EP1973166B1 - Photoreceptor integrated circuit and optoelectronic component comprising the photoreceptor integrated circuit - Google Patents

Photoreceptor integrated circuit and optoelectronic component comprising the photoreceptor integrated circuit Download PDF

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Publication number
EP1973166B1
EP1973166B1 EP08151943.1A EP08151943A EP1973166B1 EP 1973166 B1 EP1973166 B1 EP 1973166B1 EP 08151943 A EP08151943 A EP 08151943A EP 1973166 B1 EP1973166 B1 EP 1973166B1
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EP
European Patent Office
Prior art keywords
contact pads
circuit
processing unit
photoreceptor circuit
photoreceptor
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EP08151943.1A
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German (de)
French (fr)
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EP1973166A3 (en
EP1973166A2 (en
Inventor
Victorio Quercia
André Grandjean
Abdul-Hamid Kayal
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EM Microelectronic Marin SA
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EM Microelectronic Marin SA
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Publication of EP1973166A3 publication Critical patent/EP1973166A3/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/1446—Devices controlled by radiation in a repetitive configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures

Definitions

  • a photoreceptor integrated circuit includes a light-sensing region for capturing light and a processing unit region for processing the signals provided by the light-sensitive region.
  • the invention also relates to an optoelectronic component, which comprises the photoreceptor integrated circuit.
  • a photoreceptor integrated circuit may be made generally in a silicon semiconductor substrate.
  • the photosensitive region of the photoreceptor circuit may comprise a matrix of photosensitive elements, such as photodiodes, or a particular configuration of several adjacent photosensitive elements.
  • the processing unit of the photoreceptor circuit makes it possible to process the signals supplied by the elements of the photosensitive region, taking into account the quantity of light captured by each photosensitive element.
  • the photosensitive region may be surrounded by portions of a region with a treatment unit.
  • the electrical contact pads of said photoreceptor circuit are generally distributed all around the photosensitive region for example in a uniform manner, which leads to a loss of space.
  • This arrangement of the contact pads can also be provided as a function of electrical connection to corresponding connection pads of a conventional medium on which the photoreceptor circuit can be mounted.
  • Some contact pads of the photoreceptor circuit mounted on the carrier or a lead frame are each connected by a wire to a corresponding connection pad of the carrier or the lead frame.
  • the device includes a photoreceptor circuit having a photosensitive region and a treatment unit region. Contact pads are symmetrically distributed along the entire length of two opposite sides of the integrated circuit.
  • the photoreceptor integrated circuit comprises metal bumps on the contact pads so as to be mounted on connection pads of a flexible substrate having the same arrangement as the metal bumps of the integrated circuit.
  • a mounting force must be applied to the entire surface on the back of the integrated circuit. This may induce undesired mechanical mounting stresses on the photosensitive region, which is a disadvantage.
  • the object of the invention is therefore to provide a photoreceptor integrated circuit, to overcome any drawback of the prior art cited above, having a particular arrangement of the various elements making it possible in particular to reduce the size of the photoreceptor circuit produced and to symmetrize or balance certain parts of said circuit.
  • the invention relates to a photoreceptor integrated circuit, which comprises the characteristics mentioned in the independent claim 1.
  • An advantage of such a photoreceptor integrated circuit according to the invention lies in the fact that the contact pads of the whole circuit are arranged only in the processing unit region, leaving the light-sensitive region free.
  • the photosensitive region is juxtaposed to one side of the processing unit region to define two distinct regions in the same semiconductor substrate, such as silicon.
  • the contact pads are symmetrically distributed in the treatment unit region, for example in two rows at the periphery arranged along the length of the two juxtaposed regions.
  • An equal number of contact pads to be electrically connected, which are regularly or symmetrically spaced from each other, can be provided in each row.
  • metal bumps are formed on the contact pads to protrude from a passivation layer of the photoreceptor integrated circuit.
  • These metal bumps which are symmetrically distributed in the region of treatment unit, are intended to be connected directly to corresponding connection pads of a support or printed circuit substrate by a technique called "flip chip" in English terminology .
  • the connection pads of the substrate have the same arrangement and positioning as the metal bumps.
  • the invention also aims to provide an optoelectronic component, which comprises a photoreceptor integrated circuit of reduced size and some symmetrized parts.
  • the invention relates to an optoelectronic component, which comprises the features mentioned in the dependent claim 7.
  • An advantage of the optoelectronic component according to the invention lies in the fact that it comprises connection pads on a printed circuit substrate for connection to contact pads of the photoreceptor integrated circuit arranged opposite the processing unit region of said circuit. This allows during an electrical connection operation of the contact pads of the circuit to the connection pads of the substrate to avoid mechanical contact with the photosensitive region left free to protect it.
  • the substrate of the optoelectronic component is a flexible substrate.
  • This flexible substrate comprises a first portion on which the photoreceptor integrated circuit is mounted, a second portion carrying electrical connection terminals of the component, and a third connecting portion between the first and second portions.
  • This third portion carries conductive tracks connecting the connection terminals of the second portion to the connection pads of the first portion of the flexible substrate.
  • the first portion of the flexible substrate comprises connection pads having the same arrangement and positioning as the metal bumps.
  • the photoreceptor integrated circuit can be mounted on this first portion by a so-called "flip chip” technique in English terminology using a force applied only to the back of the processing unit region. This allows, thanks to the arrangement of the metal bumps of the circuit and the first portion of the substrate to ensure a reliable assembly of the circuit on the substrate.
  • a through opening may thus be provided in the first portion of the substrate facing only the photosensitive region to allow it to freely capture light.
  • only the treatment unit region may be encapsulated in a resin or under an electrically insulating and light-opaque cover to shield this region from light.
  • the photoreceptor integrated circuit 1 is made in a semiconductor substrate, such as a silicon substrate. It comprises in particular a photosensitive region 1a, which comprises several unrepresented photosensitive elements, such as photodiodes, and a processing unit region 1b for processing the electrical signals supplied by the elements of the photosensitive region.
  • the photosensitive region 1a is directly juxtaposed to one side of the treatment unit region 1b as shown by the broken lines at Figures 1a, 1b and 1c .
  • the area of this photosensitive region 1a may be half of the area of the treatment unit region 1b.
  • the region with processing unit 1b comprises all the contact pads 2, 2 'of the photoreceptor circuit according to the invention, which can be electrically connected to the outside. These contact pads can be symmetrically distributed in the processing unit region.
  • the contact pads 2 are for example distributed in two rows 3a and 3b at the periphery of two opposite sides of the treatment unit region 1b in the direction of the length of the two juxtaposed regions.
  • the number of contact pads 2 of each row is preferably equal.
  • the contact pads 2 of each row may be evenly spaced along the entire length of the treatment unit region 1b as shown in FIG. figure 1a . It can be provided for example 18 contact pads of which 9 contact pads 2 by row 3a, 3b.
  • the width of each contact pad may be 100 ⁇ m, while the space between each pad of the same row may be 200 ⁇ m.
  • contact pads may be provided in the processing unit region as far as they are symmetrically distributed in said region 1b. They may for example be grouped in regularly spaced packets on each opposite side of the processing unit region as shown in FIG. figure 1 b. They may also be arranged offset from each other on both sides of the processing unit region 1b. This symmetry of the arrangement of the ranges may be necessary to ensure a reliable assembly of the photoreceptor circuit on a printed circuit support by a technique called "flip chip" in English terminology.
  • some contact pads 2 are distributed in two rows 3a and 3b and grouped in packets of two contact pads 2 for example, which are regularly spaced apart from each other.
  • Other contact pads 2 ' for example two contact pads, may be distributed on the side of the processing unit region, opposite to the connecting side of the two regions 1a and 1b. All contact pads 2, 2, 'shown in this figure 1c , are distributed symmetrically with respect to a center line in the length direction of the photoreceptor integrated circuit.
  • the photoreceptor integrated circuit 1 may comprise metal bumps 6 made on the contact pads 2 as shown in FIG. figure 2 .
  • the contact pads 2 are conventionally formed on the semiconductor substrate 4. Apertures in the final passivation layer 5 deposited on the substrate 4 are provided to give access to each contact pad 2 of the photoreceptor integrated circuit 1.
  • Metal bumps 6 are thus made through the openings of the passivation layer 5 from each contact pad 2 to protrude from the upper surface of said passivation layer.
  • the figure 3 shows a three-dimensional view of a first embodiment of an optoelectronic component.
  • This optoelectronic component comprises on a first face of a substrate 10, which may preferably be flexible, a photoreceptor integrated circuit capable of capturing light generated for example by a not shown light source.
  • the photoreceptor circuit therefore comprises a photosensitive region 1a and a treatment unit region 1b according to the embodiment described with reference to FIG. figure 1 for example.
  • This photoreceptor circuit is mounted on a first portion 10a of the flexible substrate 10 by a "flip chip” technique.
  • contact areas 2 of the photoreceptor circuit which include metal bumps as shown in FIG. figure 2 are electrically connected to corresponding connection pads 12 of the first portion of the substrate 10.
  • the connection pads are arranged in the same arrangement and positioning as the metal bumps of the treatment unit region 1b of the circuit in two rows.
  • the electrical connection between the metal bumps and the connection pads of the substrate 10 is effected by thermocompression or with the aid of an anisotropic adhesive by applying a force F to the back of the treatment unit 1b region of the photoreceptor circuit. Thanks to the symmetrical arrangement of the contact pads 2 with the metal bumps on the side of the treatment unit region 1b, the contact pressure due to the force F applied to the back of the photoreceptor circuit is distributed uniformly without mechanical stresses on the side. of the photosensitive region 1a. This photosensitive region is thus left free floating on one side of the treatment unit region.
  • the flexible substrate 10 further comprises the first portion, a second terminal portion 10b, which carries electrical connection terminals 11, and a connecting portion 10c between the first and second portions 10a and 10b.
  • the flexible substrate 10 is in the form of a flexible sheet whose thickness may be of the order of 75 microns.
  • Conductive tracks 13, arranged on one side or the other of each portion of the flexible substrate 10, make it possible to connect certain connection pads 12 to the connection terminals 11.
  • a through opening 14 is also provided in the first portion 10a facing only of the photosensitive region 1a of the photoreceptor circuit, since said circuit is flip chip-mounted on said substrate.
  • the aperture 14 allows the photosensitive region to capture light directly from a light source or by reflection on a work surface.
  • a not shown encapsulation of at least the processing unit region 1b may be provided to house this region of the light and to stiffen the first portion of the flexible substrate, while leaving free and without mechanical stresses the photosensitive region 1a. This makes it possible to produce a small optoelectronic component. Moreover thanks to the flexible substrate with a connecting portion 10c, this allows adjustment of the second portion 10b of electrical connection of the component relative to the first portion 10a carrying the photoreceptor circuit.
  • the figure 4 represents a three-dimensional view of a second embodiment of the optoelectronic component.
  • This optoelectronic component comprises a photoreceptor circuit mounted on a first portion 10a of a flexible substrate 10.
  • the photoreceptor circuit may be of the embodiment described with reference to FIG. figure 1a for example.
  • Said substrate comprises as for the first embodiment, a second portion 10b, which carries electrical connection terminals 11, and a connecting portion 10c between the first and second portions.
  • the photoreceptor circuit comprises a photosensitive region 1a and a region with a treatment unit 1b.
  • the back of the photoreceptor circuit is fixed on one face of the first portion 10a of the flexible substrate 10.
  • the receiving surface of the photosensitive region 1a is therefore opposite to the fixing face of the circuit photoreceptor on the first portion of the substrate 10. As a result, there is no opening through this first portion 10a.
  • the first portion 10a of the substrate 10 comprises two rows of connection pads 12 each disposed on two opposite sides of the processing unit region 1b only. These connection pads 12 can be arranged in the same way as the contact pads 2 of the processing unit region 1b.
  • the electrical connection of the contact pads 2 is carried out in this second embodiment by metal wires 15, such as aluminum wires, to the corresponding connection pads 12 of the first portion 10a of the substrate 10.
  • These connection pads 12 are connected to conductive tracks 13, preferably metal, which are arranged on one side or the other of the substrate. The conductive tracks thus connect the connection pads 12 to the connection terminals 11 placed on the second portion 10b of the substrate.
  • Such an optoelectronic component can be used in any type of electronic instrument, such as an optically operating computer mouse.
  • the first portion of the substrate with the photoreceptor circuit and possibly a light source circuit, which are protected by a cover, is mounted on a transparent lens block attached to an opening in the bottom of the mouse housing.
  • the connection terminals of the second portion of the substrate are connected directly to a motherboard remote from the bottom of the housing inside the mouse.
  • the contact pads of the photoreceptor circuit may be arranged differently, but symmetrically in the processing unit region.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

L'invention concerne un circuit intégré photorécepteur, qui comprend une région photosensible pour capter de la lumière et une région à unité de traitement pour traiter les signaux fournis par la région photosensible.A photoreceptor integrated circuit includes a light-sensing region for capturing light and a processing unit region for processing the signals provided by the light-sensitive region.

L'invention concerne également un composant optoélectronique, qui comprend le circuit intégré photorécepteur.The invention also relates to an optoelectronic component, which comprises the photoreceptor integrated circuit.

Un circuit intégré photorécepteur peut être réalisé généralement dans un substrat semi-conducteur en silicium. La région photosensible du circuit photorécepteur peut comprendre une matrice d'éléments photosensibles, tels que des photodiodes, ou une configuration particulière de plusieurs éléments photosensibles adjacents. L'unité de traitement du circuit photorécepteur permet de traiter les signaux fournis par les éléments de la région photosensible en tenant compte de la quantité de lumière captée par chaque élément photosensible.A photoreceptor integrated circuit may be made generally in a silicon semiconductor substrate. The photosensitive region of the photoreceptor circuit may comprise a matrix of photosensitive elements, such as photodiodes, or a particular configuration of several adjacent photosensitive elements. The processing unit of the photoreceptor circuit makes it possible to process the signals supplied by the elements of the photosensitive region, taking into account the quantity of light captured by each photosensitive element.

Habituellement pour la réalisation d'un circuit photorécepteur, la région photosensible peut être entourée par des portions de à région à unité de traitement. Avec une telle répartition des deux régions du circuit photorécepteur, les plages de contact électrique dudit circuit photorécepteur sont généralement réparties tout autour de la région photosensible par exemple de manière uniforme, ce qui conduit à une perte de place. Cet agencement des plages de contact peut être prévu également en fonction d'une connexion électrique à des plages de connexion correspondantes d'un support traditionnel sur lequel le circuit photorécepteur peut être monté.Usually for carrying out a photoreceptor circuit, the photosensitive region may be surrounded by portions of a region with a treatment unit. With such a distribution of the two regions of the photoreceptor circuit, the electrical contact pads of said photoreceptor circuit are generally distributed all around the photosensitive region for example in a uniform manner, which leads to a loss of space. This arrangement of the contact pads can also be provided as a function of electrical connection to corresponding connection pads of a conventional medium on which the photoreceptor circuit can be mounted.

Certaines plages de contact du circuit photorécepteur monté sur le support ou une grille de connexion, sont reliées chacune par un fil métallique à une plage de connexion correspondante du support ou de la grille de connexion. Une fois la connexion électrique établie des plages de contact utilisées du circuit photorécepteur, une opération d'encapsulation permet de recouvrir au moins la région à unité de traitement, qui pourra être à l'abri de la lumière. Un passage de lumière est laissé par contre au-dessus de la région photosensible.Some contact pads of the photoreceptor circuit mounted on the carrier or a lead frame, are each connected by a wire to a corresponding connection pad of the carrier or the lead frame. Once the electrical connection has established the contact pads used of the photoreceptor circuit, an encapsulation operation makes it possible to cover at least the treatment unit region, which may be protected from light. A passage of light is left over against the photosensitive region.

On peut citer la demande de brevet US 2004/0095501 , qui décrit un dispositif d'imagerie. Le dispositif comprend un circuit photorécepteur muni d'une région photosensible et d'une région à unité de traitement. Des plages de contact sont réparties de manière symétrique sur toute la longueur de deux côtés opposés du circuit intégré. Le circuit intégré photorécepteur comprend des bosses métalliques sur les plages de contact de manière à être monté sur des plages de connexion d'un substrat flexible ayant un même arrangement que les bosses métalliques du circuit intégré. Pour le montage et la connexion électrique du circuit intégré sur le substrat flexible, il doit être appliqué une force de montage sur toute la surface au dos du circuit intégré. Cela peut induire des contraintes mécaniques de montage non souhaitées sur la région photosensible, ce qui constitue une inconvénient.One can quote the patent application US 2004/0095501 which describes an imaging device. The device includes a photoreceptor circuit having a photosensitive region and a treatment unit region. Contact pads are symmetrically distributed along the entire length of two opposite sides of the integrated circuit. The photoreceptor integrated circuit comprises metal bumps on the contact pads so as to be mounted on connection pads of a flexible substrate having the same arrangement as the metal bumps of the integrated circuit. For mounting and electrical connection of the integrated circuit to the flexible substrate, a mounting force must be applied to the entire surface on the back of the integrated circuit. This may induce undesired mechanical mounting stresses on the photosensitive region, which is a disadvantage.

Dans la réalisation de circuits intégrés photorécepteurs de l'art antérieur comme indiqué ci-devant, aucune précaution n'est prise concernant l'emplacement des plages de contact et des régions du circuit photorécepteur pour permettre de réduire la taille dudit circuit. L'emplacement des plages de contact est en général prévu pour faciliter le montage sur un support ou une grille pour l'obtention d'un module ou composant optoélectronique traditionnel de dimension bien définie. Un tel module ou composant optoélectronique traditionnel peut prendre la forme par exemple d'un composant du type DIL ou SOIC. De ce fait, il n'est pas prévu d'optimiser la réalisation d'un circuit photorécepteur de manière à répondre aux exigences actuelles de réduction de taille de tout composant optoélectronique réalisé, ce qui est un inconvénient.In the production of photoreceptor integrated circuits of the prior art as indicated above, no precautions are taken concerning the location of the contact pads and the regions of the photoreceptor circuit to enable the size of said circuit to be reduced. The location of the contact pads is generally provided to facilitate mounting on a support or a grid for obtaining a conventional optoelectronic module or component of well-defined size. Such conventional optoelectronic module or component can take the form for example of a component of the type DIL or SOIC. Therefore, it is not intended to optimize the realization of a photoreceptor circuit so as to meet the current size reduction requirements of any optoelectronic component made, which is a drawback.

L'invention a donc pour but de fournir un circuit intégré photorécepteur, pour pallier tout inconvénient de l'art antérieur cité ci-devant, ayant un agencement particulier des différents éléments permettant notamment de réduire la taille du circuit photorécepteur réalisé et symétriser ou équilibrer certaines parties dudit circuit.The object of the invention is therefore to provide a photoreceptor integrated circuit, to overcome any drawback of the prior art cited above, having a particular arrangement of the various elements making it possible in particular to reduce the size of the photoreceptor circuit produced and to symmetrize or balance certain parts of said circuit.

A cet effet, l'invention concerne un circuit intégré photorécepteur, qui comprend les caractéristiques mentionnées dans la revendication indépendante 1.To this end, the invention relates to a photoreceptor integrated circuit, which comprises the characteristics mentioned in the independent claim 1.

Des formes d'exécution spécifiques du circuit intégré photorécepteur sont définies dans les revendications dépendantes 2 à 9.Specific embodiments of the photoreceptor integrated circuit are defined in dependent claims 2 to 9.

Un avantage d'un tel circuit intégré photorécepteur selon l'invention réside dans le fait que les plages de contact de tout le circuit sont disposées uniquement dans la région à unité de traitement en laissant libre la région photosensible. La région photosensible est juxtaposée à un côté de la région à unité de traitement pour définir deux régions distinctes dans un même substrat semi-conducteur, tel qu'en silicium.An advantage of such a photoreceptor integrated circuit according to the invention lies in the fact that the contact pads of the whole circuit are arranged only in the processing unit region, leaving the light-sensitive region free. The photosensitive region is juxtaposed to one side of the processing unit region to define two distinct regions in the same semiconductor substrate, such as silicon.

Avantageusement, les plages de contact sont réparties de manière symétrique dans la région à unité de traitement par exemple selon deux rangées en périphérie disposées dans le sens de la longueur des deux régions juxtaposées. Un nombre égal de plages de contact à relier électriquement, qui sont régulièrement ou symétriquement espacées l'une de l'autre, peut être prévu dans chaque rangée.Advantageously, the contact pads are symmetrically distributed in the treatment unit region, for example in two rows at the periphery arranged along the length of the two juxtaposed regions. An equal number of contact pads to be electrically connected, which are regularly or symmetrically spaced from each other, can be provided in each row.

Avantageusement, des bosses métalliques sont réalisées sur les plages de contact pour dépasser d'une couche de passivation du circuit intégré photorécepteur. Ces bosses métalliques, qui sont réparties de manière symétrique dans la région à unité de traitement, sont prévues pour être connectées directement sur des plages de connexion correspondantes d'un support ou substrat à circuit imprimé par une technique dénommée "flip chip" en terminologie anglaise. Pour ce faire, les plages de connexion du substrat ont un même arrangement et positionnement que les bosses métalliques. Grâce à cet agencement de bosses métalliques dans la région à unité de traitement, une force de montage du circuit sur le substrat n'est appliquée qu'au dos de la région à unité de traitement en laissant la région photosensible libre sans contraintes mécaniques de montage. La pression de contact due à la force de montage du circuit avec les bosses métalliques sur le substrat est ainsi répartie de manière adéquate ou d'une façon équilibrée. Un assemblage fiable est ainsi réalisé tout en laissant la partie photosensible du circuit intégré flottante.Advantageously, metal bumps are formed on the contact pads to protrude from a passivation layer of the photoreceptor integrated circuit. These metal bumps, which are symmetrically distributed in the region of treatment unit, are intended to be connected directly to corresponding connection pads of a support or printed circuit substrate by a technique called "flip chip" in English terminology . To do this, the connection pads of the substrate have the same arrangement and positioning as the metal bumps. With this arrangement of metal bumps in the process unit region, a circuit mounting force on the substrate is applied only to the back of the process unit region leaving the free photosensitive region free of mechanical mounting stresses. . The contact pressure due to the mounting force of the circuit with the metal bumps on the substrate is thus distributed adequately or in a balanced manner. Reliable assembly is thus achieved while leaving the photosensitive part of the floating integrated circuit.

L'invention a également pour but de fournir un composant optoélectronique, qui comprend un circuit intégré photorécepteur à taille réduite et à certaines parties symétrisées.The invention also aims to provide an optoelectronic component, which comprises a photoreceptor integrated circuit of reduced size and some symmetrized parts.

A cet effet, l'invention concerne un composant optoélectronique, qui comprend les caractéristiques mentionnées dans la revendication dépendante 7.To this end, the invention relates to an optoelectronic component, which comprises the features mentioned in the dependent claim 7.

Des formes d'exécution spécifiques du composant optoélectronique sont définies dans les revendications dépendantes 8 et 9.Specific embodiments of the optoelectronic component are defined in dependent claims 8 and 9.

Un avantage du composant optoélectronique selon l'invention réside dans le fait qu'il comprend des plages de connexion sur un substrat à circuit imprimé pour une connexion à des plages de contact du circuit intégré photorécepteur disposées en regard de la région à unité de traitement dudit circuit. Ceci permet lors d'une opération de connexion électrique des plages de contact du circuit aux plages de connexion du substrat d'éviter tout contact mécanique avec la région photosensible laissée libre pour la protéger.An advantage of the optoelectronic component according to the invention lies in the fact that it comprises connection pads on a printed circuit substrate for connection to contact pads of the photoreceptor integrated circuit arranged opposite the processing unit region of said circuit. This allows during an electrical connection operation of the contact pads of the circuit to the connection pads of the substrate to avoid mechanical contact with the photosensitive region left free to protect it.

Avantageusement, le substrat du composant optoélectronique est un substrat flexible. Ce substrat flexible comprend une première portion sur laquelle est monté le circuit intégré photorécepteur, une seconde portion portant des bornes de connexion électrique du composant, et une troisième portion de liaison entre les première et seconde portions. Cette troisième portion porte des pistes conductrices reliant les bornes de connexion de la seconde portion aux plages de connexion de la première portion du substrat flexible.Advantageously, the substrate of the optoelectronic component is a flexible substrate. This flexible substrate comprises a first portion on which the photoreceptor integrated circuit is mounted, a second portion carrying electrical connection terminals of the component, and a third connecting portion between the first and second portions. This third portion carries conductive tracks connecting the connection terminals of the second portion to the connection pads of the first portion of the flexible substrate.

Avantageusement, dans le cas où le circuit intégré photorécepteur comprend des bosses métalliques, la première portion du substrat flexible comprend des plages de connexion ayant un même arrangement et positionnement que les bosses métalliques. De cette façon, le circuit intégré photorécepteur peut être monté sur cette première portion par une technique dénommée "flip chip" en terminologie anglaise à l'aide d'une force appliquée uniquement au dos de la région à unité de traitement. Ceci permet grâce à l'agencement des bosses métalliques du circuit et de la première portion du substrat d'assurer un assemblage fiable du circuit sur le substrat.Advantageously, in the case where the photoreceptor integrated circuit comprises metal bumps, the first portion of the flexible substrate comprises connection pads having the same arrangement and positioning as the metal bumps. In this way, the photoreceptor integrated circuit can be mounted on this first portion by a so-called "flip chip" technique in English terminology using a force applied only to the back of the processing unit region. This allows, thanks to the arrangement of the metal bumps of the circuit and the first portion of the substrate to ensure a reliable assembly of the circuit on the substrate.

Une ouverture traversante peut être ainsi prévue dans la première portion du substrat en regard uniquement de la région photosensible pour lui permettre de capter librement de la lumière. De préférence, uniquement la région à unité de traitement peut être encapsulée dans une résine ou sous un couvercle isolant électriquement et opaque à la lumière pour mettre cette région à l'abri de la lumière.A through opening may thus be provided in the first portion of the substrate facing only the photosensitive region to allow it to freely capture light. Preferably, only the treatment unit region may be encapsulated in a resin or under an electrically insulating and light-opaque cover to shield this region from light.

Les buts, avantages et caractéristiques du circuit intégré photorécepteur, ainsi que du composant optoélectronique le comprenant apparaîtront mieux dans la description suivante de formes d'exécution non limitatives illustrées par les dessins sur lesquels :

  • les figures 1a, 1b et 1c représentent une vue simplifiée tridimensionnelle de trois formes d'exécution du circuit intégré photorécepteur selon l'invention,
  • la figure 2 représente une vue en coupe partielle verticale d'une partie de la région à unité de traitement du circuit intégré photorécepteur selon l'invention,
  • la figure 3 représente une vue simplifiée tridimensionnelle d'une première forme d'exécution du composant optoélectronique selon l'invention, et
  • la figure 4 représente une vue simplifiée tridimensionnelle d'une seconde forme d'exécution du composant optoélectronique selon l'invention.
The aims, advantages and characteristics of the photoreceptor integrated circuit, as well as the optoelectronic component comprising it, will appear better in the following description of non-limiting embodiments illustrated by the drawings in which:
  • the Figures 1a, 1b and 1c represent a simplified three-dimensional view of three embodiments of the photoreceptor integrated circuit according to the invention,
  • the figure 2 represents a vertical partial sectional view of a portion of the photoreceptor integrated circuit processing unit region according to the invention,
  • the figure 3 represents a simplified three-dimensional view of a first embodiment of the optoelectronic component according to the invention, and
  • the figure 4 represents a simplified three-dimensional view of a second embodiment of the optoelectronic component according to the invention.

Dans la description suivante, toutes les parties du circuit intégré photorécepteur ou du composant optoélectronique qui sont bien connues d'un homme du métier dans ce domaine technique ne sont relatées que de manière simplifiée.In the following description, all parts of the photoreceptor integrated circuit or the optoelectronic component which are well known to those skilled in this technical field are only reported in a simplified manner.

Aux figures 1a, 1b et 1c, le circuit intégré photorécepteur 1 est réalisé dans un substrat semi-conducteur, tel qu'un substrat en silicium. Il comprend notamment une région photosensible 1a, qui comprend plusieurs éléments photosensibles non représentés, tels que des photodiodes, et une région à unité de traitement 1 b pour traiter les signaux électriques fournis par les éléments de la région photosensible. La région photosensible 1a est directement juxtaposée à un côté de la région à unité de traitement 1 b comme montré par les traits interrompus aux figures 1a, 1b et 1c. De préférence, la surface de cette région photosensible 1 a peut être la moitié de la surface de la région à unité de traitement 1 b.To the Figures 1a, 1b and 1c , the photoreceptor integrated circuit 1 is made in a semiconductor substrate, such as a silicon substrate. It comprises in particular a photosensitive region 1a, which comprises several unrepresented photosensitive elements, such as photodiodes, and a processing unit region 1b for processing the electrical signals supplied by the elements of the photosensitive region. The photosensitive region 1a is directly juxtaposed to one side of the treatment unit region 1b as shown by the broken lines at Figures 1a, 1b and 1c . Preferably, the area of this photosensitive region 1a may be half of the area of the treatment unit region 1b.

La région à unité de traitement 1 b comprend toutes les plages de contact 2, 2' du circuit photorécepteur selon l'invention, qui peuvent être reliées électriquement vers l'extérieur. Ces plages de contact peuvent être réparties de manière symétrique dans la région à unité de traitement. Les plages de contact 2 sont par exemple réparties selon deux rangées 3a et 3b en périphérie de deux côtés opposés de la région à unité de traitement 1 b dans le sens de la longueur des deux régions juxtaposées. Dans la figure 1c, il peut être prévu également des plages de contact 2' disposées en périphérie sur un côté de la région à unité de traitement, opposé au côté de liaison des deux régions. Bien entendu, toutes les plages de contact 2 et 2' sont réparties de manière symétrique par rapport à une ligne médiane dans le sens de la longueur du circuit intégré photorécepteur.The region with processing unit 1b comprises all the contact pads 2, 2 'of the photoreceptor circuit according to the invention, which can be electrically connected to the outside. These contact pads can be symmetrically distributed in the processing unit region. The contact pads 2 are for example distributed in two rows 3a and 3b at the periphery of two opposite sides of the treatment unit region 1b in the direction of the length of the two juxtaposed regions. In the figure 1c , there may also be provided contact pads 2 'disposed peripherally on one side of the processing unit region, opposite to the connecting side of the two regions. Of course, all the contact pads 2 and 2 'are distributed symmetrically with respect to a center line in the length direction of the photoreceptor integrated circuit.

Le nombre de plages de contact 2 de chaque rangée est de préférence égal. Les plages de contact 2 de chaque rangée peuvent être régulièrement espacées sur toute la longueur de la région à unité de traitement 1 b comme montré à la figure 1a. II peut être prévu par exemple 18 plages de contact dont 9 plages de contact 2 par rangée 3a, 3b. La largeur de chaque plage de contact peut être de 100 µm, alors que l'espace entre chaque plage d'une même rangée peut être de 200 µm.The number of contact pads 2 of each row is preferably equal. The contact pads 2 of each row may be evenly spaced along the entire length of the treatment unit region 1b as shown in FIG. figure 1a . It can be provided for example 18 contact pads of which 9 contact pads 2 by row 3a, 3b. The width of each contact pad may be 100 μm, while the space between each pad of the same row may be 200 μm.

Bien entendu, d'autres configurations ou agencements desdites plages de contact peuvent être prévus dans la région à unité de traitement pour autant qu'elles soient réparties de manière symétrique dans ladite région 1 b. Elles peuvent par exemple être groupées par paquets régulièrement espacés de chaque côté opposé de la région à unité de traitement comme montré à la figure 1 b. Elles peuvent aussi être agencées en décalage l'une de l'autre sur les deux côtés de la région à unité de traitement 1 b. Cette symétrie de l'agencement des plages peut être nécessaire pour assurer un assemblage fiable du circuit photorécepteur sur un support à circuit imprimé par une technique dénommée "flip chip" en terminologie anglaise.Of course, other configurations or arrangements of said contact pads may be provided in the processing unit region as far as they are symmetrically distributed in said region 1b. They may for example be grouped in regularly spaced packets on each opposite side of the processing unit region as shown in FIG. figure 1 b. They may also be arranged offset from each other on both sides of the processing unit region 1b. This symmetry of the arrangement of the ranges may be necessary to ensure a reliable assembly of the photoreceptor circuit on a printed circuit support by a technique called "flip chip" in English terminology.

A la figure 1c, certaines plages de contact 2 sont réparties sur deux rangées 3a et 3b et groupées par paquets de deux plages de contact 2 par exemple, qui sont régulièrement espacés l'un de l'autre. D'autres plages de contact 2', par exemple deux plages de contact, peuvent être réparties sur le côté de la région à unité de traitement, opposé au côté de liaison des deux régions 1a et 1 b. Toutes les plages de contact 2, 2,' montrées dans cette figure 1c, sont réparties symétriquement par rapport à une ligne médiane dans le sens de la longueur du circuit intégré photorécepteur.To the figure 1c , some contact pads 2 are distributed in two rows 3a and 3b and grouped in packets of two contact pads 2 for example, which are regularly spaced apart from each other. Other contact pads 2 ', for example two contact pads, may be distributed on the side of the processing unit region, opposite to the connecting side of the two regions 1a and 1b. All contact pads 2, 2, 'shown in this figure 1c , are distributed symmetrically with respect to a center line in the length direction of the photoreceptor integrated circuit.

Pour un montage par la technique "flip chip", le circuit intégré photorécepteur 1 peut comprendre des bosses métalliques 6 réalisées sur les plages de contact 2 comme montré en figure 2. Les plages de contact 2 sont réalisées de manière traditionnelle sur le substrat semi-conducteur 4. Des ouvertures dans la couche de passivation finale 5 déposée sur le substrat 4 sont prévues pour donner accès à chaque plage de contact 2 du circuit intégré photorécepteur 1. Les bosses métalliques 6 sont donc réalisées à travers les ouvertures de la couche de passivation 5 depuis chaque plage de contact 2 pour dépasser de la surface supérieure de ladite couche de passivation.For mounting by the "flip chip" technique, the photoreceptor integrated circuit 1 may comprise metal bumps 6 made on the contact pads 2 as shown in FIG. figure 2 . The contact pads 2 are conventionally formed on the semiconductor substrate 4. Apertures in the final passivation layer 5 deposited on the substrate 4 are provided to give access to each contact pad 2 of the photoreceptor integrated circuit 1. Metal bumps 6 are thus made through the openings of the passivation layer 5 from each contact pad 2 to protrude from the upper surface of said passivation layer.

La figure 3 montre une vue tridimensionnelle d'une première forme d'exécution d'un composant optoélectronique. Ce composant optoélectronique comprend sur une première face d'un substrat 10, qui peut être de préférence flexible, un circuit intégré photorécepteur susceptible de capter de la lumière générée par exemple par une source de lumière non représentée. Le circuit photorécepteur comprend donc une région photosensible 1a et une région à unité de traitement 1 b selon la forme d'exécution décrite en référence à la figure 1 a par exemple.The figure 3 shows a three-dimensional view of a first embodiment of an optoelectronic component. This optoelectronic component comprises on a first face of a substrate 10, which may preferably be flexible, a photoreceptor integrated circuit capable of capturing light generated for example by a not shown light source. The photoreceptor circuit therefore comprises a photosensitive region 1a and a treatment unit region 1b according to the embodiment described with reference to FIG. figure 1 for example.

Ce circuit photorécepteur est monté sur une première portion 10a du substrat flexible 10 par une technique "flip chip". Pour ce faire, des plages de contact 2 du circuit photorécepteur, qui comprennent des bosses métalliques comme montré à la figure 2, sont électriquement connectées sur des plages de connexion correspondantes 12 de la première portion du substrat 10. Les plages de connexion sont disposées selon un même arrangement et positionnement que les bosses métalliques de la région à unité de traitement 1 b du circuit selon deux rangées.This photoreceptor circuit is mounted on a first portion 10a of the flexible substrate 10 by a "flip chip" technique. To do this, contact areas 2 of the photoreceptor circuit, which include metal bumps as shown in FIG. figure 2 are electrically connected to corresponding connection pads 12 of the first portion of the substrate 10. The connection pads are arranged in the same arrangement and positioning as the metal bumps of the treatment unit region 1b of the circuit in two rows.

La connexion électrique entre les bosses métalliques et les plages de connexion du substrat 10 est effectuée par thermocompression ou à l'aide d'une colle anisotropique en appliquant une force F au dos de la région à unité de traitement 1 b du circuit photorécepteur. Grâce à l'agencement symétrique des plages de contact 2 avec les bosses métalliques du côté de la région à unité de traitement 1 b, la pression de contact due à la force F appliquée au dos du circuit photorécepteur est répartie uniformément sans contraintes mécaniques du côté de la région photosensible 1a. Cette région photosensible est donc laissée libre comme flottante sur un côté de la région à unité de traitement.The electrical connection between the metal bumps and the connection pads of the substrate 10 is effected by thermocompression or with the aid of an anisotropic adhesive by applying a force F to the back of the treatment unit 1b region of the photoreceptor circuit. Thanks to the symmetrical arrangement of the contact pads 2 with the metal bumps on the side of the treatment unit region 1b, the contact pressure due to the force F applied to the back of the photoreceptor circuit is distributed uniformly without mechanical stresses on the side. of the photosensitive region 1a. This photosensitive region is thus left free floating on one side of the treatment unit region.

Le substrat flexible 10 comprend en plus de la première portion, une seconde portion terminale 10b, qui porte des bornes de connexion électrique 11, et une portion de liaison 10c entre les première et seconde portions 10a et 10b. Le substrat flexible 10 est sous la forme d'une feuille flexible dont l'épaisseur peut être de l'ordre de 75 µm. Des pistes conductrices 13, disposées sur une face ou l'autre de chaque portion du substrat flexible 10, permettent de relier certaines plages de connexion 12 aux bornes de connexion 11. Une ouverture traversante 14 est également prévue dans la première portion 10a en regard uniquement de la région photosensible 1a du circuit photorécepteur, étant donné que ledit circuit est monté par la technique "flip chip" sur ledit substrat. L'ouverture 14 permet à la région photosensible de capter de la lumière directement d'une source de lumière ou par réflexion sur une surface de travail.The flexible substrate 10 further comprises the first portion, a second terminal portion 10b, which carries electrical connection terminals 11, and a connecting portion 10c between the first and second portions 10a and 10b. The flexible substrate 10 is in the form of a flexible sheet whose thickness may be of the order of 75 microns. Conductive tracks 13, arranged on one side or the other of each portion of the flexible substrate 10, make it possible to connect certain connection pads 12 to the connection terminals 11. A through opening 14 is also provided in the first portion 10a facing only of the photosensitive region 1a of the photoreceptor circuit, since said circuit is flip chip-mounted on said substrate. The aperture 14 allows the photosensitive region to capture light directly from a light source or by reflection on a work surface.

Une encapsulation non représentée d'au moins la région à unité de traitement 1 b peut être prévue pour abriter cette région de la lumière et pour rigidifier la première portion du substrat flexible, tout en laissant libre et sans contraintes mécaniques la région photosensible 1a. Ceci permet de réaliser un composant optoélectronique de petite dimension. De plus grâce au substrat flexible avec une portion de liaison 10c, cela permet un ajustement de la seconde portion 10b de connexion électrique du composant par rapport à la première portion 10a portant le circuit photorécepteur.A not shown encapsulation of at least the processing unit region 1b may be provided to house this region of the light and to stiffen the first portion of the flexible substrate, while leaving free and without mechanical stresses the photosensitive region 1a. This makes it possible to produce a small optoelectronic component. Moreover thanks to the flexible substrate with a connecting portion 10c, this allows adjustment of the second portion 10b of electrical connection of the component relative to the first portion 10a carrying the photoreceptor circuit.

La figure 4 représente une vue tridimensionnelle d'une seconde forme d'exécution du composant optoélectronique. Ce composant optoélectronique comprend un circuit photorécepteur monté sur une première portion 10a d'un substrat flexible 10. Le circuit photorécepteur peut être de la forme d'exécution décrite en référence à la figure 1a par exemple. Ledit substrat comprend comme pour la première forme d'exécution, une seconde portion 10b, qui porte des bornes de connexion électrique 11, et une portion de liaison 10c entre les première et seconde portions. Le circuit photorécepteur comprend une région photosensible 1a et une région à unité de traitement 1 b.The figure 4 represents a three-dimensional view of a second embodiment of the optoelectronic component. This optoelectronic component comprises a photoreceptor circuit mounted on a first portion 10a of a flexible substrate 10. The photoreceptor circuit may be of the embodiment described with reference to FIG. figure 1a for example. Said substrate comprises as for the first embodiment, a second portion 10b, which carries electrical connection terminals 11, and a connecting portion 10c between the first and second portions. The photoreceptor circuit comprises a photosensitive region 1a and a region with a treatment unit 1b.

A la différence de la première forme d'exécution, le dos du circuit photorécepteur est fixé sur une face de la première portion 10a du substrat flexible 10. La surface de réception de la région photosensible 1a est donc opposée à la face de fixation du circuit photorécepteur sur la première portion du substrat 10. De ce fait, il n'est pas prévu d'ouverture traversante dans cette première portion 10a.Unlike the first embodiment, the back of the photoreceptor circuit is fixed on one face of the first portion 10a of the flexible substrate 10. The receiving surface of the photosensitive region 1a is therefore opposite to the fixing face of the circuit photoreceptor on the first portion of the substrate 10. As a result, there is no opening through this first portion 10a.

La première portion 10a du substrat 10 comprend deux rangées de plages de connexion 12 disposées chacune de deux côtés opposés de la région à unité de traitement 1b uniquement. Ces plages de connexion 12 peuvent être arrangées de la même manière que les plages de contact 2 de la région à unité de traitement 1 b. La connexion électrique des plages de contact 2 est effectuée dans cette seconde forme d'exécution par des fils métalliques 15, tels que des fils en aluminium, aux plages de connexion correspondantes 12 de la première portion 10a du substrat 10. Ces plages de connexion 12 sont reliées à des pistes conductrices 13, de préférence métalliques, qui sont disposées sur une face ou l'autre du substrat. Les pistes conductrices relient ainsi les plages de connexion 12 aux bornes de connexion 11 placées sur la seconde portion 10b du substrat.The first portion 10a of the substrate 10 comprises two rows of connection pads 12 each disposed on two opposite sides of the processing unit region 1b only. These connection pads 12 can be arranged in the same way as the contact pads 2 of the processing unit region 1b. The electrical connection of the contact pads 2 is carried out in this second embodiment by metal wires 15, such as aluminum wires, to the corresponding connection pads 12 of the first portion 10a of the substrate 10. These connection pads 12 are connected to conductive tracks 13, preferably metal, which are arranged on one side or the other of the substrate. The conductive tracks thus connect the connection pads 12 to the connection terminals 11 placed on the second portion 10b of the substrate.

Comme précédemment, il peut être envisagé de n'encapsuler que la région photosensible, soit par de la résine, soit par un couvercle isolant opaque non représenté. Ceci permet de laisser libre la région photosensible 1 a sans contraintes mécaniques durant tout le procédé de réalisation du composant optoélectronique.As before, it can be envisaged to encapsulate only the photosensitive region, either by resin or by an opaque insulating cover not shown. This makes it possible to leave the photosensitive region 1a free without mechanical stresses during the entire process for producing the optoelectronic component.

Un tel composant optoélectronique peut être utilisé dans tout type d'instrument électronique, tel qu'une souris d'ordinateur à fonctionnement optique. Dans ce cas, la première portion du substrat avec le circuit photorécepteur et éventuellement encore un circuit source de lumière, qui sont protégés par un couvercle, est montée sur un bloc transparent à lentille fixé sur une ouverture du fond du boîtier de la souris. Les bornes de connexion de la seconde portion du substrat sont reliées directement à une carte mère distante du fond du boîtier à l'intérieur de la souris.Such an optoelectronic component can be used in any type of electronic instrument, such as an optically operating computer mouse. In this case, the first portion of the substrate with the photoreceptor circuit and possibly a light source circuit, which are protected by a cover, is mounted on a transparent lens block attached to an opening in the bottom of the mouse housing. The connection terminals of the second portion of the substrate are connected directly to a motherboard remote from the bottom of the housing inside the mouse.

Les plages de contact du circuit photorécepteur peuvent être agencées différemment, mais symétriquement dans la région à unité de traitement.The contact pads of the photoreceptor circuit may be arranged differently, but symmetrically in the processing unit region.

Claims (9)

  1. Integrated photoreceptor circuit (1) including a photosensitive area (1a) with several adjacent photosensitive elements for picking up light and a processing unit area (1 b) for processing the signals supplied by the photosensitive elements of the photosensitive area, electric contact pads (2, 2') being arranged solely on the side of the processing unit area (1 b), which is juxtaposed with the photosensitive area (1 a), characterized in that the contact pads are arranged symmetrically in the processing unit area, and in that at least some contact pads (2) are distributed in two rows (3a, 3b) at the periphery of the two opposite sides of the processing unit area (1 b), arranged along the length of the two juxtaposed areas.
  2. Integrated photoreceptor circuit (1) according to claim 1, characterized in that all of the contact pads (2) are distributed in the two rows in equal numbers in each row (3a, 3b).
  3. Integrated photoreceptor circuit (1) according to claim 1, characterized in that the contact pads (2) of each row are uniformly distributed and regularly spaced from each other over the entire length of each opposite side of the processing unit area (1 b).
  4. Integrated photoreceptor circuit (1) according to claim 1, characterized in that the contact pads (2) of each row are grouped to define packets of contact pads, which are uniformly distributed and regularly spaced from each other over the entire length of each opposite side of the processing unit area (1 b).
  5. Integrated photoreceptor circuit (1) according to claim 1, characterized in that first contact pads (2) distributed in the two rows (3a and 3b) are grouped in packets of contact pads, which are regularly spaced from each other, and in that second contact pads (2') are arranged on one side of the processing unit area, opposite a side connecting the two areas (1 a, 1 b), the first and second contact pads being symmetrically distributed relative to a median line along the length of the integrated photoreceptor circuit.
  6. Integrated photoreceptor circuit (1) according to any of the preceding claims, characterized in that metal bumps (6) are made above the contact pads (2, 2') of the photoreceptor circuit to project from a passivation layer (5) on the semiconductor substrate (4) of the photoreceptor circuit (4).
  7. Optoelectronic component including an integrated photoreceptor circuit (1) according to any of the preceding claims, the component including a flexible printed circuit substrate (10) on which the photoreceptor circuit (1) is mounted and electrically connected, characterized in that the integrated photoreceptor circuit includes metal bumps (6) on the contact pads (2, 2'), which are connected, by means of an assembly force of the circuit on the substrate, applied solely to the back of the processing unit area, to electrical connection pads (12) of a first portion (10a) of said substrate (10) having the same arrangement and position as the metal bumps (6) of the integrated photoreceptor circuit.
  8. Optoelectronic component according to claim 7, characterized in that the flexible substrate (10) includes a second portion (10b), which carries electrical connection terminals (11), and a connecting portion (10c) between the first and second portions (10a, 10b), conductive paths (13) arranged on a first face and/or a second face of each portion of the flexible substrate (10), connecting certain connection pads (12) to the connection terminals (11).
  9. Optoelectronic component according to claim 7, characterized in that a through aperture (14) is provided in the first portion (10a) opposite the photosensitive area (1 b) only of the photoreceptor circuit.
EP08151943.1A 2007-03-21 2008-02-26 Photoreceptor integrated circuit and optoelectronic component comprising the photoreceptor integrated circuit Active EP1973166B1 (en)

Applications Claiming Priority (1)

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EP1973166A3 EP1973166A3 (en) 2011-05-04
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CN107819981A (en) * 2017-09-27 2018-03-20 京东方科技集团股份有限公司 It is imaged backboard, imaging device and electronic equipment

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JPS5136343B2 (en) * 1972-05-26 1976-10-07
JPS5846071B2 (en) 1979-06-28 1983-10-14 横河電機株式会社 semiconductor integrated device
JPH0697510A (en) 1992-09-11 1994-04-08 Toshiba Corp Small-sized optical semiconductor device
US5865935A (en) * 1995-02-02 1999-02-02 Eastman Kodak Company Method of packaging image sensors
JP3320335B2 (en) * 1997-05-30 2002-09-03 キヤノン株式会社 Photoelectric conversion device and contact image sensor
JP4192335B2 (en) * 1999-05-24 2008-12-10 株式会社デンソー Optical sensor IC and inspection method thereof
KR100718421B1 (en) * 2002-06-28 2007-05-14 교세라 가부시키가이샤 Imaging device package, camera module and camera module producing method
TWI225696B (en) 2003-06-10 2004-12-21 Advanced Semiconductor Eng Semiconductor package and method for manufacturing the same
JP4542768B2 (en) * 2003-11-25 2010-09-15 富士フイルム株式会社 Solid-state imaging device and manufacturing method thereof
TWI244174B (en) * 2003-12-31 2005-11-21 Siliconware Precision Industries Co Ltd Photosensitive semiconductor package and method for fabricating the same
JP3857694B2 (en) 2004-02-05 2006-12-13 ローム株式会社 Optical communication module
CN2760758Y (en) * 2004-12-16 2006-02-22 力捷电脑(中国)有限公司 Chip soft board connecting structure of CMOS image sensor
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TWI449182B (en) 2014-08-11
TW200903815A (en) 2009-01-16
EP1973166A3 (en) 2011-05-04
US7579579B2 (en) 2009-08-25
US20080230679A1 (en) 2008-09-25
CN101271906A (en) 2008-09-24
CN101271906B (en) 2012-10-31
EP1973166A2 (en) 2008-09-24

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