EP1476520A1 - Procede et dispositif de collage - Google Patents

Procede et dispositif de collage

Info

Publication number
EP1476520A1
EP1476520A1 EP03703565A EP03703565A EP1476520A1 EP 1476520 A1 EP1476520 A1 EP 1476520A1 EP 03703565 A EP03703565 A EP 03703565A EP 03703565 A EP03703565 A EP 03703565A EP 1476520 A1 EP1476520 A1 EP 1476520A1
Authority
EP
European Patent Office
Prior art keywords
panel
glue
acid
edge band
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP03703565A
Other languages
German (de)
English (en)
Inventor
Leif Lesman
Sofie Keiler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo Nobel NV
Original Assignee
Akzo Nobel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akzo Nobel NV filed Critical Akzo Nobel NV
Priority to EP03703565A priority Critical patent/EP1476520A1/fr
Publication of EP1476520A1 publication Critical patent/EP1476520A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C09J161/22—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C09J161/24—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds with urea or thiourea
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27D—WORKING VENEER OR PLYWOOD
    • B27D5/00—Other working of veneer or plywood specially adapted to veneer or plywood
    • B27D5/003—Other working of veneer or plywood specially adapted to veneer or plywood securing a veneer strip to a panel edge
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27G—ACCESSORY MACHINES OR APPARATUS FOR WORKING WOOD OR SIMILAR MATERIALS; TOOLS FOR WORKING WOOD OR SIMILAR MATERIALS; SAFETY DEVICES FOR WOOD WORKING MACHINES OR TOOLS
    • B27G11/00—Applying adhesives or glue to surfaces of wood to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/04—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving separate application of adhesive ingredients to the different surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2461/00—Presence of condensation polymers of aldehydes or ketones

Definitions

  • the present invention relates generally to gluing of objects to form composite structures, and in particular to attaching edge bands to a planar edge of structures or objects such as panels.
  • Edgebanding is a process whereby a strip of material, for the art in question referred to as an "edgeband", is applied to cover the side edge of a flat panel. This can be done to cover exposed laminations, to create a more substantial panel appearance by attaching a thick edge, or to decorate the edge with a more finished or contrasting appearance.
  • the edgebands can be of a variety of materials including wood, polyvinyl chloride (PVC), acrylic, laminates, etc.
  • hot melt adhesive is meant an adhesive that is applied in the molten state and forms a bond upon cooling to a solid state.
  • Such adhesives are characterized in that they can be melted and remelted numerous times. These adhesives are typically based on ethylene vinyl acetate.
  • hot melt adhesives generally do not provide an acceptable bond with non-porous surfaces.
  • materials such as Corian ® solid surface with significant thermal mass tend to extract heat from the hot melt adhesive line and effectively raise the viscosity of the adhesive. This can produce an edgeband seam that is both functionally and aesthetically unsatisfactory.
  • 6,112,794 which improves the prior process by providing heating and employing a reactive adhesive, such as a reactive polyurethane hot melt adhesive.
  • a reactive adhesive such as a reactive polyurethane hot melt adhesive.
  • Use of polyurethane is associated with certain environmental problems. For example can isocyanate, which is a compound that is hazardous to the health, be released in hot environments
  • the quality of the glue joint is not satisfactory, and in particular problems arise with cold creep.
  • the cold creep phenomenon manifests itself in that the glue becomes brittle in cold and softens in hot and humid environments, because the hot melt adhesives used are thermoplastic materials. This phenomenon will be apparent during transport across sea, where the cargo may become exposed to very humid and hot environments; in tropical regions temperatures of up to 70°C can be reached in the cargo space of ships. Edgebands may easily come off the structures to which they are attached if the glue is softened due to such exposure.
  • the process comprises providing a first component, including liquid urea-formaldehyde having a dry matter content of 70 - 85 %; preheating said first component to a temperature of 40-100°C prior to joining said objects; providing a second component including a hardener comprising a mixture of monobasic or polybasic organic and/or inorganic acids, said mixture exhibiting a pH ⁇ 4, and said acids suitably having pK a values in the range -3 - 7; applying said first and second adhesive components separately to said objects; joining said objects to an assembly, to bring said first component and said second component in contact with each other; and applying heat and pressure across said assembly for a time sufficient to cause said adhesive to cure.
  • a first component including liquid urea-formaldehyde having a dry matter content of 70 - 85 %
  • preheating said first component to a temperature of 40-100°C prior to joining said objects
  • a second component including a hardener comprising a mixture of monobasic or polybasic
  • the novelty aspect of the invention is to employ amino resin based glue systems, in contrast to the prior art, wherein normally thermoplastic hot melt adhesives have been used, the glue system being designed so as to allow very short pressing times, around 1 second or even shorter.
  • the decisive factors are i) use of an efficient hardener system, ii) control of the rheological properties during application of the glue, and iii) separate application of glue and hardener.
  • a further factor that enhances performance is preheating of the glue prior to applying it to the substrates (e.g. edgebands and panels), and optionally also preheating of the substrates.
  • the rheology of the composition which is crucial during the manufacturing process, e.g. edge-banding, is controlled by employing a glue with a high content of dry matter, and by tuning the application temperature to the dry matter content in order to arrive at a suitable rheology of the glue during application.
  • the desired dry matter content can be achieved in a preliminary step of mixing, and the mixture can be conveyed to the application station.
  • a liquid glue ingredient is mixed in a controlled manner with a 100% dry (powder) ingredient, to achieve the desired dry matter content, and thus the desired rheology, immediately prior to application.
  • a major advantage of the invention is the superior quality of the glue joint, compared to prior art edgebanding, by virtue of the use of amino resin based adhesive, which is a prepolymer forming a cross-linked material when cured, i.e. a non-thermoplastic resin.
  • the invention provides an apparatus for joining at least two objects by gluing with a multi-component adhesive system to form a composite structure, comprising a conveyor for moving a first object and a second object to be joined, past a gluing station; said gluing station comprising contacting means for bringing said objects in contact with each other; a glue applicator for applying glue to one of objects prior to bringing the objects in contact with each other; heating means for preheating a first glue component prior to bringing the objects in contact with each other; pressure rollers provided after the contacting means.
  • the invention is based on the use of a multi-component adhesive system comprising glue and hardener, where each component is applied either separately to the objects to be joined, or wet in wet on one of the objects, but supplied from separate spreaders.
  • the figure illustrates schematically a machine for applying an edge band 2 to the edge 4 of a fiber/chip board 6, e.g. a shelf element or a table top.
  • the machine comprises a conveyor (not shown) for moving an object 6 (e.g. a fiber board) to be provided with an edgeband 2, past a gluing station.
  • the gluing station comprises a guide roll 10 for guiding an edge band 2 onto the object 6. It also comprises a glue applicator roll 8 (although other types of applicators are possible).
  • heating means 12 for preheating the object 6, and pressure rolls 14 that can be heated to provide the required process pressure and temperature.
  • the fiber board 6 is advanced through the machine at a suitable speed of about 10-40 m/min, preferably 20-30 m/min.
  • a glue applicator 8 of standard type can be used, e.g. suitable applicator rollers or a spreader nozzle, for applying the glue component to the edge 4.
  • the edge band 2 to be attached on the edge 4 of the board 6, is supplied from supply rollers (not shown) that are unwound and the band 2 is directed towards the edge 4 of the board via suitable guiding tools, such as a guide roll 10.
  • the band can be provided with the hardener component either by a separate applicator (not shown) just prior to bringing it into contact with the board edge, or the band can be pretreated with hardener and even supplied from the deliverer in this pretreated condition.
  • An important aspect of the inventive process is pre-heating of the glue before the edge band is brought into contact with the board edge.
  • the board edge itself can be preheated by suitable means 12, such as by subjecting it to a flow of hot air or exposing it to radiant heat energy, at a position just prior to the point where glue is applied to the edge.
  • the edge band provided with hardener, can be preheated at 350°C, e.g. by blowing hot air onto the surface thereof, just prior to contacting it with the board edge.
  • the glue composition can also preferably be preheated before application thereof, and the applicator roll can also be heated, to facilitate the process.
  • a suitable temperature of application for the glue is 50 - 100°C.
  • a heated (e.g. 200°C) roller 10 is used to guide the edge band and press it against the board edge, as illustrated in the figure.
  • a plurality of additional pressure rollers 14 can be provided to supply a necessary pressure for a sufficiently long time to achieve the required quality of the joint (by "sufficiently long time” we mean a pressing time of the order of magnitude of 1 second and shorter).
  • These additional rollers 14 can suitably also be heated at about 200°C, but the temperature could be in the range 100-250°C, preferably 120-180°C.
  • component of the gluing system according to the invention shall be taken to mean that which actually is applied to a surface of objects to be joined by gluing. That is, if two separate constituents or ingredients are mixed just prior to application they are nevertheless regarded as one "component".
  • the adhesive system is applied as a two-component system, i.e. a first component in the form of a liquid glue having a suitable dry matter content is applied to one substrate, and a hardener is applied to another substrate, and the two substrates are joined.
  • a first component in the form of a liquid glue having a suitable dry matter content is applied to one substrate, and a hardener is applied to another substrate, and the two substrates are joined.
  • the liquid glue ingredient is basically an amino resin pre-polymer of e.g. urea and formaldehyde, melamine and formaldehyde or a co-condensate of melamine, urea and formaldehyde, wherein the polymerization process has been terminated, by raising the pH of the reaction mixture, e.g. by the addition of a base. Mixtures of these pre-polymers are also usable and within the inventive concept.
  • This liquid amino resin prepolymer can include straight chain oligomers and also cyclic oligomers.
  • the liquid pre-polymer contains dry matter at about 50 - 85%, preferably 60-70%, i.e. it is an aqueous solution of 60-70% by weight of oligomer, and has a Formaldehyde Urea (F/U) molar ratio of 0,9 - 2,0, preferably 1,3 - 1,7.
  • the rheological properties of the glue is important. Of course these properties depend i.a. on temperature.
  • the viscosity must be suitable for e.g. edgebanding applications, i.e. attaching the edgebands onto the edges of a panel or board, at the temperatures employed in this process. Too low viscosity will tend to cause fauling of the apparatus, and cause uneven application on the vertical surfaces, since the liquid easily flows off the surface. Too high viscosity will make it difficult to control the amount of glue that is to be applied.
  • the viscosity of a typical liquid glue is 400 mPas at 40°C, and 200 mPas at 60°C respectively (by Brookfield LVT, sp3, rpm 30).
  • the viscosity and temperature must be suitable for the mixing process, i.e. the mixing of liquid glue ingredient and powder glue ingredient.
  • the powder ingredient of the glue composition can be a spray dried amino resin prepolymer of e.g. urea and formaldehyde, melamine and formaldehyde or a co-condensate of melamine, urea and formaldehyde, wherein the polymerization process has been terminated (e.g. a spray- dried liquid glue).
  • a spray- dried liquid glue e.g. a spray- dried liquid glue.
  • the F/U molar ratio for the powder ingredient is suitably 1,3 - 2,0.
  • composition of the two-/(multi-) component adhesive system to be employed in accordance with the invention can be varied within certain limits.
  • dry matter content and the molar ratio of formaldehyde to urea are used as measures to control the properties.
  • the powder ingredient has a dry matter content of 100%, and a molar ratio of 1 ,74, and the liquid has a dry matter content of 65% and a molar ratio of 1.575 (it is preferably in the range 1,3 - 1,7)
  • the molar ratios of the mixtures at 60:40 (liquid/powder) and 80:20, respectively, will be in the range 1.62 - 1.74
  • the hardener must meet certain requirements, e.g it must provide an acidic pH in order to properly catalyze the curing/cross-linking reaction.
  • the pH is 0 - 3, preferably ⁇ 0,4.
  • it preferably contains organic or inorganic, monobasic or polybasic carboxylic acids, exhibiting pK a values in the range -3 - 7. It should allow for very rapid hardening/curing, i.e., within 2 seconds, preferably within 1 second, in the applications in question.
  • Suitable organic acids can be selected from formic acid, citric acid, maleic acid, para-toluene sulfonic acid (PTSS), succinic acid, fumaric acid, oxalic acid, adipic acid, malonic acid, glutaric acid, glycolic acid, methane sulfonic acid, 4-phenol sulfonic acid, and mixtures thereof.
  • PTSS para-toluene sulfonic acid
  • Inorganic acids could be sulphamic acid, phosphoric acid, hydrochloric acid, and mixtures thereof.
  • the liquid glue and the powder ingredient are mixed.
  • the liquid glue should be kept at a temperature of at least 40°C. It would be advantageous if a higher temperature can be used. However, at about 70°C of the liquid, the powder ingredient forms aggregates during admixing, which renders the process more difficult. Therefore, a suitable and preferred temperature would be 40 - 60°C.
  • the viscosity of a typical mixture is 60000 mPas at 40°C, and 16000 mPas at 70°C respectively (by Brookfield LVT, sp4, rpm 3). It can be noted that storage of the ingredients at elevated temperatures is not possible over any extended period of time. The powder will aggregate, and the liquid tends to form a gel.
  • the glue must be sufficiently viscous in order not to flow outside the edges of the boards, but also not too viscous because then it will be difficult to apply. At the same time the temperature must be sufficiently high to enable the glue to harden in cooperation with the separately applied hardener.
  • the final dry matter content of the glue mixtures depends on the mixing ratio.
  • a suitable range for the dry matter content for the purpose of the invention is 70-85%, preferably 70-77%.
  • the hardener used in the examples below exhibits a pH ⁇ 3, and suitably contains a mixture of monobasic or polybasic organic and inorganic acids, exhibiting pK a values in the range -3 - 7, preferably 0 - 7, most preferably 1 - 7.
  • pK a values in the range -3 - 7, preferably 0 - 7, most preferably 1 - 7.
  • two acids were used in a mixture, the pK a of said acids being 1.05 (sulphamic acid), 1.83 and 6.07 (maleic acid, di-basic), respectively.
  • the dispersion would improve the flexibility of the system, thereby rendering the joints less brittle. Flexibility of the system can be a great advantage from a machine utilization point of view, since the edge bands in production are cut off to correct size only a few seconds after having been attached to the edge of the board. If the glue joint is too brittle during cutting there is a risk that the edge band comes off.
  • Water based dispersion can be admixed instead of powder dispersions. This will in principle correspond to liquid glue and powder glue (powder glue must be mixed with water in order to be usable).
  • Dispersion are binders (glue) in themselves, i.e. they are used alone in certain gluing applications, and so, apart from reacting into and with the UF system, it can have its own effect.
  • the dispersions are often relatively fast, i.e. harden quickly, which for the purpose of the present invention is an advantage. Dispersions will often yield a softer glue joint compared to UF glue which is a hard and frequently brittle binder, and therefore a UF system with these dispersions admixed would yield a more flexible or accommodating glue joint.
  • Commonly dispersions are tacky and exhibits good initial "bite", which is an advantage for edge-banding.
  • the admixture of the dispersion to the UF composition preferably is done at the same time and in the same way as the admixture of the powder glue to the liquid glue is done, therefore no substantial change in equipment is required.
  • Some kind of mixer is required for mixing together the desired glue mixture before it is filled into the edge banding machine.
  • the polymer in the dispersion usable in the invention is suitably a homopolymer or copolymer prepared from one or more ethylenically unsaturated monomers.
  • suitable ethylenically unsaturated monomers are vinylic monomers, such as vinyl esters, e. g., vinyl acetate, vinyl propionate, vinyl butyrate and comonomers thereof with, e.
  • alkyl esters of acrylic and methacrylic acid such as methyl acrylate, methyl methacrylate, ethyl acrylate, n-butyl acrylate, etc.
  • butadiene-styrene and derivates thereof such as carboxylated butadiene-styrene
  • substituted or unsubstituted mono-and dialkyl esters of alpha, beta-unsaturated dicarboxylic acids such as the substituted and unsubstituted mono-and dibutyl, mono-and diethyl maleate esters as well as the corresponding fumarates, itaconates and citronates
  • alpha beta-unsaturated carboxylic acids such as crotonic, acrylic and methacrylic acids and mixtures thereof.
  • Polymers based on vinyl acetate are preferred.
  • the polymer is prepared from at least 50 weight % vinyl acetate, based on the total weight of the monomers.
  • the dispersion polymer may comprise post-crosslinking groups.
  • the post-crosslinking groups can be incorporated into the polymer by copolymerising one or more ethylenically unsaturated monomers with at least one monomer comprising at least one post-crosslinking group.
  • Suitable post-crosslinking groups include N-alkylol, N-alk ⁇ xymethyl, carboxylate and glycidyl groups.
  • post-crosslinking monomer a monomer having a first reactive functional group that renders the monomer copolymerisable with ethylenically unsaturated comonomer (s) and a second functional group that does not enter into the copolymerisation reaction during formation of the polymer, but provides a reactive site on the copolymer that may subsequently be reacted under, for example, acidic conditions, with another reactive site on the copolymer and/or the amino resin to crosslink the copolymer and/or the amino resin.
  • first reactive functional group that renders the monomer copolymerisable with ethylenically unsaturated comonomer (s) and a second functional group that does not enter into the copolymerisation reaction during formation of the polymer, but provides a reactive site on the copolymer that may subsequently be reacted under, for example, acidic conditions, with another reactive site on the copolymer and/or the amino resin to crosslink the copolymer and/or the amino
  • Suitable post-crosslinking monomers include, N-alkylol acrylamides, e. g., Nmethylol acrylamide, N-ethanol acrylamide, N-propanol acrylamide, N-methylol methacrylamide, N- ethanol methacrylamide, N-propanol methacrylamide, N-methylol maleamide, N-methylol maleamic acid, N-methylol maleamic acid esters; the N-alkylol amides of the vinyl aromatic acids, such as N-methylol-p-vinylbenzamide and the like ; also N- (alkoxymethyl) acrylates and methacrylates, where the alkyl group has from 1-8 carbon atoms, such as N- (methoxymethyl) acrylamide, N- (butoxymethyl) acrylamide, N (methoxymethyl) methacrylamide, N- (butoxymethyl) allyl carbamate and N (methoxymethyl) allyl carbamate, and mixtures of
  • polymers containing post-crosslinking groups and polymers without post- crosslinking groups may also be used according to the invention.
  • the polymer may comprise both polyvinyl acetate without post-crosslinking groups and vinyl acetate based polymer containing post-crosslinking groups.
  • the invention is of course not restricted to a process of mixing two ingredients, but applies equally well to the use of glue already exhibiting a correct dry matter content.
  • Edgebands were cut to suitable dimensions and the area of each sample band was calculated.
  • Hardener No. 2547, obtainable from Casco Products, Sweden
  • the amount of hardener was determined by weighing. Using the area and the weight, the spread (g/m ) of hardener was determined. The hardener was allowed to dry for at least 30 minutes before the experiment.
  • the area of edges of chip boards to which the bands were to be attached was calculated to be 2,4 x 10 "3 m 2 .
  • the chip board samples were then kept at 70°C to attain the same temperature as the glue mixture.
  • a hot press (Carver) was used, and a pressing temperature of 120°C was used, although pressing can be carried out in the range 15°C to 130°C.
  • Glue was applied manually to the chip board edges, and the edge band with hardener applied to it was placed on the edge of the board.
  • the assembly was placed in the press, and the pressing was performed as quickly as possible, about 1 second, with a pressure of about 0,8 MPa. Possible pressing times range from 0.5 seconds up to 30 minutes.
  • Thickness 0,6 mm
  • a sheet of board (Dufalite ® ) was attached to a wooden frame by a pressing operation in a standard type press machine. Glue application was done manually. The amount of glue used was 130 g/m 2 , which is 10 g less than commonly used. The glue was a mixture of Cascorit 1206 and Cascorit 1352 in a ratio 70:30 (w/w).
  • Tests 1-3 were evaluated just after pressing. Because it takes some time to spread the hot glue, it cools off before the pressing can be performed, and the results would probably be further improved if application time is further reduced, i.e. by machine application of the glue.
  • the glue was a mixture of Cascorit 1206 and Cascorit 1352 in a ratio 70:30 (w/w).

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  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un procédé destiné à joindre au moins deux objets (2, 4) par collage au moyen d'un système adhésif à deux composants en vue de former une structure composite. Ce procédé consiste à utiliser un premier composant adhésif comprenant de l'urée-formaldhéhyde liquide en combinaison avec de l'urée en poudre, ce qui rend ce premier composant suffisamment visqueux. Il consiste ensuite à utiliser un second composant adhésif comprenant un agent durcissant, à préchauffer l'un au moins des objets (4) avant la jonction desdits objets, puis à appliquer lesdits premier et second composants adhésifs séparément sur ces objets. Ledit procédé consiste enfin à appliquer une chaleur et une pression (14) données pendant une durée suffisante pour amener ledit adhésif à durcir.
EP03703565A 2002-01-25 2003-01-27 Procede et dispositif de collage Withdrawn EP1476520A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP03703565A EP1476520A1 (fr) 2002-01-25 2003-01-27 Procede et dispositif de collage

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP02445010 2002-01-25
EP02445010 2002-01-25
EP03703565A EP1476520A1 (fr) 2002-01-25 2003-01-27 Procede et dispositif de collage
PCT/SE2003/000133 WO2003062340A1 (fr) 2002-01-25 2003-01-27 Procede et dispositif de collage

Publications (1)

Publication Number Publication Date
EP1476520A1 true EP1476520A1 (fr) 2004-11-17

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Family Applications (1)

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EP03703565A Withdrawn EP1476520A1 (fr) 2002-01-25 2003-01-27 Procede et dispositif de collage

Country Status (2)

Country Link
EP (1) EP1476520A1 (fr)
WO (1) WO2003062340A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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BRPI0811822A2 (pt) 2007-07-05 2014-11-04 Akzo Nobel Nv "composição endurecedora para ser utilizada em um sistema adesivo à base de amino resina, sistema adesivo, método para colar materiais de madeira, uso de uma composição endurecedora, uso de um sistema adesivo e produto colado"
JP5821132B2 (ja) 2008-12-24 2015-11-24 ディーエスエム アイピー アセッツ ビー．ブイ． キシロース異性化酵素遺伝子及びペントース糖の発酵におけるそれらの使用
DE202009006793U1 (de) * 2009-05-12 2010-09-23 Homag Holzbearbeitungssysteme Ag Vorrichtung zum Beschichten von Werkstücken
CN102174549B (zh) 2011-02-22 2012-10-10 山东大学 一种编码木糖异构酶的核酸分子及其编码的木糖异构酶
GB201105583D0 (en) * 2011-04-01 2011-05-18 Dynea Oy System for form pressing with high production efficiency
US10604773B2 (en) 2012-10-16 2020-03-31 Dsm Ip Assets B.V. Cells with improved pentose conversion
WO2014060377A1 (fr) 2012-10-16 2014-04-24 Dsm Ip Assets B.V. Cellules à conversion de pentose améliorée
WO2014142647A1 (fr) 2013-03-14 2014-09-18 Wageningen Universiteit Souches fongiques ayant une production améliorée d'acide citrique et d'acide itaconique
EP3034256B1 (fr) * 2014-12-15 2018-04-18 Konrad Scholz Patin a rouleaux
CN107987763B (zh) * 2017-11-30 2021-01-26 中南林业科技大学 一种低甲醛释放脲醛树脂胶黏剂及其制备方法
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DE102019113794A1 (de) * 2019-05-23 2020-11-26 Homag Gmbh Vorrichtung und Verfahren zum Beschichten von Werkstücken
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