EP1396023A1 - A method of producing a lamp - Google Patents
A method of producing a lampInfo
- Publication number
- EP1396023A1 EP1396023A1 EP02729655A EP02729655A EP1396023A1 EP 1396023 A1 EP1396023 A1 EP 1396023A1 EP 02729655 A EP02729655 A EP 02729655A EP 02729655 A EP02729655 A EP 02729655A EP 1396023 A1 EP1396023 A1 EP 1396023A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- conductors
- junctions
- lamp
- recesses
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000004020 conductor Substances 0.000 claims abstract description 77
- 230000003287 optical effect Effects 0.000 claims abstract description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 8
- 230000009471 action Effects 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 2
- 238000005286 illumination Methods 0.000 description 10
- 238000010276 construction Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- ORWQBKPSGDRPPA-UHFFFAOYSA-N 3-[2-[ethyl(methyl)amino]ethyl]-1h-indol-4-ol Chemical compound C1=CC(O)=C2C(CCN(C)CC)=CNC2=C1 ORWQBKPSGDRPPA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Definitions
- the method further includes locating the junctions in respective recesses formed in the support structure, the recesses functioning as an optical guide for controlling a direction of light output from the associated junction.
- the lead frame is supported on a carrier and the method includes moving the carrier so as to present each recess to a mounting station whereat the junctions are mounted to the conductors.
- the carrier is preferably rotatable about first and second orthogonal axes to align the respective recess with the mounting station and the junctions are mounted in the respective recesses by advancing the junctions and associated conductors relative to each other along a third axis, which is preferably orthogonal to the first and second axes.
- Figure 9 is a plan view of a third lamp
- Figure 10 is a circuit diagram for the lamp of Figure 9;
- Figure 11 is a front view of the lamp of Figure 9;
- Figure 12 is a side view of the lamp of Figure 9;
- Figure 13 is a side view of a lens for fitting on the lamp of Figure 9;
- Figure 16 is a representation of the illumination pattern produced by the lamp of Figures 9 to 12;
- Figure 17 is a schematic flow chart illustrating steps for producing a lamp
- Figure 18 is a diagrammatic perspective view of a lead frame arranged for a recess forming operation
- Figure 19 is a perspective view of the lead frame on a carrier
- Figure 20 is a cross-sectional view of the lead frame
- Figure 21a is a plan view of the lead frame with junctions and intermediate conductors attached;
- Figure 21b) is a cross-sectional view of the lead frame, taken along the line A- A, shown in
- Figure 22 is a plan view of another lead frame with junctions attached
- Figure 23 is a plan view of an alternative lead frame construction
- Figure 24 is a perspective view of a lamp, formed from the lead frame of Figure 23; and Figure 25 is a perspective view of another lamp.
- the lamp 1, as shown in Figure 1, includes a globe portion 2 with a cylindrical base 3 and a parabolic end 4, configured to enhance illumination output in an axial direction of the lamp.
- the lamp also includes first and second terminals, which are preferably in the form of conductors 5,6 which are embedded within the globe portion 2.
- the terminal 5 has a support platform 7 to which is mounted an integrated circuit wafer 8.
- the wafer includes two junctions which are arranged substantially adjacent to each other so that a common layer of fluorescent material, such as a phosphor layer, may be applied over both junctions.
- Intermediate conductors 9 to 12 electrically couple the junctions to the respective terminals 5,6 so that the LED junctions 14,15 are arranged in reverse polarity, as indicated in the circuit diagram Figure 3.
- a resistive element 16 is provided between a further conductor 13 (connecting the intermediate conductors 11 and 12) and the terminal 5.
- the conductors 5,6, intermediate conductors 9 to 13, and wafer 8 are all embedded within the globe portion 2 so that the lamp is presented as a robust unitary structure.
- the reverse polarity of the junctions allows the lamp to be connected to a power source without concern for polarity, as compared to the case with a conventional LED arrangement.
- the use of a single phosphor layer, common to each of the junctions, also simplifies manufacture and provides an aesthetic advantage in that the light from either junction is perceived to originate from a single source.
- the following specifications may apply:
- TYPICAL LIGHT OUTPUT > 500mCd @ 20mA
- any of the component parts of the lamp may vary, as required and the number of LED junctions may also be increased to suit illumination needs.
- All of the conductors 23, 24,26,27 are preferably formed in a two dimensional lead frame structure 40 shown in Figure 6, to allow ease of manufacture and reliability in directly positioning the junctions 29,30,31 before application of the phosphor layer 35 within and before application of the globe portion 25.
- the junctions 29,30,31 are arranged in a generally linear array, with the conductors 23,27 projecting above the conductor 26 so that the overall illumination generated by the junctions will be somewhat enhanced on- axis, as represented in Figure 8 by curve A.
- the radius 'R' of the imaginary spherical surface is the distance from the intersection of those centre lines to the LED junction within the recess.
- the angle between the sides of a recess determines the value of the 'r'.
- stage 100 is the formation of a suitable lead frame
- stage 101 is the attachment of junctions to the lead frame
- stage 102 is the final packaging stage.
- FIG 18 shows a lead frame 110, between steps 104 and 105.
- the lead frame 110 is provided in a generally elongate strip 111, divided into sections 112, which will ultimately be separated to form individual lamps.
- Each section 112 includes a plurality of conductors 113, 114, 115 formed into a curved configuration which is preferably part spherical.
- the conductors may be formed in that configuration by any suitable process such as by inserting the strip 111 in a press or the like.
- a single punch which is rotated in unison, and die 117 can be used to form all of the recesses in any desired array.
- the tool 116 may have a predefined array of die 117 and the punch configured appropriately so that all of the recesses are formed in a single action.
- the particular positioning and configuration of the recesses can be selected to optimise output, as required, since the recesses act as optical guides, as discussed above specifically in relation to Figures 9 to 16, to define the directional output while the number of recesses will determine the maximum output intensity.
- the lead frame 110 can be mounted on a carrier 119, as shown in Figure 19, for stage 101, where light emitting junctions are mounted in the recesses 120.
- the carrier 119 as shown in Figure 19, for stage 101, where light emitting junctions are mounted in the recesses 120.
- stage 102 includes separating the sections 112, removing excess lead frame material and either compression moulding, at step 135 or epoxy moulding, at step 136, a globe portion 137 (see Figure 24) about the conductors 112, 114, 115. Free ends of the conductors may then be bent into terminals or pins 138, to be inserted in an associated through hole of a typical printed circuit board (PCB)or the like.
- PCB printed circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AUPR5705A AUPR570501A0 (en) | 2001-06-15 | 2001-06-15 | Led lamp |
AUPP570501 | 2001-06-15 | ||
PCT/AU2002/000780 WO2002103794A1 (en) | 2001-06-15 | 2002-06-14 | A method of producing a lamp |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1396023A1 true EP1396023A1 (en) | 2004-03-10 |
EP1396023A4 EP1396023A4 (en) | 2007-03-21 |
Family
ID=3829678
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP02729655A Withdrawn EP1396023A4 (en) | 2001-06-15 | 2002-06-14 | A method of producing a lamp |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1396023A4 (en) |
JP (1) | JP2004532532A (en) |
KR (1) | KR20040019015A (en) |
CN (1) | CN1526169A (en) |
AU (1) | AUPR570501A0 (en) |
CA (1) | CA2450156A1 (en) |
NZ (1) | NZ530066A (en) |
TW (1) | TW567617B (en) |
WO (1) | WO2002103794A1 (en) |
ZA (1) | ZA200309547B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003107423A1 (en) | 2002-06-14 | 2003-12-24 | Lednium Pty. Ltd. | A lamp and method of producing a lamp |
NZ542269A (en) * | 2003-03-12 | 2008-03-28 | Lednium Technology Pty Ltd | A lamp assembly and a process for producing a lamp assembly |
JP5236070B2 (en) * | 2008-05-13 | 2013-07-17 | シーメンス アクチエンゲゼルシヤフト | LED array |
TWI401788B (en) | 2008-12-24 | 2013-07-11 | Ind Tech Res Inst | Led packaging module and method |
CN102754228B (en) * | 2010-01-29 | 2017-10-13 | 日本航空电子工业株式会社 | LED component, its manufacture method and light-emitting device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3438154A1 (en) * | 1984-10-18 | 1986-04-24 | SWF Auto-Electric GmbH, 7120 Bietigheim-Bissingen | Lamp, in particular rear lamp for motor vehicles |
FR2707222A1 (en) * | 1993-07-07 | 1995-01-13 | Valeo Vision | Improved signalling light with light-emitting diodes |
DE19922176A1 (en) * | 1999-05-12 | 2000-11-23 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement |
EP1081771A2 (en) * | 1999-09-03 | 2001-03-07 | Hewlett-Packard Company | Light emitting device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5974687A (en) * | 1982-10-21 | 1984-04-27 | Idec Izumi Corp | Light emitting diode lamp |
JPS6132483A (en) * | 1984-07-24 | 1986-02-15 | Kimura Denki Kk | Spherical luminous body using led |
DE4107526C2 (en) * | 1990-03-26 | 1996-04-11 | Siemens Ag | Luminescent diode device with protective device for limiting the forward current when AC voltage is present |
FR2680859B1 (en) * | 1991-09-02 | 1993-10-29 | Valeo Vision | OPTICAL COLLIMATION ELEMENT AND ITS ASSOCIATED SUPPORT ELEMENT, IN PARTICULAR FOR A MOTOR VEHICLE SIGNALING LIGHT. |
JP3033883B2 (en) * | 1994-11-30 | 2000-04-17 | ローム株式会社 | Light emitting display |
GB9605314D0 (en) * | 1996-03-13 | 1996-05-15 | Toher C H | Non-filament lights |
TW408497B (en) * | 1997-11-25 | 2000-10-11 | Matsushita Electric Works Ltd | LED illuminating apparatus |
JP3618534B2 (en) * | 1997-11-28 | 2005-02-09 | 同和鉱業株式会社 | Optical communication lamp device and manufacturing method thereof |
GB2390149B (en) * | 1999-11-03 | 2004-05-26 | Page Aerospace Ltd | A semiconductor light source |
DE19964252A1 (en) * | 1999-12-30 | 2002-06-06 | Osram Opto Semiconductors Gmbh | Surface mount component for an LED white light source |
DE20110289U1 (en) * | 2001-06-21 | 2001-08-23 | Buechner Thomas | Lighting device |
-
2001
- 2001-06-15 AU AUPR5705A patent/AUPR570501A0/en not_active Abandoned
-
2002
- 2002-06-14 WO PCT/AU2002/000780 patent/WO2002103794A1/en active Application Filing
- 2002-06-14 NZ NZ530066A patent/NZ530066A/en unknown
- 2002-06-14 CA CA002450156A patent/CA2450156A1/en not_active Abandoned
- 2002-06-14 EP EP02729655A patent/EP1396023A4/en not_active Withdrawn
- 2002-06-14 TW TW091113106A patent/TW567617B/en not_active IP Right Cessation
- 2002-06-14 JP JP2003506005A patent/JP2004532532A/en active Pending
- 2002-06-14 CN CNA02812023XA patent/CN1526169A/en active Pending
- 2002-06-14 KR KR10-2003-7016279A patent/KR20040019015A/en not_active Application Discontinuation
-
2003
- 2003-12-09 ZA ZA200309547A patent/ZA200309547B/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3438154A1 (en) * | 1984-10-18 | 1986-04-24 | SWF Auto-Electric GmbH, 7120 Bietigheim-Bissingen | Lamp, in particular rear lamp for motor vehicles |
FR2707222A1 (en) * | 1993-07-07 | 1995-01-13 | Valeo Vision | Improved signalling light with light-emitting diodes |
DE19922176A1 (en) * | 1999-05-12 | 2000-11-23 | Osram Opto Semiconductors Gmbh | Surface-mounted LED multiple arrangement |
EP1081771A2 (en) * | 1999-09-03 | 2001-03-07 | Hewlett-Packard Company | Light emitting device |
Non-Patent Citations (1)
Title |
---|
See also references of WO02103794A1 * |
Also Published As
Publication number | Publication date |
---|---|
CN1526169A (en) | 2004-09-01 |
NZ530066A (en) | 2006-10-27 |
JP2004532532A (en) | 2004-10-21 |
KR20040019015A (en) | 2004-03-04 |
CA2450156A1 (en) | 2002-12-27 |
ZA200309547B (en) | 2004-07-28 |
TW567617B (en) | 2003-12-21 |
EP1396023A4 (en) | 2007-03-21 |
WO2002103794A1 (en) | 2002-12-27 |
AUPR570501A0 (en) | 2001-07-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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17P | Request for examination filed |
Effective date: 20031209 |
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AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
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AX | Request for extension of the european patent |
Extension state: AL LT LV MK RO SI |
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RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: MONTAGNAT, JOHN, ALBERT Inventor name: JEGANATHAN, BALU |
|
REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1063380 Country of ref document: HK |
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RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: LEDNIUM PTY LIMITED |
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A4 | Supplementary search report drawn up and despatched |
Effective date: 20070215 |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 25/075 20060101AFI20030107BHEP |
|
RAP1 | Party data changed (applicant data changed or rights of an application transferred) |
Owner name: LEDNIUM TECHNOLOGY PTY LIMITED |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: MONTAGNAT, JOHN, ALBERT Inventor name: JEGANATHAN, BALU |
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17Q | First examination report despatched |
Effective date: 20080902 |
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STAA | Information on the status of an ep patent application or granted ep patent |
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18D | Application deemed to be withdrawn |
Effective date: 20101231 |