example, when decorating various house environments, exhibition places, showrooms, or restaurants, the projection lamps are inevitably used to create a mood for focusing on exhibited trade articles or decorations. Because the projection lamps have the considerable market share, various specifications of the projection lamps have been standardized. However, traditional projection lamps are generally halide projection lamps with a specification of 110 Volt, which results in increasing power consumption and generation of heat, so that the life span thereof is shortened relatively (only about several months). With the trend of higher and higher power rate, the traditional halide projection lamps are uneconomical and may cause an environmental issue; while the generated heat easily causes accidents such as cable fires.
  • the traditional LED projection lamp designated by numeral 1 comprises an outer casing 11, a voltage conversion unit 12, and a LED unit 13.
  • the LED unit 13 and the voltage conversion unit 12 are mounted in the outer casing 11.
  • the voltage conversion unit 12 is used to convert an AC power of 110V into a DC power applied to the LED unit 13, so that the LED unit 13 can illuminate for a projection purpose.
  • the traditional LED projection lamp 1 provides a power-saving advantage relative to the traditional halide projection lamp
  • the traditional LED projection lamp 1 still has the foregoing problem of heat dissipation.
  • the LED unit 13 must have a predetermined illumination in order to provide an effect of focusing on a spot target.
  • the illumination of the LED unit 13 is continuously increasing with the advance of lamp technology, the heat-dissipation problem of the LED unit 13 is more and more serious.
  • the LED unit 13 only has a lower heat-resistant property. Once an operation temperature is greater than a predetermined heat-resistant temperature of the LED unit 13, the illumination of the LED unit 13 will be gradually decreased, so that the LED unit 13 can no longer provide the predetermined illumination and the life span thereof will be shortened.
  • the traditional LED projection lamp 1 has the heat-dissipation problem, the traditional LED projection lamp 1 is still not provided with any heat-dissipation structure for dissipating heat.
  • the heat generated by the LED unit 13 can only be dissipated to the atmosphere by the outer casing 11 made of metal, so that the traditional LED projection lamp 1 only provides a relatively lower heat-dissipation efficiency.
  • the traditional LED projection lamp 1 can only use the LED unit 13 with a maximum power specification up to 1 Watt due to the heat-dissipation problem, so that the total illumination of the traditional LED projection lamp 1 is limited and the traditional LED projection lamp 1 cannot be used to completely replace the traditional halide projection lamp.
  • the traditional halide projection lamp with the higher power consumption and the more heat generation still has a considerable market share, which leads to unnecessary waste of the limited energy resources in the world.
  • a primary object of the present invention is to provide a LED lamp, which is provided with a heat-dissipating module to substantially increase total heat-dissipating area, so as to improve and enhance the overall heat-dissipating efficiency.
  • a secondary object of the present invention is to provide a LED lamp, which is provided with a heat-dissipating module having a plurality of heat sinks and a sheath for surrounding and positioning the heat sinks, so that the heat sinks are confined to ensure the operation safety and increase the structural strength of the heat-dissipating module.
  • a third object of the present invention is to provide a LED lamp, which is provided with at least one LED unit for generating a light source and a cover member for evenly projecting the light source and providing a dust-proof effect.
  • a fourth object of the present invention is to provide a LED lamp, which is provided with at least one LED unit for generating a light source, a metal base, and a light reflection member for reflecting and concentrating the light source, so as to prevent the loss of the light source and to cover the metal base for the purpose of decoration.
  • LED lamp which comprises:
  • the LED lamp further comprises at least one light reflection member received in the step portion formed on the central portion of the heat sinks of the heat-dissipating module and mounted on the base, wherein the light reflection member is provided with a curved focusing portion and a through hole formed on a central portion of the curved focusing portion, so that the LED unit mounted on the base is received in the through hole; and wherein the light reflection member is further provided with an engaging flange on an outer edge of the curved focusing portion for engaging with the cover member.
  • the LED lamp designated by numeral 20 comprises at least one LED unit 21, a thermally-conductive sleeve 22, a heat-dissipating module 23, at least one metal base 24, at least one cover member 25, at least one light reflection member 26, a sheath 27, a foundation 28, and a printed circuit board (PCB) 29.
  • the heat-dissipating module 23 is provided with a plurality of heat sinks 231.
  • the thermally-conductive sleeve 22 is a hollow column having an upper end 221 and a lower end 222, wherein the upper end 221 is provided with at least one through hole 2211.
  • the thermally-conductive sleeve 22 is preferably made of metal or alloy with a high thermal conductivity, such as iron, copper, aluminum, silver, gold, and their alloy.
  • Each of the heat sinks 231 of the heat-dissipating module 23 has one end serially connected to each other and radially arranged on an outer periphery of the thermally-conductive sleeve 22, and the other end apart from each other, so as to constitute a circular structure of the heat-dissipating module 23. Furthermore, the heat sinks 231 are extended outward about a predetermined length in relation to the upper end 221 of the thermally-conductive sleeve 22. Each of the heat sinks 231 is formed with a step portion 232, while all of the step portions 232 are arranged coaxial to the thermally-conductive sleeve 22 and surrounding the upper end 221 thereof.
  • the heat sinks 231 of the heat-dissipating module 23 are preferably made of metal or alloy with a high thermal conductivity, such as iron, copper, aluminum, silver, gold, and their alloy.
  • the metal base 24 is used to mount the LED unit 21 thereon, while the metal base 24 is mounted in the step portions 232 formed on a central portion of the heat sinks 231. Moreover, the metal base 24 is further used to mount a plurality of electronic elements (not shown), such as ICs and capacitors, for adjusting the power of the LED unit 21. Especially, the metal base 24 is further used to dissipate heat generated by the LED unit 21 via the heat sinks 231 to the atmosphere during illuminating. Preferably, the metal base 24 is further provided with epoxy resin to prevent the electronic elements (ICs and capacitors) and the LED unit 21 from contacting with each other and leading to short circuit. In an alternative preferred embodiment of the present invention, the metal base 24 can be replaced by a plastic base made of a high heat-resistant plastic material.
  • the cover member 25 is mounted in the step portion 232 formed on the central portion of the heat sink 231 of the heat-dissipating module 23, while the cover member 25 is above a light source projected by the LED unit 21, so as to evenly distribute the light source and to prevent from scattering.
  • the cover member 25 is typically transparent or semitransparent member and can be selected from the group consisting of: a convex lens, a concave lens, a planar lens, and a light diffusion plate.
  • the cover member 25 also seals the LED unit 21 into a hermetical compartment such that the LED unit 21 will not be damaged by rains or moistures of outside environment.
  • the light reflection member 26 is received in the step portion 232 formed on the central portion of the heat sink 231 of the heat-dissipating module 23, and mounted on the metal base 24.
  • the light reflection member 26 is provided with a curved focusing portion 261 and a through hole 2611 formed on a central portion of the curved focusing portion 261, so that the LED unit 21 mounted on the metal base 24 can be received in the through hole 2611.
  • the light reflection member 26 covers the metal base 24, so as to provide a dust-proof effect and a decoration effect.
  • the LED unit 21 is received in the through hole 2611 of the light reflection member 26 and mounted on the metal base 24, the light source projected by the LED unit 21 will not be scattered from a slit defined between any two of the heat sinks 231 of the heat-dissipating module 23, so as to improve and enhance the illuminating efficiency.
  • the light reflection member 26 is provided with an engaging flange 2612 on an outer edge of the curved focusing portion 261 for engaging with the cover member 25.
  • the sheath 27 is used to surround and position the upper outer rim of heat sinks 231, so that the heat sinks 231 are confined to ensure operation safety.
  • the sheath 27 can be used to prevent from being cut by the sharp outer edge of the heat sinks 231.
  • the user can easily exert a force upon the sheath 27 surrounding the heat sinks 231, and the sheath 27 can increase the structural strength of the heat-dissipating module 23 to protect the heat sinks 231 from being deformed or shifted by an external impact.
  • the sheath 27 has a width of around 2mm ⁇ 10mm on both its upper and side surfaces and covers only the sharp outer edge of heat sinks 231. Therefore, most parts of heat sinks 231 remain exposed to the atmosphere such that the efficiency of heat dissipation won't be influenced by the sheath 27.
  • the foundation 28 is a hollow housing provided with a curved opening 281 on an upper end thereof, wherein the curved opening 281 is used to position the heat sinks 231 surrounding the lower end 222 of the thermally-conductive sleeve 22.
  • the PCB 29 comprises a circuit (not shown) therein, and is mounted in the foundation 28.
  • the circuit of the PCB 29 is electrically connected to the LED unit 21 mounted on the metal base 24 via the through hole 2211 of the thermally-conductive sleeve 22.
  • the PCB 29 is further provided with at least one terminal 291 and a voltage conversion unit 292.
  • the terminal 291 is extended through the foundation 28 for being electrically connected an external power source (not shown) to the PCB 29 mounted in the foundation 28, while the voltage conversion unit 292 is used to convert an AC power of 110V or 220V from the external power source into a DC power applied to the LED unit 21, so that the LED unit 13 can illuminate for a projection purpose.
  • the specification of the foundation 28 and the PCB 29 can be the same as that of traditional projection lamps for a projection purpose.
  • the voltage conversion unit 292 is received inside the interior hollow portion of thermally-conductive sleeve 22 from the lower end 222 thereof.
  • FIG. 4 an exploded perspective view of a LED lamp according to a second preferred embodiment of the present invention is illustrated and similar to the first preferred embodiment shown in Fig. 2 , so that some elements of the second preferred embodiment similar to that of the first preferred embodiment will be designated by the same numerals and the detailed description thereof will be omitted.
  • the LED lamp of the second preferred embodiment of the present invention designated by numeral 20a further comprises a terminal housing 30 connected to another end (i.e. a lower end) of the foundation 28 opposite to the curved opening 281, wherein the terminal housing 30 is provided with an electrically conductive thread 31 formed on an outer periphery thereof for being electrically connected to the PCB 29, so that the electrically conductive thread 31 of the terminal housing 30 can be used to replace the terminal 291 of the PCB 29 of the first preferred embodiment shown in Fig. 2 .
  • the specification of the foundation 28 and the terminal housing 30 can be corresponding to that of various metal screwing adapters of traditional tungsten lamps, such as adapter specifications of E10, E12, E 14, E 17, E27, or E40, wherein the number behind the letter "E” means the diameter of the metal screwing adapters.
  • the specification of traditional household tungsten lamps is generally the E27 specification, i.e. the diameter of the metal screwing adapters thereof is 27 mm (or 2.7 cm).
  • FIG. 5 an exploded perspective view of a LED lamp according to a third preferred embodiment of the present invention is illustrated and similar to the second preferred embodiment shown in Fig. 4 , so that similar elements will be designated by the same numerals and the detailed description thereof will be omitted.
  • the LED lamp of the third preferred embodiment of the present invention designated by numeral 20b comprises a plurality of the LED units 21, and further comprises a thermally-conductive base 40 mounted in the step portion 232 of the heat-dissipating module 23.
  • the thermally-conductive base 40 is provided with a plurality of positioning portions 41 corresponding to a plurality of the metal bases 24, so that each of the metal bases 24 respectively receives each of the LED units 21, while each of the metal bases 24 is respectively positioned in the positioning portions 41.
  • the thermally-conductive base 40 is provided with a through hole 42 on a central portion thereof, so that the plurality of the metal bases 24 can be electrically connected to the PCB 29 in the foundation 28 via wires (not shown) extended through the through hole 42.
  • the thermally-conductive base 40 has a lower surface attached to an upper edge of each of the heat sinks 231 located at the step portion 232 of the heat-dissipating module 23.
  • the thermally-conductive base 40 can be used to increase a contact area between the metal bases 24 and the step portion 232 of the heat-dissipating module 23, and the heat sinks 231 can be used to improve the heat-dissipating efficiency of the metal bases 24 by speedily dissipating the heat thereof.
  • the LED lamp 20b of the third preferred embodiment of the present invention omits the light reflection member 26, and only the thermally-conductive base 40 mounted in the step portion 232 of the heat-dissipating module 23 is used to support the plurality of the LED units 21 and the plurality of the metal bases 24.
  • the common cover member 25 is used to evenly distribute the light source projected by all of the LED units 21 during the light source penetrates through the cover member 25, so that the LED lamp 20b will output an evenly distributed light source with a higher illumination.
  • FIG. 6 an exploded perspective view of a LED lamp according to a fourth preferred embodiment of the present invention is illustrated and similar to the third preferred embodiment shown in Fig. 5 , so that similar elements will be designated by the same numerals and the detailed description thereof will be omitted.
  • the LED lamp of the fourth preferred embodiment of the present invention designated by numeral 20c further comprises a plurality of the light reflection members 26 mounted on the plurality of the metal bases 24, respectively, wherein the LED units 21 are received in the through holes 2611 formed on the central portion of the curved focusing portion 261 of the light reflection members 26, respectively. Meanwhile, the plurality of the cover members 25 are engaged with the engaging flanges 2612 of the light reflection members 26, respectively.
  • each of the LED units 21 is surrounded by the curved focusing portion 261 of the light reflection members 26, so that the light source projected by each of the LED units 21 in each of the curved focusing portion 261 can be focused by the curved focusing portion 261 of the light reflection member 26.
  • each of the cover members 25 is used to respectively and evenly distribute the light sources projected by each of the LED units 21 during each of the light source penetrates through the corresponding cover member 25, so that the LED lamp 20c will focus and output a plurality of independently evenly distributed light sources projected by the plurality of the LED units 21.
  • the LED lamp 20c of the fourth preferred embodiment of the present invention further comprises a protecting plate 50 provided with a plurality of positioning holes 51 thereon.
  • the positioning holes 51 of the protecting plate 50 are used to position the cover members 25 and the light reflection members 26 therein. Meanwhile, a combination of the protecting plate 50, the cover members 25, and the light reflection members 26 is received in the step portions 232 of the heat-dissipating module 23, so that the step portions 232 of the heat-dissipating module 23 will be sealed by the combination thereof.
  • the protecting plate 50 can precisely position the cover members 25 and the light reflection members 26, while providing a dust-proof effect for preventing the lamp from dusts or foreign matters, and a decoration effect for covering all electronic elements (not shown) in the LED lamp 20c.
  • the protecting plate 50 can be made of a transparent material, and integrated with the plurality of the cover members 25 into one piece.
  • FIG. 7 an exploded perspective view of a LED lamp according to a fifth preferred embodiment of the present invention is illustrated and similar to the third preferred embodiment shown in Fig. 5 , so that similar elements will be designated by the same numerals and the detailed description thereof will be omitted.
  • the LED lamp of the fifth preferred embodiment of the present invention designated by numeral 20d has the following differences in design.
  • the thermally-conductive base 401 shown in Fig. 7 is a metallic plate such as aluminum plate and is furnished with circuitries on the top surface thereof.
  • the LED units 211 are bare LED integrated circuit (IC) chips which are directly mounted on and yet coupled with the circuitries of the thermally-conductive base 401. Because the LED units 211 in the form of bare LED IC chips are much smaller in size than the LED units 21 shown in Fig. 5 , therefore, it is possible to accommodate much more LED units 211 on a single thermally-conductive base 401.
  • IC integrated circuit
  • the LED units 211 are arranged in an array format and the amount thereof can be as many as eighty-four bare LED IC chips. Not only the illumination thereof is greatly improved, but also the heat generated by the LED units 211 can be dissipated efficiently by the combination of metallic thermally-conductive base 401, thermally-conductive sleeve 22 and heat-dissipating module 23.
  • the voltage conversion unit 292 is received inside the interior hollow portion of thermally-conductive sleeve 22 from the lower end 222 thereof.
  • the cover member 25 seals the LED unit 21 into a hermetical compartment formed between the cover member 25 and thermally-conductive base 401, such that the LED units 211 will not be damaged by rains or moistures coming from outside environment.
  • Figs. 8A and 8B are respectively an exploded perspective view and an assembled perspective view of a LED lamp according to a sixth preferred embodiment of the present invention. Because most elements shown in Figs. 8A and 8B are similar to the fifth preferred embodiment shown in Fig. 7 , so that similar elements will be designated by the same numerals and the detailed description thereof will be omitted.
  • the LED lamp of the sixth preferred embodiment of the present invention designated by numeral 20e has the following differences in design. Firstly, the foundation 28 shown in Figs. 8A and 8B has a larger and wider inner compartment than the one shown in Fig. 7 . Therefore, in the sixth preferred embodiment of Figs. 8A and 8B , the voltage conversion unit 292 is furnished on the bottom surface of PCB 29 and is received inside the foundation 28. Because the voltage conversion unit 292 in this sixth preferred embodiment is now received inside the foundation 28 instead of thermally-conductive sleeve 22, therefore the size and height of thermally-conductive sleeve 22 in this sixth preferred embodiment can be decreased vastly.
  • the LED lamp 20e of this sixth preferred embodiment further comprises a heat dissipating plate 293 and a positioning plate 294.
  • the heat dissipating plate 293 is made of metal such like aluminum, steel or copper and is in contact with the upper surface of the PCB 29, such that the heat generated by the voltage conversion unit 292 can be absorbed and dissipated by the heat dissipating plate 293.
  • the outer rim of the heat dissipating plate 293 is formed with at least one recess 2931 which can mate with the vertical ribs 281 formed on the inner surface of foundation 28 in such a manner that the PCB 29 and voltage conversion unit 292 can be sandwiched between the heat dissipating plate 293 and the bottom of inner compartment of foundation 28.
  • the positioning plate 294 is made of metal and is in contact with the upper surface of the heat dissipating plate 293.
  • the outer rim of positioning plate 294 is also formed with a plurality of screw holes 2941 which are corresponding to the screw holes 282 formed on the inner surface of foundation 28.
  • the outer rim of lower end 222 of thermally-conductive sleeve 22 is further formed with at least one locking pin 223 which can be mated with the locking slots 280 formed on the upper end of inner surface of foundation 28 in such a manner that the thermally-conductive sleeve 22 can be fixed to the upper end of foundation 28 by means of the mating of locking pin 223 and locking slots 280.
  • each of the LED lamps 20, 20a, 20b, and 20c of the present invention is provided with the heat-dissipating module 23 constructed from the plurality of the heat sinks 231, wherein each of the heat sinks 231 has one end serially connected to each other and radially arranged on an outer periphery of the thermally-conductive sleeve 22, and the other end apart from each other, so as to constitute a circular and yet radiative structure of the heat-dissipating module 23.
  • the sheath 27 is used to surround and position the heat sinks 231, so that the heat sinks 231 are confined to ensure the operation convenience and safety for being easily held by the user and preventing the user from being cut or injured by the sharp ends of heat sinks 231.
  • the LED unit 21 is mounted on the metal base 24, while the metal base 24 is mounted in the step portions 232 formed on the central portion of the heat sinks 231.
  • the light source projected by the LED unit 21 can be focused by the curved focusing portion 261 of the light reflection member 26, and followed by outputting the light source via the cover member 25.
  • the heat generated by the LED unit 21 can be dissipated to the thermally-conductive sleeve 22 via the metal base 24, and then the heat will be dissipated from the thermally-conductive sleeve 22 to the heat sinks 231 of heat-dissipating module 23, so as to dissipate the heat to the atmosphere.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
EP07252176A 2007-05-25 2007-05-25 LED lampe Withdrawn EP1995510A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07252176A EP1995510A1 (de) 2007-05-25 2007-05-25 LED lampe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP07252176A EP1995510A1 (de) 2007-05-25 2007-05-25 LED lampe

Publications (1)

Publication Number Publication Date
EP1995510A1 true EP1995510A1 (de) 2008-11-26

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP07252176A Withdrawn EP1995510A1 (de) 2007-05-25 2007-05-25 LED lampe

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EP (1) EP1995510A1 (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011085146A3 (en) * 2010-01-11 2011-11-10 General Electric Company Compact light-mixing led light engine and white led lamp with narrow beam and high cri using same
DE102011113653A1 (de) * 2011-09-19 2013-03-21 Rüdiger Lanz LED-Hochleistungsspot
KR101407687B1 (ko) * 2013-07-02 2014-06-13 주식회사 이디엠아이 방열 효과가 뛰어난 대형 led 램프
US9182110B2 (en) 2011-09-23 2015-11-10 Koninklijke Philips N.V. Lighting device with a circuit board mounting

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137838A1 (en) * 2000-05-08 2003-07-24 Alexander Rizkin Highly efficient LED lamp
DE202004004570U1 (de) * 2004-03-10 2004-05-27 Conrad Electronic Gmbh Leuchtmittel für eine Beleuchtungseinrichtung
DE202006009553U1 (de) * 2006-06-16 2006-08-31 Chien, Chen-Chun, Sansia LED-Scheinwerfermodul
WO2006128327A1 (fr) * 2005-06-03 2006-12-07 Neobulb Technologies, Inc. Dispositif electroluminescent a semi-conducteur muni d'un module de conduction/dissipation de chaleur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030137838A1 (en) * 2000-05-08 2003-07-24 Alexander Rizkin Highly efficient LED lamp
DE202004004570U1 (de) * 2004-03-10 2004-05-27 Conrad Electronic Gmbh Leuchtmittel für eine Beleuchtungseinrichtung
WO2006128327A1 (fr) * 2005-06-03 2006-12-07 Neobulb Technologies, Inc. Dispositif electroluminescent a semi-conducteur muni d'un module de conduction/dissipation de chaleur
DE202006009553U1 (de) * 2006-06-16 2006-08-31 Chien, Chen-Chun, Sansia LED-Scheinwerfermodul

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011085146A3 (en) * 2010-01-11 2011-11-10 General Electric Company Compact light-mixing led light engine and white led lamp with narrow beam and high cri using same
US8613530B2 (en) 2010-01-11 2013-12-24 General Electric Company Compact light-mixing LED light engine and white LED lamp with narrow beam and high CRI using same
US9534743B2 (en) 2010-01-11 2017-01-03 GE Lighting Solutions, LLC Directional lamp with beam forming optical system including a lens and collecting reflector
DE102011113653A1 (de) * 2011-09-19 2013-03-21 Rüdiger Lanz LED-Hochleistungsspot
DE102011113653B4 (de) * 2011-09-19 2016-02-18 Rüdiger Lanz LED-Hochleistungsspot
US9182110B2 (en) 2011-09-23 2015-11-10 Koninklijke Philips N.V. Lighting device with a circuit board mounting
RU2608566C2 (ru) * 2011-09-23 2017-01-23 Филипс Лайтинг Холдинг Б.В. Осветительное устройство с держателем печатной платы
KR101407687B1 (ko) * 2013-07-02 2014-06-13 주식회사 이디엠아이 방열 효과가 뛰어난 대형 led 램프

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