EP1374020A2 - Cooling device for a computer - Google Patents

Cooling device for a computer

Info

Publication number
EP1374020A2
EP1374020A2 EP01956516A EP01956516A EP1374020A2 EP 1374020 A2 EP1374020 A2 EP 1374020A2 EP 01956516 A EP01956516 A EP 01956516A EP 01956516 A EP01956516 A EP 01956516A EP 1374020 A2 EP1374020 A2 EP 1374020A2
Authority
EP
European Patent Office
Prior art keywords
cooling device
processor
cooling
shells
outlet opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01956516A
Other languages
German (de)
French (fr)
Inventor
Hannes Porextherm-Dämmstoffe GmbH REISACHER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Porextherm-Dammstoffe GmbH
Porextherm Daemmstoffe GmbH
Original Assignee
Porextherm-Dammstoffe GmbH
Porextherm Daemmstoffe GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Porextherm-Dammstoffe GmbH, Porextherm Daemmstoffe GmbH filed Critical Porextherm-Dammstoffe GmbH
Publication of EP1374020A2 publication Critical patent/EP1374020A2/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a cooling device for computers, with a processor mounted on a motherboard, which can be cooled to temperatures below room temperature, in particular to minus temperatures, via an active cooling unit.
  • the processor In addition to cooling via heat sinks and a fan arranged thereon, there are also active cooling units with which the processor temperature can be cooled below room temperature.
  • active cooling units For example, water cooling or other cooling liquids that are circulated via pumps and heat exchangers are used for this purpose. With these active cooling units, temperatures far below zero can be reached, so that at these temperatures the processor and associated switching elements, which are based in particular on CMOS technology, can be operated at significantly higher clock rates.
  • a disadvantage of the above-mentioned cooling units is the danger that, in the event of a hose break between the CPU and the cooling unit, the cooling liquid used can cause considerable damage until the computer fails completely.
  • the direct heat dissipation on the processor is also very complex, since the cooling liquid places considerable demands on the seal directly on current-carrying components.
  • the invention has for its object to provide a cooling device for computers, which is simple and secure.
  • the pressed insulating composite part is packed in an airtight or diffusion-tight envelope in order to maintain the degree of evacuation over a long period of time.
  • a dehumidifier is preferably provided in the cooling unit only to avoid condensation.
  • the proposed cool box consists of two half-shells which form an inner cavity in which the main board is inserted together with the processor (CPU).
  • CPU central processing unit
  • the two half-shells of the cool box are preferably constructed symmetrically in order to simplify production.
  • the half-shells are preferably connected by means of film hinges or clamps, the film hinge, for example, preferably being formed by protrusions of a pouch-like covering for the insulating microporous ceramic powder.
  • the outlet opening for the necessary cables, for example the data lines to the drives or the supply cables from the network, is provided in the cool box.
  • the outlet opening preferably has a wavy cross section, which is also largely sealed airtight by means of several sealing lips.
  • the microporous, pressed ceramic powder based on metal oxide is preferably enclosed in a covering and evacuated in order to further reduce the thermal conductivity.
  • this covering serves to securely enclose the microporous ceramic powder, in particular the highly disperse silica, so that no dust particles get to the electronic components.
  • FIG. 1 is a schematic perspective view of a computer with a cooling device. and FIG. 2 shows an enlarged sectional illustration of a cool box.
  • a computer housing 1 is indicated in chain lines.
  • this computer housing 1 houses at least one main board 5 and a processor 4 arranged thereon.
  • the main board (motherboard) 5 is connected to a plurality of cables 8, in particular in the form of a ribbon cable, for example that drive located above or the power supply located below.
  • At least the processor 4 and the motherboard 5 are housed in a cool box 6, which together with a cooling unit 3 forms the cooling device for the computer.
  • the cooling unit 3 is here schematically arranged on the base of the computer housing 1 and connected to the cool box 6 via a heat-insulated hose 3a.
  • the cool box 6 consists of two half shells 6a, 6b which form an inner cavity 6c.
  • the main board 5 with the CPU arranged thereon is inserted therein.
  • the half-shells 6a and 6b are preferably constructed symmetrically and connected to one another via a film hinge 6d.
  • brackets 10 encompassing the outside can also be provided.
  • the film hinge 6d is preferably formed by protrusions of a covering 6e, which encloses the essential microporous, pressed ceramic powder based on metal oxide, in particular highly disperse silica or silicon oxide aerogels.
  • This microporous ceramic powder which is shown in dotted lines, can optionally be mixed with hardener and / or fiber additives and opacifiers (e.g. Il enit). As a result, these silicas achieve an excellent low thermal conductivity with a BET surface area of several hundred square meters per gram. This can be further improved by evacuation, in that the microporous ceramic powder is put into a bag-like plastic covering 6e after the pressing. This envelope 6e is preferably designed to be diffusion-tight.
  • a slot-shaped outlet opening 7 is provided in the cool box 6.
  • the outlet opening 7 has a corrugated cross section, with sealing lips 9 being provided at least on the inside toward the cavity 6c.
  • the processor 4 can be plugged into the cooling box 6 together with the main board and connected to the active cooling unit 3 as an additional device, in particular in the form of a base unit, via the heat-insulating hose 3a. Then, with the cooling of the CPU and similar electronic components achieved, the clock rate of the processors (so-called overclocking) can be carried out. Since the cooling in the area of the CPU takes a certain amount of time due to the circulated amount of air, the cooling device is preferably used for continuously operated computers, in particular network servers. By enveloping the essential electronic components by means of the cool box 6, the noise level (compared to fan cooling) is also considerably reduced.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Silicon Compounds (AREA)

Abstract

According to the invention, a simple and reliable cooling device for a computer, comprising a processor (4), mounted on a main board (5), the temperature of which may be maintained at a temperature below ambient, in particular at a negative temperature, by means of an active cooling unit (3), may be achieved, whereby the processor (4) and the main board (5) are placed in a cooled box (6), made from a micro-porous pressed ceramic powder based on a metal oxide, in particular, pyrogenically-created highly-dispersed silicic acid or silicon aerogel.

Description

Kühlvorrichtung für ComputerCooling device for computers
Die Erfindung betrifft eine Kühlvorrichtung für Computer, mit einem auf einer Hauptplatine angebrachten Prozessor, der über eine aktive Kühleinheit auf Temperaturen unterhalb der Raumtemperatur, insbesondere auf Minus-Temperaturen, abkühlbar ist.The invention relates to a cooling device for computers, with a processor mounted on a motherboard, which can be cooled to temperatures below room temperature, in particular to minus temperatures, via an active cooling unit.
Zur Kühlung von Computern, insbesondere des Prozessors (CPU) , gibt es neben der Kühlung über Kühlkörper und einen darauf angeordneten Gebläse auch aktive Kühleinheiten, mit denen die Prozessortemperatur unterhalb der Raumtemperatur abkühlbar ist. Beispielsweise werden hierzu Wasserkühlungen verwendet oder andere Kühlflüssigkeiten, die über Pumpen und Wärmetauscher umgewälzt werden. Mit diesen aktiven Kühleinheiten lassen sich Temperaturen weit unterhalb des Nullpunkts erreichen, so daß bej diesen Temperaturen der Prozessor und damit verbundene Schaltelemente, die insbesondere auf CMOS-Technologie basieren, mit wesentlich höheren Taktraten betrieben werden können.For cooling computers, in particular the processor (CPU), in addition to cooling via heat sinks and a fan arranged thereon, there are also active cooling units with which the processor temperature can be cooled below room temperature. For example, water cooling or other cooling liquids that are circulated via pumps and heat exchangers are used for this purpose. With these active cooling units, temperatures far below zero can be reached, so that at these temperatures the processor and associated switching elements, which are based in particular on CMOS technology, can be operated at significantly higher clock rates.
Nachteilig bei den vorgenannten Kühleinheiten ist jedoch die Gefahr, daß bei einem Schlauchbruch zwischen der CPU und der Kühleinheit die verwendete Kühlflüssigkeit einen erheblichen Schaden bis zum Totalausfall des Computers anrichten kann. Darüber hinaus ist auch die direkte Wärmeabführung an dem Prozessor sehr aufwendig, da die Kühlflüssigkeit erhebliche Anforderungen an die Abdichtung unmittelbar an stromführenden Bauelementen stellt.A disadvantage of the above-mentioned cooling units, however, is the danger that, in the event of a hose break between the CPU and the cooling unit, the cooling liquid used can cause considerable damage until the computer fails completely. In addition, the direct heat dissipation on the processor is also very complex, since the cooling liquid places considerable demands on the seal directly on current-carrying components.
Demzufolge liegt der Erfindung die Aufgabe zugrunde, eine Kühlvorrichtung für Computer zu schaffen, die einfacher und sicherer aufgebaut ist.Accordingly, the invention has for its object to provide a cooling device for computers, which is simple and secure.
Diese Aufgabe wird gelöst durch eine Kühlvorrichtung mit den Merkmalen des Anspruches 1. Bevorzugte Ausgestaltungen sind Gegenstand der Unteransprüche. Durch die Einbringung des Prozessors zusammen mit seiner Hauptplatine (Motherboard) in eine Kühlbox sind keine Umbauarbeiten direkt an der Hauptplatine oder dem Prozessor erforderlich. Dadurch kann das Motherboard im wesentlichen unverändert in die Kühlbox eingesetzt werden, wobei lediglich die Kabel zu den Peripheriegeräten wie Netzteil, Laufwerke u. dgl. nach außen geführt werden. Von wesentlicher Bedeutung ist hierbei, daß durch die Ausbildung der Kühlbox aus mikroporösem, verpreßtem Keramikpulver auf Metalloxidbasis, insbesondere hochdisperser Kieselsäure oder Silicium-Aerogelen, eine wesentlich verbesserte Isolationsfähigkeit erreicht wird, da derartige Materialien eine sehr geringe Wärmeleitfähigkeit von nur noch etwa 0,01 W/mK oder darunter erreichen. Dieser Effekt wird noch verbessert, wenn derartige Dämmwerkstoffe evakuiert werden, beispielsweise auf Unterdrücke von 1 - 10 mbar. Hierzu wird das verpreßte Isolierverbundteil in eine möglichst luft- bzw. diffusionsdichte Umhüllung gepackt, um den Evakuierungsgrad über lange Zeit beizubehalten.This object is achieved by a cooling device having the features of claim 1. Preferred embodiments are the subject of the subclaims. By installing the processor together with its motherboard in a cool box, no modifications are necessary directly on the motherboard or the processor. As a result, the motherboard can be used essentially unchanged in the cool box, with only the cables to peripheral devices such as the power supply unit, drives and the like. Like. Be led outside. It is essential here that the formation of the cool box from microporous, pressed ceramic powder based on metal oxide, in particular highly disperse silica or silicon aerogels, results in a substantially improved insulation capacity, since such materials have a very low thermal conductivity of only about 0.01 W / mK or below. This effect is further improved if such insulation materials are evacuated, for example to negative pressures of 1-10 mbar. For this purpose, the pressed insulating composite part is packed in an airtight or diffusion-tight envelope in order to maintain the degree of evacuation over a long period of time.
Aufgrund der ausgezeichneten Isolationsfähigkeit dieses Materials reichen sehr geringe Antriebsleistungen der aktiven Kühleinheit zur Umwälzung aus. Es sei darauf hingewiesen, daß gegenüber den ansonsten verwendeten Kühlflüssigkeiten hier Luft oder ein ähnliches Gas zur Anwendung gelangt, so daß selbst bei Schlauchbrüchen keine Beschädigung der Elektronik zu erwarten ist. Zudem wird durch die Verwendung von auf ca. -30°C abgekühlter Luft oder ähnlicher Gase (z. B. Stickstoff) der Bauaufwand der Kühleinheit wesentlich reduziert. Lediglich zur Vermeidung von Kondenswasser ist in der Kühleinheit bevorzugt ein Entfeuchter vorgesehen.Due to the excellent insulation properties of this material, very low drive powers of the active cooling unit are sufficient for circulation. It should be noted that air or a similar gas is used here in relation to the cooling liquids otherwise used, so that no damage to the electronics is to be expected even in the event of hose breaks. In addition, the use of air cooled to approx. -30 ° C or similar gases (e.g. nitrogen) significantly reduces the construction costs of the cooling unit. A dehumidifier is preferably provided in the cooling unit only to avoid condensation.
Die vorgeschlagene Kühlbox besteht in bevorzugter Ausführungsform aus zwei Halbschalen, die einen inneren Hohlraum bilden, in dem die Hauptplatine zusammen mit dem Prozessor (CPU) eingesetzt ist. Somit muß lediglich dieser Hohlraum mit einem Innenvolumen von z.B. etwa einem Liter gekühlt werden. Hierbei sind neben der Hauptplatine und dem Prozessor auch Speicherbausteine u. dgl. unterzubringen, so daß auch diese bei Minus-Temperaturen mit höheren Taktraten betrieben werden können. Die beiden Halbschalen der Kühlbox sind hierbei bevorzugt symmetrisch aufgebaut, um die Herstellung zu vereinfachen. Die Halbschalen sind dabei bevorzugt über Filmscharniere oder Klammern verbunden, wobei beispielsweise das Filmscharnier bevorzugt über Überstände einer beutelartigen Umhüllung für das isolierende mikroporöse Keramikpulver gebildet ist.In a preferred embodiment, the proposed cool box consists of two half-shells which form an inner cavity in which the main board is inserted together with the processor (CPU). Thus, only this cavity with an internal volume of, for example, about one liter has to be cooled. In addition to the main board and the processor, memory chips and the like are also included. Like. To accommodate, so that this with minus temperatures higher clock rates can be operated. The two half-shells of the cool box are preferably constructed symmetrically in order to simplify production. The half-shells are preferably connected by means of film hinges or clamps, the film hinge, for example, preferably being formed by protrusions of a pouch-like covering for the insulating microporous ceramic powder.
In der Kühlbox ist zudem zumindest eine Auslaßöffnung für die erforderlichen Kabel, beispielsweise die Datenleitungen zu den Laufwerken oder die Versorgungskabel von dem Netzwerk, vorgesehen. Um Wärmeverluste zu vermeiden, weist die Auslaßöffnung bevorzugt einen wellenförmigen Querschnitt auf, der zudem mittels mehrerer Dichtlippen weitgehend luftdicht verschlossen ist. Wie oben angedeutet, ist das mikroporöse, verpreßte Keramikpulver auf Metalloxidbasis bevorzugt in einer Umhüllung umschlossen und evakuiert, um die Wärmeleitfähigkeit weiter zu verringern. Zudem dient diese Umhüllung dem sicheren Einschluß des mikroporösen Keramikpulvers, insbesondere der hochdispersen Kieselsäure, damit keine Staubteilchen an die elektronischen Bauteile gelangen.In addition, at least one outlet opening for the necessary cables, for example the data lines to the drives or the supply cables from the network, is provided in the cool box. In order to avoid heat loss, the outlet opening preferably has a wavy cross section, which is also largely sealed airtight by means of several sealing lips. As indicated above, the microporous, pressed ceramic powder based on metal oxide is preferably enclosed in a covering and evacuated in order to further reduce the thermal conductivity. In addition, this covering serves to securely enclose the microporous ceramic powder, in particular the highly disperse silica, so that no dust particles get to the electronic components.
Nachfolgend wird anhand der Zeichnung ein Ausführungsbeispiel näher beschrieben und erläutert. Hierbei zeigen:An exemplary embodiment is described and explained in more detail below with reference to the drawing. Here show:
Fig. 1 eine schematische Perspektivdarstellung eines Computers mit einer Kühlvorrichtung; und Fig. 2 eine vergrößerte Schnittdarstellung einer Kühlbox.Figure 1 is a schematic perspective view of a computer with a cooling device. and FIG. 2 shows an enlarged sectional illustration of a cool box.
In Fig. 1 ist ein Computer-Gehäuse 1 in Strichpunktlinien angedeutet. Dieses Computer-Gehäuse 1 beherbergt neben einem unten angedeuteten Netzteil und einem oben angedeuteten Laufwerk zumindest eine Hauptplatine 5 und einen darauf angeordneten Prozessor 4. An die Hauptplatine (Motherboard) 5 ist über eine Vielzahl von Kabeln 8, insbesondere in Form eines Flachbandkabels, beispielsweise das darüber angeordnete Laufwerk oder das darunter angeordnete Netzteil angeschlossen. Zumindest der Prozessor 4 und die Hauptplatine 5 (sowie ggf. andere elektronische Bauteile) sind in einer Kühlbox 6 untergebracht, die zusammen mit einer Kühleinheit 3 die Kühlvorrichtung für den Computer bildet. Die Kühleinheit 3 ist hier schematisch am Sockel des Computer-Gehäuses 1 angeordnet und über einen wärmeisolierten Schlauch 3a mit der Kühlbox 6 verbunden.In Fig. 1, a computer housing 1 is indicated in chain lines. In addition to a power supply and a drive indicated above, this computer housing 1 houses at least one main board 5 and a processor 4 arranged thereon. The main board (motherboard) 5 is connected to a plurality of cables 8, in particular in the form of a ribbon cable, for example that drive located above or the power supply located below. At least the processor 4 and the motherboard 5 (as well as others if necessary electronic components) are housed in a cool box 6, which together with a cooling unit 3 forms the cooling device for the computer. The cooling unit 3 is here schematically arranged on the base of the computer housing 1 and connected to the cool box 6 via a heat-insulated hose 3a.
Wie insbesondere aus der Schnittdarstellung der Kühlbox 6 in Fig. 2 ersichtlich ist, besteht die Kühlbox 6 aus zwei Halbschalen 6a, 6b, die einen inneren Hohlraum 6c bilden. Darin ist die Hauptplatine 5 mit der darauf angeordneten CPU eingesetzt. Die Halbschalen 6a und 6b sind bevorzugt symmetrisch aufgebaut und über ein Filmscharnier 6d miteinander verbunden. Zur Verbindung der beiden Halbschalen 6a und 6b können zudem außen umgreifende Klammern 10 vorgesehen sein. Das Filmscharnier 6d wird dabei bevorzugt durch Überstände einer Umhüllung 6e gebildet, die das hier wesentliche mikroporöse, verpreßte Keramikpulver auf Metalloxidbasis, insbesondere hochdisperser Kieselsäure oder Siliciu oxid-Aerogelen, umschließt. Dieses mikroporöse Keramikpulver, das punktiert dargestellt ist, kann ggf. mit Härter- und/oder Faserzusätzen sowie Trübungsmitteln (z. B. Il enit) versetzt sein. Dadurch erreichen diese Kieselsäuren mit einer BET-Oberflache von mehreren hundert Quadratmetern pro Gramm ausgezeichnet geringe Wärmeleitwerte. Diese kann noch durch Evakuierung verbessert werden, indem das mikroporöse Keramikpulver nach dem Verpressen in eine beutelartige Kunststoff-Umhüllung 6e gegeben wird. Diese Umhüllung 6e ist hierbei bevorzugt diffusionsdicht ausgebildet.As can be seen in particular from the sectional view of the cool box 6 in FIG. 2, the cool box 6 consists of two half shells 6a, 6b which form an inner cavity 6c. The main board 5 with the CPU arranged thereon is inserted therein. The half-shells 6a and 6b are preferably constructed symmetrically and connected to one another via a film hinge 6d. To connect the two half-shells 6a and 6b, brackets 10 encompassing the outside can also be provided. The film hinge 6d is preferably formed by protrusions of a covering 6e, which encloses the essential microporous, pressed ceramic powder based on metal oxide, in particular highly disperse silica or silicon oxide aerogels. This microporous ceramic powder, which is shown in dotted lines, can optionally be mixed with hardener and / or fiber additives and opacifiers (e.g. Il enit). As a result, these silicas achieve an excellent low thermal conductivity with a BET surface area of several hundred square meters per gram. This can be further improved by evacuation, in that the microporous ceramic powder is put into a bag-like plastic covering 6e after the pressing. This envelope 6e is preferably designed to be diffusion-tight.
Zur Herausführung der erforderlichen Verkabelung 8 von der Hauptplatine 5 zu den peripheren Bauteilen wie dem Netzteil, Laufwerken u. dgl. ist in der Kühlbox 6 eine schlitzförmige Auslaßöffnung 7 vorgesehen. Um hierbei eine möglichst gute Abdichtung zu erreichen, weist die Auslaßöffnung 7 einen wellenförmigen Querschnitt auf, wobei zumindest an der Innenseite zum Hohlraum 6c hin Dichtlippen 9 vorgesehen sind. Hierdurch läßt sich der Wärme- bzw. Kälteverlust an der Auslaßöffnung 7 weitgehend reduzieren, so daß der Leistungsbedarf der aktiven Kühleinheit 3 am Sockel des Computer-Gehäuses 1 gering gehalten werden kann.To lead out the necessary wiring 8 from the motherboard 5 to the peripheral components such as the power supply, drives and. The like. A slot-shaped outlet opening 7 is provided in the cool box 6. In order to achieve the best possible seal, the outlet opening 7 has a corrugated cross section, with sealing lips 9 being provided at least on the inside toward the cavity 6c. As a result, the heat or cold loss at the outlet opening 7 can be largely reduced, so that the power requirement of the active Cooling unit 3 on the base of the computer housing 1 can be kept low.
Durch diese vorgeschlagene Kühlvorrichtung für Computer kann ohne großen Umbauaufwand der Prozessor 4 zusammen mit der Hauptplatine in die Kühlbox 6 gesteckt werden und an die aktive Kühleinheit 3 als Zusatzgerät, insbesondere in Form eines Unterbaugerätes, über den wärmeisolierenden Schlauch 3a angeschlossen werden. Sodann kann mit der erreichten Abkühlung der CPU und ähnlicher elektronischer Bauteile die Taktrate der Prozessoren (sog. Übertaktung) durchgeführt werden. Da die Abkühlung im Bereich der CPU aufgrund der umgewälzten Luftmenge eine gewisse Zeit in Anspruch nimmt, wird die Kühlvorrichtung vorzugsweise für dauernd betriebene Computer, insbesondere Netzwerk-Server, eingesetzt. Durch die Umhüllung der wesentlichen elektronischen Bauteile mittels der Kühlbox 6 wird zudem der Geräuschpegel (gegenüber Gebläsekühlung) erheblich reduziert. By means of this proposed cooling device for computers, the processor 4 can be plugged into the cooling box 6 together with the main board and connected to the active cooling unit 3 as an additional device, in particular in the form of a base unit, via the heat-insulating hose 3a. Then, with the cooling of the CPU and similar electronic components achieved, the clock rate of the processors (so-called overclocking) can be carried out. Since the cooling in the area of the CPU takes a certain amount of time due to the circulated amount of air, the cooling device is preferably used for continuously operated computers, in particular network servers. By enveloping the essential electronic components by means of the cool box 6, the noise level (compared to fan cooling) is also considerably reduced.

Claims

Patentansprüche: claims:
1. Kühlvorrichtung für Computer, mit einem auf einer Hauptplatine angebrachten Prozessor, der über eine aktive Kühleinheit auf Temperaturen unterhalb der Raumtemperatur, insbesondere auf Minus-Temperaturen, abkühlbar ist, dadurch gekennzeichnet, daß der Prozessor (4) und die Hauptplatine (5) in einer Kühlbox (6) aus mikroporösem, verpreßtem Keramikpulver auf Metalloxidbasis, insbesondere pyrogen erzeugter, hochdisperser Kieselsäure oder Silicium-Aerogel, eingesetzt sind.1. Cooling device for computers, with a processor mounted on a motherboard, which can be cooled via an active cooling unit to temperatures below room temperature, in particular to minus temperatures, characterized in that the processor (4) and the motherboard (5) in a cool box (6) made of microporous, pressed ceramic powder based on metal oxide, in particular pyrogenically produced, highly disperse silica or silicon airgel, are used.
2. Kühlvorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Kühlbox (6) aus zwei einen inneren Hohlraum (6c) bildenden Halbschalen (6a, 6b) besteht.2. Cooling device according to claim 1, characterized in that the cool box (6) consists of two half-shells (6a, 6b) forming an inner cavity (6c).
3. Kühlvorrichtung nach Anspruch 2, dadurch gekennzeichnet, daß die Halbschalen (6a, 6b) symmetrisch ausgeformt sind.3. Cooling device according to claim 2, characterized in that the half-shells (6a, 6b) are formed symmetrically.
4. Kühlvorrichtung nach Anspruch 2 oder 3 , dadurch gekennzeichnet, daß die Halbschalen (6a, 6b) über ein Filmscharnier (6d) und/oder Klammern (10) verbunden sind.4. Cooling device according to claim 2 or 3, characterized in that the half-shells (6a, 6b) via a film hinge (6d) and / or clips (10) are connected.
5. Kühlvorrichtung nach Anspruch 4, dadurch gekennzeichnet, daß das Filmscharnier (6d) durch Überstände einer Umhüllung (6e) gebildet ist.5. Cooling device according to claim 4, characterized in that the film hinge (6d) is formed by protrusions of an envelope (6e).
6. Kühlvorrichtung nach Anspruch 4 oder 5, dadurch gekennzeichnet, daß gegenüber dem Filmscharnier (6d) eine Auslaßöffnung (7) für Kabel (8) , insbesondere Flachbandkabel, vorgesehen ist.6. Cooling device according to claim 4 or 5, characterized in that an outlet opening (7) for cable (8), in particular ribbon cable, is provided opposite the film hinge (6d).
7. Kühlvorrichtung nach Anspruch 6, dadurch gekennzeichnet, daß die Auslaßöffnung (7) einen wellenförmigen Querschnitt aufweist.7. Cooling device according to claim 6, characterized in that the outlet opening (7) has a wavy cross section.
8. Kühlvorrichtung nach Anspruch 6 oder 7, dadurch gekennzeichnet, daß entlang der Auslaßöffnung (7) mehrere Dichtlippen (9) vorgesehen sind. 8. Cooling device according to claim 6 or 7, characterized in that a plurality of sealing lips (9) are provided along the outlet opening (7).
9. Kühlvorrichtung nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß das mikroporöse, verpreßte Keramikpulver in einer zumindest weitgehenend diffusionsdichten Folienumhüllung (6e) evakuiert ist.9. Cooling device according to one of claims 1 to 8, characterized in that the microporous, pressed ceramic powder is evacuated in an at least largely diffusion-tight film envelope (6e).
10. Kühlvorrichtung nach einem der Ansprüche 5 bis 9, dadurch gekennzeichnet, daß die Umhüllung (6e) aus einem beutelartig ausgestalteten Kunststoffmaterial besteht. 10. Cooling device according to one of claims 5 to 9, characterized in that the covering (6e) consists of a bag-like plastic material.
EP01956516A 2000-07-05 2001-07-05 Cooling device for a computer Withdrawn EP1374020A2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10032050A DE10032050A1 (en) 2000-07-05 2000-07-05 Cooling device for computers
DE10032050 2000-07-05
PCT/EP2001/007707 WO2002003183A2 (en) 2000-07-05 2001-07-05 Cooling device for a computer

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EP1374020A2 true EP1374020A2 (en) 2004-01-02

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EP01956516A Withdrawn EP1374020A2 (en) 2000-07-05 2001-07-05 Cooling device for a computer

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US (1) US20040090746A1 (en)
EP (1) EP1374020A2 (en)
AU (1) AU2001278473A1 (en)
DE (1) DE10032050A1 (en)
WO (1) WO2002003183A2 (en)

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US20140083120A1 (en) * 2012-09-21 2014-03-27 Elizabeth Nowak Renewable energy-based atmospheric water generator

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US4800422A (en) * 1987-05-07 1989-01-24 Ncr Corporation Frostless interface supercooled VLSI system
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
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US5251095A (en) * 1992-07-31 1993-10-05 International Business Machines Corporation Low temperature conduction module for a cryogenically-cooled processor
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Title
See references of WO0203183A3 *

Also Published As

Publication number Publication date
WO2002003183A3 (en) 2003-10-09
US20040090746A1 (en) 2004-05-13
AU2001278473A1 (en) 2002-01-14
WO2002003183A2 (en) 2002-01-10
DE10032050A1 (en) 2002-01-17

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