EP1716586B1 - Device for inspecting and rotating electronic components - Google Patents

Device for inspecting and rotating electronic components Download PDF

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Publication number
EP1716586B1
EP1716586B1 EP05701621A EP05701621A EP1716586B1 EP 1716586 B1 EP1716586 B1 EP 1716586B1 EP 05701621 A EP05701621 A EP 05701621A EP 05701621 A EP05701621 A EP 05701621A EP 1716586 B1 EP1716586 B1 EP 1716586B1
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EP
European Patent Office
Prior art keywords
carrier
rotation
pickup element
optical device
rotatable member
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EP05701621A
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German (de)
French (fr)
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EP1716586A1 (en
Inventor
Sigmund Niklas
Rene Glas
Manfred Brandl
Franz Brandl
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Muehlbauer GmbH and Co KG
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Muehlbauer GmbH and Co KG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Definitions

  • the invention relates to a device and a method for checking and turning over electronic components, in particular flip chips, with a rotatably mounted at a pivot member for reversing the electronic components, wherein on the outside of the component a first receiving element for receiving a single electronic component of a carrier and whose retention is secured during a rotational movement of the component, according to the preambles of claims 1 and 7.
  • the vacuum pipette is usually arranged as a flip tool on a flip head of a component rotatably mounted about a pivot point and holds the received chip during a 180 ° rotation of the rotatable component. After the 180 ° rotation has taken place, the chip thus turned over is picked up by a pick-and-place element on its rear side, after which the chip is reversed to transport to the desired position, for example within a smart card module.
  • a first optical device for example a camera
  • the camera Since an optical interconnection line aligned perpendicular to the surface of the wafer and the chip between the first optical device and the wafer surface is important for optimized inspection, the camera is located directly above the male chip. Therefore, the rotatable member must be unscrewed from the vertically extending optical connection line each time before picking up a chip in order to perform a so-called wafer inspection.
  • the present invention has for its object to provide an apparatus and a method for checking and turning over electronic components, in particular flip chips, with a rotatable component for turning the components available, which are time and cost-saving.
  • An essential point of the invention is that in a device for checking and turning over electronic components, such as flip chips, with a rotatably mounted on a pivot member for reversing the electronic components, on the outside a first receiving element for receiving a single component of a support and its holding is fixed during a rotational movement, a second receiving element is the first receiving element with respect to the fulcrum opposite to the outside of the component is arranged, that in each case a receiving element at each rotation of the component by 180 ° facing the carrier.
  • the component between the receiving elements has a passage opening in such a way that the passage opening faces the carrier during a rotation of the rotatable component by 90 ° or 270 °.
  • the chip can be received by the carrier through the first receiving element formed, for example, as a vacuum pipette, after rotation about the first 90 °, an optical connecting line between a first optical line arranged above the rotatable component Device for checking the surface and the correct position position of a further arranged on the carrier chip due to the vertically aligned through hole and a drop of meanwhile reversed chip take place after a 180 ° rotation occurred on a likewise above the rotatable member and slidable depositing device.
  • the first receiving element formed, for example, as a vacuum pipette
  • the further component is received by the carrier by means of the second receiving element, which can likewise be embodied as a vacuum pipette, since in the meantime the second receiving element is arranged above the wafer surface.
  • the second receiving element is arranged above the wafer surface.
  • the first receiving element is attached to a first projection and the second receiving element to a second projection of the component.
  • the through-hole may then be formed between the projections as a through-channel open at one of its longitudinal sides.
  • a second optical device in the form of a camera for checking a correct position of the already reversed and optionally deposited chip is arranged in order to determine a flip-offset and to be able to pass correction data to the depositing device for correcting the chip position accordingly.
  • the first optical device is activated with a predeterminable time delay after the pivoting opening has been pivoted into the optical connecting line between the first optical device and the chip to be checked arranged on the carrier. In this way, it is possible to reliably avoid blurred images caused by the projections rotating with the component.
  • Fig. 1 can be seen in a schematic front view, has been used according to the prior art for the replacement of individual semiconductor chips not shown here from a wafer or its carrier 1 by means of a die-Ejector 2, a rotatable member 3, which by training a projecting into the plane of rotation axis for the formation of a pivot point 4 at the left-side end of the component in and out pivoting a flip-5 with a pickup element 6 arranged thereon of an optical connecting line between a first optical device 7 and the wafer surface allows.
  • the solid lines of the flip-head represent a pick-up position of the chip to be picked up, whereas the dotted lines of the flip-flop 5 represent a depositing position or place position following a picking operation on a depositing device 8.
  • the depositing device 8 also has a receiving element 9, for example in the form of a vacuum pipette, in order to deposit the now turned-over chip by displacing the depositing device 8, for example, within a smartcard module.
  • such a rotatable component has only one receiving element and, on the other hand, requires the sequential time-consuming process sequence already described.
  • Fig. 2 is shown in a schematic front view of an apparatus for checking and turning over semiconductor chips according to an embodiment of the invention.
  • This illustration shows that above a wafer and an associated Carrier 11 having a wafer surface 11a, are ejected from the individual semiconductor chips by means of a die ejector 12 from bottom to top, a rotatable member 14 is arranged such that it is carried out at a rotation 15, 16 about a pivot point 17, which above the is arranged to be picked chips turns.
  • the wafer can be displaced with the carrier 11 in the x or y direction, as indicated by the double arrow 13.
  • the rotatable component 14 has at jaw-like projections 18a and 18b, two opposing receiving elements 19, 20 - for example in the form of vacuum pipettes - on which allow a simultaneous loading and unloading of two semiconductor chips.
  • the first vacuum pipette 19 can receive a semiconductor chip from the carrier 11, while the second vacuum pipette 20 deposits another semiconductor chip on a depositing device 21, which can be equipped, for example, with a further vacuum pipette 22. Subsequently, the depositing device 21 is displaced laterally, as indicated by the double arrow 24.
  • rotatable member 14 rotates about its pivot point 17 - this time in the opposite direction to the previous rotation -, wherein after a 90 ° rotation arranged in the rotatable member 14 through hole not shown here a viewing channel 23a of a first optical device 23rd extending vertically through the component 14 all the way to the surface 11a of the wafer-covered carrier 11 to form a further semiconductor chip.
  • This viewing channel serves to perform a short-term recording by the first optical device 23 designed as a camera from the further semiconductor chip to be recorded on the carrier 11 for its verification of the surface and its correct position position in the future.
  • a second optical device in the form of a die-on-fly camera 25 is arranged to check a flip-off set of the already reversed chip. It calculates in the case of the presence of a flipoffset corresponding correction data and outputs this to the settable Place element 21 continues. The place element 21 then deposits the chip in an indexer 26, its position being checked by another camera 27.
  • FIG. 3 is a perspective view of a possible embodiment of a rotatable member 14 for its arrangement in a device according to the invention for checking and turning of electronic components shown.
  • the rotatable component is equipped at its pivot point 17 with a hole for receiving a rotation axis, not shown here, around which the component 14 rotates.
  • the jaw-shaped projections 18a and 18b serve to receive and fix receiving elements, not shown here, which may be formed, for example, as vacuum pipettes.
  • the through-opening 28 is designed as a through-channel which is open on a longitudinal side and which has been milled into the component in a simple manner.
  • the component 14 allows during its rotation about an axis disposed in a borehole 29 axis of rotation a maximum inspection window from a distance between the projections 18a and 18b. This distance may have, for example, an order of magnitude of approximately 20 mm.
  • the inspection window Upon further rotation over the 90 ° position of the rotatable component 14, the inspection window then decreases again and disappears completely in the case of a 180 ° position of the rotatable component 14.
  • Fig. 5 is shown in a simple schematic front view of the operation of the device according to the invention.
  • the optical connecting line 23a can be set up by the camera 23 to the semiconductor chip to be removed on the carrier 11.
  • a short pivoting of the passage opening 28 into the optical connection line 23a is a short-term recording of the surface and the situation of the semiconductor chip to be removed.
  • Further rotation of the component in a counterclockwise direction, as indicated by the arrow 15, can pivot the receiving element, not shown here, to the chip to be removed and picking up.
  • a 180 ° rotation of the component in the opposite direction, ie in the clockwise direction as shown by arrow 16 takes place.
  • Fig. 6 In a schematic representation, the observation or inspection areas which are available to the camera 23 during a rotation of the component 14 formed with the passage opening 28 are shown. For an entire 360 ° rotation of the component and the passage opening in the counterclockwise direction (reference numeral 31) and in the clockwise direction (reference numeral 32), as it is also indicated by arrows 33 and 34, are available inspection areas 35 and 36 at an approx 90 ° position of the component formed.
  • the camera is activated with a time delay of approximately 10 msec, as represented by angle sections 37 and 38.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The testing and rotating device has a rotatable component (14) provided with a pair of opposing reception elements (19,20), each used for reception of an individual electronic component from a carrier (11), with clamping of the electronic component during rotation through 180 degrees relative to the carrier. The rotatable element has a through bore between the reception elements positioned at 90 degrees or 270 degrees to the carrier upon each rotation (15,16). An independent claim for a method for testing and rotation of an electronic component is also included.

Description

Die Erfindung betrifft eine Vorrichtung und ein Verfahren zum Überprüfen und Umdrehen elektronischer Bauelemente, insbesondere Flipchips, mit einem an einem Drehpunkt drehbar gelagerten Bauteil zum Umdrehen der elektronischen Bauelemente, wobei an dem Bauteil außenseitig ein erstes Aufnahmeelement zum Aufnehmen eines einzelnen elektronischen Bauelementes von einem Träger und dessen Festhalten während einer Drehbewegung des Bauteils befestigt ist, gemäß den Oberbegriffen der Patentansprüche 1 und 7.The invention relates to a device and a method for checking and turning over electronic components, in particular flip chips, with a rotatably mounted at a pivot member for reversing the electronic components, wherein on the outside of the component a first receiving element for receiving a single electronic component of a carrier and whose retention is secured during a rotational movement of the component, according to the preambles of claims 1 and 7.

Bei Verfahren, die auf einem Flipchip-Prinzip basieren, werden bekannterweise einzelne in einem Verbund getrennt voneinander angeordnete elektronische Bauteile, wie in einem Wafer angeordnete Halbleiterchips, wobei der Wafer wiederum auf einer dehnbaren Trägerfolie aufgesetzt ist, von dieser Trägerfolie aufgenommen und umgedreht, also auf den Kopf gestellt, um sie in der umgedrehten Lage für das sich anschließende Die-Bond bzw. Die-Sort abzulegen. Hierfür wird der einzelne Chip zunächst von der Rückseite der Trägerfolie her mittels einer Nadel, dem sogenannten Die-Ejector abgelöst und mit einem von der Vorderseite beziehungsweise von oben herangeführten Aufnahmeelement, wie einer Vakuumpipette, übernommen. Die Vakuumpipette ist hierfür in der Regel als Fliptool an einem Fliphead eines um einen Drehpunkt drehbar gelagerten Bauteiles angeordnet und hält den aufgenommenen Chip während einer 180°-Drehung des drehbaren Bauteils fest. Nach der stattgefundenen 180°-Drehung wird der auf diese Weise umgedrehte Chip von einem Pick-and-Place-Element an seiner Rückseite aufgenommen, um den Chip in umgedrehter Lage anschließend zu der gewünschten Position, beispielsweise innerhalb eines Smartcard-Moduls, zu transportieren.In the case of methods which are based on a flip-chip principle, it is known that individual electronic components arranged in a composite, such as semiconductor chips arranged in a wafer, the wafer in turn being placed on a stretchable carrier film, are picked up by this carrier film and turned over, ie put upside down to put them in the upside down position for the subsequent die-bond or die-sort. For this purpose, the individual chip is first detached from the rear side of the carrier film by means of a needle, the so-called die ejector, and taken over with a receiving element, such as a vacuum pipette, brought up from the front or from above. For this purpose, the vacuum pipette is usually arranged as a flip tool on a flip head of a component rotatably mounted about a pivot point and holds the received chip during a 180 ° rotation of the rotatable component. After the 180 ° rotation has taken place, the chip thus turned over is picked up by a pick-and-place element on its rear side, after which the chip is reversed to transport to the desired position, for example within a smart card module.

Um die Oberfläche des einzelnen noch auf dem Träger angeordneten Chip vor seiner Aufnahme auf Unversehrtheit zu überprüfen und zugleich eine Prüfung seiner korrekten Lageposition vor dessen Aufnahme durchführen zu können, ist oberhalb des drehbaren Bauteiles eine erste optische Einrichtung, beispielsweise eine Kamera, zur Inspektion des Wafers angeordnet. Da eine senkrecht zur Oberfläche des Wafers und des Chip ausgerichtete optische Verbindungslinie zwischen der ersten optischen Einrichtung und der Waferoberfläche für eine optimierte Überprüfung wichtig ist, ist die Kamera direkt oberhalb des aufzunehmenden Chips angeordnet. Deshalb muss das drehbare Bauteil aus der vertikal verlaufenden optischen Verbindungslinie jedesmal vor der Aufnahme eines Chip herausgedreht werden, um eine sogenannte Waferinspektion durchführen zu können.In order to check the integrity of the surface of the individual chip still arranged on the carrier before it is picked up, and at the same time to be able to test its correct positional position before it is picked up, a first optical device, for example a camera, for inspecting the wafer is above the rotatable component arranged. Since an optical interconnection line aligned perpendicular to the surface of the wafer and the chip between the first optical device and the wafer surface is important for optimized inspection, the camera is located directly above the male chip. Therefore, the rotatable member must be unscrewed from the vertically extending optical connection line each time before picking up a chip in order to perform a so-called wafer inspection.

Dies hat folgenden sequentiell stattfindenden Verfahrensablauf für jeden Flipchip zur Folge: Zunächst muss eine Überprüfung der Oberfläche des aufzunehmenden Chips mittels der Kamera durchgeführt werden. Anschließend findet ein Hineindrehen des Flipheads in die optische Verbindungslinie statt, um mittels der daran befestigten Vakuumpipette den Chip an seiner oberseitigen Oberfläche aufzunehmen. Nun wird der Chip mittels des drehbaren Bauteils, dessen Drehachse außerhalb der optischen Verbindungslinie angeordnet ist, um 180° derart gedreht, dass sich der Fliphead in einer umgedrehten Lage außerhalb der optischen Verbindungslinie befindet. Eine mittels einer zweiten optischen Einrichtung in Form einer Kamera durchgeführte weitere Überprüfung der Lageposition des Chips soll Daten zu einem Flipoffset des geflippten Chip liefern. Danach wird der geflippte bzw. umgedrehte Chip an eine Ablegeeinrichtung in Form eines Placehead übergeben, und eine Korrektur des Flipoffsets aufgrund übergebener Korrekturwerte durchgeführt.This results in the following sequential process flow for each flip chip: First of all, a check of the surface of the chip to be recorded has to be carried out by means of the camera. Subsequently, turning the flip-head into the optical connection line takes place in order to receive the chip on its upper-side surface by means of the vacuum pipette attached to it. Now the chip is rotated by 180 ° by means of the rotatable component whose rotation axis is arranged outside the optical connecting line such that the flip head is in an inverted position outside the optical connecting line. A further check of the positional position of the chip carried out by means of a second optical device in the form of a camera is intended to supply data to a flip-flop of the flipped chip. Thereafter, the flipped chip is transferred to a depositor in the form of a placehead, and a correction of the flipoff set is performed based on delivered correction values.

Ein derartiger Ablauf aufeinanderfolgender Schritte hat einen hohen Zeitaufwand für das gesamte Verfahren zum Überprüfen und Umdrehen eines Chips zur Folge und mindert dadurch den Durchsatz der Vorrichtung. Damit verursacht er auch höhere Betriebskosten.Such a sequence of sequential steps involves a great deal of time for the entire process of checking and turning over a chip, thereby reducing the throughput of the device. This also causes higher operating costs.

US 2003/0161711 beschreibt eine Vorrichtung zum Überprüfen und Umdrehen von Bauelementen gemäß dem Stand der Technik. US 2003/0161711 describes a device for checking and turning over components according to the prior art.

Demzufolge liegt der vorliegenden Erfindung die Aufgabe zugrunde, eine Vorrichtung und ein Verfahren zum Überprüfen und Umdrehen elektronischer Bauelemente, insbesondere Flipchips, mit einem drehbaren Bauteil zum Umdrehen der Bauelemente zur Verfügung zu stellen, welche zeit- und kostensparend sind.Accordingly, the present invention has for its object to provide an apparatus and a method for checking and turning over electronic components, in particular flip chips, with a rotatable component for turning the components available, which are time and cost-saving.

Diese Aufgabe wird vorrichtungsseitig gemäß den Merkmalen des Patentanspruches 1 und verfahrensseitig gemäß den Merkmalen des Patentanspruches 7 gelöst.This object is achieved on the device side according to the features of claim 1 and method side according to the features of claim 7.

Ein wesentlicher Punkt der Erfindung liegt darin, dass bei einer Vorrichtung zum Überprüfen und Umdrehen elektronischer Bauelemente, wie Flipchips, mit einem an einem Drehpunkt drehbar gelagerten Bauteil zum Umdrehen der elektronischen Bauelemente, an dem außenseitig ein erstes Aufnahmeelement zum Aufnehmen eines einzelnen Bauelements von einem Träger und dessen Festhalten während einer Drehbewegung befestigt ist, ein zweites Aufnahmeelement dem ersten Aufnahmeelement bezüglich dem Drehpunkt gegenüberliegend derart außenseitig am Bauteil angeordnet ist, dass jeweils ein Aufnahmeelement bei jeder Drehung des Bauteils um 180° dem Träger zugewandt ist. Zudem weist das Bauteil zwischen den Aufnahmeelementen eine Durchgangsöffnung derart auf, dass die Durchgangsöffnung bei einer Drehung des drehbaren Bauteils um 90° oder 270° dem Träger zugewandt ist. Auf diese Weise kann während einer 180°-Drehung des drehbaren Bauteiles zunächst der Chip von dem Träger durch das beispielsweise als Vakuumpipette ausgebildete erste Aufnahmeelement aufgenommen werden, nach einer Drehung um die ersten 90° eine optische Verbindungslinie zwischen einer oberhalb des drehbaren Bauteils angeordneten ersten optischen Einrichtung zum Überprüfen der Oberfläche und der korrekten Lageposition eines weiteren auf dem Träger angeordneten Chips aufgrund der vertikal ausgerichteten Durchgangsöffnung und ein Ablegen des mittlerweile umgedrehten Chips nach einer stattgefundenen 180°-Drehung auf einer ebenso oberhalb des drehbaren Bauteils angeordneten und verschiebbaren Ablegeeinrichtung stattfinden. Zugleich wird mittels des zweiten ebenso als Vakuumpipette ausbildbaren Aufnahmeelementes das weitere Bauteil von dem Träger aufgenommen, da mittlerweile das zweite Aufnahmeelement über der Waferoberfläche angeordnet ist. Eine sich anschließende weitere 180°-Drehung in umgekehrter Richtung des drehbaren Bauteiles hat einen erneuten Ablauf des oben beschriebenen Verfahrens zur Folge.An essential point of the invention is that in a device for checking and turning over electronic components, such as flip chips, with a rotatably mounted on a pivot member for reversing the electronic components, on the outside a first receiving element for receiving a single component of a support and its holding is fixed during a rotational movement, a second receiving element is the first receiving element with respect to the fulcrum opposite to the outside of the component is arranged, that in each case a receiving element at each rotation of the component by 180 ° facing the carrier. In addition, the component between the receiving elements has a passage opening in such a way that the passage opening faces the carrier during a rotation of the rotatable component by 90 ° or 270 °. In this way, during a 180 ° rotation of the rotatable component, firstly the chip can be received by the carrier through the first receiving element formed, for example, as a vacuum pipette, after rotation about the first 90 °, an optical connecting line between a first optical line arranged above the rotatable component Device for checking the surface and the correct position position of a further arranged on the carrier chip due to the vertically aligned through hole and a drop of meanwhile reversed chip take place after a 180 ° rotation occurred on a likewise above the rotatable member and slidable depositing device. At the same time, the further component is received by the carrier by means of the second receiving element, which can likewise be embodied as a vacuum pipette, since in the meantime the second receiving element is arranged above the wafer surface. A subsequent further 180 ° rotation in the reverse direction of the rotatable component results in a renewed sequence of the method described above.

Da innerhalb einer einzigen 180°-Drehung des drehbaren erfindungsgemäß ausgestalteten Bauteils eine Wafer-Inspektion, ein Auf- und Ablegen des Chips sowie dessen Umdrehen und zudem die Aufnahme eines weiteren Chips erfolgen kann, wird hierdurch eine erhebliche Zeitersparnis erreicht. Dies erhöht den Durchsatz der gesamten Vorrichtung erheblich und reduziert somit die Betriebskosten der Vorrichtung.Since within a single 180 ° rotation of the rotatable component designed according to the invention, a wafer inspection, a loading and unloading of the chip as well as its reversal and also the inclusion of a further chip can take place, a considerable saving of time is thereby achieved. This significantly increases the throughput of the entire device and thus reduces the operating cost of the device.

Gemäß einer bevorzugten Ausführungsform ist das erste Aufnahmeelement an einem ersten Vorsprung und das zweite Aufnahmeelement an einem zweiten Vorsprung des Bauteils befestigt. Die Durchgangsöffnung kann dann zwischen den Vorsprüngen als ein an einer seiner Längsseiten offener Durchgangskanal ausgebildet sein. Dies hat zur Folge, dass nicht nur die Vakuumpipetten in optimierter Weise an dem drehbaren Bauteil befestigbar sind, sondern auch eine einfache Herstellung des Durchgangskanals durch einen Fräsvorgang und somit eine kostengünstige Herstellung möglich ist. Zudem wird durch eine derartige Ausbildung des drehbaren Bauteiles erreicht, dass eine senkrecht zum Verlauf des Durchgangskanals sich erstreckende Drehachse nicht sichthindernd für die erste optische Einrichtung innerhalb des Durchgangskanals angeordnet ist.According to a preferred embodiment, the first receiving element is attached to a first projection and the second receiving element to a second projection of the component. The through-hole may then be formed between the projections as a through-channel open at one of its longitudinal sides. This has the consequence that not only the vacuum pipettes can be fastened in an optimized manner to the rotatable component, but also a simple production of the through-channel by a milling process and thus a cost-effective production is possible. In addition, it is achieved by such a design of the rotatable component that a perpendicular to the course of the through-channel extending axis of rotation is not arranged obstructing view of the first optical device within the through-channel.

Vorzugsweise ist eine zweite optische Einrichtung in Form einer Kamera zur Überprüfung einer korrekten Lage des bereits umgedrehten und gegebenenfalls abgelegten Chips angeordnet, um einen Flipoffset ermitteln zu können und dementsprechend Korrekturdaten an die Ablegeeinrichtung zur Korrektur der Chiplage weitergeben zu können.Preferably, a second optical device in the form of a camera for checking a correct position of the already reversed and optionally deposited chip is arranged in order to determine a flip-offset and to be able to pass correction data to the depositing device for correcting the chip position accordingly.

Die erste optische Einrichtung wird mit einer vorbestimmbaren Zeitverzögerung nach einem Hineindrehen bzw. Hineinschwenken der Durchgangsöffnung in die optische Verbindungslinie zwischen der ersten optischen Einrichtung und dem zu überprüfenden auf dem Träger angeordneten Chip aktiviert. Auf diese Weise lassen sich bedingt durch die sich mit dem Bauteil drehenden Vorsprünge hervorgerufenen verwischten Bilder zuverlässig vermeiden.The first optical device is activated with a predeterminable time delay after the pivoting opening has been pivoted into the optical connecting line between the first optical device and the chip to be checked arranged on the carrier. In this way, it is possible to reliably avoid blurred images caused by the projections rotating with the component.

Weitere vorteilhafte Ausführungsformen ergeben sich aus den Unteransprüchen.Further advantageous embodiments will become apparent from the dependent claims.

Vorteile und Zweckmäßigkeiten sind der nachfolgenden Beschreibung in Verbindung mit der Zeichnung zu entnehmen. Hierbei zeigen:

Fig. 1
in einer schematischen Vorderansicht eine Vorrichtung zum Überprüfen und Umdrehen von Halbleiterchips gemäß dem Stand der Technik;
Fig. 2
in einer schematischen Vorderansicht eine Vorrichtung zum Überprüfen und Umdrehen von Halbleiterchips gemäß einer Ausführungsform der vorliegenden Erfindung;
Fig. 3
in einer perspektivischen Ansicht ein drehbares Bauteil für die Vorrichtung zum Überprüfen und Umdrehen von Halbleiterchips gemäß einer Ausführungsform der Erfindung;
Fig. 4
in einer schematischen Seitenansicht das in Fig. 3 gezeigte drehbare Bauteil;
Fig. 5
in einer schematischen Vorderansicht eine Darstellung des Prinzips des erfindungsgemäßen Verfahrens; und
Fig. 6
in einer schematischen Darstellung Überprüfungsbereiche für eine links- und rechtsherum gedrehte Durchgangsöffnung innerhalb des drehbaren Bauteiles.
Advantages and expediencies can be found in the following description in conjunction with the drawing. Hereby show:
Fig. 1
in a schematic front view of an apparatus for checking and turning over semiconductor chips according to the prior art;
Fig. 2
in a schematic front view of an apparatus for checking and turning over semiconductor chips according to an embodiment of the present invention;
Fig. 3
in a perspective view of a rotatable member for the device for checking and turning over semiconductor chips according to an embodiment of the invention;
Fig. 4
in a schematic side view of the in Fig. 3 shown rotatable component;
Fig. 5
in a schematic front view of a representation of the principle of the method according to the invention; and
Fig. 6
in a schematic representation of inspection areas for a left and right turn turned through hole within the rotatable component.

Wie der Fig. 1 in einer schematischen Vorderansicht zu entnehmen ist, ist bisher gemäß dem Stand der Technik für die Ablösung einzelner hier nicht gezeigter Halbleiterchips aus einem Wafer bzw. von dessen Träger 1 mittels einem Die-Ejector 2, ein drehbares Bauteil 3 verwendet worden, welches durch die Ausbildung einer in die Zeichenebene hineinragenden Drehachse für die Ausbildung eines Drehpunktes 4 am linksseitigen Ende des Bauteiles ein Hinein- und Herausschwenken eines Flipheads 5 mit einem daran angeordneten Aufnahmeelement 6 aus einer optischen Verbindungslinie zwischen einer ersten optischen Einrichtung 7 und der Waferoberfläche ermöglicht. Die durchgezogenen Linien des Flipheads stellen eine Aufnahme- bzw. Pick-Position des aufzunehmenden Chips dar, wohingegen die gepunkteten Linien des Flipheads 5 eine sich an den Aufnahmevorgang anschließende Ablegeposition bzw. Place-Position auf einer Ablegeeinrichtung 8 wiedergeben. Die Ablegeeinrichtung 8 weist ebenso ein Aufnahmeelement 9 beispielsweise in Form einer Vakuumpipette auf, um den nun umgedrehten Chip durch Verschieben des Ablegeeinrichtung 8 beispielsweise innerhalb eines Smartcard-Moduls abzulegen.Again Fig. 1 can be seen in a schematic front view, has been used according to the prior art for the replacement of individual semiconductor chips not shown here from a wafer or its carrier 1 by means of a die-Ejector 2, a rotatable member 3, which by training a projecting into the plane of rotation axis for the formation of a pivot point 4 at the left-side end of the component in and out pivoting a flip-5 with a pickup element 6 arranged thereon of an optical connecting line between a first optical device 7 and the wafer surface allows. The solid lines of the flip-head represent a pick-up position of the chip to be picked up, whereas the dotted lines of the flip-flop 5 represent a depositing position or place position following a picking operation on a depositing device 8. The depositing device 8 also has a receiving element 9, for example in the form of a vacuum pipette, in order to deposit the now turned-over chip by displacing the depositing device 8, for example, within a smartcard module.

Ein derartiges drehbares Bauteil weist zum einen nur ein Aufnahmeelement auf und erfordert zum anderen den bereits beschriebenen sequentiellen zeitraubenden Verfahrensablauf.On the one hand, such a rotatable component has only one receiving element and, on the other hand, requires the sequential time-consuming process sequence already described.

In Fig. 2 ist in einer schematischen Vorderansicht eine Vorrichtung zum Überprüfen und Umdrehen von Halbleiterchips gemäß einer Ausführungsform der Erfindung gezeigt. Dieser Darstellung ist zu entnehmen, dass oberhalb eines Wafers und einen damit verbundenen Trägers 11 mit einer Waferoberfläche 11a, aus dem einzelne Halbleiterchips mittels eines Die-Ejectors 12 von unten nach oben ausgestossen werden, ein drehbares Bauteil 14 derart angeordnet ist, dass es sich bei einer durchgeführten Drehung 15, 16 um einen Drehpunkt 17, der oberhalb des aufzunehmenden Chips angeordnet ist, dreht. Der Wafer kann mit dem Träger 11 in x- bzw. y-Richtung verschoben werden, wie es durch den Doppelpfeil 13 angedeutet wird.In Fig. 2 is shown in a schematic front view of an apparatus for checking and turning over semiconductor chips according to an embodiment of the invention. This illustration shows that above a wafer and an associated Carrier 11 having a wafer surface 11a, are ejected from the individual semiconductor chips by means of a die ejector 12 from bottom to top, a rotatable member 14 is arranged such that it is carried out at a rotation 15, 16 about a pivot point 17, which above the is arranged to be picked chips turns. The wafer can be displaced with the carrier 11 in the x or y direction, as indicated by the double arrow 13.

Das drehbare Bauteil 14 weist an backenartigen Vorsprüngen 18a und 18b zwei sich gegenüberliegende Aufnahmeelemente 19, 20 - beispielsweise in Form von Vakuumpipetten - auf, die ein zeitgleiches Auf- und Ablegen von zwei Halbleiter-Chips ermöglichen. Es kann nämlich die erste Vakuumpipette 19 einen Halbleiter-Chip von dem Träger 11 aufnehmen, während die zweite Vakuumpipette 20 einen weiteren Halbleiterchip auf einer Ablegeeinrichtung 21, welche beispielsweise mit einer weitere Vakuumpipette 22 ausgestattet sein kann, ablegt. Anschließend wird die Ablegeeinrichtung 21 seitlich verschoben, wie es durch den Doppelpfeil 24 angedeutet wird.The rotatable component 14 has at jaw-like projections 18a and 18b, two opposing receiving elements 19, 20 - for example in the form of vacuum pipettes - on which allow a simultaneous loading and unloading of two semiconductor chips. Namely, the first vacuum pipette 19 can receive a semiconductor chip from the carrier 11, while the second vacuum pipette 20 deposits another semiconductor chip on a depositing device 21, which can be equipped, for example, with a further vacuum pipette 22. Subsequently, the depositing device 21 is displaced laterally, as indicated by the double arrow 24.

Nahezu zeitgleich dreht sich das drehbare Bauteil 14 um seinen Drehpunkt 17 - diesmal in entgegengesetzter Richtung zu der vorangegangenen Drehung -, wobei nach einer 90°-Drehung eine in dem drehbaren Bauteil 14 angeordnete hier nicht gezeigte Durchgangsöffnung einen Sichtkanal 23a von einer ersten optischen Einrichtung 23 vertikal verlaufend durch das Bauteil 14 hindurch bis hin zu der Oberfläche 11a des mit dem Wafer bedeckten Trägers 11 zu einem weiteren Halbleiterchip erzeugt.Almost at the same time rotatable member 14 rotates about its pivot point 17 - this time in the opposite direction to the previous rotation -, wherein after a 90 ° rotation arranged in the rotatable member 14 through hole not shown here a viewing channel 23a of a first optical device 23rd extending vertically through the component 14 all the way to the surface 11a of the wafer-covered carrier 11 to form a further semiconductor chip.

Dieser Sichtkanal dient dazu, eine Kurzzeit-Aufnahme durch die als Kamera ausgebildete erste optische Einrichtung 23 von dem zukünftig aufzunehmenden weiteren Halbleiter-Chip auf dem Träger 11 für dessen Überprüfung der Oberfläche und seiner korrekten Lageposition durchzuführen.This viewing channel serves to perform a short-term recording by the first optical device 23 designed as a camera from the further semiconductor chip to be recorded on the carrier 11 for its verification of the surface and its correct position position in the future.

Sobald das drehbare Bauteil 14 seine 180°-Drehung nach weiteren 90° beendet hat, findet die Aufnahme des weiteren Halbleiterchips durch die zweite Vakuumpipette 20 statt.As soon as the rotatable component 14 has completed its 180 ° rotation after another 90 °, the reception of the further semiconductor chip by the second vacuum pipette 20 takes place.

Eine zweite optische Einrichtung in Form einer Die-on-Fly-Kamera 25 ist zur Überprüfung eines Flipoffsets des bereits umgedrehten Chips angeordnet. Sie errechnet im Falle des Vorliegens eines Flipoffsets entsprechende Korrekturdaten und gibt diese an das sich einstellbare Place-Element 21 weiter. Das Place-Element 21 legt anschließend des Chip in einem Indexer 26 ab, wobei dessen Lageposition durch eine weitere Kamera 27 überprüft wird.A second optical device in the form of a die-on-fly camera 25 is arranged to check a flip-off set of the already reversed chip. It calculates in the case of the presence of a flipoffset corresponding correction data and outputs this to the settable Place element 21 continues. The place element 21 then deposits the chip in an indexer 26, its position being checked by another camera 27.

In Fig. 3 ist in einer perspektivischen Ansicht eine mögliche Ausführungsform eines drehbaren Bauteiles 14 für dessen Anordnung in einer erfindungsgemäßen Vorrichtung zum Überprüfen und Umdrehen von elektronischen Bauelementen gezeigt. Wie der Darstellung zu entnehmen ist, ist das drehbare Bauteil mit an seinem Drehpunkt 17 mit einem Loch zur Aufnahme einer hier nicht gezeigten Drehachse, um welche sich das Bauteil 14 dreht, ausgestattet.In Fig. 3 is a perspective view of a possible embodiment of a rotatable member 14 for its arrangement in a device according to the invention for checking and turning of electronic components shown. As can be seen from the illustration, the rotatable component is equipped at its pivot point 17 with a hole for receiving a rotation axis, not shown here, around which the component 14 rotates.

Die backenförmig ausgebildeten Vorsprünge 18a und 18b dienen zur Aufnahme und Befestigung von hier nicht gezeigten Aufnahmeelementen, die beispielsweise als Vakuumpipetten ausgebildet sein können.The jaw-shaped projections 18a and 18b serve to receive and fix receiving elements, not shown here, which may be formed, for example, as vacuum pipettes.

Die Durchgangsöffnung 28 ist in diesem Fall als an einer Längsseite offener Durchgangskanal, der auf einfache Weise in das Bauteil hineingefräst wurde, ausgebildet.In this case, the through-opening 28 is designed as a through-channel which is open on a longitudinal side and which has been milled into the component in a simple manner.

Wie Fig. 4 in einer Seitenansicht des drehbaren Bauteiles zu entnehmen ist, lässt das Bauteil 14 während seiner Drehung um eine in einem Bohrloch 29 angeordnete Drehachse ein maximales Inspektionsfenster von einem Abstand zwischen den Vorsprüngen 18a und 18b zu. Dieser Abstand kann beispielsweise eine Größenordnung von ca. 20 mm aufweisen. Bei einem Weiterdrehen über die 90°-Stellung des drehbaren Bauteiles 14 hinweg verkleinert sich dann wieder das Inspektionsfenster und verschwindet bei einer 180°-Stellung des drehbaren Bauteils 14 vollständig.As Fig. 4 can be seen in a side view of the rotatable member, the component 14 allows during its rotation about an axis disposed in a borehole 29 axis of rotation a maximum inspection window from a distance between the projections 18a and 18b. This distance may have, for example, an order of magnitude of approximately 20 mm. Upon further rotation over the 90 ° position of the rotatable component 14, the inspection window then decreases again and disappears completely in the case of a 180 ° position of the rotatable component 14.

In Fig. 5 wird in einer einfachen schematischen Vorderansicht die Funktionsweise der erfindungsgemäßen Vorrichtung gezeigt. Das hier nicht näher dargestellte drehbare Bauteil, welches zwischen der Kamera 23 und dem Träger 11 angeordnet ist, beinhaltet unter anderem die Durchgangsöffnung 28, welche sich auf einer Kreisbahn 15a bewegt.In Fig. 5 is shown in a simple schematic front view of the operation of the device according to the invention. The rotatable component not shown here, which is arranged between the camera 23 and the carrier 11, includes, among other things, the through-hole 28, which moves on a circular path 15a.

Sobald sich die Durchgangsöffnung 28 in vertikaler Stellung befindet, also die hier nicht gezeigten Aufnahmeelemente horizontal ausgerichtet sind, kann die optische Verbindungslinie 23a von der Kamera 23 zu dem zu entnehmenden Halbleiterchip auf dem Träger 11 aufgebaut werden. Innerhalb dieses kurzen Hineinschwenkens der Durchgangsöffnung 28 in die optische Verbindungslinie 23a findet eine Kurzzeitaufnahme der Oberfläche und der Lage des zu entnehmenden Halbleiterchips statt. Ein Weiterdrehen des Bauteiles in eine Richtung entgegen dem Uhrzeigersinn, wie es durch den Pfeil 15 angedeutet wird, lässt das hier nicht gezeigte Aufnahmeelement zu dem zu entnehmenden Chip verschwenken und Aufnehmen. Anschließend findet eine 180°-Drehung des Bauteils in entgegengesetzter Richtung, also im Uhrzeigersinn wie es durch Pfeil 16 gezeigt wird, statt.As soon as the passage opening 28 is in the vertical position, ie the receiving elements not shown here are aligned horizontally, the optical connecting line 23a can be set up by the camera 23 to the semiconductor chip to be removed on the carrier 11. Within this short pivoting of the passage opening 28 into the optical connection line 23a is a short-term recording of the surface and the situation of the semiconductor chip to be removed. Further rotation of the component in a counterclockwise direction, as indicated by the arrow 15, can pivot the receiving element, not shown here, to the chip to be removed and picking up. Subsequently, a 180 ° rotation of the component in the opposite direction, ie in the clockwise direction as shown by arrow 16 takes place.

In Fig. 6 werden in einer schematischen Darstellung die Beobachtungs- bzw. Inspektionsbereiche, die der Kamera 23 während einer Drehung des mit der Durchgangsöffnung 28 ausgebildeten Bauteils 14 zur Verfügung stehen, dargestellt. Für eine gesamte 360°-Drehung des Bauteiles und der Durchgangsöffnung entgegen dem Uhrzeigersinn (Bezugszeichen 31) und mit dem Uhrzeigersinn (Bezugszeichen 32), wie es auch durch Pfeile 33 und 34 angedeutet wird, sind zur Verfügung stehende Inspektionsbereiche 35 und 36 bei einer ca. 90°-Stellung des Bauteiles ausgebildet.In Fig. 6 In a schematic representation, the observation or inspection areas which are available to the camera 23 during a rotation of the component 14 formed with the passage opening 28 are shown. For an entire 360 ° rotation of the component and the passage opening in the counterclockwise direction (reference numeral 31) and in the clockwise direction (reference numeral 32), as it is also indicated by arrows 33 and 34, are available inspection areas 35 and 36 at an approx 90 ° position of the component formed.

Um bei einem Hineinschwenken der Durchgangsöffnung in die optische Verbindungslinie zwischen der Kamera und dem Wafer keine verwischten Bilder zu verursachen, wird die Kamera mit einer Zeitverzögerung von ca. 10 msec, wie es durch Winkelabschnitte 37 und 38 dargestellt wird, aktiviert.In order to prevent blurred images when the through opening is pivoted into the optical connecting line between the camera and the wafer, the camera is activated with a time delay of approximately 10 msec, as represented by angle sections 37 and 38.

Sämtliche in den Anmeldungsunterlagen offenbarten Merkmale werden als erfindungswesentlich beansprucht, sofern sie einzeln oder in Kombination gegenüber dem Stand der Technik neu sind. Sämtliche in den Anmeldungsunterlagen offenbarten Merkmale werden einzeln und in Kombination als erfindungswesentlich angesehen. Abwandlungen hiervon sind dem Fachmann geläufig.All disclosed in the application documents features are claimed as essential to the invention, provided they are new individually or in combination over the prior art. All disclosed in the application documents features are considered individually and in combination as essential to the invention. Modifications thereof are familiar to the person skilled in the art.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

1, 111, 11
Trägercarrier
2, 122, 12
Die-EjectorDie Ejector
33
drehbares Bauteilrotatable component
4, 174, 17
Drehpunktpivot point
55
FlipheadFliphead
66
Aufnahmeelementreceiving element
7,237.23
Waferoptik-KameraWafer-optic camera
88th
Ablegeeinrichtunglaying device
99
Aufnahmeelementreceiving element
11 a11 a
Oberfläche des TrägersSurface of the carrier
1313
Verschieberichtung des TrägersDisplacement direction of the carrier
1414
drehbares Bauteilrotatable component
15, 15a, 1615, 15a, 16
Drehbewegungrotary motion
18a, 18b18a, 18b
erste und zweite Vorsprüngefirst and second projections
1919
erstes Aufnahmeelementfirst receiving element
2020
zweites Aufnahmeelementsecond receiving element
2121
Ablegeeinrichtunglaying device
2222
Vakuumpipettevacuum pipette
2323
Kameracamera
23a23a
optische Verbindungslinieoptical connection line
2424
Verschieberichtung des Ablegeeinrichtung esDisplacement direction of the depositor it
2525
Die-on-Fly-KameraThe Fly-on-camera
2626
Indexerindexer
2727
Placeoptik-KameraPlace optic camera
2828
DurchgangskanalThrough channel
2929
Bohrlochwell
3030
maximales Ausmaß des Inspektionsfenstersmaximum extent of the inspection window
31,3231.32
Gesamtdrehung des BauteilsTotal rotation of the component
33, 3433, 34
Drehrichtungendirections
35, 3635, 36
Inspektionsbereicheinspection areas
37,3837.38
Winkelabschnitteangular sections

Claims (10)

  1. Apparatus for examining and turning electronic components, particularly flipchips, with a member (14) rotatably fixed to a pivot point (17) for turning the electronic components, wherein a first pickup element (19) for picking up a single electronic component from a carrier (11) and holding the component during a rotational movement (15, 16; 15a) of the member (14) is attached to an outer side of the member (14),
    wherein a second pickup element (20) is opposite the first pickup element (19) relative to the pivot point (17) and is arranged on the outer side of the member (14), such that for each 180°-rotation (15, 16) of the member (14), one of the pickup elements (19, 20) faces the carrier (11), and
    characterized in that a passageway (28) is arranged in the member (14) between the pickup elements (19, 20) such that the passageway (28) faces the carrier (11) when the member (14) is rotated (15, 16) by 90° or 270°.
  2. Apparatus according to claim 1, characterized in that the first pickup element (19) is fixed to a first protrusion (18a) of the member (14), and the second pickup element (20) is affixed to a second protrusion (18b) of the member (14).
  3. Apparatus according to claim 2, characterized in that the passageway (28) between the protrusions (18a, 18b) is designed as a channel (28) which is uncovered along one side of its length.
  4. Apparatus according to one of the previous claims, characterized in that a first optical device (23) is arranged on a side of the rotatable member (14) opposite the carrier (11) for optically examining surfaces and correct positioning of electronic components arranged on the carrier (11) before they are picked up.
  5. Apparatus according to claim 4, characterized in that the passageway (28) is formed so as to allow an optical connection between the first optical device (23) and an electronic component arranged on the carrier (11) during a rotation (15, 16) of the rotatable member (14).
  6. Apparatus according to one of the previous claims, characterized by a second optical device (25) for examining a correct positioning of electronic components that have been turned and released.
  7. Method of examining and turning electronic components, particularly flipchips, that are individually picked from a group of electronic components arranged on a carrier (11) by a pickup element (19) arranged on a rotatable member (14) and released upside down, wherein the rotatable member (14) is placable between the carrier (11) and a first optical device (23) for examining the surface and correct positioning of an individual component arranged on the carrier (11),
    characterized in that in the course of a 180°-rotation (15, 16) of the rotatable member (14), the following steps are executed:
    picking up an electronic component arranged individually on the carrier (11) using a first pickup element (19),
    examining, when the rotatable member (14) is rotated by 90°, a surface and correct positioning of a further electronic component arranged on the carrier (11) by means of the optical device (23) and a passageway (28) arranged in the rotatable member (14),
    depositing the electronic component held by the first pickup element (19) on a deposit device (21) after a 180°-rotation (15, 16) of the rotatable member (14), and
    simultaneously picking up a further electronic component arranged individually on the carrier (11) using a second pickup element arranged opposite the first pickup element (19) on an outer side of the rotatable member (14).
  8. Method according to claim 7, characterized in that after the 180°-rotation (15) a 180°-rotation (16) in the opposite direction is executed.
  9. Method according to claim 7 or 8, characterized in that during or after transport of a turned and released component, a correct positioning is checked and adjusted by a second optical device (25).
  10. Method according to one of claims 7 to 9, characterized in that the first optical device (23) is activated after a predeterminable time delay (37, 38) after the passageway (28) is rotated into an optical a connection line (23a) between the first optical device (23) and the electronic component still arranged on the carrier (11).
EP05701621A 2004-02-16 2005-01-31 Device for inspecting and rotating electronic components Active EP1716586B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004007703A DE102004007703B3 (en) 2004-02-16 2004-02-16 Electronic component testing and rotating device, e.g. for flip-chip testing, with reception elements for electronic components on opposite sides of rotatable component rotated through 180 degrees
PCT/EP2005/050388 WO2005078768A1 (en) 2004-02-16 2005-01-31 Device for inspecting and rotating electronic components

Publications (2)

Publication Number Publication Date
EP1716586A1 EP1716586A1 (en) 2006-11-02
EP1716586B1 true EP1716586B1 (en) 2012-03-07

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EP05701621A Active EP1716586B1 (en) 2004-02-16 2005-01-31 Device for inspecting and rotating electronic components

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US (2) US7603765B2 (en)
EP (1) EP1716586B1 (en)
JP (1) JP4637861B2 (en)
KR (1) KR100894051B1 (en)
CN (1) CN100481318C (en)
AT (1) ATE548753T1 (en)
DE (1) DE102004007703B3 (en)
WO (1) WO2005078768A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1941536B8 (en) * 2005-10-26 2019-06-19 Kulicke and Soffa (Switzerland) Management GmbH Method and device for the placement of electronic components, in particular semiconductor chips, on a substrate
SG147353A1 (en) 2007-05-07 2008-11-28 Mfg Integration Technology Ltd Apparatus for object processing
US8167524B2 (en) * 2007-11-16 2012-05-01 Asm Assembly Automation Ltd Handling system for inspecting and sorting electronic components
KR100979721B1 (en) * 2008-12-04 2010-09-03 (주)에이피텍 Combined apparatus of vision inspection and sorting for semiconductor die
CN104752283B (en) * 2015-04-07 2018-02-13 嘉兴景焱智能装备技术有限公司 Flip-chip device
WO2017043696A1 (en) * 2015-09-09 2017-03-16 (주)에이피텍 Flip apparatus
DE102015013495B4 (en) * 2015-10-16 2018-04-26 Mühlbauer Gmbh & Co. Kg Receiving device for components and methods for removing defective components from this
US10717607B2 (en) * 2016-02-17 2020-07-21 Wheelabrator Group, Inc. Turnover mechanism of a conveyor system of a blast wheel machine
CN108155124A (en) * 2017-12-25 2018-06-12 北京中电科电子装备有限公司 A kind of chip attachment device and method
JP7349636B2 (en) * 2019-10-11 2023-09-25 パナソニックＩｐマネジメント株式会社 parts supply device
CN113921450B (en) * 2021-10-13 2024-01-12 深圳市哈德胜精密科技股份有限公司 Chip sucking method and double-suction-head chip sucking device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151945A (en) * 1977-12-08 1979-05-01 Universal Instruments Corporation Automated hybrid circuit board assembly apparatus
US4627787A (en) * 1984-03-22 1986-12-09 Thomson Components-Mostek Corporation Chip selection in automatic assembly of integrated circuit
US4915565A (en) * 1984-03-22 1990-04-10 Sgs-Thomson Microelectronics, Inc. Manipulation and handling of integrated circuit dice
NL8900027A (en) * 1989-01-06 1990-08-01 Philips Nv METHOD AND APPARATUS FOR PLACING COMPONENTS ON A CARRIER.
JP2517178B2 (en) * 1991-03-04 1996-07-24 松下電器産業株式会社 Electronic component mounting method
JPH09130084A (en) * 1995-11-06 1997-05-16 Matsushita Electric Ind Co Ltd Parts mounter and parts mounting facility
CN1189070C (en) * 1998-02-17 2005-02-09 戴塔康半导体设备股份有限公司 Device for positioning electronic circuits arranged on foil
JP3475776B2 (en) 1998-04-07 2003-12-08 三菱電機株式会社 Flip chip bonding apparatus and flip chip bonding method
JP3504166B2 (en) * 1998-11-25 2004-03-08 株式会社新川 Flip chip bonding equipment
JP3636127B2 (en) * 2001-10-12 2005-04-06 松下電器産業株式会社 Electronic component mounting apparatus and electronic component mounting method
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor
DE10203601A1 (en) 2002-01-30 2003-08-14 Siemens Ag Chip removal device, chip removal system, placement system and method for removing chips from a wafer

Also Published As

Publication number Publication date
US20070209198A1 (en) 2007-09-13
US8256109B2 (en) 2012-09-04
EP1716586A1 (en) 2006-11-02
CN100481318C (en) 2009-04-22
DE102004007703B3 (en) 2005-06-23
KR100894051B1 (en) 2009-04-20
JP2007524852A (en) 2007-08-30
US7603765B2 (en) 2009-10-20
CN1926661A (en) 2007-03-07
JP4637861B2 (en) 2011-02-23
WO2005078768A1 (en) 2005-08-25
KR20060122964A (en) 2006-11-30
ATE548753T1 (en) 2012-03-15
US20090213365A1 (en) 2009-08-27

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