EP1710605A1 - Plaquette optique et procédé destiné à sa fabrication - Google Patents
Plaquette optique et procédé destiné à sa fabrication Download PDFInfo
- Publication number
- EP1710605A1 EP1710605A1 EP06006652A EP06006652A EP1710605A1 EP 1710605 A1 EP1710605 A1 EP 1710605A1 EP 06006652 A EP06006652 A EP 06006652A EP 06006652 A EP06006652 A EP 06006652A EP 1710605 A1 EP1710605 A1 EP 1710605A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- layer
- trenches
- circuit board
- optically conductive
- refractive index
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/132—Integrated optical circuits characterised by the manufacturing method by deposition of thin films
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/136—Integrated optical circuits characterised by the manufacturing method by etching
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68345—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self supporting substrates
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005016435A DE102005016435A1 (de) | 2005-04-05 | 2005-04-05 | Optische Leiterplatte und Verfahren zu ihrer Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1710605A1 true EP1710605A1 (fr) | 2006-10-11 |
Family
ID=36603406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06006652A Withdrawn EP1710605A1 (fr) | 2005-04-05 | 2006-03-30 | Plaquette optique et procédé destiné à sa fabrication |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP1710605A1 (fr) |
DE (1) | DE102005016435A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8538207B2 (en) | 2007-04-16 | 2013-09-17 | University Of Southampton | Method of fabricating waveguide devices which use evanescent coupling between waveguides and grooves |
EP3511749A1 (fr) * | 2018-01-10 | 2019-07-17 | Deutsche Telekom AG | Couches transparentes destinées à la transmission de données optique |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4765819A (en) * | 1985-10-16 | 1988-08-23 | Schott Glaswerke | Method for making planar lightwave guides |
US5106211A (en) * | 1991-02-14 | 1992-04-21 | Hoechst Celanese Corp. | Formation of polymer channel waveguides by excimer laser ablation and method of making same |
US5337391A (en) * | 1993-05-03 | 1994-08-09 | Motorola, Inc. | Optoelectronic sub-module and method of making same |
EP1041418A2 (fr) * | 1999-03-30 | 2000-10-04 | Toppan Printing Co., Ltd. | Couche d'interconnection optique, substrat d'interconnection optoélectrique, substrat monté et méthode de fabrication |
US6571037B1 (en) * | 1999-05-21 | 2003-05-27 | British Telecommunications Public Limited Company | Arrayed waveguide gratings |
US6845184B1 (en) * | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5249245A (en) * | 1992-08-31 | 1993-09-28 | Motorola, Inc. | Optoelectroinc mount including flexible substrate and method for making same |
EP0943935A3 (fr) * | 1998-03-20 | 2001-01-31 | Nippon Telegraph and Telephone Corporation | Guide d'onde optique et méthode de fabrication |
-
2005
- 2005-04-05 DE DE102005016435A patent/DE102005016435A1/de not_active Ceased
-
2006
- 2006-03-30 EP EP06006652A patent/EP1710605A1/fr not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4765819A (en) * | 1985-10-16 | 1988-08-23 | Schott Glaswerke | Method for making planar lightwave guides |
US5106211A (en) * | 1991-02-14 | 1992-04-21 | Hoechst Celanese Corp. | Formation of polymer channel waveguides by excimer laser ablation and method of making same |
US5337391A (en) * | 1993-05-03 | 1994-08-09 | Motorola, Inc. | Optoelectronic sub-module and method of making same |
US6845184B1 (en) * | 1998-10-09 | 2005-01-18 | Fujitsu Limited | Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making |
EP1041418A2 (fr) * | 1999-03-30 | 2000-10-04 | Toppan Printing Co., Ltd. | Couche d'interconnection optique, substrat d'interconnection optoélectrique, substrat monté et méthode de fabrication |
US6571037B1 (en) * | 1999-05-21 | 2003-05-27 | British Telecommunications Public Limited Company | Arrayed waveguide gratings |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8538207B2 (en) | 2007-04-16 | 2013-09-17 | University Of Southampton | Method of fabricating waveguide devices which use evanescent coupling between waveguides and grooves |
EP3511749A1 (fr) * | 2018-01-10 | 2019-07-17 | Deutsche Telekom AG | Couches transparentes destinées à la transmission de données optique |
Also Published As
Publication number | Publication date |
---|---|
DE102005016435A1 (de) | 2006-10-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK YU |
|
17P | Request for examination filed |
Effective date: 20070316 |
|
17Q | First examination report despatched |
Effective date: 20070419 |
|
AKX | Designation fees paid |
Designated state(s): AT CH DE FR GB LI |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20150630 |