EP1269412A1 - Rfid label with an element for regulating the resonance frequency - Google Patents
Rfid label with an element for regulating the resonance frequencyInfo
- Publication number
- EP1269412A1 EP1269412A1 EP01962432A EP01962432A EP1269412A1 EP 1269412 A1 EP1269412 A1 EP 1269412A1 EP 01962432 A EP01962432 A EP 01962432A EP 01962432 A EP01962432 A EP 01962432A EP 1269412 A1 EP1269412 A1 EP 1269412A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- rfid label
- substrate
- sticker
- label according
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
- G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
- G08B13/2414—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/0672—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with resonating marks
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
- G06K19/0726—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
- G08B13/2405—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used
- G08B13/2414—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags
- G08B13/2417—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting characterised by the tag technology used using inductive tags having a radio frequency identification chip
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B13/00—Burglar, theft or intruder alarms
- G08B13/22—Electrical actuation
- G08B13/24—Electrical actuation by interference with electromagnetic field distribution
- G08B13/2402—Electronic Article Surveillance [EAS], i.e. systems using tags for detecting removal of a tagged item from a secure area, e.g. tags for detecting shoplifting
- G08B13/2428—Tag details
- G08B13/2431—Tag circuit details
Definitions
- the present invention relates to an RFID label according to the preamble of claim 1.
- RFID stands for the English term “radio frequency identification”.
- RFID labels like those considered here, generally include an electrical resonant circuit with a coil and a capacitor on a thin plastic substrate, and a very small integrated semiconductor circuit (chip), which gives the label a certain level of intelligence.
- the coil also acts as an antenna, so that the label on its resonance frequency, which is determined by the resonant circuit and lies in the "radio waves" area, can communicate with a remote transmitting and receiving station via "radio", so to speak.
- the energy required for the operation of the semiconductor circuit is obtained from the external energy received via the coil antenna Field
- the label therefore does not have its own energy source
- RFID labels can be used particularly for goods identification, for access security in a building complex or, for example, as a ski pass ticket
- RFID labels are usually subject to strict radio regulations, which are very narrow, for example, for their operation Allow limited frequency bands
- a frequency band which is often chosen for RFID labels, is eg 13 560 MHz, the width of this band being only +/- 7 kHz
- Such a known trimming method is, for example, shortening a capacitor with the aid of a laser (see US Pat. No. 3,947,934) or a punching or cutting tool (see WO 89/05984). This reduces the area of the capacitor and thus reduces the capacitance Reducing the capacitance affects the resonance frequency of the resonant circuit in such a way that the resonance frequency is increased
- the extent of the frequency change brought about by the additional element can also be chosen to be absolutely larger in comparison with the aforementioned known trimming methods, as a result of which the achievable accuracy of the frequency setting is increased
- a sticker with a conductive layer and an adhesive layer is used to increase the effective capacity of the resonant circuit in at least partial coverage with at least two conductive surfaces with different potential, which are on the same side of the substrate.
- the adhesive layer acts as an insulating and as a dielectric layer.
- it can also be attached to the opposite side of the substrate, with the substrate additionally acting as an insulating and as a dielectric conductive surfaces to which it is applied are chosen at least approximately at the potential of the two Capacitor plates are usually those areas that are also used for contacting the semiconductor circuit
- a sticker could also be conductively connected to a conductive area on one side of the substrate and otherwise arranged such that it is at least partially covered with another conductive area on the opposite side of the substrate. This also results in an increase in capacitance, provided the corresponding conductive area Surfaces are not at the same electrical potential
- a sticker with a conductive layer is applied in the area within the coil for the purpose of lowering the effective inductance of the resonant circuit.
- the magnetic field within the coil is influenced in this way in such a way that the inductance is reduced and a desired frequency increase results therefrom This measure is particularly effective if the sticker is offset within the coil from its center because the magnetic flux is denser here than in the center
- a local application can be carried out from an initially liquid or pasteous, later drying or hardening composition which has a high dielectric constant, the local application of this composition in the space between two Such an order creates an additional dielectric between the conductors, which leads to an increase in capacitance and thus a lowering of the frequency of the resonant circuit.
- the paste is easy to apply between the two conductors.
- the dielectric of the paste can vary depending on the desired frequency adjustment
- FIG. 4 also in section an alternative solution with an additionally applied local application made of a material with a high dielectric constant
- Fig. 1, 1 denotes a plastic film which, for example, consists of polyester and which is provided on both sides with conductive surfaces, preferably made of aluminum.
- conductive surfaces preferably made of aluminum.
- the conductive surfaces are two mutually parallel conductor tracks 2 and 3, a coil 4, a first corner surface 5, a first contact surface 6 and a connecting piece 7 are arranged on the front side of the substrate.
- the stippled conductors 8 and 9 are arranged on the rear side of the substrate.
- a first via 9 is provided on the rear side of the substrate, essentially congruent with the first corner surface 5, is also still a second corner surface 5 'and essentially congruent with the first contact surface 6, also a second contact surface 6' is formed between the first 5 and the second corner surface 5 'by means of a so-called compression, a first via 9 is provided. Another such via 10 is also between the two contact surfaces 6 and 6 '
- the coil 4 is connected at one end to the conductor track 3 and ends at the other end into the first corner surface 5. From there, the electrical connection continues via the via 9 to the second corner compartment 5 ', via the conductor track 8 to the further contact surface 6 'and from there to the conductor track 14, in the region of their free ends, the conductor tracks 3 and 14 cross over on different substrate sides and there form the plates of a capacitor 11, which in turn forms an oscillating circuit together with the coil 4
- the conductor 14 located on the back of the substrate and thus the rear capacitor plate is connected to the conductor 2 located on the front of the substrate, which accordingly also has the potential of the rear capacitor plate.
- the conductor 3 has this Potential of the front capacitor plate is connected to the two conductor tracks 2 and 3 and thus applied to the voltage of the capacitor 11 is a semiconductor circuit or chip 12
- the RFID label shown in FIG. 1 is also trimmed by a sticker 13 which is partially covered with the surfaces 2 and 3.
- the surfaces 2 and 3 are designed to be of sufficient length for this purpose.
- the sticker 13 has one with an adhesive layer 16 provided conductive layer 15 z made of aluminum (see FIG. 3 A or B) and, depending on the size of the conductive layer or its overlap with the conductive surfaces 2 and 3 of the label, locally causes an additional capacitance, which the capacitance of the Oscillating circuit increased This in turn results in a lowering of the frequency of the oscillating circuit 1
- the resonance circuit with the sticker 13 can in principle be made after the labels have been produced as such, the actual frequency of the resonance circuit first being determined, for example by frequency measuring cells. The actual frequency is then compared with a predetermined target frequency and a correction factor is derived therefrom The size of the sticker 13 is selected on the basis of this correction factor,
- the sticker 13 can either be applied directly to the two conductive surfaces 2 or 3, with only its adhesive layer acting as an insulation against these surfaces and as a dielectric, or it can be applied to the opposite side of the substrate, the substrate being additionally insulated and forming a dielectric
- FIG. 2 shows another possibility of frequency adaptation of the resonant circuit 1.
- a sticker 21 with a conductive layer, for example made of aluminum, is simply applied here somewhere on a free area inside the coil 4 without being covered by one of the conductive surfaces 21, the magnetic field within the coil 4 is changed. More specifically, the inductance L of the coil is reduced by the sticker 21. This has an increasing effect on the resonance frequency of the resonant circuit 1.
- the sticker 21 should preferably be attached to the coil center, since the effect on the magnetic flux in it Case is larger than than in the center of the coil 4 3 shows, under A and B in section, the two possibilities already described for attaching a sticker 13 to increase capacity in at least partially overlap with two conductor tracks 2 and 3, picture A corresponding to section II of FIG.
- a sticker 17 with a conductive layer 18 and a conductive adhesive layer 19 with a first conductive surface on the same substrate side is conductive and with a further conductive surface which is arranged on the opposite side of the substrate and has a different potential than the first surface, partially overlapped.
- the sticker 17 brings about an additional capacitance between the two conductive surfaces shown
- the local application 20 is made from a liquid, for example, applied mass with a high dielectric constant ⁇ , preferably in the range of ⁇ r 2-10, whereby these The mass solidifies later and / or dries and / or hardens. Due to the high dielectric constant of the mass used, like the stickers described above, the application causes a local increase in capacitance between the two conductor tracks, which increases the overall capacitance of the resonant circuit and has a negative effect on its resonance frequency that the extent of the change in capacity here is primarily determined by the length of the order 20 along the two conductor tracks
- the extent of the change in capacity basically also depends on the position that is selected for the sticker or the local order. It is most pronounced if the conductive surfaces with which the sticker is at least partially covered, or The potential between which the order is placed is as different as possible. With an RFID label of the type considered here, the greatest potential difference arises between the plates of the resonant circuit capacitor For this reason, the sticker 13 from FIG. 1 is also applied across the two conductor tracks 2 and 3, which have this maximum potential difference
Abstract
The invention relates to an RFID label comprising a resonant circuit consisting of a coil and a capacitor. Said RFID label is provided with an additional element (13, 17, 20, 21) for regulating the resonance frequency of the resonant circuit, this element being applied to the surface of the RFID label after production of the same. The additional element can be especially, a sticker with a conductive layer, which is stuck in such a way that it at least partially overlaps individual conductive surfaces of the label in order to produce an additional capacitance or which is simply stuck into the coil in order to reduce the effective inductance of the coil. Alternatively, the element can be formed by a layer with high relative permittivity which is applied between two conductive surfaces.
Description
BESCHREIBUNG DESCRIPTION
TITELTITLE
RFID-LABELRFID-LABEL
TECHNISCHES GEBIETTECHNICAL AREA
Die vorliegende Erfindung betrifft ein RFID-Label gemass dem Oberbegriff des Patentanspruchs 1 Die Abkürzung "RFID" steht hierbei für den englischen Begriff "Radio Frequency Identification"The present invention relates to an RFID label according to the preamble of claim 1. The abbreviation "RFID" stands for the English term "radio frequency identification".
RFID- Label umfassen, wie die hier betrachteten, im allgemeinen auf einem dünnen Kunststoffsubstrat einen elektrischen Schwingkreis mit einer Spule und einem Kondensator sowie einen sehr kleinen integrierten Halbleiterschaltkreis (Chip), der dem Label eine gewisse Intelligenz verleiht Die Spule wirkt gleichzeitig als Antenne, so dass das Label auf seiner im "Radιowellen"-Bereιch liegenden, durch den Schwingkreis bestimmten Resonanzfrequenz sozusagen über "Funk" mit einer entfernten Sende- und Empfangsstation kommunizieren kann Die für den Betrieb des Halbleiterschaltkreises benotigte Energie bezieht das Label aus dem über die Spulenantenne empfangenen ausseren Feld Das Label verfugt also selbst über keine eigene EnergiequelleRFID labels, like those considered here, generally include an electrical resonant circuit with a coil and a capacitor on a thin plastic substrate, and a very small integrated semiconductor circuit (chip), which gives the label a certain level of intelligence. The coil also acts as an antenna, so that the label on its resonance frequency, which is determined by the resonant circuit and lies in the "radio waves" area, can communicate with a remote transmitting and receiving station via "radio", so to speak. The energy required for the operation of the semiconductor circuit is obtained from the external energy received via the coil antenna Field The label therefore does not have its own energy source
RFID-Label lassen sich wegen ihrer "Intelligenz" besonders zur Warenidentifizierung einsetzen, zur Zugangs-Sicherungselement in einem Gebaudekomplex oder z B auch als Skihft-TicketBecause of their "intelligence", RFID labels can be used particularly for goods identification, for access security in a building complex or, for example, as a ski pass ticket
RFID-Labels unterliegen zusammen mit ihren zugehörigen Sende- und Empfangsstationen in der Regel strengen funktechnischen Regelungen, die z B für ihren Betrieb nur sehr eng
begrenzte Frequenzbander zulassen Ein solches für RFID-Labels gern gewähltes Frequenzband liegt z B 13 560 MHz, wobei die Breite dieses Bandes nur +/- 7 kHz betragtTogether with their associated sending and receiving stations, RFID labels are usually subject to strict radio regulations, which are very narrow, for example, for their operation Allow limited frequency bands Such a frequency band, which is often chosen for RFID labels, is eg 13 560 MHz, the width of this band being only +/- 7 kHz
In Bezug auf RFID-Labels der beschriebenen Ausbildung besteht nun die Schwierigkeit, die Resonanzfrequenz der Label insbesondere bei einer der grosstechnischen Herstellung genau in einem solch engen Bereich einzustellen und zu haltenWith regard to RFID labels of the described design, there is now the difficulty of setting and maintaining the resonance frequency of the labels precisely in such a narrow range, particularly in the case of large-scale production
STAND DER TECHNIKSTATE OF THE ART
Eine solche Vorπchtung ist in unterschiedlichen Ausgestaltungen aus dem Stand der Technik bekanntSuch a device is known in various configurations from the prior art
Im Sinne einer nachträglichen Korrektur einer nicht im gewünschten Frequenzbereich liegenden Resonanzfrequenz sind bereits verschiedene Methoden zum "Trimmen" der Resonanzfrequenz bekannt gewordenIn the sense of a subsequent correction of a resonance frequency that is not in the desired frequency range, various methods for “trimming” the resonance frequency have already become known
Ein solches bekanntes Trimmverfahren ist das z B Einkurzen eines Kondensators mit Hilfe eines Lasers (vergl die US-3,947,934) oder eines Stanz- oder Schneidwerkzeugs (vergl die WO 89/05984) Dadurch wird die Flache des Kondensators verkleinert und somit die Kapazität verringert Durch die Verringerung der Kapazität wird die Resonanzfrequenz des Schwingkreises beeinflusst und zwar in der Weise, dass die Resonanzfrequenz erhöht wirdSuch a known trimming method is, for example, shortening a capacitor with the aid of a laser (see US Pat. No. 3,947,934) or a punching or cutting tool (see WO 89/05984). This reduces the area of the capacitor and thus reduces the capacitance Reducing the capacitance affects the resonance frequency of the resonant circuit in such a way that the resonance frequency is increased
Eine weitere bekannte Technik ist das Einschmelzen der Kunsstoffolie zwischen den Kondensatorflachen Dabei wird die Distanz zwischen den Kondensatorplatten verkürzt, was eine Erhöhung der Kapazität des Kondensators bewirkt und somit eine Reduktion der Resonanzfrequenz des Schwingkreises hervorruftAnother known technique is the melting of the plastic film between the capacitor surfaces. The distance between the capacitor plates is shortened, which causes an increase in the capacitance of the capacitor and thus a reduction in the resonant frequency of the resonant circuit
Beide bekannten Techniken haben verschiedene Nachteile Beispielsweise ist der Einsatz von teuren Prazisionsmaschinen notig, welche den Herstellungsprozess von solchen Labein wesentlich verteuern Ferner besteht die Gefahr der Oberflachenverletzung beim Zuschneiden der Kondensatorplatten auf der Folie Auch sind die bekannten Techniken nicht ohne weiteres mit der erforderlichen Gewindigkeit bei der Serienproduktion der Label in einem Endlos-Durchlaufprozess ausfuhrbar
DARSTELLUNG DER ERFINDUNGBoth known techniques have different disadvantages.For example, the use of expensive precision machines is necessary, which significantly increases the cost of the production of such labein. Furthermore, there is a risk of surface damage when cutting the capacitor plates on the film. Also, the known techniques are not readily available with the required threading Series production of the labels can be carried out in a continuous process PRESENTATION OF THE INVENTION
Es ist daher die Aufgabe der Erfindung, anzugeben, wie die Resonanzfrequenz von RFID- Labeln auch noch angepasst werden kann so dass sie anschliessend in einem bestimmten Frequenzband liegt Zudem soll dies maschinell einfacher und somit wirtschaftlicher als die bekannten Techniken seinIt is therefore the object of the invention to specify how the resonance frequency of RFID labels can also be adapted so that it subsequently lies in a specific frequency band. In addition, this should be easier in terms of machine and therefore more economical than the known techniques
Diese Aufgabe wird dadurch gelost, dass das Label mit einem auf seine Oberflache nachträglich aufgebrachten zusatzlichen Element versehen wird, welches die Resonanzfrequenz des Schwingkreises verändert und in den gewünschten Bereich bringtThis task is solved in that the label is provided with an additional element subsequently applied to its surface, which changes the resonance frequency of the resonant circuit and brings it into the desired range
Die sich durch die Erfindung ergebenden Vorteile sind insbesondere dann zu sehen, dass als zusätzliches Element einfach ein Aufkleber mit einer leitenden Schicht oder ein Auftrag aus einer Masse mit hoher Dielektrizitätskonstante verwendet werden kann, deren Flache und/oder Material die gewünschte Korrektur der Resonanzfrequenz bewirken und die auch grosstechnisch sehr einfach und genau sowie bei hoher Produktionsgeschwindigkeit auf die ansonsten bereits feπtg ausgebildten Label applizierbar sindThe advantages resulting from the invention can be seen in particular that a sticker with a conductive layer or an application from a mass with a high dielectric constant can be used as an additional element, the area and / or material of which bring about the desired correction of the resonance frequency and which are also technically very simple and precise and can be applied at high production speeds to the otherwise already well-formed labels
Auch kann auf die erfindungsgemasse Art das Ausmass der durch das zusätzliche Element bewirkten Frequenzanderung im Vergleich mit den vorerwähnten bekannten Trimmverfahren absolut grosser gewählt werden, wodurch die erzielbare Genauigkeit der Frequenzeinstellung erhöht istIn the manner according to the invention, the extent of the frequency change brought about by the additional element can also be chosen to be absolutely larger in comparison with the aforementioned known trimming methods, as a result of which the achievable accuracy of the frequency setting is increased
Gemass einer bevorzugten Ausfuhrungsart ist ein Aufkleber mit einer leitenden Schicht und einer Klebeschicht zwecks Erhöhung der wirksamen Kapazität des Schwingkreises in wenigstens teilweiser Uberdeckung mit wenigstens zwei leitenden Flachen mit unterschiedlichem Potential, welche auf derselben Substratseite liegen, angebracht Er kann dabei auf der gleichen Substratseite wie diese leitenden Flachen quasi unmittelbar auf Ihnen aufgebracht sein, wobei z B nur die Klebeschicht als isolierende sowie als dielektrische Schicht wirkt Er kann andererseits aber auch auf der gegenüberliegenden Substratseite angebracht sein, wobei zusatzlich das Substrat isolierend sowie als Dielektrikum wirkt Besonders wirksam ist der Aufkleber wenn als leitende Flachen, auf die er aufgebracht wird solche gewählt werden die zumindest annähernd auf dem Potential der beiden
Kondensatorplatten liegen Üblicherweise sind dies diejenigen Flachen, die auch für die Kontaktierung des Halbleiterschaltkreises verwendet sindAccording to a preferred embodiment, a sticker with a conductive layer and an adhesive layer is used to increase the effective capacity of the resonant circuit in at least partial coverage with at least two conductive surfaces with different potential, which are on the same side of the substrate.It can be on the same side of the substrate as this conductive surfaces can be applied directly to you, e.g. only the adhesive layer acts as an insulating and as a dielectric layer.On the other hand, it can also be attached to the opposite side of the substrate, with the substrate additionally acting as an insulating and as a dielectric conductive surfaces to which it is applied are chosen at least approximately at the potential of the two Capacitor plates are usually those areas that are also used for contacting the semiconductor circuit
Grundsätzlich konnte ein Aufkleber auch mit einer leitenden Flache auf einer Substratseite leitend verbunden werden und im übrigen so angeordnet werden, dass er mit einer anderen leitenden Flache auf der gegenüberliegenden Substratseite in wenigstens teilweiser Uberdeckung ist Auch hierdurch ergibt sich eine Kapazitatserhohung, vorausgesetzt, die entsprechenden leitenden Flachen befinden sich nicht auf demselben elektrischen PotentialIn principle, a sticker could also be conductively connected to a conductive area on one side of the substrate and otherwise arranged such that it is at least partially covered with another conductive area on the opposite side of the substrate.This also results in an increase in capacitance, provided the corresponding conductive area Surfaces are not at the same electrical potential
In einer anderen bevorzugten Ausfuhrungsform ist ein Aufkleber mit einer leitenden Schicht im Bereich innerhalb der Spule angebracht zwecks einer Erniedrigung der wirksamen Induktivität des Schwingkreises Hierdurch wird das Magnetfeld innerhalb der Spule beeinflusst, und zwar so, dass die Induktivität herabgesetzt ist und daraus eine gewünschte Frequenzerhohung resultiert Besonders wirksam ist diese Massnahme, wenn der Aufkleber innerhalb der Spule versetzt gegenüber deren Zentrum angeordnet wird, weil hier der Magnetfluss dichter ist als im ZentrumIn another preferred embodiment, a sticker with a conductive layer is applied in the area within the coil for the purpose of lowering the effective inductance of the resonant circuit. The magnetic field within the coil is influenced in this way in such a way that the inductance is reduced and a desired frequency increase results therefrom This measure is particularly effective if the sticker is offset within the coil from its center because the magnetic flux is denser here than in the center
Anstelle oder zusätzlich zu einem Aufkleber kann als zusätzliches Element nach der Erfindung auch ein lokaler Auftrag aus einer zunächst flussigen oder pasteusen, spater trocknenden oder aushärtenden Masse, welche eine hohe Dielektπzitatkonstante aufweist, vorgenommen werden, wobei der lokale Auftrag dieser Masse in dem Zwischenraum zwischen zwei leitenden Flachen mit unterschiedlichem elektrischen Potential anzuordnen ist Durch einen solchen Auftrag wird ein zusatzliches Dielektrikum zwischen den Leitern geschaffen, welches eine Kapazitatserhohung und damit eine Frequenzerniedrigung des Schwingkreises zur Folge hat Die Paste ist leicht zwischen den beiden Leitern anzubringen Zusätzlich kann das Dielektrikum der Paste je nach der gewünschten Frequenzanpassung eingestellt werdenInstead of or in addition to a sticker, as an additional element according to the invention, a local application can be carried out from an initially liquid or pasteous, later drying or hardening composition which has a high dielectric constant, the local application of this composition in the space between two Such an order creates an additional dielectric between the conductors, which leads to an increase in capacitance and thus a lowering of the frequency of the resonant circuit. The paste is easy to apply between the two conductors. In addition, the dielectric of the paste can vary depending on the desired frequency adjustment
Weitere Ausfuhrungsformen ergeben sich aus den abhangigen Ansprüchen sowie der nachfolgenden Beschreibung von AusfuhrungsbeispielenFurther embodiments result from the dependent claims and the following description of exemplary embodiments
KURZE ERLÄUTERUNG DER FIGURENBRIEF EXPLANATION OF THE FIGURES
Die Erfindung soll nachfolgend anhand von Ausfuhrungsbeispielen im Zusammenhang mit der Zeichnung naher erläutert werden Es zeigen
Fig 1 eine Aufsicht auf einen RFID Label mit einem zusätzlich angebrachten Aufkleber,The invention will be explained in more detail below with reference to exemplary embodiments in connection with the drawing 1 shows a top view of an RFID label with an additionally attached sticker,
Fig 2 eine Aufsicht auf einen RFID Label mit einem Aufkleber innerhalb der Spule,2 shows a top view of an RFID label with a sticker inside the coil,
Fig 3 jeweils im Schnitt unter A) - C) verschiedene Arten, wie solche Aufkleber angeordnet werden können, und Fig 4 ebenfalls im Schnitt eine Alternativlosung mit einem zusatzlich aufgebrachten lokalen Auftrag aus einem Material mit hoher Dielektrizitätskonstante3 each in section under A) - C) different ways in which such stickers can be arranged, and FIG. 4 also in section an alternative solution with an additionally applied local application made of a material with a high dielectric constant
WEGE ZUR AUSFUHRUNG DER ERFINDUNGWAYS OF CARRYING OUT THE INVENTION
In Fig 1 ist mit 1 eine Kunststoffolie bezeichnet, welche z B aus Polyester besteht, und die beidseitig mit leitenden Flachen, vorzugsweise aus Aluminium, versehen ist Von den leitenden Flachen sind zwei zueinander parallele Leiterbahnen 2 und 3, eine Spule 4, eine erste Eckflache 5, eine erste Kontaktflache 6 sowie ein Verbindungstuck 7 auf der Substrat- Vorderseite angeordnet Die stπchliert ausgeführten dieser Leiterbahnen 8 und 9 sind demgegenüber auf der Substrat-Ruckseite angeordnet Auf der Substrat-Ruckseite ist, im wesentlichen deckungsgleich mit der ersten Eckflache 5, auch noch eine zweite Eckflache 5' und im wesentlichen deckungsgleich mit der ersten Kontaktflache 6 auch noch eine zweite Kontaktflache 6' ausgebildet Zwischen der ersten 5 und der zweiten Eckflache 5' ist mittels einer sogenannten Verkπmpung eine erste Durchkontaktierung 9 vorhanden Eine weitere solche Durchkontaktierung 10 ist auch zwischen den beiden Kontaktflachen 6 und 6' vorhandenIn Fig. 1, 1 denotes a plastic film which, for example, consists of polyester and which is provided on both sides with conductive surfaces, preferably made of aluminum. Of the conductive surfaces are two mutually parallel conductor tracks 2 and 3, a coil 4, a first corner surface 5, a first contact surface 6 and a connecting piece 7 are arranged on the front side of the substrate. In contrast, the stippled conductors 8 and 9 are arranged on the rear side of the substrate. On the rear side of the substrate, essentially congruent with the first corner surface 5, is also still a second corner surface 5 'and essentially congruent with the first contact surface 6, also a second contact surface 6' is formed between the first 5 and the second corner surface 5 'by means of a so-called compression, a first via 9 is provided. Another such via 10 is also between the two contact surfaces 6 and 6 '
Die Spule 4 ist mit ihrem einen Ende mit der Leiterbahn 3 verbunden und mundet mit ihrem anderen Ende in die erste Eckflache 5 Von dort lauft die elektrische Verbindung weiter über die Durchkontaktierung 9 auf die zweite Eckfache 5', über die Leiterbahn 8 zur weiteren Kontaktflache 6' und von dort zur Leiterbahn 14 Im Bereich ihrer freien Enden uberkreuzen sich die Leiterbahnen 3 und 14 auf unterschiedlichen Substratseiten und bilden dort die Platten eines Kondensators 11 Dieser wiederum bildet zusammen mit der Spule 4 einen SchwingkreisThe coil 4 is connected at one end to the conductor track 3 and ends at the other end into the first corner surface 5. From there, the electrical connection continues via the via 9 to the second corner compartment 5 ', via the conductor track 8 to the further contact surface 6 'and from there to the conductor track 14, in the region of their free ends, the conductor tracks 3 and 14 cross over on different substrate sides and there form the plates of a capacitor 11, which in turn forms an oscillating circuit together with the coil 4
Über die Durchkontaktierung 10 und das Verbindungsstuck 7 ist die auf der Substrat- Ruckseite befindliche Leiterbahn 14 und damit die hintere Kondensatorplatte mit der auf der Substrat-Vorderseite befindlichen Leiterbahn 2 verbunden die demnach ebenfalls das Potential der hinteren Kondensatorplatte aufweist Demgegenüber weist die Leiterbahn 3 das
Potential der vorderen Kondensatorplatte auf Mit den beiden Leiterbahnen 2 und 3 verbunden und damit mit der Spannung des Kondensators 11 beaufschlagt ist ein Halbleiterschaltkreis bzw Chip 12Via the via 10 and the connector 7, the conductor 14 located on the back of the substrate and thus the rear capacitor plate is connected to the conductor 2 located on the front of the substrate, which accordingly also has the potential of the rear capacitor plate. In contrast, the conductor 3 has this Potential of the front capacitor plate is connected to the two conductor tracks 2 and 3 and thus applied to the voltage of the capacitor 11 is a semiconductor circuit or chip 12
Das in Fig 1 dargestellte RFID-Label ist auch noch getrimmt und zwar durch einen Aufkleber 13, der in teilweiser Uberdeckung mit den Flachen 2 und 3 aufgeklebt ist Die Flachen 2 und 3 sind hierzu extra ausreichend lang ausgebildet Der Aufkleber 13 weist eine mit einer Klebeschicht 16 versehene leitende Schicht 15 z B aus Alumininum auf (vergl Fig 3 A oder B) und bewirkt, abhangig von der Grosse der leitenden Schicht bzw ihrer Uberdeckung mit den leitenden Flachen 2 und 3 des Labels, lokal eine zusatzliche Kapazität, welche die Kapazität des Schwingkreises erhöht Dies wiederum hat eine Frequenzerniedrigung des Schwingkreises 1 zur FolgeThe RFID label shown in FIG. 1 is also trimmed by a sticker 13 which is partially covered with the surfaces 2 and 3. The surfaces 2 and 3 are designed to be of sufficient length for this purpose. The sticker 13 has one with an adhesive layer 16 provided conductive layer 15 z made of aluminum (see FIG. 3 A or B) and, depending on the size of the conductive layer or its overlap with the conductive surfaces 2 and 3 of the label, locally causes an additional capacitance, which the capacitance of the Oscillating circuit increased This in turn results in a lowering of the frequency of the oscillating circuit 1
Das Tπmmen des Schwingkreises mit dem Aufkleber 13 kann grundsätzlich nach Herstellung der Labels als solchem erfolgen, wobei zuerst die Ist- Frequenz des Schwingkreises ermittelt wird, beispielsweise durch Frequenzmesszellen Die Ist-Frequenz wird dann mit einer vorgegeben Soll-Frequenz verglichen und ein Korrekturfaktor wird daraus bestimmt Anhand dieses Korrekturfaktors wird die Grosse des Aufklebers 13 gewählt,The resonance circuit with the sticker 13 can in principle be made after the labels have been produced as such, the actual frequency of the resonance circuit first being determined, for example by frequency measuring cells. The actual frequency is then compared with a predetermined target frequency and a correction factor is derived therefrom The size of the sticker 13 is selected on the basis of this correction factor,
Der Aufkleber 13 kann entweder direkt auf den beiden leitenden Flachen 2 oder 3 aufgebracht werden, wobei nur seine Klebeschicht isolierend gegenüber diesen Flachen sowie als Dielektikum wirkt oder er kann auf der gegenüberliegenden Substratseite aufgebracht werden, wobei das Substrat zusätzlich isoliert und ein Dielektrikum bildetThe sticker 13 can either be applied directly to the two conductive surfaces 2 or 3, with only its adhesive layer acting as an insulation against these surfaces and as a dielectric, or it can be applied to the opposite side of the substrate, the substrate being additionally insulated and forming a dielectric
In Fig 2 ist eine weitere Möglichkeit einer Frequenzanpassung des Schwingkreises 1 dargestellt Ein Aufkleber 21 mit einer leitenden, z B wieder aus Aluminium bestehenden Schicht ist hier ohne Uberdeckung mit einer der leitenden Flachen einfach irgendwo auf einer freien Flache innerhalb der Spule 4 aufgebracht Durch den Aufkleber 21 wird das Magnetfeld innerhalb der Spule 4 verändert Genauer wird durch den Aufkleber 21 die Induktivität L der Spule verringert Auf die Resonanzfrequenz des Schwingkreises 1 wirkt sich dies erhöhend aus Der Aufkleber 21 ist vorzugsweise zum Spulenzentrum versetzt anzubringen, da die Auswirkung auf den Magnetfluss in diesem Falle grosser ist, als als im Zentrum der Spule 4
Fig 3 zeigt unter A und B im Schnitt die beiden bereits beschriebenen Möglichkeiten, einen Aufkleber 13 kapazitatserhohend in wenistens teilweise Uberdeckung mit zwei Leiterbahnen 2 und 3 anzubringen, wobei Bild A dem Schnitt l-l von Fig 1 entspricht und den Aufkleber 13 auf der Substrat-Vorderseite, d h auf derselben Seite, wie die beiden Leiterbahnen 2 und 3 zeigt Mit 15 ist die leitende Schicht des Aufklebers 13 bezeichnet und mit 16 seine isolierende Klebeschicht Bild B zeigt den Aufkleber 13 auf der Substrat Ruckseite, den Leiterbahnen 2 und 3 gegenüber Da das Substrat hier zusatzlich isolierend wirkt, konnte der Aufkleber 13 auch direkt auf die Kunststoffolie 1 ohne die Klebschicht 16 aufgebracht werden, z B durch eine HeissiegelungFIG. 2 shows another possibility of frequency adaptation of the resonant circuit 1. A sticker 21 with a conductive layer, for example made of aluminum, is simply applied here somewhere on a free area inside the coil 4 without being covered by one of the conductive surfaces 21, the magnetic field within the coil 4 is changed. More specifically, the inductance L of the coil is reduced by the sticker 21. This has an increasing effect on the resonance frequency of the resonant circuit 1. The sticker 21 should preferably be attached to the coil center, since the effect on the magnetic flux in it Case is larger than than in the center of the coil 4 3 shows, under A and B in section, the two possibilities already described for attaching a sticker 13 to increase capacity in at least partially overlap with two conductor tracks 2 and 3, picture A corresponding to section II of FIG. 1 and sticker 13 on the front side of the substrate , ie on the same side as the two conductor tracks 2 and 3 shows 15 denotes the conductive layer of the sticker 13 and 16 its insulating adhesive layer Figure B shows the sticker 13 on the back of the substrate, the conductor tracks 2 and 3 opposite since the substrate here also has an insulating effect, the sticker 13 could also be applied directly to the plastic film 1 without the adhesive layer 16, for example by a heat seal
Im Schnitt C ist ein Aufkleber 17 mit einer leitenden Schicht 18 und einer leitenden Klebeschicht 19 mit einer ersten leitenden Flache auf derselben Substratseite leitend und mit einer weiteren leitenden Flache, die auf der gegenüberliegenden Substratseite angeordnet und auf unterschiedlichem Potential, wie die erste Flache liegt, in wengistens teilweise Uberdeckung gebracht Es versteht sich, dass auch in diesem Fall der Aufkleber 17 eine zusätzliche Kapazität zwischen den beiden dargestellten leitenden Flachen bewirktIn section C, a sticker 17 with a conductive layer 18 and a conductive adhesive layer 19 with a first conductive surface on the same substrate side is conductive and with a further conductive surface which is arranged on the opposite side of the substrate and has a different potential than the first surface, partially overlapped. Of course, in this case too, the sticker 17 brings about an additional capacitance between the two conductive surfaces shown
In Fig 4 ist ein lokaler Auftrag 20 zwischen zwei leitenden Flachen mit unterschiedlichem Potential auf derselben Substratseite gezeigt Der lokale Auftrag 20 ist hergestellt aus einer z B flussig aufgebrachten Masse mit einer hohen Dielektπzitazskonstant ε , vorzugsweise im Bereich von εr 2 - 10, wobei diese Masse sich spater verfestigt und/oder trocknet und/oder aushärtet Der Auftrag bewirkt durch die hohe Dielektrizitätskonstante der verwendeten Masse wie die vorbeschriebenen Aufkleber eine lokale Kapazitatserhohung zwischen den beiden Leiterbahnen, die die Gesamtkapazitat des Schwingkreises erhöht und sich erniedrigend auf dessen Resonanzfrequenz auswirkt Es versteht sich, dass das Ausmass der Kapazitatsanderung hier vor allem durch die Lange des Auftrags 20 entlang der beiden Leiterbahnen bestimmt wird4 shows a local application 20 between two conductive surfaces with different potential on the same substrate side. The local application 20 is made from a liquid, for example, applied mass with a high dielectric constant ε, preferably in the range of ε r 2-10, whereby these The mass solidifies later and / or dries and / or hardens. Due to the high dielectric constant of the mass used, like the stickers described above, the application causes a local increase in capacitance between the two conductor tracks, which increases the overall capacitance of the resonant circuit and has a negative effect on its resonance frequency that the extent of the change in capacity here is primarily determined by the length of the order 20 along the two conductor tracks
Was das Ausmass der Kapazitatsanderung anbetrifft, so hangt diese grundsätzlich auch noch von der Position ab, die für den Aufkleber bzw den lokalen Auftrag gewählt wird Am ausgeprägtesten ist sie, wenn die leitenden Flachen, mit denen der Aufkleber in wenigstens teilweise Uberdeckung gebracht wird, oder zwischen denen der Auftrag angebracht wird, auf möglichst unterschiedlichem Potential liegen Bei einem RFID-Label der hier betrachteten Art entsteht die grosste Potentialdifferenz zwischen den Platten des Schwingkreiskondensators
1 1 Aus diesem Grund ist der Aufkleber 13 von Fig 1 auch quer über den beiden Leiterbahnen 2 und 3 appliziert, die diese maximale Potentialdifferenz aufweisenAs far as the extent of the change in capacity is concerned, it basically also depends on the position that is selected for the sticker or the local order. It is most pronounced if the conductive surfaces with which the sticker is at least partially covered, or The potential between which the order is placed is as different as possible. With an RFID label of the type considered here, the greatest potential difference arises between the plates of the resonant circuit capacitor For this reason, the sticker 13 from FIG. 1 is also applied across the two conductor tracks 2 and 3, which have this maximum potential difference
Andererseits kann es auch vorteilt sein, einen Aufkleber bzw Auftrag in einem Bereich des Labels aufzubringen, auf dem er weniger wirksam ist, wie z B irgendwo zwischen zwei Spulenwindungen, den Aufkleber bzw den Auftrag zum Ausgleich dafür grosser oder langer zu machen Auf diese Weise kann eine die gewünschte Frequenztnmmung ggf sogar noch exakter und mit "gröberen" Mitteln erreicht werden Die gleichen Überlegungen bestimmen auch mit, auf welcher Substratseite ein Aufkleber am besten zu plazieren ist
On the other hand, it can also be advantageous to apply a sticker or order in an area of the label on which it is less effective, such as somewhere between two coil turns, to make the sticker or the order larger or longer in order to compensate for it the desired frequency resolution can be achieved even more precisely and with "coarser" means. The same considerations also determine on which side of the substrate a sticker is best to be placed
BEZEICHNUNGSLISTENAME LIST
1 Kunststoffolie1 plastic film
2 Leiterbahnen2 conductor tracks
3 Leiterbahnen3 conductor tracks
4 Spule4 spool
5 erste Eckfläche5 first corner surface
5' zweite Eckfläche5 'second corner surface
6 Kontaktfläche6 contact surface
6' Kontaktfläche6 'contact surface
7 Verbindungstück7 connecting piece
8 Leitebahn8 runway
9 Durchkontaktierung9 plated-through holes
10 Durchkontaktierung10 plated-through holes
1 1 Kondensator1 1 capacitor
12 Chip12 chip
13 Aufkleber13 stickers
14 Leiterbahn14 conductor track
15 leitende Schicht15 conductive layer
16 isolierende Klebeschicht16 insulating adhesive layer
17 Aufkleber17 stickers
18 leitenden Schicht18 conductive layer
19 leitenden Klebeschicht19 conductive adhesive layer
20 lokaler Auftrag20 local order
21 Aufkleber
21 stickers
Claims
PATENTANSPRÜCHE
1 RFID-Label mit einem Substrat aus einer Kunststoffolie und mit leitenden Flachen auf der Vorder- und der Ruckseite des Substrats, wobei die leitenden Flachen unter anderem einen elektrischen Schwingkreis bilden, welcher eine Spule (4) mit mindestens eine Spulenwindung und einen Kondensator mit einer ersten Kondensatorplatte auf der Substrat- Vorderseite und einer zweiten Kondensatorplatte auf der Substrat Ruckseite umfassen und wobei auf der Substrat-Vorderseite eine weitere leitende Flache (2) angeordnet ist, welche mit der zweiten Kondensatorplatte auf der Substrat-Ruckseite leitend verbunden ist, dadurch gekennzeichnet, αass es mit einem auf seine Oberflache nachtraglich aufgebrachten zusätzlichen Element (13, 17, 20, 21) versehen ist, welches die Resonanzfrequenz des Schwingkreises verändert1 RFID label with a substrate made of a plastic film and with conductive surfaces on the front and back of the substrate, the conductive surfaces forming, among other things, an electrical resonant circuit which has a coil (4) with at least one coil turn and a capacitor with a comprise a first capacitor plate on the front side of the substrate and a second capacitor plate on the rear side of the substrate and a further conductive surface (2) is arranged on the front side of the substrate, which is conductively connected to the second capacitor plate on the back side of the substrate, characterized in that αass that it is provided with an additional element (13, 17, 20, 21) which is applied to its surface and which changes the resonance frequency of the resonant circuit
2 RFID-Label nach Anspruch 1 , dadurch gekennzeichnet, dass es mit einem Aufkleber (13) mit einer metallisch leitenden Schicht, vorzugsweise aus Aluminium, versehen2 RFID label according to claim 1, characterized in that it is provided with a sticker (13) with a metallic conductive layer, preferably made of aluminum
3 RFID-Label nach Anspruch 2, dadurch gekennzeichnet, dass der Aufkleber (13) zwecks Erhöhung der wirksamen Kapazität des Schwingkreises in wenigstens teilweiser Uberdeckung mit mindestens zwei auf derselben Substratseite nebeneinander angeordneten leitenden Flachen aufgebracht ist3 RFID label according to claim 2, characterized in that the sticker (13) is applied in order to increase the effective capacity of the resonant circuit in at least partial coverage with at least two conductive surfaces arranged side by side on the same substrate side
4 RFID-Label nach einem der Ansprüche 2 oder 3, dadurch gekennzeichnet, dass der Aufkleber (13) zwecks Erhöhung der wirksamen Kapazität des Schwingkreises in wenigstens teilweiser Uberdeckung mit der weiteren leitenden Flache sowie einer leitenden Flache angeordnet ist, die sich im wesentlichen auf demselben elektrischen Potential wie die erste Kondensatorplatte befindet4 RFID label according to one of claims 2 or 3, characterized in that the sticker (13) is arranged in order to increase the effective capacity of the resonant circuit in at least partial coverage with the further conductive surface and a conductive surface, which is essentially on the same electrical potential is located like the first capacitor plate
5 RFID-Label nach einem der Ansprüche 3 oder 4, dadurch gekennzeichnet, dass der Aufkleber (13) auf derselben Substratseite wie die leitenden Flachen aufgebracht ist, mit denen er zusammenwirkt, und zwar vorzugsweise mit einer isolierenden Klebeschicht (16) direkt auf diesen leitenden Flachen
6 RFID-Label nach einem der Ansprüche 3 - 5, dadurch gekennzeichnet, dass der Aufkleber (13) auf der gegenüberliegenden Substratseite wie die leitenden Flachen aufgebracht ist, mit denen er zusammenwirkt5 RFID label according to one of claims 3 or 4, characterized in that the sticker (13) is applied to the same substrate side as the conductive surfaces with which it cooperates, preferably with an insulating adhesive layer (16) directly on this flat 6 RFID label according to one of claims 3-5, characterized in that the sticker (13) is applied on the opposite side of the substrate as the conductive surfaces with which it cooperates
7 RFID-Label nach einem der Ansprüche 3 - 6, dadurch gekennzeichnet, dass der Aufkleber (17) mit einer leitenden Flache auf einer Substratseite leitend verbunden und werden und im übrigen so angeordnet ist, dass er mit einer anderen leitenden und sich auf einem unterschiedlichen Potential befindlichen Flache auf der gegenüberliegenden Substratseite in wenigstens teilweiser Uberdeckung ist7 RFID label according to one of claims 3 - 6, characterized in that the sticker (17) with a conductive surface on a substrate side and are conductively connected and is otherwise arranged so that it with another conductive and on a different Potential area on the opposite side of the substrate is at least partially covered
8 RFID-Label nach einem der Ansprüche 2 - 7, dadurch gekennzeichnet, dass der Aufkleber (21 ) zwecks Erniedrigung der wirksamen Induktivität des Schwingkreises wenigstens teilweise in einem Bereich innerhalb der Spule (4) aufgebracht ist8 RFID label according to one of claims 2-7, characterized in that the sticker (21) for the purpose of lowering the effective inductance of the resonant circuit is at least partially applied in an area within the coil (4)
9 RFID-Label nach Anspruch 8, dadurch gekennzeichnet, dass der Bereich innerhalb der Spule (4) ein Zentrum aufweist und dass der Aufkleber (21 ) gegenüber diesem Zentrum versetzt aufgebracht ist9 RFID label according to claim 8, characterized in that the area within the coil (4) has a center and that the sticker (21) is applied offset from this center
10 RFID-Label nach einem der Ansprüche 1 - 9, dadurch gekennzeichnet, dass es mit einem lokalen Auftrag (20) einer Masse versehen ist, welche eine hohe Dielektrizitätskonstante, vorzugsweise im Bereich zwischen εr 2 und 10 aufweist, wobei der lokale Auftrag (20) einen Zwischenraum zwischen zwei auf derselben Substratseite angeordneten, sich auf unterschiedlichem elektrischem Potential befindlichen leitenden Flachen überbrückt10 RFID label according to one of claims 1-9, characterized in that it is provided with a local application (20) of a mass which has a high dielectric constant, preferably in the range between ε r 2 and 10, the local application ( 20) bridges a gap between two conductive surfaces arranged on the same substrate side and at different electrical potentials
11 RFID-Label nach Anspruch 10, dadurch gekennzeichnet, dass die Masse in einem flussigen oder pasteusen Zustand auftragbar ist und sich danach verfestigt und/oder trocknet und/oder aushärtet11 RFID label according to claim 10, characterized in that the mass can be applied in a liquid or paste-like state and then solidifies and / or dries and / or hardens
12 RFID-Label nach einem der Ansprüche 10 oder 1 1 , dadurch gekennzeichnet, dass der lokale Auftrag (20) einen Zwischenraum zwischen der weiteren leitenden Flache sowie einer leitenden Flache überbrückt, die sich im wesentlichen auf demselben elektrischen Potential wie die erste Kondensatorplatte befindet
13 RFID-Label nach einem der Ansprüche 1 - 12, dadurch gekennzeichnet, dass es mit einem integrierten Halbleiterschaltkreis in Form eines Miniatur-Chips (12) versehen ist, wobei dessen elektrische Anschlüsse vorzugsweise mit einerseits der weiteren leitenden Flache sowie andererseits mit einer leitenden Flache verbunden sind, die sich im wesentlichen auf demselben elektrischen Potential wie die erste Kondensatorplatte befindet
12 RFID label according to one of claims 10 or 1 1, characterized in that the local order (20) bridges a gap between the further conductive surface and a conductive surface which is essentially at the same electrical potential as the first capacitor plate 13 RFID label according to one of claims 1 - 12, characterized in that it is provided with an integrated semiconductor circuit in the form of a miniature chip (12), the electrical connections of which are preferably connected on the one hand to the further conductive surface and on the other hand to a conductive surface are connected, which is essentially at the same electrical potential as the first capacitor plate
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH594002000 | 2000-03-28 | ||
CH5942000 | 2000-03-28 | ||
PCT/CH2001/000085 WO2001073685A1 (en) | 2000-03-28 | 2001-02-07 | Rfid label with an element for regulating the resonance frequency |
Publications (1)
Publication Number | Publication Date |
---|---|
EP1269412A1 true EP1269412A1 (en) | 2003-01-02 |
Family
ID=4522316
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01962432A Withdrawn EP1269412A1 (en) | 2000-03-28 | 2001-02-07 | Rfid label with an element for regulating the resonance frequency |
Country Status (4)
Country | Link |
---|---|
US (1) | US6796508B2 (en) |
EP (1) | EP1269412A1 (en) |
JP (1) | JP2003529163A (en) |
WO (1) | WO2001073685A1 (en) |
Families Citing this family (114)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
KR101050837B1 (en) * | 2002-08-13 | 2011-07-21 | 삼성테크윈 주식회사 | Smart label |
KR100919984B1 (en) * | 2002-10-18 | 2009-10-05 | 삼성테크윈 주식회사 | Smart label |
US7224280B2 (en) * | 2002-12-31 | 2007-05-29 | Avery Dennison Corporation | RFID device and method of forming |
US6940408B2 (en) * | 2002-12-31 | 2005-09-06 | Avery Dennison Corporation | RFID device and method of forming |
CA2532342A1 (en) * | 2003-07-17 | 2005-01-27 | Honda Motor Co., Ltd. | Ic card and information storage/transmission system |
US20060044769A1 (en) * | 2004-09-01 | 2006-03-02 | Forster Ian J | RFID device with magnetic coupling |
US7158033B2 (en) * | 2004-09-01 | 2007-01-02 | Avery Dennison Corporation | RFID device with combined reactive coupler |
US7500307B2 (en) | 2004-09-22 | 2009-03-10 | Avery Dennison Corporation | High-speed RFID circuit placement method |
US7253734B2 (en) * | 2004-09-22 | 2007-08-07 | International Business Machines Corporation | System and method for altering or disabling RFID tags |
US7277016B2 (en) * | 2004-09-22 | 2007-10-02 | International Business Machines Corporation | System and method for disabling RFID tags |
US7614556B2 (en) * | 2004-11-05 | 2009-11-10 | Goliath Solutions, Llc | Distributed RFID antenna array utilizing circular polarized helical antennas |
US20060109125A1 (en) * | 2004-11-08 | 2006-05-25 | Goliath Solutions Llc. | System for RF detection and location determination of merchandising materials in retail environments |
US7535337B2 (en) * | 2004-11-18 | 2009-05-19 | Goliath Solutions, Llc | Systems and methods for monitoring open stock merchandising |
US20070071131A1 (en) * | 2004-11-18 | 2007-03-29 | Pyne John W | Switched phase receiver for a long range RFID system |
AU2005307767A1 (en) * | 2004-11-19 | 2006-05-26 | Goliath Solutions L.L.C. | Low stock alert system |
US7170415B2 (en) * | 2004-12-01 | 2007-01-30 | Avery Dennison Corporation | RFID tags with modifiable operating parameters |
US7355516B2 (en) * | 2004-12-23 | 2008-04-08 | Checkpoint Systems, Inc. | Method and apparatus for protecting culinary products |
US7696883B2 (en) * | 2005-01-17 | 2010-04-13 | Canon Kabushiki Kaisha | Resonance tag, method of reversibly changing resonance characteristics of resonance circuit, and capacitive element |
US7623034B2 (en) | 2005-04-25 | 2009-11-24 | Avery Dennison Corporation | High-speed RFID circuit placement method and device |
WO2006130988A1 (en) * | 2005-06-10 | 2006-12-14 | Telecommunications Research Laboratories | Wireless communication system |
GB2429111A (en) * | 2005-08-10 | 2007-02-14 | Nicholas Jim Stone | Electronic tag |
US7555826B2 (en) | 2005-12-22 | 2009-07-07 | Avery Dennison Corporation | Method of manufacturing RFID devices |
US7519328B2 (en) | 2006-01-19 | 2009-04-14 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
JP5105290B2 (en) * | 2006-04-03 | 2012-12-26 | 株式会社ユニバーサルエンターテインメント | Wireless IC tag |
EP3168932B1 (en) | 2006-04-14 | 2021-06-02 | Murata Manufacturing Co., Ltd. | Antenna |
US9064198B2 (en) | 2006-04-26 | 2015-06-23 | Murata Manufacturing Co., Ltd. | Electromagnetic-coupling-module-attached article |
JP4281850B2 (en) | 2006-06-30 | 2009-06-17 | 株式会社村田製作所 | optical disk |
WO2008050535A1 (en) | 2006-09-26 | 2008-05-02 | Murata Manufacturing Co., Ltd. | Electromagnetically coupled module and article with electromagnetically coupled module |
JP4888494B2 (en) | 2007-02-06 | 2012-02-29 | 株式会社村田製作所 | Packaging material with electromagnetic coupling module |
EP2133827B1 (en) | 2007-04-06 | 2012-04-25 | Murata Manufacturing Co. Ltd. | Radio ic device |
US8009101B2 (en) * | 2007-04-06 | 2011-08-30 | Murata Manufacturing Co., Ltd. | Wireless IC device |
JP4697332B2 (en) | 2007-04-09 | 2011-06-08 | 株式会社村田製作所 | Wireless IC device |
US8235299B2 (en) | 2007-07-04 | 2012-08-07 | Murata Manufacturing Co., Ltd. | Wireless IC device and component for wireless IC device |
EP2138962B1 (en) * | 2007-04-26 | 2012-01-04 | Murata Manufacturing Co. Ltd. | Wireless ic device |
WO2008136220A1 (en) | 2007-04-27 | 2008-11-13 | Murata Manufacturing Co., Ltd. | Wireless ic device |
CN101601056B (en) | 2007-04-27 | 2012-05-23 | 株式会社村田制作所 | Wireless ic device |
WO2008140037A1 (en) | 2007-05-11 | 2008-11-20 | Murata Manufacturing Co., Ltd. | Wireless ic device |
WO2009008296A1 (en) | 2007-07-09 | 2009-01-15 | Murata Manufacturing Co., Ltd. | Wireless ic device |
EP2166490B1 (en) | 2007-07-17 | 2015-04-01 | Murata Manufacturing Co. Ltd. | Wireless ic device and electronic apparatus |
JP5104865B2 (en) | 2007-07-18 | 2012-12-19 | 株式会社村田製作所 | Wireless IC device |
KR101006808B1 (en) * | 2007-07-18 | 2011-01-10 | 가부시키가이샤 무라타 세이사쿠쇼 | Wireless ic device |
WO2009011375A1 (en) | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | Wireless ic device and method for manufacturing the same |
US20090021352A1 (en) * | 2007-07-18 | 2009-01-22 | Murata Manufacturing Co., Ltd. | Radio frequency ic device and electronic apparatus |
DE102007052125A1 (en) | 2007-10-31 | 2009-05-07 | Siemens Aktiengesellschaft | Component e.g. printed circuit board, carrier testing system for use in microelectronics field, has communication interfaces assigned to communication units for displaying and/or processing component-specific data |
EP2408064B1 (en) | 2007-12-20 | 2020-08-05 | Murata Manufacturing Co., Ltd. | Wireless IC device |
WO2009081683A1 (en) | 2007-12-26 | 2009-07-02 | Murata Manufacturing Co., Ltd. | Antenna apparatus and wireless ic device |
US8115636B2 (en) | 2008-01-22 | 2012-02-14 | Avery Dennison Corporation | RFID tag with a reduced read range |
US9000925B2 (en) * | 2008-02-19 | 2015-04-07 | Avery Dennison Corporation | RFID tag with a releasable coupler |
JP4518211B2 (en) * | 2008-03-03 | 2010-08-04 | 株式会社村田製作所 | Compound antenna |
JP5267463B2 (en) | 2008-03-03 | 2013-08-21 | 株式会社村田製作所 | Wireless IC device and wireless communication system |
JP4404166B2 (en) | 2008-03-26 | 2010-01-27 | 株式会社村田製作所 | Wireless IC device |
WO2009128437A1 (en) * | 2008-04-14 | 2009-10-22 | 株式会社村田製作所 | Radio ic device, electronic device, and method for adjusting resonance frequency of radio ic device |
JP4609604B2 (en) | 2008-05-21 | 2011-01-12 | 株式会社村田製作所 | Wireless IC device |
WO2009142068A1 (en) * | 2008-05-22 | 2009-11-26 | 株式会社村田製作所 | Wireless ic device and method for manufacturing the same |
CN104077622B (en) | 2008-05-26 | 2016-07-06 | 株式会社村田制作所 | The authenticating method of wireless IC device system and Wireless IC device |
KR101148534B1 (en) | 2008-05-28 | 2012-05-21 | 가부시키가이샤 무라타 세이사쿠쇼 | Wireless ic device and component for a wireless ic device |
JP4557186B2 (en) * | 2008-06-25 | 2010-10-06 | 株式会社村田製作所 | Wireless IC device and manufacturing method thereof |
JP4671001B2 (en) * | 2008-07-04 | 2011-04-13 | 株式会社村田製作所 | Wireless IC device |
CN102124605A (en) * | 2008-08-19 | 2011-07-13 | 株式会社村田制作所 | Wireless IC device and method for manufacturing same |
WO2010047214A1 (en) | 2008-10-24 | 2010-04-29 | 株式会社村田製作所 | Radio ic device |
WO2010050361A1 (en) | 2008-10-29 | 2010-05-06 | 株式会社村田製作所 | Wireless ic device |
WO2010055945A1 (en) * | 2008-11-17 | 2010-05-20 | 株式会社村田製作所 | Antenna and wireless ic device |
WO2010079830A1 (en) | 2009-01-09 | 2010-07-15 | 株式会社村田製作所 | Wireless ic device, wireless ic module and wireless ic module manufacturing method |
JP5041077B2 (en) * | 2009-01-16 | 2012-10-03 | 株式会社村田製作所 | High frequency device and wireless IC device |
WO2010087429A1 (en) | 2009-01-30 | 2010-08-05 | 株式会社村田製作所 | Antenna and wireless ic device |
FR2944124B1 (en) * | 2009-04-03 | 2012-05-11 | Paragon Identification | RADIO FREQUENCY IDENTIFICATION LABEL (RFID) AND METHOD OF MANUFACTURING THE LABEL |
JP5510450B2 (en) | 2009-04-14 | 2014-06-04 | 株式会社村田製作所 | Wireless IC device |
CN103022661B (en) | 2009-04-21 | 2014-12-03 | 株式会社村田制作所 | Antenna apparatus and resonant frequency setting method of same |
JP5447515B2 (en) | 2009-06-03 | 2014-03-19 | 株式会社村田製作所 | Wireless IC device and manufacturing method thereof |
JP5516580B2 (en) | 2009-06-19 | 2014-06-11 | 株式会社村田製作所 | Wireless IC device and method for coupling power feeding circuit and radiation plate |
WO2011037234A1 (en) | 2009-09-28 | 2011-03-31 | 株式会社村田製作所 | Wireless ic device and method for detecting environmental conditions using same |
JP5201270B2 (en) | 2009-09-30 | 2013-06-05 | 株式会社村田製作所 | Circuit board and manufacturing method thereof |
JP5304580B2 (en) | 2009-10-02 | 2013-10-02 | 株式会社村田製作所 | Wireless IC device |
CN102576939B (en) | 2009-10-16 | 2015-11-25 | 株式会社村田制作所 | Antenna and wireless ic device |
WO2011052310A1 (en) | 2009-10-27 | 2011-05-05 | 株式会社村田製作所 | Transmitting/receiving apparatus and wireless tag reader |
CN108063314A (en) | 2009-11-04 | 2018-05-22 | 株式会社村田制作所 | Communication terminal and information processing system |
WO2011055703A1 (en) | 2009-11-04 | 2011-05-12 | 株式会社村田製作所 | Communication terminal and information processing system |
JP5299518B2 (en) | 2009-11-04 | 2013-09-25 | 株式会社村田製作所 | Information processing system |
GB2487491B (en) | 2009-11-20 | 2014-09-03 | Murata Manufacturing Co | Antenna device and mobile communication terminal |
CN102687338B (en) | 2009-12-24 | 2015-05-27 | 株式会社村田制作所 | Antenna and mobile terminal |
WO2011108341A1 (en) | 2010-03-03 | 2011-09-09 | 株式会社村田製作所 | Radio communication device and radio communication terminal |
CN102792520B (en) | 2010-03-03 | 2017-08-25 | 株式会社村田制作所 | Wireless communication module and Wireless Telecom Equipment |
WO2011111509A1 (en) | 2010-03-12 | 2011-09-15 | 株式会社村田製作所 | Radio communication device and metallic article |
CN102668241B (en) | 2010-03-24 | 2015-01-28 | 株式会社村田制作所 | Rfid system |
WO2011122163A1 (en) | 2010-03-31 | 2011-10-06 | 株式会社村田製作所 | Antenna and wireless communication device |
JP5482421B2 (en) * | 2010-05-10 | 2014-05-07 | ソニー株式会社 | Non-contact communication medium, antenna coil arrangement medium, communication apparatus and communication method |
JP5170156B2 (en) | 2010-05-14 | 2013-03-27 | 株式会社村田製作所 | Wireless IC device |
JP5299351B2 (en) | 2010-05-14 | 2013-09-25 | 株式会社村田製作所 | Wireless IC device |
WO2012005278A1 (en) | 2010-07-08 | 2012-01-12 | 株式会社村田製作所 | Antenna and rfid device |
JP5630503B2 (en) | 2010-07-28 | 2014-11-26 | 株式会社村田製作所 | Antenna device and communication terminal device |
JP5423897B2 (en) | 2010-08-10 | 2014-02-19 | 株式会社村田製作所 | Printed wiring board and wireless communication system |
JP5234071B2 (en) | 2010-09-03 | 2013-07-10 | 株式会社村田製作所 | RFIC module |
CN103038939B (en) | 2010-09-30 | 2015-11-25 | 株式会社村田制作所 | Wireless IC device |
JP5758909B2 (en) | 2010-10-12 | 2015-08-05 | 株式会社村田製作所 | Communication terminal device |
CN102971909B (en) | 2010-10-21 | 2014-10-15 | 株式会社村田制作所 | Communication terminal device |
CN105048058B (en) | 2011-01-05 | 2017-10-27 | 株式会社村田制作所 | Wireless communication devices |
WO2012096365A1 (en) | 2011-01-14 | 2012-07-19 | 株式会社村田製作所 | Rfid chip package and rfid tag |
CN104899639B (en) | 2011-02-28 | 2018-08-07 | 株式会社村田制作所 | Wireless communication devices |
JP5630566B2 (en) | 2011-03-08 | 2014-11-26 | 株式会社村田製作所 | Antenna device and communication terminal device |
WO2012137717A1 (en) | 2011-04-05 | 2012-10-11 | 株式会社村田製作所 | Wireless communication device |
JP5482964B2 (en) | 2011-04-13 | 2014-05-07 | 株式会社村田製作所 | Wireless IC device and wireless communication terminal |
WO2012157596A1 (en) | 2011-05-16 | 2012-11-22 | 株式会社村田製作所 | Wireless ic device |
EP3041087B1 (en) | 2011-07-14 | 2022-09-07 | Murata Manufacturing Co., Ltd. | Wireless communication device |
WO2013011856A1 (en) | 2011-07-15 | 2013-01-24 | 株式会社村田製作所 | Wireless communication device |
WO2013011865A1 (en) | 2011-07-19 | 2013-01-24 | 株式会社村田製作所 | Antenna module, antenna device, rfid tag, and communication terminal device |
WO2013035821A1 (en) | 2011-09-09 | 2013-03-14 | 株式会社村田製作所 | Antenna device and wireless device |
WO2013080991A1 (en) | 2011-12-01 | 2013-06-06 | 株式会社村田製作所 | Wireless ic device and method for manufacturing same |
KR20130105938A (en) | 2012-01-30 | 2013-09-26 | 가부시키가이샤 무라타 세이사쿠쇼 | Wireless ic device |
JP5464307B2 (en) | 2012-02-24 | 2014-04-09 | 株式会社村田製作所 | ANTENNA DEVICE AND WIRELESS COMMUNICATION DEVICE |
CN104487985B (en) | 2012-04-13 | 2020-06-26 | 株式会社村田制作所 | Method and device for inspecting RFID tag |
JP6048740B2 (en) * | 2013-02-06 | 2016-12-21 | 日立化成株式会社 | Circuit board for non-contact type IC card or non-contact type IC tag and non-contact type IC card or non-contact type IC tag |
FR3023401B1 (en) * | 2014-07-07 | 2017-10-13 | Commissariat Energie Atomique | FREQUENCY ACCORDING TO AN ELECTRONIC LABEL |
BR112022016966A2 (en) * | 2020-03-23 | 2022-10-25 | Philip Morris Products Sa | CARTRIDGE WITH RESONANT CIRCUIT FOR AN AEROSOL GENERATING DEVICE |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3947934A (en) * | 1973-07-20 | 1976-04-06 | Rca Corporation | Method of tuning a tunable microelectronic LC circuit |
US4021705A (en) * | 1975-03-24 | 1977-05-03 | Lichtblau G J | Resonant tag circuits having one or more fusible links |
US4498076A (en) * | 1982-05-10 | 1985-02-05 | Lichtblau G J | Resonant tag and deactivator for use in an electronic security system |
US5124523A (en) | 1987-12-23 | 1992-06-23 | Swiss Aluminium Ltd. | Process for adapting the frequency band of an oscillating circuit made from a metal-plastic-metal sandwich foil useful as an identification label, and sandwich foil for implementing the process |
US5695860A (en) * | 1990-08-06 | 1997-12-09 | Tokai Electronics Co., Ltd. | Resonant tag and method of manufacturing the same |
US5438305A (en) * | 1991-08-12 | 1995-08-01 | Hitachi, Ltd. | High frequency module including a flexible substrate |
US5276431A (en) * | 1992-04-29 | 1994-01-04 | Checkpoint Systems, Inc. | Security tag for use with article having inherent capacitance |
JP2672924B2 (en) * | 1992-07-30 | 1997-11-05 | 三菱電機株式会社 | Non-contact IC card, manufacturing method and testing method thereof |
US5812065A (en) * | 1995-08-14 | 1998-09-22 | International Business Machines Corporation | Modulation of the resonant frequency of a circuit using an energy field |
US5574431A (en) * | 1995-08-29 | 1996-11-12 | Checkpoint Systems, Inc. | Deactivateable security tag |
US5754110A (en) * | 1996-03-07 | 1998-05-19 | Checkpoint Systems, Inc. | Security tag and manufacturing method |
US5708419A (en) * | 1996-07-22 | 1998-01-13 | Checkpoint Systems, Inc. | Method of wire bonding an integrated circuit to an ultraflexible substrate |
AU734390B2 (en) * | 1997-03-10 | 2001-06-14 | Precision Dynamics Corporation | Reactively coupled elements in circuits on flexible substrates |
FR2769109B1 (en) * | 1997-09-26 | 1999-11-19 | Gemplus Sca | DISPOSABLE CHIP ELECTRONIC DEVICE AND MANUFACTURING METHOD |
JPH11250214A (en) * | 1998-03-03 | 1999-09-17 | Matsushita Electron Corp | Method for mounting parts, ic card and its manufacture |
DE29804579U1 (en) * | 1998-03-18 | 1998-11-26 | Georg Siegel Gmbh | Radio frequency label with copper-coated ferrite foil |
JP4187278B2 (en) | 1998-07-08 | 2008-11-26 | 大日本印刷株式会社 | Non-contact IC card and manufacturing method thereof |
US6161761A (en) * | 1998-07-09 | 2000-12-19 | Motorola, Inc. | Card assembly having a loop antenna formed of a bare conductor and method for manufacturing the card assembly |
US6091607A (en) * | 1998-12-10 | 2000-07-18 | Checkpoint Systems, Inc. | Resonant tag with a conductive composition closing an electrical circuit |
DE19857583A1 (en) * | 1998-12-14 | 2000-06-15 | Meto International Gmbh | Security element for electronic articles has dielectric layer at least as thick in critical region, where bounding edge of lower/upper track overlaps other track, as in rest of overlap region |
JP3687459B2 (en) * | 1999-06-29 | 2005-08-24 | ソニーケミカル株式会社 | IC card |
JP2001084343A (en) * | 1999-09-16 | 2001-03-30 | Toshiba Corp | Non-contact ic card and ic card communication system |
DE19950524A1 (en) * | 1999-10-20 | 2001-04-26 | Philips Corp Intellectual Pty | Smart card |
JP3390389B2 (en) * | 1999-12-08 | 2003-03-24 | チェックポイント・マニュファクチュアリング・ジャパン株式会社 | Resonance tag |
US6424263B1 (en) * | 2000-12-01 | 2002-07-23 | Microchip Technology Incorporated | Radio frequency identification tag on a single layer substrate |
-
2001
- 2001-02-07 US US10/239,793 patent/US6796508B2/en not_active Expired - Fee Related
- 2001-02-07 EP EP01962432A patent/EP1269412A1/en not_active Withdrawn
- 2001-02-07 WO PCT/CH2001/000085 patent/WO2001073685A1/en active Application Filing
- 2001-02-07 JP JP2001571328A patent/JP2003529163A/en active Pending
Non-Patent Citations (1)
Title |
---|
See references of WO0173685A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20030169153A1 (en) | 2003-09-11 |
JP2003529163A (en) | 2003-09-30 |
WO2001073685A1 (en) | 2001-10-04 |
US6796508B2 (en) | 2004-09-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1269412A1 (en) | Rfid label with an element for regulating the resonance frequency | |
EP0255073B1 (en) | Circuit device and resonance tag and method of making the same | |
EP0110921A1 (en) | Tag-shaped identification device applicable to an object and manufacturing method thereof | |
DE602004004482T2 (en) | Antenna for radio frequency identification | |
EP0092555B1 (en) | Tag-shaped identification device attachable to an object | |
DE3536908C2 (en) | ||
DE3118674C2 (en) | Thin film transistor | |
DE3532858A1 (en) | METHOD FOR ATTACHING TERMINALS TO CERAMIC BODIES | |
CH648686A5 (en) | CAPACITOR of wound METALLIZED FILM AND METHOD FOR PRODUCING. | |
WO2003032246A1 (en) | Device for shielding a transponder, method for producing a corresponding shielding and transponder provided with said shielding | |
DE3844393A1 (en) | CIRCUIT ARRANGEMENT WITH SWITCHED COIL | |
WO2004093002A1 (en) | Transponder and method for the production thereof | |
DE1903518B2 (en) | HIGH FREQUENCY OSCILLATOR | |
DE3247425C2 (en) | ||
WO2014118079A1 (en) | Circuit on a thin carrier for use in hollow conductors, and production method | |
DE2908255C2 (en) | Y circulator | |
DE3143210A1 (en) | Electrical component | |
EP1843281A1 (en) | Data carrier/transmission device and method for manufacturing such a data carrier/transmission device | |
EP2507748B1 (en) | Method for making contact with a chip | |
DE1931295A1 (en) | Thin-film electronic circuit elements and apparatus and method for manufacturing such circuit elements | |
DE2329488B2 (en) | Magnetic sensor with a parametrically excited second harmonic oscillator | |
DE102017111464B4 (en) | COMPACT CAPACITORS AND PROCESS FOR THEIR MANUFACTURE | |
DE10001120C2 (en) | Low induction electrolytic capacitor | |
DE2815850C2 (en) | Method for testing planar coils and device for carrying out this method | |
DE2801875A1 (en) | Heat sink for HF transistors etc. - is in form of HF delay line with transistor at line end |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20021028 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
17Q | First examination report despatched |
Effective date: 20071228 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20080506 |