EP1926354B1 - Thermally conductive bus, in particular for a calculation unit with a microprocessor - Google Patents
Thermally conductive bus, in particular for a calculation unit with a microprocessor Download PDFInfo
- Publication number
- EP1926354B1 EP1926354B1 EP07022447A EP07022447A EP1926354B1 EP 1926354 B1 EP1926354 B1 EP 1926354B1 EP 07022447 A EP07022447 A EP 07022447A EP 07022447 A EP07022447 A EP 07022447A EP 1926354 B1 EP1926354 B1 EP 1926354B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- strip
- tab
- collector
- tabs
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 210000002105 tongue Anatomy 0.000 description 27
- 238000005219 brazing Methods 0.000 description 13
- 238000005476 soldering Methods 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 5
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000009897 systematic effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10037—Printed or non-printed battery
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
Definitions
- the invention relates to a thermal conduction bus, in particular for a microprocessor computing unit.
- the invention relates to a thermal conduction bus comprising, in one piece, a thermally conductive strip having a plurality of solder connection tongues to connection pads of electronic components that may heat up. , and a collector secured to the bar and arranged to channel and evacuate the thermal energy drained by the tabs and passing through the bar.
- Such buses are particularly used in the automotive field as "radiators" for the evacuation of the thermal energy provided by the electronic components of printed circuits.
- the invention aims to overcome this drawback, and its main objective is to provide a very economical solution for obtaining the same thermal gradient in all the tongues of a thermal conduction bus, and thus leading to a uniform quality of the solders of the said tongues regardless of their position relative to the heat collector.
- the present invention aims to allow tongues connected to a heat collector to warm up quickly during soldering and not to heat up during normal operation of the heat bus.
- the invention aims a heat conduction bus of the type described in the preamble above, further comprising, at least next to each of the tabs geometrically closest to the collector, a light formed in the bar to proximity of the tongue, so as to be interposed between said tongue and the collector and to form an obstacle opposing the direct path of the thermal energy between the tongue and said collector.
- each light consists of a slot having at least one longitudinal axis orthogonal to the tongue.
- each of these slots is advantageously arranged at a distance from the corresponding edge of the bar adapted to delimit, with respect to said edge, a strip of material of minimum width calculated to ensure the mechanical strength of the bar.
- the conduction bus comprises a tongue formed in the extension of an angle of the bar
- the corresponding slot advantageously has the shape of a V whose two branches extend parallel to the edges of the bar defining the angle in which is formed the tongue.
- FIG. 1 is a perspective view of a thermal conduction bus according to the invention.
- the thermal conduction bus according to the invention represented by way of example at the figure 1 is intended to be connected to a motor vehicle battery in order to ensure, on the one hand, the power supply of electronic components, in particular of a microprocessor-based computing unit, and, on the other hand, the evacuation of the thermal energy produced by these components.
- this bus comprises a bar 1 formed of a substantially flat plate having a generally parallelepipedal shape defined in particular by two parallel longitudinal edges 1a and 1b.
- This bus further comprises a plurality of connecting tongues 7 to 12 having the general shape of teeth extending perpendicularly with respect to the other longitudinal edge 1b of the bar 1, two of said teeth, in particular being positioned each at one of the ends of said longitudinal edge.
- the bar 1 is finally pierced, facing each of the tabs geometrically closest to the collector 4, in the example the tongues 11 and 12 disposed on either side of the collector 4, a light 13, 14 formed near the said tongue, so as to be interposed between the latter and the collector 4, and to form an obstacle opposing the direct path of the thermal energy between the tongue 11, 12 and the said collector.
- the corresponding slot 14 has, in turn, the shape of an L whose two branches 14a , 14b extend parallel to the edges of the bar 1 defining said angle.
- These simple slots 13, 14 have the function of opposing the propagation of heat for a very short time advantageously determined to correspond to the time required by the soldering operation.
- they make it possible to standardize the parameters of the brazing operation (preheating time and temperature, brazing time, etc.) required to guarantee correct brazing for each of the tongues.
- the lights 13, 14 according to the invention make it possible to confine the heat due to the brazing operation in each tongue at the time of soldering, without however preventing the propagation of this heat towards the collector when need to use the heat bus as a radiator. These lights therefore make it possible to perform a dual function (a priori contradictory) namely to confine the heat when the tongue is subjected to a rapid rise in temperature and dissipate this heat when the tab is subjected to a temperature rise of long duration.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Connection Or Junction Boxes (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Fuses (AREA)
Description
L'invention concerne un bus de conduction thermique, notamment pour unité de calcul à microprocesseur.The invention relates to a thermal conduction bus, in particular for a microprocessor computing unit.
De façon plus spécifique, l'invention vise un bus de conduction thermique comprenant, d'un seul tenant, une barrette thermiquement conductrice dotée d'une pluralité de languettes de connexion par brasage à des plots de connexion de composants électroniques susceptibles de s'échauffer, et un collecteur solidaire de la barrette et disposé de façon à canaliser et évacuer l'énergie thermique drainée par les languettes et transitant par la barrette.More specifically, the invention relates to a thermal conduction bus comprising, in one piece, a thermally conductive strip having a plurality of solder connection tongues to connection pads of electronic components that may heat up. , and a collector secured to the bar and arranged to channel and evacuate the thermal energy drained by the tabs and passing through the bar.
De tels bus sont notamment utilisés dans le domaine automobile en tant que « radiateurs » pour l'évacuation de l'énergie thermique fournie par les composants électroniques de circuits imprimés.Such buses are particularly used in the automotive field as "radiators" for the evacuation of the thermal energy provided by the electronic components of printed circuits.
Un des principaux obstacles rencontrés avec de tels bus réside dans le fait que, lors de l'opération de brasage, il est très difficile de trouver un compromis concernant les paramètres de cette opération de brasage (temps et température de préchauffage, temps de brasage..) garantissant une brasure correcte pour chacune des languettes.One of the main obstacles encountered with such buses lies in the fact that, during the soldering operation, it is very difficult to find a compromise concerning the parameters of this soldering operation (preheating time and temperature, soldering time. .) guaranteeing a correct solder for each of the tabs.
En effet, ces paramètres sont identiques pour l'ensemble des languettes alors qu'ils devraient, de façon optimale mais non réalisable dans la pratique, être adaptés à chaque languette pour prendre en compte les différences de positionnement de ces dernières par rapport au collecteur, qui conditionnent les paramètres de la propagation de l'énergie thermique vers le dit collecteur. En effet, lorsque l'on élève la température d'une languette située à proximité du collecteur, pour la braser, il est difficile de l'amener rapidement à la température de brasage requise car la chaleur se disperse vers le collecteur et s'évacue. Ceci est d'ailleurs tout à fait normal, puisque le collecteur assure, en condition normale d'utilisation l'évacuation de la chaleur. Par contre, pendant le brasage des languettes on aimerait que le collecteur n'assure pas cette fonction d'évacuation de la chaleur de sorte que les languettes puissent rapidement atteindre leur température de brasage quelle que soit leur position par rapport au collecteur.Indeed, these parameters are identical for all the tongues when they should, optimally but not practically feasible, be adapted to each tab to take into account the differences in positioning of the latter with respect to the collector, which condition the parameters of the propagation of thermal energy towards the said collector. Indeed, when the temperature of a tab near the collector is raised, for brazing, it is difficult to bring it quickly to the required brazing temperature because the heat is dispersed to the collector and is evacuated . This is also quite normal, since the collector ensures, under normal conditions of use, the evacuation of heat. On the other hand, during the brazing of the tongues it would be desirable for the collector not to provide this heat removal function so that the tongues can quickly reach their brazing temperature irrespective of their position relative to the collector.
On connaît de la technique antérieure, des bus optimisés pour l'évacuation de l'énergie thermique
Dans la pratique, à l'heure actuelle, il s'avère que ces difficultés ont fréquemment pour conséquences directes la mise en oeuvre de conditions de brasage (notamment temps de préchauffage) ne permettant pas de garantir un brasage correct systématique des languettes les plus proches du collecteur.In practice, at present, it turns out that these difficulties frequently have direct consequences the implementation of soldering conditions (including preheating time) does not guarantee a systematic brazing of the nearest tabs of the collector.
Il découle de cet état de fait qu'un nombre non négligeable de languettes s'avèrent en fait simplement « collées » sur les plots de connexion correspondants et non pas soudées avec ces derniers, avec pour conséquence des risques importants de rupture de la liaison.It follows from this fact that a significant number of tongues are actually simply "glued" on the corresponding connection pads and not welded with them, with the consequent significant risk of breaking the connection.
L'invention vise à pallier cet inconvénient, et a pour principal objectif de fournir une solution très économique permettant d'obtenir un même gradient thermique dans toutes les languettes d'un bus de conduction thermique, et conduisant ainsi à une qualité uniforme des brasures des dites languettes quelle que soit leur position par rapport au collecteur thermique. Notamment la présente invention a pour but de permettre à des languettes connectées à un collecteur de chaleur de s'échauffer rapidement lors de leur brasage et de ne pas s'échauffer lors du fonctionnement normal du bus thermique.The invention aims to overcome this drawback, and its main objective is to provide a very economical solution for obtaining the same thermal gradient in all the tongues of a thermal conduction bus, and thus leading to a uniform quality of the solders of the said tongues regardless of their position relative to the heat collector. In particular, the present invention aims to allow tongues connected to a heat collector to warm up quickly during soldering and not to heat up during normal operation of the heat bus.
A cet effet, l'invention vise un bus de conduction thermique du type décrit dans le préambule ci-dessus, comprenant, en outre, au moins en regard de chacune des languettes géométriquement les plus proches du collecteur, une lumière ménagée dans la barrette à proximité de la languette, de façon à se trouver interposée entre la dite languette et le collecteur et à former un obstacle s'opposant au cheminement direct de l'énergie thermique entre cette languette et le dit collecteur.For this purpose, the invention aims a heat conduction bus of the type described in the preamble above, further comprising, at least next to each of the tabs geometrically closest to the collector, a light formed in the bar to proximity of the tongue, so as to be interposed between said tongue and the collector and to form an obstacle opposing the direct path of the thermal energy between the tongue and said collector.
L'invention a donc consisté à ménager dans la barrette, en regard des languettes géométriquement les plus proches du collecteur, une simple lumière, dont la forme et les dimensions peuvent avantageusement être déterminées par des simulations, qui :
- s'oppose à la propagation de la chaleur durant un temps très court avantageusement déterminé pour correspondre au temps requis par l'opération de brasage,
- ne contrarie par contre pas la fonction de radiateur thermique du bus lors d'une utilisation classique de ce dernier, c'est à dire pour des cycles de fonctionnement de l'ordre de plusieurs minutes (supérieurs généralement à vingt minutes dans la pratique).
- opposes the propagation of heat for a very short time advantageously determined to correspond to the time required by the soldering operation,
- does not, however, thwart the thermal radiator function of the bus during a conventional use of the latter, that is to say for operating cycles of the order of several minutes (generally greater than twenty minutes in practice).
Cette solution, moyennant un simple usinage supplémentaire des bus actuels, sans conséquences sur le prix de revient de ces deniers, permet donc d'uniformiser les paramètres des opérations de brasage (temps et température de préchauffage, temps de brasage..) requis pour garantir une brasure correcte pour chacune des languettes.This solution, by means of a simple additional machining of the current buses, without consequences on the cost price of these deniers, thus makes it possible to standardize the parameters of the soldering operations (time and temperature of preheating, brazing time ..) required to guarantee a proper solder for each of the tabs.
Selon un mode de réalisation avantageux de l'invention visant un bus de conduction thermique dont chaque languette s'étend orthogonalement par rapport à un bord de la barrette, chaque lumière consiste en une fente présentant au moins un axe longitudinal orthogonal à la languette.According to an advantageous embodiment of the invention for a thermal conduction bus whose each tab extends orthogonally with respect to an edge of the bar, each light consists of a slot having at least one longitudinal axis orthogonal to the tongue.
De plus, chacune de ces fentes est avantageusement ménagée à une distance du bord correspondant de la barrette adaptée pour délimiter, par rapport au dit bord, une bande de matière de largeur minimale calculée pour assurer la tenue mécanique de la barrette.In addition, each of these slots is advantageously arranged at a distance from the corresponding edge of the bar adapted to delimit, with respect to said edge, a strip of material of minimum width calculated to ensure the mechanical strength of the bar.
Par ailleurs, lorsque le bus de conduction comprend une languette ménagée dans le prolongement d'un angle de la barrette, la fente correspondante présente avantageusement la forme d'un V dont les deux branches s'étendent parallèlement aux bords de la barrette délimitant l'angle dans lequel est ménagée la languette.Furthermore, when the conduction bus comprises a tongue formed in the extension of an angle of the bar, the corresponding slot advantageously has the shape of a V whose two branches extend parallel to the edges of the bar defining the angle in which is formed the tongue.
D'autres caractéristiques buts et avantages de l'invention ressortiront de la description détaillée qui suit en référence au dessin annexé qui en représente à titre d'exemple non limitatif un mode de réalisation préférentiel. Sur ce dessin, la figure unique 1 est une vue en perspective d'un bus de conduction thermique selon l'invention.Other features and advantages of the invention will become apparent from the detailed description which follows with reference to the accompanying drawing which represents by way of non-limiting example a preferred embodiment. In this drawing, the single figure 1 is a perspective view of a thermal conduction bus according to the invention.
Le bus de conduction thermique selon l'invention représenté à titre d'exemple à la
De façon usuelle, ce bus comporte une barrette 1 formée d'une plaque sensiblement plane présentant une forme générale parallélépipédique délimitée notamment par deux bords longitudinaux parallèles 1 a et 1 b.In the usual way, this bus comprises a bar 1 formed of a substantially flat plate having a generally parallelepipedal shape defined in particular by two parallel
Ce bus comporte, en outre, une cosse 2 dotée d'un orifice 3 pour son montage sur une borne de batterie. Cette cosse 2, qui s'étend dans un plan orthogonal à celui de la barrette 1, est reliée à un des bords longitudinaux 1 a de cette dernière, à proximité d'une des extrémités du dit bord longitudinal, par une pièce de jonction, ou collecteur, 4 en forme de L (L inversé si l'on considère la
- une ailette 5 de jonction avec le bord longitudinal 1 a, perpendiculaire au plan de la barrette 1,
- et une
aile 6 de jonction avec la cosse 2, s'étendant parallèlement au plan de la barrette 1.
- a fin 5 joining the longitudinal edge 1a, perpendicular to the plane of the bar 1,
- and a
wing 6 junction with the terminal 2, extending parallel to the plane of the bar 1.
Ce bus comporte, en outre, une pluralité de languettes de connexion 7 à 12 présentant la forme générale de dents s'étendant perpendiculairement par rapport à l'autre bord longitudinal 1b de la barrette 1, deux des dites dents, notamment, étant positionnées chacune au niveau d'une des extrémités du dit bord longitudinal.This bus further comprises a plurality of connecting
Selon l'invention, la barrette 1 est enfin percée, en regard de chacune des languettes géométriquement les plus proches du collecteur 4, en l'exemple les languettes 11 et 12 disposées de part et d'autre de ce collecteur 4, d'une lumière 13, 14 ménagée à proximité de la dite languette, de façon à se trouver interposée entre cette dernière et le collecteur 4, et à former un obstacle s'opposant au cheminement direct de l'énergie thermique entre cette languette 11, 12 et le dit collecteur.According to the invention, the bar 1 is finally pierced, facing each of the tabs geometrically closest to the collector 4, in the example the
Concernant la languette 11 ménagée en position intermédiaire le long du bord longitudinal 1 b, cette lumière 13 consiste en une fente 13 :
- s'étendant de part et d'autre de la
languette 11, selon un axe longitudinal A parallèle au bord longitudinal 1b, - ménagée à une distance du bord longitudinal 1b adaptée pour délimiter, par rapport au dit bord, une bande de
matière 15 de largeur minimale calculée pour assurer la tenue mécanique de la barrette 1.
- extending on either side of the
tongue 11, along a longitudinal axis A parallel to thelongitudinal edge 1b, - arranged at a distance from the
longitudinal edge 1b adapted to delimit, with respect to said edge, a strip ofmaterial 15 of minimum width calculated to ensure the mechanical strength of the bar 1.
Concernant la languette 12 ménagée au niveau d'une des extrémités du bord longitudinal 1b, dans le prolongement d'un angle de la barrette 1, la fente 14 correspondante présente, quant à elle, la forme d'un L dont les deux branches 14a, 14b s'étendent parallèlement aux bords de la barrette 1 délimitant le dit angle.Regarding the tongue 12 formed at one end of the
Ces simples fentes 13, 14 ont pour fonction de s'opposer à la propagation de la chaleur durant un temps très court avantageusement déterminé pour correspondre au temps requis par l'opération de brasage. Par là même, elles permettent d'uniformiser les paramètres de l'opération de brasage (temps et température de préchauffage, temps de brasage..) requis pour garantir une brasure correcte pour chacune des languettes.These
Il est ainsi possible de braser les languettes du bus thermique en appliquant un temps de brasage uniforme (temps pour monter la languette jusqu'à la température de brasage), quelle que soit la position de la languette par rapport au collecteur.It is thus possible to braze the tongues of the thermal bus by applying a uniform brazing time (time to mount the tongue to the brazing temperature), regardless of the position of the tongue relative to the collector.
On notera que les lumières 13, 14 selon l'invention permettent de confiner la chaleur due à l'opération de brasage dans chaque languette au moment du brasage, sans toutefois faire obstacle à la propagation de cette chaleur vers le collecteur lorsque l'on a besoin d'utiliser le bus thermique en tant que radiateur. Ces lumières permettent donc de réaliser une double fonction (a priori contradictoire) à savoir confiner la chaleur lorsque la languette est soumise à une rapide élévation de température et dissiper cette chaleur lorsque la languette est soumise à une élévation de température de longue durée.It will be noted that the
Claims (4)
- Heat conduction bus, particularly for a microprocessor-based computation unit, comprising, from a single starting end, a heat-conducting strip (1) equipped with a plurality of tabs (7-12) for solder-connecting to the connection terminals of electronic components likely to become hot, and a collector (4) joined to the strip (1) and arranged so as to channel and evacuate the thermal energy drained by the tabs (7-12) and passing through the strip (1), said heat conduction bus being characterised in that it comprises, at least in line with each of the tabs (11, 12) geometrically the closest to the collector (4), an opening (13, 14) provided in the strip (1) near to the tab (11, 12), so as to be located interposed between said tab and the collector (4) and to form an obstacle opposing the direct routing of the thermal energy between this tab (11, 12) and said collector.
- Conduction bus according to claim 1, in which each tab (7-12) extends orthogonally in relation to an edge (1b) of the strip (1), characterised in that each opening consists of a slot (13, 14) having at least a longitudinal axis (A) orthogonal to the tab (7-12).
- Conduction bus according to claim 2, characterised in that each slot (13, 14) is provided at a distance from the corresponding edge (1b) of the strip (1) suitable for delimiting, in relation to said edge, a strip of material (15) of minimal width calculated to ensure the mechanical withstand strength of the strip (1).
- Conduction bus according to one of claims 1 or 2, comprising a tab (12) provided in the extension of a corner of the strip (1), characterised in that the corresponding slot (14) takes the form of a V, the two branches (14a, 14b) of which extend parallel to the edges of the strip (1) delimiting the corner in which the tab (12) is provided.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0610264A FR2909254B1 (en) | 2006-11-23 | 2006-11-23 | THERMAL CONDUCTION BUS, IN PARTICULAR FOR A MICROPROCESSOR CALCULATION UNIT. |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1926354A1 EP1926354A1 (en) | 2008-05-28 |
EP1926354B1 true EP1926354B1 (en) | 2010-05-19 |
Family
ID=38325416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07022447A Expired - Fee Related EP1926354B1 (en) | 2006-11-23 | 2007-11-20 | Thermally conductive bus, in particular for a calculation unit with a microprocessor |
Country Status (6)
Country | Link |
---|---|
US (1) | US7599186B2 (en) |
EP (1) | EP1926354B1 (en) |
JP (1) | JP2008147647A (en) |
CN (1) | CN101188926A (en) |
DE (1) | DE602007006613D1 (en) |
FR (1) | FR2909254B1 (en) |
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DE102006040824B4 (en) * | 2006-08-31 | 2013-03-28 | Lisa Dräxlmaier GmbH | Power distributor to compensate for a tolerance |
CN101420841B (en) * | 2008-10-23 | 2012-06-27 | 旭丽电子(广州)有限公司 | Heat radiating mechanism |
JP4968316B2 (en) * | 2009-12-14 | 2012-07-04 | アンデン株式会社 | Electronic circuit equipment |
JP5679959B2 (en) * | 2011-12-27 | 2015-03-04 | 三菱電機株式会社 | Current assist assembly using current assist members |
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JP2587911Y2 (en) * | 1993-07-07 | 1998-12-24 | 住友電装株式会社 | Fixing structure of electric connection box and busbar for mini fuse |
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JPH10290085A (en) * | 1997-04-15 | 1998-10-27 | Nemic Lambda Kk | Heat dissipating bus bar |
SE516755C2 (en) * | 1999-12-16 | 2002-02-26 | Inmotion Technologies Ab | Electric drive unit including a circuit board with power distribution rods. |
JP2001251028A (en) * | 2000-03-06 | 2001-09-14 | Matsushita Electric Ind Co Ltd | Power source wiring method for electronic equipment and power source wiring device |
US6302709B1 (en) * | 2000-06-05 | 2001-10-16 | Power-One, Inc. | Multiple function high current interconnect with integrated bus bar |
US6351385B1 (en) * | 2000-09-26 | 2002-02-26 | Thomson Licensing, S.A. | Heat sink for integrated circuit packages |
JP2002171086A (en) * | 2000-11-29 | 2002-06-14 | Pioneer Electronic Corp | Component |
US6702595B2 (en) * | 2002-06-10 | 2004-03-09 | The Turo Company | Fuse clip for circuit boards |
US7273398B2 (en) * | 2005-11-01 | 2007-09-25 | Tyco Electronics Corporation | Electrical device carrier contact assembly |
-
2006
- 2006-11-23 FR FR0610264A patent/FR2909254B1/en not_active Expired - Fee Related
-
2007
- 2007-11-20 EP EP07022447A patent/EP1926354B1/en not_active Expired - Fee Related
- 2007-11-20 DE DE602007006613T patent/DE602007006613D1/en active Active
- 2007-11-23 US US11/944,500 patent/US7599186B2/en not_active Expired - Fee Related
- 2007-11-23 CN CNA2007103051664A patent/CN101188926A/en active Pending
- 2007-11-26 JP JP2007303988A patent/JP2008147647A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US20080123290A1 (en) | 2008-05-29 |
DE602007006613D1 (en) | 2010-07-01 |
EP1926354A1 (en) | 2008-05-28 |
FR2909254B1 (en) | 2009-01-09 |
JP2008147647A (en) | 2008-06-26 |
CN101188926A (en) | 2008-05-28 |
US7599186B2 (en) | 2009-10-06 |
FR2909254A1 (en) | 2008-05-30 |
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