EP1794530A4 - Heat riser - Google Patents

Heat riser

Info

Publication number
EP1794530A4
EP1794530A4 EP05798089A EP05798089A EP1794530A4 EP 1794530 A4 EP1794530 A4 EP 1794530A4 EP 05798089 A EP05798089 A EP 05798089A EP 05798089 A EP05798089 A EP 05798089A EP 1794530 A4 EP1794530 A4 EP 1794530A4
Authority
EP
European Patent Office
Prior art keywords
heat riser
riser
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05798089A
Other languages
German (de)
French (fr)
Other versions
EP1794530A2 (en
Inventor
Joseph P Capp
Gary G Chen
David S Flaherty
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Graftech International Holdings Inc
Original Assignee
Graftech International Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Graftech International Holdings Inc filed Critical Graftech International Holdings Inc
Publication of EP1794530A2 publication Critical patent/EP1794530A2/en
Publication of EP1794530A4 publication Critical patent/EP1794530A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
EP05798089A 2004-09-17 2005-09-13 Heat riser Withdrawn EP1794530A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/943,338 US20060070720A1 (en) 2004-09-17 2004-09-17 Heat riser
PCT/US2005/032574 WO2006033894A2 (en) 2004-09-17 2005-09-13 Heat riser

Publications (2)

Publication Number Publication Date
EP1794530A2 EP1794530A2 (en) 2007-06-13
EP1794530A4 true EP1794530A4 (en) 2009-04-29

Family

ID=36090472

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05798089A Withdrawn EP1794530A4 (en) 2004-09-17 2005-09-13 Heat riser

Country Status (5)

Country Link
US (1) US20060070720A1 (en)
EP (1) EP1794530A4 (en)
KR (1) KR20070083642A (en)
CN (1) CN101084704B (en)
WO (1) WO2006033894A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4299261B2 (en) * 2005-03-31 2009-07-22 東洋炭素株式会社 Method of using heat transfer sheet, heat dissipation structure and heat transfer sheet
DE202006010757U1 (en) * 2006-07-11 2006-11-02 Sgl Carbon Ag A method for providing an open refrigerated display cabinet with uniform temperature maintenance has an inner liner within the thermal insulation comprising a phase change material and graphite
US20100009174A1 (en) * 2008-07-10 2010-01-14 Reis Bradley E Heat Dissipation For Low Profile Devices
EP2321607A1 (en) * 2008-08-04 2011-05-18 Clustered Systems Company A contact cooled electronic enclosure
US8955580B2 (en) 2009-08-14 2015-02-17 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
TW201035513A (en) * 2009-03-25 2010-10-01 Wah Hong Ind Corp Method for manufacturing heat dissipation interface device and product thereof
US8537553B2 (en) * 2011-02-14 2013-09-17 Futurewei Technologies, Inc. Devices having anisotropic conductivity heatsinks, and methods of making thereof
CN103415184A (en) * 2013-07-23 2013-11-27 苏州天脉导热科技有限公司 Thermal transmission device and thermal diffusion device combining method
US9706684B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Exfoliated graphite materials and composite materials and devices for thermal management
US9700968B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Apparatus and methods for processing exfoliated graphite materials
US11840013B2 (en) 2018-02-27 2023-12-12 Matthews International Corporation Graphite materials and devices with surface micro-texturing

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000020525A1 (en) * 1998-10-07 2000-04-13 Ucar Carbon Technology Corporation Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
WO2001063983A2 (en) * 2000-02-25 2001-08-30 Graftech Inc. Thermal management system
US20020167800A1 (en) * 2001-05-02 2002-11-14 Smalc Martin D. Radial Finned Heat Sink
WO2003052340A1 (en) * 2001-12-13 2003-06-26 Graftech Inc. Heat dissipating component using high conducting inserts

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
US4895713A (en) * 1987-08-31 1990-01-23 Union Carbide Corporation Intercalation of graphite
US4961991A (en) * 1990-01-29 1990-10-09 Ucar Carbon Technology Corporation Flexible graphite laminate
US5198063A (en) * 1991-06-03 1993-03-30 Ucar Carbon Technology Corporation Method and assembly for reinforcing flexible graphite and article
US5260124A (en) * 1991-11-25 1993-11-09 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Intercalated hybrid graphite fiber composite
US5390734A (en) * 1993-05-28 1995-02-21 Lytron Incorporated Heat sink
US5545473A (en) * 1994-02-14 1996-08-13 W. L. Gore & Associates, Inc. Thermally conductive interface
US5566752A (en) * 1994-10-20 1996-10-22 Lockheed Fort Worth Company High heat density transfer device
US5902762A (en) * 1997-04-04 1999-05-11 Ucar Carbon Technology Corporation Flexible graphite composite
US6060166A (en) * 1998-02-05 2000-05-09 Raytheon Company Flexible graphite fiber thermal shunt
US6404061B1 (en) * 1999-02-26 2002-06-11 Rohm Co., Ltd. Semiconductor device and semiconductor chip
JP2000273196A (en) * 1999-03-24 2000-10-03 Polymatech Co Ltd Heat-conductive resin substrate and semiconductor package
EP2248645A1 (en) * 1999-04-07 2010-11-10 GrafTech International Holdings Inc. Flexible graphite article and method of manufacture
US6165612A (en) * 1999-05-14 2000-12-26 The Bergquist Company Thermally conductive interface layers
US6286591B1 (en) * 1999-11-08 2001-09-11 Space Systems/Loral, Inc. Thermal harness using thermal conductive fiber and polymer matrix material
US6841250B2 (en) * 2000-02-25 2005-01-11 Advanced Energy Technology Inc. Thermal management system
US6503626B1 (en) * 2000-02-25 2003-01-07 Graftech Inc. Graphite-based heat sink
US6469381B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Carbon-carbon and/or metal-carbon fiber composite heat spreader
US6407922B1 (en) * 2000-09-29 2002-06-18 Intel Corporation Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader
US7027304B2 (en) * 2001-02-15 2006-04-11 Integral Technologies, Inc. Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials
US6351386B1 (en) * 2001-03-13 2002-02-26 Motorola, Inc. Component shim for mounting a component on a heat spreader
US20020157819A1 (en) * 2001-04-04 2002-10-31 Julian Norley Graphite-based thermal dissipation component
US20020157818A1 (en) * 2001-04-04 2002-10-31 Julian Norley Anisotropic thermal solution
US7232601B2 (en) * 2001-05-31 2007-06-19 Advanced Energy Technology Inc. Method for preparing composite flexible graphite material
US6777086B2 (en) * 2001-08-31 2004-08-17 Julian Norley Laminates prepared from impregnated flexible graphite sheets
JP3938681B2 (en) * 2001-11-21 2007-06-27 信越化学工業株式会社 Heat dissipation structure
US7108055B2 (en) * 2002-03-29 2006-09-19 Advanced Energy Technology Inc. Optimized heat sink using high thermal conducting base and low thermal conducting fins
US20040118553A1 (en) * 2002-12-23 2004-06-24 Graftech, Inc. Flexible graphite thermal management devices
US20050016714A1 (en) * 2003-07-09 2005-01-27 Chung Deborah D.L. Thermal paste for improving thermal contacts
US6874573B2 (en) * 2003-07-31 2005-04-05 National Starch And Chemical Investment Holding Corporation Thermal interface material
US7160619B2 (en) * 2003-10-14 2007-01-09 Advanced Energy Technology Inc. Heat spreader for emissive display device
US6982874B2 (en) * 2003-11-25 2006-01-03 Advanced Energy Technology Inc. Thermal solution for electronic devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000020525A1 (en) * 1998-10-07 2000-04-13 Ucar Carbon Technology Corporation Flexible graphite with non-carrier pressure sensitive adhesive backing and release liner
WO2001063983A2 (en) * 2000-02-25 2001-08-30 Graftech Inc. Thermal management system
US20020167800A1 (en) * 2001-05-02 2002-11-14 Smalc Martin D. Radial Finned Heat Sink
WO2003052340A1 (en) * 2001-12-13 2003-06-26 Graftech Inc. Heat dissipating component using high conducting inserts

Also Published As

Publication number Publication date
WO2006033894A3 (en) 2007-06-07
CN101084704A (en) 2007-12-05
KR20070083642A (en) 2007-08-24
WO2006033894A2 (en) 2006-03-30
US20060070720A1 (en) 2006-04-06
EP1794530A2 (en) 2007-06-13
CN101084704B (en) 2011-08-10

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20070226

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

R17D Deferred search report published (corrected)

Effective date: 20070607

RIC1 Information provided on ipc code assigned before grant

Ipc: B23B 9/00 20060101ALI20070716BHEP

Ipc: H05K 7/20 20060101AFI20070716BHEP

RIN1 Information on inventor provided before grant (corrected)

Inventor name: FLAHERTY, DAVID, S.

Inventor name: CHEN, GARY, G.

Inventor name: CAPP, JOSEPH, P.

RIC1 Information provided on ipc code assigned before grant

Ipc: B32B 9/00 20060101ALI20071010BHEP

Ipc: H05K 7/20 20060101AFI20071010BHEP

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: GRAFTECH INTERNATIONAL HOLDINGS INC.

A4 Supplementary search report drawn up and despatched

Effective date: 20090326

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Effective date: 20090603

STAA Information on the status of an ep patent application or granted ep patent

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18D Application deemed to be withdrawn

Effective date: 20091014