EP1246215B1 - Microrelais à nouvelle construction - Google Patents

Microrelais à nouvelle construction Download PDF

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Publication number
EP1246215B1
EP1246215B1 EP01810322A EP01810322A EP1246215B1 EP 1246215 B1 EP1246215 B1 EP 1246215B1 EP 01810322 A EP01810322 A EP 01810322A EP 01810322 A EP01810322 A EP 01810322A EP 1246215 B1 EP1246215 B1 EP 1246215B1
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EP
European Patent Office
Prior art keywords
contact piece
movable contact
drive capacitor
microrelay
movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP01810322A
Other languages
German (de)
English (en)
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EP1246215A1 (fr
Inventor
Ralf Strümpler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Research Ltd Switzerland
ABB Research Ltd Sweden
Original Assignee
ABB Research Ltd Switzerland
ABB Research Ltd Sweden
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB Research Ltd Switzerland, ABB Research Ltd Sweden filed Critical ABB Research Ltd Switzerland
Priority to AT01810322T priority Critical patent/ATE451712T1/de
Priority to DE50115251T priority patent/DE50115251D1/de
Priority to EP01810322A priority patent/EP1246215B1/fr
Publication of EP1246215A1 publication Critical patent/EP1246215A1/fr
Application granted granted Critical
Publication of EP1246215B1 publication Critical patent/EP1246215B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0078—Switches making use of microelectromechanical systems [MEMS] with parallel movement of the movable contact relative to the substrate

Definitions

  • a micro-relay is a microscopic electrical switch in which a movable contact piece is moved electrostatically, electromagnetically, piezoelectrically or otherwise relative to a mating contact to make electrical contact open and close.
  • Micro relays are so to speak, very small relays, as is clear from the name, and are often, but not necessarily, made with the aid of technological processes that are borrowed from semiconductor technology and / or microstructure technology.
  • Micro-relays with electrostatic drives are known per se.
  • the electrostatic drive is effected by a drive capacitor having two spaced conductive surfaces, one of which is fixedly connected to the movable contact piece.
  • the electrostatic forces generated when creating a supply voltage between the surfaces can be used for the mechanical drive of the movable contact piece.
  • the movable contact piece is usually elastically suspended, so that the electrostatic drive acts against a restoring force of the elastic suspension.
  • the movable contact piece consists of a lamella protruding obliquely from a substrate surface, which at the same time contains one of the drive capacitor surfaces, wherein the other drive capacitor surface and the mating contact piece are arranged in the substrate plane.
  • the electrostatic attraction between the driving capacitor surfaces may pull the blade down onto the substrate surface, whereupon contact on the blade-like movable contact contacts the mating contact in the substrate surface.
  • a three-dimensional, electrostatic drive for a microstructure is in Fig. 4 from EP 1 020 984 A2 described.
  • This drive has a fixed base 41 and an arrow 42 movable actuator 42, which is held with four leaf springs 44 at four attachment points 45 and is driven by the electrostatic forces of a comb structure with finger electrodes 43, 46 having capacitor. Since each two of the four leaf springs engage on opposite sides of the actuator 42, the actuator 42 moves only perpendicular to the surfaces of the finger electrodes and the distance between the finger electrodes 43 and 46 remains constant during this movement. However, the distance traveled in the movement is only small.
  • the object is to provide a micro-relay of the type mentioned, which allows relatively low supply voltages to overcome a large isolation distance between the contact pieces.
  • the movable contact piece is suspended such that the direction of movement to the direction of the distance between the drive capacitor surfaces is almost vertical, the largest occurring in operation distance of the drive capacitor surfaces is much smaller than that covered in operation by the movable contact piece movement distance in the direction of movement, and the elastic suspension has a spring constant, which is substantially smaller than a spring constant of the elastic suspension with respect to a movement in the direction of the distance of the drive capacitor surfaces, with respect to a movement of the movable contact piece in the movement direction.
  • the basic idea of the invention is thus to depart from the conventional concept, in which the direction of movement of the movable contact piece is essentially the same or parallel to the electrostatic force.
  • a structure is chosen in which the movable contact piece is elastically suspended so that it is a transverse elastic with respect to the direction of the electrostatic force, ie to the direct distance between the drive capacitor surfaces corresponding direction.
  • a small component in the direction of force must be present, so that the drive capacitor surfaces are approximated or removed from each other. It is essential, however, that the vast majority of the movement of the movable contact piece is perpendicular to the electrostatic force, so the capacitor gap.
  • this may mean that the transverse component in the movements is preferably at least 5 times, more preferably 7.5 times, more preferably 12 times and in the best case even more than 20 times the force-parallel component.
  • This is inventively achieved in that the elastic suspension in the desired direction of movement has a much smaller spring constant than in the (conventional) direction of the distance between the drive capacitor surfaces.
  • the advantages of this structure can be varied: Firstly, in some applications it can lead to more favorable geometric solutions to be able to arrange the drive capacitor surfaces substantially parallel to the direction of movement of the movable contact piece.
  • the invention thus provides a new degree of freedom for the design of micro-relays.
  • An essential, but according to the invention not necessarily standing in the foreground advantage is that relatively large quantitative relationships between the possible path of movement of the movable contact piece on the one hand and the.
  • these quantitative ratios should be as large as possible, preferably over 10, better over 20 and best over 40.
  • the micro-relays according to the invention can therefore combine a high withstand voltage with a small drive voltage.
  • the elastic suspension on the side of the movable contact piece on which the electrically conductive surface is provided, since then a particularly favorable power distribution is achieved.
  • the initial force when applying a voltage is namely given by the production-related distance of the capacitor surfaces.
  • the distance of the plates decreases with increasing movement of the movable contact piece.
  • the driving force is always larger and reaches a maximum when the movable contact piece reaches an end position in which the contacts are closed.
  • the microrelay according to the invention then has a desirably high contact closure force.
  • a favorable embodiment for an elastic suspension with the described properties consists of at least one narrow long carrier whose longitudinal direction corresponds to the direction of the distance of the drive capacitor surfaces and which is much narrower in the direction of movement of the movable contact piece.
  • the carrier may be relatively extended or relatively flat, preferably matched to the corresponding dimensions of the drive capacitor and the remaining components in that direction. This carrier forms a leaf spring-like structure and can not be extended and shortened by the electrostatic force of the drive capacitor, but laterally deformed.
  • At least two of these carriers are provided, which are preferably substantially identical to each other, but spaced apart in the direction of movement.
  • By their common fixed coupling with the movable contact piece then results in a movement of the movable contact piece, which remains tilt-free, that consists essentially only of translational components.
  • the force-displacement relationships, ie the spring constants, can be easily calculated in such carriers using known approximation formulas.
  • the movement of the movable contact piece can be used not only to bring a contact attached to the movable contact piece with an associated contact on a mating contact piece and to separate it, but the same movement can simultaneously a further contact of the movable contact piece with a connect and disconnect the other contact on another mating contact piece in a complementary manner.
  • the movable contact piece between the mating contact pieces is reciprocated.
  • a double switch is obtained which, moreover, offers in a middle position a state in which all the contacts are disconnected.
  • it can also be designed or operated so that it is switched between two states, in each of which one of the two contact pairs is open and the other is closed.
  • the various advantageous applications of such double switches are well known to those skilled in the art.
  • the carrier or carriers described need not necessarily be elongated in the force-free state, so that they are bent by the electrostatic drive. You can also be provided in the production of the micro-relay already with a predetermined slight curvature, which can then be reduced by the electrostatic drive force, repealed or reversed in the direction sense.
  • Nested structures may also be used in which a larger number of drive capacitor surfaces are interleaved, such as two combs engaged with each other.
  • the direction of movement of the micro-relay according to the invention is preferably parallel to a substrate on which the micro-relay is mounted or on which it has preferably been produced integrated.
  • the substrate-parallel direction of movement has the advantage of favoring two-dimensional structures of the microrelay, which are very advantageous in terms of production technology.
  • the typical microtechnological and semiconductor technology methods such as lithography, etching or coating methods are usually initially two-dimensional and in three-dimensional structures to realize only slightly increased effort.
  • the individual functional parts of the micro-relay namely the movable contact piece, the elastic suspension and the drive capacitor, each in their functional structure, preferably purely two-dimensional, in a substrate-parallel plane.
  • a flat structure which is possible due to the substrate-parallel movement is frequently favorable in terms of construction and in particular facilitates subsequent lithography steps, for example those which are required for microelectronic circuits to be produced on the same substrate. Even with a protection of the micro-relay by an encapsulation or cover a flat structure is advantageous.
  • SiO 2 layers are suitable for silicon substrates.
  • SOI structures Silicon on Insulator
  • the material silicon is basically a preferred material for the microrelay according to the invention.
  • silicon has the advantage of being able to be carried out by suitable sorting both insulating and electrically conductive. By ion implantation or diffusion of dopants can thus be easily made conductor tracks with an adapted structure.
  • the underlying technology is known from semiconductor device fabrication.
  • metallizations will be necessary for the contacts themselves.
  • metallizations In the case of a glass microrelay, metallizations must always be applied in order to produce the electrical leads and contacts.
  • RIE reactive ion etching
  • DRIE deep reactive ion etching
  • FIG. 1 shows a plan view of a structure of a movable contact piece 1 with elastic suspension 2.
  • the viewing direction is perpendicular to the substrate plane, which should be a two-dimensional structure.
  • the schematically drawn base 3 should, as indicated by the hatched background, be firmly connected to the substrate, whereas the elastic suspension forming carrier 2 and the movable contact piece 1 are free from the substrate.
  • the parts 1, 2 and 3 are made of Si and integrated from a Si substrate be worked out.
  • the movable contact piece 1 and the carriers 2 have been freed from the substrate by dissolving an SiO 2 layer buried underneath.
  • the solid lines represent the force-free arrangement, while the dashed lines show the movable contact piece 1 and the elastic suspension 2 in the deflected state.
  • This deflection is caused by a force symbolized with N, which in FIG. 1 acts from top to bottom, that is, in the substrate plane, but is the direction of movement seen by the difference between the dashed and the solid drawing substantially perpendicular.
  • N a force symbolized with N
  • the direction of movement is not really a constant direction. Rather, it is clear from this figure that the direction of movement with increasing deflection away from the orthogonal orientation to the normal force. It is essential, however, that the movement path contains a much larger component f perpendicular to the force N than the force-parallel component ⁇ .
  • the component ⁇ is important insofar as it is necessary in order to be able to generate the illustrated movement with the force N at all.
  • the movement behavior of the movable contact piece 1 results from the shape and arrangement of the pair of supports 2 and these are spaced apart in the direction of movement and otherwise identical and aligned to the force N substantially symmetrical, in order to avoid torques as possible.
  • the carriers 2 have a length I in the direction of the force N and, in contrast, are very narrow, as indicated by h.
  • the depth perpendicular to the plane is denoted by b and here corresponds to the depth of the movable contact piece 1. It is for the inventive principle no longer of concern.
  • the area of the driving capacitor also increases linearly with the depth, so that the depth b only depends on the technical limits of the etching process and the desired contact surface.
  • too great a width of the capacitor 4,5 not only increases the mass inertia of the movable contact part 1, but also goes directly into the overall size of the micro-relay. So here a meaningful compromise must be found.
  • FIG. 2 shows the schematic in FIG. 1 explained basic structure in a concrete application form.
  • an electrically conductive surface layer 4 is mounted, which is opposite to a second electrically conductive surface layer 5 on a substrate-fixed part.
  • A is the area of the drive capacitor 4, 5 and also proportional to b.
  • d is the distance between the two drive capacitor surfaces 4 and 5. It can be seen directly that very large electrostatic forces can be generated by correspondingly small distances, because the distance d occurs in the second power. Furthermore, wide capacitors in the sense of the horizontal in the drawing plane, so large distances between the carriers 2, low. At a distance d of 1 ⁇ m, forces in the range of 4 mN result at a supply voltage of 36 V and a typical area A of 450 ⁇ m ⁇ 1500 ⁇ m.
  • FIG. 2 shows that the movable contact piece 1 is switched back and forth between two mating contact pieces 6 and 7.
  • the movable contact piece 1 has, at its ends extending beyond the supports 2, in each case an angled attachment region 8 or 9, which carries in each case two metal contacts, which are connected via a metallic conductor track.
  • These contacts can come in contact with each associated two contacts on the mating contact pieces 6 and 7, which in turn are electrically isolated from each other. you will be So bridged by the contacts on the angled regions 8 and 9 of the movable contact piece 1.
  • the hatched areas in FIG. 2 indicate that the two drive capacitor surfaces 4 and 5 and each of the contacts on the mating contact pieces 6 and 7 outgoing interconnects are formed by ion-implanted Si regions.
  • the black filled contacts are metallized, for example by lateral Schrägbedampfung or plasma deposition and masking.
  • micro-relay off FIG. 2 when unloaded drive capacitor 4, 5 bridges the contacts on the left mating contact piece 7 and can be switched by voltage application of the capacitor 4, 5 so that instead the contacts on the right mating contact piece 6 are bridged.
  • the drive capacitor surfaces 4, 5 are aligned with each other so that they lie directly opposite each other approximately in the middle of this path, so that in each case at the two Wegenden a certain offset is present, which is immaterial because of the actually small quantitative significance.
  • the total contact surfaces can be determined by adjusting the depth b.
  • the metal contacts can also in the in FIG. 2 be made wider in the vertical direction, if the contact surface plays an essential role.
  • FIG. 3 is opposite to the variants FIGS. 1 and 2 to that extent, a deviation before that the carrier 2 'are slightly curved in the illustrated stress-free state slightly S-shaped, namely approximately as in the deformed state FIG. 1 , This can be easily realized by appropriate structuring of the mask in the DRIE process, with which these structures are machined out of the silicon wafer.
  • the drive capacitor in this example is on the compared to FIG. 2 arranged on the other side of the movable contact piece 1, and therefore designated 4 ', 5'.
  • the micro-relay in this case is designed so that the "right switch" 6, 8 is closed in the de-energized state, while the "left switch” 7, 9 is open in the de-energized state.
  • the movable contact piece 1 in FIG. 3 Due to the electrostatic attraction between the drive capacitor surfaces 4 'and 5', the movable contact piece 1 in FIG. 3 be moved to the left, with the carrier 2 'stretch largely or can deform with reversed sense of direction.
  • the arrangement of the drive capacitor 4 '5' should, in the case of simple micro-relays, be such that a maximum contact force results in the closed state, ie the minimum distance between the drive capacitor surfaces 4, 5 or 4 ', 5' is present. In the first and in the second embodiment, this is given for the right switch and for the left switch.
  • FIG. 4 shows a third embodiment, which is a variant of the second embodiment FIG. 3 represents.
  • the drive capacitor in this case consists of comb-like interleaved surfaces, designated 4 "and 5". Again, these are Si structures with corresponding dopings (or metallizations), as the hatching shows.
  • the effective area of the drive capacitor previously designated A can be multiplied, in this case tripled. For the rest, this embodiment corresponds to the previously described.

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  • Micromachines (AREA)
  • Investigation Of Foundation Soil And Reinforcement Of Foundation Soil By Compacting Or Drainage (AREA)
  • Relay Circuits (AREA)

Claims (14)

  1. Microrelais qui présente :
    une pièce mobile de contact (1),
    un condensateur d'entraînement (4, 5, 4', 5', 4", 5") qui entraîne électrostatiquement la pièce mobile de contact (1),
    le condensateur d'entraînement présentant deux surfaces conductrices (4, 5, 4', 5', 4", 5") disposées à distance l'une de l'autre, parallèlement l'une à l'autre et dont l'une (4, 4', 4") est placée sur un côté de la pièce mobile de contact (1),
    une suspension élastique (2, 2') de la pièce élastique de contact (1) et
    une pièce complémentaire de contact (6, 7),
    le microrelais étant conçu de telle sorte qu'une modification de l'état de charge du condensateur d'entraînement (4, 5, 4', 5', 4", 5") provoque un déplacement de la pièce mobile de contact (1) dans une direction de déplacement vers ou hors d'une position contre la pièce complémentaire de contact (6, 7) pour ouvrir ou fermer un contact électrique entre la pièce mobile de contact (1) et la pièce complémentaire de contact (6, 7),
    caractérisé en ce que
    la pièce mobile de contact (1) est suspendue de telle sorte que la direction de déplacement est presque perpendiculaire à la direction d'extension de la distance entre les surfaces (4, 5, 4', 5', 4", 5") du condensateur d'entraînement,
    en ce que la plus grande distance qui s'établit en fonctionnement entre les surfaces (4, 5, 4', 5', 4", 5") du condensateur d'entraînement est beaucoup plus petite que la distance de déplacement (f) parcourue en fonctionnement par la pièce mobile de contact (1) dans la direction du déplacement et
    en ce que lors d'un déplacement de la pièce mobile de contact (1) dans la direction de déplacement, la suspension élastique (2, 2') présente une constante élastique beaucoup plus petite que la constante élastique de la suspension élastique (2, 2') lors d'un déplacement dans la direction d'extension de la distance entre les surfaces (4, 5, 4', 5', 4", 5") du condensateur d'entraînement.
  2. Microrelais selon la revendication 1, caractérisé en ce que la suspension élastique (2) est disposée sur le côté de la pièce mobile de contact (1) sur lequel la surface électriquement conductrice (4) est prévue.
  3. Microrelais selon les revendications 1 ou 2, dans lequel la suspension élastique (2, 2') présente un support (2, 2') qui s'étend essentiellement en parallèle à la direction de l'extension de la distance entre les surfaces (4, 5, 4', 5', 4", 5") du condensateur d'entraînement, qui est beaucoup plus étroit (h) dans la direction de déplacement que sa longueur (1) dans cette direction, qui est relié solidairement à la pièce mobile de contact (1) et qui maintient cette dernière à déplacement élastique dans la direction de déplacement grâce à sa longueur (1) et à son étroitesse (h).
  4. Microrelais selon la revendication 3, dans lequel la suspension élastique (2, 2') présente au moins deux des supports (2) décrits plus haut et décalés parallèlement l'un par rapport à l'autre dans la direction du déplacement.
  5. Microrelais selon l'une des revendications précédentes, dans lequel la pièce mobile de contact (1) peut être branchée et débranchée entre deux pièces complémentaires de contact (6, 7).
  6. Microrelais selon l'une des revendications 3 à 5, caractérisé en ce que le ou les supports (2') sont installés sur un côté de la pièce mobile de contact (1) qui n'est pas tourné vers le boîtier qui porte la surface électriquement conductrice (4') et en ce que le ou les supports (2') sont légèrement incurvés le long de leur longueur (l) et peuvent être étirés par le condensateur d'entraînement (4', 5', 4", 5") lors du déplacement de la pièce mobile de contact (1).
  7. Microrelais selon l'une des revendications précédentes, dans lequel le condensateur d'entraînement (4", 5") présente plusieurs surfaces conductrices (4", 5") imbriquées et disposées parallèlement les unes aux autres et à distance les unes des autres.
  8. Microrelais selon l'une des revendications précédentes, qui présente un substrat sur lequel le microrelais est fixé (3), la pièce mobile de contact (1) se déplaçant parallèlement au substrat.
  9. Microrelais selon l'une des revendications précédentes, fabriqué de manière intégrée sur le substrat.
  10. Microrelais selon l'une des revendications précédentes et au moins selon la revendication 8, dans lequel la pièce mobile de contact (1), la suspension élastique (2, 2') et le condensateur d'entraînement (4, 5, 4', 5', 4", 5") présentent au moins une partie essentielle de leur structure fonctionnelle sous la forme d'une structure bidimensionnelle ménagée dans un plan parallèle au substrat.
  11. Microrelais selon la revendication 9 et la revendication 10, qui présente une couche gravée disposée entre les structures bidimensionnelles et le substrat et située à distance des parties mobiles (1, 2, 2', 4, 4', 4") de la structure.
  12. Microrelais selon l'une des revendications précédentes, fabriqué par un procédé de gravure par ions, et de préférence par un procédé DRIE.
  13. Microrelais selon l'une des revendications précédentes, essentiellement constitué de silicium.
  14. Microrelais selon l'une des revendications 1 à 12, essentiellement constitué de verre.
EP01810322A 2001-03-29 2001-03-29 Microrelais à nouvelle construction Expired - Lifetime EP1246215B1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AT01810322T ATE451712T1 (de) 2001-03-29 2001-03-29 Mikrorelais mit neuem aufbau
DE50115251T DE50115251D1 (de) 2001-03-29 2001-03-29 Mikrorelais mit neuem Aufbau
EP01810322A EP1246215B1 (fr) 2001-03-29 2001-03-29 Microrelais à nouvelle construction

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01810322A EP1246215B1 (fr) 2001-03-29 2001-03-29 Microrelais à nouvelle construction

Publications (2)

Publication Number Publication Date
EP1246215A1 EP1246215A1 (fr) 2002-10-02
EP1246215B1 true EP1246215B1 (fr) 2009-12-09

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EP01810322A Expired - Lifetime EP1246215B1 (fr) 2001-03-29 2001-03-29 Microrelais à nouvelle construction

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EP (1) EP1246215B1 (fr)
AT (1) ATE451712T1 (fr)
DE (1) DE50115251D1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6975193B2 (en) 2003-03-25 2005-12-13 Rockwell Automation Technologies, Inc. Microelectromechanical isolating circuit
AU2003254882A1 (en) * 2003-08-07 2005-02-25 Fujitsu Media Devices Limited Micro switching element and method of manufacturing the element
WO2007059634A1 (fr) * 2005-11-28 2007-05-31 Abb Research Ltd Actionneur electrostatique

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4126107C2 (de) * 1991-08-07 1993-12-16 Bosch Gmbh Robert Beschleunigungssensor und Verfahren zur Herstellung
US5179499A (en) * 1992-04-14 1993-01-12 Cornell Research Foundation, Inc. Multi-dimensional precision micro-actuator
KR100459887B1 (ko) * 1999-01-11 2004-12-03 삼성전자주식회사 삼차원 빗살 가진 구조물 및 이를 채용한 관성 감지 센서와 액츄

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DE50115251D1 (de) 2010-01-21
EP1246215A1 (fr) 2002-10-02
ATE451712T1 (de) 2009-12-15

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