EP1825519A4 - Device using abrupt metal-insulator transition layer and method of fabricating the device - Google Patents
Device using abrupt metal-insulator transition layer and method of fabricating the deviceInfo
- Publication number
- EP1825519A4 EP1825519A4 EP05821307A EP05821307A EP1825519A4 EP 1825519 A4 EP1825519 A4 EP 1825519A4 EP 05821307 A EP05821307 A EP 05821307A EP 05821307 A EP05821307 A EP 05821307A EP 1825519 A4 EP1825519 A4 EP 1825519A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- fabricating
- transition layer
- insulator transition
- abrupt metal
- abrupt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000012212 insulator Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000007704 transition Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N99/00—Subject matter not provided for in other groups of this subclass
- H10N99/03—Devices using Mott metal-insulator transition, e.g. field-effect transistor-like devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Junction Field-Effect Transistors (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20040103063 | 2004-12-08 | ||
KR1020050039098A KR100639990B1 (en) | 2004-12-08 | 2005-05-11 | Devices using abrupt metal-insulator transition and fabrication method thereof |
PCT/KR2005/004116 WO2006062317A1 (en) | 2004-12-08 | 2005-12-05 | Device using abrupt metal-insulator transition layer and method of fabricating the device |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1825519A1 EP1825519A1 (en) | 2007-08-29 |
EP1825519A4 true EP1825519A4 (en) | 2011-01-05 |
Family
ID=36578108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05821307A Withdrawn EP1825519A4 (en) | 2004-12-08 | 2005-12-05 | Device using abrupt metal-insulator transition layer and method of fabricating the device |
Country Status (6)
Country | Link |
---|---|
US (1) | US7767501B2 (en) |
EP (1) | EP1825519A4 (en) |
JP (1) | JP4920596B2 (en) |
KR (1) | KR100639990B1 (en) |
CN (1) | CN100585874C (en) |
WO (1) | WO2006062317A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100609699B1 (en) * | 2004-07-15 | 2006-08-08 | 한국전자통신연구원 | 2-terminal semiconductor device using abrupt metal-insulator transition semiconductor material |
KR100687760B1 (en) * | 2005-10-19 | 2007-02-27 | 한국전자통신연구원 | Insulator experiencing abruptly metal-insulator transition and method of manufacturing the same, device using the insulator |
KR100825760B1 (en) * | 2006-06-02 | 2008-04-29 | 한국전자통신연구원 | Abrupt metal-insulator transitionMIT device, MIT sensor using the same abrupt MIT device, and alarming apparatus and secondary battery anti-explosion circuit comprising the same MIT sensor |
BRPI0719055A2 (en) * | 2006-11-08 | 2013-11-26 | Symetrix Corp | Correlated memory of electrons |
KR101109667B1 (en) * | 2008-12-22 | 2012-01-31 | 한국전자통신연구원 | The package of power device having enhanced heat dissipation |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0282781A1 (en) * | 1987-03-16 | 1988-09-21 | International Business Machines Corporation | Contact to gallium-arsenide and method of forming such |
US5045502A (en) * | 1990-05-10 | 1991-09-03 | Bell Communications Research, Inc. | PdIn ohmic contact to GaAs |
US6392262B1 (en) * | 1999-01-28 | 2002-05-21 | Nec Corporation | Compound semiconductor device having low-resistive ohmic contact electrode and process for producing ohmic electrode |
US20030020114A1 (en) * | 2001-07-25 | 2003-01-30 | Motorola, Inc. | Metal-insulator-transition field-effect transistor utilizing a compliant substrate and method for fabricating same |
US20040084697A1 (en) * | 2002-10-18 | 2004-05-06 | Youn Doo Hyeb | Nitride semiconductor field effect transistor (FET) and method of fabricating the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5019530A (en) * | 1990-04-20 | 1991-05-28 | International Business Machines Corporation | Method of making metal-insulator-metal junction structures with adjustable barrier heights |
JP3462720B2 (en) | 1997-07-16 | 2003-11-05 | 三洋電機株式会社 | N-type nitride semiconductor electrode, semiconductor element having the electrode, and method of manufacturing the same |
US6121642A (en) * | 1998-07-20 | 2000-09-19 | International Business Machines Corporation | Junction mott transition field effect transistor (JMTFET) and switch for logic and memory applications |
KR100433623B1 (en) * | 2001-09-17 | 2004-05-31 | 한국전자통신연구원 | Field effect transistor using sharp metal-insulator transition |
KR200324156Y1 (en) | 2003-05-16 | 2003-08-21 | 김희중 | testicle holder attached to a panty |
KR100576703B1 (en) * | 2003-10-23 | 2006-05-03 | 한국전자통신연구원 | Metal-insulator transition high speed switching device and method for manufacturing the same |
KR100609699B1 (en) * | 2004-07-15 | 2006-08-08 | 한국전자통신연구원 | 2-terminal semiconductor device using abrupt metal-insulator transition semiconductor material |
-
2005
- 2005-05-11 KR KR1020050039098A patent/KR100639990B1/en not_active IP Right Cessation
- 2005-12-05 EP EP05821307A patent/EP1825519A4/en not_active Withdrawn
- 2005-12-05 US US11/721,069 patent/US7767501B2/en not_active Expired - Fee Related
- 2005-12-05 JP JP2007544274A patent/JP4920596B2/en not_active Expired - Fee Related
- 2005-12-05 WO PCT/KR2005/004116 patent/WO2006062317A1/en active Application Filing
- 2005-12-05 CN CN200580042261A patent/CN100585874C/en not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0282781A1 (en) * | 1987-03-16 | 1988-09-21 | International Business Machines Corporation | Contact to gallium-arsenide and method of forming such |
US5045502A (en) * | 1990-05-10 | 1991-09-03 | Bell Communications Research, Inc. | PdIn ohmic contact to GaAs |
US6392262B1 (en) * | 1999-01-28 | 2002-05-21 | Nec Corporation | Compound semiconductor device having low-resistive ohmic contact electrode and process for producing ohmic electrode |
US20030020114A1 (en) * | 2001-07-25 | 2003-01-30 | Motorola, Inc. | Metal-insulator-transition field-effect transistor utilizing a compliant substrate and method for fabricating same |
US20040084697A1 (en) * | 2002-10-18 | 2004-05-06 | Youn Doo Hyeb | Nitride semiconductor field effect transistor (FET) and method of fabricating the same |
Non-Patent Citations (3)
Title |
---|
GRBIC B ET AL: "Magnetotransport in C-doped AlGaAs heterostructures", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US, vol. 85, no. 12, 1 January 2004 (2004-01-01), pages 2277 - 2279, XP012062612, ISSN: 0003-6951, DOI: 10.1063/1.1781750 * |
MAJEWSKI L ET AL: "Organic field-effect transistors with electroplated platinum contacts", APPLIED PHYSICS LETTERS, AIP, AMERICAN INSTITUTE OF PHYSICS, MELVILLE, NY, US, vol. 85, no. 16, 1 January 2004 (2004-01-01), pages 3620 - 3622, XP012063041, ISSN: 0003-6951, DOI: 10.1063/1.1797540 * |
See also references of WO2006062317A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN100585874C (en) | 2010-01-27 |
JP2008523587A (en) | 2008-07-03 |
KR100639990B1 (en) | 2006-10-31 |
JP4920596B2 (en) | 2012-04-18 |
US7767501B2 (en) | 2010-08-03 |
WO2006062317A1 (en) | 2006-06-15 |
KR20060064461A (en) | 2006-06-13 |
US20090230428A1 (en) | 2009-09-17 |
CN101073156A (en) | 2007-11-14 |
EP1825519A1 (en) | 2007-08-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG114787A1 (en) | Semiconductor device and manufacturing method of the same | |
TWI371061B (en) | Semiconductor device and method of fabricating the same | |
HK1130232A1 (en) | Closure device and method of manufacturing the same | |
HK1211742A1 (en) | Methods and devices for fabricating and assembling printable semiconductor elements | |
TWI347640B (en) | Semiconductor device and method of fabricating the same | |
EP1756949A4 (en) | Semiconductor device and method of forming the same | |
EP1794255A4 (en) | Organic light-emitting device comprising buffer layer and method for fabricating the same | |
EP1805795A4 (en) | Planar substrate devices integrated with finfets and method of manufacture | |
GB2417130B (en) | Variable mask device for crystallizing silicon layer and method for crystalling using the same | |
TWI346826B (en) | Bonding structure and method of fabricating the same | |
EP1713399A4 (en) | Cmut devices and fabrication methods | |
AU2003289448A1 (en) | Semiconductor device and its fabricating method | |
HK1109175A1 (en) | Method of manufacturing hard layered coating and coating forming device | |
EP1769573A4 (en) | Multiple element electrode cmut devices and fabrication methods | |
EP1750336A4 (en) | Semiconductor optical device and a method of fabricating the same | |
EP1806769A4 (en) | Soi wafer manufacturing method and soi wafer | |
EP1817796A4 (en) | Semiconductor device and manufacturing method thereof | |
GB2430070B (en) | Organic electroluminescent device and method of fabricating the same | |
EP1757512A4 (en) | Steering device and method of manufacturing the same | |
EP1774580A4 (en) | Method of forming a semiconductor device and structure thereof | |
EP1737029A4 (en) | Substrate for device bonding and method for manufacturing same | |
GB0707819D0 (en) | Semiconductor device and manufacturing method thereof | |
EP1773572A4 (en) | Thermoplastic film and method of manufacturing the same | |
EP1825519A4 (en) | Device using abrupt metal-insulator transition layer and method of fabricating the device | |
EP1705699A4 (en) | Film forming device and film forming method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20070608 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
DAX | Request for extension of the european patent (deleted) | ||
A4 | Supplementary search report drawn up and despatched |
Effective date: 20101208 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 29/45 20060101ALI20101202BHEP Ipc: H01L 49/00 20060101AFI20101202BHEP |
|
17Q | First examination report despatched |
Effective date: 20120209 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20120821 |