EP1523799A1 - Cooling body and rectifier module for an electrical machine - Google Patents
Cooling body and rectifier module for an electrical machineInfo
- Publication number
- EP1523799A1 EP1523799A1 EP03724878A EP03724878A EP1523799A1 EP 1523799 A1 EP1523799 A1 EP 1523799A1 EP 03724878 A EP03724878 A EP 03724878A EP 03724878 A EP03724878 A EP 03724878A EP 1523799 A1 EP1523799 A1 EP 1523799A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat sink
- diode
- cooling air
- sink according
- elevation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
- H02K11/04—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection for rectification
- H02K11/049—Rectifiers associated with stationary parts, e.g. stator cores
- H02K11/05—Rectifiers associated with casings, enclosures or brackets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/115—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the invention relates to a heat sink and a rectifier assembly for an electrical machine according to the preamble of the independent claims.
- EP 0329722 B1 discloses a cooling body and a rectifier for an electrical machine that has been introduced to the market. At least in part, the copies of these generators sold have rectifiers, the heat sinks, in particular plus heat sinks, of which have irregularly arranged cooling air openings around the plus diodes. To increase performance, i.e. increased current output of the generator and thus increased heat dissipation to maintain an acceptable temperature level of the rectifier, it is necessary to improve the cooling of the diodes.
- the radius-dependent jacket cut surface of the heat sink or its deviation from the standard cut surface is in the range of 1.3 ⁇ r / rD ⁇ 2.0.
- This configuration results in a flow through the cooling body through the introduced cooling air openings and thus additional heat dissipation and a lower flow resistance.
- a cooling element located behind it is additionally overflowed with cooling air, which in turn can emit additional thermal energy.
- cooling air passages are arranged at least partially in an annular manner around the at least one diode opening or diode, the arrangement of the cooling air passages corresponds to the annular or jet-shaped heat conduction characteristic of the diodes. This results in a further improvement in heat dissipation.
- the heat sink has at least two cooling air passages, which are arranged essentially uniformly around a diode opening or diode, the result is a uniform heat-conducting characteristic and thus a uniform heat dissipation of the diode and heating of the heat sink for effective cooling.
- the heat sink is at least partially in the form of a ring segment and if at least one cooling air passage is arranged between the diode opening or diode and a central opening of the heat sink, there is a lower flow resistance for the cooling air flow into the interior of the generator and thus a higher air throughput due to less strongly curved flow around the edge of the central opening.
- the heat sink which is partially in the form of a ring segment, has at least one cooling air passage between the diode opening or diode and an outer radial edge, the flow resistance for the flow into the interior of the generator is also reduced on this outer edge, and the air throughput is also reduced here by a less curved flow increases.
- the cooling air passages have an elongated shape with a longitudinal axis; the longitudinal axis being directed towards the central opening, there is a further reduction in the flow resistance.
- the longitudinal axis of the elongated cooling air passages is preferably directed essentially radially to the diode opening or diode.
- an elevation extends between two cooling air passages each associated with a diode opening or diode. This increase leads to an increase in mass, which in turn leads to an increase in surface area and thus to better heat dissipation at this critical point.
- the elevation In order to generate the lowest possible flow resistance of the elevation, provision is made for the elevation to extend in the direction of a central axis of the heat sink, so that it extends essentially or completely radially.
- the cooling air passages can nestle against adjacent elevations in order to guide the air along these elevations and thus to achieve an air flow flowing past the elevations in a targeted manner.
- a further increased cooling effect of the elevation results from the fact that the elevation extends into the central opening of the heat sink.
- a further improved cooling effect of the heat sink results from the fact that a further radial elevation extends between two cooling air passages arranged between the diode interface and the outer radial edge.
- At least two cooling air passages are located essentially uniformly around a diode interface.
- an elevation is arranged between two diode interfaces, which is ideally arranged between two cooling air passages.
- FIG. 1 shows a schematic illustration of a perforated heat sink
- FIG. 2 shows a plan view of a heat sink
- FIG. 3 shows a further schematic illustration of a perforated heat sink
- FIG. 4 shows a diagram of the relationship of a heat flow cross section with respect to the radius
- FIG. 5 shows a plan view of a heat sink according to the prior art.
- a heat sink 20 is shown in detail in FIG.
- the heat sink 20 has a plurality of openings, including at least one diode opening 23 forming a diode interface for inserting a diode.
- At least two cooling air passages 26 are arranged around this one diode opening 23, ten cooling air passages 26 being arranged around one diode opening 23 in the example.
- two cooling air passages 26 are at a distance a from one another and a distance b from an edge of the diode opening 23 or diode.
- the cooling air passages 26 are arranged in a ring around the at least one diode opening 23. This arrangement is an exemplary embodiment of the requirement that the cooling air passages 26 are arranged at least partially in a ring around the diode opening 23.
- FIG. 2 shows a top view of an entire heat sink 20, which is provided in particular for rectifier devices of three-phase generators for motor vehicles.
- the heat sink 20 initially consists of a flat, ie essentially flat base body 29, in which six diode openings 23 are introduced in this exemplary embodiment. Rectifier diodes are usually pressed into these essentially equally spaced diode openings 23. These rectifier diodes generate a loss heat during the rectification work, which must be dissipated via the base body 29 in order to avoid overheating of the diodes.
- the cooling effect of a perforated base body 29 is significantly better than that of an unperforated base body 29, which is why the aforementioned cooling air passages 26 are introduced into the base body 29.
- the heat sink 20 is at least partially in the form of a ring segment and has a central opening 32 in the center of the ring. If the rectifier with the heat sink 20 is mounted on the electrical machine, a shaft end of a rotor (not shown) projects through this central opening 32. It is provided that at least one cooling air passage 26 having an elongated shape with a longitudinal axis 35 is arranged between a diode opening 23 and the central opening 32. The longitudinal axis 35 is directed toward the central opening 32. The cooling effect is particularly advantageous if two of these elongated cooling air passages 26 are arranged next to one another between the diode opening 23 and the central opening 32.
- two neighboring cooling air passages 26 act like a throttle, so that the heat transport in the direction pointing away from a diode is initially impeded by two neighboring cooling air passages 26.
- an elevation 38 extends between two cooling air passages 26 arranged between a diode opening 23 and the central opening 32.
- the elevation 38 extends in the direction of a central axis 41 or radially inward.
- This central axis 41 shown as a cross in FIG. 2, and essentially perpendicular to the base body 29, coincides with an axis of rotation of a rotor (not shown) or denotes a center point of, for example, a circular contour of the heat sink 20.
- At least one of the elevations 38 extends into the central opening 32.
- a simple cooling air passage 26 can of course also be provided or a plurality of cooling air passages 26 arranged one after the other, which are arranged in a preferably radially oriented longitudinal direction.
- At least one cooling air passage 26 having an elongated shape with a longitudinal axis 35 is arranged in the essentially planar base body 29 between a diode opening 23 and an outer radial edge 44 is.
- the longitudinal axis 35 is also directed towards the central opening 32.
- a simple cooling air passage 26 can of course also be provided here or a plurality of cooling air passages 26 arranged one after the other, which are arranged in a longitudinal direction that is preferably oriented radially to the diode opening 23.
- the longitudinal axis 35 is directed radially or essentially radially to the diode opening 23.
- an elevation 38 is also arranged between two adjacent elongated diode openings 23 between the outer radial edge 44 and a diode opening 23.
- the at least two cooling air passages 26 are arranged substantially uniformly around a diode opening 23. If, for reasons of space, two adjacent diodes are arranged relatively close to one another and, as provided overall, cooling air passages 26 are arranged around the diodes, there is a risk that the very closely adjacent passage openings 26 of two different diodes will cause a heat build-up between the diodes. Such a build-up of heat has the result that the heat dissipation between the diodes is only limited and the temperature level increases in the middle between two diodes. To remedy this problem, it is provided that an elevation 38 is arranged between two diode openings 23, which extends from the base body 29. It is very particularly provided that the elevation 38 is arranged between at least two cooling air passages 26 of two adjacent diodes.
- an elevation 38 being additionally arranged around the diode or diode opening 23 then concentrically circles can be arranged around a diode opening 23.
- a circle k is shown in FIG. If the circle k intersects - as shown - cooling air passages 26, a so-called jacket cut surface M results in the depth of the cooling body 20, which is interrupted in this case by the cooling air passages 26.
- the entire surface area M consists of ten individual shell cut surfaces together.
- individual jacket surfaces Moe result, which are formed in the cooling air passages 26.
- Several such individual jacket surfaces Moe form an entire jacket surface Mo.
- the heat flow cross section in the surface direction of the heat sink 20 results from the jacket cut surface M, which is dependent on the radius r.
- the jacket sectional area M is referred to here as the area As.
- This area As which is dependent on the radius, can be normalized, specifically to the theoretical cylindrical surface area of an unperforated and non-finned heat sink 20, the area AN.
- This comparison cladding sectional area corresponds to a theoretical cylindrical cladding area around the diode opening 23 with the radius r.
- the plate thicknesses are the same for holding the diodes. Elevations, ribs, etc. directly on the diode are not taken into account to determine the plate thickness.
- r is set equal to the diameter 2 * rD of the diode opening 23 or the soldered-on diode, the value 1 of both surfaces to be compared is obtained if As relates to AN.
- the radius r can also be standardized by setting the radius r in relation to the radius rD of the diode opening 23.
- a radius-dependent surface section M is related to a radius-dependent standard section AN, a standardized diagram, FIG. 4, can be determined. According to FIG. 4, it is provided that a radius-dependent jacket cut surface M of the heat sink 20 around a diode opening 23 deviates from a radius-dependent standard cut surface by a maximum of - 52%. This deviation is shown in FIG. 4 with the symbol ⁇ s2. According to an improved embodiment, there is a deviation ( ⁇ sl) of at most - 35%. It is envisaged that the permissible deviation will be between 1.4 ⁇ r / rD ⁇ 1.8.
- elevation is not limited to an elongated shape — for example that of a cooling fin. It is also understood to mean an essentially cylindrical or even conical shape; a series of individual essentially cylindrical or even conical cooling elevations also perform the same function.
- diode boundary surface refers to a — essentially cylindrical — lateral surface of the diode opening formed by a diode opening 23 Roger that.
- this also means the actual soldered connection surface between the diode and the heat sink when the diodes are soldered onto the heat sink.
- An important property of the diode interface is the property according to which the heat transfer from the diode to the heat sink takes place through this area.
- a rectifier assembly 50 which has a heat sink 20 according to one of the described examples, FIG. 5.
- the rectifier assembly 50 can be, for example, with two individual heat sinks 20 for mounting on a bearing plate of a generator or also with a heat sink 20, for example as a positive heat sink and a further heat sink 20, for example designed as a minus heat sink, which also has the function of a bearing plate, that is to say is a generator housing part.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Motor Or Generator Cooling System (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10232051 | 2002-07-16 | ||
DE10232051A DE10232051A1 (en) | 2002-07-16 | 2002-07-16 | Heatsink and rectifier assembly for an electrical machine |
PCT/DE2003/001410 WO2004017495A1 (en) | 2002-07-16 | 2003-05-02 | Cooling body and rectifier module for an electrical machine |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1523799A1 true EP1523799A1 (en) | 2005-04-20 |
Family
ID=31724041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03724878A Ceased EP1523799A1 (en) | 2002-07-16 | 2003-05-02 | Cooling body and rectifier module for an electrical machine |
Country Status (6)
Country | Link |
---|---|
US (1) | US7505273B2 (en) |
EP (1) | EP1523799A1 (en) |
JP (1) | JP4559855B2 (en) |
CN (1) | CN1332498C (en) |
DE (1) | DE10232051A1 (en) |
WO (1) | WO2004017495A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006062482A1 (en) * | 2006-12-28 | 2008-07-03 | Robert Bosch Gmbh | Cooling body's cooling effectiveness determining method, involves computing ratio of surface area of cooling body surface to differential surface area, where ratio represents cooling effectiveness of cooling body |
DE102007014645A1 (en) * | 2007-03-27 | 2008-10-30 | Continental Automotive Gmbh | Electrical component for electrical power steering of motor vehicle, has heat sink with radial edge that has diameter corresponding to inner side diameter of tubular housing, where heat sink is inserted into housing of electric motor |
DE102008042504A1 (en) * | 2008-09-30 | 2010-10-21 | Robert Bosch Gmbh | Electric machine with a contact element for the electrical connection of electrical components |
DE102009042567A1 (en) * | 2009-09-17 | 2011-06-22 | Robert Bosch GmbH, 70469 | Cooling device in a rectifier device of an electrical machine |
US9380717B2 (en) * | 2012-07-27 | 2016-06-28 | Illinois Tool Works Inc. | Rectifier module for power conversion circuits |
US9312742B2 (en) | 2013-03-01 | 2016-04-12 | Hamilton Sundstrand Corporation | Connector and spring assembly for a generator |
US9693833B2 (en) | 2013-08-05 | 2017-07-04 | Merit Medical Systems, Inc. | Absorbent cleaning and securement devices and methods |
US9976112B2 (en) | 2015-03-04 | 2018-05-22 | Merit Medical Systems, Inc. | Absorbent pads and methods of manufacturing |
JP6414092B2 (en) * | 2016-01-28 | 2018-10-31 | 株式会社デンソー | Rotating electric machine for vehicles |
US20220065443A1 (en) * | 2020-08-28 | 2022-03-03 | Aaron GOMEZ | Torch Heat Shield |
Family Cites Families (42)
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US3198972A (en) * | 1961-08-03 | 1965-08-03 | Gen Motors Corp | Dynamoelectric machine |
CA747579A (en) * | 1963-02-19 | 1966-11-29 | M. Potter Frederick | Heatsink |
US3573516A (en) | 1969-04-23 | 1971-04-06 | Gen Electric | Rectifier bridge for use with an alternator |
JPS5273410U (en) * | 1975-11-28 | 1977-06-01 | ||
US4329603A (en) * | 1977-06-10 | 1982-05-11 | Sundstrand Corporation | Directly cooled, rotating rectifier assembly for a synchronous machine |
GB2057763B (en) * | 1979-09-07 | 1983-09-14 | Bosch Gmbh Robert | Rectifier assembly |
DE2936204C2 (en) * | 1979-09-07 | 1986-12-11 | Robert Bosch Gmbh, 7000 Stuttgart | Rectifier unit |
JPS5663282U (en) * | 1979-10-19 | 1981-05-28 | ||
FR2512601B1 (en) | 1981-09-08 | 1986-05-16 | Bosch Gmbh Robert | AC GENERATOR WITH AIR COOLED RECTIFIERS |
US4701828A (en) * | 1984-11-07 | 1987-10-20 | Al Weiner | Heat sink assembly |
JPH0742225Y2 (en) * | 1986-08-28 | 1995-09-27 | 株式会社三ツ葉電機製作所 | Rectifier structure of vehicle generator |
GB8623361D0 (en) * | 1986-09-29 | 1986-11-05 | Lucas Elect Electron Syst | Alternator |
DE3728081A1 (en) | 1987-08-22 | 1989-03-02 | Bosch Gmbh Robert | RECTIFIER BEARING DEVICE |
CA2012737A1 (en) | 1989-03-22 | 1990-09-22 | Hideyuki Takahashi | Structure of rectifier in generator for vehicle |
US5043614A (en) * | 1990-02-02 | 1991-08-27 | Ford Motor Company | Alternator rectifier bridge assembly |
JP3182822B2 (en) * | 1991-12-26 | 2001-07-03 | 株式会社デンソー | Rectifier for automotive alternator |
JP3230829B2 (en) * | 1992-01-14 | 2001-11-19 | 株式会社日立製作所 | AC generators and rectifiers for vehicles |
DE4421358B4 (en) * | 1994-06-18 | 2009-04-09 | Robert Bosch Gmbh | Rectifier arrangement, preferably for a three-phase generator for motor vehicles |
US5659212A (en) * | 1994-12-16 | 1997-08-19 | Electro-Dyn Choke Corporation | Rectifier assembly for automotive alternator |
JP3019251B2 (en) * | 1996-08-06 | 2000-03-13 | 中村製作所株式会社 | Radiator and manufacturing method thereof |
JP3675048B2 (en) * | 1996-08-09 | 2005-07-27 | 株式会社デンソー | Vehicle alternator |
JP3671534B2 (en) * | 1996-08-09 | 2005-07-13 | 株式会社デンソー | Vehicle alternator |
US5866963A (en) * | 1997-01-30 | 1999-02-02 | Renard Manufacturing Co., Inc. | Bridge rectifier with insulating support having expandable legs |
DE19705228A1 (en) * | 1997-02-12 | 1998-08-13 | Bosch Gmbh Robert | Electrical machine, preferably a three-phase generator with a rectifier unit |
ITTO980517A1 (en) | 1998-06-12 | 1999-12-12 | Magneti Marelli Manufacturing | BRIDGE RECTIFIER DEVICE FOR AN ALTERNATOR. |
DE19828518A1 (en) * | 1998-06-26 | 1999-12-30 | Bosch Gmbh Robert | Rectifier modular unit on a three-phase alternator |
US6252320B1 (en) * | 1999-05-24 | 2001-06-26 | Unit Parts Company | Alternator system |
JP2000341953A (en) * | 1999-05-27 | 2000-12-08 | Mitsubishi Electric Corp | Rectifier for vehicle ac generator |
JP3486136B2 (en) * | 1999-07-22 | 2004-01-13 | 三菱電機株式会社 | AC generator for vehicles |
DE19946255A1 (en) * | 1999-09-27 | 2001-03-29 | Philips Corp Intellectual Pty | Rectifier arrangement |
JP4306058B2 (en) * | 1999-12-07 | 2009-07-29 | 株式会社デンソー | Vehicle alternator |
US6580187B2 (en) * | 2000-01-14 | 2003-06-17 | Delphi Technologies, Inc. | Rectifier assembly for an air-cooled generator |
US6205024B1 (en) * | 2000-01-22 | 2001-03-20 | Kalem Technology Corporation | Heat sink for rectifier |
JP3983445B2 (en) * | 2000-03-15 | 2007-09-26 | 三菱電機株式会社 | AC generator |
KR20020001311A (en) * | 2000-06-28 | 2002-01-09 | 에릭 발리베 | A alternator for car |
JP3905300B2 (en) * | 2000-10-30 | 2007-04-18 | 三菱電機株式会社 | AC generator for vehicles |
US6661662B2 (en) * | 2001-02-21 | 2003-12-09 | Transpo Electronics, Inc. | Vehicular modular design multiple application rectifier assembly |
US6552908B2 (en) * | 2001-02-21 | 2003-04-22 | Transpo Electronics, Inc. | Vehicular modular design multiple application rectifier assembly having outer lead integument |
US6731030B2 (en) * | 2001-08-30 | 2004-05-04 | Integral Ro Design Ltd. | High performance bridge rectifier for diode-rectified alternating current generator |
US20030070798A1 (en) * | 2001-10-12 | 2003-04-17 | Chun-Min Shih | Heat sink for a rectifier |
US20030141042A1 (en) * | 2002-01-31 | 2003-07-31 | Bradfield Michael Duane | High thermal capability positive heat sink for rectifier assembly |
US6707691B2 (en) * | 2002-04-17 | 2004-03-16 | Delphi Technologies, Inc. | Compact rectifier bridge and method for manufacturing the same |
-
2002
- 2002-07-16 DE DE10232051A patent/DE10232051A1/en not_active Withdrawn
-
2003
- 2003-05-02 US US10/494,381 patent/US7505273B2/en not_active Expired - Fee Related
- 2003-05-02 WO PCT/DE2003/001410 patent/WO2004017495A1/en active Application Filing
- 2003-05-02 CN CNB03809682XA patent/CN1332498C/en not_active Expired - Fee Related
- 2003-05-02 EP EP03724878A patent/EP1523799A1/en not_active Ceased
- 2003-05-02 JP JP2004528291A patent/JP4559855B2/en not_active Expired - Fee Related
Non-Patent Citations (1)
Title |
---|
See references of WO2004017495A1 * |
Also Published As
Publication number | Publication date |
---|---|
US7505273B2 (en) | 2009-03-17 |
CN1650500A (en) | 2005-08-03 |
DE10232051A1 (en) | 2004-11-18 |
US20050013118A1 (en) | 2005-01-20 |
JP2005533392A (en) | 2005-11-04 |
WO2004017495A1 (en) | 2004-02-26 |
JP4559855B2 (en) | 2010-10-13 |
CN1332498C (en) | 2007-08-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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