EP1894238A1 - Heat exchanger for small components - Google Patents
Heat exchanger for small componentsInfo
- Publication number
- EP1894238A1 EP1894238A1 EP06754389A EP06754389A EP1894238A1 EP 1894238 A1 EP1894238 A1 EP 1894238A1 EP 06754389 A EP06754389 A EP 06754389A EP 06754389 A EP06754389 A EP 06754389A EP 1894238 A1 EP1894238 A1 EP 1894238A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat exchange
- exchange element
- heat exchanger
- heat
- channel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
- F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/0263—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by varying the geometry or cross-section of header box
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0029—Heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a heat exchanger for small components, which can be traversed by a fluid, consisting of several exclusively Umformtechnisch manufactured individual parts, the joining technology firmly together to an inlet channel, a flat heat exchange element and an outlet channel, wherein the heat exchange element connectable to at least one heat source Has top and bottom.
- heat exchangers are already used in a wide variety of technical fields.
- heat exchangers with liquid cooling or evaporation are becoming increasingly important.
- Previously available heat exchangers in the form of water coolers for microprocessors are usually made of a copper or aluminum block by machining. Since solid material is used for the individual components, a machining is correspondingly complex and therefore expensive.
- document JP 2005019905 A discloses a cooling device with a heat exchanger, which is used as a heat sink for semiconductor components.
- the heat exchanger has a structured interior to the heat source to increase the heat dissipation. These structures with low height expansion have no significant influence on the fluid flowing in the interior.
- the heat exchanger consists of several individual parts, which are joining technology firmly connected to an inlet channel, a flat heat exchange element and an outlet channel.
- the lid and bottom element existing closed heat exchange element is in contact with the heat source.
- the invention has the object of developing a heat exchanger of the aforementioned type and to optimize this under specification of a cost-effective manufacturing process in its heat exchange capacity.
- the invention includes a heat exchanger for small components, which can be traversed by a fluid consisting of several exclusively Umformtechnisch produced individual parts, the joining technology firmly together to an inlet channel, a flat heat exchange element and an outlet channel are connected, wherein the heat exchange element with at least one heat source connectable top and bottom, wherein the inlet channel consists of a metal connecting pipe, which continuously widens on the input side to the heat exchange element, the outlet channel, starting from the heat exchange part, the output side continuously tapers to a metal connecting pipe, and the heat exchange element to increase the heat transfer in Has flow direction extending channel-like inner structure, which extends in the interior of the bottom to the top.
- the heat exchanger consists of several parts exclusively manufactured by forming technology.
- the individual parts are in their geometry such that they can be produced by a cold forming process.
- the end face of the conically widened inlet channel is then connected to the input-side end face of the flat heat exchange element and the end face of the conically tapering outlet channel is connected to the outlet-side end face of the heat exchanger.
- the design options of the forming technique thus determine up to a certain extent the geometry of the top and bottom of the heat exchange element.
- the metal connecting pipe of the inlet channel or outlet channel can basically have any cross-sectional shape, but is preferably round or oval for reasons of deformation and the fluidic conditions.
- An important function has the running in the heat exchange element channel-like internal structure. These extends in the interior of the bottom to the top, whereby an increased heat transfer takes place.
- the channel structure proves to be extremely stable against external forces. These can occur when connecting and fixing a heat source on the heat exchanger, which would result in the contact forces used in hollow interior structures that the common contact surface of the heat exchanger is deformed with the heat source or even pressed. This is particularly useful when, for reasons of material savings thin walls are considered, which are no longer designed for such strong mechanical loads. Alone by forming techniques can already be achieved compared to the previously used cutting methods, a material savings and thus a cost reduction. The above-described structural design of the interior with corresponding channel structures provides this yet another contribution.
- channel-like internal structures running in the direction of flow are not necessarily continuous side walls.
- pins or cuboids arranged at shorter intervals in the direction of flow can also form a corresponding channel structure.
- Suitable joining methods are in particular the already widely used in the soldering, gluing or welding.
- the frontally abutting surfaces of the heat exchange element with the inlet or outlet channel can also be formed plugged into each other by grooves formed on the front side.
- Another two-part design of the individual parts produced by deformation can consist of two half-elements formed in the longitudinal direction, which only have to be joined together in the longitudinal direction by means of joining technology.
- the particular advantage is that with correspondingly thin walls of the heat exchanger against deformation is correspondingly stable.
- the channels running in the interior lead thereby the one- or two-phase fluid targeted by the heat exchanger, so that the heat exchange performance is optimized for mechanical stability.
- the conical inlet and outlet channels provide a smooth transition for a uniform fluid distribution with minimal pressure drop in the flow.
- the inner structure may be formed so that the fluid flow over the cross section is constant. This can be achieved, for example, via a different width of the channel-like inner structure, also referred to below as channels, wherein in the middle of the heat exchanger smaller channel cross-sections are present, which increase on both sides towards the outside. From the inlet channel in this way the main flow is distributed more uniformly throughout the heat exchanger.
- the constructive design of the internal volume of the heat exchange element with respect to favorable fluid mechanical conditions is given special attention.
- the internal structure of the heat exchange element in the inlet channel and / or outlet channel can continue.
- the fluid is already distributed according to flow-favorable aspects in the individual channels immediately after passing out of the metal connecting pipe in the widening part of the heat exchange element.
- Such structures are preferably in the inlet channel.
- channels in the tapered part of the heat exchange element can also guide the fluid flow in a targeted manner and have a favorable effect on flow mechanics.
- the inner structure may consist of continuous ribs forming channels.
- Continuous ribs are manufacturing technology especially with small rib distances with forming process reliable manufacture.
- the ribs run as partitions in the interior from the bottom to the top and form the individual longitudinal channels in which the fluid is conducted in the operating state.
- the internal structure can consist of rods or pyramids projecting from the inner wall.
- these are always arranged so that form channel-like internal structures in the flow direction.
- structurally favorable structures are generated which still allow a certain fluid exchange with adjacent channels.
- the heat exchange element may be integrally formed.
- the channel structure is produced with longitudinal ribs which are continuous in the interior. As a result, the joining technical effort is reduced for the heat exchange element. Integral heat exchange elements are only connected to the inlet channel and the outlet channel.
- the inlet channel, the heat exchange element and the outlet channel can be arranged in alignment.
- the elongate shape has no further bends in tight radii and thus promotes uniform fluid flow throughout the heat exchanger.
- the heat exchanger for example, as a heat sink for microprocessors or other heat-generating components in a computer, only a small amount of space is available.
- the inlet channel and / or the outlet channel can then run away from the heat source. However, this will usually only happen with the largest possible bending radii, which support the most undisturbed fluid flow possible.
- corrosion of some of the common fluids can not be ruled out.
- the inner surface of the heat exchanger can then be coated.
- FIG. 1 is a view of a heat exchanger with a heat source
- Fig. 3 shows a cross section of a heat exchange element with the same design
- Fig. 4 shows a cross section of a heat exchange element with the same design
- Fig. 5 is a cross section of a stacked trays formed
- Fig. 7 is a plan view of a heat exchanger having channel-like structures of different width
- Fig. 8 is a plan view of a heat exchanger with channel-like structures continuing into the inlet and outlet channels.
- FIG. 1 shows a schematic view of a heat exchanger 1 with a heat source 5.
- the heat exchanger 1 consists of an inlet channel 2, a flat heat exchange element 3 and an outlet channel 4, which are joined together by joining technique.
- the heat source 5 is arranged on the underside of the heat exchange element 3.
- the inlet channel 2 is made from a metal connecting pipe 21 which continuously widens on the input side to the heat exchange element 3.
- the shape of the inlet channel shown in the figure can be produced in one piece by means of a forming process, such as extruding.
- the joint is in this case at the common contact surface of the inlet channel 2 to the heat exchanger element 3.
- the outlet channel 4 which may also be integral, from a collection zone 42 and a metal connecting pipe 41.
- the collecting zone 42 tapers continuously to the metal connection pipe 41st
- the joint is located at the common contact surface of the outlet channel 4 to the heat exchange element.
- the heat source 5 is an electronic component, such as a microprocessor.
- the heat source 5 is often held with clips or an adhesive bond, whereby the heat well-conductive intermediate layers are used. In intermediate layers, the heat source 5 is connected to the heat exchanger 1 under a contact pressure. In the embodiment shown, the inlet channel 2 and the outlet channel 4 are directed away from the heat source 5.
- Fig. 2 shows a cross section of a two-part heat exchange element 3 with lid 32 and bottom 33.
- the inner structure is formed together with the bottom 33, the lid 32 is firmly joined to the ground.
- Joining technology used to connect lid 32 and bottom 33 welding, soldering or adhesive joints or interference fits into consideration. Preference is given to joining methods which do not thermally and mechanically lead to a deformation of the component.
- Fig. 3 shows a cross section of a heat exchange element 3 with the same design lid 32 and bottom 33 and an interlocking inner structure 31.
- the inner structure is in each case half formed together with the lid 32 and the bottom 33. This offers the advantage of forming technology, for example, with continuous ribs in the lid 32 and bottom 33 to provide coarser structures that engage in one another after joining so that correspondingly small Channels arise.
- Fig. 4 shows in cross section a heat exchange element 3 with the same design lid 32 and bottom 33. Both form successive set the channel-like inner structure.
- FIG. 5 shows a cross-section of a heat exchange element 3 with a closed cover 32 formed from two trays 33 stacked one above the other.
- Such structures are suitable, for example, if a heat source is arranged both on the upper side and on the lower side.
- FIG. 6 another embodiment of the heat exchange element 3 is shown, which may be integrally formed by extrusion.
- One-piece components are preferred for manufacturing reasons for larger channel structures used. These can also be manufactured continuously and cut to the appropriate dimension.
- FIG. 7 shows a plan view of a heat exchanger 1 cut open in the region of the heat exchange element 3 with channel-like structures of different widths.
- the channels of the inner structure 31 are formed so that the fluid flow over the cross section of the heat exchange element 3 is constant and forms a uniform pressure drop in the flow direction of the fluid.
- FIG. 8 shows a plan view of a partially cut-open heat exchanger 1 with channel-like structures that continue into the inlet channel 2 and outlet channel 4.
- the fluid is already distributed immediately after the passage from the metal connecting pipe 21 in the widening part of the distribution zone 22 or from the tapered parts of the collection zone 42 of the heat exchanger 1 after flow-favorable aspects in the individual channels of the inner structure 31 and the metal connection pipe 41 collected again.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005029074A DE102005029074B3 (en) | 2005-06-23 | 2005-06-23 | Heat exchanger for cooling e.g. microprocessor, has heat exchanging unit (3) with inner structure that runs in flow direction for increasing heat transfer and extends in inner space from lower side to upper side |
PCT/EP2006/005776 WO2006136325A1 (en) | 2005-06-23 | 2006-06-16 | Heat exchanger for small components |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1894238A1 true EP1894238A1 (en) | 2008-03-05 |
Family
ID=36709974
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06754389A Withdrawn EP1894238A1 (en) | 2005-06-23 | 2006-06-16 | Heat exchanger for small components |
Country Status (4)
Country | Link |
---|---|
US (1) | US20090236083A1 (en) |
EP (1) | EP1894238A1 (en) |
DE (1) | DE102005029074B3 (en) |
WO (1) | WO2006136325A1 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007017623B4 (en) * | 2007-04-12 | 2009-05-14 | Rittal Gmbh & Co. Kg | Mounting plate for electrical or electronic components |
DE102007029377A1 (en) * | 2007-06-26 | 2009-01-08 | Continental Automotive Gmbh | Method for heat removal of electronic components for operation of a liquid pump |
WO2012160564A1 (en) * | 2011-05-23 | 2012-11-29 | Ramot At Tel-Aviv University Ltd. | Heat exchanger device |
EP2974576B1 (en) * | 2013-03-14 | 2020-08-26 | Rochester Institute of Technology | Heat transfer system and method incorporating tapered flow field |
JP6593214B2 (en) * | 2016-02-10 | 2019-10-23 | オムロン株式会社 | Cooler, flow path unit |
US9894801B1 (en) * | 2016-10-31 | 2018-02-13 | International Business Machines Corporation | Cold plate |
CN110543069A (en) * | 2018-05-28 | 2019-12-06 | 中强光电股份有限公司 | Liquid cooling type radiator |
CN108905921B (en) * | 2018-08-29 | 2024-03-29 | 山东豪迈化工技术有限公司 | Microchannel reaction heat exchange device |
DE102019219777A1 (en) * | 2019-12-17 | 2021-06-17 | Vitesco Technologies Germany Gmbh | Cooler, power electrical device with a cooler |
CN114206063A (en) * | 2020-09-02 | 2022-03-18 | 春鸿电子科技(重庆)有限公司 | Liquid cooling head and liquid cooling type heat dissipation device |
US20230413471A1 (en) * | 2022-06-17 | 2023-12-21 | Frore Systems Inc. | Mems based cooling systems having an integrated spout |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3329325A1 (en) * | 1982-09-03 | 1984-03-08 | Peter 2563 Ipsach Herren | Heat sink for liquid cooling of at least one electrical power element |
EP0564027A1 (en) * | 1992-03-31 | 1993-10-06 | Akzo Nobel N.V. | Heat exchanger, a method of manufacturing same, and applications |
JP3166423B2 (en) * | 1993-07-22 | 2001-05-14 | 株式会社デンソー | Cooling structure |
US5473508A (en) * | 1994-05-31 | 1995-12-05 | At&T Global Information Solutions Company | Focused CPU air cooling system including high efficiency heat exchanger |
DE19514548C1 (en) * | 1995-04-20 | 1996-10-02 | Daimler Benz Ag | Method of manufacturing a micro cooler |
DE19600164A1 (en) * | 1996-01-04 | 1997-07-17 | Daimler Benz Ag | Cooling body |
US6169658B1 (en) * | 1999-10-13 | 2001-01-02 | Trw Inc. | Plenumless air cooled avionics rack |
JP4141613B2 (en) * | 2000-03-09 | 2008-08-27 | 富士通株式会社 | Closed cycle refrigerator and dry evaporator for closed cycle refrigerator |
US6443253B1 (en) * | 2000-08-24 | 2002-09-03 | General Motors Corporation | Thermal management system for an electrochemical engine |
US6367543B1 (en) * | 2000-12-11 | 2002-04-09 | Thermal Corp. | Liquid-cooled heat sink with thermal jacket |
CA2329408C (en) * | 2000-12-21 | 2007-12-04 | Long Manufacturing Ltd. | Finned plate heat exchanger |
US6935419B2 (en) * | 2002-02-20 | 2005-08-30 | Hewlett-Packard Development Company, L.P. | Heat sink apparatus with air duct |
EP1506054B1 (en) * | 2002-03-26 | 2012-07-25 | Peter Prechtl | Micro-reactor and micro-channel heat exchanger |
DE10317580B4 (en) * | 2002-04-18 | 2010-09-16 | Hitachi, Ltd. | Electric inverter device with a liquid channel and electric vehicle with such an inverter device |
US20040107718A1 (en) * | 2002-12-06 | 2004-06-10 | Michael Bowman | Method, system and apparatus for cooling high power density devices |
DE10315225B4 (en) * | 2003-03-31 | 2005-06-30 | Alutec Metallwaren Gmbh & Co. | heat exchangers |
US6934154B2 (en) * | 2003-03-31 | 2005-08-23 | Intel Corporation | Micro-channel heat exchangers and spreaders |
JP3778910B2 (en) * | 2003-12-15 | 2006-05-24 | 株式会社ソニー・コンピュータエンタテインメント | Electronic device cooling apparatus, electronic device cooling method, and electronic device cooling control program |
US7204303B2 (en) * | 2003-12-17 | 2007-04-17 | Lytron, Inc. | Flat tube cold plate assembly |
WO2005088714A1 (en) * | 2004-03-08 | 2005-09-22 | Remmele Engineering, Inc. | Cold plate and method of making the same |
US7414843B2 (en) * | 2004-03-10 | 2008-08-19 | Intel Corporation | Method and apparatus for a layered thermal management arrangement |
US7521789B1 (en) * | 2004-12-18 | 2009-04-21 | Rinehart Motion Systems, Llc | Electrical assembly having heat sink protrusions |
JP5120605B2 (en) * | 2007-05-22 | 2013-01-16 | アイシン・エィ・ダブリュ株式会社 | Semiconductor module and inverter device |
US7782616B1 (en) * | 2009-04-23 | 2010-08-24 | Delphi Technologies, Inc. | Heat-dissipating component having stair-stepped coolant channels |
-
2005
- 2005-06-23 DE DE102005029074A patent/DE102005029074B3/en active Active
-
2006
- 2006-06-16 US US11/922,477 patent/US20090236083A1/en not_active Abandoned
- 2006-06-16 EP EP06754389A patent/EP1894238A1/en not_active Withdrawn
- 2006-06-16 WO PCT/EP2006/005776 patent/WO2006136325A1/en active Application Filing
Non-Patent Citations (1)
Title |
---|
See references of WO2006136325A1 * |
Also Published As
Publication number | Publication date |
---|---|
DE102005029074B3 (en) | 2006-08-10 |
WO2006136325A1 (en) | 2006-12-28 |
US20090236083A1 (en) | 2009-09-24 |
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Legal Events
Date | Code | Title | Description |
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20071116 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
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DAX | Request for extension of the european patent (deleted) | ||
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: WOELFLIK, OLIVER Inventor name: SCHOPPER, FLORIAN Inventor name: BRAND, KARINE |
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DAX | Request for extension of the european patent (deleted) | ||
17Q | First examination report despatched |
Effective date: 20090518 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20140103 |