EP1512112A4 - Use of overlay diagnostics for enhanced automatic process control - Google Patents
Use of overlay diagnostics for enhanced automatic process controlInfo
- Publication number
- EP1512112A4 EP1512112A4 EP03736896A EP03736896A EP1512112A4 EP 1512112 A4 EP1512112 A4 EP 1512112A4 EP 03736896 A EP03736896 A EP 03736896A EP 03736896 A EP03736896 A EP 03736896A EP 1512112 A4 EP1512112 A4 EP 1512112A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- diagnostics
- overlay
- process control
- automatic process
- enhanced automatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
- G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (11)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US38628502P | 2002-06-05 | 2002-06-05 | |
US386285P | 2002-06-05 | ||
US39584702P | 2002-07-11 | 2002-07-11 | |
US395847P | 2002-07-11 | ||
US45668103P | 2003-03-19 | 2003-03-19 | |
US456681P | 2003-03-19 | ||
US438962 | 2003-05-14 | ||
US438963 | 2003-05-14 | ||
US10/438,962 US6928628B2 (en) | 2002-06-05 | 2003-05-14 | Use of overlay diagnostics for enhanced automatic process control |
US10/438,963 US7111256B2 (en) | 2002-06-05 | 2003-05-14 | Use of overlay diagnostics for enhanced automatic process control |
PCT/US2003/017899 WO2003104929A2 (en) | 2002-06-05 | 2003-06-05 | Use of overlay diagnostics for enhanced automatic process control |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1512112A2 EP1512112A2 (en) | 2005-03-09 |
EP1512112A4 true EP1512112A4 (en) | 2006-11-02 |
Family
ID=29741145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP03736896A Withdrawn EP1512112A4 (en) | 2002-06-05 | 2003-06-05 | Use of overlay diagnostics for enhanced automatic process control |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1512112A4 (en) |
JP (1) | JP4677231B2 (en) |
WO (1) | WO2003104929A2 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060117293A1 (en) * | 2004-11-30 | 2006-06-01 | Nigel Smith | Method for designing an overlay mark |
JP5036429B2 (en) * | 2007-07-09 | 2012-09-26 | キヤノン株式会社 | Position detection apparatus, exposure apparatus, device manufacturing method, and adjustment method |
US7873585B2 (en) * | 2007-08-31 | 2011-01-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for predicting a semiconductor parameter across an area of a wafer |
WO2010145951A2 (en) | 2009-06-17 | 2010-12-23 | Asml Netherlands B.V. | Method of overlay measurement, lithographic apparatus, inspection apparatus, processing apparatus and lithographic processing cell |
JP6008851B2 (en) | 2010-07-19 | 2016-10-19 | エーエスエムエル ネザーランズ ビー.ブイ. | Method and apparatus for determining overlay error |
CN103582819B (en) * | 2011-04-06 | 2016-09-14 | 科磊股份有限公司 | For providing the method and system of the quality metric of improved process control |
JP5959739B2 (en) * | 2012-07-10 | 2016-08-02 | エーエスエムエル ネザーランズ ビー.ブイ. | Lithographic cluster system, measuring apparatus and method for calibrating a positioning device of a lithographic apparatus |
KR102287757B1 (en) * | 2015-05-26 | 2021-08-09 | 삼성전자주식회사 | Methods of Revising an Overlay Correction Data |
US10928737B2 (en) | 2016-03-04 | 2021-02-23 | Asml Netherlands B.V. | Method for characterizing distortions in a lithographic process, lithographic apparatus, lithographic cell and computer program |
WO2018197144A1 (en) * | 2017-04-28 | 2018-11-01 | Asml Netherlands B.V. | Optimizing a sequence of processes for manufacturing of product units |
US11378451B2 (en) | 2017-08-07 | 2022-07-05 | Kla Corporation | Bandgap measurements of patterned film stacks using spectroscopic metrology |
EP3454126A1 (en) * | 2017-09-08 | 2019-03-13 | ASML Netherlands B.V. | Method for estimating overlay |
CN113574643A (en) * | 2019-03-21 | 2021-10-29 | 科磊股份有限公司 | Parametric stabilized misalignment measurement improvement in semiconductor devices |
US11604063B2 (en) | 2021-06-24 | 2023-03-14 | Kla Corporation | Self-calibrated overlay metrology using a skew training sample |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5329334A (en) * | 1993-03-02 | 1994-07-12 | Lsi Logic Corporation | Integrated circuit test reticle and alignment mark optimization method |
US20020001083A1 (en) * | 2000-06-30 | 2002-01-03 | Kouwa Tabei | Apparatus and method for measuring pattern alignment error |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2985587B2 (en) * | 1993-07-06 | 1999-12-06 | 松下電器産業株式会社 | Alignment method and semiconductor device manufacturing apparatus |
JP3248580B2 (en) * | 1999-02-16 | 2002-01-21 | 日本電気株式会社 | Registration accuracy measurement mark and registration accuracy measurement method |
US6612159B1 (en) * | 1999-08-26 | 2003-09-02 | Schlumberger Technologies, Inc. | Overlay registration error measurement made simultaneously for more than two semiconductor wafer layers |
JP2002124458A (en) * | 2000-10-18 | 2002-04-26 | Nikon Corp | Overlap inspection device and method |
US6694498B2 (en) * | 2001-12-13 | 2004-02-17 | Internationl Business Machines Corporation | Feed-forward lithographic overlay offset method and system |
US7804994B2 (en) * | 2002-02-15 | 2010-09-28 | Kla-Tencor Technologies Corporation | Overlay metrology and control method |
US6664121B2 (en) * | 2002-05-20 | 2003-12-16 | Nikon Precision, Inc. | Method and apparatus for position measurement of a pattern formed by a lithographic exposure tool |
-
2003
- 2003-06-05 JP JP2004511937A patent/JP4677231B2/en not_active Expired - Fee Related
- 2003-06-05 WO PCT/US2003/017899 patent/WO2003104929A2/en active Application Filing
- 2003-06-05 EP EP03736896A patent/EP1512112A4/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5329334A (en) * | 1993-03-02 | 1994-07-12 | Lsi Logic Corporation | Integrated circuit test reticle and alignment mark optimization method |
US20020001083A1 (en) * | 2000-06-30 | 2002-01-03 | Kouwa Tabei | Apparatus and method for measuring pattern alignment error |
Non-Patent Citations (1)
Title |
---|
STARIKOV A ET AL: "ACCURACY OF OVERLAY MEASUREMENTS: TOOL AND MARK ASYMMETRY EFFECTS", OPTICAL ENGINEERING, SOC. OF PHOTO-OPTICAL INSTRUMENTATION ENGINEERS. BELLINGHAM, US, vol. 31, no. 6, 1 June 1992 (1992-06-01), pages 1298 - 1309, XP000278264, ISSN: 0091-3286 * |
Also Published As
Publication number | Publication date |
---|---|
WO2003104929A3 (en) | 2004-06-24 |
EP1512112A2 (en) | 2005-03-09 |
JP2005529488A (en) | 2005-09-29 |
JP4677231B2 (en) | 2011-04-27 |
WO2003104929A2 (en) | 2003-12-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20041213 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL LT LV MK |
|
DAX | Request for extension of the european patent (deleted) | ||
RBV | Designated contracting states (corrected) |
Designated state(s): DE GB |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: TULIPMAN, DAVID Inventor name: ADEL, MICHAEL, E. Inventor name: ROBINSON, JOHN Inventor name: SIMKIN, BORIS Inventor name: IZIKSON, PAVEL Inventor name: GHINOVKER, MARK Inventor name: SELIGSON, JOEL, L. |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: TULIPMAN, DAVID Inventor name: ADEL, MICHAEL, E. Inventor name: ROBINSON, JOHN Inventor name: SIMKIN, BORIS Inventor name: IZIKSON, PAVEL Inventor name: GHINOVKER, MARK Inventor name: SELIGSON, JOEL, L. |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20061005 |
|
17Q | First examination report despatched |
Effective date: 20070117 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20160105 |