EP1513689A1 - Method and device for transferring a pattern - Google Patents

Method and device for transferring a pattern

Info

Publication number
EP1513689A1
EP1513689A1 EP03736397A EP03736397A EP1513689A1 EP 1513689 A1 EP1513689 A1 EP 1513689A1 EP 03736397 A EP03736397 A EP 03736397A EP 03736397 A EP03736397 A EP 03736397A EP 1513689 A1 EP1513689 A1 EP 1513689A1
Authority
EP
European Patent Office
Prior art keywords
pressing means
power source
pressing
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP03736397A
Other languages
German (de)
French (fr)
Inventor
Lennart Olsson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Obducat AB
Original Assignee
Obducat AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=30002439&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP1513689(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from SE0201912A external-priority patent/SE524684C2/en
Application filed by Obducat AB filed Critical Obducat AB
Publication of EP1513689A1 publication Critical patent/EP1513689A1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
    • B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B29C2043/025—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves forming a microstructure, i.e. fine patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/08—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means for dielectric heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning

Definitions

  • the present invention relates to a method and a device for heating a substrate when transferring a pattern from a stamp to a substrate by pressing. More specifically, it relates to a method and a device in connection with so-called nanoimprint lithography or hot embossing.
  • the present application relates to lithography by pressing a stamp with a pattern into a deformable film on a substrate.
  • the film has to be sufficiently soft. This is usually achieved by heating the film so as to make it soft. This has previously been done, for instance, by heating the substrate from one of its sides by means of a hot plate.
  • One problem of this technique is that the heating is not homogeneous. This problem is particularly important in connection with so-called nanoimprint lithography in which the structures which are to be transferred are in the order of nanometers .
  • PCT application WO 01/63361 discloses a method and a device for homogeneous heating of a substrate. This is achieved by providing a heat-absorbing layer, which is arranged so that a homogeneous thermal distribution is obtained in the layer. The heat is subsequently transferred to the substrate. When heating a substrate in the above manner, a homogeneous heating is obtained over the surface of the substrate. Nevertheless one side of the substrate is heated faster than the other, which may result in the substrate bending.
  • the present invention is intended to provide a method and a device which overcome at least one of the problems identified above.
  • An object of the present invention is to provide a method for transferring a pattern from a stamp to a layer on a substrate by pressing, the layer being heated homogeneously.
  • a further object of the present invention is to provide a device for transferring a pattern from a stamp to a layer on a substrate by pressing, the layer being heated homogeneously.
  • One more object of the present invention is to provide a device for transferring a pattern from a stamp to a layer on a substrate by pressing, the layer being heated in a fast and controllable manner.
  • a method for transferring at least one pattern in the form of a structure from a pressing means to a substrate, which is coated with a layer on at least one planar surface comprises the following steps: connecting a power source over the pressing means, operating the power source so that a current is passed through the pressing means and heats the pressing means and the layer, which is in contact with the pressing means, arranging the pressing means, which has a surface with a structure that defines the pattern, said pattern facing the layer, and pressing the pressing means against the layer so that the pattern is transferred to the layer.
  • the method according to the invention is particularly useful in so-called nanoimprint lithography in which the size of the structures which are to be transferred is in the order of nanometers .
  • the pressing means has to be electrically conducting.
  • the power source is connected so as to render the current density in the pressing means homogeneous. This can be achieved in a number of ways.
  • the power source being connected in this manner and considering the shape of the pressing means, it is possible to connect the pressing means in a suitable manner. If the pressing means is rectangular, the power source can be connected along a pair of opposed sides, the power source being connected along the entire side of each one of the opposed sides .
  • the substrate will be heated in a self-regulating manner. It is thus advantageous to make the pressing means of a material which has a resistivity that increases as the temperature rises.
  • the method further comprises the step of providing a pressing means which is formed so that the current density in the pressing means will be homogeneous. If the pressing means has the shape of a trapezoid, the pressing means is suitably formed so as to be thickest at the end which is closest to the shortest side of the two parallel sides of the trapezoid. The pressing means is connected to the power source along the entirety of the two parallel sides.
  • the power source is advantageously connected between the inner periphery and the outer periphery.
  • the substrate is made thicker at the inner periphery. It is particularly advantageous to have a circular-symmetrical pressing means.
  • the connecting means in a number of ways, also when the pressing means is circular-symmetrical with an inner and an outer periphery.
  • the power source is connected with the aid of two connecting means, which each extend in the radial direction of the pressing means .
  • the step of connecting the pressing means to a power source comprises the steps of arranging the substrate in a recess in an electrically conducting holder means with a rectangular outer shape, and connecting the holder means to the power source, the pressing means having electrical contact along its entire periphery, and the combination of holder means and pressing means having the same electrical properties as a rectangular plate. In this manner, it is relatively easy to provide a homogeneous current density in the pressing means.
  • a device for transferring at least one pattern from a pressing means with a structure to a plate-shaped substrate, which is coated with a layer on a planar surface, comprising a first holder means for receiving the substrate, a second holder means for receiving the pressing means, the device being arranged to apply a pressure between the first holder means and the second holder means.
  • the device is characterized in that it further comprises a power source for heating the pressing means, and electrical connecting means for connecting the pressing means to the power source .
  • the first holder means comprises a rectangular portion with a recess which is formed to receive the pressing means, which portion is connected on two opposed sides to the electrical connecting means and has the same resistivity as the substrate and which portion together with the pressing means forms a unit with the same electrical properties as a rectangular plate without a recess.
  • the pressing means is resi- liently connected to the power source.
  • the pressing means is in moving contact with the connecting means to enable the pressing means to slide in relation to the connecting means.
  • Fig. 1 illustrates a method according to the invention.
  • Fig. 2 shows a pressing means with connecting means according to an embodiment of the invention.
  • Fig. 3 shows a pressing means arranged in a portion according to an alternative embodiment of the present invention.
  • Fig. 4 shows a pressing means according to an alternative embodiment of the present invention.
  • Fig. 5 shows a device according to an embodiment of the invention.
  • Fig. 6 shows two different embodiments for connection of connecting means to the pressing means.
  • Fig. 7 shows a further embodiment for connection of connecting means to a pressing means. Description of Embodiments of the Invention
  • Fig. 1 illustrates a method according to the invention.
  • a pressing means 1 is arranged on a first holder means 2.
  • the pressing means 1 is provided with a pattern 3 in the form of raised portions on one of its sides.
  • the pattern 3 is facing a layer 4 which is arranged on a substrate 5.
  • the substrate 5 is arranged on a second holder means 6.
  • a first connecting means 7 and a second connecting means 8 are arranged on one side each of the substrate 5.
  • the pattern 3 When the pattern 3 is to be transferred from the pressing means to the layer, it is necessary to first heat the layer 4 to make it deformable .
  • a voltage is applied over the connecting means so that a current is passed through the pressing means after the pressing means has been brought into contact with the layer.
  • the connecting means 7, 8 are designed so that the current through the pressing means will have a homogeneous density.
  • the current through the pressing means causes it to be heated and the layer to soften.
  • Fig. 2a shows a rectangular pressing means 10 with a first connecting means 11 and a second connecting means 12 arranged on one side each of the pressing means 10.
  • Each of the connecting means is in contact with the pressing means along the entire side of one of the sides of the pressing means, thereby ensuring a homogeneous current density in the pressing means.
  • Fig. 2b is a cross-sectional view of the pressing means.
  • Fig. 3 shows how a first connecting means 13 and a second connecting means 14 are arranged on a portion 15 in which the pressing means 16 is provided.
  • the pressing means 16 is circular and arranged in a circular recess in the portion 15 with electrical contact between the pressing means and the connecting means along the entire periphery of the pressing means.
  • the portion is made of the same material as the pressing means, which makes the current distribution between the connecting means essentially the same as in the embodiment shown in Fig . 2.
  • Fig. 4 shows a circular pressing means 17 which is defined by an outer periphery 18 and an inner periphery 19 which defines a circular through-hole.
  • the pressing means 17 is thicker towards the center in such manner that the current density will be constant, which results in a homogeneous heating of the pressing means and thus also of the layer.
  • the pressing means is formed so that a desirable radial temperature distribution is obtained.
  • Connecting means 40, 41 are connected', respectively, at . the inner and the outer periphery of the pressing means.
  • Fig. 5 schematically shows a device for transferring a pattern from a pressing means 20 to a layer 21 on a substrate 22.
  • the device comprises a power unit 23 which is connected to both sides of the pressing means 20. By passing a current through the pressing means it can be heated.
  • the pressing means 20 is arranged on a first holder means 24 whereas the substrate is arranged on a second holder means 25.
  • the device is arranged so that a pressure can be applied between the two . holder means.
  • the device also comprises a power source 26, which is intended to be connected to the pressing means .
  • Fig. 6 shows two different embodiments of the connection of connecting means to a pressing means.
  • Fig. 6a is a cross-sectional view in which a pressing means 30 is arranged in contact with a carbon path 31. The pressing means 30 rests on the carbon path 31 and can slide towards the carbon path in the direction of the arrow 36.
  • Fig. 6b shows an alternative embodiment in which a pressing means 32 is connected to a connecting means 33, which comprises a resilient portion 34 that allows motion in the direction of the arrow 35.
  • ii is a cross-sectional view in which a pressing means 30 is arranged in contact with a carbon path 31. The pressing means 30 rests on the carbon path 31 and can slide towards the carbon path in the direction of the arrow 36.
  • Fig. 6b shows an alternative embodiment in which a pressing means 32 is connected to a connecting means 33, which comprises a resilient portion 34 that allows motion in the direction of the arrow 35.
  • Fig. 6 are merely exemplifications which can be applied in the area between the connecting means and the pressing means in one of the embodiments previously described.
  • Fig. 7 shows yet another embodiment of how the pressing means 37 can be connected to connecting means.
  • both the pressing means 37, 38 are radially connected from the inner periphery 39 to the outer periphery 40.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

A method and a device for transferring a pattern in the form of a structure from a pressing means to a layer on a substrate. The layer is heated by a current being supplied through the pressing means in contact with the layer.

Description

METHOD AND DEVICE FOR TRANSFERRING A PATTERN
Field of the Invention
The present invention relates to a method and a device for heating a substrate when transferring a pattern from a stamp to a substrate by pressing. More specifically, it relates to a method and a device in connection with so-called nanoimprint lithography or hot embossing. Background Art
The present application relates to lithography by pressing a stamp with a pattern into a deformable film on a substrate. To allow pressing of the pattern from the stamp into the film, the film has to be sufficiently soft. This is usually achieved by heating the film so as to make it soft. This has previously been done, for instance, by heating the substrate from one of its sides by means of a hot plate. One problem of this technique is that the heating is not homogeneous. This problem is particularly important in connection with so-called nanoimprint lithography in which the structures which are to be transferred are in the order of nanometers .
PCT application WO 01/63361 discloses a method and a device for homogeneous heating of a substrate. This is achieved by providing a heat-absorbing layer, which is arranged so that a homogeneous thermal distribution is obtained in the layer. The heat is subsequently transferred to the substrate. When heating a substrate in the above manner, a homogeneous heating is obtained over the surface of the substrate. Nevertheless one side of the substrate is heated faster than the other, which may result in the substrate bending.
If the pattern has to be transferred from the stamp to the substrate with a high degree of accuracy, it is desirable to avoid bending of the substrate. Consequently, there is^ a need for a method and a device which in a more homogeneous manner heat a layer on a substrate when transferring a pattern from a stamp to the layer. Summary of the Invention
The present invention is intended to provide a method and a device which overcome at least one of the problems identified above.
An object of the present invention is to provide a method for transferring a pattern from a stamp to a layer on a substrate by pressing, the layer being heated homogeneously.
It is also an object of the present invention to provide a method for transferring a pattern from a stamp to a layer on a substrate by pressing, the layer being heated in a fast and controllable manner.
A further object of the present invention is to provide a device for transferring a pattern from a stamp to a layer on a substrate by pressing, the layer being heated homogeneously. One more object of the present invention is to provide a device for transferring a pattern from a stamp to a layer on a substrate by pressing, the layer being heated in a fast and controllable manner.
At least one of these objects is achieved by a method or a device according to the independent claims .
Further advantages of the invention are stated in the dependent claims.
According to the invention, a method for transferring at least one pattern in the form of a structure from a pressing means to a substrate, which is coated with a layer on at least one planar surface, is characterized in that it comprises the following steps: connecting a power source over the pressing means, operating the power source so that a current is passed through the pressing means and heats the pressing means and the layer, which is in contact with the pressing means, arranging the pressing means, which has a surface with a structure that defines the pattern, said pattern facing the layer, and pressing the pressing means against the layer so that the pattern is transferred to the layer.
Since the pressing means is heated by a current being passed therethrough, a considerably more homogeneous heating of the pressing means and the layer is allowed, as compared to prior-art technique. The method according to the invention is particularly useful in so-called nanoimprint lithography in which the size of the structures which are to be transferred is in the order of nanometers .
Naturally, in a method according to the invention the pressing means has to be electrically conducting.
According to one embodiment of the invention, the power source is connected so as to render the current density in the pressing means homogeneous. This can be achieved in a number of ways. The power source being connected in this manner and considering the shape of the pressing means, it is possible to connect the pressing means in a suitable manner. If the pressing means is rectangular, the power source can be connected along a pair of opposed sides, the power source being connected along the entire side of each one of the opposed sides .
If the resistivity increases as the temperature rises, the substrate will be heated in a self-regulating manner. It is thus advantageous to make the pressing means of a material which has a resistivity that increases as the temperature rises.
According to an alternative embodiment, the method further comprises the step of providing a pressing means which is formed so that the current density in the pressing means will be homogeneous. If the pressing means has the shape of a trapezoid, the pressing means is suitably formed so as to be thickest at the end which is closest to the shortest side of the two parallel sides of the trapezoid. The pressing means is connected to the power source along the entirety of the two parallel sides.
If the pressing means has an outer periphery and a hole which defines an inner periphery, the power source is advantageously connected between the inner periphery and the outer periphery.
If a homogeneous current density in the substrate is desirable, the substrate is made thicker at the inner periphery. It is particularly advantageous to have a circular-symmetrical pressing means.
Naturally, it is possible to connect the connecting means in a number of ways, also when the pressing means is circular-symmetrical with an inner and an outer periphery. According to one embodiment, the power source is connected with the aid of two connecting means, which each extend in the radial direction of the pressing means .
In some cases, it may be difficult to provide a homogeneous current density when the pressing means is irregular in shape. According to one embodiment of the invention, the step of connecting the pressing means to a power source comprises the steps of arranging the substrate in a recess in an electrically conducting holder means with a rectangular outer shape, and connecting the holder means to the power source, the pressing means having electrical contact along its entire periphery, and the combination of holder means and pressing means having the same electrical properties as a rectangular plate. In this manner, it is relatively easy to provide a homogeneous current density in the pressing means.
According to one aspect of the invention, a device is provided for transferring at least one pattern from a pressing means with a structure to a plate-shaped substrate, which is coated with a layer on a planar surface, comprising a first holder means for receiving the substrate, a second holder means for receiving the pressing means, the device being arranged to apply a pressure between the first holder means and the second holder means. The device is characterized in that it further comprises a power source for heating the pressing means, and electrical connecting means for connecting the pressing means to the power source .
According to one embodiment of the invention, the first holder means comprises a rectangular portion with a recess which is formed to receive the pressing means, which portion is connected on two opposed sides to the electrical connecting means and has the same resistivity as the substrate and which portion together with the pressing means forms a unit with the same electrical properties as a rectangular plate without a recess.
As a result, it is relatively easy to provide a homogeneous current density in the substrate.
To avoid thermal strain in the pressing means, the pressing means, according to one embodiment, is resi- liently connected to the power source. According to an alternative embodiment, the pressing means is in moving contact with the connecting means to enable the pressing means to slide in relation to the connecting means.
It goes without saying that the different features of the device can be combined with each other in the same way as the different features of the method can be combined with each other. Furthermore, the different features of the device are applicable to the method and vice versa.
Below various embodiments of the invention will be described with reference to the accompanying drawings . Brief Description of the Drawings
Fig. 1 illustrates a method according to the invention.
Fig. 2 shows a pressing means with connecting means according to an embodiment of the invention.
Fig. 3 shows a pressing means arranged in a portion according to an alternative embodiment of the present invention.
Fig. 4 shows a pressing means according to an alternative embodiment of the present invention.
Fig. 5 shows a device according to an embodiment of the invention.
Fig. 6 shows two different embodiments for connection of connecting means to the pressing means. Fig. 7 shows a further embodiment for connection of connecting means to a pressing means. Description of Embodiments of the Invention
Fig. 1 illustrates a method according to the invention. A pressing means 1 is arranged on a first holder means 2. The pressing means 1 is provided with a pattern 3 in the form of raised portions on one of its sides. The pattern 3 is facing a layer 4 which is arranged on a substrate 5. The substrate 5 is arranged on a second holder means 6. A first connecting means 7 and a second connecting means 8 are arranged on one side each of the substrate 5.
When the pattern 3 is to be transferred from the pressing means to the layer, it is necessary to first heat the layer 4 to make it deformable . For this purpose, a voltage is applied over the connecting means so that a current is passed through the pressing means after the pressing means has been brought into contact with the layer. The connecting means 7, 8 are designed so that the current through the pressing means will have a homogeneous density. The current through the pressing means causes it to be heated and the layer to soften. By measuring the resistance between the connecting means, it is possible to control the temperature so as to attain the desirable temperature.
When the layer is heated to the desirable temperature, a pressure is applied between the first holder means 2 and the second holder means 6, whereby the pattern is transferred to the layer 4.
Fig. 2a shows a rectangular pressing means 10 with a first connecting means 11 and a second connecting means 12 arranged on one side each of the pressing means 10. Each of the connecting means is in contact with the pressing means along the entire side of one of the sides of the pressing means, thereby ensuring a homogeneous current density in the pressing means. Fig. 2b is a cross-sectional view of the pressing means.
Fig. 3 shows how a first connecting means 13 and a second connecting means 14 are arranged on a portion 15 in which the pressing means 16 is provided. The pressing means 16 is circular and arranged in a circular recess in the portion 15 with electrical contact between the pressing means and the connecting means along the entire periphery of the pressing means. The portion is made of the same material as the pressing means, which makes the current distribution between the connecting means essentially the same as in the embodiment shown in Fig . 2.
Fig. 4 shows a circular pressing means 17 which is defined by an outer periphery 18 and an inner periphery 19 which defines a circular through-hole. When a voltage is applied between the inner and the outer periphery, the current is passed radially through the pressing means. The pressing means 17 is thicker towards the center in such manner that the current density will be constant, which results in a homogeneous heating of the pressing means and thus also of the layer. As an alternative, the pressing means is formed so that a desirable radial temperature distribution is obtained. Connecting means 40, 41 are connected', respectively, at . the inner and the outer periphery of the pressing means.
Fig. 5 schematically shows a device for transferring a pattern from a pressing means 20 to a layer 21 on a substrate 22. The device comprises a power unit 23 which is connected to both sides of the pressing means 20. By passing a current through the pressing means it can be heated. The pressing means 20 is arranged on a first holder means 24 whereas the substrate is arranged on a second holder means 25. The device is arranged so that a pressure can be applied between the two. holder means. The device also comprises a power source 26, which is intended to be connected to the pressing means .
Fig. 6 shows two different embodiments of the connection of connecting means to a pressing means. Fig. 6a is a cross-sectional view in which a pressing means 30 is arranged in contact with a carbon path 31. The pressing means 30 rests on the carbon path 31 and can slide towards the carbon path in the direction of the arrow 36. Fig. 6b shows an alternative embodiment in which a pressing means 32 is connected to a connecting means 33, which comprises a resilient portion 34 that allows motion in the direction of the arrow 35. The embodiments shown in ii
Fig. 6 are merely exemplifications which can be applied in the area between the connecting means and the pressing means in one of the embodiments previously described.
Fig. 7 shows yet another embodiment of how the pressing means 37 can be connected to connecting means. In Fig. 7 both the pressing means 37, 38 are radially connected from the inner periphery 39 to the outer periphery 40.
The above embodiments are only to be understood as examples. It is, of course, conceivable to vary the embodiments described in a number of ways within the scope of the claims.
It is not, for instance, necessary to transfer only- one pattern to the substrate. It is feasible to arrange a layer and a pressing means on each side of the substrate.

Claims

1. A method for transferring at least one pattern in the form of a structure from a pressing means to a deformable layer (4, 21) which is arranged on a planar surface of a substrate (5), ch a r a c t e r i z e d in that it comprises the steps of connecting a power source (26) over the pressing means (1) , arranging the pressing means (1) in contact with the layer (4, 21) , the pattern facing the layer (4, 21) , operating the power source (26) so that a current is passed through the pressing means (1) and heats the pressing means and the layer (4, 21) , and pressing the pressing means (1) against the layer (4, 21) so that the pattern is transferred to the layer (4, 21) .
2. A method as claimed in claim 1, wherein the power source is connected so that the current density in the pressing means (1) is homogeneous.
3. A method as claimed in claim 1 or 2 , which further comprises the step of providing a pressing means (1) which .is formed so that the current density in the.press.- ing -means (1) is homogeneous.
4: A method as claimed in any one of the 'preceding claims, wherein the pressing means (1) has an outer periphery' and a hole which. defines an inner periphery, and
(continued) (continued claim 4) the power source is connected between the inner periphery and the outer periphery.
5. A method as claimed in claim 4, wherein the power source is connected with the aid of two connecting means, which each extend in the radial direction of the pressing means (1) .
6. A method as claimed in any one of claims 1, 2 or 3, wherein the step of connecting the pressing means (1) to a power source comprises the steps of arranging the substrate in a recess in an electrically conducting holder means (15) which has a rectangular outer shape, and connecting the holder means (15) to the power source (26) , the pressing means having electrical contact with the holder means (15) along its entire periphery, and the combination of holder means (15) and pressing means (1) having the same electrical properties as a rectangular plate.
7. A device for transferring at least one pattern in the form of a structure (3) from a pressing means (1) to a deformable layer (4, 21) which is arranged on a planar surface of a plate-shaped substrate (5) , comprising a first holder means (2, 25), and a second holder means (6, 24) for receiving one of the substrate and the pressing means (1) each, the device being arranged to apply a pressure between the first
(continued) (continued claim 7) holder means (2, 25) and the second holder means (6, 24), c h a r a c t e r i z e d in that it further comprises a power source for heating the pressing means, and electrical connecting means for connecting the pressing means to the power source (26) .
8. A device as claimed in claim 7, wherein the pressing means has an inner periphery and an outer periphery, and the power source is connected between the inner periphery and the outer periphery.
9. A method as claimed in claim 8, wherein the thickness of the pressing means decreases with an increasing distance from the inner periphery.
10. A device as claimed in claim 7, wherein the first holder means comprises a rectangular portion (15) with a recess which is formed to receive the pressing means (16) , which portion is connected on two opposed sides to the electrical connecting means (13, 14) and has the same resistivity as the substrate and which portion together with the pressing means forms a unit with the same electrical properties as a rectangular plate without a recess.
11. A device as claimed in any one of claims 7-10, wherein the pressing means is resiliently connected to the power source .
12. A device as claimed in any one of claims 7-10, wherein the pressing means is in moving contact with the
(continued) (continued claim 12) connecting means to enable the pressing means to slide in relation to the connecting means.
EP03736397A 2002-06-20 2003-06-16 Method and device for transferring a pattern Ceased EP1513689A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US38989002P 2002-06-20 2002-06-20
SE0201912A SE524684C2 (en) 2002-06-20 2002-06-20 Pressing unit pattern structure transferring method, involves operating power source to pass current through pressing unit to heat it and layer, and pressing unit against layer to transfer pattern to layer
SE0201912 2002-06-20
US389890P 2002-06-20
PCT/SE2003/001003 WO2004000566A1 (en) 2002-06-20 2003-06-16 Method and device for transferring a pattern

Publications (1)

Publication Number Publication Date
EP1513689A1 true EP1513689A1 (en) 2005-03-16

Family

ID=30002439

Family Applications (1)

Application Number Title Priority Date Filing Date
EP03736397A Ceased EP1513689A1 (en) 2002-06-20 2003-06-16 Method and device for transferring a pattern

Country Status (4)

Country Link
US (1) US20050146083A1 (en)
EP (1) EP1513689A1 (en)
AU (1) AU2003237738A1 (en)
WO (1) WO2004000566A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI243796B (en) * 2004-06-08 2005-11-21 Ind Tech Res Inst Device of nano-structure imprint for pattern transfer and method of the same
US7281920B2 (en) * 2005-03-28 2007-10-16 Komag, Inc. Die set utilizing compliant gasket
ATE549294T1 (en) * 2005-12-09 2012-03-15 Obducat Ab DEVICE AND METHOD FOR TRANSFER OF PATTERN WITH INTERMEDIATE STAMP
US20080047930A1 (en) * 2006-08-23 2008-02-28 Graciela Beatriz Blanchet Method to form a pattern of functional material on a substrate
EP2199855B1 (en) * 2008-12-19 2016-07-20 Obducat Methods and processes for modifying polymer material surface interactions
EP2199854B1 (en) * 2008-12-19 2015-12-16 Obducat AB Hybrid polymer mold for nano-imprinting and method for making the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH664030A5 (en) * 1984-07-06 1988-01-29 Landis & Gyr Ag METHOD FOR GENERATING A MACROSCOPIC SURFACE PATTERN WITH A MICROSCOPIC STRUCTURE, IN PARTICULAR A STRUCTURALLY EFFECTIVE STRUCTURE.
US5772905A (en) * 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
GB9601289D0 (en) * 1996-01-23 1996-03-27 Nimbus Manufacturing Uk Limite Manufacture of optical data storage disc
SE515785C2 (en) * 2000-02-23 2001-10-08 Obducat Ab Apparatus for homogeneous heating of an object and use of the apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2004000566A1 *

Also Published As

Publication number Publication date
US20050146083A1 (en) 2005-07-07
WO2004000566A1 (en) 2003-12-31
AU2003237738A1 (en) 2004-01-06

Similar Documents

Publication Publication Date Title
US20050077285A1 (en) Device for homogeneous heating of an object
JP3892609B2 (en) Hot plate and method for manufacturing semiconductor device
US7834441B2 (en) Multilayer substrate and method of manufacturing the same
US8060001B2 (en) Fusing unit and image forming apparatus including the same
JP2015510274A (en) Thermal interface material
US10884364B2 (en) Image heating apparatus and image forming apparatus having an intermediate member fixed to a terminal and fixed to an electrode at regions shifted from each other
EP1867974B8 (en) Apparatus for providing enhanced self-resistive specimen heating in dynamic material testing systems and an accompanying method for use therein
US20030185605A1 (en) Belt type fixing device
EP1513689A1 (en) Method and device for transferring a pattern
EP1672958A3 (en) Thickfilm heating tube
JP4734304B2 (en) Pad structure for transfer device and method for manufacturing pad for transfer device
JP2002329987A (en) Radiator and manufacturing method therefor
JP4837192B2 (en) Heater and fixing device having the heater
DE60033627D1 (en) THICKNESS HEATING ELEMENT
TW466560B (en) Surface structure and method of making, and electrostatic wafer clamp incorporating surface structure
KR20220027564A (en) Hybrid film heater manufacturing method and hybrid film heater
JP4552486B2 (en) Planar heating element
JP3172112B2 (en) Laminated body manufacturing method and manufacturing apparatus
JP4307237B2 (en) Film heater and manufacturing method thereof
US20060027949A1 (en) Device of microstructure imprint for pattern transfer and method of the same
JPH11121149A (en) Flat heating device
US11937342B2 (en) Spot heater
JP3066145U (en) Heating heater device
TW444524B (en) Method for thermal pressing of circuit board
JPH0796686A (en) Binding device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20041201

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL LT LV MK

DAX Request for extension of the european patent (deleted)
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED

18R Application refused

Effective date: 20071028