EP1969536A1 - Identity document having a chip - Google Patents
Identity document having a chipInfo
- Publication number
- EP1969536A1 EP1969536A1 EP07709149A EP07709149A EP1969536A1 EP 1969536 A1 EP1969536 A1 EP 1969536A1 EP 07709149 A EP07709149 A EP 07709149A EP 07709149 A EP07709149 A EP 07709149A EP 1969536 A1 EP1969536 A1 EP 1969536A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- chip
- auxiliary layer
- auxiliary
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to an identity document comprising a support, such as a page or a card, provided with a chip and an antenna, said support comprising a number of layers of plastic material laminated to each other, a first layer of plastic material being provided adjoining one side of said chip, on said first layer a second layer of plastic material is provided on the side away from said chip, an auxiliary layer being provided between said first and second plastic layers extending over a limited part of the extension of said support.
- An identity document of this type may be an identity card, a bank card, credit card, driving license or part of a passport.
- a chip is accommodated therein, inter alia, for holding the personal data which, if required, may be compared to personal data provided in another manner on the identity document, such as a photograph, fingerprint and the like.
- the support can be arranged around the chip in a simple manner. It is also important that such an identity document has sufficient mechanical properties and a sufficiently long service life. In addition, such an identity document has to be simple to produce against limited cost.
- a further condition which is sometimes set is that it has to be possible to write the plastic material used for the support by means of a laser, i.e. it has to be possible to transform certain parts of the plastic material by means of a laser in such a manner that its appearance changes, for example is colored black as a result of carbonization.
- PC polycarbonate
- ABS acrylonitrile butadiene styrene
- PVC polyvinyl chloride
- PET polyester
- EP 1 227435 A2 discloses a chip card in which a metal foil is provided under the battery incorporated therein in order to prevent damage.
- US 2005/093172 discloses a reinforcing plate arranged above a chip.
- US 6,765,286 describes a system with a chip against which a layer is positioned, followed by a reinforcing layer consisting of metal.
- auxiliary layer is made from a thermoplastic elastomer which comprises a material which is rubber-like at room temperature.
- This auxiliary layer preferably consists of a plastic material which can absorb differences in shrinking stresses.
- this auxiliary layer consists of a thermoplastic elastomer and more particularly of a material which is rubber-like at room temperature.
- the presence of such an auxiliary layer makes it virtually impossible that any cracks starting in the first layer continue into the second layer. Since such cracks reach the auxiliary layer, local stresses are distributed over the entire surface area of the auxiliary layer as a result of the elastomer/rubber-like nature thereof, thus considerably limiting the risk of the pressure limit being exceeded. As a result, the cracks will not continue into the second layer which is furthest from the chip, so that the support remains sealed with respect to the environment, so that this second layer remains sealed.
- the auxiliary layer has a much larger coefficient of expansion than the plastic material of the support or, as a result of intrinsic, temperature-dependent chemical or physical changes, exhibits a relatively large amount of shrinkage in the relevant temperature range.
- the shrinkage of the above-described material during cooling from manufacturing temperature to ambient temperature is greater than that of the plastic material of the support. More particularly, this coefficient of expansion is at least twice that of the plastic material of the support and more particularly greater than 1.10 "4 1/°C.
- Examples of such a material are polyurethane grades, rubber grades, such as isoprene and butyl rubber, acrylates, vinyl acetates (EVA) and combinations thereof, as well as epoxy grades.
- the thickness of the auxiliary layer may be relatively small.
- the auxiliary layer may be applied in any way imaginable on either the first or the second layer. However, it is preferably applied on the second layer. According to a preferred embodiment of the invention, application is carried out by means of screen printing. Other printing techniques or application techniques, such as on film/foil, are possible.
- the material used for the screen printing may be solvent-based, such as a water-based system. However, it is also possible to use two-component systems or radiation-curable systems, such as UV/electron beam- curable systems.
- the first layer preferably has a thickness of approximately 50 ⁇ m, whereas the second layer has a total thickness (including an optional further layer) of approximately 200 ⁇ m.
- the second layer is preferably colored and more particularly white, so that any crack formation in the first layer is not visible.
- the above-described warping problem occurs mainly when the chip either has a nonsymmetrical shape or is not positioned symmetrically in the support, i.e. at equal distances from the top and bottom thereof. It has been observed that when such an auxiliary layer is used, the identity document is substantially flat, even at the position of the chip, i.e. the abovementioned symptoms of an elevation from the surface of the support no longer occur. In addition, no crack formation has been observed in the second layer, not even in tests which simulated a relatively long service life of the identity document.
- an additional auxiliary layer is present.
- the latter is provided on the side of the chip turned away from the side on which the above-described auxiliary layer is provided.
- This additional auxiliary layer may be provided directly adjoining the chip or at some distance, subject to the interposition of another layer.
- the dimensions of this additional layer are preferably at least equal to the dimensions of the chip in situ and preferably greater. More particularly, the dimensions of this additional auxiliary layer are greater than the greatest dimension of the chip.
- Such an additional auxiliary layer may be made from the same material as described above for the auxiliary layer.
- the invention also relates to a method for producing an identity document comprising providing a first continuous plastic layer and a second continuous plastic layer and a third layer provided with an opening, wherein said these layers are laminated together when a chip is accommodated in this opening, an auxiliary layer being provided between this first and second layer.
- the production of the identity document comprises laminating a number of plastic sheets.
- one or more plastic sheets may be provided with an opening for arranging the chip therein.
- this first layer, third layer and additional layer are provided during the accommodation of this chip and the subsequent lamination of these other layers.
- Fig. 1 diagrammatically shows a perspective view of a first embodiment of an identity document or part thereof
- Fig. 2 shows the various parts from which the identity document according to Fig. 1 is produced;
- Fig. 3 shows a detail of this identity document at the position of the chip
- FIG. 4 in a structure corresponding to that from Fig. 2, shows a further embodiment of an identity document
- Fig. 5 shows a detail of this second embodiment according to Fig. 3.
- an identity document is denoted by reference numeral 1.
- This may be any (bank) card, credit card, driving license or part of a passport, such as a holder page.
- This consists of a plastic support material 2 on or in which, for example, a photograph 3 of the owner or another biometrical feature and further data of the lawful holder are provided.
- a completely encapsulated chip with antenna 4 is provided.
- the former contains further data of the holder and can be read remotely.
- Fig. 2 shows how such an identity document according to the invention can be produced.
- Fig. 2 describes this by means of a laminating process. However, it should be understood that it is also possible to use other processes, such as injection-molding, with the present invention.
- a layer 5 is provided which is continuous.
- a subsequent layer 6 having a relatively small opening 7 is present.
- a layer 8 having a relatively large opening 9 is present while a first layer 18 is provided which is continuous.
- First layer 18 adjoins the part of the chip with the largest dimension.
- Adjoining layer 18, a second layer 13 is provided.
- mis second layer 13 is provided with an auxiliary layer 14 consisting of a rubber-like material.
- the elastomeric auxiliary layer preferably consists of a rubber-like polyurethane layer.
- the auxiliary layer 14 is applied to the second layer 13 by means of screen printing.
- the thickness of layer 13 is approximately 100 ⁇ m, whereas the thickness of the auxiliary layer is between 10 and 15 ⁇ m.
- a chip 10 is also present. This chip has a relatively large top part and a slightly smaller bottom part. This is the result of the protrusions of the lead frame and the epoxy encapsulation used.
- thermal stresses will occur due to the difference in thermal coefficient of expansion between the support material 2 and the chip 10. Due to either the asymmetrical shape of the chip or the fact that the chip has not been positioned at equal distances from the top and bottom of the support, these stresses may lead to protuberances, warping and possibly cracking.
- auxiliary layer 14 By providing an auxiliary layer 14 according to the present invention, these stresses are absorbed to such an extent that warping and/or cracking hardly occur anymore. If, under certain circumstances, such stresses become so great that they exceed the strength of the first layer 18, these stresses will lead to the formation of cracks in layer 18. However, due to the presence of the auxiliary layer 14, such stresses will never be transmitted to the second layer 13 with the same stress concentrations. After all, as a result of the presence of the auxiliary layer 14, any stress peaks which occur inside first layer 18 will be absorbed and distributed over the entire surface area thereof. This is due to the elastomeric properties of the auxiliary layer. This prevents the second layer 13 from being subjected to stresses which are so high that they would lead to crack formation in the latter as well.
- the total thickness of the card may be approximately 800 ⁇ m.
- the thickness of layer 5 may be approximately 225 ⁇ m.
- the layer 8 may have a thickness of 100 ⁇ m, while the layer 6 has a thickness of 250 ⁇ m.
- the thickness of layer 13 is preferably at least approximately 100 ⁇ m, while the first layer 18 has a thickness of approximately 50 ⁇ m. It will be understood that the ratio between the thickness of layers 13 and 18 may vary depending on the desired properties.
- Figs. 4, 5 show a further variant of the invention. Parts which are similar to those of the previous embodiment are denoted by the same reference numerals increased by 20.
- This variant differs from the variant described earlier in that an additional auxiliary layer 44 is present.
- the latter directly adjoins the chip 30, but it is also readily possible for it to be positioned at a small distance therefrom by the interposition of a layer.
- This additional auxiliary layer 44 is situated on the side of the chip turned away from the side of the chip on which the auxiliary layer 34 is provided.
- the extension of the additional auxiliary layer 44 is greater than the dimensions of the chip in situ and more preferably greater than the dimensions of the chip 30 in general.
- This layer 44 is preferably made from the same material as the first auxiliary layer.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1030865A NL1030865C2 (en) | 2006-01-06 | 2006-01-06 | Identity document with chip. |
PCT/NL2007/050001 WO2007089140A1 (en) | 2006-01-06 | 2007-01-05 | Identity document having a chip |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1969536A1 true EP1969536A1 (en) | 2008-09-17 |
Family
ID=36928227
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07709149A Withdrawn EP1969536A1 (en) | 2006-01-06 | 2007-01-05 | Identity document having a chip |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1969536A1 (en) |
NL (1) | NL1030865C2 (en) |
WO (1) | WO2007089140A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2550013T3 (en) | 2008-05-06 | 2015-11-03 | Hid Global Gmbh | Functional laminate |
DE102009012255A1 (en) | 2009-03-07 | 2010-09-09 | Michalk, Manfred, Dr. | circuitry |
DE102009043587A1 (en) | 2009-09-30 | 2011-05-19 | Smartrac Ip B.V. | Functional laminate |
DE102010025774A1 (en) | 2010-07-01 | 2012-01-05 | Giesecke & Devrient Gmbh | Method of making an inlay for a portable data carrier and inlay |
EP2461275A1 (en) * | 2010-12-02 | 2012-06-06 | Gemalto SA | Security Document and method of manufacturing security document |
FR3000822A1 (en) * | 2013-01-08 | 2014-07-11 | Ask Sa | RADIOFREQUENCY PLASTIC DEVICE FOR NON-CONTACT CHIP CARD OR NON-CONTACT SAFETY OR VALUE DOCUMENT AND METHOD OF MANUFACTURING THE SAME TO PREVENT CRACKS |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1717731A1 (en) * | 2005-04-28 | 2006-11-02 | Hitachi, Ltd. | Radio frequency IC tag and method for manufacturing same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01108095A (en) * | 1987-10-20 | 1989-04-25 | Ryoden Kasei Co Ltd | Ic card |
SG80077A1 (en) * | 1998-10-19 | 2001-04-17 | Sony Corp | Semiconductor integrated circuit card manufacturing method, and semiconductor integrated circuit card |
DE10102125A1 (en) * | 2001-01-18 | 2002-07-25 | Varta Geraetebatterie Gmbh | Thin electronic chip card used as a credit card or telephone card has a high strength film made from metal or fiber-reinforced plastic arranged between outer covering films and an energy storage device |
JP4479209B2 (en) * | 2003-10-10 | 2010-06-09 | パナソニック株式会社 | Electronic circuit device, method for manufacturing the same, and apparatus for manufacturing electronic circuit device |
US7259678B2 (en) * | 2003-12-08 | 2007-08-21 | 3M Innovative Properties Company | Durable radio frequency identification label and methods of manufacturing the same |
-
2006
- 2006-01-06 NL NL1030865A patent/NL1030865C2/en active Search and Examination
-
2007
- 2007-01-05 EP EP07709149A patent/EP1969536A1/en not_active Withdrawn
- 2007-01-05 WO PCT/NL2007/050001 patent/WO2007089140A1/en active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1717731A1 (en) * | 2005-04-28 | 2006-11-02 | Hitachi, Ltd. | Radio frequency IC tag and method for manufacturing same |
Non-Patent Citations (1)
Title |
---|
See also references of WO2007089140A1 * |
Also Published As
Publication number | Publication date |
---|---|
NL1030865C2 (en) | 2007-07-09 |
WO2007089140A1 (en) | 2007-08-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2007089140A1 (en) | Identity document having a chip | |
CN1193900C (en) | Laminated multi-layer card with an inlaid security element in the form of relief structure | |
AU2005329469B2 (en) | Method for making Advanced Smart Cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces | |
US20080282540A1 (en) | Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces | |
EP1842689B1 (en) | Thermally stable proximity indentifaction card | |
CA2555821A1 (en) | Tamper-proof, color-shift security feature | |
CN107408216A (en) | Valuable or secure file with electronic circuit and for manufacturing valuable or secure file method | |
JP4676899B2 (en) | Method of incorporating IC tag into concrete structure and IC tag structure of concrete formwork | |
EP1934892B1 (en) | Identity document comprising a chip | |
US9858522B2 (en) | Security document and method of manufacturing security document | |
US20080252067A1 (en) | Security Marking System | |
US9783135B2 (en) | Number plate preferably motor vehicle number plate and method for production thereof | |
JP5205938B2 (en) | Information recording medium | |
EP2585310B1 (en) | A security document and a manufacturing method | |
JP5167629B2 (en) | Method for manufacturing IC card having magnetic recording layer | |
US20100295288A1 (en) | Printed identification document and process for printing such a document | |
JP2002298103A (en) | Contactless ic card and manufacturing method thereof | |
JP2002352210A (en) | Substrate for ic card, and ic card | |
PT1231076E (en) | Laminated structure | |
JP2001126041A (en) | Manufacturing method of magnetic card | |
JP2004009564A (en) | Card and its producing process | |
WO2011161224A1 (en) | A security document and a manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20080630 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
17Q | First examination report despatched |
Effective date: 20081030 |
|
DAX | Request for extension of the european patent (deleted) | ||
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: MORPHO B.V. |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: MORPHO B.V. |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20160126 |
|
GRAJ | Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted |
Free format text: ORIGINAL CODE: EPIDOSDIGR1 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
INTG | Intention to grant announced |
Effective date: 20160318 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20160729 |