EP0953206B1 - Device for precise location of a microchip - Google Patents

Device for precise location of a microchip Download PDF

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Publication number
EP0953206B1
EP0953206B1 EP97923787A EP97923787A EP0953206B1 EP 0953206 B1 EP0953206 B1 EP 0953206B1 EP 97923787 A EP97923787 A EP 97923787A EP 97923787 A EP97923787 A EP 97923787A EP 0953206 B1 EP0953206 B1 EP 0953206B1
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EP
European Patent Office
Prior art keywords
microchip
heating
radiation
imaging optics
monitoring
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EP97923787A
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German (de)
French (fr)
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EP0953206A1 (en
Inventor
Georg Bogner
Hans-Ludwig Althaus
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Infineon Technologies AG
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Infineon Technologies AG
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

Definitions

  • the invention relates to a device for location-precise fixation of a microchip on a support with a designed as radiant heating heater for supplying heating radiation for mounting the microchip on the support by heating and soldering, wherein the heating radiation is guided by an imaging optics on the microchip, and with a optical monitoring device associated with the same imaging optics.
  • microchip is to be interpreted broadly. These may be, for example, semiconductor diodes or microlenses, which are to be mounted with high precision on a support, which is also called Submount.
  • microchip is picked up with a suction nozzle or a pair of pliers and brought into the desired position with the aid of micromanipulators.
  • the exact adjustment of the position is carried out with the aid of an image recognition system, which usually has a camera with a tube and an imaging optics and is located axially above the mounting position.
  • the microchip is then lowered onto the respective carrier.
  • By heating microchip and carrier are soldered or glued together. When heating come in a resistance heating, gas heating or radiant heating into consideration.
  • the problem arises that in a relatively small space a plurality of subcomponents for the heat source and the axial position monitoring must be spatially mounted side by side in a system. In addition, it is not always optimal to bring the heating energy to the right position.
  • Both the camera and the exit optics of the laser beam from a fiber cable are arranged laterally next to the optical path of the imaging optics, so that both the optical radiation of the position monitoring and the heating radiation of the laser must be reflected through inclined semipermeable mirrors in the beam path of the imaging optics.
  • a detector for infrared light is arranged, with which the quality of the solder joints is monitored by means of characteristic radiation profiles of the IR radiation.
  • the IR radiation passes from the imaging optics through the two semitransparent mirrors into the IR detector.
  • the heating radiation is thus directed by the laser first directed through a beam splitter on the component and reflected from there. Only the reflected heating radiation passes systemically through the beam splitter of the laser and the beam splitter of the surveillance camera through to the IR detector.
  • the invention has for its object to provide a device of the type mentioned, which is designed to be particularly compact and with a particularly accurate positioning and fixing the microchip on the carrier is possible.
  • optical monitoring device is designed as optical position monitoring for location-accurate adjustment of the microchip on the carrier.
  • the essential advantage of the invention is that the heating energy for soldering or gluing the microchip can be introduced directly into the microchip itself.
  • the same imaging optics are used, which is used to observe the microchip and to control the adjustment position by means of the optical monitoring device. In this way, a coaxial optical power coupling for simultaneous adjustment and fixation is created.
  • the optical position monitoring is arranged in an optical axis of the imaging optics.
  • the heating radiation and radiation detectable for the optical position monitoring are supplied laterally and reflected by means of optical elements into the optical axis of the imaging optics.
  • mirrors or preferably beam splitters are used.
  • Behind the beam splitters monitoring systems for controlling and regulating the radiation power can be arranged in a preferred development of the invention.
  • photodiodes can be used.
  • the beam splitters are designed so that more than 90% of the radiation power is directed in the direction of imaging optics and only a small residual hits the photodiode.
  • the optical position monitoring has a camera, a tubular body and an imaging optics, wherein the camera is preferably arranged in the optical axis of the imaging optics.
  • a filter in particular an edge filter, is advantageously arranged, which is impermeable only to the light of the optical position monitoring, that is to say for visible light or infrared light, and permeable to the wavelength of the heating radiation. This measure will the camera effectively protected from the heating radiation of the heater.
  • a laser is preferably provided, since with this a very high energy density can be achieved.
  • NdYag laser or a fiber-bundled high-power semiconductor laser system Particularly suitable here NdYag laser or a fiber-bundled high-power semiconductor laser system.
  • a xenon vapor lamp or the like may be used under circumstances.
  • a light guide is provided for supplying the heating radiation to the device. If the light is irradiated into the tube by means of a fiber or a fiber bundle, the tube structure can be made very small.
  • an optics for parallelization and focus control of the heating radiation is provided so that the focal positions for the heating radiation and the monitoring radiation can be brought into conformity.
  • This optics also serves to first parallelize the heating radiation.
  • a microchip 1 which rests on a support 2.
  • the optical position monitoring 3 consists essentially of a camera 5, a tube 6 and an imaging optics 4.
  • the imaging optics 4 has an optical axis 15, in which the camera 5 is arranged centered.
  • An illumination device 10 for image recognition generates visible or infrared light, which is fed laterally into the tube 6. Via a beam splitter 8, this light is deflected on the optical axis 15 in the direction of the microchip 1.
  • the optical axis 15 extends axially in the center of the tube 6.
  • an optical system 14 is provided for the parallelization of the heating radiation, so that the heating radiation falls parallel to a beam splitter 7, and is deflected by this to over 90% in the direction of imaging optics 4 and microchip 1.
  • the parallelization optics 14 it is achieved that the heating radiation is also irradiated on the optical axis 15 of the imaging optics and the focal position of the heating radiation is adjustable and, for example, can match the focus position of the light for image recognition.
  • the beam splitter 7 can pass a small proportion of the heating radiation, so that this proportion, which is less than 10% of the radiation power, falls on a monitoring system 11, which has a photodiode as an essential part. With this monitoring system 11, the radiant energy can be measured and regulated according to the requirements.
  • an edge filter 13 is provided, which is permeable only to the light of the illumination device and impermeable in the wavelength range of the heating device.
  • the camera 5 also has a terminal 16, with which the recorded. Images are fed to a data processing.
  • the storage position for the microchip in particular for a lens, is set with the camera.
  • the microchip is brought into this position with a micromanipulator and stored there.
  • the microchip is fixed by the optics of the image recognition system. This ensures that the microchip is accurately positioned and that the exact position to be heated is actually heated.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Laser Beam Processing (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Description

Die Erfindung betrifft eine Vorrichtung zur ortsgenauen Fixierung eines Mikröchips auf einem Träger mit einer als Strahlungsheizung ausgebildeten Heizeinrichtung zur Zuführung von Heizstrahlung zum Befestigen des Mikrochips auf dem Träger durch Erhitzung und Lötung, wobei die Heizstrahlung durch eine Abbildungsoptik auf den Mikrochip geführt ist, und mit einer optischen Überwachungseinrichtung, die derselben Abbildungsoptik zugeordnet ist.The invention relates to a device for location-precise fixation of a microchip on a support with a designed as radiant heating heater for supplying heating radiation for mounting the microchip on the support by heating and soldering, wherein the heating radiation is guided by an imaging optics on the microchip, and with a optical monitoring device associated with the same imaging optics.

Der Begriff Mikrochip ist weit auszulegen. Dies können beispielsweise Halbleiterdioden oder Mikrolinsen sein, die hochgenau auf einem Träger, der auch Submount genannt wird, montiert werden sollen.The term microchip is to be interpreted broadly. These may be, for example, semiconductor diodes or microlenses, which are to be mounted with high precision on a support, which is also called Submount.

Bekannte Verfahren der eingangs genannten Art zeichnen sich dadurch aus, daß der Mikrochip mit einer Saugdüse oder einer Zange aufgenommen und mit Hilfe von Mikromanipulatoren in die gewünschte Position gebracht wird. Die exakte Einstellung der Position erfolgt mit Hilfe eines Bilderkennungssystems, welches üblicherweise eine Kamera mit einem Tubus und einer Abbildungsoptik aufweist und sich axial über der Montageposition befindet. Der Mikrochip wird dann auf den jeweiligen Träger abgesenkt. Durch Erhitzung werden Mikrochip und Träger miteinander verlötet bzw. verklebt. Als Heizung kommen dabei eine Widerstandsheizung, eine Gasheizung oder auch eine Strahlungsheizung in Betracht. Dabei entsteht das Problem, daß auf relativ engem Raum eine Vielzahl von Subkomponenten für die Heizquelle und die axiale Positionsüberwachung räumlich nebeneinander in einer Anlage montiert werden müssen. Zudem gelingt es nicht immer optimal, die Heizenergie an die richtige Position zu bringen.Known methods of the type mentioned above are characterized in that the microchip is picked up with a suction nozzle or a pair of pliers and brought into the desired position with the aid of micromanipulators. The exact adjustment of the position is carried out with the aid of an image recognition system, which usually has a camera with a tube and an imaging optics and is located axially above the mounting position. The microchip is then lowered onto the respective carrier. By heating microchip and carrier are soldered or glued together. When heating come in a resistance heating, gas heating or radiant heating into consideration. The problem arises that in a relatively small space a plurality of subcomponents for the heat source and the axial position monitoring must be spatially mounted side by side in a system. In addition, it is not always optimal to bring the heating energy to the right position.

Aus "Design Engineering", Juni 1987, London, Seite 25 "Sensor Based Laser Scanner Links ..." ist bekannt, einen Laser als Strahlungsheizung zur Fixierung eines Mikrochips auf einen Träger zu verwenden und die Heizstrahlung durch die Abbildungsoptik einer optischen Positions-Überwachung zu führen.From "Design Engineering", June 1987, London, page 25 "Sensor Based Laser Scanner Links ..." is known to use a laser as a radiant heater for fixing a microchip on a support and the heating radiation through the imaging optics of an optical position monitoring respectively.

Sowohl die Kamera als auch die Austrittsoptik des Laserstrahls aus einem Faserkabel sind seitlich neben dem Lichtweg der Abbildungsoptik angeordnet, so daß sowohl die optische Strahlung der Positionsüberwachung als auch die Heizstrahlung des Lasers über geneigte halbdurchlässige Spiegel in den Strahlengang der Abbildungsoptik eingespiegelt werden müssen. Unmittelbar im Strahlengang der Abbildungsoptik ist ein Detektor für infrarotes Licht angeordnet, mit welchem die Qualität der Lötverbindungen anhand von charakteristischen Strahlungsverläufen der IR-Strahlung überwacht wird. Die IR-Strahlung gelangt von der Abbildungsoptik durch die beiden halbdurchlässigen Spiegel hindurch in den IR-Detektor. Die Heizstrahlung wird also vom Laser kommend zunächst über einen Strahlteiler auf das Bauteil gerichtet und von dort reflektiert. Nur die reflektierte Heizstrahlung gelangt systembedingt durch den Strahlteiler des Lasers und den Strahlteiler der Überwachungskamera hindurch zum IR-Detektor.Both the camera and the exit optics of the laser beam from a fiber cable are arranged laterally next to the optical path of the imaging optics, so that both the optical radiation of the position monitoring and the heating radiation of the laser must be reflected through inclined semipermeable mirrors in the beam path of the imaging optics. Immediately in the beam path of the imaging optics, a detector for infrared light is arranged, with which the quality of the solder joints is monitored by means of characteristic radiation profiles of the IR radiation. The IR radiation passes from the imaging optics through the two semitransparent mirrors into the IR detector. The heating radiation is thus directed by the laser first directed through a beam splitter on the component and reflected from there. Only the reflected heating radiation passes systemically through the beam splitter of the laser and the beam splitter of the surveillance camera through to the IR detector.

Diese Anordnung hat den Nachteil, daß eine Nachregelung der Heizstrahlung erst erfolgen kann, wenn tatsächlich Lötverbindungen hergestellt und analysiert wurden. Es ist daher unausweichlich, daß im Falle einer falsch eingestellten Heizstrahlung zunächst einige Fehl-Lötungen durchgeführt werden, bevor das System reagieren kann. In einem solchen Fall fällt daher zwangsläufig immer Ausschuß an.This arrangement has the disadvantage that a readjustment of the heating radiation can only take place when actually solder joints were made and analyzed. It is therefore inevitable that in the case of an incorrectly set heating radiation first some false soldering be performed before the system can react. In such a case, therefore inevitably always Committee.

Aus "Instruments and experimental techniques", vol. 30, no. 6, Teil 2, November 1987, Seiten 1494/1495 ist bei einer gattungsgemäßen Anordnung bekannt, anstelle eines IR-Detektors eine Beobachtungsoptik anzubringen, über welche ein Bediener die Lötstelle betrachten kann. Dazu wird Licht über einen Drehspiegel von der Abbildungsoptik eingeleitet. Vor der Beobachtungsoptik und dem Eingang einer Überwachungskamera liegt ein Lichtfilter im Wege der reflektierten Heizstrahlung.
Ahnliche Vorrichtungen der vorstehend beschriebenen Art sind ferner aus EP 0 326 020 A und EP 0 491 192 A bekannt.From "Instruments and experimental techniques", vol. 30, no. 6, Part 2, November 1987, pages 1494/1495 is known in a generic arrangement to install instead of an IR detector observation optics, via which an operator can consider the solder joint. For this purpose, light is introduced via a rotating mirror of the imaging optics. In front of the observation optics and the entrance of a surveillance camera is a light filter in the way of the reflected heating radiation.
Similar devices of the type described above are also known from EP 0 326 020 A and EP 0 491 192 A.

Der Erfindung liegt die Aufgabe zugrunde, eine Vorrichtung der eingangs genannten Art zu schaffen, die besonders kompakt ausgebildet ist und mit der eine besonders genaue Positionierung und Fixierung des Mikrochips auf dem Träger möglich ist.The invention has for its object to provide a device of the type mentioned, which is designed to be particularly compact and with a particularly accurate positioning and fixing the microchip on the carrier is possible.

Die Aufgabe wird erfindungsgemäß dadurch gelöste siehe Anspruch 1, daß die optische Überwachungseinrichtung als optische Positionsüberwachung zur ortsgenauen Justierung des Mikrochips auf dem Träger ausgebildet ist.The object is achieved by solving see claim 1, that the optical monitoring device is designed as optical position monitoring for location-accurate adjustment of the microchip on the carrier.

Der wesentliche Vorteil der Erfindung besteht darin, daß die Heizenergie zum Löten bzw. Kleben des Mikrochips direkt in den Mikrochip selbst eingebracht werden kann. Hierzu wird die gleiche Abbildungsoptik verwendet, die zur Beobachtung des Mikrochips und zur Kontrolle der Justageposition mittels der optischen Überwachungseinrichtung verwendet wird. Auf diese Weise wird eine koaxiale optische Leistungskopplung zur simultanen Justierung und Fixierung geschaffen.The essential advantage of the invention is that the heating energy for soldering or gluing the microchip can be introduced directly into the microchip itself. For this purpose, the same imaging optics are used, which is used to observe the microchip and to control the adjustment position by means of the optical monitoring device. In this way, a coaxial optical power coupling for simultaneous adjustment and fixation is created.

In einer bevorzugten Ausführungsform der Erfindung ist die optische Postionsüberwachung in einer optischen Achse der Abbildungsoptik angeordnet. Die Heizstrahlung und für die optische Positionsüberwachung erkennbare Strahlung werden seitlich zugeführt und mit Hilfe optischer Elemente in die optische Achse der Abbildungsoptik eingespiegelt. Dazu werden Spiegel oder bevorzugt Strahlteiler verwendet. Hinter den Strahlteilern können in einer bevorzugten Weiterbildung der Erfindung Überwachungssysteme zur Kontrolle und Regelung der Strahlungsleistung angeordnet sein. Dazu können beispielsweise Fotodioden verwendet werden. Die Strahlteiler sind dabei so gestaltet, daß mehr als 90 % der Strahlungsleistung in Richtung Abbildungsoptik gelenkt wird und nur ein kleiner Rest auf die Fotodiode trifft.In a preferred embodiment of the invention, the optical position monitoring is arranged in an optical axis of the imaging optics. The heating radiation and radiation detectable for the optical position monitoring are supplied laterally and reflected by means of optical elements into the optical axis of the imaging optics. For this purpose, mirrors or preferably beam splitters are used. Behind the beam splitters monitoring systems for controlling and regulating the radiation power can be arranged in a preferred development of the invention. For this purpose, for example, photodiodes can be used. The beam splitters are designed so that more than 90% of the radiation power is directed in the direction of imaging optics and only a small residual hits the photodiode.

Die optische Postionsüberwachung weist eine Kamera, einen tubusförmigen Körper und eine Abbildungsoptik auf, wobei die Kamera bevorzugt in der optischen Achse der Abbildungsoptik angeordnet ist. Vor der Kamera ist vorteilhafterweise ein Filter, insbesondere ein Kantenfilter, angeordnet, der nur für das Licht der optischen Positionsüberwachung, also für sichtbares Licht oder Infrarotlicht, durchlässig und für die Wellenlänge der Heizstrahlung undurchlässig ist. Durch diese Maßnahme wird die Kamera wirksam vor der Heizstrahlung der Heizeinrichtung geschützt.The optical position monitoring has a camera, a tubular body and an imaging optics, wherein the camera is preferably arranged in the optical axis of the imaging optics. In front of the camera, a filter, in particular an edge filter, is advantageously arranged, which is impermeable only to the light of the optical position monitoring, that is to say for visible light or infrared light, and permeable to the wavelength of the heating radiation. This measure will the camera effectively protected from the heating radiation of the heater.

Zur Erzeugung der Heizstrahlung ist bevorzugt ein Laser vorgesehen, da mit diesem eine sehr hohe Energiedichte erreichbar ist. Besonders eignen sich hier NdYag-Laser oder ein fasergebündeltes Hochleistungs-Halbleiterlasersystem. Auch eine Xenon-Dampflampe oder ähnliches kann unter Umständen eingesetzt werden.To generate the heating radiation, a laser is preferably provided, since with this a very high energy density can be achieved. Particularly suitable here NdYag laser or a fiber-bundled high-power semiconductor laser system. Also, a xenon vapor lamp or the like may be used under circumstances.

Von Vorteil ist es, wenn zur Zuführung der Heizstrahlung zur Vorrichtung ein Lichtleiter vorgesehen ist. Wenn das Licht mittels einer Faser oder eines Faserbündels in den Tubus eingestrahlt wird, kann der Tubusaufbau sehr klein gestaltet werden.It is advantageous if a light guide is provided for supplying the heating radiation to the device. If the light is irradiated into the tube by means of a fiber or a fiber bundle, the tube structure can be made very small.

In einer anderen Weiterbildung der Erfindung ist eine Optik zur Parallelisierung und Fokusregelung der Heizstrahlung vorgesehen, damit die Fokuslagen für die Heizstrahlung und die Überwachungsstrahlung in Übereinstimmung gebracht werden können. Diese Optik dient außerdem dazu die Heizstrahlung zunächst zu parallelisieren.In another embodiment of the invention, an optics for parallelization and focus control of the heating radiation is provided so that the focal positions for the heating radiation and the monitoring radiation can be brought into conformity. This optics also serves to first parallelize the heating radiation.

Die Erfindung wird anhand der einzigen Figur der Zeichnung weiter erläutert. In dieser Figur ist der Aufbau einer erfindungsgemäßen Vorrichtung schematisch dargestellt.The invention will be further explained with reference to the single figure of the drawing. In this figure, the structure of a device according to the invention is shown schematically.

Im unteren Bereich der Figur ist ein Mikrochip 1 dargestellt, der auf einem Träger 2 ruht. Die optische Positionsüberwachung 3 besteht im wesentlichen aus einer Kamera 5, einem Tubus 6 und einer Abbildungsoptik 4. Die Abbildungsoptik 4 weist eine optische Achse 15 auf, in welcher die Kamera 5 zentriert angeordnet ist. Eine Beleuchtungseinrichtung 10 zur Bilderkennung erzeugt sichtbares oder Infrarotlicht, welches seitlich in den Tubus 6 eingespeist wird. Über einen Strahlteiler 8 wird dieses Licht auf der optischen Achse 15 in Richtung Mikrochip 1 abgelenkt. Die optische Achse 15 verläuft axial im Zentrum des Tubus 6. Eine Heizeinrichtung 9, die im vorliegenden Fall als Laser ausgebildet ist, erzeugt Heizstrahlung, die über eine Faser 12 seitlich an den Tubus 6 herangeführt wird. Am Ende der Faser 12 ist eine Optik 14 zur Parallelisierung der Heizstrahlung vorgesehen, so daß die Heizstrahlung parallel auf einen Strahlteiler 7 fällt, und von diesem zu über 90 % in Richtung Abbildungsoptik 4 und Mikrochip 1 abgelenkt wird. Durch die Parallelisierungsoptik 14 wird erreicht, daß die Heizstrahlung ebenfalls auf der optischen Achse 15 der Abbildungsoptik eingestrahlt wird und die Fokuslage der Heizstrahlung einstellbar wird und z.B. mit der Fokuslage des Lichts zur Bilderkennung übereinstimmen kann. Der Strahlteiler 7 läßt einen kleinen Anteil der Heizstrahlung passieren, so daß dieser Anteil, der unter 10 % der Strahlungsleistung liegt, auf ein Überwachungssystem 11 fällt, welches als wesentlichen Bestandteil eine Fotodiode aufweist. Mit diesem Überwachungssystem 11 kann die Strahlungsenergie gemessen und entsprechend den Anforderungen geregelt werden. Zwischen den seitlichen Anschlüssen für die Beleuchtungseinrichtung und für die Heizeinrichtung und der Kamera ist ein Kantenfilter 13 vorgesehen, der nur für das Licht der Beleuchtungseinrichtung durchlässig und im Wellenlängenbereich der Heizeinrichtung undurchlässig ist. Die Kamera 5 weist außerdem einen Anschluß 16 auf, mit dem die aufgenommenen. Bilder einer Datenverarbeitung zugeführt werden.In the lower part of the figure, a microchip 1 is shown, which rests on a support 2. The optical position monitoring 3 consists essentially of a camera 5, a tube 6 and an imaging optics 4. The imaging optics 4 has an optical axis 15, in which the camera 5 is arranged centered. An illumination device 10 for image recognition generates visible or infrared light, which is fed laterally into the tube 6. Via a beam splitter 8, this light is deflected on the optical axis 15 in the direction of the microchip 1. The optical axis 15 extends axially in the center of the tube 6. A heating device 9, which is formed in the present case as a laser, generates heating radiation, which is brought laterally via a fiber 12 to the tube 6. At the end of the fiber 12 an optical system 14 is provided for the parallelization of the heating radiation, so that the heating radiation falls parallel to a beam splitter 7, and is deflected by this to over 90% in the direction of imaging optics 4 and microchip 1. By the parallelization optics 14 it is achieved that the heating radiation is also irradiated on the optical axis 15 of the imaging optics and the focal position of the heating radiation is adjustable and, for example, can match the focus position of the light for image recognition. The beam splitter 7 can pass a small proportion of the heating radiation, so that this proportion, which is less than 10% of the radiation power, falls on a monitoring system 11, which has a photodiode as an essential part. With this monitoring system 11, the radiant energy can be measured and regulated according to the requirements. Between the lateral connections for the illumination device and for the heating device and the camera, an edge filter 13 is provided, which is permeable only to the light of the illumination device and impermeable in the wavelength range of the heating device. The camera 5 also has a terminal 16, with which the recorded. Images are fed to a data processing.

Mit dieser Vorrichtung wird ein sehr günstiges Verfahren zur Justierung und Fixierung von Mikrochips möglich. Zunächst wird die Ablageposition für den Mikrochip, insbesondere für eine Linse, mit der Kamera eingestellt. Der Mikrochip wird mit einem Mikromanipulator in diese Position gebracht und dort abgelegt. Mit Hilfe eines Lichtpulses wird der Mikrochip durch die Optik des Bilderkennungssystems fixiert. Dadurch ist gewährleistet, daß der Mikrochip exakt positioniert ist und daß genau die Position, die es aufzuheizen gilt, auch wirklich geheizt wird.With this device, a very favorable method for adjusting and fixing microchips is possible. First, the storage position for the microchip, in particular for a lens, is set with the camera. The microchip is brought into this position with a micromanipulator and stored there. With the help of a light pulse, the microchip is fixed by the optics of the image recognition system. This ensures that the microchip is accurately positioned and that the exact position to be heated is actually heated.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11
Mikrochipmicrochip
22
Trägercarrier
33
optische Positionsüberwachungoptical position monitoring
44
Abbildungsoptikimaging optics
55
Kamera -Camera -
66
Tubustube
77
Strahlteiler für HeizstrahlungBeam splitter for radiant heat
88th
Strahlteiler für BeleuchtungBeam splitter for lighting
99
HeizstrahlungsquelleHeizstrahlungsquelle
1010
Beleuchtungseinrichtunglighting device
1111
Überwachungssystemmonitoring system
1212
Faserfiber
1313
Kantenfiltercut-off filter
1414
Optik zur ParallelisierungOptics for parallelization
1515
optische Achseoptical axis
1616
Anschluß für DatenverarbeitungConnection for data processing

Claims (2)

  1. Device for the positionally accurate fixing of a microchip (1), having a laser (9) which serves as a radiant heater on a carrier (2) and is intended to supply thermal radiation via a fibre (12) and a parallelizing optical system (14) on the end of the fibre (12), the thermal radiation being guided via a beam splitter through an imaging optical system (4) of an optical position monitor (3), characterized in that a monitoring system (11) for monitoring and controlling the radiant power is provided downstream of the beam splitter in the exit direction of the thermal radiation from the parallelizing optical system (14) of the fibre (12).
  2. Device according to Claim 1, characterized in that the beam splitter (7) deflects more than 90% of the thermal radiation in the direction of the imaging optical system (4).
EP97923787A 1996-05-08 1997-05-07 Device for precise location of a microchip Expired - Lifetime EP0953206B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19618533 1996-05-08
DE19618533A DE19618533A1 (en) 1996-05-08 1996-05-08 Device for the precise fixing of microchips
PCT/DE1997/000926 WO1997042653A1 (en) 1996-05-08 1997-05-07 Device for precise location of a microchip

Publications (2)

Publication Number Publication Date
EP0953206A1 EP0953206A1 (en) 1999-11-03
EP0953206B1 true EP0953206B1 (en) 2006-04-26

Family

ID=7793734

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97923787A Expired - Lifetime EP0953206B1 (en) 1996-05-08 1997-05-07 Device for precise location of a microchip

Country Status (6)

Country Link
EP (1) EP0953206B1 (en)
JP (1) JP2000509558A (en)
KR (1) KR20000010742A (en)
CN (1) CN1217819A (en)
DE (2) DE19618533A1 (en)
WO (1) WO1997042653A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100489462B1 (en) * 2002-08-13 2005-05-12 현대모비스 주식회사 Structure for heater control button for vehicles
US10029330B2 (en) * 2015-06-17 2018-07-24 The Boeing Company Hybrid laser machining of multi-material stack-ups
KR20230045850A (en) * 2021-09-29 2023-04-05 (주)레이저발테크놀러지 Soldering device applying multi nozzle and the method thereof

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209650A3 (en) * 1985-06-07 1989-07-05 Vanzetti Systems, Inc. Method and apparatus for placing and electrically connecting components on a printed circuit board
JPS63108983A (en) * 1986-10-27 1988-05-13 Toshiba Corp Laser beam machine
US4845335A (en) * 1988-01-28 1989-07-04 Microelectronics And Computer Technology Corporation Laser Bonding apparatus and method
JPH0694080B2 (en) * 1988-12-19 1994-11-24 三菱電機株式会社 Laser processing equipment
JP2648892B2 (en) * 1990-12-19 1997-09-03 エヌティエヌ 株式会社 Laser processing equipment
US5164565A (en) * 1991-04-18 1992-11-17 Photon Dynamics, Inc. Laser-based system for material deposition and removal
NL193987C (en) * 1993-05-03 2001-04-03 Iai Bv Device for picking up, positioning and attaching components to a carrier by means of laser light.
JPH0890272A (en) * 1994-09-19 1996-04-09 Miyachi Technos Corp Laser beam machine
JPH08114502A (en) * 1994-10-17 1996-05-07 Toppan Printing Co Ltd Method and device for fluid colorimetry

Also Published As

Publication number Publication date
WO1997042653A1 (en) 1997-11-13
DE19618533A1 (en) 1997-11-13
EP0953206A1 (en) 1999-11-03
JP2000509558A (en) 2000-07-25
KR20000010742A (en) 2000-02-25
DE59712634D1 (en) 2006-06-01
CN1217819A (en) 1999-05-26

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