EP1118111A1 - Procede permettant de couler un module electronique plat dans un corps carte en plastique par moulage thermoplastique par injection - Google Patents

Procede permettant de couler un module electronique plat dans un corps carte en plastique par moulage thermoplastique par injection

Info

Publication number
EP1118111A1
EP1118111A1 EP99953592A EP99953592A EP1118111A1 EP 1118111 A1 EP1118111 A1 EP 1118111A1 EP 99953592 A EP99953592 A EP 99953592A EP 99953592 A EP99953592 A EP 99953592A EP 1118111 A1 EP1118111 A1 EP 1118111A1
Authority
EP
European Patent Office
Prior art keywords
shot
electronic module
module
card body
injected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP99953592A
Other languages
German (de)
English (en)
Inventor
Jean-Pierre Dekeyser
Helge Schmidt
Peter Preiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Tyco Electronics Logistics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics AG filed Critical Tyco Electronics Logistics AG
Publication of EP1118111A1 publication Critical patent/EP1118111A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C45/1671—Making multilayered or multicoloured articles with an insert
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a method for casting a flat electronic module with external contacts into a plastic card body by thermoplastic injection molding.
  • the electronic module described there consists of a leadframe with a chip mounted thereon, which are embedded in a plastic housing in such a way that external contacts of the module protrude from the housing in one plane.
  • This module is then embedded in a flat plastic object, for example a chip card, which typically has a thickness of only about 0.8 mm, by injection molding.
  • the module is not cast with thermoplastic on either one of the flat sides, that is, the thickness of the electronic module is equal to the thickness of the thermoplastic material of the plastic card body.
  • the housed module the flat underside of which is typically formed by the exposed lead frame, is inserted into an injection mold with an upper and lower mold half and then the module, with the material of the chip card exactly in alignment, is cast around its edges, using centering pins the mold is additionally positioned in the mold cavity.
  • At least one surface of the module is also on the today
  • the object of the invention is therefore to provide a method of the type mentioned at the outset which allows the central injection of relatively large-area electronic modules into card bodies up to approximately 3 mm thick.
  • FIG. 1 shows a finished injection-molded plastic card body in a schematic sectional illustration
  • FIG. 1 a plastic card body in a molding tool after the first or after the second shot
  • FIG. 4 to 6 in a schematic plan view from above, an equipped chip carrier before the encapsulation (FIG. 4) and after the first (FIG. 5) and after the second (FIG. 6) shot, with the associated side views as parts of the figure below FIG. 5 and 6 are attached.
  • the present invention is based on the knowledge that, on the one hand, it is a necessary prerequisite for injecting an electronic module in the middle, in particular if it comprises a lead frame as the chip carrier, not to stress the lead frame or the module in such a way that the chip is functional loses what can only be prevented if there is a balance of forces during the injection process.
  • this is not possible with the known one-shot method for the following reasons:
  • the injection molding is not completely reproducible in the area of high pressures.
  • the increase in the mold temperature leads to a warping of the card body.
  • the bigger the de chip carrier area the higher the uncontrollable surface forces.
  • the chip carriers cannot be fixed in the mold, or only with difficulty.
  • turbulence occurs and leaves traces. It turns out that unevenness leads to an uneven flow, in which transverse forces arise despite the symmetrical position of the chip carrier to be injected, which press the lead frame or the module against the injection mold wall.
  • the invention is therefore based on the fact that the balance of forces in the middle injection is not immediate, which does not appear to be possible, but rather indirectly in two injection phases with two different molding tools, one half of which in each case has the necessary counterforce to the forces occurring in the opposite half of the mold due to the injection process forms to manufacture.
  • FIG. 1 shows a lead frame 8 on which an encapsulated chip, that is to say provided with a plastic housing 9, is arranged.
  • the production of such a plastic housing 9, which belongs to the electronics module 1 itself, is in principle independent of the method according to the invention.
  • the finished card body 2 in Figure 1 is on both sides Injection molded plastic, except in the area of the contact area 10 of the leadframe, which is designed as a via.
  • the position of the module 1 on the first shot can be seen in FIG.
  • the upper mold half 3 of the first mold is so pronounced that the relief of the module 1 bears completely and without gaps on the side to be covered.
  • the lead frame or module side with more relief structure is sprayed out, possibly together with a contact area 10, since then the negative for the module side with less structure, i.e. the upper mold half 3, can be made simpler, which is particularly the case with unhoused modules or PCB is important. Due to the fact that the upper side of the module 1 is fully in contact, infiltration during spraying is not possible and it is ensured that the chip carrier 8 does not bend.
  • the position of the partially injected card body 7 in the second shot can be seen in Figure 3.
  • the remaining card body areas 2 are filled in according to the upper mold half 5 of the second mold, while the mold half 6 lies flat.
  • the chip carrier 8 is completely enclosed. It is also possible to inject labeling labels that are inserted into one of the injection molds in the two injection molding processes.
  • FIGS. 4 to 6 A further exemplary embodiment is shown in FIGS. 4 to 6, in which a chip carrier 8 equipped with two chips 11 and without a plastic housing is encapsulated directly in the two-shot method according to the invention.
  • the plastic body 7 can be seen in FIG. 5 after the first shot, a preferred flow channel 12 for the second shot also being shown on the left and right.
  • the connecting seam 13 between the first and the second weft is also indicated in the finished injection-molded card.
  • the sprue for the second shot opens into the preferred flow channel 12 for the second shot and is already formed with the first shot by means of a mold insert.
  • ABS, PBT, PET, LCP, PA and PC are the most suitable plastic thermoplastics.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Credit Cards Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

Le module (1) est moulé par injection au centre du corps carte en plastique (2), la moitié supérieure (3) du premier moule (3, 4) utilisé lors de la première charge d'injection est conçue de telle façon qu'elle soit en complètement et sans interruption en contact avec le relief de la face supérieure du module électronique (1), cette face à recouvrir étant d'abord dépourvue de la matière à injecter, tandis que la face inférieure (1) du module est moulée en fonction de la moitié inférieure (4) du moule. La moitié inférieure (6) du deuxième moule utilisé de la deuxième charge d'injection est en contact avec les zones (7) du corps carte moulées lors de la première charge d'injection.
EP99953592A 1998-09-29 1999-08-25 Procede permettant de couler un module electronique plat dans un corps carte en plastique par moulage thermoplastique par injection Withdrawn EP1118111A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19844640 1998-09-29
DE19844640 1998-09-29
PCT/DE1999/002659 WO2000019513A1 (fr) 1998-09-29 1999-08-25 Procede permettant de couler un module electronique plat dans un corps carte en plastique par moulage thermoplastique par injection

Publications (1)

Publication Number Publication Date
EP1118111A1 true EP1118111A1 (fr) 2001-07-25

Family

ID=7882648

Family Applications (1)

Application Number Title Priority Date Filing Date
EP99953592A Withdrawn EP1118111A1 (fr) 1998-09-29 1999-08-25 Procede permettant de couler un module electronique plat dans un corps carte en plastique par moulage thermoplastique par injection

Country Status (2)

Country Link
EP (1) EP1118111A1 (fr)
WO (1) WO2000019513A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2725149A1 (fr) 2012-10-24 2014-04-30 Hexagon Technology Center GmbH Système de commande de machine pour une chargeuse à pneus comportant une lame racleuse

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812335B1 (en) 1999-03-23 2004-11-02 The Regents Of The University Of California Human polypeptide receptors for lysophospholipids and sphingolipids and nucleic acids encoding the same
DE102006028816B4 (de) * 2006-06-21 2008-05-15 Hansatronic Gmbh Verfahren zum getakteten, kontinuierlichen Herstellen von beidseitig umspritzten flexiblen Leiterplatten
KR101561996B1 (ko) 2012-09-14 2015-10-20 현대모비스 주식회사 차량용 카드키

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60217491A (ja) * 1984-04-12 1985-10-31 Dainippon Printing Co Ltd Ｉｃカ−ドの製造法
FR2609821B1 (fr) * 1987-01-16 1989-03-31 Flonic Sa Procede de realisation de cartes a memoire et cartes obtenues par la mise en oeuvre dudit procede
FR2636755B1 (fr) * 1988-09-16 1992-05-22 Schlumberger Ind Sa Procede de realisation de cartes a memoire et cartes obtenues par ledit procede
FR2659157B2 (fr) * 1989-05-26 1994-09-30 Lemaire Gerard Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
CH686325A5 (de) * 1992-11-27 1996-02-29 Esec Sempac Sa Elektronikmodul und Chip-Karte.

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO0019513A1 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2725149A1 (fr) 2012-10-24 2014-04-30 Hexagon Technology Center GmbH Système de commande de machine pour une chargeuse à pneus comportant une lame racleuse
WO2014064143A1 (fr) 2012-10-24 2014-05-01 Hexagon Technology Center Gmbh Système de commande de machine pour un chargeur à roues comprenant une lame niveleuse

Also Published As

Publication number Publication date
WO2000019513A1 (fr) 2000-04-06

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