EP1550195A1 - Assembly for n consumers of electric energy, of which m consumers are simultaneously supplied with energy - Google Patents
Assembly for n consumers of electric energy, of which m consumers are simultaneously supplied with energyInfo
- Publication number
- EP1550195A1 EP1550195A1 EP03776843A EP03776843A EP1550195A1 EP 1550195 A1 EP1550195 A1 EP 1550195A1 EP 03776843 A EP03776843 A EP 03776843A EP 03776843 A EP03776843 A EP 03776843A EP 1550195 A1 EP1550195 A1 EP 1550195A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- consumers
- energy
- arrangement according
- systems
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J1/00—Circuit arrangements for dc mains or dc distribution networks
- H02J1/10—Parallel operation of dc sources
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J4/00—Circuit arrangements for mains or distribution networks not specified as ac or dc
Definitions
- the invention relates to an arrangement according to the preamble of patent claim 1.
- Coating systems often consist of several sputtering devices, which are provided with different sputtering cathodes in order to apply different coatings to glass, for example.
- Each sputtering device has its own energy supply, which can be a direct current (DC) or alternating current (AC) energy supply.
- DC direct current
- AC alternating current
- the electrical powers with which the sputtering devices work are different. They can be 15 kW, but also 180 kW. For example, if you take fifteen sputtering devices with the outputs 180 kW (AC), 30 kW (DC), 75 kW (DC), 30 kW (DC), 30 kW (DC), 120 kW (DC), 120 kW (AC) , 120 kW (AC), 75 kW (DC), 120 kW (DC), 30 kW (DC), 30 kW (DC), 120 kW (DC), 120 kW (AC), 120 kW (AC) off, this results in a total AC power of 660 kW and a total DC power of 660 kW, which must be provided.
- An electrical power supply currently costs around € 700.00 per kilowatt, which results in a total electricity supply cost of € 924,000.00.
- the object of the invention is therefore to provide only as much electrical power as is actually required.
- the invention thus relates to an arrangement for several consumers of electrical energy, these consumers either having the same electrical power or different electrical powers. Since usually not all consumers have to be supplied with electrical energy at the same time, e.g. B. if some are out of service due to maintenance, a modular power supply system is provided that is off consists of several interconnectable modules. As a result, each consumer can be supplied with the power that he needs from small units.
- FIG. 1 shows a schematic diagram of a modular energy supply
- Fig. 2 shows a two-pole connection of energy supply sources to supply lines.
- sputtering systems 1 to 15 are shown schematically as boxes, which are arranged one behind the other, for example in a hall. Glass panes to be coated, which are provided with one or more layers, run through these sputtering systems 1 to 15.
- the respective electrical connected load of these sputtering systems 1 to 15 is shown within a box; likewise the material of a target to be split.
- the layer that is produced with the sputtered material on a substrate is shown to the right of sputtering systems 1 to 15.
- each system has its own power supply, which can provide the required performance.
- a controller 36 which links several individual energy supplies 16 to 35 to one another by means of a control line and switches 37 to 67.
- the sputtering system 5 requires 30 kW, so that the interconnection of the individual energy supplies 19 and 23 or 18 and 19 etc. is sufficient.
- the sputtering system 5 If the sputtering system 5 is switched on, feedback can take place via a line 70 to the controller 36, which then knows that thirty kW must be provided for the sputtering arrangement 5. You then linked z. B. by means of a control command via a line 71 and the switch 43, the two individual power supplies 19 and 23rd together. If the line 71 is designed as a control and power line, the interconnected power can be looped through the controller 36 and fed to the sputtering system 5 via the line 70.
- each sputtering system has its own regulation, which u. a. is responsible for preventing flashovers.
- the so-called are management thus remains assigned to each individual sputtering system 1 to 15 or its cathodes.
- an adaptation network must be assigned to each cathode during AC operation. If the sputter cathodes are operated with pulsed direct current, each cathode is connected to a pulse generator in addition to its own are management. If double cathodes are used, a polarity reversal unit is assigned to two cathodes.
- Fig. 2 the connection of two individual power supplies 19, 23 is shown again two-pole.
- the two individual energy supplies 19, 23 are connected to the supply lines 84, 85 via switches 80, 81 and 82, 83.
- the control lines 86 to 89 and supply lines 84, 85 can be guided to the controller 36 in a single cable. However, it is also possible to run both types of cable separately.
- the are management, the adaptation networks and the circuits necessary for the pulse operation can be arranged directly at the cathodes or in their vicinity.
- the sputtering systems 1 to 15 can of course also all have the same performance data. For example, there are many coating systems in a production hall of the same type and are some systems such. B. not in operation due to maintenance or revision, so that the actual utilization is around 80%, you can switch the required power to the systems in operation with the modular power supply 100. The systems that are at a standstill would then not be connected to the power supply.
- the invention has been described on the basis of an exemplary embodiment which relates to sputtering systems. However, it is applicable to all coating systems and, more generally, to all power consumers.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Supply And Distribution Of Alternating Current (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003141717 DE10341717A1 (en) | 2003-09-10 | 2003-09-10 | Arrangement for n consumers of electrical energy, from which m consumers are supplied with energy at the same time |
DE10341717 | 2003-09-10 | ||
PCT/DE2003/003714 WO2005027299A1 (en) | 2003-09-10 | 2003-11-10 | Assembly for n consumers of electric energy, of which m consumers are simultaneously supplied with energy |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1550195A1 true EP1550195A1 (en) | 2005-07-06 |
Family
ID=34223521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03776843A Withdrawn EP1550195A1 (en) | 2003-09-10 | 2003-11-10 | Assembly for n consumers of electric energy, of which m consumers are simultaneously supplied with energy |
Country Status (10)
Country | Link |
---|---|
US (1) | US7479712B2 (en) |
EP (1) | EP1550195A1 (en) |
JP (1) | JP2006514527A (en) |
KR (1) | KR100679618B1 (en) |
CN (1) | CN100349350C (en) |
AU (1) | AU2003286122A1 (en) |
DE (1) | DE10341717A1 (en) |
PL (1) | PL377149A1 (en) |
TW (1) | TWI265665B (en) |
WO (1) | WO2005027299A1 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010083334A1 (en) * | 2009-01-14 | 2010-07-22 | Integral Analytics, Inc. | Optimization of microgrid energy use and distribution |
US8706650B2 (en) * | 2009-01-14 | 2014-04-22 | Integral Analytics, Inc. | Optimization of microgrid energy use and distribution |
JP5722875B2 (en) * | 2009-04-10 | 2015-05-27 | ザ リージェンツ オブ ザ ユニバーシティ オブ ミシガン | Dynamically reconfigurable structure for large battery systems |
US9118213B2 (en) | 2010-11-24 | 2015-08-25 | Kohler Co. | Portal for harvesting energy from distributed electrical power sources |
JP5701730B2 (en) | 2011-09-30 | 2015-04-15 | 株式会社東芝 | Charge / discharge determination device, charge / discharge determination method, and charge / discharge determination program |
JP5731941B2 (en) * | 2011-09-30 | 2015-06-10 | 株式会社東芝 | Charge / discharge instruction apparatus, charge / discharge instruction method, and charge / discharge instruction program |
US10510575B2 (en) * | 2017-09-20 | 2019-12-17 | Applied Materials, Inc. | Substrate support with multiple embedded electrodes |
US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
WO2020154310A1 (en) | 2019-01-22 | 2020-07-30 | Applied Materials, Inc. | Feedback loop for controlling a pulsed voltage waveform |
US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
US11462389B2 (en) | 2020-07-31 | 2022-10-04 | Applied Materials, Inc. | Pulsed-voltage hardware assembly for use in a plasma processing system |
US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11798790B2 (en) | 2020-11-16 | 2023-10-24 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
US11495470B1 (en) | 2021-04-16 | 2022-11-08 | Applied Materials, Inc. | Method of enhancing etching selectivity using a pulsed plasma |
US11791138B2 (en) | 2021-05-12 | 2023-10-17 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11948780B2 (en) | 2021-05-12 | 2024-04-02 | Applied Materials, Inc. | Automatic electrostatic chuck bias compensation during plasma processing |
US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
US11984306B2 (en) | 2021-06-09 | 2024-05-14 | Applied Materials, Inc. | Plasma chamber and chamber component cleaning methods |
US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
US11476090B1 (en) | 2021-08-24 | 2022-10-18 | Applied Materials, Inc. | Voltage pulse time-domain multiplexing |
US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
US11972924B2 (en) | 2022-06-08 | 2024-04-30 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
Family Cites Families (26)
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DE2811942C2 (en) | 1977-03-23 | 1986-09-18 | Vide et Traitement S.A., Neuilly-en-Thelle | Furnace for the ionic nitriding treatment of metallic workpieces |
JPS583976A (en) | 1981-06-29 | 1983-01-10 | Hitachi Ltd | Method and device for formation of film by sputtering |
JPS62158863A (en) | 1985-12-30 | 1987-07-14 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Film forming apparatus |
JP2613201B2 (en) * | 1987-01-23 | 1997-05-21 | 株式会社日立製作所 | Spaghetti method |
US4788449A (en) * | 1987-04-24 | 1988-11-29 | The Foxboro Company | Redundant power distribution |
DE4305748A1 (en) * | 1993-02-25 | 1994-09-01 | Leybold Ag | Appliance for deposition onto, and/or etching of, substrates in a vacuum chamber |
US5444333A (en) * | 1993-05-26 | 1995-08-22 | Lights Of America, Inc. | Electronic ballast circuit for a fluorescent light |
ATE167007T1 (en) * | 1994-09-21 | 1998-06-15 | Inventio Ag | METHOD AND DEVICE FOR VARIABLE ALLOCATION OF INVERTERS IN OPERATION TO AT LEAST ONE LOAD |
AUPN422295A0 (en) * | 1995-07-18 | 1995-08-10 | Bytecraft Research Pty. Ltd. | Control system |
JPH0956064A (en) | 1995-08-21 | 1997-02-25 | Matsushita Electric Ind Co Ltd | Power source controller |
US5584974A (en) * | 1995-10-20 | 1996-12-17 | Eni | Arc control and switching element protection for pulsed dc cathode sputtering power supply |
DE19540255A1 (en) | 1995-10-28 | 1997-04-30 | Leybold Ag | Apparatus for film coating a substrate |
JPH09204240A (en) | 1996-01-24 | 1997-08-05 | Fujitsu Ltd | Power supplying device |
US5914585A (en) * | 1996-02-20 | 1999-06-22 | Norand Corporation | Power sharing in computing systems with a plurality of electronic devices |
DE19610012B4 (en) * | 1996-03-14 | 2005-02-10 | Unaxis Deutschland Holding Gmbh | A method for stabilizing a working point in reactive sputtering in an oxygen-containing atmosphere |
DE19651811B4 (en) * | 1996-12-13 | 2006-08-31 | Unaxis Deutschland Holding Gmbh | Device for covering a substrate with thin layers |
DE19848636C2 (en) * | 1998-10-22 | 2001-07-26 | Fraunhofer Ges Forschung | Method for monitoring an AC voltage discharge on a double electrode |
US6625736B1 (en) * | 1999-07-29 | 2003-09-23 | International Business Machines Corporation | System for automatically determining a number of power supplies are required by managing changes of the power requirements in a power consuming system |
DE19937859C2 (en) | 1999-08-13 | 2003-06-18 | Huettinger Elektronik Gmbh | Electrical supply unit for plasma systems |
US6448672B1 (en) * | 2000-02-29 | 2002-09-10 | 3Com Corporation | Intelligent power supply control for electronic systems requiring multiple voltages |
JP2002004033A (en) | 2000-06-19 | 2002-01-09 | Sony Corp | Apparatus and method for film deposition |
US6524455B1 (en) * | 2000-10-04 | 2003-02-25 | Eni Technology, Inc. | Sputtering apparatus using passive arc control system and method |
EP1263108A1 (en) | 2001-06-01 | 2002-12-04 | Roke Manor Research Limited | Community energy comsumption management |
JP4614578B2 (en) | 2001-06-01 | 2011-01-19 | キヤノンアネルバ株式会社 | Plasma processing equipment for sputter deposition applications |
KR101102116B1 (en) | 2001-10-11 | 2012-01-02 | 디노보 리서치, 엘엘씨 | Digital battery |
US7112896B2 (en) * | 2002-03-07 | 2006-09-26 | Sun Microsystems, Inc. | Power system with load matrix |
-
2003
- 2003-09-10 DE DE2003141717 patent/DE10341717A1/en not_active Ceased
- 2003-10-27 US US10/694,530 patent/US7479712B2/en not_active Expired - Fee Related
- 2003-11-10 EP EP03776843A patent/EP1550195A1/en not_active Withdrawn
- 2003-11-10 AU AU2003286122A patent/AU2003286122A1/en not_active Abandoned
- 2003-11-10 JP JP2005508828A patent/JP2006514527A/en active Pending
- 2003-11-10 PL PL37714903A patent/PL377149A1/en unknown
- 2003-11-10 WO PCT/DE2003/003714 patent/WO2005027299A1/en active Application Filing
- 2003-11-10 CN CNB2003801029401A patent/CN100349350C/en not_active Expired - Fee Related
- 2003-11-10 KR KR1020057006165A patent/KR100679618B1/en not_active IP Right Cessation
-
2004
- 2004-02-02 TW TW93102283A patent/TWI265665B/en not_active IP Right Cessation
Non-Patent Citations (1)
Title |
---|
See references of WO2005027299A1 * |
Also Published As
Publication number | Publication date |
---|---|
AU2003286122A1 (en) | 2005-04-06 |
KR100679618B1 (en) | 2007-02-06 |
US20050052803A1 (en) | 2005-03-10 |
WO2005027299A1 (en) | 2005-03-24 |
TW200511684A (en) | 2005-03-16 |
JP2006514527A (en) | 2006-04-27 |
DE10341717A1 (en) | 2005-05-25 |
KR20050067176A (en) | 2005-06-30 |
CN1711666A (en) | 2005-12-21 |
PL377149A1 (en) | 2006-01-23 |
CN100349350C (en) | 2007-11-14 |
US7479712B2 (en) | 2009-01-20 |
TWI265665B (en) | 2006-11-01 |
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Owner name: APPLIED MATERIALS GMBH & CO. KG |
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Effective date: 20110407 |