EP1576653A3 - Semiconductor substrate having copper/diamond composite material and method of making same - Google Patents
Semiconductor substrate having copper/diamond composite material and method of making sameInfo
- Publication number
- EP1576653A3 EP1576653A3 EP03768542.7A EP03768542A EP1576653A3 EP 1576653 A3 EP1576653 A3 EP 1576653A3 EP 03768542 A EP03768542 A EP 03768542A EP 1576653 A3 EP1576653 A3 EP 1576653A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- semiconductor substrate
- composite material
- making same
- diamond composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
- 229910003460 diamond Inorganic materials 0.000 title 1
- 239000010432 diamond Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12189387.9A EP2587536B8 (en) | 2002-11-07 | 2003-10-24 | Semiconductor substrate having copper/diamond composite material and method of making same |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/291,126 US6727117B1 (en) | 2002-11-07 | 2002-11-07 | Semiconductor substrate having copper/diamond composite material and method of making same |
US291126 | 2002-11-07 | ||
PCT/US2003/033945 WO2004044950A2 (en) | 2002-11-07 | 2003-10-24 | Semiconductor substrate having copper/diamond composite material and method of making same |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12189387.9A Division EP2587536B8 (en) | 2002-11-07 | 2003-10-24 | Semiconductor substrate having copper/diamond composite material and method of making same |
EP12189387.9 Division-Into | 2012-10-22 |
Publications (4)
Publication Number | Publication Date |
---|---|
EP1576653A3 true EP1576653A3 (en) | 2005-08-18 |
EP1576653A2 EP1576653A2 (en) | 2005-09-21 |
EP1576653A4 EP1576653A4 (en) | 2008-11-12 |
EP1576653B1 EP1576653B1 (en) | 2013-06-12 |
Family
ID=32107653
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03768542.7A Expired - Lifetime EP1576653B1 (en) | 2002-11-07 | 2003-10-24 | Semiconductor substrate having copper-diamond composite material and method of making same |
EP12189387.9A Expired - Lifetime EP2587536B8 (en) | 2002-11-07 | 2003-10-24 | Semiconductor substrate having copper/diamond composite material and method of making same |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12189387.9A Expired - Lifetime EP2587536B8 (en) | 2002-11-07 | 2003-10-24 | Semiconductor substrate having copper/diamond composite material and method of making same |
Country Status (10)
Country | Link |
---|---|
US (1) | US6727117B1 (en) |
EP (2) | EP1576653B1 (en) |
JP (1) | JP2006505951A (en) |
KR (1) | KR100745872B1 (en) |
CN (2) | CN102214620B (en) |
AU (1) | AU2003291654A1 (en) |
CA (2) | CA2800957C (en) |
HK (1) | HK1080994A1 (en) |
IL (1) | IL168429A (en) |
WO (1) | WO2004044950A2 (en) |
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CN101139515B (en) * | 2007-05-18 | 2010-08-18 | 中南大学 | High heat-conductive diamond-copper composite encapsulating material and method for making same |
CN101070461B (en) * | 2007-05-18 | 2011-04-20 | 中南大学 | Super-high heat-conductive diamond-copper composite package material and production method |
US8067834B2 (en) * | 2007-08-21 | 2011-11-29 | Hvvi Semiconductors, Inc. | Semiconductor component |
US20090108437A1 (en) * | 2007-10-29 | 2009-04-30 | M/A-Com, Inc. | Wafer scale integrated thermal heat spreader |
US7660335B2 (en) * | 2008-04-17 | 2010-02-09 | Lasertel, Inc. | Liquid cooled laser bar arrays incorporating diamond/copper expansion matched materials |
US8828804B2 (en) * | 2008-04-30 | 2014-09-09 | Infineon Technologies Ag | Semiconductor device and method |
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WO2010027504A1 (en) * | 2008-09-08 | 2010-03-11 | Materials And Electrochemical Research (Mer) Corporation | Machinable metal/diamond metal matrix composite compound structure and method of making same |
US20100208431A1 (en) * | 2008-10-09 | 2010-08-19 | Dugas Matthew P | Patterned Composite Structures and Methods of Making the Same |
AT11107U1 (en) * | 2008-11-20 | 2010-04-15 | Plansee Se | HEAT SINKS AND METHOD FOR THE PRODUCTION THEREOF |
US20100139885A1 (en) * | 2008-12-09 | 2010-06-10 | Renewable Thermodynamics, Llc | Sintered diamond heat exchanger apparatus |
US20100319895A1 (en) * | 2009-06-19 | 2010-12-23 | Wei-En Chen | Heat spreader structure and method of manufacturing the same |
EP2445835A1 (en) * | 2009-06-24 | 2012-05-02 | Third Millennium Metals, Llc | Copper-carbon composition |
US8637379B2 (en) * | 2009-10-08 | 2014-01-28 | Infineon Technologies Ag | Device including a semiconductor chip and a carrier and fabrication method |
WO2011049479A1 (en) * | 2009-10-21 | 2011-04-28 | Andrey Mikhailovich Abyzov | Composite material having high thermal conductivity and process of fabricating same |
CN101706226B (en) * | 2009-11-23 | 2012-01-25 | 陈盈同 | Heat dissipation structure and manufacturing method thereof |
JP5450313B2 (en) * | 2010-08-06 | 2014-03-26 | 株式会社東芝 | High frequency semiconductor package and manufacturing method thereof |
WO2012122035A2 (en) | 2011-03-04 | 2012-09-13 | Third Millennium Metals, Llc | Aluminum-carbon compositions |
JP5896400B2 (en) * | 2011-11-25 | 2016-03-30 | トーメイダイヤ株式会社 | Diamond-containing heat sink material and method for producing the same |
US9035448B2 (en) | 2012-06-29 | 2015-05-19 | Materion Corporation | Semiconductor packages having metal composite base plates |
CN104733399A (en) * | 2013-12-24 | 2015-06-24 | 北京有色金属研究总院 | Layer-shaped high thermal conductive and insulating base plate and preparation method thereof |
CN104046833A (en) * | 2014-06-18 | 2014-09-17 | 南昌航空大学 | Diamond/copper composite material with high heat-conducting property and preparation method thereof |
JP5807935B1 (en) | 2014-10-09 | 2015-11-10 | 株式会社半導体熱研究所 | Heat dissipation board and semiconductor module using it |
CN104651658B (en) * | 2015-03-17 | 2017-01-11 | 北京科技大学 | Preparation method of novel copper-based composite material having high thermal conductivity |
US10246335B2 (en) * | 2016-05-27 | 2019-04-02 | Baker Hughes, A Ge Company, Llc | Methods of modifying surfaces of diamond particles, and related diamond particles and earth-boring tools |
US11025031B2 (en) | 2016-11-29 | 2021-06-01 | Leonardo Electronics Us Inc. | Dual junction fiber-coupled laser diode and related methods |
CN106584263B (en) * | 2016-12-22 | 2019-08-09 | 清华大学 | Monster chip thining method based on Nano diamond particle |
CN107326364B (en) * | 2017-06-02 | 2023-08-11 | 泉州众志金刚石工具有限公司 | Cu-Sn-Ti diamond brazing coating and preparation method thereof |
US10847336B2 (en) | 2017-08-17 | 2020-11-24 | Bruker AXS, GmbH | Analytical X-ray tube with high thermal performance |
EP3451376A1 (en) * | 2017-09-04 | 2019-03-06 | The Provost, Fellows, Foundation Scholars, and The Other Members of Board, of The College of The Holy and Undivided Trinity of Queen Elizabeth | Thermal structures for dissipating heat and methods for manufacture thereof |
US11406004B2 (en) | 2018-08-13 | 2022-08-02 | Leonardo Electronics Us Inc. | Use of metal-core printed circuit board (PCB) for generation of ultra-narrow, high-current pulse driver |
DE102019121924A1 (en) | 2018-08-14 | 2020-02-20 | Lasertel, Inc. | LASER ASSEMBLY AND RELATED METHODS |
US11296481B2 (en) | 2019-01-09 | 2022-04-05 | Leonardo Electronics Us Inc. | Divergence reshaping array |
US11752571B1 (en) | 2019-06-07 | 2023-09-12 | Leonardo Electronics Us Inc. | Coherent beam coupler |
CN110482482B (en) * | 2019-07-24 | 2022-04-19 | 北京科技大学 | Preparation method of insulated patterned high-thermal-conductivity diamond heat dissipation device |
WO2021056133A1 (en) * | 2019-09-23 | 2021-04-01 | 广东工业大学 | Novel ceramic-based diamond composite sheet and preparation method therefor |
CN113206200B (en) * | 2020-04-17 | 2023-04-07 | 广东聚华印刷显示技术有限公司 | Thin film packaging structure, thin film packaging method and photoelectric device |
CN113758327B (en) * | 2021-08-13 | 2022-06-17 | 中南大学 | Composite VC radiator containing copper/diamond sintered liquid absorption cores and preparation method thereof |
CN114192750B (en) * | 2021-12-15 | 2023-09-22 | 西华大学 | Diamond/copper composite thermal conductive material and preparation method thereof |
US20230352360A1 (en) * | 2022-04-29 | 2023-11-02 | Macom Technology Solutions Holdings, Inc. | Diamond-metal composite high power device packages |
Family Cites Families (29)
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US2034550A (en) | 1934-10-25 | 1936-03-17 | Gen Electric | Arcing tip and method for making the same |
US2401221A (en) | 1943-06-24 | 1946-05-28 | Gen Motors Corp | Method of impregnating porous metal parts |
US3303026A (en) | 1966-03-11 | 1967-02-07 | Mallory & Co Inc P R | Vacuum infiltrating of tungsten powder bodies with copper-titanium alloys |
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JP2746279B2 (en) | 1990-06-18 | 1998-05-06 | 日本タングステン 株式会社 | Substrate material for semiconductor device and method of manufacturing the same |
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US5045972A (en) | 1990-08-27 | 1991-09-03 | The Standard Oil Company | High thermal conductivity metal matrix composite |
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JP3086558B2 (en) * | 1993-02-19 | 2000-09-11 | 中部電力株式会社 | Automatic torus ring cutting device for turbine high pressure feed water heater |
JPH06284556A (en) * | 1993-03-30 | 1994-10-07 | Meidensha Corp | Grounding current detection method for three-phase four-wire circuit |
US5886407A (en) | 1993-04-14 | 1999-03-23 | Frank J. Polese | Heat-dissipating package for microcircuit devices |
US6238454B1 (en) | 1993-04-14 | 2001-05-29 | Frank J. Polese | Isotropic carbon/copper composites |
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US6264882B1 (en) | 1994-05-20 | 2001-07-24 | The Regents Of The University Of California | Process for fabricating composite material having high thermal conductivity |
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GB9626221D0 (en) * | 1996-12-18 | 1997-02-05 | Smiths Industries Plc | Diamond surfaces |
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KR100217032B1 (en) | 1997-06-14 | 1999-09-01 | 박호군 | Fabrication method of w-skelton structure for the infiltration of cu melt and composites thereof |
JP3893681B2 (en) | 1997-08-19 | 2007-03-14 | 住友電気工業株式会社 | Semiconductor heat sink and manufacturing method thereof |
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JPH11289037A (en) * | 1998-04-01 | 1999-10-19 | Sumitomo Metal Electronics Devices Inc | Metal plate for heat dissipation and package for electronic component using the same |
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-
2002
- 2002-11-07 US US10/291,126 patent/US6727117B1/en not_active Expired - Lifetime
-
2003
- 2003-10-24 CN CN2011100405466A patent/CN102214620B/en not_active Expired - Fee Related
- 2003-10-24 CN CNA2003801065126A patent/CN1768420A/en active Pending
- 2003-10-24 EP EP03768542.7A patent/EP1576653B1/en not_active Expired - Lifetime
- 2003-10-24 CA CA2800957A patent/CA2800957C/en not_active Expired - Lifetime
- 2003-10-24 JP JP2004551578A patent/JP2006505951A/en active Pending
- 2003-10-24 AU AU2003291654A patent/AU2003291654A1/en not_active Abandoned
- 2003-10-24 KR KR1020057008074A patent/KR100745872B1/en active IP Right Grant
- 2003-10-24 EP EP12189387.9A patent/EP2587536B8/en not_active Expired - Lifetime
- 2003-10-24 CA CA2505593A patent/CA2505593C/en not_active Expired - Lifetime
- 2003-10-24 WO PCT/US2003/033945 patent/WO2004044950A2/en active Application Filing
-
2005
- 2005-05-05 IL IL168429A patent/IL168429A/en active IP Right Grant
-
2006
- 2006-03-20 HK HK06103494.9A patent/HK1080994A1/en not_active IP Right Cessation
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