EP1827064A4 - Capacitor layer forming material, and printed wiring board having internal capacitor layer obtained by using such capacitor layer forming material - Google Patents

Capacitor layer forming material, and printed wiring board having internal capacitor layer obtained by using such capacitor layer forming material

Info

Publication number
EP1827064A4
EP1827064A4 EP05799990A EP05799990A EP1827064A4 EP 1827064 A4 EP1827064 A4 EP 1827064A4 EP 05799990 A EP05799990 A EP 05799990A EP 05799990 A EP05799990 A EP 05799990A EP 1827064 A4 EP1827064 A4 EP 1827064A4
Authority
EP
European Patent Office
Prior art keywords
layer
capacitor layer
forming material
layer forming
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05799990A
Other languages
German (de)
French (fr)
Japanese (ja)
Other versions
EP1827064A1 (en
Inventor
Akihiro Kanno
Naohiko Abe
Akiko Sugioka
Yasuaki Mashiko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Mining and Smelting Co Ltd
Original Assignee
Mitsui Mining and Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining and Smelting Co Ltd filed Critical Mitsui Mining and Smelting Co Ltd
Publication of EP1827064A1 publication Critical patent/EP1827064A1/en
Publication of EP1827064A4 publication Critical patent/EP1827064A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Abstract

A capacitor layer forming material applicable to a printed wiring board produced through a high temperature processing process of a fluororesin substrate, a liquid crystal polymer or the like at 300-400°C without causing deterioration in strength after high temperature heating. The capacitor layer forming material for a printed wiring board having a dielectric layer interposed between a first conductive layer which is used for forming an upper electrode and a second conductive layer which is used for forming a lower electrode is characterized in that the second conductive layer is a nickel layer or a nickel alloy layer. Preferably, the nickel layer or nickel alloy layer as the second conductive layer has a thickness of 10-100 μm. Furthermore, the dielectric layer is composed of such a material which is suitable for formation on the nickel layer or nickel alloy layer as the second conductive layer by sol-gel method.
EP05799990A 2004-11-04 2005-11-02 Capacitor layer forming material, and printed wiring board having internal capacitor layer obtained by using such capacitor layer forming material Withdrawn EP1827064A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004321298A JP3816508B2 (en) 2004-11-04 2004-11-04 Capacitor layer forming material and printed wiring board with built-in capacitor layer obtained using the capacitor layer forming material
PCT/JP2005/020183 WO2006049195A1 (en) 2004-11-04 2005-11-02 Capacitor layer forming material, and printed wiring board having internal capacitor layer obtained by using such capacitor layer forming material

Publications (2)

Publication Number Publication Date
EP1827064A1 EP1827064A1 (en) 2007-08-29
EP1827064A4 true EP1827064A4 (en) 2008-06-11

Family

ID=36319200

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05799990A Withdrawn EP1827064A4 (en) 2004-11-04 2005-11-02 Capacitor layer forming material, and printed wiring board having internal capacitor layer obtained by using such capacitor layer forming material

Country Status (7)

Country Link
US (1) US20080130196A1 (en)
EP (1) EP1827064A4 (en)
JP (1) JP3816508B2 (en)
KR (1) KR100922467B1 (en)
CN (1) CN101049055A (en)
TW (1) TW200629993A (en)
WO (1) WO2006049195A1 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4503583B2 (en) * 2006-12-15 2010-07-14 日本メクトロン株式会社 Adhesive sheet for capacitor and method for manufacturing printed wiring board with built-in capacitor using the same
EP2141971A4 (en) 2007-04-18 2011-01-05 Ibiden Co Ltd Multilayer printed wiring board and method for manufacturing the same
KR101448907B1 (en) * 2007-11-13 2014-10-14 삼성디스플레이 주식회사 Backlight unit and liquid crystal display comprising the same
JP4844578B2 (en) * 2008-03-11 2011-12-28 Ｔｄｋ株式会社 Manufacturing method of electronic parts
JP5098743B2 (en) * 2008-03-26 2012-12-12 Ｔｄｋ株式会社 Manufacturing method of electronic parts
JP5082060B2 (en) 2008-05-22 2012-11-28 学校法人明星学苑 Low characteristic impedance power supply / ground pair line structure
JP2010087499A (en) * 2008-09-30 2010-04-15 Ibiden Co Ltd Method of manufacturing capacitor device
US20100309608A1 (en) * 2009-06-07 2010-12-09 Chien-Wei Chang Buried Capacitor Structure
EP2480052B1 (en) * 2009-09-15 2017-08-09 Kabushiki Kaisha Toshiba Ceramic circuit board and process for producing same
JP2013062265A (en) * 2010-01-15 2013-04-04 Sanyo Electric Co Ltd Manufacturing method of substrate with built-in capacitor
CN102143654A (en) * 2010-01-29 2011-08-03 旭硝子株式会社 Substrate for mounting element and process for its production
JP5757163B2 (en) 2011-06-02 2015-07-29 ソニー株式会社 Multilayer wiring board, manufacturing method thereof, and semiconductor device
CN103298274B (en) * 2012-02-24 2016-02-24 北大方正集团有限公司 A kind of bury hold printed circuit board manufacture method and bury appearance printed circuit board
JP5722813B2 (en) * 2012-03-02 2015-05-27 Jx日鉱日石金属株式会社 Electrode copper foil and negative electrode current collector for secondary battery
JP6015159B2 (en) 2012-06-22 2016-10-26 Tdk株式会社 Thin film capacitor
JP6287105B2 (en) * 2013-11-22 2018-03-07 ソニー株式会社 Optical communication device, receiving apparatus, transmitting apparatus, and transmitting / receiving system
CN113725002B (en) * 2021-09-02 2023-03-14 江门市东有科技有限公司 Single-layer capacitor and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6207522B1 (en) * 1998-11-23 2001-03-27 Microcoating Technologies Formation of thin film capacitors
EP1093328A2 (en) * 1999-10-13 2001-04-18 Rohm And Haas Company Laser imaging of thin layer electronic circuitry material
US6541137B1 (en) * 2000-07-31 2003-04-01 Motorola, Inc. Multi-layer conductor-dielectric oxide structure
JP2004134421A (en) * 2002-10-08 2004-04-30 Nec Tokin Corp Capacitor built-in wiring board and its manufacturing method

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US3721870A (en) * 1971-06-25 1973-03-20 Welwyn Electric Ltd Capacitor
US4097911A (en) * 1975-10-06 1978-06-27 Erie Technological Products, Inc. Base metal electrode capacitor and method of making the same
JPH0580356A (en) * 1991-09-24 1993-04-02 Seiko Epson Corp Production of bidirectional nonlinear resistance element and production of liquid crystal display panel
US5800575A (en) * 1992-04-06 1998-09-01 Zycon Corporation In situ method of forming a bypass capacitor element internally within a capacitive PCB
US5952040A (en) * 1996-10-11 1999-09-14 Nanomaterials Research Corporation Passive electronic components from nano-precision engineered materials
KR100574215B1 (en) * 1997-04-17 2006-04-27 세키스이가가쿠 고교가부시키가이샤 Conductive particles
US6274224B1 (en) * 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
JP3630367B2 (en) * 1999-11-12 2005-03-16 松下電器産業株式会社 Circuit board and circuit board manufacturing method
US6606793B1 (en) * 2000-07-31 2003-08-19 Motorola, Inc. Printed circuit board comprising embedded capacitor and method of same
US6693793B2 (en) * 2001-10-15 2004-02-17 Mitsui Mining & Smelting Co., Ltd. Double-sided copper clad laminate for capacitor layer formation and its manufacturing method
JP2003133165A (en) * 2001-10-25 2003-05-09 Matsushita Electric Ind Co Ltd Laminated ceramic electronic component and its manufacturing method
US7100277B2 (en) * 2004-07-01 2006-09-05 E. I. Du Pont De Nemours And Company Methods of forming printed circuit boards having embedded thick film capacitors
US7190016B2 (en) * 2004-10-08 2007-03-13 Rohm And Haas Electronic Materials Llc Capacitor structure
US20060286696A1 (en) * 2005-06-21 2006-12-21 Peiffer Joel S Passive electrical article

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6207522B1 (en) * 1998-11-23 2001-03-27 Microcoating Technologies Formation of thin film capacitors
EP1093328A2 (en) * 1999-10-13 2001-04-18 Rohm And Haas Company Laser imaging of thin layer electronic circuitry material
US6541137B1 (en) * 2000-07-31 2003-04-01 Motorola, Inc. Multi-layer conductor-dielectric oxide structure
JP2004134421A (en) * 2002-10-08 2004-04-30 Nec Tokin Corp Capacitor built-in wiring board and its manufacturing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006049195A1 *

Also Published As

Publication number Publication date
CN101049055A (en) 2007-10-03
US20080130196A1 (en) 2008-06-05
WO2006049195A1 (en) 2006-05-11
JP2006135036A (en) 2006-05-25
KR100922467B1 (en) 2009-10-21
KR20070074599A (en) 2007-07-12
TW200629993A (en) 2006-08-16
EP1827064A1 (en) 2007-08-29
JP3816508B2 (en) 2006-08-30

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20070602

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

RIN1 Information on inventor provided before grant (corrected)

Inventor name: SUGIOKA, AKIKO,C/O MITSUI MINING & SMELTING CO., L

Inventor name: KANNO, AKIHIRO,C/O MITSUI MINING & SMELTING CO., L

Inventor name: MASHIKO, YASUAKI,C/O MITSUI MINING & SMELTING CO.,

Inventor name: ABE, NAOHIKO,C/O MITSUI MINING & SMELTING CO., LTD

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20080509

17Q First examination report despatched

Effective date: 20080825

STAA Information on the status of an ep patent application or granted ep patent

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Effective date: 20091001