EP1765723A1 - Procede pour modifier la microstructure d'un article - Google Patents

Procede pour modifier la microstructure d'un article

Info

Publication number
EP1765723A1
EP1765723A1 EP05774215A EP05774215A EP1765723A1 EP 1765723 A1 EP1765723 A1 EP 1765723A1 EP 05774215 A EP05774215 A EP 05774215A EP 05774215 A EP05774215 A EP 05774215A EP 1765723 A1 EP1765723 A1 EP 1765723A1
Authority
EP
European Patent Office
Prior art keywords
microstructure
materials
volume contraction
molding
carried out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP05774215A
Other languages
German (de)
English (en)
Inventor
Achim Hansen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OVD Kinegram AG
Original Assignee
OVD Kinegram AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OVD Kinegram AG filed Critical OVD Kinegram AG
Publication of EP1765723A1 publication Critical patent/EP1765723A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045

Definitions

  • volume modification of a microstructure on a material and / or in the material of an article is a volume modification of a microstructure on a material and / or in the material of an article.
  • Articles or materials with a microstructured surface are used, for example, as optical elements and components, as materials with defined modified surface properties, or as functional components.
  • Modified microstructured surfaces come e.g. as optical structures, for example in the form of holograms, as light-scattering structures, as
  • the wettability is e.g. known as the "lotus flower effect”; the electrical or electronic properties are e.g. structures for LCDs, "lab on chip", etc.
  • the mechanical properties are e.g. around the frictional behavior, i. influencing the coefficient of adhesion and / or sliding friction of the article formed with the corresponding microstructure.
  • Volume-modified materials or objects have, for example, microstructures in the form of holes, channels and / or openings in various Versions. Such volume-modified materials are used, for example, as filters, membranes, electronic components, etc.
  • the direct methods are for example a so-called direct structuring by means of a laser, lithographic methods such as an X-ray lithography method or in particular an electron beam lithography method, mask methods, etching methods, mechanical methods such as scribing, for example by means of diamonds. Embossing by means of matrices is also possible.
  • lithographic methods such as an X-ray lithography method or in particular an electron beam lithography method
  • mask methods etching methods
  • mechanical methods such as scribing, for example by means of diamonds.
  • Embossing by means of matrices is also possible.
  • In the molding process is a so-called direct structuring by means of a laser, lithographic methods such as an X-ray lithography method or in particular an electron beam lithography method, mask methods, etching methods, mechanical methods such as scribing, for example by means of diamonds. Embossing by means of matrices is also possible.
  • Molding e.g. by means of mechanical processes and / or by means of hardenable materials, e.g. can be UV cast resins or the like.
  • the present invention seeks to provide a method of the type mentioned, which is relatively simple and inexpensive suitable for the targeted modification of microstructures or microstructured materials.
  • the inventive method has the advantage that in a first process step, a corresponding microstructure is produced, and that this microstructure is then reduced by volume contraction of the material in their dimensions.
  • the volume contraction is preferably carried out while largely preserving the relative profiling of the microstructure.
  • the microstructure on and / or in the material of the article can be produced by means of all common methods, in particular by means of a lithography method or by means of a molding method.
  • the molding process can be performed by means of a die.
  • the molding of the die can be done by mechanical and / or thermal deformation by pressing or by pouring a medium.
  • the separation of the microstructured material from the die can be done mechanically, by etching, by solvent, by burning, by pyrolysis, etc., i. All possible methods are applicable.
  • the method according to the invention thus comprises the method steps:
  • the structuring of the respective material can - as has already been stated - by means of laser, by etching or dissolution of areas by means of solvents, by the use of matrices, etc. take place.
  • the molding of the matrices is usually carried out by mechanical and / or thermal deformation by pressing, by pouring a medium with subsequent solidification, or by known lithographic processes.
  • the solidification can be achieved by drying, by chemical curing e.g. UV curing, etc. take place.
  • the contact time between the die and the material depends on the particular system and on the desired and achievable properties. This contact time can be ⁇ 1 sec to several days.
  • the matrices can be off consist of different materials. These materials may be metals, plastics, inorganic materials, etc.
  • the separation of the matrices from the material can be purely mechanical, by etching, by solvent, ie dissolution of the template or for example the photoresist, or by burning or by pyrolysis.
  • the separation time of the die from the material depends on the system used. For example, curing takes place by means of UV radiation during the contact and a subsequent separation and controlled pyrolysis.
  • Filler expediently filler particles are used whose particle size is smaller than the dimensions of the coming for the impression
  • Microstructure It has proven to be expedient if the ratio of microstructural dimensions: particle sizes between 2: 1 and> 100: 1, preferably of the order of> 10: 1, is.
  • nanoparticles are available whose particle size is 3 to 30 nm. Such nanoparticles can be used, for example, in microstructures, such as a sinusoidal structure with 1000 lines / mm. Apart from the particle size, the shape of the filler particles can also be of great influence; Therefore, it may be advantageous if filler particles having an elongated, fibrous or platelet-like shape are used in the method according to the invention. Such filler particles of the latter type can allow a better impression of the structures and thus, if necessary, even at an unfavorable ratio of microstructural dimensions: particle size can be used. Also advantageous may be filler particles which can be deformed during molding. The filler particles may also have a round shape. The use of fillers can also lead to modifications of the microstructures. For example, a structuring of the microstructure can take place with "superimposed" nanostructures. This may be advantageous and desirable in certain applications.
  • the volume contraction of the material to reduce the structural dimensions can be effected by a physical and / or a chemical and / or biological process.
  • Drying process with release of water and / or solvent, by a setting process, by a sintering process, by a curing process or by targeted carbonization or coking of organic materials or
  • Ceramics take place. Likewise, in volume expansion, well-known source processes are applicable.
  • the articles produced by the process according to the invention can be used as components or as matrices for molding microstructures.
  • Applications of the materials are thus for example:
  • Materials with volume-modified properties for example with nanotubes in industrial applications, e.g. in filters, membranes, biological applications, in medicine, diagnostics, electronics, in optical

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Micromachines (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

L'invention concerne un procédé pour la modification d'une surface et/ou la modification d'un volume d'une microstructure sur et/ou dans la matière d'un article. La microstructure est produite initialement et/ou à l'intérieur de la matière, le volume de matière étant sensiblement contracté de manière à réduire les dimensions structurelles relatives de la microstructure de l'objet. Le procédé de l'invention est utilisé pour produire des microstructures très fines de manière simple et peu coûteuse.
EP05774215A 2004-07-10 2005-07-07 Procede pour modifier la microstructure d'un article Ceased EP1765723A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004033424A DE102004033424A1 (de) 2004-07-10 2004-07-10 Verfahren zur Modifikation einer Mikrostruktur eines Gegenstandes
PCT/EP2005/007358 WO2006005515A1 (fr) 2004-07-10 2005-07-07 Procede pour modifier la microstructure d'un article

Publications (1)

Publication Number Publication Date
EP1765723A1 true EP1765723A1 (fr) 2007-03-28

Family

ID=35148777

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05774215A Ceased EP1765723A1 (fr) 2004-07-10 2005-07-07 Procede pour modifier la microstructure d'un article

Country Status (8)

Country Link
US (1) US20080088045A1 (fr)
EP (1) EP1765723A1 (fr)
JP (1) JP2008505758A (fr)
KR (1) KR20070042991A (fr)
CN (1) CN1980853A (fr)
DE (1) DE102004033424A1 (fr)
RU (1) RU2357883C2 (fr)
WO (1) WO2006005515A1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020037233A1 (en) * 2000-09-26 2002-03-28 Billiet Romain L. Method for making micromolds

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB991581A (en) * 1962-03-21 1965-05-12 High Temperature Materials Inc Expanded pyrolytic graphite and process for producing the same
DE3611271A1 (de) * 1986-04-04 1987-10-15 Licentia Gmbh Verfahren zur herstellung von metallformteilen
US4942102A (en) * 1988-01-15 1990-07-17 E. I. Du Pont De Nemours And Company Holographic optical elements having a reflection hologram formed in a photopolymer
US5124188A (en) * 1990-04-02 1992-06-23 The Procter & Gamble Company Porous, absorbent, polymeric macrostructures and methods of making the same
US5308556A (en) * 1993-02-23 1994-05-03 Corning Incorporated Method of making extrusion dies from powders
JP3886020B2 (ja) * 1995-03-20 2007-02-28 日本碍子株式会社 セラミックス積層焼結体の製造方法およびグリーン成形体の積層体
US6077464A (en) * 1996-12-19 2000-06-20 Alliedsignal Inc. Process of making carbon-carbon composite material made from densified carbon foam
US6143412A (en) * 1997-02-10 2000-11-07 President And Fellows Of Harvard College Fabrication of carbon microstructures
DE10021490C2 (de) * 2000-05-03 2002-03-28 Lin Ching Bin Mikroherstellungsprozess zur Herstellung von geometrisch miniaturisierten Mikrostrukturen aus dreidimensionalen Gebilden
DE10034507C1 (de) * 2000-07-15 2002-02-21 Schott Glas Verfahren zum Erzeugen von Mikrostrukturen auf Glas- oder Kunststoffsubstraten nach der Heißformtechnologie und zugehöriges Formgebungswerkzeug
NL1016779C2 (nl) * 2000-12-02 2002-06-04 Cornelis Johannes Maria V Rijn Matrijs, werkwijze voor het vervaardigen van precisieproducten met behulp van een matrijs, alsmede precisieproducten, in het bijzonder microzeven en membraanfilters, vervaardigd met een dergelijke matrijs.
US6656398B2 (en) * 2001-06-19 2003-12-02 Corning Incorporated Process of making a pattern in a film
JP2003008213A (ja) * 2001-06-26 2003-01-10 Ibiden Co Ltd 配線板およびその製造方法
DE10332725A1 (de) * 2003-07-18 2005-02-24 Forschungszentrum Jülich GmbH Verfahren zur selbstjustierenden Verkleinerung von Strukturen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020037233A1 (en) * 2000-09-26 2002-03-28 Billiet Romain L. Method for making micromolds

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
BERTSCH A; JIGUET S; RENAUD P: "Microfabrication of ceramic components by microstereolithography", JOURNAL OF MICROMECHANICS AND MICROENGINEERING, vol. 14, no. 2, 15 October 2003 (2003-10-15), IOP Publishing UK, pages 197 - 203, XP020069609 *
MORALES A M; GARINO T J; BOYCE B L; DOMEIER L A; GUTMANN A K; MCLEAN D E: "Micromolding and sintering of nanoparticle preforms into microparts", PROCEEDINGS OF THE SPIE, vol. 4979, 27 January 2003 (2003-01-27) - 29 January 2003 (2003-01-29), SPIE-Int. Soc. Opt. Eng USA, pages 430 - 439, XP007904035 *
See also references of WO2006005515A1 *
TANAKA S; SUGIMOTO S; LI J -F; WATANABE R; ESASHI M: "Silicon carbide micro-reaction-sintering using micromachined silicon molds", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS MARCH 2001, vol. 10, no. 1, 1 March 2001 (2001-03-01), IEEE USA, pages 55 - 61, XP011034624 *

Also Published As

Publication number Publication date
CN1980853A (zh) 2007-06-13
US20080088045A1 (en) 2008-04-17
KR20070042991A (ko) 2007-04-24
DE102004033424A1 (de) 2006-02-02
WO2006005515A1 (fr) 2006-01-19
RU2007105110A (ru) 2008-08-20
RU2357883C2 (ru) 2009-06-10
JP2008505758A (ja) 2008-02-28

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