EP1920200A1 - Sous-refroidissement de refrigerant au moyen d'un dispositif thermoelectrique - Google Patents

Sous-refroidissement de refrigerant au moyen d'un dispositif thermoelectrique

Info

Publication number
EP1920200A1
EP1920200A1 EP05792651A EP05792651A EP1920200A1 EP 1920200 A1 EP1920200 A1 EP 1920200A1 EP 05792651 A EP05792651 A EP 05792651A EP 05792651 A EP05792651 A EP 05792651A EP 1920200 A1 EP1920200 A1 EP 1920200A1
Authority
EP
European Patent Office
Prior art keywords
conduit
thermoelectric modules
refrigerant
subcooler
vapor compression
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05792651A
Other languages
German (de)
English (en)
Other versions
EP1920200A4 (fr
Inventor
Rakesh Radhakrishnan
Xiaomei Yu
Michael K. Sahm
Gregory M. Dobbs
David Tew
Chung-Yi Tsai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carrier Corp
Original Assignee
Carrier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carrier Corp filed Critical Carrier Corp
Publication of EP1920200A1 publication Critical patent/EP1920200A1/fr
Publication of EP1920200A4 publication Critical patent/EP1920200A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B25/00—Machines, plants or systems, using a combination of modes of operation covered by two or more of the groups F25B1/00 - F25B23/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B40/00—Subcoolers, desuperheaters or superheaters
    • F25B40/02—Subcoolers

Definitions

  • thermoelectric subcooler Accordingly, there is a need for an improved subcooler that does not require the need for a secondary loop or a secondary liquid.
  • the method and apparatus of the present invention avoids the need for a secondary loop or a secondary liquid through the use of a thermoelectric subcooler.
  • a subcooler for a vapor compression cycle having a refrigerant comprises a conduit and one or more thermoelectric modules.
  • the conduit being in fluid communication with the vapor compression cycle for flow of the refrigerant therethrough.
  • Each of the one or more thermoelectric modules has a cold side in thermal communication with an inner volume of the conduit for subcooling the refrigerant.
  • a vapor compression system comprising a compressor, a condensor, and an evaporator connected to each other via a conduit and a subcooler.
  • the subcooler has one or more thermoelectric modules connected to the conduit, wherein each of the one or more thermoelectric modules has a cold side in thermal communication with an inner volume of the conduit for subcooling refrigerant circulating therethrough.
  • a method of subcooling a vapor compression cycle is provided.
  • thermoelectric modules can have a warm side in thermal isolation from the inner volume of the conduit.
  • the one or more thermoelectric modules can be embedded in the conduit, and the cold side can directly contact the refrigerant.
  • the one or more thermoelectric modules can further comprise a secondary heat exchanger for indirect heat exchange with refrigerant.
  • the one or more thermoelectric modules can comprise a thermoelectric heat exchanger.
  • the thermoeletric heat exchanger can be an air or liquid thermoelectric heat exchanger.
  • the one or more thermoelectric modules can be connected to an outer surface of the conduit and in thermal communication with the refrigerant.
  • the subcooler can further comprise a fan that provides air flow in thermal communication with a warm side of the one or more thermoelectric modules.
  • Vapor compression cycle 10 uses a thermoelectric subcooler 15 to subcool refrigerant of the vapor compression cycle 10.
  • Subcooler 15 may be used for vapor compression cycles such as, for example, supermarket display cases having low coefficient of performance (COPs), e.g., less than 3, as well as any other types of refrigeration cycles of large or small scale.
  • COPs coefficient of performance
  • chilled water coils in air handlers or fan coils may also be precooled when a transient change in their cooling or humidity removal performance is warranted.
  • Subcooler 15 thermoelectrically subcools the refrigerant as the refrigerant circulates through second conduit 45 from condenser 30.
  • Third conduit 47 connects subcooler 15 to thermal expansion valve 35.
  • the refrigerant circulates through third conduit to thermal expansion valve 35 as represented by arrow 46.
  • thermal expansion valve 35 decreases a pressure of the refrigerant to a mixed liquid and vapor.
  • the the refrigerant enters evaporator 25 from fourth conduit 48 as represented by arrow 49.
  • Evaporator 25 substantially vaporizes the liquid by heat transfer provided from a refrigerated space 75.
  • a rejection space 70 is underneath evaporator 25 so that heat from evaporator 25 is not rejected to refrigerated space 75.
  • the refrigerant exits evaporator 25 to a fifth conduit 50 as represented by arrows 51.
  • the refrigerant enters compressor 20 from fifth conduit 50.
  • Compressor 20 compresses the refrigerant and completes vapor compression cycle 10.
  • Thermoelectric modules 17 may be embedded in second conduit 45 so that a cold side or face is facing inwardly into an inner volume of second conduit 45 and a warm side or face is facing away from the inner volume of second conduit 45.
  • the cold side of each of the thermoelectric modules 17 is in thermal contact with the inner volume of second conduit 45 to provide contact cooling of the refrigerant, while the warm side is in thermal isolation from the inner volume of second conduit 45.
  • thermoelectric modules 17 cools the refrigerant, which is being circulated through second conduit 45.
  • Second conduit 45 can be made of thermally conductive materials, however, the material can be varied based upon the particular cooling needs and other factors related to vapor compression cycle 10.
  • the number of thermoelectric modules 17 that are used in second conduit 45 can be varied based upon the particular cooling needs and other factors related to the subcooler 15.
  • the particular number of thermoelectric modules 17, as well as the structure or method of making the inner surface or inner portion of second conduit 45 thermally conductive, can be varied based upon the particular cooling needs and other factors related to the display vapor compression cycle 10.
  • thermoelectric modules 17 The particular type, including materials, dimensions and shape, of thermoelectric modules 17 that are utilized can vary according to the particular needs of the subcooler 15. Preferably, the dimensions and shape of the cold side and the warm side of the thermoelectric modules 17 maximize thermal contact or communication, e.g., surface area, between second conduit 45 and the cold side, as well as between the air outside of second conduit 45 and the warm side.
  • the particular structure or method of providing energy source 18 to thermoeiectric modules 17 can be varied according to the particular needs of subcooler 15.
  • Thermoelectric modules 17 may be a thermoelectric device powered directly by a DC source, such as, for example, batteries, a portable fuel cell, photovoltaic, and the like, without need for AC-DC conversion.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Other Air-Conditioning Systems (AREA)

Abstract

La présente invention concerne un sous-refroidisseur (15) pour un cycle de compression de vapeur comportant un réfrigérant. Le sous-refroidisseur (15) comprend un conduit (45) et un ou plusieurs modules thermoélectriques (17). Le conduit (45) est en communication fluidique avec le cycle de compression de vapeur pour permettre que le réfrigérant y circule. Chaque module thermoélectrique (17) comporte un côté froid en communication thermique avec un volume interne du conduit (45) pour le sous-refroidissement du réfrigérant.
EP05792651A 2005-08-29 2005-08-29 Sous-refroidissement de refrigerant au moyen d'un dispositif thermoelectrique Withdrawn EP1920200A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2005/030747 WO2007027171A1 (fr) 2005-08-29 2005-08-29 Sous-refroidissement de refrigerant au moyen d'un dispositif thermoelectrique

Publications (2)

Publication Number Publication Date
EP1920200A1 true EP1920200A1 (fr) 2008-05-14
EP1920200A4 EP1920200A4 (fr) 2011-04-20

Family

ID=37809162

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05792651A Withdrawn EP1920200A4 (fr) 2005-08-29 2005-08-29 Sous-refroidissement de refrigerant au moyen d'un dispositif thermoelectrique

Country Status (6)

Country Link
US (1) US20090266084A1 (fr)
EP (1) EP1920200A4 (fr)
CN (1) CN101297167B (fr)
CA (1) CA2620391A1 (fr)
HK (1) HK1125692A1 (fr)
WO (1) WO2007027171A1 (fr)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8104293B2 (en) 2007-06-19 2012-01-31 General Electric Company Magneto-caloric cooling device and method of operation
EP2179231A1 (fr) * 2007-07-09 2010-04-28 Carrier Corporation Machine réfrigérante à compression
KR100984280B1 (ko) * 2010-04-23 2010-09-30 김봉석 열전모듈을 이용한 냉동사이클의 냉매 열교환장치
RU2472077C1 (ru) * 2011-05-20 2013-01-10 Общество С Ограниченной Ответственностью "Термо-Модуль" (Ооо "Термо-Модуль") Способ расширения температурного диапазона работы компрессионного холодильника
CN102252498B (zh) * 2011-06-15 2012-10-03 杭州滨鸿光电科技有限公司 一种常温态湿度控制存储柜
US9134053B2 (en) * 2011-08-23 2015-09-15 B/E Aerospace, Inc. Vehicle refrigerator having a liquid line subcooled vapor cycle system
GB2495149A (en) * 2011-09-30 2013-04-03 Arctic Circle Ltd Refrigeration Apparatus With Subcooler
DE102013211177A1 (de) * 2013-06-14 2014-12-18 Airbus Operations Gmbh Flugzeugkühlsystem und Verfahren zum Betreiben eines Flugzeugkühlsystems
EP2799343B1 (fr) 2013-04-03 2017-02-15 Airbus Operations GmbH Système de climatisation d'aéronef
CN107076473A (zh) 2014-07-31 2017-08-18 开利公司 冷却***
CN105371523A (zh) * 2014-08-29 2016-03-02 青岛海尔空调器有限总公司 空调制冷回路及空调器
CN105066507A (zh) * 2015-09-02 2015-11-18 北京三相典创科技有限公司 一种用于循环冷却***的风冷半导体制冷装置
ES2886157T3 (es) * 2015-10-15 2021-12-16 Phononic Inc Sistema híbrido de transporte de calor por compresión de vapor/termoeléctrico
CN105318612A (zh) * 2015-12-05 2016-02-10 广东志高空调有限公司 一种空调冷凝器过冷段热电冷却***
CN105318613A (zh) * 2015-12-05 2016-02-10 广东志高空调有限公司 一种空调***
CN106895602A (zh) * 2017-02-21 2017-06-27 山东大学 一种半导体制冷辅助蒸汽压缩制冷***及方法
CN109068549B (zh) * 2018-09-27 2024-02-27 邹昊雄 散热装置及具有该散热装置的电子产品
CN109612166B (zh) * 2018-12-25 2021-07-27 新奥数能科技有限公司 一种空调过冷器、调节空调***过冷度的方法和装置
EP3918645A4 (fr) 2019-02-01 2022-11-09 DTP Thermoelectrics LLC Éléments thermoélectriques et dispositifs ayant des différences de température maximales améliorées sur la base de propriétés de transport distribuées variant dans l'espace
US11421919B2 (en) 2019-02-01 2022-08-23 DTP Thermoelectrics LLC Thermoelectric systems employing distributed transport properties to increase cooling and heating performance
CN116209588A (zh) 2020-06-15 2023-06-02 Dtp热电体有限责任公司 热电增强混合热泵***

Citations (4)

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DE4329816A1 (de) * 1992-09-08 1994-03-10 Agency Ind Science Techn Thermoelementplatte oder Flächenelement
US6351950B1 (en) * 1997-09-05 2002-03-05 Fisher & Paykel Limited Refrigeration system with variable sub-cooling
WO2002065030A1 (fr) * 2001-02-09 2002-08-22 Bsst, Llc Systeme thermoelectrique a efficacite amelioree mettant en oeuvre une isolation thermique
EP1555493A2 (fr) * 2004-01-13 2005-07-20 Tecumseh Products Company Methode et appareil pour le controle de la pression d'un refroidisseur de gaz au dioxyde de carbone utilisant un tube capillaire

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US6592577B2 (en) * 1999-01-25 2003-07-15 Cryocath Technologies Inc. Cooling system
US6635053B1 (en) * 1999-01-25 2003-10-21 Cryocath Technologies Inc. Cooling system
ITTV20010003A1 (it) * 2001-01-11 2002-07-11 Vetraria Biancadese Sas Soc Metodo e apparecchio ad uso privato per la conservazione contemporanea di prodotti a base di tabacco e di bevande imbottigliate e simili.
US6705089B2 (en) * 2002-04-04 2004-03-16 International Business Machines Corporation Two stage cooling system employing thermoelectric modules

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4329816A1 (de) * 1992-09-08 1994-03-10 Agency Ind Science Techn Thermoelementplatte oder Flächenelement
US6351950B1 (en) * 1997-09-05 2002-03-05 Fisher & Paykel Limited Refrigeration system with variable sub-cooling
WO2002065030A1 (fr) * 2001-02-09 2002-08-22 Bsst, Llc Systeme thermoelectrique a efficacite amelioree mettant en oeuvre une isolation thermique
EP1555493A2 (fr) * 2004-01-13 2005-07-20 Tecumseh Products Company Methode et appareil pour le controle de la pression d'un refroidisseur de gaz au dioxyde de carbone utilisant un tube capillaire

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007027171A1 *

Also Published As

Publication number Publication date
CN101297167A (zh) 2008-10-29
EP1920200A4 (fr) 2011-04-20
CN101297167B (zh) 2011-09-14
CA2620391A1 (fr) 2007-03-08
HK1125692A1 (en) 2009-08-14
WO2007027171A1 (fr) 2007-03-08
US20090266084A1 (en) 2009-10-29

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