EP1409772B2 - Procede pour la galvanisation selective d'un materiau support metallique en forme de bande - Google Patents
Procede pour la galvanisation selective d'un materiau support metallique en forme de bande Download PDFInfo
- Publication number
- EP1409772B2 EP1409772B2 EP02754718A EP02754718A EP1409772B2 EP 1409772 B2 EP1409772 B2 EP 1409772B2 EP 02754718 A EP02754718 A EP 02754718A EP 02754718 A EP02754718 A EP 02754718A EP 1409772 B2 EP1409772 B2 EP 1409772B2
- Authority
- EP
- European Patent Office
- Prior art keywords
- paint
- strip
- base material
- strips
- electroplating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 title claims abstract description 24
- 238000009713 electroplating Methods 0.000 title claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 5
- 239000002184 metal Substances 0.000 title claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 230000008569 process Effects 0.000 claims abstract description 8
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000003973 paint Substances 0.000 claims description 77
- 230000008021 deposition Effects 0.000 claims description 9
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims description 2
- 239000003792 electrolyte Substances 0.000 claims description 2
- 238000010422 painting Methods 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 22
- 239000008199 coating composition Substances 0.000 abstract 1
- 239000004922 lacquer Substances 0.000 description 30
- 239000012876 carrier material Substances 0.000 description 25
- 239000010410 layer Substances 0.000 description 19
- 238000005246 galvanizing Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 230000002378 acidificating effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000013532 laser treatment Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000035508 accumulation Effects 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000003562 lightweight material Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
- Y10S205/917—Treatment of workpiece between coating steps
Definitions
- the invention relates to a method for the selective galvanization of a strip-like, metallic carrier material in a continuous pass, in particular for the galvanization of a carrier strip with pre-punched contact elements.
- the support material is first completely coated with lacquer by either sprayed with lacquer or dipped in lacquer. Then, by means of a laser, those areas are freed from the paint on which contact material is to be galvanized.
- An object of the present invention is to develop the known method so that a faster passage of the strip-like carrier material is achieved by the galvanization with significantly lower paint requirement.
- the inventive method has the advantage that in the electrophoretic lacquer coating even at much lower paint thicknesses, a closed lacquer layer can be achieved, which has a very constant paint thickness. As a result, damage to the substrate can be effectively prevented when removing the paint layer by laser treatment. In addition, the very thin paint layer can be removed faster and with less power, which allows a higher throughput speed of the substrate. The deposition of the electrophoretic paint on the substrate is very fast, which in turn allows higher throughput speeds of the substrate. These advantages are further enhanced by the fact that only a selective lacquer layer is applied, for example a lacquer strip or several lacquer strips. These paint strips are applied only in the areas in which a galvanizing layer is applied. In addition to the saving of expensive paint material thus faster removal of the paint at the end of the treatment is possible.
- the electrophoretic lacquer coating leads to uniform thin lacquer layers even with three-dimensional support materials, so that a selective electroplating is possible in these. Since the paint removal by laser action is virtually arbitrarily controllable, punctiform galvanizations can be achieved in addition to strip-like electroplating.
- the strip-like carrier material expires before the coating expediently a cleaning and / or activation and / or rinsing process to create optimal initial conditions.
- paint strips can be applied in the same or different width on the same side or on both sides of the belt-like carrier material.
- the width of these strips is precisely adjustable by the electrophoretic lacquer coating process, so that by optimizing the strip width, a minimization of the required lacquer material can be achieved.
- the lacquer layer thickness can be adjusted as a function of the applied voltage, the lacquer composition and the speed of the support material, in particular cataphoretic or anaphoretic lacquer deposition. By thus precisely adjustable coating thickness can be completely removed at the required locations by appropriate adjustment of the laser beam, this paint layer, while still avoiding damage to the substrate is avoided.
- a housing of the paint coating device expediently compared to the carrier material by a slot-like dimming, depending on the slot width and the distance between dimming and substrate, the paint strip width can be adjusted.
- dimming with multiple slots can accordingly several paint strips are formed.
- the support material is expediently rinsed and dried, in particular in an oven or by UV light. Furthermore, the carrier material is expediently rinsed after laser removal.
- the laser-stripped areas can now be electroplated by one or more of the following selective plating methods: selective dipping in a plating bath, covering the areas outside of the at least one paint strip by means of mechanical mask masks, in particular belt tools, applying the electrolyte agent by means of wheel technology, spotter or brush technique.
- Fig. 1 illustrated galvanizing plant for selective galvanization of a carrier strip is designed as a so-called reel-to-reel system, wherein the metallic carrier strip 10 unwound continuously from a first roll or spool 11, passed through the system and behind again on a second roll or coil 12 as Finished tape is wound up.
- Belt speeds of 20 m / min or even higher speeds are possible.
- the substrate tape 10 passes through a preparation station 13, where it is cleaned, activated and rinsed.
- the substrate strip 10 is passed through a Belakkungsstation 14, where a selective electrophoretic coating takes place.
- the lacquering station 14 may have one or more lacquer cells 15, as shown in FIG Fig. 2 are shown schematically.
- Such a Belackungszelle consists in principle of an example encapsulated housing which is shielded so that an uncontrolled paint deposition is avoided at undesirable areas.
- shields 17, 18, which, like the other housing areas, consist for example of Teflon or another non-conductive plastic, are arranged such that they cover the regions of the carrier material strip 10 which are not to be coated with respect to a flat anode 19.
- the anode 19 is made of stainless steel, but may also be platinum plated from titanium.
- the illustrated coating cell 15 is designed for anaphoretic paint deposition, for which purpose an anaphoretic paint is used.
- a lacquer layer is resistant to acidic media, such as a nickel, gold or tin bath, and can be removed in an alkaline medium.
- the anode 19 is connected to the positive pole of a galvanizing voltage, while a contacting unit 21 is arranged in front of the cell by supplying current to the carrier material band 10.
- a cataphoretic lacquer deposition with cataphoretic lacquer is possible.
- the cataphoretic lacquer is resistant to alkaline media and can be removed in an acidic environment.
- the polarity is reversed, that is, instead of the anode 19, a cathode occurs.
- the varnish cell 15 is designed so that the paint strip formed or the varnish-coated areas are no longer damaged after the coating process. This is achieved for example by guide rollers, not shown, which are mounted in front of and behind the coating cell 15 and which position the carrier material in both vertical and horizontal directions exactly so that the area coated with the paint strip 22 is not in contact with areas of the housing 16 arrives.
- the distance between the substrate tape 10 and the dimming 17, 18 is chosen so that on the one hand a sufficient dimming effect is present, but that no points of contact arise.
- the paint located in a storage tank, not shown, is supplied via nozzles of the coating cell 15.
- a pump located in the storage tank is connected via a pipe to the paint cell, wherein the amount of the supplied paint can be set or controlled via a likewise not shown intermediate throttle valve.
- a filter arrangement may also be provided.
- the Paint Conveyor Pump is designed to prevent electrical charges by using light-weight materials on all moving parts surrounded by paint, otherwise the paint will come into contact with moving parts that can become electrically charged and into contact with the paint come, can take place.
- FIGS. 3 to 10 various carrier material bands are shown as examples, which are provided with differently arranged paint strips.
- carrier strip three paint strips 24 - 26 of different width on the front and back are applied. This can be carried out either with successively arranged coating cells 15 or with coating cells which has a plurality of slits 20 and dips and anodes or cathodes arranged on both sides of the carrier material band 23.
- carrier strip 27 is pre-punched so that already individual contacts are formed, which can be canceled or cut off after completion.
- substrate strip 30 is also pre-punched to form individual contacts, said contacts on one side of a holding strip 31, which holds them together, semi-circular formations 32, so that the carrier material strip 30 is formed three-dimensionally.
- a paint strip 33 is applied to the outside of the formations 32.
- carrier material strip 34 is also formed three-dimensional, wherein retaining strips 35 connect the individual contact elements 36 at their ends.
- These contact elements 36 are box-shaped in the central region, wherein a paint strip 37 extends over the central region of the box-like formations.
- the selective paint strip (or more) is applied over the entire spatial depth in 3D carrier material bands, as in the Fig. 7 to 10 is recognizable.
- the substrate tape 10 according to Fig. 1 passed through a drying station 38.
- the drying and thus a partial polymerization is carried out in an oven of the drying station 38, in which a uniform temperature distribution is present.
- the paint strips can also be dried with UV light and partially polymerized.
- the substrate tape 10 is passed through a selective de-paint laser station 39.
- a selective de-paint laser station 39 By means of the laser beam of a laser 40 those lacquer areas are removed from the paint strip or stripes, which are to be galvanized later.
- both a strip-like Entlakkung and the Entlackung on singular surfaces is possible, for example, by the laser oscillating processed these surfaces.
- a plurality of strip-shaped paint erosions can be made by means of the laser within a paint strip.
- the tolerances of Lackabtrags and the subsequent electroplating are low and amount to about 50 ⁇ m.
- the substrate is not damaged by the laser beam and paint removal is complete. This is ensured by the exact setting of the laser energy, wavelength, strength and duration of the pulses.
- FIGS. 11 and 12 It is shown that a strip-shaped region 42 in the laser station 39 has been stripped of the paint strip 22 applied to the substrate tape 10.
- the substrate strip 10 is then passed through a galvanizing station 43, in which galvanization of the area 42 stripped by the laser takes place.
- a galvanizing station 43 in which galvanization of the area 42 stripped by the laser takes place.
- This is achieved by a selective electroplating process known per se.
- Fig. 12 In this case, the regions of the carrier material strip 10 outside the paint strip 20 are covered by means of two continuously circulating belts 44.
- the speed of the belt 44 is adapted to the passage speed of the carrier material strip 10, so that the belt 44 run along accordingly.
- the released area between the two belts 44 is then wetted by means of a cloth, a brush or the like with galvanizing solution and thereby galvanized. This can be done in several stages depending on the desired layer thickness.
- the selective galvanization can also take place by selective immersion in a plating bath.
- other mechanical Abdeckmasken can be used, which may be mentioned as further known methods for selective galvanization, the mocking technique and brushing.
- the substrate tape 10 is completely stripped in a Entlackungsstation 45 by being passed through a corresponding aqueous solution.
- the aqueous solution is acidic or alkaline.
- the carrier strip 10 which is usually made of brass, copper or a copper alloy.
- Different plating layers can also be superimposed, for which purpose the necessary steps take place one after the other.
- the substrate tape 10 may also already have a plating layer applied in a classical manner, for example selective galvanization without paint coverage.
- the method according to the invention can be carried out, as described, with carrier material tapes which, in accordance with FIGS Fig. 5 to 10 already pre-punched contacts or other elements or which are still full-surface, for example according to the Fig. 3, 4 . 11 and 12 , In the latter case, stamping operations can still be carried out after the galvanization, but this requires a larger amount of lacquer and galvanization metals.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Claims (9)
- Procédé pour la galvanisation sélective d'un matériau de support métallique en forme de bande, en passage continu, plus particulièrement d'une bande de matériau de support avec des éléments de contact préestampés, dans lequela) le matériau de support (10, 23, 27, 30, 34) est recouvert dans un dispositif de revêtement de laque électrophorétique (14, 15) par une laque électrophorétique sélective avec au moins une bande de laque (22, 24 - 26, 28, 29, 33, 37),b) la laque d'au moins une bande de laque (22, 24 - 26, 28, 29, 33, 37) est enlevée au moyen d'un laser au niveau des points (42) qui doivent être galvanisés,c) des électrodes (19) sont masquées dans un logement (16) du dispositif de revêtement de laque (14, 15) par rapport au matériau de support (10) par un écran en forme de fente (17, 18), la largeur de la bande de laque étant définie en fonction de la largeur de la fente (20) et de la distance entre l'écran (17, 18) et le matériau de support (10),d) dans un processus de galvanisation, une couche métallique est disposée sur les points sur lesquels la laque a été enlevée (42) dans au moins une bande de laque (22, 24 - 26, 28, 29, 33, 37) au moyen d'une galvanisation sélective, ete) la bande de laque (22, 24 - 26, 28, 29, 33, 37), au nombre d'une au moins, est ensuite enlevée.
- Procédé selon la revendication 1, caractérisé en ce que le matériau de support en forme de bande (10, 23, 27, 30, 34) subit, avant le laquage, une opération de nettoyage et/ou d'activation et/ou de rinçage.
- Procédé selon la revendication 1 ou 2, caractérisé en ce que plusieurs bandes de laque (24 - 26, 28, 29) sont disposées dans une même largeur ou dans des largeurs différentes du même côté ou sur les deux côtés du matériau de support en forme de bande (23, 27).
- Procédé selon l'une des revendications précédentes, caractérisé en ce que l'épaisseur de la couche de laque est définie en fonction de la tension appliquée, de la composition de la laque et de la vitesse du matériau de support, une séparation de la laque cataphorétique ou anaphorétique étant plus particulièrement effectuée.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que le matériau de support (10, 23, 27, 30, 34) est rincé et séché après le laquage, plus particulièrement dans un four (28) ou par une lampe à rayons ultraviolets.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que des bandes et/ou des points de galvanisation (42) singuliers sont formés par l'enlèvement de la laque au laser.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que le matériau de support (10, 23, 27, 30, 34) est rincé après l'enlèvement de la laque au laser.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que les points (42) sur lesquels la laque a été enlevée au laser (40) sont galvanisés par un ou plusieurs des procédés de galvanisation sélectifs suivants : immersion sélective dans un bain de galvanisation, revêtement des zones en dehors d'au moins une bande de laque au moyen de masques mécaniques (44), plus particulièrement d'outils à courroie, diffusion de l'électrolyte au moyen d'une technique utilisant une roue, d'une technique de pulvérisation ou d'une technique de balayage.
- Procédé selon l'une des revendications précédentes, caractérisé en ce que la bande de laque (22, 24 - 26, 28, 29, 33, 37) au nombre d'une au moins est entièrement éliminée, après la galvanisation, dans une solution aqueuse alcaline ou acide.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10135349 | 2001-07-20 | ||
DE10135349A DE10135349A1 (de) | 2001-07-20 | 2001-07-20 | Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials |
PCT/EP2002/006824 WO2003012175A2 (fr) | 2001-07-20 | 2002-06-20 | Procede pour la galvanisation selective d'un materiau support metallique en forme de bande |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1409772A2 EP1409772A2 (fr) | 2004-04-21 |
EP1409772B1 EP1409772B1 (fr) | 2005-03-16 |
EP1409772B2 true EP1409772B2 (fr) | 2008-08-13 |
Family
ID=7692468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02754718A Expired - Lifetime EP1409772B2 (fr) | 2001-07-20 | 2002-06-20 | Procede pour la galvanisation selective d'un materiau support metallique en forme de bande |
Country Status (8)
Country | Link |
---|---|
US (1) | US6972082B2 (fr) |
EP (1) | EP1409772B2 (fr) |
JP (1) | JP2004536971A (fr) |
CN (1) | CN1250777C (fr) |
AT (1) | ATE291110T1 (fr) |
DE (2) | DE10135349A1 (fr) |
HK (1) | HK1069607A1 (fr) |
WO (1) | WO2003012175A2 (fr) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4660231B2 (ja) * | 2005-03-10 | 2011-03-30 | 株式会社シミズ | 表面処理方法およびそれを用いる電子部品の製造方法 |
US20130334055A1 (en) * | 2010-12-23 | 2013-12-19 | Fci | Plating Method and Apparatus, and Strip Obtained by this Method |
CN102888632B (zh) * | 2012-09-14 | 2014-12-03 | 艾蒂盟斯(苏州)压铸电子技术有限公司 | 一种选择性电镀的防护工装和方法 |
CN103173839B (zh) * | 2013-03-22 | 2015-11-18 | 湖南永盛新材料股份有限公司 | 一种金属带材单面连续电泳沉积的方法及装置 |
CN105239118B (zh) * | 2014-06-17 | 2017-10-31 | 于长弘 | 电镀治具 |
CN107059078B (zh) * | 2017-04-21 | 2020-02-18 | 东莞领益精密制造科技有限公司 | 一种金属零件局部精密镀锡加工工艺 |
JP7221003B2 (ja) * | 2017-08-31 | 2023-02-13 | Dowaメタルテック株式会社 | 部分めっき方法 |
CN110923783B (zh) * | 2019-11-20 | 2021-05-25 | 娄底市安地亚斯电子陶瓷有限公司 | 一种轮毂型电镀超薄金刚石切割片的制作方法 |
CN112934582B (zh) * | 2021-02-08 | 2022-04-26 | 浙江东尼电子股份有限公司 | 一种毛毡涂漆装置及漆包线 |
CN113089063A (zh) * | 2021-04-14 | 2021-07-09 | 王曼曼 | 连续电镀装置及连续电镀方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0106977A2 (fr) † | 1982-09-30 | 1984-05-02 | International Business Machines Corporation | Procédé et dispositif pour le traitement électrochimique d'un substrat |
DD246575A1 (de) † | 1986-03-14 | 1987-06-10 | Seghers A Mikroelektronik Veb | Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern |
EP0337658A1 (fr) † | 1988-04-12 | 1989-10-18 | The Whitaker Corporation | Plaquage sélectif par ablation au laser |
DE69403926T2 (de) † | 1993-01-28 | 1998-01-02 | Meco Equip Eng | Verfahren und Vorrichtung zur selektiven Elektroplattierung von gelochtem Metall oder metallisierten Gegenständen |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5035918A (en) * | 1989-04-26 | 1991-07-30 | Amp Incorporated | Non-flammable and strippable plating resist and method of using same |
US6143145A (en) * | 1997-10-02 | 2000-11-07 | Precious Plate Inc. | Apparatus for continuous masking for selective electroplating and method |
SG76591A1 (en) * | 1999-02-27 | 2000-11-21 | Aem Tech Engineers Pte Ltd | Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method |
DE19934584A1 (de) * | 1999-07-23 | 2001-01-25 | Inovan Stroebe | Verfahren zum Herstellen von Kontakten |
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2001
- 2001-07-20 DE DE10135349A patent/DE10135349A1/de not_active Withdrawn
-
2002
- 2002-06-20 AT AT02754718T patent/ATE291110T1/de active
- 2002-06-20 US US10/484,205 patent/US6972082B2/en not_active Expired - Fee Related
- 2002-06-20 JP JP2003517344A patent/JP2004536971A/ja active Pending
- 2002-06-20 WO PCT/EP2002/006824 patent/WO2003012175A2/fr active IP Right Grant
- 2002-06-20 EP EP02754718A patent/EP1409772B2/fr not_active Expired - Lifetime
- 2002-06-20 CN CNB02814614XA patent/CN1250777C/zh not_active Expired - Fee Related
- 2002-06-20 DE DE50202493T patent/DE50202493D1/de not_active Expired - Lifetime
-
2005
- 2005-03-10 HK HK05102087A patent/HK1069607A1/xx not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0106977A2 (fr) † | 1982-09-30 | 1984-05-02 | International Business Machines Corporation | Procédé et dispositif pour le traitement électrochimique d'un substrat |
DD246575A1 (de) † | 1986-03-14 | 1987-06-10 | Seghers A Mikroelektronik Veb | Verfahren zum kontinuierlichen partiellen beschichten von metallbaendern |
EP0337658A1 (fr) † | 1988-04-12 | 1989-10-18 | The Whitaker Corporation | Plaquage sélectif par ablation au laser |
DE68910864T2 (de) † | 1988-04-12 | 1994-06-01 | Whitaker Corp | Selektive Plattierung durch Abtragen mittels eines Lasers. |
DE69403926T2 (de) † | 1993-01-28 | 1998-01-02 | Meco Equip Eng | Verfahren und Vorrichtung zur selektiven Elektroplattierung von gelochtem Metall oder metallisierten Gegenständen |
Also Published As
Publication number | Publication date |
---|---|
EP1409772B1 (fr) | 2005-03-16 |
DE50202493D1 (de) | 2005-04-21 |
US6972082B2 (en) | 2005-12-06 |
HK1069607A1 (en) | 2005-05-27 |
JP2004536971A (ja) | 2004-12-09 |
US20040206629A1 (en) | 2004-10-21 |
WO2003012175A3 (fr) | 2003-10-30 |
EP1409772A2 (fr) | 2004-04-21 |
CN1250777C (zh) | 2006-04-12 |
DE10135349A1 (de) | 2003-02-06 |
ATE291110T1 (de) | 2005-04-15 |
WO2003012175A2 (fr) | 2003-02-13 |
CN1533449A (zh) | 2004-09-29 |
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