EP1039487A3 - Thin film layer sequence on a substrate - Google Patents
Thin film layer sequence on a substrate Download PDFInfo
- Publication number
- EP1039487A3 EP1039487A3 EP00103863A EP00103863A EP1039487A3 EP 1039487 A3 EP1039487 A3 EP 1039487A3 EP 00103863 A EP00103863 A EP 00103863A EP 00103863 A EP00103863 A EP 00103863A EP 1039487 A3 EP1039487 A3 EP 1039487A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- thin film
- layer sequence
- film layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
- H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
- H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/938—Vapor deposition or gas diffusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12389—All metal or with adjacent metals having variation in thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12486—Laterally noncoextensive components [e.g., embedded, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12639—Adjacent, identical composition, components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12896—Ag-base component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19913466A DE19913466A1 (en) | 1999-03-25 | 1999-03-25 | Layer sequence built up on a substrate using thin-film technology |
DE19913466 | 1999-03-25 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1039487A2 EP1039487A2 (en) | 2000-09-27 |
EP1039487A3 true EP1039487A3 (en) | 2004-01-02 |
EP1039487B1 EP1039487B1 (en) | 2007-05-09 |
Family
ID=7902319
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00103863A Expired - Lifetime EP1039487B1 (en) | 1999-03-25 | 2000-02-24 | Thin film layer sequence on a substrate for trimming of an electronic circuit |
Country Status (4)
Country | Link |
---|---|
US (1) | US7018720B1 (en) |
EP (1) | EP1039487B1 (en) |
AT (1) | ATE362186T1 (en) |
DE (2) | DE19913466A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4288530A (en) * | 1979-10-15 | 1981-09-08 | Motorola, Inc. | Method of tuning apparatus by low power laser beam removal |
US4301439A (en) * | 1978-12-26 | 1981-11-17 | Electro Materials Corp. Of America | Film type resistor and method of producing same |
US4338506A (en) * | 1979-09-07 | 1982-07-06 | Motorola, Inc. | Method of trimming thick film capacitor |
US4626822A (en) * | 1985-05-02 | 1986-12-02 | Motorola, Inc. | Thick film resistor element with coarse and fine adjustment provision |
EP0957529A1 (en) * | 1998-05-13 | 1999-11-17 | Robert Bosch Gmbh | Method for tuning the resonance frequency of a ring resonator |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3556951A (en) * | 1967-08-04 | 1971-01-19 | Sylvania Electric Prod | Method of forming leads on semiconductor devices |
DE2409312C3 (en) * | 1974-02-27 | 1981-01-08 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Semiconductor arrangement with a metal layer arranged on the semiconductor surface and method for its production |
US4357395A (en) * | 1980-08-22 | 1982-11-02 | General Electric Company | Transfer lamination of vapor deposited foils, method and product |
JPH0678590B2 (en) * | 1988-09-19 | 1994-10-05 | パイオニア株式会社 | Stamper manufacturing method |
US5167776A (en) * | 1991-04-16 | 1992-12-01 | Hewlett-Packard Company | Thermal inkjet printhead orifice plate and method of manufacture |
US5261593A (en) * | 1992-08-19 | 1993-11-16 | Sheldahl, Inc. | Direct application of unpackaged integrated circuit to flexible printed circuit |
US5374792A (en) * | 1993-01-04 | 1994-12-20 | General Electric Company | Micromechanical moving structures including multiple contact switching system |
-
1999
- 1999-03-25 DE DE19913466A patent/DE19913466A1/en not_active Withdrawn
-
2000
- 2000-02-24 AT AT00103863T patent/ATE362186T1/en not_active IP Right Cessation
- 2000-02-24 DE DE50014312T patent/DE50014312D1/en not_active Expired - Lifetime
- 2000-02-24 EP EP00103863A patent/EP1039487B1/en not_active Expired - Lifetime
- 2000-03-21 US US09/532,144 patent/US7018720B1/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4301439A (en) * | 1978-12-26 | 1981-11-17 | Electro Materials Corp. Of America | Film type resistor and method of producing same |
US4338506A (en) * | 1979-09-07 | 1982-07-06 | Motorola, Inc. | Method of trimming thick film capacitor |
US4288530A (en) * | 1979-10-15 | 1981-09-08 | Motorola, Inc. | Method of tuning apparatus by low power laser beam removal |
US4626822A (en) * | 1985-05-02 | 1986-12-02 | Motorola, Inc. | Thick film resistor element with coarse and fine adjustment provision |
EP0957529A1 (en) * | 1998-05-13 | 1999-11-17 | Robert Bosch Gmbh | Method for tuning the resonance frequency of a ring resonator |
Also Published As
Publication number | Publication date |
---|---|
DE50014312D1 (en) | 2007-06-21 |
DE19913466A1 (en) | 2000-09-28 |
EP1039487A2 (en) | 2000-09-27 |
EP1039487B1 (en) | 2007-05-09 |
US7018720B1 (en) | 2006-03-28 |
ATE362186T1 (en) | 2007-06-15 |
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