EP1571232A3 - Copper wire and method and apparatus for making a copper wire - Google Patents
Copper wire and method and apparatus for making a copper wire Download PDFInfo
- Publication number
- EP1571232A3 EP1571232A3 EP05000986A EP05000986A EP1571232A3 EP 1571232 A3 EP1571232 A3 EP 1571232A3 EP 05000986 A EP05000986 A EP 05000986A EP 05000986 A EP05000986 A EP 05000986A EP 1571232 A3 EP1571232 A3 EP 1571232A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- companion
- copper wire
- copper
- weight
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
- B22D11/10—Supplying or treating molten metal
- B22D11/108—Feeding additives, powders, or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D39/00—Equipment for supplying molten metal in rations
- B22D39/04—Equipment for supplying molten metal in rations having means for controlling the amount of molten metal by weight
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Continuous Casting (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Der Kupferdraht weist einen mittleren Kupfergehalt von mindestens 99,95 Gewichtsprozenten sowie mindestens einen dem Kupfer zulegierten Begleiter auf. Ein Quotient aus dem Gewichtsanteil des Begleiters und einem Gewichtsanteil eines Restsauerstoffgehaltes weist einen Wert im Intervall von 0,8 bis 1,7 auf. Der Gewichtsanteil des Begleiters variiert entlang einer Drahtlänge um maximal 25 % bezogen auf den maximalen Gewichtsanteil des Begleiters. Verfahrenstechnisch wird der Kupferdraht durch einen Gießvorgang mit anschließender Weiterverarbeitung hergestellt. Die Kupferschmelze wird bis zu einer Erstarrung gegenüber einer Umgebungsatmosphäre geschützt. Zur Gewährleistung einer genauen Zulegierung des Begleiters weist die Vorrichtung zur Herstellung des Kupferdrahtes eine Dosierregelung mit angeschlossener Dosiereinrichtung auf.The copper wire has a mean copper content of at least 99.95% by weight and at least one Copper alloyed companion on. A quotient of the weight fraction of the companion and a weight fraction of one Residual oxygen content has a value in the interval of 0.8 to 1.7 on. The weight percentage of the companion varies along a wire length by a maximum of 25% relative to the maximum weight of the companion. process engineering is the copper wire by a casting process with subsequent Further processing produced. The copper melt is up to a solidification to an ambient atmosphere protected. To ensure an accurate Admission of the companion has the device for production of the copper wire a dosing with connected Dosing on.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004010040 | 2004-03-02 | ||
DE102004010040A DE102004010040A1 (en) | 2004-03-02 | 2004-03-02 | Copper wire and method and apparatus for making a copper wire |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1571232A2 EP1571232A2 (en) | 2005-09-07 |
EP1571232A3 true EP1571232A3 (en) | 2005-12-21 |
Family
ID=34745337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP05000986A Withdrawn EP1571232A3 (en) | 2004-03-02 | 2005-01-19 | Copper wire and method and apparatus for making a copper wire |
Country Status (5)
Country | Link |
---|---|
US (1) | US20050247384A1 (en) |
EP (1) | EP1571232A3 (en) |
JP (1) | JP2005251749A (en) |
CN (1) | CN1664961A (en) |
DE (1) | DE102004010040A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102637657A (en) * | 2011-02-15 | 2012-08-15 | 宋东升 | Single crystal copper bonding lead and preparation method thereof |
JP5998758B2 (en) * | 2012-08-31 | 2016-09-28 | 三菱マテリアル株式会社 | Rough drawn copper wire and winding, and method for producing rough drawn copper wire |
JP6361194B2 (en) | 2014-03-14 | 2018-07-25 | 三菱マテリアル株式会社 | Copper ingot, copper wire, and method for producing copper ingot |
WO2016031989A1 (en) * | 2014-08-29 | 2016-03-03 | 日鉄住金マイクロメタル株式会社 | CYLINDRICAL FORMED BODY FOR Cu PILLARS FOR SEMICONDUCTOR CONNECTION |
CN106756706A (en) * | 2016-12-15 | 2017-05-31 | 惠州德晋昌光电科技有限公司 | Ultra-fine copper wire hot tinning process |
DE102019105453A1 (en) * | 2019-03-04 | 2020-09-10 | Kme Mansfeld Gmbh | A method for continuously manufacturing a copper alloy product |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4118256A (en) * | 1976-05-11 | 1978-10-03 | Electroschmelzwerk Kempten Gmbh | Process for the production of oxygen-free copper casting and moldings |
GB2048954A (en) * | 1979-03-24 | 1980-12-17 | Hitachi Wire Rod | Method of manufacturing a copper alloy wire |
US4521455A (en) * | 1982-02-23 | 1985-06-04 | Csepel Muvek Femmuve | Process and equipment for the production of alloyed copper wire rod by continuous casting |
GB2220956A (en) * | 1988-05-18 | 1990-01-24 | Mitsubishi Metal Corp | Copper alloy bonding wire |
JPH0663767A (en) * | 1992-08-12 | 1994-03-08 | Furukawa Electric Co Ltd:The | Electrode wire for welding for can making |
JPH06228680A (en) * | 1993-02-05 | 1994-08-16 | Hitachi Cable Ltd | Copper alloy wire and production thereof |
JPH09316568A (en) * | 1996-05-23 | 1997-12-09 | Furukawa Electric Co Ltd:The | Oxygen-free copper for high vacuum equipment and its production |
JPH107491A (en) * | 1996-06-21 | 1998-01-13 | Dowa Mining Co Ltd | High-purity single crystal copper and its production and production unit therefor |
JPH10245647A (en) * | 1997-03-06 | 1998-09-14 | Furukawa Electric Co Ltd:The | Copper wire rod for insulation-coated electric wire and its production |
JPH11176769A (en) * | 1997-12-15 | 1999-07-02 | Toshiba Corp | Sputtering target and copper wiring film |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55128353A (en) * | 1979-03-28 | 1980-10-04 | Hitachi Seisen Kk | Manufacture of copper alloy wire |
DE3427034C2 (en) * | 1984-07-21 | 1996-06-27 | Km Europa Metal Ag | Use of an oxygen-free copper deoxidized by boron or lithium for hollow profiles |
JPS6411932A (en) * | 1987-07-06 | 1989-01-17 | Hitachi Cable | High pure oxygen-free copper and its use |
US6123788A (en) * | 1993-04-19 | 2000-09-26 | Electrocopper Products Limited | Copper wire and process for making copper wire |
US6077364A (en) * | 1997-06-30 | 2000-06-20 | Phelps Dodge Industries, Inc. | Copper trolley wire and a method of manufacturing copper trolley wire |
JP2000005848A (en) * | 1998-06-23 | 2000-01-11 | Kitz Corp | Melting copper alloy supplying device |
-
2004
- 2004-03-02 DE DE102004010040A patent/DE102004010040A1/en not_active Withdrawn
-
2005
- 2005-01-19 EP EP05000986A patent/EP1571232A3/en not_active Withdrawn
- 2005-02-28 US US11/069,831 patent/US20050247384A1/en not_active Abandoned
- 2005-03-02 CN CN200510051811.5A patent/CN1664961A/en active Pending
- 2005-03-02 JP JP2005057318A patent/JP2005251749A/en active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4118256A (en) * | 1976-05-11 | 1978-10-03 | Electroschmelzwerk Kempten Gmbh | Process for the production of oxygen-free copper casting and moldings |
GB2048954A (en) * | 1979-03-24 | 1980-12-17 | Hitachi Wire Rod | Method of manufacturing a copper alloy wire |
US4521455A (en) * | 1982-02-23 | 1985-06-04 | Csepel Muvek Femmuve | Process and equipment for the production of alloyed copper wire rod by continuous casting |
GB2220956A (en) * | 1988-05-18 | 1990-01-24 | Mitsubishi Metal Corp | Copper alloy bonding wire |
JPH0663767A (en) * | 1992-08-12 | 1994-03-08 | Furukawa Electric Co Ltd:The | Electrode wire for welding for can making |
JPH06228680A (en) * | 1993-02-05 | 1994-08-16 | Hitachi Cable Ltd | Copper alloy wire and production thereof |
JPH09316568A (en) * | 1996-05-23 | 1997-12-09 | Furukawa Electric Co Ltd:The | Oxygen-free copper for high vacuum equipment and its production |
JPH107491A (en) * | 1996-06-21 | 1998-01-13 | Dowa Mining Co Ltd | High-purity single crystal copper and its production and production unit therefor |
JPH10245647A (en) * | 1997-03-06 | 1998-09-14 | Furukawa Electric Co Ltd:The | Copper wire rod for insulation-coated electric wire and its production |
JPH11176769A (en) * | 1997-12-15 | 1999-07-02 | Toshiba Corp | Sputtering target and copper wiring film |
Non-Patent Citations (6)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 018, no. 302 (M - 1618) 9 June 1994 (1994-06-09) * |
PATENT ABSTRACTS OF JAPAN vol. 018, no. 604 (C - 1275) 17 November 1994 (1994-11-17) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 04 31 March 1998 (1998-03-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 05 30 April 1998 (1998-04-30) * |
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 14 31 December 1998 (1998-12-31) * |
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12 29 October 1999 (1999-10-29) * |
Also Published As
Publication number | Publication date |
---|---|
CN1664961A (en) | 2005-09-07 |
DE102004010040A1 (en) | 2005-09-15 |
JP2005251749A (en) | 2005-09-15 |
EP1571232A2 (en) | 2005-09-07 |
US20050247384A1 (en) | 2005-11-10 |
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Legal Events
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PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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RIC1 | Information provided on ipc code assigned before grant |
Ipc: 7B 22D 39/04 B Ipc: 7B 22D 11/06 B Ipc: 7C 22C 9/00 B Ipc: 7C 22F 1/08 A |
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17P | Request for examination filed |
Effective date: 20051115 |
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AKX | Designation fees paid |
Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU MC NL PL PT RO SE SI SK TR |
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17Q | First examination report despatched |
Effective date: 20080313 |
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STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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18D | Application deemed to be withdrawn |
Effective date: 20080724 |