EP1619696A3 - Chip resistor for surface mounting and method of manufacturing a chip resistor for surface mounting - Google Patents

Chip resistor for surface mounting and method of manufacturing a chip resistor for surface mounting Download PDF

Info

Publication number
EP1619696A3
EP1619696A3 EP05253599A EP05253599A EP1619696A3 EP 1619696 A3 EP1619696 A3 EP 1619696A3 EP 05253599 A EP05253599 A EP 05253599A EP 05253599 A EP05253599 A EP 05253599A EP 1619696 A3 EP1619696 A3 EP 1619696A3
Authority
EP
European Patent Office
Prior art keywords
resistor
surface mounting
chip
chip resistor
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05253599A
Other languages
German (de)
French (fr)
Other versions
EP1619696A2 (en
Inventor
David Jackson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Welwyn Compnents Ltd
Original Assignee
Welwyn Compnents Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Welwyn Compnents Ltd filed Critical Welwyn Compnents Ltd
Publication of EP1619696A2 publication Critical patent/EP1619696A2/en
Publication of EP1619696A3 publication Critical patent/EP1619696A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Details Of Resistors (AREA)

Abstract

The present invention relates to a leadless chip resistor for surface mounting on a circuit board. Conventional leadless chip resistors have a single resistor layer 20 on the upper surface thereof between two conductive plates 50. The present invention proposes a double sided resistor chip, which has resistor layers 20, 320 on both upper and lower faces of the substrate 10 and in conductive contact with electroplated conductive plates 50 which wrap around the ends of the substrate 10. This allows the resistor chip to have a higher pulse energy rating then a conventional surface mounted resistor of the same size. A method of manufacturing the resistor chip is also disclosed.
EP05253599A 2004-07-23 2005-06-10 Chip resistor for surface mounting and method of manufacturing a chip resistor for surface mounting Withdrawn EP1619696A3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0416510A GB0416510D0 (en) 2004-07-23 2004-07-23 Resistor and method of manufacturing resistor

Publications (2)

Publication Number Publication Date
EP1619696A2 EP1619696A2 (en) 2006-01-25
EP1619696A3 true EP1619696A3 (en) 2007-10-03

Family

ID=32922718

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05253599A Withdrawn EP1619696A3 (en) 2004-07-23 2005-06-10 Chip resistor for surface mounting and method of manufacturing a chip resistor for surface mounting

Country Status (2)

Country Link
EP (1) EP1619696A3 (en)
GB (1) GB0416510D0 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6181500B2 (en) * 2013-09-30 2017-08-16 Koa株式会社 Chip resistor and manufacturing method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030089964A1 (en) * 2001-11-15 2003-05-15 Michael Belman Surge current chip resistor
US20040075510A1 (en) * 2002-10-22 2004-04-22 Eskeldson David D. Distributed capacitive/resistive electronic device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030089964A1 (en) * 2001-11-15 2003-05-15 Michael Belman Surge current chip resistor
US20040075510A1 (en) * 2002-10-22 2004-04-22 Eskeldson David D. Distributed capacitive/resistive electronic device

Also Published As

Publication number Publication date
EP1619696A2 (en) 2006-01-25
GB0416510D0 (en) 2004-08-25

Similar Documents

Publication Publication Date Title
US7397118B2 (en) Ceramic chip-type electronic component and method of making the same
EP1538638A3 (en) Method of manufacturing multilayered electronic component and multilayered component
US7495884B2 (en) Multilayer capacitor
JP6776582B2 (en) Electronic components
EP1545175A3 (en) Method of providing printed circuit board with conductive holes and board resulting therefrom
WO2006091463A8 (en) Method of making multilayered construction for use in resistors and capacitors
US7362559B2 (en) Ceramic chip-type electronic component with electrode covering resin and method of making the same
EP1592061A3 (en) Multilayer substrate including components therein
EP1739747A3 (en) Semiconductor chip and method of manufacturing the same
JP2007013092A5 (en)
EP1505858A3 (en) Circuit module and manufacturing method thereof
WO2005011343A3 (en) Circuit board with embedded components and method of manufacture
TW200635460A (en) Double-sided wiring board fabrication method, double-sided wiring board, and base material therefor
EP1724832A3 (en) Multilayer module formed of modules stacked on top of each other and method of manufacturing the same
EP1538669A3 (en) Thin package for stacking integrated circuits
EP2040519A3 (en) Wired Circuit Board
EP1699277A4 (en) Ceramic multilayer substrate
US9301404B2 (en) Ceramic substrate and method of manufacturing the same
EP1705675A3 (en) Electronic component and electronic device
TW200723373A (en) Conductive structure, manufacturing method for conductive structure, element substrate, and manufacturing method for element substrate
TW200629997A (en) Thin circuit board
EP1180920A3 (en) Circuit board and method of manufacturing same
JP2004002956A5 (en)
TW200636769A (en) Laminated ceramic electronic component and method for manufacturing same
EP0987748A3 (en) Multilayered circuit board for semiconductor chip module, and method of manufacturing the same

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR LV MK YU

AKX Designation fees paid
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20080103

REG Reference to a national code

Ref country code: DE

Ref legal event code: 8566