EP1710605A1 - Plaquette optique et procédé destiné à sa fabrication - Google Patents

Plaquette optique et procédé destiné à sa fabrication Download PDF

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Publication number
EP1710605A1
EP1710605A1 EP06006652A EP06006652A EP1710605A1 EP 1710605 A1 EP1710605 A1 EP 1710605A1 EP 06006652 A EP06006652 A EP 06006652A EP 06006652 A EP06006652 A EP 06006652A EP 1710605 A1 EP1710605 A1 EP 1710605A1
Authority
EP
European Patent Office
Prior art keywords
layer
trenches
circuit board
optically conductive
refractive index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06006652A
Other languages
German (de)
English (en)
Inventor
Jan Kostelnik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuerth Elektronik GmbH and Co KG
Original Assignee
Wuerth Elektronik GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuerth Elektronik GmbH and Co KG filed Critical Wuerth Elektronik GmbH and Co KG
Publication of EP1710605A1 publication Critical patent/EP1710605A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method
    • G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
EP06006652A 2005-04-05 2006-03-30 Plaquette optique et procédé destiné à sa fabrication Withdrawn EP1710605A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005016435A DE102005016435A1 (de) 2005-04-05 2005-04-05 Optische Leiterplatte und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
EP1710605A1 true EP1710605A1 (fr) 2006-10-11

Family

ID=36603406

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06006652A Withdrawn EP1710605A1 (fr) 2005-04-05 2006-03-30 Plaquette optique et procédé destiné à sa fabrication

Country Status (2)

Country Link
EP (1) EP1710605A1 (fr)
DE (1) DE102005016435A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8538207B2 (en) 2007-04-16 2013-09-17 University Of Southampton Method of fabricating waveguide devices which use evanescent coupling between waveguides and grooves
EP3511749A1 (fr) * 2018-01-10 2019-07-17 Deutsche Telekom AG Couches transparentes destinées à la transmission de données optique

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765819A (en) * 1985-10-16 1988-08-23 Schott Glaswerke Method for making planar lightwave guides
US5106211A (en) * 1991-02-14 1992-04-21 Hoechst Celanese Corp. Formation of polymer channel waveguides by excimer laser ablation and method of making same
US5337391A (en) * 1993-05-03 1994-08-09 Motorola, Inc. Optoelectronic sub-module and method of making same
EP1041418A2 (fr) * 1999-03-30 2000-10-04 Toppan Printing Co., Ltd. Couche d'interconnection optique, substrat d'interconnection optoélectrique, substrat monté et méthode de fabrication
US6571037B1 (en) * 1999-05-21 2003-05-27 British Telecommunications Public Limited Company Arrayed waveguide gratings
US6845184B1 (en) * 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5249245A (en) * 1992-08-31 1993-09-28 Motorola, Inc. Optoelectroinc mount including flexible substrate and method for making same
EP0943935A3 (fr) * 1998-03-20 2001-01-31 Nippon Telegraph and Telephone Corporation Guide d'onde optique et méthode de fabrication

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765819A (en) * 1985-10-16 1988-08-23 Schott Glaswerke Method for making planar lightwave guides
US5106211A (en) * 1991-02-14 1992-04-21 Hoechst Celanese Corp. Formation of polymer channel waveguides by excimer laser ablation and method of making same
US5337391A (en) * 1993-05-03 1994-08-09 Motorola, Inc. Optoelectronic sub-module and method of making same
US6845184B1 (en) * 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
EP1041418A2 (fr) * 1999-03-30 2000-10-04 Toppan Printing Co., Ltd. Couche d'interconnection optique, substrat d'interconnection optoélectrique, substrat monté et méthode de fabrication
US6571037B1 (en) * 1999-05-21 2003-05-27 British Telecommunications Public Limited Company Arrayed waveguide gratings

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8538207B2 (en) 2007-04-16 2013-09-17 University Of Southampton Method of fabricating waveguide devices which use evanescent coupling between waveguides and grooves
EP3511749A1 (fr) * 2018-01-10 2019-07-17 Deutsche Telekom AG Couches transparentes destinées à la transmission de données optique

Also Published As

Publication number Publication date
DE102005016435A1 (de) 2006-10-12

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