EP1570951A3 - Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units - Google Patents

Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units Download PDF

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Publication number
EP1570951A3
EP1570951A3 EP05004484A EP05004484A EP1570951A3 EP 1570951 A3 EP1570951 A3 EP 1570951A3 EP 05004484 A EP05004484 A EP 05004484A EP 05004484 A EP05004484 A EP 05004484A EP 1570951 A3 EP1570951 A3 EP 1570951A3
Authority
EP
European Patent Office
Prior art keywords
wafers
production
defective
polishing
electronic units
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP05004484A
Other languages
German (de)
French (fr)
Other versions
EP1570951A2 (en
Inventor
Peter Blaum
Burkhardt Speit
Ingo Köhler
Bernd Ruedinger
Wolfram Beier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schott AG
Original Assignee
Schott AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott AG filed Critical Schott AG
Publication of EP1570951A2 publication Critical patent/EP1570951A2/en
Publication of EP1570951A3 publication Critical patent/EP1570951A3/en
Withdrawn legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Semiconductor Lasers (AREA)

Abstract

Es wird ein Verfahren zur Herstellung von insbesonders spannungsarmen Waferscheiben mit mindestens einer auf an sich bekannte Weise zu beschichtenden aktiven Oberfläche beschrieben, wobei die aktive Oberfläche arm an Beschichtungsfehler erzeugenden Defekten ist. Das Verfahren umfasst ein Glätten der Oberfläche mittels eines Polierschritts, bei dem die aktive Oberfläche mittels eines Polierelements poliert wird. Dabei wird die Waferoberfläche mit einer sich ändernden Polierrichtung vom Polierwerkzeug derart überstrichen, dass jede Stelle der Oberfläche in jeder Richtung eines 360°Vollwinkels statistisch gleichmäßig überstrichen wird.

Figure imgaf001
The invention relates to a process for the production of particularly low-tension wafer wafers with at least one active surface to be coated in a manner known per se, the active surface being poor in defects generating coating defects. The method comprises smoothing the surface by means of a polishing step in which the active surface is polished by means of a polishing element. In this case, the surface of the wafer is covered with a changing polishing direction by the polishing tool in such a way that each point of the surface is covered statistically evenly in every direction of a full angle of 360 °.
Figure imgaf001
EP05004484A 2004-03-03 2005-03-01 Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units Withdrawn EP1570951A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004010379A DE102004010379A1 (en) 2004-03-03 2004-03-03 Process for the production of wafers with low-defect surfaces, the use of such wafers and electronic components obtained therefrom
DE102004010379 2004-03-03

Publications (2)

Publication Number Publication Date
EP1570951A2 EP1570951A2 (en) 2005-09-07
EP1570951A3 true EP1570951A3 (en) 2006-04-05

Family

ID=34745363

Family Applications (1)

Application Number Title Priority Date Filing Date
EP05004484A Withdrawn EP1570951A3 (en) 2004-03-03 2005-03-01 Method for the production of wafers with defective-poor surfaces, the use such wafers and therewith obtained electronic units

Country Status (5)

Country Link
US (1) US7367865B2 (en)
EP (1) EP1570951A3 (en)
JP (1) JP5105711B2 (en)
CN (1) CN1684234B (en)
DE (1) DE102004010379A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8207539B2 (en) * 2009-06-09 2012-06-26 Epistar Corporation Light-emitting device having a thinned structure and the manufacturing method thereof
DE102009052744B4 (en) * 2009-11-11 2013-08-29 Siltronic Ag Process for polishing a semiconductor wafer
CN112720247B (en) * 2020-12-30 2022-04-19 合肥晶合集成电路股份有限公司 Chemical mechanical planarization equipment and application thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008360A1 (en) * 1978-08-15 1980-03-05 International Business Machines Corporation Device and method for the polishing of loose workpieces

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JPH06762A (en) * 1992-06-17 1994-01-11 Sumitomo Electric Ind Ltd Single-side polishing method for wafer
JPH07161667A (en) * 1993-12-13 1995-06-23 Sony Corp Polishing of semiconductor wafer and wafer holder to be used for that
JP3534207B2 (en) * 1995-05-16 2004-06-07 コマツ電子金属株式会社 Manufacturing method of semiconductor wafer
US6395613B1 (en) * 2000-08-30 2002-05-28 Micron Technology, Inc. Semiconductor processing methods of forming a plurality of capacitors on a substrate, bit line contacts and method of forming bit line contacts
US5895583A (en) * 1996-11-20 1999-04-20 Northrop Grumman Corporation Method of preparing silicon carbide wafers for epitaxial growth
JPH11277413A (en) * 1998-03-27 1999-10-12 Kyocera Corp Wafer polishing machine
US6464571B2 (en) * 1998-12-01 2002-10-15 Nutool, Inc. Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein
JP2001093867A (en) * 1999-09-21 2001-04-06 Rodel Nitta Kk Protective member for periphery of wafer, and method of polishing the wafer
JP4028163B2 (en) * 1999-11-16 2007-12-26 株式会社デンソー Mechanochemical polishing method and mechanochemical polishing apparatus
EP1439246B1 (en) * 2000-04-07 2008-06-25 Hoya Corporation Process for producing silicon carbide single crystal
KR20030024834A (en) * 2000-08-07 2003-03-26 엠이엠씨 일렉트로닉 머티리얼즈 인코포레이티드 Method for processing a semiconductor wafer using double-side polishing
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
US6753954B2 (en) * 2000-12-06 2004-06-22 Asml Masktools B.V. Method and apparatus for detecting aberrations in a projection lens utilized for projection optics
US6418921B1 (en) * 2001-01-24 2002-07-16 Crystal Systems, Inc. Method and apparatus for cutting workpieces
WO2002091495A2 (en) * 2001-05-07 2002-11-14 Coatue Corporation Molecular memory device
US6488767B1 (en) * 2001-06-08 2002-12-03 Advanced Technology Materials, Inc. High surface quality GaN wafer and method of fabricating same
US6768157B2 (en) * 2001-08-13 2004-07-27 Advanced Micro Devices, Inc. Memory device
JP2003273049A (en) * 2002-03-18 2003-09-26 Toshiba Ceramics Co Ltd Vacuum bonding device of wafer
JP4206233B2 (en) * 2002-07-22 2009-01-07 旭硝子株式会社 Abrasive and polishing method
TWI257126B (en) * 2002-07-25 2006-06-21 Hitachi Chemical Co Ltd Slurry and polishing method
FR2843061B1 (en) * 2002-08-02 2004-09-24 Soitec Silicon On Insulator MATERIAL WAFER POLISHING PROCESS
US6770905B1 (en) * 2002-12-05 2004-08-03 Advanced Micro Devices, Inc. Implantation for the formation of CuX layer in an organic memory device
US6686263B1 (en) * 2002-12-09 2004-02-03 Advanced Micro Devices, Inc. Selective formation of top memory electrode by electroless formation of conductive materials
DE10306801A1 (en) * 2003-02-18 2004-09-02 Schott Glas Production of hexagonal monocrystals for making semiconductor components, comprises withdrawing the crystal from a melt in the direction of the c axis and heat-treating the crystal produced
US6656763B1 (en) * 2003-03-10 2003-12-02 Advanced Micro Devices, Inc. Spin on polymers for organic memory devices
US6825060B1 (en) * 2003-04-02 2004-11-30 Advanced Micro Devices, Inc. Photosensitive polymeric memory elements
US6787458B1 (en) * 2003-07-07 2004-09-07 Advanced Micro Devices, Inc. Polymer memory device formed in via opening
US6803267B1 (en) * 2003-07-07 2004-10-12 Advanced Micro Devices, Inc. Silicon containing material for patterning polymeric memory element
US6852586B1 (en) * 2003-10-01 2005-02-08 Advanced Micro Devices, Inc. Self assembly of conducting polymer for formation of polymer memory cell

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0008360A1 (en) * 1978-08-15 1980-03-05 International Business Machines Corporation Device and method for the polishing of loose workpieces

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "Method Of Polishing Semiconductor Wafers. September 1979.", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 22, no. 4, 1 September 1979 (1979-09-01), New York, US, pages 1453, XP002366198 *

Also Published As

Publication number Publication date
US20050233679A1 (en) 2005-10-20
JP5105711B2 (en) 2012-12-26
US7367865B2 (en) 2008-05-06
EP1570951A2 (en) 2005-09-07
DE102004010379A1 (en) 2005-09-22
CN1684234B (en) 2012-08-01
CN1684234A (en) 2005-10-19
JP2005260225A (en) 2005-09-22

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