EP1753549A4 - Methods for wet cleaning quartz surfaces of components for plasma processing chambers - Google Patents
Methods for wet cleaning quartz surfaces of components for plasma processing chambersInfo
- Publication number
- EP1753549A4 EP1753549A4 EP05756207A EP05756207A EP1753549A4 EP 1753549 A4 EP1753549 A4 EP 1753549A4 EP 05756207 A EP05756207 A EP 05756207A EP 05756207 A EP05756207 A EP 05756207A EP 1753549 A4 EP1753549 A4 EP 1753549A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- methods
- components
- plasma processing
- processing chambers
- wet cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/863,360 US20050274396A1 (en) | 2004-06-09 | 2004-06-09 | Methods for wet cleaning quartz surfaces of components for plasma processing chambers |
PCT/US2005/019466 WO2005123282A2 (en) | 2004-06-09 | 2005-06-03 | Methods for wet cleaning quartz surfaces of components for plasma processing chambers |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1753549A2 EP1753549A2 (en) | 2007-02-21 |
EP1753549A4 true EP1753549A4 (en) | 2009-09-16 |
Family
ID=35459232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05756207A Withdrawn EP1753549A4 (en) | 2004-06-09 | 2005-06-03 | Methods for wet cleaning quartz surfaces of components for plasma processing chambers |
Country Status (8)
Country | Link |
---|---|
US (2) | US20050274396A1 (en) |
EP (1) | EP1753549A4 (en) |
JP (1) | JP4648392B2 (en) |
KR (1) | KR20070033419A (en) |
CN (1) | CN101194046B (en) |
IL (1) | IL179875A0 (en) |
TW (1) | TWI364327B (en) |
WO (1) | WO2005123282A2 (en) |
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Also Published As
Publication number | Publication date |
---|---|
TWI364327B (en) | 2012-05-21 |
CN101194046B (en) | 2011-04-13 |
WO2005123282A2 (en) | 2005-12-29 |
IL179875A0 (en) | 2007-05-15 |
EP1753549A2 (en) | 2007-02-21 |
WO2005123282A3 (en) | 2008-02-21 |
KR20070033419A (en) | 2007-03-26 |
CN101194046A (en) | 2008-06-04 |
TW200610592A (en) | 2006-04-01 |
JP2008506530A (en) | 2008-03-06 |
US20110146909A1 (en) | 2011-06-23 |
JP4648392B2 (en) | 2011-03-09 |
US20050274396A1 (en) | 2005-12-15 |
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