EP1163692B1 - Microrelay working parallel to the substrate - Google Patents
Microrelay working parallel to the substrate Download PDFInfo
- Publication number
- EP1163692B1 EP1163692B1 EP00908889A EP00908889A EP1163692B1 EP 1163692 B1 EP1163692 B1 EP 1163692B1 EP 00908889 A EP00908889 A EP 00908889A EP 00908889 A EP00908889 A EP 00908889A EP 1163692 B1 EP1163692 B1 EP 1163692B1
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- EP
- European Patent Office
- Prior art keywords
- contact piece
- substrate
- movable contact
- microrelay
- drive
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H59/00—Electrostatic relays; Electro-adhesion relays
- H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/12—Contacts characterised by the manner in which co-operating contacts engage
- H01H1/14—Contacts characterised by the manner in which co-operating contacts engage by abutting
- H01H1/20—Bridging contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/30—Means for extinguishing or preventing arc between current-carrying parts
- H01H9/34—Stationary parts for restricting or subdividing the arc, e.g. barrier plate
Definitions
- This invention relates to a micro relay for switching on and off electric current.
- a micro relay according to the preamble of claim 1 is from K E PETERSEN: “Micromechanical Membrane Switches on Silicon” IBM JOURNAL OF RESEARCH AND DEVELOPMENT, US, IBM CORPORATION, ARMONK, Vol. 23, No. 4, July 1979 (1979-07), Pages 376-385-385, XP002101779 ISSN: 0018-8646 known.
- micro-relays are mounted on a substrate and have a movable contact piece on the substrate as well as an elastic suspension of the contact piece and an electrically actuated drive of the contact piece on.
- the drive for example electrostatic, electromagnetic or can work piezoelectrically, the movable contact piece from an open position moved into a closed position or vice versa, the elastic Suspension provides a restoring force.
- the contact piece for example, elastic properties have or be part of the drive.
- Microrelays are made by the known methods of semiconductor technology or comparable methods of microtechnology are manufactured and are particularly suitable in this respect for integration with other semiconductor technology facilities, in particular integrated circuits or transistors.
- micro-relays have a particularly good comparison to conventional electromagnetic ones Relay extraordinary due to the small moving masses fast response times.
- the switching capacities required are very high low, so that in particular when used multiple times in a larger one Circuit can achieve significant performance savings.
- micro relays not only have small construction volumes in Claim but also have correspondingly low weights. After all, with suitable encapsulation, they are again due to the small size Size and the small moving masses extremely insensitive both in mechanical as well as in thermal terms. So the technician is with the use of microrelays is much more flexible than with conventional electromagnetic Relay.
- the invention is based on the technical problem, one compared to the prior art to find technology-enhanced micro-relays.
- the invention solves this problem by means of a micro-relay having a substrate, a movable contact piece on the substrate, an elastic suspension of the movable contact piece and an electrically actuable drive of the movable contact piece, characterized in that the movable contact piece is essentially parallel to the substrate by the drive in the suspension is movable and by a method for producing a micro-relay of the above type, in which the movable contact piece receives at least a substantial part of its functional structure through a two-dimensional structuring method parallel to the substrate.
- the microrelay according to the invention is thus characterized in that the movable Contact piece has a substrate-parallel direction of movement.
- the moveable The contact piece moves in a way planar and not, as in the State of the art, more or less perpendicular to the substrate plane. hereby there are various possibilities for technical improvements.
- To the entire microrelay can be essentially two-dimensional be what the application of typical microtechnological processes, in particular with regard to the necessary lithography, etching or coating steps basically simplified.
- a flat structure can also increase the possibilities of one later encapsulation or protection by a cover or the like.
- the structure of the microrelay be either partial, i. H. the structure of the movable contact piece, the drive or the elastic Suspension, or to carry out two-dimensionally as far as possible.
- the function-determining ones Structural elements can be selected two-dimensionally in the substrate plane and accordingly implemented simply and uniformly in lithography and structuring can be.
- the buried Layers in the appropriate places can be removed to make certain Detach parts from the substrate and thus, for example, elastic or movable to design.
- Silicon is a suitable structural material, also because it is doped appropriately depending on the need, both practically insulating and electrically conductive can be executed. This is through appropriate implantation or diffusion steps also possible in a manner adapted to the microrelay structure.
- Buried layers can consist of SiO 2 , for example, and also in order to maximize the contact points with the established semiconductor technology processes.
- SiO 2 or another insulator If silicon on SiO 2 or another insulator is used, it is possible to fall back on imported SOI (Silicon on Insulator) structures, particularly if single-crystal silicon is preferred as the building material, on SI-MOX wafers.
- SOI Silicon on Insulator
- ion etching processes and in particular RIE processes.
- RIE processes With ion etching can be used in various materials with suitable process control almost vertical flanks in completely sufficient for this application Create depths. These processes are also to be processed for larger ones Even surfaces and are well suited for automated mass production. In addition to other established ion etching processes, this stands out RIE process through a large selection of known processes for various Materials with justifiable expenditure on equipment and relatively high Etching rates.
- a Rod arranged parallel to the substrate can be used, preferably a Has truss structure to achieve good stability with low weight. This makes them sensitive to vibrations and shocks and they respond quickly Structures with high resonance frequencies possible.
- This truss structure can be considered in view of the two-dimensional preferred in this invention Realize the structure with a two-dimensional structuring of the micro relay.
- the movable contact piece can have an oblique contact surface, at an angle to the direction of movement and at the same time essentially running perpendicular to the substrate plane. Due to the oblique arrangement of the contact surface can be in contact with a corresponding complementary contact surface a fixed contact piece without too much physical expansion of the movable contact piece a relatively large contact area can be achieved. At the same time, the oblique angle of attack between the direction of movement and the contact surface also a translation of the power of the drive be achieved, especially if it is on the opposite of the contact surface Side of the movable contact piece, a corresponding second contact surface or other investment there.
- the movable or a fixed contact piece is designed so that itself in the closing movement, for example due to a bending of a contact piece a noticeable cross component between the respective contact surfaces, d. H. a component of movement in the surface direction, the contact quality be improved.
- An electrostatic version is preferred as the drive, because it compared to electromagnetic or piezoelectric drives lower utility services as well as lower utility voltages having.
- electrostatic drives namely the to compensate for relatively low driving forces is a toothed finger structure preferred, which is considered in the present invention standing two-dimensional structuring can be sensibly implemented.
- the elastic suspension is preferably meandering by at least one trained footbridge. On the details of these geometric designs will be discussed in more detail in the description of the exemplary embodiments.
- the invention also makes it possible to use one of conventional ones To install circuit breakers known arcing chamber structure, as shown in more detail in the third embodiment.
- the invention relates both to a novel microrelay structure as well as a two-dimensional structuring process designed for this purpose. Accordingly, the above statements are about the different Individual aspects of the invention both with regard to the disclosure corresponding device features as well as with regard to process features to understand.
- Figures 1 and 2 show a first embodiment with a movable Contact piece, which is a rod 1 in the direction of movement with a through has transverse struts built truss structure.
- a movable Contact piece which is a rod 1 in the direction of movement with a through has transverse struts built truss structure.
- At the in the figure right side of the rod 1 are two oblique to that in the figures of the Horizontal corresponding direction of movement and perpendicular to that of the drawing plane corresponding contact plane 3 extending contact surfaces of the movable Contact piece and two complementary contact surfaces 4 of a fixed Contact piece 5.
- the movable contact piece is due to an elastic suspension in one double meandering web structure 6 in the horizontal direction in Figure 1, d. H. parallel to the substrate, movable. 1 shows an open state of the Micro relay, in which two parts of the fixed contact piece 5 from each other are separated, whereas FIG. 2 shows the microrelay in the closed state shows in which the movable contact piece the two parts of the fixed Contact piece 5 connects.
- the current flow I that is now possible is indicated.
- the entire movable contact piece By removing a buried SiO 2 layer from the substrate, the entire movable contact piece, including the left side of the drive 7 and the elastic suspension 6 in the figures, is removed. The remaining parts shown, in particular the fixed contact piece 5 and the right side in the figures of the drive 7 are firmly connected to the substrate by the buried SiO 2 layer.
- the force necessary for the movement is generated by a designated 7 toothed finger structure by applying a voltage U in the in the figures 1 and 2 shown is operated.
- the fingers are exaggerated in Figure 1 shown far apart, they can also be open reach into each other.
- the de-energized state thus corresponds to that in Figure 1 shown open position, whereas when creating a positive Voltage through the electrostatic attraction the restoring force of the elastic Suspension 6 is overcome and the closed position is established.
- the meandering webs are the elastic ones by appropriate doping Suspension 6 and the fingers of the drive 7 electrically conductive.
- the truss structure of the rod 1 is designed to be insulating Separate the drive from the switched path in potential.
- the contact areas 3 and 4 are covered with Au by appropriate oblique vapor deposition; the fixed contact piece 5 can be a relatively solid one metallic conductor track.
- To the ohmic resistance in the closed Decrease position can also be the contact-side tip of the movable Contact piece between the two inclined contact surfaces 3 with one sufficiently thick metal layer and thus the two contact surfaces 3 electrically connect.
- the case shown corresponds to an open relay when de-energized the usual design of conventional electromagnetic relays, however not necessarily. It can also be caused by electrostatic repulsion, or by electrostatic Attraction of fingers in opposite directions, one basically closed microrelay structure due to the elastic suspension 6 can be opened by applying voltage.
- Figures 3 and 4 show a second embodiment, only those of Details deviating from the first exemplary embodiment are explained.
- the truss structure 2 of the movable contact piece bears on the contact-side end of the contact piece rod 1 a substantially transverse to Beam 8 extending in the direction of the bar, with bars located at both ends thereof reinforced metal structures 9 connected by a metallic bridge 10 are.
- Analog contact surfaces lie opposite each of the contact surfaces 9 11 on two parts of the fixed contact piece 5.
- this structure has the advantage that a slight movement component due to a slight bending of the beam 8 between the contact surfaces 9 and 11 transverse to the closing direction of the microrelay results. Experience has shown that this can improve the quality of the contact become.
- the third exemplary embodiment in FIGS. 5 and 6 shows a variant with a quenching chamber structure 12 constructed from vertical Si webs which are electrically insulated on the substrate by the buried SiO 2 layer.
- the contact piece from the closed position shown in FIG. 6 to the open position shown in FIG. 5 can have an arc due to the rounded shape of the fixed contact piece 5 at the point denoted by 13 and the rounded shape of the contact-side end 14 of the movable contact piece along the as Structure 13 acting rail are driven into the quenching chamber 12.
- a curved shape of the arc is driven due to 12.
- a curved shape of the arc is important due to the suitable shape at 13 and 14.
- the third embodiment differs from the first and second in that the movable contact piece is not about two separate Parts of the fixed contact piece 5 can connect, but a part itself of the current path to be switched. This is shown in FIGS. 5 and 6 by the Reinforced lines in the area of the current path shown, d. H. in the area of the fixed contact piece 5, the arcing chamber 12, the movable Contact piece, d. H. of the rod 1, which is made conductive here, in the figures 5 and 6 lower meandering suspension structure 6 and the conductive Connection between the left end of the structure in FIGS. 5 and 6 and the extinguishing chamber 12.
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- Micromachines (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Relay Circuits (AREA)
- Contacts (AREA)
Abstract
Description
Diese Erfindung bezieht sich auf ein Mikrorelais zum Ein- und Ausschalten eines elektrischen Stromes.This invention relates to a micro relay for switching on and off electric current.
Konventionelle Relais, beispielsweise elektromagnetische Schütze, sind elektromagnetisch betätigte Schalter mit einem beweglichen Kontaktstück, das durch die Wechselwirkung eines Elektromagneten mit einem beweglichen Teil seines Kerns betätigt wird. Anstatt einer detaillierten Darstellung dieses Standes der Technik wird als Beispiel verwiesen auf "New Electromagnetic Contactor with Wide Control Voltage Range" von P. Stephansson, H. Vefling, G. Johansson, Cl. Henrion in ABB Review 1/1997, Seite 29 ff.Conventional relays, such as electromagnetic contactors, are electromagnetic actuated switch with a movable contact piece, which by the Interaction of an electromagnet with a moving part of its core is operated. Instead of a detailed description of this state of the art is referred as an example to "New Electromagnetic Contactor with Wide Control Voltage Range "by P. Stephansson, H. Vefling, G. Johansson, Cl. Henrion in ABB Review 1/1997, page 29 ff.
Als Alternative zu solchen konventionellen Relais sind in jüngster Zeit sogenannte Mikrorelais entwickelt und untersucht worden. Diesbezüglicher Stand der Technik findet sich beispielsweise in H. F. Schlaak, F. Arndt, J. Schimkat, M. Hanke, Proc. Micro System Technology 96, 1996, Seiten 463-468. Es wird weiterhin verwiesen auf R. Allen: "Simplified Process is Used to Make Micromachined FET-like Four-Terminal Microswitches and Microrelays" in Electronic Design, 8 July, 1996, Seite 31.As an alternative to such conventional relays, so-called Microrelays have been developed and investigated. State of the art in this regard can be found, for example, in H. F. Schlaak, F. Arndt, J. Schimkat, M. Hanke, Proc. Micro System Technology 96, 1996, pages 463-468. It will continue to be referred on R. Allen: "Simplified Process is Used to Make Micromachined FET-like Four-Terminal Microswitches and Microrelays "in Electronic Design, July 8, 1996, page 31st
Ein Mikrorelais nach dem Oberbegriffs des Anspruchs 1 is aus K E PETERSEN: "Micromechanical Membrane Switches on Silicon" IBM JOURNAL OF RESEARCH AND DEVELOPMENT,US,IBM CORPORATION, ARMONK, Bd. 23, Nr. 4, Juli 1979 (1979-07), Seiten 376-385-385, XP002101779 ISSN: 0018-8646 bekannt.A micro relay according to the preamble of claim 1 is from K E PETERSEN: "Micromechanical Membrane Switches on Silicon" IBM JOURNAL OF RESEARCH AND DEVELOPMENT, US, IBM CORPORATION, ARMONK, Vol. 23, No. 4, July 1979 (1979-07), Pages 376-385-385, XP002101779 ISSN: 0018-8646 known.
Im allgemeinen sind Mikrorelais auf einem Substrat angebracht und weisen ein bewegbares Kontaktstück auf dem Substrat sowie eine elastische Aufhängung des Kontaktstückes und einen elektrisch betätigbaren Antrieb des Kontaktstückes auf. Mit dem Antrieb, der beispielsweise elektrostatisch, elektromagnetisch oder piezoelektrisch arbeiten kann, wird das bewegbare Kontaktstück von einer Öffnungsposition in eine Schließposition oder umgekehrt bewegt, wobei die elastische Aufhängung für eine Rückstellkraft sorgt. Dabei können die einzelnen Teile auch kombiniert sein, das Kontaktstück beispielsweise elastische Eigenschaften haben oder Teil des Antriebs sein.Generally, micro-relays are mounted on a substrate and have a movable contact piece on the substrate as well as an elastic suspension of the contact piece and an electrically actuated drive of the contact piece on. With the drive, for example electrostatic, electromagnetic or can work piezoelectrically, the movable contact piece from an open position moved into a closed position or vice versa, the elastic Suspension provides a restoring force. The individual parts also be combined, the contact piece, for example, elastic properties have or be part of the drive.
Mikrorelais werden durch die bekannten Verfahren der Halbleitertechnologie oder vergleichbare Verfahren der Mikrotechnik hergestellt und eignen sich insoweit besonders zur Integration mit anderen halbleitertechnologischen Einrichtungen, insbesondere integrierten Schaltungen oder Transistoren.Microrelays are made by the known methods of semiconductor technology or comparable methods of microtechnology are manufactured and are particularly suitable in this respect for integration with other semiconductor technology facilities, in particular integrated circuits or transistors.
Daneben haben Mikrorelais insbesondere im Vergleich zu konventionellen elektromagnetischen Relais aufgrund der kleinen bewegten Massen außerordentlich schnelle Ansprechzeiten. Gleichzeitig sind die notwendigen Schaltleistungen sehr gering, so daß sich insbesondere bei mehrfacher Verwendung in einer größeren Schaltung erhebliche Leistungseinsparungen erzielen lassen.In addition, micro-relays have a particularly good comparison to conventional electromagnetic ones Relay extraordinary due to the small moving masses fast response times. At the same time, the switching capacities required are very high low, so that in particular when used multiple times in a larger one Circuit can achieve significant performance savings.
Bei vielen Anwendungen ist es außerdem von erheblichem Interesse, daß moderne Mikrorelais aufgrund ihrer kleinen Bauweise nicht nur geringe Bauvolumina in Anspruch nehmen sondern auch entsprechend niedrige Gewichte aufweisen. Schließlich sind sie bei geeigneter Kapselung wiederum aufgrund der kleinen Baugröße und der kleinen bewegten Massen außerordentlich unempfindlich sowohl in mechanischer als auch in thermischer Hinsicht. Der Techniker ist also bei der Anwendung von Mikrorelais sehr viel flexibler als bei konventionellen elektromagnetischen Relais.In many applications it is also of considerable interest that modern Because of their small design, micro relays not only have small construction volumes in Claim but also have correspondingly low weights. After all, with suitable encapsulation, they are again due to the small size Size and the small moving masses extremely insensitive both in mechanical as well as in thermal terms. So the technician is with the use of microrelays is much more flexible than with conventional electromagnetic Relay.
Der Erfindung liegt das technische Problem zugrunde, ein gegenüber dem Stand der Technik verbessertes Mikrorelais zu finden.The invention is based on the technical problem, one compared to the prior art to find technology-enhanced micro-relays.
Dieses Problem löst die Erfindung durch ein Mikrorelais mit einem Substrat, einem
bewegbaren Kontaktstück auf dem Substrat, einer elastischen Aufhängung des
bewegbaren Kontaktstücks und einem elektrisch betätigbaren Antrieb des bewegbaren
Kontaktstücks, dadurch gekennzeichnet, daß das bewegbare Kontaktstück
durch den Antrieb in der Aufhängung im wesentlichen substratparallel bewegbar
ist,
sowie durch ein Verfahren zur Herstellung eines Mikrorelais der oben stehenden
Art, bei dem das bewegbare Kontaktstück durch ein substratparalleles zweidimensionales
Strukturierungsverfahren zumindest einen wesentlichen Teil seiner
funktionalen Struktur erhält.The invention solves this problem by means of a micro-relay having a substrate, a movable contact piece on the substrate, an elastic suspension of the movable contact piece and an electrically actuable drive of the movable contact piece, characterized in that the movable contact piece is essentially parallel to the substrate by the drive in the suspension is movable
and by a method for producing a micro-relay of the above type, in which the movable contact piece receives at least a substantial part of its functional structure through a two-dimensional structuring method parallel to the substrate.
Besondere Ausgestaltungen der Erfindung sind Gegenstand der abhängigen Ansprüche.Particular embodiments of the invention are the subject of the dependent claims.
Das erfindungsgemäße Mikrorelais zeichnet sich also dadurch aus, daß das bewegbare Kontaktstück eine substratparallele Bewegungsrichtung hat. Das bewegbare Kontaktstück bewegt sich also gewissermaßen planar und nicht, wie im Stand der Technik, mehr oder weniger senkrecht zur Substratebene. Hierdurch ergeben sich verschiedene Möglichkeiten für technische Verbesserungen. Zum einen kann das gesamte Mikrorelais im wesentlichen zweidimensional ausgeführt werden, was die Anwendung typischer mikrotechnologischer Verfahren, insbesondere im Hinblick auf notwendige Lithographie-, Ätz- oder Beschichtungsschritte grundsätzlich vereinfacht. Zum zweiten läßt sich vermeiden, daß Teile des Mikrorelais in der Richtung senkrecht zur Substratebene in größerem Umfang von dem Mikrorelais abstehen und somit nachfolgende Lithographieschritte, beispielsweise im Zusammenhang mit benachbarten mikroelektronischen Schaltungen, behindern. Schließlich kann ein flacher Aufbau auch die Möglichkeiten einer späteren Verkapselung oder eines Schutzes durch eine Abdeckung oder dgl. erleichtem.The microrelay according to the invention is thus characterized in that the movable Contact piece has a substrate-parallel direction of movement. The moveable The contact piece moves in a way planar and not, as in the State of the art, more or less perpendicular to the substrate plane. hereby there are various possibilities for technical improvements. To the the entire microrelay can be essentially two-dimensional be what the application of typical microtechnological processes, in particular with regard to the necessary lithography, etching or coating steps basically simplified. Secondly, it can be avoided that parts of the Microrelay in the direction perpendicular to the substrate plane on a larger scale of protrude from the microrelay and thus subsequent lithography steps, for example in connection with neighboring microelectronic circuits, hinder. After all, a flat structure can also increase the possibilities of one later encapsulation or protection by a cover or the like.
Es ist vor allem bevorzugt, die Struktur des Mikrorelais entweder teilweise, d. h. die Struktur des bewegbaren Kontaktstücks, des Antriebes oder der elastischen Aufhängung, oder insgesamt soweit wie möglich zweidimensional auszuführen. Dies bedeutet, daß bei der Auslegung der Geometrie die funktionsbestimmenden Strukturelemente zweidimensional in der Substratebene gewählt werden und dementsprechend einfach und einheitlich in Lithographie und Strukturierung umgesetzt werden können. It is most preferred that the structure of the microrelay be either partial, i. H. the structure of the movable contact piece, the drive or the elastic Suspension, or to carry out two-dimensionally as far as possible. This means that when determining the geometry, the function-determining ones Structural elements can be selected two-dimensionally in the substrate plane and accordingly implemented simply and uniformly in lithography and structuring can be.
Dabei ist es günstig, mit vergrabenen Schichten unter der die solchermaßen zweidimensional aufgebauten Teile bildenden Schicht zu arbeiten, wobei die vergrabenen Schichten an den geeigneten Stellen entfernt werden können, um bestimmte Teile vom Substrat zu lösen und damit beispielsweise elastisch oder bewegbar zu gestalten.It is convenient to have buried layers under which such work two-dimensionally constructed parts-forming layer, the buried Layers in the appropriate places can be removed to make certain Detach parts from the substrate and thus, for example, elastic or movable to design.
Im Hinblick auf die Parallelität der Technologie zu mikroelektronischen Verfahren bietet sich als Strukturmaterial Silizium an, auch weil es bei geeigneter Dotierung je nach Notwendigkeit sowohl praktisch isolierend als auch elektrisch leitfähig ausgeführt sein kann. Dies ist durch geeignete Implantations- oder Diffusionsschritte auch in an die Mikrorelaisstruktur angepaßter Weise möglich.With regard to the parallelism of technology to microelectronic processes Silicon is a suitable structural material, also because it is doped appropriately depending on the need, both practically insulating and electrically conductive can be executed. This is through appropriate implantation or diffusion steps also possible in a manner adapted to the microrelay structure.
Vergrabene Schichten können beispielsweise aus SiO2 bestehen, und zwar ebenfalls um die Berührungspunkte mit den etablierten halbleitertechnologischen Verfahren zu maximieren.Buried layers can consist of SiO 2 , for example, and also in order to maximize the contact points with the established semiconductor technology processes.
Bei Verwendung von Silizium auf SiO2 oder einem anderen Isolator kann dabei auf eingeführte SOI (Silicon on Insulator)-Strukturen zurückgegriffen werden, insbesondere, wenn einkristallines Silizium als Baumaterial bevorzugt ist, auf SI-MOX-Wafer.If silicon on SiO 2 or another insulator is used, it is possible to fall back on imported SOI (Silicon on Insulator) structures, particularly if single-crystal silicon is preferred as the building material, on SI-MOX wafers.
Günstige Strukturierungsverfahren für zweidimensionale Strukturen des Mikrorelais sind allgemein lonenätzverfahren und insbesondere RIE-Verfahren. Mit lonenätzverfahren lassen sich bei geeigneter Prozeßführung in verschiedenen Materialien nahezu vertikale Flanken in für diese Anwendung völlig ausreichenden Tiefen herstellen. Diese Verfahren sind außerdem auch bei größeren zu prozessierenden Flächen gleichmäßig und eignen sich gut für eine automatisierte Massenfertigung. Neben anderen etablierten lonenätzverfahren zeichnet sich das RIE-Verfahren durch eine große Auswahl bekannter Prozesse für verschiedenste Materialien bei gleichzeitig vertretbarem apparativem Aufwand und relativ hohen Ätzraten aus. Favorable structuring methods for two-dimensional structures of the microrelay are generally ion etching processes and in particular RIE processes. With ion etching can be used in various materials with suitable process control almost vertical flanks in completely sufficient for this application Create depths. These processes are also to be processed for larger ones Even surfaces and are well suited for automated mass production. In addition to other established ion etching processes, this stands out RIE process through a large selection of known processes for various Materials with justifiable expenditure on equipment and relatively high Etching rates.
Hierzu wird als technologisches Beispiel verwiesen auf "Vertical Mirrors Fabricated
by Deep Reactive Ion Etching for Fiber-Optic Switching Applications" von C.
Marxer et al, Journal of Microelectromechanical Systems, Band 6, Nr. 3, September
1997, Seiten 277-285. Dort sind mikrooptische Schalter für faseroptische Anwendungen
beschrieben, die durch einen RIE-Prozeß in Silizium auf vergrabenen
SiO2-Schichten mit 75 µm hohen vertikalen Wänden strukturiert wurden. Die Offenbarung
dieses Dokuments ist hier durch Inbezugnahme inbegriffen.As a technological example, reference is made to "Vertical Mirrors Fabricated by Deep Reactive Ion Etching for Fiber-Optic Switching Applications" by C. Marxer et al, Journal of Microelectromechanical Systems,
Zum Verbinden einer Kontaktfläche eines Kontaktstücks mit dem Antrieb kann ein substratparallel angeordneter Stab verwendet werden, der vorzugsweise eine Fachwerkstruktur aufweist, um bei geringem Gewicht eine gute Stabilität zu erzielen. Dadurch sind vibrations- und stoßunempfindliche und schnell ansprechende Strukturen mit hohen Resonanzfrequenzen möglich. Diese Fachwerkstruktur läßt sich im Hinblick auf den bei dieser Erfindung bevorzugten zweidimensionalen Aufbau mit einer zweidimensionalen Strukturierung des Mikrorelais günstig realisieren.To connect a contact surface of a contact piece with the drive, a Rod arranged parallel to the substrate can be used, preferably a Has truss structure to achieve good stability with low weight. This makes them sensitive to vibrations and shocks and they respond quickly Structures with high resonance frequencies possible. This truss structure can be considered in view of the two-dimensional preferred in this invention Realize the structure with a two-dimensional structuring of the micro relay.
Weiterhin kann das bewegbare Kontaktstück eine schräge Kontaktfläche aufweisen, und zwar schräg zur Bewegungsrichtung und gleichzeitig im wesentlichen senkrecht zur Substratebene verlaufend. Durch die schräge Anordnung der Kontaktfläche kann bei Berührung mit einer entsprechenden komplementären Kontaktfläche eines feststehenden Kontaktstücks ohne zu große körperliche Ausdehnung des bewegbaren Kontaktstücks eine relativ große Kontaktfläche erzielt werden. Gleichzeitig kann durch den schrägen Anstellwinkel zwischen der Bewegungsrichtung und der Kontaktfläche auch eine Übersetzung der Kraft des Antriebs erzielt werden, vor allem wenn es auf der der Kontaktfläche entgegengesetzten Seite des bewegbaren Kontaktstückes eine entsprechende zweite Kontaktfläche oder anderweitige Anlage gibt.Furthermore, the movable contact piece can have an oblique contact surface, at an angle to the direction of movement and at the same time essentially running perpendicular to the substrate plane. Due to the oblique arrangement of the contact surface can be in contact with a corresponding complementary contact surface a fixed contact piece without too much physical expansion of the movable contact piece a relatively large contact area can be achieved. At the same time, the oblique angle of attack between the direction of movement and the contact surface also a translation of the power of the drive be achieved, especially if it is on the opposite of the contact surface Side of the movable contact piece, a corresponding second contact surface or other investment there.
Wenn das bewegbare oder ein feststehendes Kontaktstück so ausgelegt ist, daß sich in der Schließbewegung beispielsweise durch eine Verbiegung eines Kontaktstückes eine spürbare Querkomponente zwischen jeweiligen Kontaktflächen, d. h. eine Bewegungskomponente in Flächenrichtung, ergibt, kann die Kontaktqualität verbessert werden.If the movable or a fixed contact piece is designed so that itself in the closing movement, for example due to a bending of a contact piece a noticeable cross component between the respective contact surfaces, d. H. a component of movement in the surface direction, the contact quality be improved.
Als Antrieb kommt bevorzugt eine elektrostatische Ausführung in Betracht, weil sie gegenüber elektromagnetischen oder piezoelektrischen Antrieben den Vorteil sowohl geringer Versorgungsleistungen als auch niedriger Versorgungsspannungen aufweist. Um den grundsätzlichen Nachteil elektrostatischer Antriebe, nämlich die relativ niedrigen Antriebskräfte, auszugleichen, ist eine verzahnt angeordnete Fingerstruktur bevorzugt, die sich gerade bei der hier erfindungsgemäß in Betracht stehenden zweidimensionalen Strukturierung sinnvoll realisieren läßt.An electrostatic version is preferred as the drive, because it compared to electromagnetic or piezoelectric drives lower utility services as well as lower utility voltages having. To the fundamental disadvantage of electrostatic drives, namely the to compensate for relatively low driving forces is a toothed finger structure preferred, which is considered in the present invention standing two-dimensional structuring can be sensibly implemented.
Die elastische Aufhängung ist vorzugsweise durch zumindest einen mäanderförmig ausgebildeten Steg gegeben. Auf die Einzelheiten dieser geometrischen Gestaltungen wird bei der Beschreibung der Ausführungsbeispiele näher eingegangen.The elastic suspension is preferably meandering by at least one trained footbridge. On the details of these geometric designs will be discussed in more detail in the description of the exemplary embodiments.
Schließlich ergibt sich mit der Erfindung auch die Möglichkeit, eine von konventionellen Leistungsschutzschaltern her bekannte Löschkammerstruktur einzubauen, wie im dritten Ausführungsbeispiel näher dargestellt.Finally, the invention also makes it possible to use one of conventional ones To install circuit breakers known arcing chamber structure, as shown in more detail in the third embodiment.
Wie ausgeführt, bezieht sich die Erfindung sowohl auf eine neuartige Mikrorelaisstruktur als auch auf ein hierzu ausgelegtes zweidimensionales Strukturierungsverfahren. Dementsprechend sind die obenstehenden Ausführungen zu den verschiedenen Einzelaspekten der Erfindung sowohl im Hinblick auf die Offenbarung entsprechender Vorrichtungsmerkmale als auch im Hinblick auf Verfahrensmerkmale zu verstehen.As stated, the invention relates both to a novel microrelay structure as well as a two-dimensional structuring process designed for this purpose. Accordingly, the above statements are about the different Individual aspects of the invention both with regard to the disclosure corresponding device features as well as with regard to process features to understand.
Weitere Einzelheiten der Erfindung werden mit Hilfe der folgenden drei Ausführungsbeispiele der Erfindung näher erläutert. Die dabei offenbarten Einzelmerkmale können auch in anderen Kombinationen erfindungswesentlich sein. Further details of the invention are illustrated with the help of the following three exemplary embodiments the invention explained in more detail. The individual features disclosed can also be essential to the invention in other combinations.
Es zeigen:
Die im Folgenden dargestellten Ausführungsbeispiele können mit der in der zitierten Veröffentlichung von C. Marxer et al dargestellten Technologie hergestellt werden, wobei die Kontaktflächen durch entsprechend verstärkte Aufdampfungen unter schrägem Winkel aufgebracht werden können. Es sind im Prinzip auch elektrolytische Kontaktverstärkungen an ausgewählten Stellen möglich.The exemplary embodiments shown below can be compared with the one cited in FIG Published by C. Marxer et al be, the contact surfaces by correspondingly increased evaporation can be applied at an oblique angle. In principle, too Electrolytic contact reinforcement possible at selected points.
Die Figuren 1 und 2 zeigen ein erstes Ausführungsbeispiel mit einem bewegbaren
Kontaktstück, das einen in Bewegungsrichtung liegenden Stab 1 mit einem durch
querverlaufende Verstrebungen aufgebauten Fachwerkaufbau aufweist. An der in
der Figur rechten Seite des Stabes 1 liegen zwei schräg zu der in den Figuren der
Horizontalen entsprechenden Bewegungsrichtung und senkrecht zu der der Zeichenebene
entsprechenden Substratebene verlaufende Kontaktflächen 3 des bewegbaren
Kontaktstückes und zwei komplementäre Kontaktflächen 4 eines feststehenden
Kontaktstücks 5.Figures 1 and 2 show a first embodiment with a movable
Contact piece, which is a rod 1 in the direction of movement with a through
has transverse struts built truss structure. At the in
the figure right side of the rod 1 are two oblique to that in the figures of the
Horizontal corresponding direction of movement and perpendicular to that of the drawing plane
corresponding contact plane 3 extending contact surfaces of the movable
Contact piece and two
Das bewegbare Kontaktstück ist aufgrund einer elastischen Aufhängung in einer
doppelten mäanderförmigen Stegstruktur 6 in in Figur 1 horizontaler Richtung, d.
h. substratparallel, bewegbar. Dabei zeigt Figur 1 einen geöffneten Zustand des
Mikrorelais, bei dem zwei Teile des feststehenden Kontaktstücks 5 voneinander
getrennt sind, wohingegen Figur 2 das Mikrorelais im geschlossenen Zustand
zeigt, in dem das bewegbare Kontaktstück die beiden Teile des feststehenden
Kontaktstücks 5 verbindet. Der nun mögliche Stromfluß I ist angedeutet.The movable contact piece is due to an elastic suspension in one
double
Durch Entfernen einer vergrabenen SiO2-Schicht vom Substrat gelöst ist dabei
das gesamte bewegbare Kontaktstück einschließlich der in den Figuren linken
Seite des Antriebs 7 und der elastischen Aufhängung 6. Die übrigen dargestellten
Teile, insbesondere das feststehende Kontaktstück 5 und die in den Figuren
rechte Seite des Antriebs 7 sind durch die vergrabene SiO2-Schicht fest mit dem
Substrat verbunden.By removing a buried SiO 2 layer from the substrate, the entire movable contact piece, including the left side of the
Die für die Bewegung notwendige Kraft wird erzeugt durch eine mit 7 bezeichnete
verzahnte Fingerstruktur, die durch Anlegen einer Spannung U in der in den Figuren
1 und 2 dargestellten Weise betätigt wird. Die Finger sind in Figur 1 übertrieben
weit auseinander gezogen dargestellt, sie können auch im offenen Zustand
noch ineinander hineinreichen. Der spannungslose Zustand entspricht also der in
Figur 1 dargestellten offenen Position, wohingegen bei Anlegen einer positiven
Spannung durch die elektrostatische Anziehung die Rückstellkraft der elastischen
Aufhängung 6 überwunden und die geschlossene Position hergestellt wird.The force necessary for the movement is generated by a designated 7
toothed finger structure by applying a voltage U in the in the figures
1 and 2 shown is operated. The fingers are exaggerated in Figure 1
shown far apart, they can also be open
reach into each other. The de-energized state thus corresponds to that in
Figure 1 shown open position, whereas when creating a positive
Voltage through the electrostatic attraction the restoring force of the
Durch entsprechende Dotierungen sind die mäanderförmigen Stege der elastischen
Aufhängung 6 und die Finger des Antriebs 7 elektrisch leitend. Im Gegensatz
dazu ist der Fachwerkaufbau des Stabes 1 isolierend ausgeführt, um den
Antrieb gegenüber der geschalteten Strecke im Potential zu trennen. Die Kontaktflächen
3 und 4 sind durch entsprechende Schrägbedampfungen mit Au belegt;
das feststehende Kontaktstück 5 kann dabei einer relativ massiv ausgeführten
metallischen Leiterbahn entsprechen. Um den Ohmschen Widerstand in der geschlossenen
Position zu verringern, kann auch die kontaktseitige Spitze des bewegbaren
Kontaktstücks zwischen den beiden schrägen Kontaktflächen 3 mit einer
ausreichend dicken Metallschicht belegt sein und somit die beiden Kontaktflächen
3 elektrisch verbinden. The meandering webs are the elastic ones by
Der dargestellte Fall eines im spannungsfreien Zustand offenen Relais entspricht
der üblichen Ausführung konventioneller elektromagnetischer Relais, ist jedoch
nicht zwingend. Es kann auch durch elektrostatische Abstoßung, oder durch elektrostatische
Anziehung von entsprechend gegensinnig angebrachten Fingern, eine
durch die elastische Aufhängung 6 grundsätzlich geschlossene Mikrorelaisstruktur
durch Spannungsbeaufschlagung geöffnet werden.The case shown corresponds to an open relay when de-energized
the usual design of conventional electromagnetic relays, however
not necessarily. It can also be caused by electrostatic repulsion, or by electrostatic
Attraction of fingers in opposite directions, one
basically closed microrelay structure due to the
Die Figuren 3 und 4 zeigen ein zweites Ausführungsbeispiel, wobei nur die von dem ersten Ausführungsbeispiel abweichenden Einzelheiten erläutert werden.Figures 3 and 4 show a second embodiment, only those of Details deviating from the first exemplary embodiment are explained.
Und zwar trägt die Fachwerkstruktur 2 des bewegbaren Kontaktstücks an dem
kontaktseitigen Ende des Kontaktstückstabes 1 einen im wesentlichen quer zur
Richtung des Stabes verlaufenden Balken 8 mit an seinen beiden Enden befindlichen
verstärkten Metallstrukturen 9, die durch eine metallische Brücke 10 verbunden
sind. Jeweils gegenüberliegend den Kontaktflächen 9 liegen analoge Kontaktflächen
11 an zwei Teilen des feststehenden Kontaktstückes 5. In der in Figur
4 dargestellten geschlossenen Position hat diese Struktur den Vorteil, daß sich
durch eine leichte Verbiegung des Balkens 8 eine kleine Bewegungskomponente
zwischen den Kontaktflächen 9 und 11 quer zur Schließrichtung des Mikrorelais
ergibt. Dadurch kann die Qualität des Kontaktes erfahrungsgemäß verbessert
werden.Namely, the truss structure 2 of the movable contact piece bears on the
contact-side end of the contact piece rod 1 a substantially transverse to
Beam 8 extending in the direction of the bar, with bars located at both ends thereof
reinforced
Das dritte Ausführungsbeispiel in den Figuren 5 und 6 zeigt eine Variante mit einer
aus vertikalen Si-Stegen, die durch die vergrabene SiO2-Schicht elektrisch
isoliert auf dem Substrat stehen, aufgebauten Löschkammerstruktur 12. Beim Öffnen
des Mikrorelais, also bei einer Bewegung des bewegbaren Kontaktstücks von
der in Figur 6 dargestellten geschlossenen Position in die in Figur 5 dargestellte
geöffnete Position kann dementsprechend ein Lichtbogen durch die gerundete
Form des feststehenden Kontaktstückes 5 an der mit 13 bezeichneten Stelle und
durch die gerundete Form des kontaktseitigen Endes 14 des bewegbaren Kontaktstücks
entlang der als Laufschiene wirkenden Struktur 13 in die Löschkammer
12 getrieben werden. Hierbei ist eine gebogene Form des Lichtbogens aufgrund
12 getrieben werden. Hierbei ist eine gebogene Form des Lichtbogens aufgrund
der geeigneten Formgebung bei 13 und 14 von Bedeutung.The third exemplary embodiment in FIGS. 5 and 6 shows a variant with a quenching
Im übrigen unterscheidet sich das dritte Ausführungsbeispiel von dem ersten und
zweiten dadurch, daß das bewegbare Kontaktstück nicht etwa zwei getrennte
Teile des feststehenden Kontaktstücks 5 verbinden kann, sondern selbst ein Teil
des zu schaltenden Strompfades bildet. Dies ist in den Figuren 5 und 6 durch die
verstärkte Linienführung im Bereich des Strompfades dargestellt, d. h. im Bereich
des feststehenden Kontaktstückes 5, der Löschkammer 12, des bewegbaren
Kontaktstücks, d. h. des Stabes 1, der hier leitend ausgeführt ist, der in den Figuren
5 und 6 unteren mäanderförmigen Aufhängungsstruktur 6 und der leitenden
Verbindung zwischen dem in den Figuren 5 und 6 linken Ende der Struktur und
der Löschkammer 12.Otherwise, the third embodiment differs from the first and
second in that the movable contact piece is not about two separate
Parts of the fixed
Claims (12)
- Microrelay having
a substrate,
a movable contact piece (1) on the substrate,
an elastic suspension (6) of the movable contact piece (1) and
an electrically actuable drive (7) of the movable contact piece (1),
characterized in that the movable contact piece (1) can be moved essentially in substrate-parallel fashion by the drive (7) in the suspension (6). - Microrelay according to Claim 1, in which at least an essential part of the functional structure of the movable contact piece (1), of the elastic suspension (6) and/or of the drive (7) is provided in the form of a two-dimensional structure in a substrate-parallel plane.
- Microrelay according to Claim 2 having a buried layer which is arranged between the two-dimensional structure (1, 6, 7) and the substrate and is removed under movable structure parts.
- Microrelay according to one of the preceding claims, in which the movable contact piece has a bar (1), which is arranged in substrate-parallel fashion and connects a contact area (3, 9, 14) to the drive (7).
- Microrelay according to Claim 4, in which the bar (1) has a framework structure (2).
- Microrelay according to one of the preceding claims, in which the movable contact piece (1) has a contact area (3) running obliquely with respect to the direction of movement and perpendicularly to the substrate.
- Microrelay according to one of the preceding claims, in which, in the event of a movement of the movable contact piece (1) that closes the microrelay, a transverse movement component is produced between contact areas (9,11) of the movable contact piece (1) and a stationary contact piece (5).
- Microrelay according to one of the preceding claims, in which the drive has an electrostatically acting toothed finger structure (7).
- Microrelay according to one of the preceding claims, in which the elastic suspension has a meander-shaped web (6).
- Microrelay according to one of the preceding claims having an arcing chamber structure (12).
- Method for producing a microrelay according to one of the preceding claims, in which the movable contact piece (1), the drive (7) and/or the elastic suspension (6) acquire at least an essential part of their functional structure through a substrate-parallel two-dimensional structuring method.
- Method according to Claim 11, in which a buried layer arranged between the two-dimensional structure (1, 6, 7) and the substrate is partially removed in order to release structure parts from the substrate.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19912669 | 1999-03-20 | ||
DE19912669A DE19912669A1 (en) | 1999-03-20 | 1999-03-20 | Microrelay operating parallel to the substrate |
PCT/CH2000/000152 WO2000057445A1 (en) | 1999-03-20 | 2000-03-17 | Microrelay working parallel to the substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1163692A1 EP1163692A1 (en) | 2001-12-19 |
EP1163692B1 true EP1163692B1 (en) | 2003-02-05 |
Family
ID=7901818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00908889A Expired - Lifetime EP1163692B1 (en) | 1999-03-20 | 2000-03-17 | Microrelay working parallel to the substrate |
Country Status (5)
Country | Link |
---|---|
US (1) | US6613993B1 (en) |
EP (1) | EP1163692B1 (en) |
AT (1) | ATE232331T1 (en) |
DE (2) | DE19912669A1 (en) |
WO (1) | WO2000057445A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007035633A1 (en) | 2007-07-28 | 2009-02-19 | Protron Mikrotechnik Gmbh | Micromechanical structure e.g. electrostatic drive, manufacturing method, involves using structures etched in silicon substrate as negative region, removing partial regions of substrate and opening galvanically produced metal structures |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10040867A1 (en) | 2000-08-21 | 2002-05-23 | Abb Research Ltd | Microswitch has contact bearer deformable parallel to substrate with shape of symmetrical oscillation trough in stable off position, shape of asymmetrical trough in stable on position |
US6917268B2 (en) * | 2001-12-31 | 2005-07-12 | International Business Machines Corporation | Lateral microelectromechanical system switch |
US20040027029A1 (en) * | 2002-08-07 | 2004-02-12 | Innovative Techology Licensing, Llc | Lorentz force microelectromechanical system (MEMS) and a method for operating such a MEMS |
WO2004046019A1 (en) * | 2002-11-19 | 2004-06-03 | Baolab Microsystems S.L. | Miniature relay and corresponding uses thereof |
US20050156191A1 (en) * | 2004-01-21 | 2005-07-21 | Sumitomo Electric Industries, Ltd. | Actuator structure and optical device |
JP4540443B2 (en) * | 2004-10-21 | 2010-09-08 | 富士通コンポーネント株式会社 | Electrostatic relay |
KR100748747B1 (en) | 2006-02-17 | 2007-08-13 | 현대자동차주식회사 | Noncontact radio frequency microelectromechanical systems switch |
WO2009148677A2 (en) * | 2008-03-11 | 2009-12-10 | The Regents Of The University Of California | Microelectromechanical system (mems) resonant switches and applications for power converters and amplifiers |
FR2950194B1 (en) * | 2009-09-11 | 2011-09-02 | Commissariat Energie Atomique | ELECTROMECHANICAL ACTUATOR WITH INTERDIGITED ELECTRODES |
EP2780925B1 (en) * | 2011-12-21 | 2018-09-05 | Siemens Aktiengesellschaft | Contactor |
KR101276369B1 (en) * | 2012-01-10 | 2013-06-18 | 현대중공업 주식회사 | Circuit breaker |
CN103956299A (en) * | 2014-03-31 | 2014-07-30 | 苏州锟恩电子科技有限公司 | Micromechanical RF switch |
Family Cites Families (7)
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---|---|---|---|---|
US5025346A (en) | 1989-02-17 | 1991-06-18 | Regents Of The University Of California | Laterally driven resonant microstructures |
DE4126107C2 (en) * | 1991-08-07 | 1993-12-16 | Bosch Gmbh Robert | Accelerometer and manufacturing method |
DE4205029C1 (en) * | 1992-02-19 | 1993-02-11 | Siemens Ag, 8000 Muenchen, De | Micro-mechanical electrostatic relay - has tongue-shaped armature etched from surface of silicon@ substrate |
DE4229068C2 (en) * | 1992-09-01 | 1994-06-16 | Bosch Gmbh Robert | Accelerator switch and manufacturing method |
FR2706075B1 (en) * | 1993-06-02 | 1995-07-21 | Lewiner Jacques | Control device of the moving part actuator type retaining its orientation during movement. |
KR100252009B1 (en) * | 1997-09-25 | 2000-04-15 | 윤종용 | Micro structure for oscillation and method of controlling resonant frequency and the same and microactuator and micro gyroscope using the same |
DE19800189C2 (en) * | 1998-01-05 | 2000-05-18 | Stefan Vogel | Micromechanical switch |
-
1999
- 1999-03-20 DE DE19912669A patent/DE19912669A1/en not_active Withdrawn
-
2000
- 2000-03-17 DE DE50001205T patent/DE50001205D1/en not_active Expired - Lifetime
- 2000-03-17 AT AT00908889T patent/ATE232331T1/en not_active IP Right Cessation
- 2000-03-17 EP EP00908889A patent/EP1163692B1/en not_active Expired - Lifetime
- 2000-03-17 US US09/936,836 patent/US6613993B1/en not_active Expired - Fee Related
- 2000-03-17 WO PCT/CH2000/000152 patent/WO2000057445A1/en active IP Right Grant
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007035633A1 (en) | 2007-07-28 | 2009-02-19 | Protron Mikrotechnik Gmbh | Micromechanical structure e.g. electrostatic drive, manufacturing method, involves using structures etched in silicon substrate as negative region, removing partial regions of substrate and opening galvanically produced metal structures |
DE102007035633B4 (en) * | 2007-07-28 | 2012-10-04 | Protron Mikrotechnik Gmbh | Process for producing micromechanical structures and micromechanical structure |
Also Published As
Publication number | Publication date |
---|---|
WO2000057445A1 (en) | 2000-09-28 |
EP1163692A1 (en) | 2001-12-19 |
DE19912669A1 (en) | 2000-09-21 |
ATE232331T1 (en) | 2003-02-15 |
DE50001205D1 (en) | 2003-03-13 |
US6613993B1 (en) | 2003-09-02 |
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