EP1722013A4 - Electroplating in presence of co2 - Google Patents

Electroplating in presence of co2

Info

Publication number
EP1722013A4
EP1722013A4 EP05710181A EP05710181A EP1722013A4 EP 1722013 A4 EP1722013 A4 EP 1722013A4 EP 05710181 A EP05710181 A EP 05710181A EP 05710181 A EP05710181 A EP 05710181A EP 1722013 A4 EP1722013 A4 EP 1722013A4
Authority
EP
European Patent Office
Prior art keywords
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05710181A
Other languages
German (de)
French (fr)
Other versions
EP1722013A1 (en
Inventor
T Nagai
K Fujii
H Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Publication of EP1722013A1 publication Critical patent/EP1722013A1/en
Publication of EP1722013A4 publication Critical patent/EP1722013A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
EP05710181A 2004-02-12 2005-02-14 Electroplating in presence of co2 Withdrawn EP1722013A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004035281 2004-02-12
JP2004349651A JP4673612B2 (en) 2004-02-12 2004-12-02 Electroplating in the presence of CO2
PCT/JP2005/002179 WO2005078161A1 (en) 2004-02-12 2005-02-14 Electroplating in presence of co2

Publications (2)

Publication Number Publication Date
EP1722013A1 EP1722013A1 (en) 2006-11-15
EP1722013A4 true EP1722013A4 (en) 2007-08-08

Family

ID=34863449

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05710181A Withdrawn EP1722013A4 (en) 2004-02-12 2005-02-14 Electroplating in presence of co2

Country Status (5)

Country Link
US (1) US20070175763A1 (en)
EP (1) EP1722013A4 (en)
JP (1) JP4673612B2 (en)
KR (1) KR20070001174A (en)
WO (1) WO2005078161A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007063598A (en) * 2005-08-30 2007-03-15 Tokyo Univ Of Agriculture & Technology Porous metallic thin film and production method therefor
JP4919262B2 (en) * 2006-06-02 2012-04-18 日立マクセル株式会社 Storage container, resin molding method and plating film forming method
JP5324191B2 (en) 2008-11-07 2013-10-23 ルネサスエレクトロニクス株式会社 Semiconductor device
US20120245019A1 (en) * 2011-03-23 2012-09-27 Brookhaven Science Associates, Llc Method and Electrochemical Cell for Synthesis of Electrocatalysts by Growing Metal Monolayers, or Bilayers and Treatment of Metal, Carbon, Oxide and Core-Shell Nanoparticles
CN106222729B (en) * 2014-08-20 2018-02-06 江苏理工学院 Overcritical composite plating processing drill method based on mobile anode
US10011918B2 (en) * 2014-12-23 2018-07-03 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and process of electro-chemical plating

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1314799B1 (en) * 2000-08-24 2013-10-16 Hideo Yoshida Electrochemical treating method such as electroplating and electrochemical reaction device therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number Publication date
WO2005078161A1 (en) 2005-08-25
KR20070001174A (en) 2007-01-03
JP4673612B2 (en) 2011-04-20
JP2005256162A (en) 2005-09-22
EP1722013A1 (en) 2006-11-15
US20070175763A1 (en) 2007-08-02

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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17P Request for examination filed

Effective date: 20060907

AK Designated contracting states

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

RTI1 Title (correction)

Free format text: ELECTROPLATING IN PRESENCE OF CO2

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20070709

STAA Information on the status of an ep patent application or granted ep patent

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18W Application withdrawn

Effective date: 20080310